JP2017101305A - Fixture for barrel plating, plating method using the same, and method for producing electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a fixture for barrel plating, even in the case where the compact objects to be plated are subjected to plating, capable of using stirring media with a size larger than that of the objects to be plated, efficiently stirring the objects to be plated to suppress the sticking of the objects to be plated each other, and capable of performing stable plating, a plating method, and a method for producing an electronic component.SOLUTION: Provided is a fixture for barrel plating including: a container body 10 stored with the objects 1 to be plated, conductive media 2 and stirring media 3, in which a rotary shaft X is tiltedly rotated to a horizontal direction H, having a bottom and a square-cylindrical shape, and in which a tilted part 8 is provided between the bottom part 5 and side parts 7; and a partition member 20 arranged so as to form a gap G passing through the objects to be plated and not passing through the stirring media between the side parts of the container body and the inner circumferential face of the boundary of the tilted part, the container body is partitioned into the first region 11 closer to the bottom part of the container body and the second region 12 farther from the bottom part by a partition member, and at least the first region is rollably stored with the stirring media.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a barrel plating jig used when plating a chip-type electronic component or the like, a plating method using the jig, and a method for manufacturing an electronic component.

  For example, in an electronic component such as a chip-type multilayer capacitor, Ni plating or Sn plating is applied to the surface of an external electrode provided in the electronic component for the purpose of improving mounting reliability by soldering or preventing solder erosion. It is generally done.

  And when performing Ni plating, Sn plating, etc. to such an electronic component, it puts a to-be-plated object and a conductive medium in a rotatable barrel, and performs plating by rotating in a plating solution, so-called barrel plating. Often done by method. This barrel plating method is widely known as one of highly productive plating methods.

  By the way, there exists a stirring container as described in patent document 1, for example in one of the stirring containers (barrel) used for such barrel plating.

  As shown in FIG. 5, the stirring vessel disclosed in Patent Document 1 has a bottomed cylindrical structure, and a rotating shaft 102 is provided at the center of rotation via a protrusion 103 fixed to the bottom 101a. It has an arranged structure.

  And it is supposed that it can plate efficiently, stirring, without retaining the to-be-plated object accommodated in the inside by using this stirring container and rotating in the state in which the rotating shaft 102 inclined.

  However, in the case of the stirring container of Patent Document 1, it is possible to suppress the retention of the object to be plated as compared with the stirring container not provided with the above-described protrusions. If the conductive media diameter is large, the object to be plated may remain at the bottom and not roll.

  In addition, when a loosening ball (stirring media) for stirring is used to promote stirring, the loosening ball only rolls further above the object to be plated and the conductive medium, and the contribution to stirring is limited. There is a problem of becoming. In particular, when the charge amount of the object to be plated is increased or when a small object is to be plated, the problem becomes remarkable.

  In Patent Document 2, as shown in FIG. 6, an object to be plated 201, a non-conductive dummy (unwinding ball) 202, and a conductive dummy (media) 203 are placed in a barrel 204 in which a cathode 206 is disposed. In the method of plating the object 201 by rotating the barrel 204, the volume or maximum projected area of the non-conductive dummy 202 is equal to or larger than that of the object 201. A plating method has been proposed.

  In the case of the plating method disclosed in Patent Document 2, the effect of stirring is increased by increasing the size of the non-conductive dummy (unraveling ball). However, for uniform stirring, the non-conductive dummy according to the size of the object to be plated It is necessary to use a loosening ball and a conductive dummy (media).

  In particular, when the object to be plated is extremely small, it is necessary to use an extremely small non-conductive dummy (unraveling ball) and a conductive dummy (media) equivalent to that.

  However, such an extremely small non-conductive dummy (unhulling ball) and conductive dummy (media) are not only difficult to obtain, but also expensive and difficult to repeatedly use, so that a small plating target is required. When it is necessary to uniformly plate an object, it is difficult to cope with it by simply downsizing the non-conductive dummy (unwinding ball) and conductive dummy (media). is there.

JP 2006-219713 A JP-A-10-212596

  The present invention solves the above-described problem, and even when plating on a small object to be plated, it is possible to use a stirring medium having a size larger than that of the object to be plated, and to efficiently remove the object to be plated. A barrel plating jig capable of performing stable plating while suppressing sticking between objects to be plated by stirring, a plating method using the same, and a method of manufacturing an electronic component using the plating method The purpose is to provide.

