JP2017116931A - 多層反射膜付き基板、反射型マスクブランク、反射型マスク及び半導体装置の製造方法 - Google Patents
多層反射膜付き基板、反射型マスクブランク、反射型マスク及び半導体装置の製造方法 Download PDFInfo
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- JP2017116931A JP2017116931A JP2016242190A JP2016242190A JP2017116931A JP 2017116931 A JP2017116931 A JP 2017116931A JP 2016242190 A JP2016242190 A JP 2016242190A JP 2016242190 A JP2016242190 A JP 2016242190A JP 2017116931 A JP2017116931 A JP 2017116931A
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- 239000000758 substrate Substances 0.000 title claims abstract description 194
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 78
- 238000000034 method Methods 0.000 title claims abstract description 63
- 239000004065 semiconductor Substances 0.000 title claims description 22
- 239000000463 material Substances 0.000 claims abstract description 56
- 239000002245 particle Substances 0.000 claims abstract description 56
- 238000001659 ion-beam spectroscopy Methods 0.000 claims abstract description 31
- 229910052743 krypton Inorganic materials 0.000 claims abstract description 18
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000006096 absorbing agent Substances 0.000 claims description 88
- 230000001681 protective effect Effects 0.000 claims description 42
- 229910052710 silicon Inorganic materials 0.000 claims description 28
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 19
- 239000010703 silicon Substances 0.000 claims description 19
- 238000012546 transfer Methods 0.000 claims description 18
- 229910052750 molybdenum Inorganic materials 0.000 claims description 16
- 230000008569 process Effects 0.000 claims description 13
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical group [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 12
- 239000011733 molybdenum Substances 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 11
- 238000001459 lithography Methods 0.000 claims description 4
- 230000001747 exhibiting effect Effects 0.000 abstract 1
- 239000010408 film Substances 0.000 description 500
- 239000010410 layer Substances 0.000 description 82
- 150000002500 ions Chemical class 0.000 description 59
- 239000007789 gas Substances 0.000 description 37
- 238000000137 annealing Methods 0.000 description 33
- 238000005477 sputtering target Methods 0.000 description 20
- 150000001875 compounds Chemical class 0.000 description 18
- 230000006870 function Effects 0.000 description 18
- 238000005530 etching Methods 0.000 description 17
- 229910052715 tantalum Inorganic materials 0.000 description 16
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 14
- 238000007689 inspection Methods 0.000 description 14
- 229910052757 nitrogen Inorganic materials 0.000 description 13
- 239000001257 hydrogen Substances 0.000 description 12
- 229910052739 hydrogen Inorganic materials 0.000 description 12
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 11
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 11
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 11
- 239000011651 chromium Substances 0.000 description 11
- 229910052760 oxygen Inorganic materials 0.000 description 11
- 239000001301 oxygen Substances 0.000 description 11
- 238000002310 reflectometry Methods 0.000 description 10
- 239000010409 thin film Substances 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 9
- 229910052796 boron Inorganic materials 0.000 description 9
- 238000004140 cleaning Methods 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 9
- 229910052786 argon Inorganic materials 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- 239000000956 alloy Substances 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 7
- 230000001629 suppression Effects 0.000 description 7
- 239000010936 titanium Substances 0.000 description 7
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 6
- 125000004429 atom Chemical group 0.000 description 6
