KR20160115200A - A Cover Plate for Electro Plating - Google Patents

A Cover Plate for Electro Plating Download PDF

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Publication number
KR20160115200A
KR20160115200A KR1020150042402A KR20150042402A KR20160115200A KR 20160115200 A KR20160115200 A KR 20160115200A KR 1020150042402 A KR1020150042402 A KR 1020150042402A KR 20150042402 A KR20150042402 A KR 20150042402A KR 20160115200 A KR20160115200 A KR 20160115200A
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South Korea
Prior art keywords
region
plating
plate
shielding plate
thickness
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KR1020150042402A
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Korean (ko)
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KR101734302B1 (en
Inventor
임재홍
이규환
송영섭
정용수
이주열
장도연
임동찬
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한국기계연구원
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Priority to KR1020150042402A priority Critical patent/KR101734302B1/en
Publication of KR20160115200A publication Critical patent/KR20160115200A/en
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Publication of KR101734302B1 publication Critical patent/KR101734302B1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002—Cell separation, e.g. membranes, diaphragms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C25D17/18—Apparatus for electrolytic coating of small objects in bulk having closed containers

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The present invention provides a shielding plate for plating, comprising a plate including a first region and a second region located along the periphery of the first region, the second region comprising: a corner region including a vertex of the plate; A center region located between two adjacent corner regions; And an intermediate region located between the corner region and the center region of the auxiliary region, the first hole being located in the first region and the second hole being located in the corner region, It is possible to provide a shielding plate for electrolytic plating capable of uniformly plating the thickness of a metal film.

Description

{A Cover Plate for Electro Plating}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a shield plate for electroplating, and more particularly, to a shield plate for electrolytic plating capable of uniformly plating a thickness of a metal film.

As a general method of forming a metal film, there are various methods such as an electrolytic plating method, a vapor deposition method, a printing method, and a ball bump method, but electrolytic plating methods which can be miniaturized and have relatively stable performance are widely used.

According to the electrolytic plating method, a metal film (plating film) of high purity can be easily obtained, the film formation rate of the metal film is comparatively fast, and the thickness of the metal film can be controlled relatively easily.

On the other hand, for example, since formation of a metal film on a printed circuit board pursues high-density packaging, high performance, and high yield, in-plane uniformity of the film thickness is also strictly demanded.

According to the electrolytic plating as described above, it is expected that a metal film excellent in in-plane uniformity in film thickness can be obtained by uniformizing the metal ion supply rate distribution and the potential distribution of the plating liquid.

1 is a schematic view showing an electrolytic plating bath according to the prior art.

The electrolytic plating bath of FIG. 1 is shown in the form of an electrolytic plating bath which is commonly used for plating a printed circuit board.

1, when an anode 2 and a cathode 3 are present in the plating tank 1 and electricity is applied between the two electrodes, the metal ions supplied to the anode 2 (anode) Moves along the electric field to the substrate 3, and the electrons move along the electric wire to the substrate 3. The metal ions combine with electrons at the surface of the substrate and are metal plated.

At this time, in order to make the thickness of the plating uniform, it is firstly necessary to maintain the concentration of the plating metal ion concentration in the vicinity of the surface of the substrate to be plated to a predetermined level or higher.

For this reason, a method of stirring the plating solution or applying a predetermined flow rate to the plating solution always replaces the plating solution around the substrate to maintain the concentration of the plating solution at a constant level.

Second, it is necessary to keep the current density uniform. If the current density is high, the plating rate is increased correspondingly, and the thickness of the plating is formed differently depending on the substrate position.

However, the lines of electric force in the plating tank tend to be concentrated in the vertical or parallel direction of the substrate and the electrodes at the central portion of the substrate, while the electric lines tend to concentrate at the peripheral portion of the substrate due to the edge effect.

As a result, the growth rate of the plating is faster than the center portion of the substrate, and as a result, the thickness of plating on the peripheral portion of the substrate is increased.

