JP2017108115A5 - - Google Patents

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Publication number
JP2017108115A5
JP2017108115A5 JP2016213939A JP2016213939A JP2017108115A5 JP 2017108115 A5 JP2017108115 A5 JP 2017108115A5 JP 2016213939 A JP2016213939 A JP 2016213939A JP 2016213939 A JP2016213939 A JP 2016213939A JP 2017108115 A5 JP2017108115 A5 JP 2017108115A5
Authority
JP
Japan
Prior art keywords
chuck
chuck body
series
rotary
grip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016213939A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017108115A (ja
JP6792414B2 (ja
Filing date
Publication date
Priority claimed from US14/931,577 external-priority patent/US9887120B2/en
Application filed filed Critical
Publication of JP2017108115A publication Critical patent/JP2017108115A/ja
Publication of JP2017108115A5 publication Critical patent/JP2017108115A5/ja
Application granted granted Critical
Publication of JP6792414B2 publication Critical patent/JP6792414B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2016213939A 2015-11-03 2016-11-01 ウエハ形状物品の表面を処理するための装置 Active JP6792414B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/931,577 US9887120B2 (en) 2015-11-03 2015-11-03 Apparatus for treating surfaces of wafer-shaped articles
US14/931,577 2015-11-03

Publications (3)

Publication Number Publication Date
JP2017108115A JP2017108115A (ja) 2017-06-15
JP2017108115A5 true JP2017108115A5 (enExample) 2020-01-16
JP6792414B2 JP6792414B2 (ja) 2020-11-25

Family

ID=58635242

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016213939A Active JP6792414B2 (ja) 2015-11-03 2016-11-01 ウエハ形状物品の表面を処理するための装置

Country Status (5)

Country Link
US (1) US9887120B2 (enExample)
JP (1) JP6792414B2 (enExample)
KR (1) KR102644438B1 (enExample)
CN (1) CN106952859B (enExample)
TW (1) TWI710056B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7256728B2 (ja) * 2019-10-04 2023-04-12 株式会社荏原製作所 基板ホルダ及び基板処理装置
CN110976933B (zh) * 2019-12-10 2021-10-29 安庆师范大学 一种机械精加工用机床
TWI831361B (zh) * 2022-09-06 2024-02-01 天正國際精密機械股份有限公司 檢測元件的承載裝置

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2977128A (en) * 1959-03-19 1961-03-28 Judelshon Inc Oscar I Chuck for rotary knife cutting machine
US3892419A (en) * 1974-06-19 1975-07-01 Gen Motors Corp Balanced floating machine tool chuck
US4222577A (en) * 1978-07-19 1980-09-16 Giffin Brian K Centering and holding devices for potter's wheelhead
AT389959B (de) 1987-11-09 1990-02-26 Sez Semiconduct Equip Zubehoer Vorrichtung zum aetzen von scheibenfoermigen gegenstaenden, insbesondere von siliziumscheiben
US5531549A (en) * 1989-07-28 1996-07-02 Great Bay Tool Corporation Auto-lock drill chuck
DE59407361D1 (de) 1993-02-08 1999-01-14 Sez Semiconduct Equip Zubehoer Träger für scheibenförmige Gegenstände
US5566466A (en) * 1994-07-01 1996-10-22 Ontrak Systems, Inc. Spindle assembly with improved wafer holder
AT405225B (de) 1995-05-02 1999-06-25 Sez Semiconduct Equip Zubehoer Vorrichtung zum behandeln annähernd runder oder kreisscheibenförmiger gegenstände, insbesondere siliziumwafer
JPH11354617A (ja) * 1998-06-10 1999-12-24 Sumiere Sez Kk 基板処理装置および基板処理方法
US6485531B1 (en) 1998-09-15 2002-11-26 Levitronix Llc Process chamber
US6394691B1 (en) * 2000-07-21 2002-05-28 George V. Stephan Gripping apparatus
US6827092B1 (en) * 2000-12-22 2004-12-07 Lam Research Corporation Wafer backside plate for use in a spin, rinse, and dry module and methods for making and implementing the same
JP4468775B2 (ja) * 2004-09-14 2010-05-26 大日本スクリーン製造株式会社 基板保持回転装置
ITMO20050009A1 (it) * 2005-01-19 2006-07-20 Gino Ferrari Apparato di serraggio.
JP4753832B2 (ja) * 2006-10-19 2011-08-24 大日本スクリーン製造株式会社 基板回転保持装置および基板処理装置
TWI348934B (en) * 2007-08-30 2011-09-21 Lam Res Ag Apparatus for wet treatment of plate-like articles
TWI538094B (zh) * 2009-03-31 2016-06-11 蘭研究公司 用以處理盤狀物品的裝置
US9190310B2 (en) * 2010-04-16 2015-11-17 Lam Research Ag Grounded chuck
US8646767B2 (en) * 2010-07-23 2014-02-11 Lam Research Ag Device for holding wafer shaped articles
US20120152069A1 (en) * 2010-12-15 2012-06-21 Mori Seiki Co., Ltd. CNC MACHINES, ADJUSTABLE TOOLS FOR CNC MACHINES, AND METHODS of OPERATING AN ADJUSTABLE TOOL ON A CNC MACHINE
US20120305036A1 (en) * 2011-06-01 2012-12-06 Lam Research Ag Device for treating surfaces of wafer-shaped articles
US10269615B2 (en) * 2011-09-09 2019-04-23 Lam Research Ag Apparatus for treating surfaces of wafer-shaped articles
TWI725067B (zh) * 2015-10-28 2021-04-21 美商應用材料股份有限公司 可旋轉靜電夾盤

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