In order to solve the above problems, the jig for barrel plating of the present invention is:
An object to be plated, a conductive medium whose surface is made of a conductive material, and a stirring medium whose surface is made of a non-conductive material are housed therein, and the rotating shaft rotates at a predetermined angle with respect to the horizontal direction. A container body having a bottom, a rectangular tube shape, and an inclined portion between a bottom portion and a side portion constituting a body portion;
Between the side part of the container main body and the inner peripheral surface of the boundary part of the inclined part, it is arranged so that a gap is formed so that at least the object to be plated is allowed to pass but the stirring medium is not allowed to pass. A partition member that divides the container main body into two regions along the rotation axis direction, the first region closer to the bottom side of the container main body, and the second region farther from the bottom. And
The stirring medium is configured to be able to roll in at least the first region.

  In the barrel plating jig of the present invention, it is preferable that the stirring medium is also accommodated in the second region so as to be able to roll.

  With the above configuration, when the stirring medium is also present in the second region, it is possible to more reliably stir the object to be plated and perform stable plating.

  Further, it is preferable that the conductive medium is configured to be able to move between the first region and the second region via a gap between the partition member and the inner peripheral surface of the boundary portion.

  By setting it as the said structure, it becomes possible to plate efficiently in both a 1st area | region and a 2nd area | region.

  In addition, an inclination angle θ1 of the inclined portion of the container body with respect to a side portion of the container body is 10 ° or more and 80 ° or less, and an inclination angle θ2 of the rotating shaft with respect to the horizontal direction is 5 ° or more and 40 °. The following is preferable.

  The inclination angle θ1 with respect to the side portion of the inclined portion of the container body is set to 10 ° or more and 80 ° or less, and the inclination angle θ2 with respect to the horizontal direction of the rotating shaft is set to ½ of the value of θ1, that is, 5 ° or more, By setting the angle to 40 ° or less, it becomes possible to more efficiently collect the objects to be plated, the stirring media, and the conductive media in the vicinity of the boundary portion between the side portion and the inclined portion of the container body. It can be tightened.

  Moreover, it is preferable that the surface facing the said bottom part of the said container main body of the said partition member has the pyramid surface shape which protruded toward the said bottom part of the said container main body.

  By making the surface of the partition member facing the bottom of the container main body into a pyramidal surface shape that protrudes toward the bottom, the flow of contents such as agitation media and objects to be plated is guided toward the bottom of the container main body. It is possible to converge. As a result, the stirring efficiency in the rotation axis X direction is improved and the staying area of the objects to be plated is reduced, so that the objects to be plated can be effectively prevented from sticking to each other during plating. It is.

  Moreover, it is preferable that the peripheral part of the said partition member is provided with the return part which protrudes in the direction which goes to the said inclination part of the said container main body, and becomes thin toward the front end side.

  When the partition member is configured to include the return portion, for example, when a pair of agitation media are located in positions near the peripheral edge of the partition member in the first region and the second region partitioned by the partition member. The stirring medium does not go back and forth from the first region to the second region or from the second region to the first region, and between the partition member and the boundary between the side portion of the container body and the inclined portion, While avoiding the agitation media from being caught, the container can be positioned in the vicinity of the boundary portion between the side portion and the inclined portion of the container main body in a state of being extremely close to each other or being able to contact each other. Therefore, it is possible to ensure good contact between the object to be plated, the conductive medium, and the stirring medium, and the present invention can be more effectively realized.

  Moreover, it is preferable that the said partition member is attached to the cover member for sealing the opening provided facing the said bottom part of the said container main body via the support | pillar.

  By setting it as the said structure, it becomes possible to hold | maintain a partition member reliably in the predetermined position in a container main body, without requiring a complicated structure.

  Moreover, it is preferable that the barrel plating jig of the present invention is configured such that the container body can be sealed and the plating solution can be held inside.

  If it is possible to seal and the plating solution can be held inside, just turn the barrel plating jig with the plating solution in the container body together with the object to be plated and the stirring media. Thus, it is possible to easily and surely perform good plating.

  At least a part of the container body may be made of a material that allows the plating solution to pass therethrough but does not allow the solid object to be plated, the conductive media, and the stirring media to pass therethrough.

  With the above configuration, barrel plating jigs containing objects to be plated, conductive media, stirring media, etc. are immersed in the plating solution and rotated, enabling easy and reliable good plating. Become.

  The plating method of the present invention is characterized by performing plating using the barrel plating jig of the present invention.

