JP2013118279A5 - Spin processing device - Google Patents

Spin processing device Download PDF

Info

Publication number
JP2013118279A5
JP2013118279A5 JP2011264950A JP2011264950A JP2013118279A5 JP 2013118279 A5 JP2013118279 A5 JP 2013118279A5 JP 2011264950 A JP2011264950 A JP 2011264950A JP 2011264950 A JP2011264950 A JP 2011264950A JP 2013118279 A5 JP2013118279 A5 JP 2013118279A5
Authority
JP
Japan
Prior art keywords
substrate
processing apparatus
rotating
spin processing
elevating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011264950A
Other languages
Japanese (ja)
Other versions
JP6091060B2 (en
JP2013118279A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2011264950A priority Critical patent/JP6091060B2/en
Priority claimed from JP2011264950A external-priority patent/JP6091060B2/en
Priority to TW101144478A priority patent/TWI476053B/en
Priority to KR1020120137125A priority patent/KR101344143B1/en
Publication of JP2013118279A publication Critical patent/JP2013118279A/en
Publication of JP2013118279A5 publication Critical patent/JP2013118279A5/en
Application granted granted Critical
Publication of JP6091060B2 publication Critical patent/JP6091060B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Description

本発明の実施形態は、スピン処理装置関する。 Embodiments of the present invention relates to a spin processing apparatus.

本発明が解決しようとする課題は、基板の均一な処理を実現することができるスピン処
理装置提供することである。
The problem to be solved by the present invention is to provide a spin processing apparatus that can realize uniform processing of a substrate.

本発明の実施形態に係るスピン処理装置は、基板を回転させて処理するスピン処理装置
であって、回転可能に設けられた回転体と、回転体の回転方向に所定間隔で昇降可能に設
けられ、基板の周縁部を支持する少なくとも三つの基板支持部材と、回転体の回転方向に
所定間隔で偏心回転可能に設けられ、偏心回転により基板の外周面に各々当接して基板を
把持する少なくとも三つのクランプピンと、三つの基板支持部材を同期させて昇降させる
昇降機構と、三つのクランプピンを同期させて偏心回転させる回転機構とを備え、前記回転機構は、前記回転体の回転軸に直交する方向に移動可能に設けられ、前記三つのクランプピンを偏心回転させるための複数のスライドアームと、前記回転体の回転軸を中心として回転可能に設けられ、前記複数のスライドアームを同期させて前記回転体の回転軸に直交する方向に移動させる同期移動リングと、を具備している。
A spin processing apparatus according to an embodiment of the present invention is a spin processing apparatus that rotates and processes a substrate, and is provided so as to be capable of rotating up and down at predetermined intervals in the rotation direction of the rotating body. And at least three substrate support members for supporting the peripheral edge of the substrate and at least three substrate members that are eccentrically rotatable at predetermined intervals in the rotation direction of the rotating body and that respectively contact the outer peripheral surface of the substrate by eccentric rotation. Two clamp pins, a lifting mechanism that moves the three substrate support members in synchronization, and a rotation mechanism that rotates the three clamp pins in synchronization, and the rotation mechanism is orthogonal to the rotation axis of the rotating body. A plurality of slide arms for eccentrically rotating the three clamp pins, a rotation arm about the rotation axis of the rotating body, It is provided with a synchronous moving ring that moves in a direction perpendicular to the rotation axis of the rotating body of the slide arm in synchronization.

