JP6067392B2 - Substrate holding device and substrate processing method - Google Patents

Description

  The present invention is used in a substrate processing apparatus for processing a substrate by supplying a processing liquid to the surface of the substrate while rotating the substrate, and holds the substrate rotatably in a plane parallel to the main surface. The present invention relates to a holding device and a substrate processing method using the substrate holding device.

  In a substrate processing apparatus that processes a substrate by rotating a substantially circular substrate such as a semiconductor wafer while supplying the processing liquid to the main surface, the substrate that rotates the substrate that holds the main surface in a horizontal direction A holding device is used. The substrate holding device includes a plurality of chucks that hold a substrate by contacting an edge of the substrate. The plurality of chucks are movable between a holding position for holding the substrate and a delivery position for delivering the substrate to and from a transfer arm or the like.

  In such a substrate processing apparatus, a processing liquid is supplied to the semiconductor wafer while the semiconductor wafer is held by a plurality of chucks. At this time, at the position where a plurality of chucks are always in contact with the semiconductor wafer during the processing of the semiconductor wafer, the processing liquid stays in the contact portion between the chuck and the semiconductor wafer without being sufficiently circulated, resulting in processing unevenness. There was a case.

  In Patent Document 1, by moving a magnet up and down, among three chucking pins, three chucking pins are alternately moved to a position for chucking the substrate, so that the processing liquid remains on the surface of the substrate. A spin head that can prevent the phenomenon and uniformly process the substrate is disclosed. Further, Patent Document 2 discloses a wafer rotation holding device in which a wafer is always held by any one of the holding claws while a plurality of holding claws are repeatedly moved to a holding position and a release position during wafer processing. Has been.

JP 2008-135750 A Japanese Patent Laid-Open No. 9-107023

  Patent Documents 1 and 2 describe a configuration in which a part of a holding member for holding a substrate is moved to a holding position, and the remaining part is moved to a release position. However, since the holding member is selectively moved, there is a problem that the configuration of the moving mechanism becomes complicated.

  The present invention has been made to solve the above-described problems. During processing with a processing liquid, the chuck is moved between the holding position and the guide position of the substrate to prevent the processing liquid from staying. An object of the present invention is to provide a substrate holding device and a substrate processing method capable of uniformly processing the substrate.

  The invention according to claim 1 is used in a substrate processing apparatus for processing the substrate by supplying a processing liquid to the main surface of the substrate while rotating the substrate, and in a plane parallel to the main surface of the substrate. A substrate holding device for rotatably holding the substrate, wherein the substrate is disposed opposite to the lower surface of the substrate so as to be able to support the lower surface near the edge of the substrate in a state where the substrate is held at a holding position for holding the substrate. A support portion extending toward the rotation center of the substrate and an upper surface in the vicinity of an edge of the substrate, and extending toward the rotation center of the substrate, the tip of the support portion extending from the tip of the support portion. A plurality of chucks each provided with a guide portion that is spaced apart from the center of rotation; the holding position for holding the plurality of chucks; and a tip of the guide portion from an edge of the substrate. Outside And a movement for moving between a delivery position where the front end of the support portion is disposed inside the edge of the substrate and an intermediate position where the front end of the guide portion is disposed inside the edge of the substrate. And a controller that controls the moving mechanism to reciprocate the plurality of chucks between the holding position and the intermediate position during processing of the substrate.

  The invention according to claim 2 is the invention according to claim 1, further comprising a rotating chamber that rotates by driving of a motor and a fixed chamber, and the moving mechanism includes a magnet, and is moved up and down in the rotating chamber. A plurality of chucks and a plurality of chucks, and a plurality of chucks, and a plurality of chucks and a plurality of chucks. An opening / closing mechanism disposed in the rotating chamber that moves synchronously between the delivery position and the intermediate position, and a magnet, and a first disposed in the fixed chamber so as to face the first elevating plate. 2 elevating plates, and an elevating mechanism disposed in the fixed chamber for elevating the second elevating plate.

  A third aspect of the present invention includes the spring according to the second aspect, wherein the plurality of chucks bias the first elevating plate in a direction toward the holding position.

  According to a fourth aspect of the present invention, in the invention according to the second or third aspect, the plurality of chucks rotate about a rotation axis that faces in a vertical direction, so that the holding position and the delivery position are Move between.