Therefore, in order to make the current density uniform, a shielding plate 5 is provided between the anode 2 and the substrate 3 so as to cover the edge portion of the substrate, as shown in FIG. 1, However, according to this method, the plating solution in the portion blocked by the shielding plate is stagnated by interfering with the flow of the plating solution, so that it is difficult to maintain the concentration of the plating solution at a constant level.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a shield plate for electrolytic plating capable of uniformly plating a thickness of a metal film.

The objects of the present invention are not limited to the above-mentioned objects, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.

According to an aspect of the present invention, there is provided a shielding plate for plating comprising a plate including a first region and a second region located along the periphery of the first region, An edge area including a vertex of the pixel; A center region located between two adjacent corner regions; And an intermediate region located between the corner region and the center region of the auxiliary region, the first hole located in the first region and the second hole located in the corner region, to provide.

Further, the present invention provides a shielding plate for plating comprising a third hole located in the central region.

Further, the present invention provides a shielding plate for plating, wherein the intermediate region is a shielding region not including a hole.

Further, the present invention is characterized in that the second region is defined as a region extending from each end of the plate to a predetermined length (l x ), and the predetermined length (l x ) And a length of the longest line segment among the line segments including the other point located at the end of the plate is 10% or less based on 100% of the length of the longest line segment.

The edge area may be defined as an area located in the second area and corresponding to an inside of a virtual circle corresponding to a radius r of a predetermined length centered on the vertex, (r) provides a plating shielding plate having a length of 10% or less based on 100% of the length of a line segment including any one vertex and another vertex adjacent to the vertex.

Further, the present invention is characterized in that the center area includes a center of a line segment which is located in the second area and which is adjacent to one of the vertexes and one of the vertexes adjacent to the other vertex, And a length of 10% or less based on%.

Further, the present invention provides the shielding plate for plating, wherein the intermediate region is defined as a region located in the second region and excluding the corner region and the center region.

According to the present invention as described above, it is possible to provide a shielding plate for electrolytic plating capable of uniformly plating the thickness of a metal film.

1 is a schematic view showing an electrolytic plating bath according to the prior art.
2A is a plan view showing a shielding plate for electrolytic plating according to a first embodiment of the present invention.
2B is a plan view showing a shielding plate for electroplating according to a second embodiment of the present invention.
3 is a reference view for defining a plate region of the shielding plate for electroplating according to the present invention.
4 is a plan view showing a shielding plate for electrolytic plating according to Comparative Example 1. Fig.
5 is a plan view showing a shielding plate for electrolytic plating according to Comparative Example 2. Fig.
6 is a plan view showing a shielding plate for electrolytic plating according to Comparative Example 3. Fig.
FIG. 7A is a photograph showing a specimen in the case of plating without using a shielding plate for plating, and FIG. 7B is a graph showing an actual value of thickness along a line on lines 1 and 2 in FIG. 7A.
8 is a simulation result in which the plating thickness is predicted when the shielding plate for electrolytic plating according to the first embodiment of the present invention is used.
9 is a simulation result that predicts a plating thickness when a shielding plate for electroplating according to the second embodiment of the present invention is used.
10 is a simulation result that predicts a plating thickness when a shielding plate for electrolytic plating according to Comparative Example 1 is used.
11 is a simulation result in which the plating thickness is predicted when the shielding plate for electrolytic plating according to Comparative Example 2 is used.
12 is a simulation result in which the plating thickness is predicted when the shielding plate for electrolytic plating according to the comparative example 3 is used.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and the manner of achieving them, will be apparent from and elucidated with reference to the embodiments described hereinafter in conjunction with the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings. &Quot; and / or "include each and every combination of one or more of the mentioned items. ≪ RTI ID = 0.0 >

Although the first, second, etc. are used to describe various components, it goes without saying that these components are not limited by these terms. These terms are used only to distinguish one component from another. Therefore, it goes without saying that the first component mentioned below may be the second component within the technical scope of the present invention.