Claims (9)

基板を回転させて処理するスピン処理装置であって、
回転可能に設けられた回転体と、
前記回転体の回転方向に所定間隔で昇降可能に設けられ、前記基板の周縁部を支持する少なくとも三つの基板支持部材と、
前記回転体の回転方向に所定間隔で偏心回転可能に設けられ、偏心回転により前記基板の外周面に各々当接して前記基板を把持する少なくとも三つのクランプピンと、
前記三つの基板支持部材を同期させて昇降させる昇降機構と、
前記三つのクランプピンを同期させて偏心回転させる回転機構と、
を備え
前記回転機構は、
前記回転体の回転軸に直交する方向に移動可能に設けられ、前記三つのクランプピンを偏心回転させるための複数のスライドアームと、
前記回転体の回転軸を中心として回転可能に設けられ、前記複数のスライドアームを同期させて前記回転体の回転軸に直交する方向に移動させる同期移動リングと、
を具備していることを特徴とするスピン処理装置。
A spin processing apparatus for processing by rotating a substrate,
A rotating body provided rotatably,
At least three substrate support members provided so as to be movable up and down at predetermined intervals in the rotation direction of the rotating body, and supporting the peripheral edge of the substrate;
At least three clamp pins which are provided so as to be eccentrically rotatable at predetermined intervals in the rotation direction of the rotating body, and which respectively contact the outer peripheral surface of the substrate by eccentric rotation and grip the substrate;
An elevating mechanism for elevating and lowering the three substrate support members synchronously;
A rotating mechanism for synchronizing and rotating the three clamp pins in an eccentric manner;
Equipped with a,
The rotation mechanism is
A plurality of slide arms provided so as to be movable in a direction perpendicular to the rotation axis of the rotating body, and for eccentrically rotating the three clamp pins;
A synchronous moving ring provided rotatably about the rotation axis of the rotating body, and moving the plurality of slide arms in a direction perpendicular to the rotation axis of the rotating body;
Spin processing apparatus characterized that you have to include a.
前記昇降機構は、
前記三つの基板支持部材を支持する支持リングと、
前記支持リングを昇降させる昇降部と、
を具備していることを特徴とする請求項1記載のスピン処理装置。
The lifting mechanism is
A support ring for supporting the three substrate support members;
An elevating part for elevating the support ring;
The spin processing apparatus according to claim 1, further comprising:
前記複数のスライドアームは各々同期移動ピンを有しており、
前記同期移動リングは、前記回転体の回転軸を中心とした回転により前記同期移動ピンに接触する複数のピン接触部を有していることを特徴とする請求項1記載のスピン処理装置。
Each of the plurality of slide arms has a synchronous movement pin;
The spin processing device according to claim 1, wherein the synchronous movement ring includes a plurality of pin contact portions that come into contact with the synchronous movement pin by rotation about a rotation axis of the rotating body.
前記同期移動リングは、前記回転体の回転軸の軸方向に延びるスパイラル状の溝が形成された円筒部を有しており、
前記回転機構は、
前記溝に挿入されてその溝に沿って移動可能な昇降ピンと、
前記回転体の回転軸を中心としてその回転軸の軸方向に移動可能に設けられ、前記昇降ピンに連結された昇降リングと、
前記昇降リングを昇降させる昇降部と、
を具備していることを特徴とする請求項1記載のスピン処理装置。
The synchronous movement ring has a cylindrical portion in which a spiral groove extending in the axial direction of the rotating shaft of the rotating body is formed,
The rotation mechanism is
Lift pins inserted into the groove and movable along the groove;
An elevating ring provided to be movable in the axial direction of the rotating shaft around the rotating shaft of the rotating body, and connected to the elevating pin;
An elevating part for elevating the elevating ring;
The spin processing apparatus according to claim 1, further comprising:
前記昇降リングの高さを検出するセンサと、
前記センサにより検出された前記昇降リングの高さに応じて前記複数のクランプピンによる前記基板の把持が正常であるか否かを判断する判断部と、
を備えることを特徴とする請求項4記載のスピン処理装置。
A sensor for detecting the height of the lifting ring;
A determination unit for determining whether or not the holding of the substrate by the plurality of clamp pins is normal according to the height of the lifting ring detected by the sensor;
The spin processing apparatus according to claim 4, further comprising:
偏心回転可能に設けられ、前記クランプピンを保持する偏心回転部材を備え、
前記クランプピンは前記偏心回転部材に二本設けられており、それら二本のクランプピンは前記基板を把持するときに前記二本のクランプピンの間隔が前記基板の外周面の切り欠き部の幅以上で前記基板の外周面に接触するように設けられていることを特徴とする請求項1に記載のスピン処理装置。
An eccentric rotation member that is provided to be eccentrically rotatable and holds the clamp pin;
Two of the clamp pins are provided on the eccentric rotating member, and when the two clamp pins hold the substrate, the distance between the two clamp pins is the width of the notch on the outer peripheral surface of the substrate. The spin processing apparatus according to claim 1, wherein the spin processing apparatus is provided so as to be in contact with the outer peripheral surface of the substrate.
前記基板支持部材は六つ設けられており、
前記クランプピンは三つを一組として六つ設けられており、
前記回転機構は前記六つのクランプピンを組ごとに同期させて回転させ、
前記昇降機構は前記六つの基板支持部材を同期させて昇降させることを特徴とする請求項1に記載のスピン処理装置。
Six substrate support members are provided,
Six clamp pins are provided as a set of three,
The rotating mechanism rotates the six clamp pins in synchronism with each pair,
The spin processing apparatus according to claim 1, wherein the lifting mechanism lifts and lowers the six substrate support members in synchronization.
前記六つのクランプピンは、前記基板を処理する処理中に組ごとに交互に前記基板を把持することを特徴とする請求項7記載のスピン処理装置。   8. The spin processing apparatus according to claim 7, wherein the six clamp pins grip the substrate alternately for each set during processing of processing the substrate. 前記基板は矩形板状の基板であることを特徴とする請求項1に記載のスピン処理装置。   The spin processing apparatus according to claim 1, wherein the substrate is a rectangular plate-shaped substrate.
JP2011264950A 2011-12-02 2011-12-02 Spin processing device Active JP6091060B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2011264950A JP6091060B2 (en) 2011-12-02 2011-12-02 Spin processing device
TW101144478A TWI476053B (en) 2011-12-02 2012-11-28 Rotation processing device
KR1020120137125A KR101344143B1 (en) 2011-12-02 2012-11-29 Spin processer and spin processing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011264950A JP6091060B2 (en) 2011-12-02 2011-12-02 Spin processing device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2017020286A Division JP6386113B2 (en) 2017-02-07 2017-02-07 Spin processing equipment

