JP2017120781A5 - - Google Patents

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Publication number
JP2017120781A5
JP2017120781A5 JP2016251556A JP2016251556A JP2017120781A5 JP 2017120781 A5 JP2017120781 A5 JP 2017120781A5 JP 2016251556 A JP2016251556 A JP 2016251556A JP 2016251556 A JP2016251556 A JP 2016251556A JP 2017120781 A5 JP2017120781 A5 JP 2017120781A5
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JP
Japan
Prior art keywords
cylindrical electrode
processing apparatus
plasma processing
rotary table
opening
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JP2016251556A
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English (en)
Japanese (ja)
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JP6800009B2 (ja
JP2017120781A (ja
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Priority to TW105143327A priority Critical patent/TWI604758B/zh
Priority to CN201611242158.5A priority patent/CN107012436B/zh
Priority to KR1020160181293A priority patent/KR102322816B1/ko
Publication of JP2017120781A publication Critical patent/JP2017120781A/ja
Publication of JP2017120781A5 publication Critical patent/JP2017120781A5/ja
Application granted granted Critical
Publication of JP6800009B2 publication Critical patent/JP6800009B2/ja
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JP2016251556A 2015-12-28 2016-12-26 プラズマ処理装置 Active JP6800009B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW105143327A TWI604758B (zh) 2015-12-28 2016-12-27 Plasma processing device
CN201611242158.5A CN107012436B (zh) 2015-12-28 2016-12-28 等离子体处理装置
KR1020160181293A KR102322816B1 (ko) 2015-12-28 2016-12-28 플라즈마 처리 장치

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015257353 2015-12-28
JP2015257353 2015-12-28

Publications (3)

Publication Number Publication Date
JP2017120781A JP2017120781A (ja) 2017-07-06
JP2017120781A5 true JP2017120781A5 (cg-RX-API-DMAC7.html) 2019-08-15
JP6800009B2 JP6800009B2 (ja) 2020-12-16

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ID=59272139

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016251556A Active JP6800009B2 (ja) 2015-12-28 2016-12-26 プラズマ処理装置

Country Status (4)

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JP (1) JP6800009B2 (cg-RX-API-DMAC7.html)
KR (1) KR102322816B1 (cg-RX-API-DMAC7.html)
CN (1) CN107012436B (cg-RX-API-DMAC7.html)
TW (1) TWI604758B (cg-RX-API-DMAC7.html)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7000083B2 (ja) * 2017-09-07 2022-01-19 芝浦メカトロニクス株式会社 成膜装置
JP7144219B2 (ja) * 2018-03-22 2022-09-29 芝浦メカトロニクス株式会社 真空処理装置及びトレイ
JP7141989B2 (ja) * 2018-09-28 2022-09-26 芝浦メカトロニクス株式会社 成膜装置
CN109603450A (zh) * 2019-02-20 2019-04-12 北京卓昱科技有限公司 一种智能电子烟气净化系统
JP7469303B2 (ja) * 2019-06-06 2024-04-16 芝浦メカトロニクス株式会社 成膜装置
JP7111380B2 (ja) * 2020-04-01 2022-08-02 株式会社シンクロン スパッタ装置及びこれを用いた成膜方法
JP2023048694A (ja) * 2021-09-28 2023-04-07 芝浦メカトロニクス株式会社 成膜装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0663107B2 (ja) * 1984-11-14 1994-08-17 東京エレクトロン山梨株式会社 平行平板型ドライエツチング装置
JP3371176B2 (ja) * 1995-01-25 2003-01-27 ソニー株式会社 プラズマ処理装置および半導体装置の製造方法
US5716505A (en) * 1996-02-23 1998-02-10 Balzers Prozess-Systems Gmbh Apparatus for coating substrates by cathode sputtering with a hollow target
JP4212210B2 (ja) * 1999-12-07 2009-01-21 株式会社小松製作所 表面処理装置
JP4428873B2 (ja) * 2001-02-28 2010-03-10 芝浦メカトロニクス株式会社 スパッタリング装置
KR101364655B1 (ko) * 2005-08-02 2014-02-19 가부시키가이샤 퓨아론 쟈판 플라즈마 발생 장치 및 이것을 이용한 성막방법
JP4854235B2 (ja) * 2005-08-22 2012-01-18 芝浦メカトロニクス株式会社 プラズマ処理装置
TWI391518B (zh) 2005-09-09 2013-04-01 愛發科股份有限公司 離子源及電漿處理裝置
US8066857B2 (en) * 2008-12-12 2011-11-29 Fujifilm Corporation Shaped anode and anode-shield connection for vacuum physical vapor deposition
JP5350043B2 (ja) * 2009-03-31 2013-11-27 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理方法

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