The terminology used herein is for the purpose of illustrating embodiments and is not intended to be limiting of the present invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. The terms " comprises "and / or" comprising "used in the specification do not exclude the presence or addition of one or more other elements in addition to the stated element.

Unless defined otherwise, all terms (including technical and scientific terms) used herein may be used in a sense commonly understood by one of ordinary skill in the art to which this invention belongs. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.

The terms spatially relative, "below", "beneath", "lower", "above", "upper" And can be used to easily describe a correlation between an element and other elements. Spatially relative terms should be understood in terms of the directions shown in the drawings, including the different directions of components at the time of use or operation. For example, when inverting an element shown in the figures, an element described as "below" or "beneath" of another element may be placed "above" another element . Thus, the exemplary term "below" can include both downward and upward directions. The components can also be oriented in different directions, so that spatially relative terms can be interpreted according to orientation.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2A is a plan view showing a shielding plate for electrolytic plating according to a first embodiment of the present invention.

Referring to FIG. 2A, the shielding plate 100 for electrolytic plating according to the first embodiment of the present invention includes a plate 110 constituting a body of a shielding plate.

The plate 110 serves to cut off the electric force line when electroplating. Although the plate 110 has a rectangular shape in the drawing, the plate 110 may be a polygon in various shapes such as a triangle, a pentagon, and a hexagon. However, The shape of the plate is not limited.

3 is a reference view for defining a plate region of the shielding plate for electroplating according to the present invention.

3, the plate 10 of the shielding plate for electroplating according to the present invention includes a first region A and a second region B, which is located along the periphery of the first region A, C, and D).

Hereinafter, for convenience of explanation, the first area is defined as a main area and the second area is defined as a sub area. However, in the present invention, the terms "main" It is not intended to limit its meaning.

Subsequently 3, the secondary zone (B, C, D) can be defined as the area to a predetermined length (l x) from each end of the plate, but is located along the periphery of the main area, The predetermined length l x is the length of the longest line segment among the line segments between a point X 1 located at the end of the plate and another point X 3 located at the end of the plate l 1 ) It can be defined as a length of 10% or less based on 100%.

Further, the main region A may be defined as a region of the plate excluding the auxiliary region.

In addition, the secondary zone (B, C, D) are the vertices (X 1, X 2, X 3, X 4) the edge region including the (B-1, B-2 , B-3, B- of the plate 4).

The edge region (B-1, B-2 , B-3, B-4) is located in the secondary zone (B, C, D), each of the vertices (X 1, X 2, X 3, X 4 ) may be the center defined by the area corresponding to the inside of the imaginary circle that corresponds to the radius (r) of a predetermined length, the radius (r) of said predetermined length is one of the vertices (one and the one X 1) a the vertex of line segment length followed by a different one of the vertices (X 4) adjacent to the (X 1) (l 2) can be defined as a length of no more than 10% with respect to 100%.

The auxiliary areas B, C, and D include center areas D-1, D-2, D-3, and D-4 of the auxiliary areas located between adjacent two edge areas.

The central region (D-1, D-2 , D-3, D-4) of the storage area is situated in the secondary zone (B, C, D), the one and any one of the vertices (X 1) of the point (X 1) it includes a center (y) of the segment followed by the other one of the vertices (X 4) adjacent to, and define a length of no more than 10% with respect to the length (l 2) 100% of the line segment .

The auxiliary areas B, C, and D include intermediate areas C-1 to C-8 positioned between the corner areas and the center areas of the auxiliary areas.

The intermediate areas C-1 to C-8 may be defined as areas that are located in the auxiliary areas B, C, and D, excluding the corner areas and the center areas of the auxiliary areas.

The plate 10 of the shielding plate for electroplating according to the present invention includes a main region A and auxiliary regions B, C and D located along the periphery of the main region A, .

In addition, the secondary zone (B, C, D) are the vertices (X 1, X 2, X 3, X 4) the edge region including the (B-1, B-2 , B-3, B- of the plate D-2, D-3, D-3, and D-4 of the auxiliary area located between adjacent two corner areas, 4).