  According to a fifth aspect of the present invention, in a state where the substrate is held at a holding position for holding the substrate, the substrate is disposed so as to be opposed to the lower surface of the substrate so as to support the lower surface near the edge of the substrate, and the rotation center of the substrate A support portion extending toward the substrate and an upper surface in the vicinity of the edge of the substrate, and extending toward the rotation center of the substrate, the tip of which is arranged away from the rotation center of the substrate from the tip of the support portion In the state where the substrate is held by a plurality of chucks each including a guide portion, a processing liquid is applied to the substrate while rotating the substrate together with the plurality of chucks in a plane parallel to the main surface of the substrate. In the substrate processing method of processing the substrate by supplying the plurality of chucks, the plurality of chucks are arranged such that the leading ends of the guide portions are disposed outside the edge of the substrate, and the leading ends of the support portions are the bases. In a state where the substrate is loaded at a delivery position disposed on the inner side of the edge of the substrate, and in a state where the plurality of chucks are disposed at a holding position for holding the substrate, A rotation start step for starting rotation, a treatment liquid supply step for supplying a treatment liquid to the main surface of the substrate, the plurality of chucks, the holding position, and the tip of the guide portion on the inner side of the edge of the substrate. A continuous processing step of reciprocating between the intermediate position and the intermediate position disposed in the substrate, a rotation stopping step of stopping the rotation of the substrate, and an unloading step of unloading the substrate with the plurality of chucks disposed at the delivery position. It is characterized by comprising.

  According to the first and fifth aspects of the present invention, when the substrate is treated with the treatment liquid, the retention of the treatment liquid is prevented by moving the chuck between the holding position and the guide position of the substrate. Thus, the substrate can be processed uniformly.

  According to the second aspect of the present invention, since the plurality of chucks can be moved synchronously by the action of the first lifting plate, the substrate can be simultaneously held by the plurality of chucks, and the substrate is held eccentrically. It is possible to prevent this. In addition, the moving mechanism can be isolated from the atmosphere of the processing liquid by the action of the rotating chamber and the fixed chamber.

  According to the third aspect of the present invention, the substrate can be securely held by the chuck by the action of the spring.

  According to the fourth aspect of the present invention, the chuck can be easily moved between the holding position and the delivery position.

1 is a schematic side view showing a substrate holding apparatus according to a first embodiment of the present invention together with a processing liquid supply nozzle. 4 is a perspective view showing an opening / closing mechanism for moving the chuck 11 together with the chuck 11 and a first lifting plate 31. FIG. It is the perspective view which removed the rotation chamber 91 and the fixed chamber 92, and looked at the principal part of the board | substrate holding apparatus which concerns on 1st Embodiment of this invention. FIG. 6 is an explanatory diagram showing an arrangement of a semiconductor wafer 100 and a chuck 11. It is a block diagram which shows the main control systems of the board | substrate holding | maintenance apparatus concerning this invention. It is a flowchart which shows the substrate processing method using the substrate holding | maintenance apparatus which concerns on this invention. It is the perspective view which removed the rotation chamber 91 and the fixed chamber 92, and showed the principal part of the board | substrate holding apparatus which concerns on 2nd Embodiment of this invention. It is a top view of the 2nd raising / lowering board 37 which concerns on 2nd Embodiment. FIG. 10 is a perspective view of a second opening / closing mechanism for moving the second chuck 12.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic side view showing a substrate holding apparatus according to a first embodiment of the present invention together with a processing liquid supply nozzle 10. FIG. 2 is a perspective view showing an opening / closing mechanism for rotating the chuck 11 together with the chuck 11 and the first lifting plate 31. FIG. 3 is a perspective view of the main part of the substrate holding apparatus according to the first embodiment of the present invention, with the rotating chamber 91 and the fixed chamber 92 removed.

  This substrate holding device is used in a substrate processing apparatus for supplying a processing liquid from a processing liquid supply nozzle 10 of the semiconductor wafer 100 while rotating the semiconductor wafer 100 as a substrate and processing the semiconductor wafer 100. Is rotatably held in a plane parallel to the main surface. The substrate holding apparatus includes a rotating chamber 91 that rotates by driving a motor 61 and a fixed chamber 92.

  The rotating chamber 91 is provided with six chucks 11 for holding the semiconductor wafer 100 by contacting the edge of the semiconductor wafer 100 having a substantially circular shape except for the orientation flat portion. The chuck 11 is configured to move between a holding position, a delivery position, and an intermediate position, which will be described later, by rotating around a rotating shaft 21 that is disposed in the rotating chamber 91 and faces the vertical direction. ing.

  As shown in FIG. 1, a first elevating plate 31 is disposed in the rotary chamber 91 in a state where it can be raised and lowered by an elevating mechanism (not shown). The first elevating plate 31 is urged downward by the action of the plurality of springs 35. A ring-shaped magnet 33 is attached to the lower surface of the first lifting plate 31.