  Moreover, the manufacturing method of the electronic component of this invention is equipped with the process of plating using an electronic component element as a to-be-plated object using the plating method of the said invention.

  The barrel plating jig of the present invention accommodates an object to be plated, a conductive medium whose surface is made of a conductive material, and a stirring medium whose surface is made of a non-conductive material, and its rotation axis is predetermined with respect to the horizontal direction. A container body having a bottomed, rectangular tube shape and having an inclined portion between the bottom portion and a side portion constituting the body portion, and a boundary portion between the side portion and the inclined portion of the container body. Between the inner peripheral surface of the container and the inner surface of the container, the gap is formed so as to allow the object to be plated to pass but not the stirring medium, and the container main body is located closer to the bottom side and far from the bottom. And a partition member for partitioning into the second region, and at least the first region is configured so that the stirring medium is accommodated. Therefore, when plating on a small object to be plated, compared to the object to be plated Even when stirring media with large dimensions are used,拌 media to suppress the uneven distribution in the state of floating on the object to be plated group or a conductive media group, it is possible to sufficiently stir the object to be plated.

  In addition, even when using a stirring medium with a size larger than that of the object to be plated, since the stirring medium is sufficiently stirred, it is possible to perform good plating on fine objects to be plated. become.

  In addition, since it becomes possible to use a stirring medium having a size larger than that of the object to be plated, the cost can be reduced compared to the case of using a stirring medium having a smaller dimension corresponding to the dimension of the object to be plated. Is possible.

  In addition, since the plating method of the present invention performs plating using the above-described barrel plating jig of the present invention, it is efficient and reliable even when plating on a workpiece having a small size. It is possible to perform good plating.

  When plating is performed using a barrel plating jig that is configured so that the container body can be sealed and the plating solution can be held inside, for example, the cathode and anode are positioned in the container body. In addition, plating can be performed by energizing the anode and the cathode while rotating the barrel plating jig in which the conductive medium, the stirring medium, the object to be plated, and the plating solution are charged.

  In addition, at least a part of the container body is plated using a barrel plating jig made of a material that allows the plating solution to pass but does not allow other solid objects to be plated, stirring media, and conductive media to pass. For example, in the plating solution in which the anode is immersed, the cathode is positioned in the container body, and the conductive medium, the agitation medium, and the object to be plated are placed. Plating can be performed by energizing between the anode and the cathode while rotating.

  Moreover, since the manufacturing method of the electronic component of the present invention includes a step of performing plating using the electronic component element as an object to be plated using the plating method of the present invention, for example, good plating for an external terminal electrode or the like. It is possible to efficiently manufacture a highly reliable electronic component to which is applied. This is particularly significant when the electronic component has a small size.

It is a figure for demonstrating the method to plate using the jig | tool for barrel plating concerning Embodiment 1 of this invention. It is front sectional drawing which shows the structure of the jig | tool for barrel plating concerning Embodiment 1 of this invention. It is a figure which shows the container main body which comprises the jig | tool for barrel plating concerning Embodiment 1 of this invention, Comprising: (a) is a top view, (b) is a front view, (c) is a bottom view. It is a figure which shows the partition member which comprises the jig | tool for barrel plating of this invention, (a) is a front view of the state currently hold | maintained at the cover member, (b) is a bottom view of a partition member. It is a figure which shows the stirring container for the conventional barrel plating. It is a figure explaining the conventional barrel plating method.

  In the following, embodiments of the present invention will be shown to describe the features of the present invention in more detail.

[Embodiment 1]
In the first embodiment, a multilayer ceramic capacitor (element), which is a typical chip-type electronic component, is used as an object to be plated, and an example of a barrel plating jig used when plating is performed on an external electrode formed on the surface. I will explain to you.

FIG. 1 is a view for explaining a method of performing plating using a barrel plating jig according to Embodiment 1 of the present invention, and FIG. 2 is a front sectional view of the barrel plating jig of the present invention.
3 is a diagram showing the configuration of the container body constituting the barrel plating jig according to the first embodiment. FIG. 4A is a front view showing the partition member held by the lid member. ) Is a bottom view of the partition member.

  As shown in FIGS. 1 to 4, the jig A for barrel plating contains an object 1 to be plated, a conductive medium 2, and a stirring medium 3, and the rotation axis X is in a horizontal direction (horizontal plane) H. A container body 10 that is inclined and rotated at a predetermined angle; a partition member that divides the interior of the container body 10 into a first region 11 closer to the bottom 5 side and a second region 12 farther from the bottom 5 20 and a lid member 30 that seals the opening of the container body 10.