Publications (3)

Publication Number Publication Date
JP2013118279A JP2013118279A (en) 2013-06-13
JP2013118279A5 true JP2013118279A5 (en) 2015-02-26
JP6091060B2 JP6091060B2 (en) 2017-03-08

Family

ID=48712641

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011264950A Active JP6091060B2 (en) 2011-12-02 2011-12-02 Spin processing device

Country Status (3)

Country Link
JP (1) JP6091060B2 (en)
KR (1) KR101344143B1 (en)
TW (1) TWI476053B (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6068975B2 (en) 2012-12-27 2017-01-25 株式会社ディスコ Cleaning device
KR20160071107A (en) 2014-12-11 2016-06-21 에이플러스미디어(주) Method for operating school application capable of communicating in bidirectional
JP6734666B2 (en) * 2015-03-30 2020-08-05 芝浦メカトロニクス株式会社 Spin processing device
KR101841342B1 (en) * 2015-03-30 2018-03-22 시바우라 메카트로닉스 가부시끼가이샤 Spin processor
USD937292S1 (en) 2017-04-19 2021-11-30 Samsung Electronics Co., Ltd. Display screen or portion thereof with graphical user interface
CN109571782A (en) * 2018-10-26 2019-04-05 广州市昊志机电股份有限公司 A kind of rotatable quick-clamping module of high-precision
KR102649391B1 (en) * 2019-05-20 2024-03-22 주식회사 제우스 Substrate processing device
US20210054497A1 (en) * 2019-08-19 2021-02-25 Oem Group, Llc Systems and methods for a lift and rotate wafer handling process
CN111468983B (en) * 2020-06-22 2020-10-02 山东银河动力股份有限公司 Lubricating oil recovery device for machine tool parts
JP7471170B2 (en) 2020-08-03 2024-04-19 東京エレクトロン株式会社 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
CN111964363B (en) * 2020-08-10 2022-12-13 江苏星辰星汽车附件有限公司 Vehicle-mounted umbrella storage device
CN113797396B (en) * 2021-10-08 2023-03-03 温州医科大学附属口腔医院 Preparation method of porous zinc biological composite coating for degradable bone scaffold
CN114289404B (en) * 2022-01-07 2022-12-27 深圳市益家益电子科技有限公司 High-precision ultrasonic cleaning device