  On the other hand, in the fixed chamber 92, the second elevating plate 32 is arranged in a state of being opposed to the first elevating plate 31. The second elevating plate 32 is connected to a slider 63 that is guided up and down by a guide member 64 via a support member 65. The second elevating plate 32 is connected to the cylinder rod of the air cylinder 62 disposed in the fixed chamber 92. For this reason, the second elevating plate 32 moves up and down by driving the air cylinder 62. On the upper surface of the second elevating plate 32, a ring-shaped magnet 34 having a characteristic of repelling the ring-shaped magnet 33 attached to the lower surface of the first elevating plate 31 is disposed.

  For this reason, when the 2nd raising / lowering board 32 in the fixed chamber 92 raises by the drive of the air cylinder 62, the 1st raising / lowering board 31 in the rotation chamber 91 also raises by the effect | action of the magnets 33 and 34 which repel each other. . On the other hand, when the second elevating plate 32 in the fixed chamber 92 is lowered by driving the air cylinder 62, the first elevating plate 31 in the rotating chamber 91 is caused by the weight of the first elevating plate 31 itself and the action of the spring 35. Also descends.

  Note that the magnet 33 and the magnet 34 do not necessarily have a ring shape. A plurality of magnets may be arranged on the first lifting plate 31 and the second lifting plate 32 as long as the above-described lifting operation of the first lifting plate 31 can be performed.

  As shown in FIG. 1, a stopper 67 that is movable by driving an air cylinder 66 is disposed on the side of the lifting region of the second lifting plate 32. The stopper 67 can move between a retracted position indicated by a solid line in FIG. 1 and a contact position with the second elevating plate 32 indicated by an imaginary line in FIG. 1 by driving the air cylinder 66. Therefore, the second elevating plate 32 that is moved up and down by driving the air cylinder 62 can move up and down between the raised position shown in FIG. 1, the intermediate position that contacts the stopper 67, and the lowered position below the intermediate position. ing. As the second elevating plate 32 moves up and down, the first elevating plate 31 also reciprocates between the raised position, the intermediate position, and the lowered position.

  As shown in FIG. 2, the first elevating plate 31 is provided with a cam plate 24 via a connecting member 25. The cam plate 24 is formed with a hole 23 that faces in an oblique direction. The tip of a shaft 22 attached to the rotary shaft 21 is engaged with the hole 23. For this reason, when the 1st raising / lowering board 31 raises / lowers, the rotating shaft 21 rotates centering on the shaft center by the effect | action of the hole 23 and the axis | shaft 22 which face the diagonal direction. Along with the rotation of the rotating shaft 21, the chuck 11 is also rotated about the axis of the rotating shaft 21. The rotation angle position of the chuck 11 is determined by the height position of the first elevating plate 31.

  An opening / closing mechanism for rotating the chuck 11 provided with the cam plate 24 and the shaft 22 is provided for each of the six chucks 11. In FIG. 3, only the connecting member 25 is shown, and the cam plate 24 and the shaft 22 are not shown.

  FIG. 4 is an explanatory view showing the arrangement of the semiconductor wafer 100 and the chuck 11. 4A shows a state where the chuck 11 is arranged at the delivery position, FIG. 4B shows a state where the chuck 11 is arranged at the holding position, and FIG. 4C shows a state where the chuck 11 is at the intermediate position. It shows the state of being arranged.

  As shown in FIG. 4, the chuck 11 includes a support portion 13 formed of a tapered surface disposed to face the lower surface of the semiconductor wafer 100 so as to support the lower surface near the edge of the semiconductor wafer 100, and the vicinity of the edge of the semiconductor wafer 100. The guide part 14 which consists of a taper surface opposingly arrange | positioned is provided. The distance from the rotating shaft 21 to the tip of the support portion 13 is larger than the distance from the rotating shaft 21 to the tip of the guide portion 14. That is, when the chuck 11 is disposed at a holding position for holding the semiconductor wafer 100, the tip of the guide portion 14 extending toward the rotation center of the semiconductor wafer 100 faces the rotation center of the semiconductor wafer 100. It is arranged at a position separated from the center of rotation of the semiconductor wafer 100 from the tip of the support portion 13 extending in the direction.