  The partition member 20 is attached to the lid member 30 via the support column 21, and the partition member 20 is held at a predetermined position in the container body 10 by fixing the lid member 30 to the container body 20. It is comprised so that.

  The lid member 30 can have various shapes as long as the lid member 30 can be attached to the opening of the container body 10, for example, a hexagon corresponding to the planar shape of the container body 10, It can also be circular.

  As will be described later, the lid member 30 is provided with a through-hole 30a for charging and storing the object to be plated 1, the conductive medium 2, the stirring medium 3, the plating solution 4 and the like in the container body 10.

  As described above, the object to be plated 1 is a chip-type multilayer ceramic capacitor element in which external electrodes to be plated are formed on the surface. However, the object to be plated 1 is not limited to the multilayer ceramic capacitor element, and may be an electronic component having an external electrode formed on the surface. For example, the workpiece 1 may be a coil component or a thermistor.

  Further, as the conductive medium 2, a spherical medium whose surface is made of a conductive material, for example, a metal spherical body such as iron, copper, or nickel is used. Although there are no particular restrictions on the material constituting the conductive medium 2, it is desirable to use a material made of a material that is not likely to elute into the plating solution.

  As the stirring medium 3, a medium whose surface is made of a non-conductive material, for example, a ceramic spherical body is used. In addition, there is no special restriction | limiting in the material which comprises the stirring medium 3, Other materials can also be used.

Moreover, in the barrel plating jig A according to this embodiment, the container body 10 is a regular hexagonal cylinder as shown in FIGS. 2 and 3, and includes a bottom portion 5 and side portions 7 constituting the body barrel 6. An inclined portion 8 is provided between them.
The container body 10 is configured such that the rotation axis X passes through the center of a regular hexagonal cylinder.

  Moreover, as shown to Fig.4 (a), (b), the planar shape of the partition member 20 attached to the cover member 30 via the support | pillar 21 is a regular hexagon.

The partition member 20 forms a gap G between the side wall 7 and the inner peripheral surface of the boundary portion of the inclined portion 8 of the container body 10 while allowing the workpiece 1 to pass but not allowing the stirring medium 3 to pass. The dimensions and structure are as described above.
In the barrel plating jig A according to this embodiment, the gap G is sized so as to allow the conductive media 2 to pass therethrough.

Further, the partition member 20 is configured such that a surface 20 a facing the bottom portion 5 of the container body 10 has a pyramidal surface shape protruding toward the bottom portion 5 of the container body 10.
This is because the surface 20a of the partition member 20 facing the bottom 5 of the container body 10 has a pyramidal shape protruding toward the bottom 5 of the container body 10, so that the object to be plated 1, the conductive medium 2, and the stirring are performed. It is intended to guide the flow of the media 3 toward the bottom of the container body 10, improve the stirring efficiency in the direction of the rotation axis X, and reduce the staying area of the workpiece 1.

  Further, in the barrel plating jig A of this embodiment, the stirring medium 3 is movably accommodated in both the first region 11 and the second region 12 described above, and in the first region and the second region. Each of the agitation media 3 accommodated is configured to be able to roll in one area by the partition member 20 and not move to the other area.

  Further, a return portion 20 b that protrudes in the direction toward the inclined portion 8 of the container body 20 is provided at the peripheral edge portion of the partition member 20. The return portion 2 is configured such that the thickness decreases from the proximal end side toward the distal end side.

  As shown in FIGS. 1 and 2, for example, as shown in FIGS. 1 and 2, the first region 11 and the second region 12 partitioned by the partition member 20 are configured by including the return portion 20 b as in the case of this embodiment. When the pair of stirring media 3 is located near the peripheral edge of the partition member 20, the stirring media 3 is moved back and forth from the first region 11 to the second region 12 or from the second region 12 to the first region 11. Without contact between the partition member 20 and the boundary portion between the side portion 7 and the inclined portion 8 of the container body 10 and in close proximity to or in contact with each other. In a state where it can be performed, the container body 10 can be positioned in the vicinity of the boundary portion between the side portion 7 and the inclined portion 8. Therefore, it is possible to ensure good contact between the object to be plated 1, the conductive medium 2, and the stirring medium 3.