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5566466A (en) * 1994-07-01 1996-10-22 Ontrak Systems, Inc. Spindle assembly with improved wafer holder
US6003185A (en) * 1994-07-15 1999-12-21 Ontrak Systems, Inc. Hesitation free roller
JPH09107023A (en) * 1995-10-13 1997-04-22 Toshiba Microelectron Corp Rotary holder of substance to be treated
JPH09232410A (en) * 1996-02-26 1997-09-05 Dainippon Screen Mfg Co Ltd Substrate rotating/holding device and rotary substrate processing device
EP0976460B1 (en) * 1996-11-15 2007-01-10 Shibaura Mechatronics Corporation Spinning device and spinning method
JP3822996B2 (en) * 1999-03-04 2006-09-20 エム・セテック株式会社 Substrate holding structure for semiconductor manufacturing equipment
JP4681148B2 (en) 2001-04-27 2011-05-11 芝浦メカトロニクス株式会社 Spin processing device
JP4532014B2 (en) * 2001-04-27 2010-08-25 芝浦メカトロニクス株式会社 Spin processing equipment
JP3762275B2 (en) * 2001-09-20 2006-04-05 大日本スクリーン製造株式会社 Substrate processing apparatus and substrate processing method
JP2004079637A (en) * 2002-08-12 2004-03-11 Toshiba Corp Holding device of plate-like member, method for holding and spin treating apparatus
JP4080319B2 (en) * 2002-12-18 2008-04-23 大日本スクリーン製造株式会社 Substrate processing apparatus and substrate processing method
JP2005011934A (en) * 2003-06-18 2005-01-13 Toshiba Corp Semiconductor substrate cleaning device
JP4467367B2 (en) * 2004-06-22 2010-05-26 大日本スクリーン製造株式会社 Substrate reversing device, substrate transporting device, substrate processing device, substrate reversing method, substrate transporting method, and substrate processing method

Similar Documents

Publication Publication Date Title
JP2013118279A5 (en) Spin processing device
KR101587359B1 (en) Spin processor
JP6091060B2 (en) Spin processing device
JP5495826B2 (en) Tire sorting device
JP2009295751A5 (en)
EP2421034A3 (en) Substrate carrying mechanism and substrate carrying method
KR101841342B1 (en) Spin processor
CN203522463U (en) Coiling device
JP6734666B2 (en) Spin processing device
EP2700474A3 (en) Polishing apparatus and polishing method
JP2015530332A5 (en)
JP2011092747A5 (en)
JP2012506789A5 (en)
JP2017118897A5 (en)
CN203589960U (en) Coiling apparatus
JP2013008068A5 (en)
CN101049648B (en) Tin attachable fixture
JP2012182458A5 (en)
JP2017085173A5 (en) Spin processing device
JP2008054641A (en) Method and apparatus for extending food dough
CN211292414U (en) Hardness detector
RU2632045C2 (en) Device for products polishing
RU2013116991A (en) DIGITAL CONTROLLED GRINDING MACHINE, IN PARTICULAR, FOR DIRECT-SIDE GLASS SHEETS
JP2016144932A5 (en)
JP2013011445A5 (en)