JP2017111446A5 - - Google Patents

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Publication number
JP2017111446A5
JP2017111446A5 JP2016243178A JP2016243178A JP2017111446A5 JP 2017111446 A5 JP2017111446 A5 JP 2017111446A5 JP 2016243178 A JP2016243178 A JP 2016243178A JP 2016243178 A JP2016243178 A JP 2016243178A JP 2017111446 A5 JP2017111446 A5 JP 2017111446A5
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JP
Japan
Prior art keywords
substrate
image
projection system
image projection
processing system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016243178A
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English (en)
Japanese (ja)
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JP2017111446A (ja
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Publication date
Priority claimed from US14/974,974 external-priority patent/US9645391B2/en
Application filed filed Critical
Publication of JP2017111446A publication Critical patent/JP2017111446A/ja
Publication of JP2017111446A5 publication Critical patent/JP2017111446A5/ja
Pending legal-status Critical Current

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JP2016243178A 2015-12-18 2016-12-15 光学投射を用いた基板調整システム及び方法 Pending JP2017111446A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/974,974 2015-12-18
US14/974,974 US9645391B2 (en) 2013-11-27 2015-12-18 Substrate tuning system and method using optical projection

Publications (2)

Publication Number Publication Date
JP2017111446A JP2017111446A (ja) 2017-06-22
JP2017111446A5 true JP2017111446A5 (enrdf_load_stackoverflow) 2019-11-21

Family

ID=59080724

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016243178A Pending JP2017111446A (ja) 2015-12-18 2016-12-15 光学投射を用いた基板調整システム及び方法

Country Status (4)

Country Link
JP (1) JP2017111446A (enrdf_load_stackoverflow)
KR (1) KR102544422B1 (enrdf_load_stackoverflow)
CN (1) CN106896646B (enrdf_load_stackoverflow)
TW (1) TWI640837B (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11360388B2 (en) * 2018-03-19 2022-06-14 Tokyo Electron Limited Critical dimension correction via calibrated trim dosing
CN110187607B (zh) * 2019-05-08 2024-11-19 源卓微纳科技(苏州)股份有限公司 一种直写光刻机构及其曝光方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6248168B1 (en) * 1997-12-15 2001-06-19 Tokyo Electron Limited Spin coating apparatus including aging unit and solvent replacement unit
US6949203B2 (en) * 1999-12-28 2005-09-27 Applied Materials, Inc. System level in-situ integrated dielectric etch process particularly useful for copper dual damascene
JP2002072491A (ja) * 2000-09-01 2002-03-12 Airex Inc プリント基板製造装置
JP2005189714A (ja) * 2003-12-26 2005-07-14 Fuji Photo Film Co Ltd 露光装置
US6960775B1 (en) * 2004-04-13 2005-11-01 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufactured thereby
US7259829B2 (en) * 2004-07-26 2007-08-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2006201692A (ja) * 2005-01-24 2006-08-03 Sony Corp 立体パターン形成装置及び立体パターンの形成方法
US7534627B2 (en) * 2006-08-07 2009-05-19 Sokudo Co., Ltd. Methods and systems for controlling critical dimensions in track lithography tools
JP2008250140A (ja) * 2007-03-30 2008-10-16 Fujifilm Corp 露光装置における露光方法及び露光装置
JP5852374B2 (ja) * 2011-09-07 2016-02-03 株式会社Ｓｃｒｅｅｎホールディングス 描画装置および描画方法
WO2015081167A1 (en) * 2013-11-27 2015-06-04 Tokyo Electron Limited Substrate tuning system and method using optical projection
JP6321189B2 (ja) * 2014-01-27 2018-05-09 東京エレクトロン株式会社 パターン化膜の臨界寸法をシフトするシステムおよび方法

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