  As the first elevating plate 31 moves to the above-described raised position, the chuck 11 is rotated to an angular position rotated by a predetermined angle (15 to 45 degrees) from the state shown in FIG. At this time, due to the difference between the distance from the rotating shaft 21 to the tip of the support portion 13 and the distance from the rotating shaft 21 to the tip of the guide portion 14, as shown in FIG. The tip is disposed inside the edge of the semiconductor wafer 100, and the tip of the guide portion 14 in the chuck 11 is disposed outside the edge of the semiconductor wafer 100. In this state, the semiconductor wafer 100 is supported by the support portion 13 in the chuck 11 but is movable upward. In the state where the chuck 11 is disposed at the delivery position shown in FIG. 4A, the semiconductor wafer 100 supported by the chuck 11 can be delivered between the chuck 11 and a transfer arm or the like (not shown). Become.

  When the first elevating plate 31 moves to the above-described lowered position, the chuck 11 is rotated to an angular position slightly rotated (5 to 10 degrees) from the state shown in FIG. At this time, as shown in FIG. 4B, the support portion 13 and the guide portion 14 in the chuck 11 are arranged at positions where they abut against the edge of the semiconductor wafer 100 (that is, the rotation is stopped). In this state, the semiconductor wafer 100 comes into contact with the support portion 13 and the guide portion 14 in the chuck 11. In the state where the chuck 11 is disposed at the holding position shown in FIG. 4B, the semiconductor wafer 100 is securely held by the chuck 11.

  When the first elevating plate 31 moves to the above-described intermediate position, the chuck 11 is disposed at an angular position between the delivery position and the holding position shown in FIG. At this time, as shown in FIG. 4C, the tip of the support portion 13 in the chuck 11 is disposed inside the edge of the semiconductor wafer 100, and the tip of the guide portion 14 in the chuck 11 is also from the edge of the semiconductor wafer 100. Arranged inside. In the state where the chuck 11 is disposed at the intermediate position shown in FIG. 4C, the semiconductor wafer 100 can move between a position where the chuck 11 abuts on the support portion 13 and a position where the chuck 11 abuts on the guide portion 14.

  FIG. 5 is a block diagram showing a main control system of the substrate holding apparatus according to the present invention.

  The substrate holding apparatus includes a control unit 80 having a ROM 81 that stores an operation program necessary for controlling the apparatus, a RAM 82 that temporarily stores data and the like during control, and a CPU 83 that executes a logical operation. The control unit 80 includes an air cylinder 62 for moving up and down the second lift plate 32, an air cylinder 66 for regulating the lift position of the second lift plate 32, and a motor for rotating the rotation chamber 91. 61. The control unit 80 controls the opening / closing operation of the chuck 11 and the rotating operation of the rotating chamber 91. Further, the processing liquid supply operation from the processing liquid supply nozzle 10 and other processing operations are also controlled by the control unit 80.

  Next, a substrate processing method when processing the semiconductor wafer 100 with the processing liquid using the substrate holding apparatus according to the present invention will be described. FIG. 6 is a flowchart showing a substrate processing method using the substrate holding apparatus according to the present invention.

  When processing the semiconductor wafer 100, the semiconductor wafer 100 is first carried in (step S1). Specifically, the control unit 80 drives the air cylinder 62 to move the second lifting plate 32 to the raised position. At this time, the stopper 67 is disposed at the retracted position indicated by the solid line in FIG. By moving the second lifting plate 32 to the raised position, the first lifting plate 31 in the rotating chamber 91 is also moved to the raised position by the action of the magnets 33 and 34 repelling each other. In this state, the chuck 11 rotates around the rotation shaft 21 and is disposed at the delivery position shown in FIG. Then, the semiconductor wafer 100 is transferred onto the six chucks 11 by a transfer arm (not shown). As a result, as shown in FIG. 4A, the semiconductor wafer 100 is supported by the six chucks 11 in a state where the edge thereof is in contact with the support portion 13 in the chuck 11.

  Next, the semiconductor wafer 100 is held by the six chucks 11 (step S2). Specifically, the controller 80 drives the air cylinder 62 to move the second elevating plate 32 in the fixed chamber 92 to the lowered position. As a result, the first elevating plate 31 in the rotation chamber 91 moves to the lowered position by its own weight and the action of the spring 35. In this state, the chuck 11 is rotated about the rotation shaft 21 and rotated so as to approach the holding position shown in FIG.

  The six chucks 11 are connected to the first elevating plate 31 via an opening / closing mechanism including a shaft 22, a cam plate 24, a connecting member 25, and the like. For this reason, when the six chucks 11 are rotated, they are rotated in complete synchronization with each other as the first elevating plate 31 moves up and down. Therefore, even when there is an error in the diameter of the semiconductor wafer 100 having a substantially circular shape, the center of the semiconductor wafer 100 can always be arranged at a fixed position (the center of the rotating chamber 91), and the semiconductor wafer 100 is eccentric. It can be prevented from being held. The holding force of the semiconductor wafer 100 by the chuck 11 at this time is kept constant by the action of the spring 35.