- 239000000460 chlorine Substances 0.000 description 6
- 230000007547 defect Effects 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- 230000010363 phase shift Effects 0.000 description 6
- 229910052707 ruthenium Inorganic materials 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 229910004298 SiO 2 Inorganic materials 0.000 description 5
- 229910004535 TaBN Inorganic materials 0.000 description 5
- 229910052799 carbon Inorganic materials 0.000 description 5
- 238000010894 electron beam technology Methods 0.000 description 5
- 238000001900 extreme ultraviolet lithography Methods 0.000 description 5
- 229910052731 fluorine Inorganic materials 0.000 description 5
- -1 krypton ions Chemical class 0.000 description 5
- 239000010955 niobium Substances 0.000 description 5
- 150000003482 tantalum compounds Chemical class 0.000 description 5
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 4
- 229910000929 Ru alloy Inorganic materials 0.000 description 4
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 229910052804 chromium Inorganic materials 0.000 description 4
- 239000000470 constituent Substances 0.000 description 4
- 238000001312 dry etching Methods 0.000 description 4
- 239000011737 fluorine Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000005546 reactive sputtering Methods 0.000 description 4
- 230000035945 sensitivity Effects 0.000 description 4
- 239000002356 single layer Substances 0.000 description 4
- 230000003746 surface roughness Effects 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 238000001755 magnetron sputter deposition Methods 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229910052758 niobium Inorganic materials 0.000 description 3
- 230000000737 periodic effect Effects 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 238000007517 polishing process Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000010948 rhodium Substances 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 229910003071 TaON Inorganic materials 0.000 description 2
- 229910010413 TiO 2 Inorganic materials 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 238000004380 ashing Methods 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- 229910052746 lanthanum Inorganic materials 0.000 description 2
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910052702 rhenium Inorganic materials 0.000 description 2
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 2
- VSZWPYCFIRKVQL-UHFFFAOYSA-N selanylidenegallium;selenium Chemical compound [Se].[Se]=[Ga].[Se]=[Ga] VSZWPYCFIRKVQL-UHFFFAOYSA-N 0.000 description 2
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 2
- 239000011856 silicon-based particle Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000013077 target material Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910052727 yttrium Inorganic materials 0.000 description 2
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 2
- 101150013999 CRBN gene Proteins 0.000 description 1
- 229910016006 MoSi Inorganic materials 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 229910003902 SiCl 4 Inorganic materials 0.000 description 1
- 229910004541 SiN Inorganic materials 0.000 description 1
- 241001538551 Sibon Species 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910001362 Ta alloys Inorganic materials 0.000 description 1
- 229910004162 TaHf Inorganic materials 0.000 description 1
- 229910004200 TaSiN Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- SWXQKHHHCFXQJF-UHFFFAOYSA-N azane;hydrogen peroxide Chemical compound [NH4+].[O-]O SWXQKHHHCFXQJF-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 150000001845 chromium compounds Chemical class 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000007687 exposure technique Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 101150016677 ohgt gene Proteins 0.000 description 1
