JP2017085173A5 - Spin processing device - Google Patents
Spin processing device Download PDFInfo
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- JP2017085173A5 JP2017085173A5 JP2017020286A JP2017020286A JP2017085173A5 JP 2017085173 A5 JP2017085173 A5 JP 2017085173A5 JP 2017020286 A JP2017020286 A JP 2017020286A JP 2017020286 A JP2017020286 A JP 2017020286A JP 2017085173 A5 JP2017085173 A5 JP 2017085173A5
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- substrate
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- processing apparatus
- rotating
- spin processing
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- 239000000758 substrate Substances 0.000 claims description 33
- 230000003028 elevating Effects 0.000 claims description 10
- 230000002093 peripheral Effects 0.000 claims description 6
- 239000007788 liquid Substances 0.000 description 1
Description
本発明の実施形態は、スピン処理装置に関する。 Embodiments described herein relate generally to a spin processing apparatus .
本発明が解決しようとする課題は、基板の均一な処理を実現することができるスピン処理装置を提供することである。 The problem to be solved by the present invention is to provide a spin processing apparatus that can realize uniform processing of a substrate.
本発明の実施形態に係るスピン処理装置は、
基板を回転させて処理するスピン処理装置であって、
回転可能に設けられた回転体と、
前記回転体の回転方向に所定間隔で昇降可能に設けられ、前記基板の周縁部を支持する少なくとも三つの基板支持部材と、
前記回転体の回転方向に所定間隔で偏心回転可能に設けられ、偏心回転により前記基板の外周面に各々当接して前記基板を把持する少なくとも三つのクランプピンと、
前記三つの基板支持部材を同期させて昇降させる昇降機構と、
前記三つのクランプピンを同期させて偏心回転させる回転機構と、
を備え、
前記昇降機構は、前記基板支持部材を、前記クランプピンによる前記基板のクランプ高さ位置よりも上方に設定される前記基板の移載高さ位置、前記クランプ高さ位置、前記クランプ高さ位置より下方の退避位置、に位置付けることを可能とすることを特徴とする。
A spin processing apparatus according to an embodiment of the present invention includes:
A spin processing apparatus for processing by rotating a substrate,
A rotating body provided rotatably,
At least three substrate support members provided so as to be movable up and down at predetermined intervals in the rotation direction of the rotating body, and supporting the peripheral edge of the substrate;
At least three clamp pins which are provided so as to be eccentrically rotatable at predetermined intervals in the rotation direction of the rotating body, and which respectively contact the outer peripheral surface of the substrate by eccentric rotation and grip the substrate;
An elevating mechanism for elevating and lowering the three substrate support members synchronously;
A rotating mechanism for synchronizing and rotating the three clamp pins in an eccentric manner;
Equipped with a,
The elevating mechanism is configured such that the substrate support member is set at a position higher than the clamp height position of the substrate by the clamp pins, the transfer height position of the substrate, the clamp height position, and the clamp height position. retracted position below, characterized that you allow to position the.
さらに、二組の基板クランプ機構を独立に、しかも、基板回転機構とも独立して駆動することができる。これにより、基板把持時には、二つの昇降リング47A、47Bを下降させて基板Wを把持したら、各昇降リング47A、47Bの高さ位置を確認すれば、基板Wの把持が正常に完了しているかを確認することができる。また、基板Wの回転中でも、各昇降リング47A、47Bの片方を上昇させれば、六箇所のクランプピン21の三本を開くことができる。特に、基板Wを把持する状態を維持しつつ交互に三本のクランプピン21を開放することによって、処理液におけるピン影響を低減することができる。なお、各シリンダがカムフォロアを有しているため、回転している昇降リング47A、47Bにカムフォロアが接触しても、駆動モータ3に回転負荷を与えることを抑止することができる。 Further, the two sets of substrate clamping mechanisms can be driven independently and independently of the substrate rotating mechanism. As a result, when holding the substrate, if the two lifting rings 47A and 47B are lowered and the substrate W is gripped, if the height positions of the lifting rings 47A and 47B are confirmed, is the gripping of the substrate W completed normally? Can be confirmed. Further, even when the substrate W is rotating, if one of the elevating rings 47A and 47B is raised, three of the six clamp pins 21 can be opened. In particular, the pin influence in the processing liquid can be reduced by alternately releasing the three clamp pins 21 while maintaining the state of gripping the substrate W. Since each cylinder has a cam follower, even if the cam follower comes into contact with the rotating elevating rings 47A and 47B, it is possible to prevent a rotational load from being applied to the drive motor 3.