  When the holding operation of the semiconductor wafer 100 by the six chucks 11 is completed, the control unit 80 drives the motor 61 to rotate the rotating chamber 91 together with the chuck 11 and the semiconductor wafer 100 (step S3).

  When the rotating semiconductor wafer 100 held by the chuck 11 reaches a predetermined number of revolutions, the control unit 80 supplies the processing liquid from the processing liquid supply nozzle 10 toward the main surface of the semiconductor wafer 100 (step S4). The processing liquid supply operation may be stopped at a fixed time, or the processing liquid may be continuously supplied during a continuous processing step described later.

  In this state, the rotation of the semiconductor wafer 100 is continued, and the semiconductor wafer 100 is processed with the processing liquid (step S5). At this time, the second elevating plate 32 is reciprocated between the lowered position and the intermediate position by the action of the air cylinders 62 and 66. Specifically, the air cylinder 66 is driven and the stopper 67 is moved to the contact position. By driving the air cylinder 62 in this state, the second elevating plate 32 is lowered to a position where it comes into contact with the stopper 67 described above. Since the first elevating plate 31 is urged downward by the plurality of springs 35, the influence of the repelling magnetic force from the second elevating plate 32 is reduced, so that the first elevating plate 31 is moved to the intermediate position slightly lowered from the holding position. Retained. In this way, the first elevating plate 31 is reciprocated between the lowered position and the intermediate position.

  As a result, the chuck 11 rotates about the rotation shaft 21, and the holding position shown in FIG. 2 and FIG. 4B and the intermediate position between the holding position and the delivery position shown in FIG. Move back and forth between them. The reciprocating movement of the chuck 11 is executed under the control of the control unit 80 shown in FIG.

  During the processing of the semiconductor wafer 100, when the chuck 11 is always disposed at the holding position shown in FIG. 4B and the semiconductor wafer 100 is continuously held, the processing liquid is brought into contact with the chuck 11 and the semiconductor wafer 100. Stays without being sufficiently circulated, resulting in uneven processing. Therefore, when the semiconductor wafer 100 is processed with the processing liquid, the chuck 11 is rotated from the holding position to the intermediate position, so that the contact portion between the chuck 11 and the semiconductor wafer 100 is moved in the intermediate position. Thus, it is possible to replace the processing liquid in step 1, thereby preventing the occurrence of processing unevenness.

  In the state where the chuck 11 is disposed at the intermediate position, the semiconductor wafer 100 is only supported from the lower surface by the support portion 13 of the chuck 11. However, the semiconductor wafer 100 continues to rotate due to inertia, and a frictional force acts between the semiconductor wafer 100 and the support portion 13 of the chuck 11, so that the chuck position does not change. Further, in this state, the upper surface of the semiconductor wafer 100 is guided and guided by the guide portion 14, so that even when the rotation center of the semiconductor wafer 100 changes, the semiconductor wafer is removed from the chuck 11. It will not come off.

  The timing for rotating the chuck 11 between the holding position and the intermediate position can be, for example, every few seconds to several tens of seconds. Further, by setting the ratio of placing the chuck 11 at the intermediate position during processing by rotating the semiconductor wafer 100 to 50% or more, processing unevenness similar to the case of holding the semiconductor wafer 100 by the pair of chucks 11 is achieved. It is possible to obtain the prevention effect.

  Further, when the semiconductor wafer 100 is processed with the processing liquid, the substrate holding device includes the first elevating plate 31 provided with the magnet 33, the shaft 22, the cam plate 24, the connecting member 25, and the like in the rotating chamber 91. Since the second elevating plate 32 having the magnet 34 and the elevating mechanism of the second elevating plate 32 are accommodated in the fixed chamber 92, these members are isolated from the atmosphere of the processing liquid. It becomes possible.

  When the processing using the processing liquid for the semiconductor wafer 100 is completed (step S6), the control unit 80 stops the supply of the processing liquid from the processing liquid supply nozzle 10. Then, the semiconductor wafer 100 is rotated at a high speed together with the rotating chamber 91 to perform a drying process. When the semiconductor wafer 100 is dried, the rotation of the rotation chamber 91 is stopped (step S7).

  Even during the drying process, it is possible to perform the drying process while rotating the chuck 11 between the holding position and the intermediate position, as in the above-described process using the processing liquid. Thereby, it becomes possible to obtain the effect of preventing processing unevenness in the drying processing.

  However, when the rotation speed of the semiconductor wafer is changed (acceleration and deceleration), the chuck 11 needs to be in the holding position. This is because rubbing occurs between the semiconductor wafer 100 and the support portion 13 of the chuck 11 when there is a speed difference between the rotation speed of the semiconductor wafer 100 and the rotation speed of the chuck 11.