The auxiliary areas B, C, and D include intermediate areas C-1 to C-8 positioned between the corner areas and the center areas of the auxiliary areas.

Therefore, the plate region of the electroplating shield may include a primary region and a secondary region, and the secondary region may include an edge region, a secondary region central region, and an intermediate region.

The present invention is described as follows through the definition of the plate region as described above.

2A, the plate 110 of the shielding plate for electroplating according to the first embodiment of the present invention includes a main region A, And a supplementary area located along the periphery.

At this time, the holes 120 located in the main region A and the holes 120 located in the edge regions B-1, B-2, B-3, and B- ).

As described above, the auxiliary area of the present invention includes the edge area, the auxiliary area center area, and the intermediate area. However, in the plate according to the first embodiment of the present invention, .

Meanwhile, in the present invention, the hole located in the main region may be divided into the first hole and the hole located in the edge region may be divided into the second hole, in order to distinguish the hole located in the main region and the hole located in the edge region, , It does not mean that there is a difference in the shape of these holes.

2B is a plan view showing a shielding plate for electroplating according to a second embodiment of the present invention.

Referring to FIG. 2B, the shielding plate 200 for electroplating according to the second embodiment of the present invention includes a plate 210 constituting the body of the shielding plate. Since this is the same as the first embodiment, detailed description will be omitted below.

2B, the plate 210 of the shielding plate for electroplating according to the second embodiment of the present invention includes a main region A, And a supplementary area located along the periphery.

In this case, the auxiliary area includes an edge area, a center area of the auxiliary area, and an intermediate area, and includes a hole 220 located in the main area A, as in the first embodiment, And holes 220 located in corner areas B-1, B-2, B-3, and B-4.

Unlike the first embodiment, the second embodiment of the present invention also includes holes in the auxiliary area central areas D-1, D-2, D-3, and D-4.

That is, the plate according to the second embodiment of the present invention includes holes in the edge region and the auxiliary region central region, but no hole is formed in the intermediate region.

In the present invention, in order to distinguish between holes located in the main region, holes located in the corner regions, and holes located in the center region of the auxiliary region, the holes located in the main region are divided into the first holes, And the holes located in the center region of the auxiliary region can be divided into the third holes, but this does not mean that there is a difference in the shape of the holes.

Hereinafter, embodiments of the comparative example for comparison with the present invention will be described.

4 is a plan view showing a shielding plate for electrolytic plating according to Comparative Example 1. Fig.

Referring to FIG. 4, the shielding plate 300 for electrolytic plating according to the comparative example 1 includes a plate 310 constituting the body of the shielding plate.

The plate 310 includes a main area A and auxiliary areas B, C and D located along the periphery of the main area A.

At this time, the auxiliary area includes an edge area, a center area of the auxiliary area, and an intermediate area, and includes holes 320 located in the main area A, as in the first embodiment.

However, in Comparative Example 1, the holes are not included in the auxiliary regions (B, C, D).

5 is a plan view showing a shielding plate for electrolytic plating according to Comparative Example 2. Fig.

Referring to FIG. 5, the shielding plate 400 for electrolytic plating according to the second comparative example includes a plate 410 constituting the body of the shielding plate.

The plate 410 includes a primary region A and a secondary region located along the periphery of the primary region A. [

In this case, the auxiliary region includes the edge region, the auxiliary region central region, and the middle region. Similarly to the first embodiment, the auxiliary region includes the hole 320 located in the main region A, , Holes are formed in the auxiliary region central regions D-1, D-2, D-3, and D-4.

However, in Comparative Example 1, it can be seen that holes are not included in the corner region and the middle region.

6 is a plan view showing a shielding plate for electrolytic plating according to Comparative Example 3. Fig.

Referring to FIG. 6, the shielding plate 500 for electrolytic plating according to the third comparative example includes a plate 510 constituting the body of the shielding plate.