Claims (5)
回転可能に設けられた回転体と、
前記回転体の回転方向に所定間隔で昇降可能に設けられ、前記基板の周縁部を支持する少なくとも三つの基板支持部材と、
前記回転体の回転方向に所定間隔で偏心回転可能に設けられ、偏心回転により前記基板の外周面に各々当接して前記基板を把持する少なくとも三つのクランプピンと、
前記三つの基板支持部材を同期させて昇降させる昇降機構と、
前記三つのクランプピンを同期させて偏心回転させる回転機構と、
を備え、
前記昇降機構は、前記基板支持部材を、前記クランプピンによる前記基板のクランプ高さ位置よりも上方に設定される前記基板の移載高さ位置、前記クランプ高さ位置、前記クランプ高さ位置より下方の退避位置、に位置付けることを可能とすることを特徴とするスピン処理装置。 A spin processing apparatus for processing by rotating a substrate,
A rotating body provided rotatably,
At least three substrate support members provided so as to be movable up and down at predetermined intervals in the rotation direction of the rotating body, and supporting the peripheral edge of the substrate;
At least three clamp pins which are provided so as to be eccentrically rotatable at predetermined intervals in the rotation direction of the rotating body, and which respectively contact the outer peripheral surface of the substrate by eccentric rotation and grip the substrate;
An elevating mechanism for elevating and lowering the three substrate support members synchronously;
A rotating mechanism for synchronizing and rotating the three clamp pins in an eccentric manner;
With
The elevating mechanism is configured such that the substrate support member is set at a position higher than the clamp height position of the substrate by the clamp pins, the transfer height position of the substrate, the clamp height position, and the clamp height position. A spin processing device, characterized in that it can be positioned at a lower retreat position .
前記三つの基板支持部材を支持する支持リングと、A support ring for supporting the three substrate support members;
前記支持リングを昇降させる昇降部と、An elevating part for elevating the support ring;
を具備していることを特徴とする請求項1に記載のスピン処理装置。The spin processing apparatus according to claim 1, comprising:
前記クランプピンは三つを一組として六つ設けられており、Six clamp pins are provided as a set of three,
前記回転機構は前記六つのクランプピンを組ごとに同期させて回転させ、The rotating mechanism rotates the six clamp pins in synchronism with each pair,
前記昇降機構は前記六つの基板支持部材を同期させて昇降させることを特徴とする請求項1に記載のスピン処理装置。The spin processing apparatus according to claim 1, wherein the lifting mechanism lifts and lowers the six substrate support members in synchronization.
前記クランプピンは前記偏心回転部材に二本設けられており、それら二本のクランプピンは前記基板を把持するときにそれらの間隔が前記基板の外周面の切り欠き部の幅以上で前記基板の外周面に接触するように設けられていることを特徴とする請求項1乃至4のいずれかに記載のスピン処理装置。Two clamp pins are provided on the eccentric rotating member, and when the two clamp pins hold the substrate, the distance between them is equal to or greater than the width of the notch on the outer peripheral surface of the substrate. The spin processing apparatus according to claim 1, wherein the spin processing apparatus is provided so as to contact an outer peripheral surface.
Priority Applications (1)
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JP2017020286A JP6386113B2 (en) | 2017-02-07 | 2017-02-07 | Spin processing equipment |
Applications Claiming Priority (1)
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JP2017020286A JP6386113B2 (en) | 2017-02-07 | 2017-02-07 | Spin processing equipment |
Related Parent Applications (1)
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JP2011264950A Division JP6091060B2 (en) | 2011-12-02 | 2011-12-02 | Spin processing device |
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JP2017085173A JP2017085173A (en) | 2017-05-18 |
JP2017085173A5 true JP2017085173A5 (en) | 2018-01-18 |
JP6386113B2 JP6386113B2 (en) | 2018-09-05 |
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KR20210128064A (en) * | 2020-04-16 | 2021-10-26 | 주식회사 제우스 | Energizing device for substrate processing |
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JPH10135312A (en) * | 1996-10-28 | 1998-05-22 | Dainippon Screen Mfg Co Ltd | Substrate rotation holding apparatus and rotary substrate treating apparatus |
JP3395696B2 (en) * | 1999-03-15 | 2003-04-14 | 日本電気株式会社 | Wafer processing apparatus and wafer processing method |
JP2001326267A (en) * | 2000-05-18 | 2001-11-22 | Sony Corp | Semiconductor processing apparatus |
JP4152087B2 (en) * | 2001-03-23 | 2008-09-17 | 大日本スクリーン製造株式会社 | Substrate cooling apparatus and substrate cooling method |
JP4347766B2 (en) * | 2004-07-23 | 2009-10-21 | 大日本スクリーン製造株式会社 | Substrate processing apparatus and substrate processing method |
JP2006253210A (en) * | 2005-03-08 | 2006-09-21 | Dainippon Screen Mfg Co Ltd | Substrate holding device, substrate processing apparatus and method of processing substrate |
JP2010045153A (en) * | 2008-08-12 | 2010-02-25 | Fujitsu Microelectronics Ltd | Semiconductor manufacturing device |
JP4971294B2 (en) * | 2008-12-02 | 2012-07-11 | 三菱電機株式会社 | Substrate processing apparatus, substrate processing method, and display device manufacturing method |
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