  Thereafter, the semiconductor wafer 100 is unloaded (step S8). Specifically, the control unit 80 drives the air cylinder 62 to move the second lifting plate 32 to the raised position. Thereby, the 1st raising / lowering board 31 also moves to a raise position. In this state, the chuck 11 rotates around the rotation shaft 21 and is disposed at the delivery position shown in FIG. Then, the semiconductor wafer 100 is unloaded by a transfer arm (not shown).

  As described above, in the substrate holding device according to the present invention, since the six chucks 11 can be rotated in complete synchronization, even when there is an error in the diameter of the semiconductor wafer 100, the semiconductor wafer The center of 100 can always be arranged at a fixed position, and the semiconductor wafer 100 can be prevented from being held eccentrically. Further, during the processing of the semiconductor wafer 100 with the processing liquid and during the drying processing, the chuck 11 is reciprocally rotated between the holding position shown in FIG. 4B and the intermediate position shown in FIG. 4C. Further, it is possible to prevent the occurrence of processing unevenness due to retention of the processing liquid at the contact portion between the chuck 11 and the semiconductor wafer 100. Further, the action of the rotating chamber 91 and the fixed chamber 92 makes it possible to isolate the magnets 33, 34, the opening / closing mechanism, the lifting mechanism, and the like from the processing liquid atmosphere.

  Next, another embodiment of the present invention will be described. FIG. 7 is a perspective view of the main part of the substrate holding apparatus according to the second embodiment of the present invention, with the rotating chamber 91 and the fixed chamber 92 removed. FIG. 8 is a plan view of the second elevating plate 37 according to the second embodiment. Furthermore, FIG. 9 is a perspective view of a second opening / closing mechanism for rotating the second chuck 12. In addition, about the member similar to 1st Embodiment mentioned above, the same code | symbol is attached | subjected and detailed description is abbreviate | omitted.

  In the substrate holding apparatus according to the first embodiment described above, the six chucks 11 are rotated synchronously by the action of the first and second elevating plates 31 and 32. On the other hand, in the substrate holding apparatus according to the second embodiment, the three chucks 11 are rotated in synchronism by the action of the first and second elevating plates 36 and 37 by the same mechanism as in the first embodiment. In addition, the three second chucks 12 are individually rotated using the individual second opening / closing mechanisms.

  As in the chuck 11 shown in FIG. 4, the second chuck 12 includes a support portion 13 made of a tapered surface disposed opposite to the lower surface of the semiconductor wafer 100 so as to be able to support the lower surface near the edge of the semiconductor wafer 100, and a semiconductor. A guide portion 14 having a tapered surface disposed opposite to the upper surface near the edge of the wafer 100 is provided. Also in the second chuck 12, the distance from the rotary shaft 21 to the tip of the support portion 13 is larger than the distance from the rotary shaft 21 to the tip of the guide portion 14.

  In the second embodiment, as shown in FIGS. 7 and 8, the second elevating plate 37 is formed with three recesses, and the upper surface of the second elevating plate 37 has three pieces. A magnet 39 is provided. Further, as shown in FIG. 7, the first elevating plate 36 is also formed with three concave portions, and three magnets 39 in the second elevating plate 37 are formed on the lower surface of the first elevating plate 36. The three magnets 38 are disposed at positions facing each other. In addition, the 2nd raising / lowering board 37 performs the raising / lowering operation | movement to a raise position, a descent | fall position, and an intermediate position by the effect | action of the air cylinders 62 and 66 shown in FIG. 1 similarly to 1st Embodiment.

  Although not shown in FIG. 7, the opening / closing mechanism of the chuck 11 having the same cam plate 24 and shaft 22 as in the first embodiment is connected to the first lifting plate 36 via the connecting member 25. Yes. Therefore, the three chucks 11 connected to the first lifting plate 31 are driven by the air cylinder 62 shown in FIG. 1 to drive the second lifting plate 37 and the first lifting plate, as in the first embodiment. They are rotated in complete synchronization with each other via 36.

  A second opening / closing mechanism shown in FIG. 9 for rotating the second chuck 12 is disposed at a location corresponding to the recess formed in the first lifting plate 36 and the second lifting plate 37. The second chuck 12 is disposed along the edge of the semiconductor wafer 100 in the region between the three chucks 11 in the rotating chamber 91. The second chuck 12 is rotated around a rotating shaft 41 that is disposed in the rotating chamber 91 and faces the vertical direction, so that the holding position, the delivery position, and the intermediate position similar to those of the chuck 11 described above are obtained. It is the structure which moves between.

