CN106952859B - 用于处理晶片状物件的表面的装置 - Google Patents

用于处理晶片状物件的表面的装置 Download PDF

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Publication number
CN106952859B
CN106952859B CN201610944676.5A CN201610944676A CN106952859B CN 106952859 B CN106952859 B CN 106952859B CN 201610944676 A CN201610944676 A CN 201610944676A CN 106952859 B CN106952859 B CN 106952859B
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China
Prior art keywords
chuck body
chuck
series
wafer
drive ring
Prior art date
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CN201610944676.5A
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English (en)
Chinese (zh)
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CN106952859A (zh
Inventor
安德烈亚斯·格雷森纳
迈克尔·布鲁格
托马斯·维恩斯贝格尔
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Lam Research Corp
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Lam Research Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B31/00—Chucks; Expansion mandrels; Adaptations thereof for remote control
    • B23B31/02—Chucks
    • B23B31/10—Chucks characterised by the retaining or gripping devices or their immediate operating means
    • B23B31/12—Chucks with simultaneously-acting jaws, whether or not also individually adjustable
    • B23B31/16—Chucks with simultaneously-acting jaws, whether or not also individually adjustable moving radially
    • B23B31/16004—Jaws movement actuated by one or more spiral grooves
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7614—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B2260/00—Details of constructional elements
    • B23B2260/10—Magnets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/19—Radially reciprocating jaws
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/19—Radially reciprocating jaws
    • Y10T279/1926—Spiral cam or scroll actuated

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
  • Machine Tool Units (AREA)
CN201610944676.5A 2015-11-03 2016-11-02 用于处理晶片状物件的表面的装置 Active CN106952859B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/931,577 US9887120B2 (en) 2015-11-03 2015-11-03 Apparatus for treating surfaces of wafer-shaped articles
US14/931,577 2015-11-03

Publications (2)

Publication Number Publication Date
CN106952859A CN106952859A (zh) 2017-07-14
CN106952859B true CN106952859B (zh) 2020-10-02

Family

ID=58635242

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610944676.5A Active CN106952859B (zh) 2015-11-03 2016-11-02 用于处理晶片状物件的表面的装置

Country Status (5)

Country Link
US (1) US9887120B2 (enExample)
JP (1) JP6792414B2 (enExample)
KR (1) KR102644438B1 (enExample)
CN (1) CN106952859B (enExample)
TW (1) TWI710056B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7256728B2 (ja) * 2019-10-04 2023-04-12 株式会社荏原製作所 基板ホルダ及び基板処理装置
CN110976933B (zh) * 2019-12-10 2021-10-29 安庆师范大学 一种机械精加工用机床
JP7558043B2 (ja) * 2020-11-30 2024-09-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置及び基板処理方法
TWI831361B (zh) * 2022-09-06 2024-02-01 天正國際精密機械股份有限公司 檢測元件的承載裝置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3892419A (en) * 1974-06-19 1975-07-01 Gen Motors Corp Balanced floating machine tool chuck
US6394691B1 (en) * 2000-07-21 2002-05-28 George V. Stephan Gripping apparatus
CN104160496A (zh) * 2011-09-09 2014-11-19 朗姆研究公司 用于处理晶片状物品的表面的装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2977128A (en) * 1959-03-19 1961-03-28 Judelshon Inc Oscar I Chuck for rotary knife cutting machine
US4222577A (en) * 1978-07-19 1980-09-16 Giffin Brian K Centering and holding devices for potter's wheelhead
AT389959B (de) 1987-11-09 1990-02-26 Sez Semiconduct Equip Zubehoer Vorrichtung zum aetzen von scheibenfoermigen gegenstaenden, insbesondere von siliziumscheiben
US5531549A (en) * 1989-07-28 1996-07-02 Great Bay Tool Corporation Auto-lock drill chuck
EP0611274B1 (de) 1993-02-08 1998-12-02 SEZ Semiconductor-Equipment Zubehör für die Halbleiterfertigung AG Träger für scheibenförmige Gegenstände
US5566466A (en) * 1994-07-01 1996-10-22 Ontrak Systems, Inc. Spindle assembly with improved wafer holder
AT405225B (de) 1995-05-02 1999-06-25 Sez Semiconduct Equip Zubehoer Vorrichtung zum behandeln annähernd runder oder kreisscheibenförmiger gegenstände, insbesondere siliziumwafer
JPH11354617A (ja) * 1998-06-10 1999-12-24 Sumiere Sez Kk 基板処理装置および基板処理方法
US6485531B1 (en) 1998-09-15 2002-11-26 Levitronix Llc Process chamber
US6827092B1 (en) * 2000-12-22 2004-12-07 Lam Research Corporation Wafer backside plate for use in a spin, rinse, and dry module and methods for making and implementing the same
JP4468775B2 (ja) * 2004-09-14 2010-05-26 大日本スクリーン製造株式会社 基板保持回転装置
ITMO20050009A1 (it) * 2005-01-19 2006-07-20 Gino Ferrari Apparato di serraggio.
JP4753832B2 (ja) 2006-10-19 2011-08-24 大日本スクリーン製造株式会社 基板回転保持装置および基板処理装置
TWI348934B (en) * 2007-08-30 2011-09-21 Lam Res Ag Apparatus for wet treatment of plate-like articles
TWI538094B (zh) * 2009-03-31 2016-06-11 蘭研究公司 用以處理盤狀物品的裝置
US9190310B2 (en) * 2010-04-16 2015-11-17 Lam Research Ag Grounded chuck
US8646767B2 (en) * 2010-07-23 2014-02-11 Lam Research Ag Device for holding wafer shaped articles
US20120152069A1 (en) * 2010-12-15 2012-06-21 Mori Seiki Co., Ltd. CNC MACHINES, ADJUSTABLE TOOLS FOR CNC MACHINES, AND METHODS of OPERATING AN ADJUSTABLE TOOL ON A CNC MACHINE
US20120305036A1 (en) * 2011-06-01 2012-12-06 Lam Research Ag Device for treating surfaces of wafer-shaped articles
TWI725067B (zh) * 2015-10-28 2021-04-21 美商應用材料股份有限公司 可旋轉靜電夾盤

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3892419A (en) * 1974-06-19 1975-07-01 Gen Motors Corp Balanced floating machine tool chuck
US6394691B1 (en) * 2000-07-21 2002-05-28 George V. Stephan Gripping apparatus
CN104160496A (zh) * 2011-09-09 2014-11-19 朗姆研究公司 用于处理晶片状物品的表面的装置

Also Published As

Publication number Publication date
US20170125281A1 (en) 2017-05-04
TWI710056B (zh) 2020-11-11
KR102644438B1 (ko) 2024-03-06
CN106952859A (zh) 2017-07-14
JP2017108115A (ja) 2017-06-15
KR20170054279A (ko) 2017-05-17
US9887120B2 (en) 2018-02-06
JP6792414B2 (ja) 2020-11-25
TW201727821A (zh) 2017-08-01

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