The plate 510 includes a main area A and auxiliary areas B, C, D located along the periphery of the main area A.

In this case, the auxiliary region includes the edge region, the auxiliary region central region, and the middle region. Similarly to the first embodiment, the auxiliary region includes the hole 320 located in the main region A, The edge areas B-1, B-2, B-3 and B-4, the auxiliary area central areas D-1, D-2, D-3 and D- 1 to C-8.

That is, in Comparative Example 3, holes are formed in the corner regions of the main region and the auxiliary region, the center region of the auxiliary region, and the middle region.

Hereinafter, the plating effect according to the shielding plate for electrolytic plating according to the first, second and comparative examples 1 to 3 will be described.

7A is a photograph showing a specimen when plating is performed without using a shielding plate for plating, and FIG. 7B is a graph showing an actual value of thickness along a line on lines 1 and 2 in FIG. 7A.

7A and 7B, it can be seen that in the case of plating without using the shielding plate, the thickness deviation appears at both the measurement position 1 and the measurement position 2, 150) is thicker than the other regions.

That is, when there is no shielding plate, it means that the electric force lines are concentrated in the corner region in the plating process, and the current density in the edge region is increased, thereby plating the thickness thicker than the other regions.

Next, FIG. 8 is a simulation result in which the plating thickness is predicted when the shielding plate for electrolytic plating according to the first embodiment of the present invention is used.

As shown in FIG. 2A, when the holes are included only in the main region of the plate and the edge region of the auxiliary region, the thickness variation hardly occurs.

That is, it can be confirmed that the thickness in the central region of the main region is about 13.8 占 퐉, and the thickness in the corner region is about 13.6 to 14 占 퐉.

However, the thickness in the central region of the auxiliary region is about 12.4 占 퐉, which is slightly different from the thickness of the main region and the edge region, but it is within the allowable range.

Next, FIG. 9 is a simulation result in which the plating thickness is predicted when the shielding plate for electrolytic plating according to the second embodiment of the present invention is used.

As shown in FIG. 2B, when the holes are included only in the main region of the plate, the edge region of the auxiliary region, and the central region of the auxiliary region, no further thickness variation occurs.

That is, it can be confirmed that the thickness at the central portion of the main region is about 13.6 占 퐉 and the thickness at the corner region is about 13.6 占 퐉.

In addition, it can be seen that the thickness in the center region of the auxiliary region is about 12.8 占 퐉, and the difference in thickness between the main region and the corner region is smaller than that in Fig.

Next, Fig. 10 shows the simulation results in which the plating thickness is predicted when the shielding plate for electrolytic plating according to the comparative example 1 is used.

As shown in FIG. 4, it can be seen that when the main region of the plate contains holes and the auxiliary region does not include holes, the thickness variation is very large.

That is, it can be confirmed that the thickness at the central portion of the main region is about 14 mu m and the thickness at the corner region is about 12 mu m, which causes a very large deviation.

On the other hand, in the case where the shielding plate is not used, the thickness of the corner region is plated to be thicker than the thickness of the central region of the main region, as compared with the case of plating without using the shielding plate for plating described in Fig. It is confirmed that the thickness of the central portion of the main region is thicker than the thickness of the edge region.

Next, FIG. 11 shows the simulation results in which the plating thickness is predicted when the shielding plate for electrolytic plating according to the comparative example 2 is used.

As shown in FIG. 5, when a hole is included only in the main region of the plate and in the center region of the auxiliary region, and the hole region is not included in the edge region of the auxiliary region and the intermediate region of the auxiliary region, .

That is, it can be confirmed that the thickness at the central portion of the main region is about 14 mu m and the thickness at the corner region is about 12 mu m, which causes a very large deviation.

On the other hand, in the case where the shielding plate is not used, the thickness of the corner region is plated to be thicker than the thickness of the central region of the main region, as compared with the case of plating without using the shielding plate for plating described in Fig. It is confirmed that the thickness of the central portion of the main region is thicker than the thickness of the edge region, in contrast to the case where only the central region of the main region and the auxiliary region includes holes.

