JP2017107993A5 - - Google Patents
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- Publication number
- JP2017107993A5 JP2017107993A5 JP2015240761A JP2015240761A JP2017107993A5 JP 2017107993 A5 JP2017107993 A5 JP 2017107993A5 JP 2015240761 A JP2015240761 A JP 2015240761A JP 2015240761 A JP2015240761 A JP 2015240761A JP 2017107993 A5 JP2017107993 A5 JP 2017107993A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- substrate
- magnetic
- polishing pad
- slurry solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims description 82
- 239000000758 substrate Substances 0.000 claims description 64
- 239000010432 diamond Substances 0.000 claims description 29
- 229910003460 diamond Inorganic materials 0.000 claims description 29
- 239000002002 slurry Substances 0.000 claims description 26
- 239000006061 abrasive grain Substances 0.000 claims description 24
- 238000005296 abrasive Methods 0.000 claims description 22
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive Effects 0.000 claims description 5
- 239000002904 solvent Substances 0.000 claims description 4
- 238000003672 processing method Methods 0.000 claims description 3
- 206010017553 Furuncle Diseases 0.000 claims description 2
- 239000002245 particle Substances 0.000 description 10
- 229910010271 silicon carbide Inorganic materials 0.000 description 7
- 229910003465 moissanite Inorganic materials 0.000 description 6
- 239000000835 fiber Substances 0.000 description 5
- 229920000058 polyacrylate Polymers 0.000 description 5
- 229910052594 sapphire Inorganic materials 0.000 description 5
- 239000010980 sapphire Substances 0.000 description 5
- 239000002759 woven fabric Substances 0.000 description 5
- 230000003746 surface roughness Effects 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N AI2O3 Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229920001721 Polyimide Polymers 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229920000305 Nylon 6,10 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N Silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N Silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910001172 neodymium magnet Inorganic materials 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920002530 poly[4-(4-benzoylphenoxy)phenol] polymer Polymers 0.000 description 1
- -1 polybutylene phthalate Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000005341 toughened glass Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015240761A JP6616171B2 (ja) | 2015-12-10 | 2015-12-10 | 研磨装置および研磨加工方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015240761A JP6616171B2 (ja) | 2015-12-10 | 2015-12-10 | 研磨装置および研磨加工方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017107993A JP2017107993A (ja) | 2017-06-15 |
| JP2017107993A5 true JP2017107993A5 (zh) | 2019-03-14 |
| JP6616171B2 JP6616171B2 (ja) | 2019-12-04 |
Family
ID=59060042
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015240761A Active JP6616171B2 (ja) | 2015-12-10 | 2015-12-10 | 研磨装置および研磨加工方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6616171B2 (zh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110871401A (zh) * | 2019-11-29 | 2020-03-10 | 湘能华磊光电股份有限公司 | 一种led芯片的研磨抛光方法 |
-
2015
- 2015-12-10 JP JP2015240761A patent/JP6616171B2/ja active Active
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