  As shown in FIGS. 1 and 2, the inclination angle θ1 of the inclined portion 8 of the container body 20 with respect to the side portion 7 of the container body 10 is not less than 10 ° and not more than 80 °, and is about 45 in this embodiment. It is °.

  Further, the barrel plating jig A is configured to rotate while being inclined so that the rotation axis X has a predetermined angle with respect to the horizontal direction (horizontal plane) H when performing plating. In this embodiment, as shown in FIG. 1, the inclination angle θ2 of the rotation axis X with respect to the horizontal direction H is 5 ° or more and 40 ° or less. In this embodiment, the inclination portion 8 of the container body 20 is The angle of the inclination angle θ <b> 1 with respect to the side portion 7 of the container body 10 is about 20 °.

  Thus, by setting the inclination angle θ2 with respect to the horizontal direction H of the rotation axis X of the container body 10 to be ½ of the inclination angle θ1 with respect to the side part 7 of the inclination part 8, as shown in FIG. 7 and the inclined portion 8 is the bottom of the valley, and the V angle formed by the horizontal direction H and the side portion 7 is the same angle as the f angle θ3 formed by the horizontal direction H and the inclined portion 8. In this area, the object to be plated 1, the conductive medium 2, and the stirring medium 3 roll while being accumulated. The agitation media 3 present in both the first region 11 and the second region 12 sufficiently agitate, and the conductive media 2 and the workpiece 1 are sufficiently in contact with each other to perform satisfactory plating.

  The barrel plating jig A of this embodiment is configured so that the container body 10 can be sealed and the plating solution can be held inside.

  When plating is performed using the barrel plating jig A, first, the stirring medium 3 to be accommodated in the first region 11 is put into the container body 10, and then the lid member 30 is attached to the container body 10, and the partition member 20 is disposed at a predetermined position inside the container body 10.

  Then, the agitating medium 3 to be accommodated in the second region 12, the object to be plated 1, the conductive medium 2, and the plating solution 4 are introduced from the through hole 30 a provided in the lid member 30.

  Thereby, the to-be-plated object 1, the conductive media 2, and the plating solution 4 are accommodated in the container body 10 so as to be able to go back and forth between the first region 11 and the second region 12 through the gap G described above, The stirring media 4 accommodated in each of the first region 11 and the second region 12 are held so as to be able to roll in the respective regions without going back and forth between the first region 11 and the second region 12.

  Note that a predetermined amount of the stirring medium 3 to be accommodated in the first region 11 is charged before the lid member 30 is attached to the container body 10 and the partition member 20 is disposed at a predetermined position inside the container body 10. Except for the above, there is no restriction on the order in which the object to be plated 1, the conductive medium 2, the stirring medium 3 to be accommodated in the second region 11 and the plating solution 4 are charged.

  When plating is performed using this barrel plating jig A, for example, although not illustrated, for example, a cathode and an anode are positioned in the container body, and an object to be plated, a conductive medium, and the like are disposed in the body container. The plating is performed by energizing between the anode and the cathode while rotating the barrel plating jig while the stirring medium and the plating solution are accommodated.

  Since the barrel plating jig A of this embodiment is configured as described above, the object to be plated, the conductive media, the stirring media, and the plating solution are only accommodated and rotated in the main body container. Thus, the object to be plated 1 can be efficiently stirred to perform high-quality plating.

  That is, the container body 10 includes the inclined portion 8 between the side portion 7 and the bottom portion 5, and the partition member 20 is disposed therein, and the container body 10 is rotated at a predetermined angle. As a result, the stirring medium 3 is lifted from the group of objects to be plated by the stirring medium 3 accommodated in a rollable manner in each of the first region 11 and the second region 12. It is possible to suppress and perform good plating.

  Further, since the barrel plating jig A of this embodiment is configured as described above, even when a large stirring medium 3 is used, it is possible to sufficiently stir the workpiece 1, As the conductive medium 2, a medium having a diameter larger than twice the dimension of the workpiece 1 can be used.

  Conventionally, it has been preferable to set the diameter of the conductive medium to about ± 50 μm of the dimension of the object 1 to be plated. However, by using the barrel plating jig A of this embodiment, the diameter of the conductive medium can be reduced. Can be expanded to ± 150 μm or more of the dimension of the workpiece 1.

  Therefore, when the dimension of the workpiece 1 is small, the cost can be reduced as compared with the case where a small stirring medium having the same dimension as that of the workpiece 1 is used.