- 238000001579 optical reflectometry Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000001552 radio frequency sputter deposition Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Landscapes
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015246173 | 2015-12-17 | ||
| JP2015246173 | 2015-12-17 |
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| Publication Number | Publication Date |
|---|---|
| JP2017116931A true JP2017116931A (ja) | 2017-06-29 |
| JP2017116931A5 JP2017116931A5 (enExample) | 2020-01-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| JP2016242190A Pending JP2017116931A (ja) | 2015-12-17 | 2016-12-14 | 多層反射膜付き基板、反射型マスクブランク、反射型マスク及び半導体装置の製造方法 |
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| JP (1) | JP2017116931A (enExample) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108417569A (zh) * | 2018-05-11 | 2018-08-17 | 深圳市方宇鑫材料科技有限公司 | Led基板及led光源模组 |
| WO2018235721A1 (ja) * | 2017-06-21 | 2018-12-27 | Hoya株式会社 | 多層反射膜付き基板、反射型マスクブランク及び反射型マスク、並びに半導体装置の製造方法 |
| KR20210022765A (ko) * | 2018-07-19 | 2021-03-03 | 어플라이드 머티어리얼스, 인코포레이티드 | 극자외선 마스크 흡수체 물질들 |
| US20210247687A1 (en) * | 2017-11-14 | 2021-08-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of manufacturing extreme ultraviolet mask with reduced wafer neighboring effect |
| JP2021167878A (ja) * | 2020-04-10 | 2021-10-21 | 信越化学工業株式会社 | 反射型マスクブランク、その製造方法及び反射型マスク |
| US11579521B2 (en) | 2020-01-08 | 2023-02-14 | S&S Tech Co., Ltd. | Reflective type blankmask and photomask for EUV |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004331998A (ja) * | 2003-04-30 | 2004-11-25 | Nikon Corp | 多層膜成膜方法、反射鏡及び露光装置 |
| JP2013122952A (ja) * | 2011-12-09 | 2013-06-20 | Asahi Glass Co Ltd | Euvリソグラフィ用反射型マスクブランクおよびその製造方法、ならびに該マスクブランク用の反射層付基板の製造方法 |
| WO2015037564A1 (ja) * | 2013-09-11 | 2015-03-19 | Hoya株式会社 | 多層反射膜付き基板、euvリソグラフィー用反射型マスクブランク、euvリソグラフィー用反射型マスク及びその製造方法、並びに半導体装置の製造方法 |
-
2016
- 2016-12-14 JP JP2016242190A patent/JP2017116931A/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004331998A (ja) * | 2003-04-30 | 2004-11-25 | Nikon Corp | 多層膜成膜方法、反射鏡及び露光装置 |
| JP2013122952A (ja) * | 2011-12-09 | 2013-06-20 | Asahi Glass Co Ltd | Euvリソグラフィ用反射型マスクブランクおよびその製造方法、ならびに該マスクブランク用の反射層付基板の製造方法 |
| WO2015037564A1 (ja) * | 2013-09-11 | 2015-03-19 | Hoya株式会社 | 多層反射膜付き基板、euvリソグラフィー用反射型マスクブランク、euvリソグラフィー用反射型マスク及びその製造方法、並びに半導体装置の製造方法 |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018235721A1 (ja) * | 2017-06-21 | 2018-12-27 | Hoya株式会社 | 多層反射膜付き基板、反射型マスクブランク及び反射型マスク、並びに半導体装置の製造方法 |
| US11454878B2 (en) | 2017-06-21 | 2022-09-27 | Hoya Corporation | Substrate with multilayer reflective film, reflective mask blank, reflective mask and method of manufacturing semiconductor device |
| US20210247687A1 (en) * | 2017-11-14 | 2021-08-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of manufacturing extreme ultraviolet mask with reduced wafer neighboring effect |
| US11740547B2 (en) * | 2017-11-14 | 2023-08-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of manufacturing extreme ultraviolet mask with reduced wafer neighboring effect |
| US12130548B2 (en) | 2017-11-14 | 2024-10-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Extreme ultraviolet mask with reduced wafer neighboring effect |
| CN108417569A (zh) * | 2018-05-11 | 2018-08-17 | 深圳市方宇鑫材料科技有限公司 | Led基板及led光源模组 |
| KR20210022765A (ko) * | 2018-07-19 | 2021-03-03 | 어플라이드 머티어리얼스, 인코포레이티드 | 극자외선 마스크 흡수체 물질들 |
| JP2021530738A (ja) * | 2018-07-19 | 2021-11-11 | アプライド マテリアルズ インコーポレイテッドApplied Materials, Incorporated | 極紫外線マスクの吸収体材料 |
| KR102537308B1 (ko) | 2018-07-19 | 2023-05-26 | 어플라이드 머티어리얼스, 인코포레이티드 | 극자외선 마스크 흡수체 물질들 |
| US11579521B2 (en) | 2020-01-08 | 2023-02-14 | S&S Tech Co., Ltd. | Reflective type blankmask and photomask for EUV |
| JP2021167878A (ja) * | 2020-04-10 | 2021-10-21 | 信越化学工業株式会社 | 反射型マスクブランク、その製造方法及び反射型マスク |
| JP7226384B2 (ja) | 2020-04-10 | 2023-02-21 | 信越化学工業株式会社 | 反射型マスクブランク、その製造方法及び反射型マスク |
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