  As shown in FIG. 9, a cam plate 44 in which a hole 43 facing in an oblique direction is formed is disposed in the rotating chamber 91. The lower end portion of the cam plate 44 is connected to the first elevating member 40, and a magnet 45 is attached to the lower surface of the first elevating member 40. The cam plate 44 is provided with a slider 50 guided by the guide member 49. The guide member 49 is supported in a rotating chamber 91 by a bracket 48 fixed to the rotating chamber 91. The cam plate 44 is provided with a spring 51 that biases the cam plate 44 downward.

  On the other hand, a second elevating member 47 that elevates and lowers by the action of the air cylinder 52 is disposed in the fixed chamber 92 so as to be opposed to the first elevating member 40. On the upper surface of the second elevating member 47, a magnet 46 having a characteristic of repelling the magnet 45 attached to the lower surface of the first elevating member 40 is disposed. In addition, this 2nd raising / lowering member 47 is abbreviate | omitting illustration similarly to the air cylinder 66 shown in FIG. 1 similarly to the 2nd raising / lowering board 32 which concerns on 1st Embodiment, and the 2nd raising / lowering board 37 which concerns on 2nd Embodiment. By the action of the air cylinder having the stopper and the air cylinder 52, the air cylinder is moved up and down between the raised position, the lowered position, and the intermediate position. Here, in FIG. 9, the arc-shaped second elevating member 47 is used. As the second elevating member 47, any member that can connect the cylinder lot of the air cylinder 52 and the magnet 46 is used. Any shape can be adopted.

  A tip end of a shaft 42 attached to the rotating shaft 41 is engaged with a hole portion 43 formed in the cam plate 44 and facing in an oblique direction. For this reason, when the 1st raising / lowering member 40 raises / lowers, the rotating shaft 41 rotates centering | focusing on the axis center by the effect | action of the hole 43 and the axis | shaft 42 which face the diagonal direction. Along with the rotation of the rotating shaft 41, the second chuck 12 is also rotated around the axis of the rotating shaft 41. The rotational angle position of the second chuck 12 is determined by the height position of the first elevating member 40. That is, the second chuck 12 has a delivery position and a holding position similar to the chuck 11 by the first and second elevating members 40 and 47 reciprocating between the raised position, the lowered position, and the intermediate position. And the intermediate position.

  When the semiconductor wafer 100 is processed using the substrate holding apparatus according to the second embodiment, the chuck 11 and the second chuck 12 are rotated in synchronism with each other, and thus the same as the first embodiment described above. The processing of the semiconductor wafer 100 can be executed by the operation. In particular, in the processing step of processing the semiconductor wafer 100 with the processing liquid and the step of performing the drying processing, the chuck 11 and the second chuck are switched by switching the second chuck 12 and the chuck 11 to the holding position. 12, it is possible to effectively prevent the occurrence of processing unevenness due to the retention of the processing liquid at the contact portion between the semiconductor wafer 100 and the semiconductor wafer 100.

  In the substrate holding apparatus according to the second embodiment, the diameter of the semiconductor wafer 100 having a substantially circular shape is obtained by the action of the three chucks 11 that are coupled to the first elevating plate 36 and rotate in synchronization with each other. Even if there is an error, the center of the semiconductor wafer 100 can always be arranged at a fixed position, and the semiconductor wafer 100 can be prevented from being held eccentrically. Even if the shape of the edge of the semiconductor wafer 100 is not a perfect circle due to the action of the three second chucks 12 having the individual second opening / closing mechanisms, the three chucks 11 and the three chucks The semiconductor wafer 100 can be reliably held by both the second chucks 12.

  In the above-described embodiment, as the chuck 11 and the second chuck 12, the support portion 13 made of a tapered surface disposed to face the lower surface of the semiconductor wafer 100 so as to support the lower surface near the edge of the semiconductor wafer 100; A semiconductor wafer 100 having an upper surface in the vicinity of the edge and a guide portion 14 having a tapered surface disposed oppositely is used. However, a support portion that supports the semiconductor wafer 100 and a guide portion that guides and guides the semiconductor wafer 100 are provided, and the distance from the rotation shaft 21 to the tip of the support portion is the distance from the rotation shaft 21 to the tip of the guide portion. Other shapes may be used for larger configurations.

  In the above-described embodiment, the case where the semiconductor wafer 100 is held by six chucks has been described. However, at least three chucks may be used. Further, six or more chucks such as eight chucks may be provided.