  Specifically, in the barrel plating jig A of this embodiment, when the dimension of the workpiece 1 is 1.0 mm in length and 0.5 mm in width, the conductive medium 2 has a diameter of 1. Good plating could be performed using a 5 mm diameter stirring medium 3 having a diameter of 7.8 mm.

  By the way, when an agitating medium having a size larger than that of the conductive medium or the object to be plated is used, the conductive medium or the object to be plated having a smaller size is accumulated below the container body, and the agitating medium having a larger size is not removed from the conductive medium or the object to be plated. It becomes easy to collect on things. And when the stirring media is in a state of floating on the surface of the group of objects to be plated or the group of conductive media, it becomes difficult to sufficiently loosen and agitate the objects to be plated.

  As described above, the stirring medium tends to float on the surface of the group of objects to be plated or the group of conductive media. Mainly, the object to be plated or the conductive medium is smaller in size than the stirring medium, and the container body 10 is filled. This is because the gap is small, the conductive medium is spherical and has high fluidity, and is easily moved downward from the gap formed between the stirring media having large dimensions.

Further, in terms of the relationship between the conductive medium and the object to be plated, the conductive medium has a spherical shape and less frictional resistance, and thus tends to move upward than the object to be plated.
As described above, when the stirring medium is positioned above and the contact opportunity with the object to be plated decreases, the object to be plated cannot be loosened and stirred sufficiently.

  On the other hand, in the case of the barrel plating jig A of the present invention, the workpiece 1 and the conductive media 2 pass, but the stirring media 3 is not allowed to pass, and the partition member 20 is partitioned. Since the rollable stirring medium 3 is accommodated in both the first region 11 close to the bottom 5 and the second region 12 far from the bottom 5, the bottom side of the container body 10 is closer to the bottom. Even in the first region close to 2, the object to be plated 1 is sufficiently stirred by the stirring medium 3, and the object to be plated 1 can be sufficiently stirred by the stirring medium 3 in the second region 12, which is favorable. Plating can be performed.

  Moreover, since the surface 20a facing the bottom 5 of the container body 10 of the partition member 20 has a pyramidal surface shape protruding toward the bottom 5 of the container body 10 as described above, the workpiece 1 Since the flow of the conductive medium 2 and the stirring medium 3 is guided toward the bottom of the container body 10, the stirring efficiency in the rotation axis X direction can be improved, and the residence area of the object 1 can be reduced. It is possible to effectively prevent the objects to be plated 1 from sticking to each other during plating.

  Moreover, in the barrel plating jig A according to this embodiment, the thickness decreases from the proximal end side toward the distal end side, protruding in the direction toward the inclined portion 8 of the container body 10 at the peripheral edge portion of the partition member 20. Since the return part 20b is provided, the peripheral part of the partition member 20 and the inner peripheral surface of the boundary part of the side part 7 and the inclined part 8 of the container body 10 are reliably blocked while the stirring medium 3 is prevented from passing therethrough. The plating object 1 can be surely agitated and reliable plating can be performed without hindering the flow of the plating object 1 and the conductive media 2 in the vicinity of the gap G between the two.

That is, the stirring medium 3 having a size larger than that of the workpiece 1 and the conductive medium 3 is held by the partition member 20 so as to be able to roll in both the first region 11 and the second region 12. In both the region 11 and the second region 12, the object to be plated 1 can be loosened and agitated, and the object 1 and the conductive medium 2 are interposed between the first region 11 and the second region 12. Freely come and go to contact each other, and more closely contact at the V-shaped valley between the side 7 and the inclined portion 8 of the container body 10, so that it is possible to reliably perform good plating Become.
Further, even when the object to be plated 1 is an electronic component element having a small size, efficient plating can be performed efficiently.

  In the above embodiment, the container body is a regular hexagonal cylinder and the rotation axis X passes through the center of the regular hexagonal cylinder. However, the container body may be a rectangular cylinder. For example, the number of corners is not particularly limited, and a square tube having a smaller number of corners than that of a hexagonal tube may be used, or a square tube having a number of corners larger than six may be used.

  In addition, the barrel plating jig of the present invention is formed of a material in which at least a part of the container body allows the plating solution to pass but does not allow other solid objects to be plated, conductive media, and stirring media to pass. It is also possible to have a configuration. In performing plating using the barrel plating jig A configured as described above, for example, although not shown, for example, the cathode is positioned in the container body, and the conductive medium, the stirring medium, and the object to be plated In a state in which is put into the container body, plating can be performed by energizing between the anode and the cathode while rotating the barrel plating jig in the plating solution in which the anode is immersed.