This is similar to the result shown in FIG. 10, but it can be seen that, as compared with FIG. 10, the thickness deviation between the central region of the main region and the central region of the auxiliary region decreases.

Next, FIG. 12 is a simulation result in which the plating thickness is predicted when the shielding plate for electrolytic plating according to the comparative example 3 is used.

As can be seen from FIG. 5, when a hole is included in all of the main region and the auxiliary region, that is, the hole is also included in the middle region of the auxiliary region, the thickness variation is the largest.

That is, it can be confirmed that the thickness at the central portion of the main region is about 11 mu m and the thickness at the corner region is about 18.5 mu m, which causes a very large deviation.

This tendency is similar when plating is performed without using the shielding plate for plating shown in Fig.

That is, in the case of plating without using the shielding plate for plating shown in FIG. 7, the thickness of the edge region was plated thicker than the thickness of the central region of the main region, It is confirmed that the thickness of the edge region is larger than the thickness of the central region of the main region even when holes are included in all of the auxiliary regions, and the plating tends to be plating between the both regions.

Based on the above results, it can be seen that uniformity of plating thickness can be ensured by including holes in the main region of the plate and the corner region of the auxiliary region.

In addition, it can be seen that it is preferable to include a hole in the central region of the auxiliary region, but it is preferable that the intermediate region located between the corner region and the center region of the auxiliary region does not include a hole Therefore, it can be confirmed that the intermediate region does not include holes, and must be a shielded region in which an electric line of force is shielded.

Therefore, in the present invention, it is possible to provide a shielding plate for electrolytic plating capable of uniformly plating the thickness of a metal film through the shape of the shielding plate as described above.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

Claims (7)

A shielding plate for plating comprising a first region and a plate including a second region located along the periphery of the first region,
Wherein the second region comprises:
An edge region including an apex of the plate;
A center region located between two adjacent corner regions; And
And an intermediate region located between the corner region and the center region of the auxiliary region,
A first hole located in the first region and a second hole located in the corner region. The method according to claim 1,
And a third hole located in the central region. The method according to claim 1,
Wherein the intermediate region is a shielding region not including a hole. The method according to claim 1,
The second region is defined as a region extending from each end of the plate to a predetermined length (l x )
Said predetermined length (l x) is, in any of the point and the longest line segment of line segment followed by another single point located at the end of the plate which is located at the end of the plate of less than 10%, based on the length 100% Shielding plate for plating. The method according to claim 1,
Wherein the corner region is defined as a region located in the second region and corresponding to an inside of a virtual circle corresponding to a radius r of a predetermined length about the vertex,
Wherein the radius r of the predetermined length has a length of 10% or less based on 100% of a length of a line segment between any one vertex and another vertex adjacent to the vertex. 6. The method of claim 5,
Wherein the center region includes a center of a line segment that is located in the second region and that includes one of the vertexes and one of the vertexes adjacent to the other vertex adjacent to the other vertex, % Shielding plate for plating. The method according to claim 6,
Wherein the intermediate region is defined as an area located in the second region and excluding the corner region and the center region.
KR1020150042402A 2015-03-26 2015-03-26 A Cover Plate for Electro Plating KR101734302B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115537902A (en) * 2022-10-19 2022-12-30 厦门海辰新材料科技有限公司 Titanium net assembly and electroplating equipment

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Publication number Priority date Publication date Assignee Title
JP2002054000A (en) * 2000-08-02 2002-02-19 Nitto Denko Corp Electroplating method for substrate
JP3924537B2 (en) 2001-03-28 2007-06-06 富士通株式会社 Electrolytic plating tank

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115537902A (en) * 2022-10-19 2022-12-30 厦门海辰新材料科技有限公司 Titanium net assembly and electroplating equipment
CN115537902B (en) * 2022-10-19 2023-12-22 厦门海辰新材料科技有限公司 Titanium net assembly and electroplating equipment

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