  Further, in the above-described embodiment, the chuck 11 rotates about the shaft 21 and the second chuck 12 rotates about the shaft 41. However, the first chuck 11 and the second chuck 12 are A configuration of moving in the direction of approaching or separating from the center of the semiconductor wafer 100 may be employed.

DESCRIPTION OF SYMBOLS 10 Process liquid supply nozzle 11 Chuck 12 2nd chuck 13 Support part 14 Guide part 21 Rotating shaft 22 Shaft 23 Hole 24 Cam plate 25 Connection member 31 1st raising / lowering board 32 2nd raising / lowering board 33 Magnet 34 Magnet 35 Spring 36 1st Lift plate 37 Second lift plate 38 Magnet 39 Magnet 40 First lift member 41 Rotating shaft 42 Axis 43 Hole 44 Cam plate 45 Magnet 46 Magnet 47 Second lift member 49 Guide member 50 Slider 51 Spring 61 Motor 62 Air cylinder 63 Slider 64 Guide member 66 Air cylinder 67 Stopper 80 Control unit 91 Rotating chamber 92 Fixed chamber 100 Semiconductor wafer

Claims (5)

A substrate used in a substrate processing apparatus for processing a substrate by supplying a processing liquid to the main surface of the substrate while rotating the substrate, and holding the substrate rotatably in a plane parallel to the main surface of the substrate A holding device,
A support portion that is disposed to face the lower surface of the substrate so as to be able to support the lower surface in the vicinity of the edge of the substrate and extends toward the rotation center of the substrate in a state of being disposed at a holding position for holding the substrate A guide portion disposed opposite to the upper surface in the vicinity of the edge of the substrate and extending toward the center of rotation of the substrate, the tip of which is disposed apart from the center of rotation of the substrate from the tip of the support portion. A plurality of chucks, and
The plurality of chucks are arranged such that the holding position for holding the substrate and the tip of the guide portion are arranged outside the edge of the substrate, and the tip of the support portion is arranged inside the edge of the substrate. A moving mechanism that moves between a delivery position and an intermediate position in which the tip of the guide portion is arranged on the inner side of the edge of the substrate;
A controller that reciprocally moves the plurality of chucks between the holding position and the intermediate position during processing of the substrate by controlling the moving mechanism;
A substrate holding apparatus comprising: The substrate holding apparatus according to claim 1,
A rotating chamber that rotates by driving the motor; and a fixed chamber,
The moving mechanism is
A first elevating plate including a magnet and disposed in the rotating chamber so as to be movable up and down;
The plurality of chucks are connected to the first elevating plate, and the plurality of chucks are synchronized between the holding position, the delivery position, and the intermediate position in accordance with the elevating operation of the first elevating plate. An opening / closing mechanism disposed in the rotating chamber,
A second elevating plate provided with a magnet and disposed opposite to the first elevating plate in the fixed chamber;
An elevating mechanism disposed in the fixed chamber for elevating the second elevating plate;
A substrate holding apparatus comprising: The substrate holding apparatus according to claim 2, wherein
A substrate holding mechanism comprising a spring that biases the first elevating plate in a direction in which the plurality of chucks move toward the holding position. In the substrate holding device according to claim 2 or 3,
The plurality of chucks are substrate holding devices that move between the holding position and the delivery position by rotating about a rotation axis that faces in a vertical direction. A support portion disposed opposite to the lower surface of the substrate so as to be able to support a lower surface near an edge of the substrate in a state where the substrate is held at a holding position for holding the substrate, and extending toward the rotation center of the substrate; A guide portion disposed opposite to the upper surface in the vicinity of the edge of the substrate and extending toward the rotation center of the substrate, the tip of which is disposed away from the rotation center of the substrate from the tip of the support portion. In a state where the substrate is held by a plurality of chucks, the substrate is rotated together with the plurality of chucks in a plane parallel to the main surface of the substrate while supplying a processing liquid to the substrate. In the substrate processing method to process,
In the state where the plurality of chucks are arranged at a delivery position where the front end of the guide portion is arranged outside the edge of the substrate and the front end of the support portion is arranged inside the edge of the substrate. A carrying-in process for carrying in,
A rotation start step of starting rotation of the substrate in a state where the plurality of chucks are arranged at holding positions for holding the substrate;
A treatment liquid supply step of supplying a treatment liquid to the main surface of the substrate;
A continuous processing step of reciprocally moving the plurality of chucks between the holding position and an intermediate position in which a front end of the guide portion is disposed inside an edge of the substrate;
A rotation stopping step for stopping rotation of the substrate;
An unloading step of unloading the substrate in a state where the plurality of chucks are arranged at the delivery position;
A substrate processing method comprising:

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