  In the above embodiment, the stirring medium 3 is configured to exist in both the first region 11 and the second region 12 partitioned by the partition member 20, but the stirring medium 3 is provided only in the first region 11. It can also be configured to exist. In that case, the stirring medium 3 and the workpiece 1 are contacted and stirred in the first region 11, but the contact between the stirring media 3 and the workpiece 1 is lost in the second region. However, since the object to be plated 1 can move back and forth between the first region 11 and the second region 12, even with the first region 11 alone, appropriate stirring can be performed and good plating can be performed.

  In the above embodiment, the case where a chip-type multilayer ceramic capacitor element is to be plated and the external electrode is plated has been described as an example, but there are special restrictions on the type of plating object and the object to be plated. For example, the present invention can also be applied to the case where the laminated coil component element is plated and the surface conductor is plated.

  In addition, the present invention is not limited to the above-described embodiment in other points, and various applications and modifications can be made within the scope of the present invention with respect to plating conditions and the like.

DESCRIPTION OF SYMBOLS 1 To-be-plated object 2 Conductive medium 3 Stirring medium 4 Plating solution 5 Bottom part of container main body 6 Main body cylinder of container main body 7 Side part which comprises main body cylinder 8 Inclined part 10 Container main body 11 1st area | region 12 2nd area | region 20 Partition member 20a Surface facing the bottom of the container body of the partition member 20b Return portion formed on the partition member 21 Column 30 Lid member 30a Through hole A Barrel plating jig G Gap H Horizontal direction (horizontal plane)
X Rotation axis X
θ1 Inclination angle relative to the side of the inclined portion of the container body θ2 Inclination angle relative to the horizontal direction of the rotation axis θ3 Angle formed between the horizontal direction and the side portion θ4 Angle formed between the horizontal direction and the inclined portion

Claims (11)

An object to be plated, a conductive medium whose surface is made of a conductive material, and a stirring medium whose surface is made of a non-conductive material are housed therein, and the rotating shaft rotates at a predetermined angle with respect to the horizontal direction. A container body having a bottom, a rectangular tube shape, and an inclined portion between a bottom portion and a side portion constituting a body portion;
Between the side part of the container main body and the inner peripheral surface of the boundary part of the inclined part, it is arranged so that a gap is formed so that at least the object to be plated is allowed to pass but the stirring medium is not allowed to pass. A partition member that divides the container main body into two regions along the rotation axis direction, the first region closer to the bottom side of the container main body, and the second region farther from the bottom. And
A barrel plating jig, wherein the stirring medium is accommodated in at least the first region so as to be able to roll.   The barrel plating jig according to claim 1, wherein the stirring medium is accommodated in the second region so as to be able to roll.   The conductive medium is configured to be movable between the first region and the second region through a gap between the partition member and an inner peripheral surface of the boundary portion. Item 3. A jig for barrel plating according to item 1 or 2.   The inclination angle θ1 of the inclined portion of the container main body with respect to the side portion of the container main body is 10 ° or more and 80 ° or less, and the inclination angle θ2 of the rotating shaft with respect to the horizontal direction is 5 ° or more and 40 ° or less. The barrel plating jig according to claim 1, wherein the barrel plating jig is provided.   The surface of the partition member facing the bottom portion of the container body has a pyramidal surface shape protruding toward the bottom portion of the container body. The jig for barrel plating as described.   The peripheral portion of the partition member is provided with a return portion that protrudes in a direction toward the inclined portion of the container main body and decreases in thickness toward the distal end side. The barrel plating jig according to any one of the above.   The said partition member is attached to the cover member for sealing the opening provided facing the said bottom part of the said container main body via the support | pillar. A jig for barrel plating as described in 1.   The barrel plating jig according to any one of claims 1 to 7, wherein the container main body is sealable and configured to hold the plating solution therein.   At least a part of the container body is made of a material that allows the plating solution to pass therethrough but does not allow the solid object to be plated, the conductive medium, and the stirring medium to pass therethrough. The barrel plating jig according to claim 1.   A plating method comprising performing plating using the barrel plating jig according to claim 1.   A method for producing an electronic component, comprising the step of performing plating using the electronic component element as an object to be plated using the plating method according to claim 10.

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