JP2014146746A - Substrate holding device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate holding device preventing eccentricity of a substrate by rotating a plurality of chucks synchronously and capable of separating a magnet or the like from a processing liquid atmosphere.SOLUTION: When a second lifting plate 32 in a fixed chamber 92 is moved up and down by the driving of an air cylinder 62, a first lifting plate 31 in a rotating chamber 91 is also moved up and down by the action of magnets 33, 34 repulsing each other. A plurality of chucks 11 connected with the first lifting plate 31 via an opening/closing mechanism is rotated in perfect synchronization in accordance with the lifting action of the first lifting plate 31.

Description

  The present invention relates to a substrate holding apparatus that is used in a substrate processing apparatus that processes a substrate while rotating the substrate, and that rotatably holds the substrate in a plane parallel to the main surface of the substrate.

  In a substrate processing apparatus that processes a substrate by rotating a substantially circular substrate such as a semiconductor wafer while supplying the processing liquid to the main surface, the substrate that rotates the substrate that holds the main surface in a horizontal direction A holding device is used. The substrate holding device includes a plurality of chucks that hold a substrate by contacting an edge of the substrate. The plurality of chucks are movable between a holding position for holding the substrate and a delivery position for delivering the substrate to and from a transfer arm or the like.

  Patent Document 1 discloses a spin head that moves three chucking pins out of six chucking pins alternately to a position for chucking a substrate by raising and lowering a magnet. Further, Patent Document 2 discloses a substrate holding device that changes a holding state of a substrate by a rotary holding member by using a magnet provided at the upper end of the cup and a magnet provided on the bottom surface of the cup. Is disclosed.

JP 2008-135750 A JP 2005-142585 A

  As described in Patent Document 1 and Patent Document 2, when the opening / closing operation of the chuck is performed using the magnetic force of the magnet, if the movements of the plurality of chucks are not completely synchronized, In some cases, the substrate is held in an eccentric state. When the substrate is decentered in this way, there is a problem that the substrate cannot be rotated accurately and the substrate cannot be processed uniformly.

  Further, as described in Patent Document 1 and Patent Document 2, when the opening / closing operation of the chuck is performed using the magnetic force of the magnet, the magnet is corroded if the magnet is disposed in the atmosphere of the processing liquid. In addition to this, there is a problem that the processing result of the substrate is also adversely affected.

  The present invention has been made to solve the above-described problems, and can prevent the eccentricity of the substrate by rotating a plurality of chucks synchronously, and can isolate a magnet or the like from the processing liquid atmosphere. An object is to provide a substrate holding device.

  The invention according to claim 1 is a substrate holding apparatus that is used in a substrate processing apparatus that performs processing while rotating a substrate, and that rotatably holds the substrate in a plane parallel to a main surface of the substrate. A rotating chamber that rotates by driving of a motor, a plurality of chucks that are disposed in the rotating chamber and hold the substrate by contacting an edge of a substantially circular substrate, and a magnet, are moved up and down in the rotating chamber. A first lifting plate, a plurality of chucks, and a first lifting plate connected to the first lifting plate, and holding the plurality of chucks as the first lifting plate moves up and down. An opening / closing mechanism disposed in the rotating chamber, a fixed chamber, and a magnet that are rotated synchronously between a position and a delivery position where the substrate can be delivered; A second lifting plate arranged opposite said first elevating plate have, for elevating the second lifting plate, characterized in that a disposed a lifting mechanism to the fixed chamber.

  A second aspect of the present invention includes the spring according to the first aspect, wherein the plurality of chucks bias the first elevating plate in a direction toward the holding position.

  According to a third aspect of the present invention, in the first or second aspect of the present invention, the plurality of chucks swing around a rotating shaft that faces in a vertical direction, thereby the holding position and the delivery position. Rotate between.

  According to a fourth aspect of the present invention, in the invention according to any one of the first to third aspects, the substrate is disposed along an edge of the substrate in a region between the plurality of chucks in the rotating chamber. A second chuck for holding the substrate by abutting against an edge of the circular substrate, a first elevating member including a magnet and arranged to be movable up and down in the rotating chamber, the second chuck, and the second chuck Connected to one lifting member, and with the lifting and lowering operation of the first lifting member, the second chuck is rotated between a holding position for holding the substrate and a delivery position where the substrate can be delivered, A second opening / closing mechanism disposed in the rotation chamber, a magnet, a second lifting member disposed opposite to the first lifting member in the fixed chamber, and for lifting the second lifting member; Further comprising a second lifting mechanism disposed serial stationary chamber.

  A fifth aspect of the present invention includes the spring according to the fourth aspect of the present invention, wherein the second chuck biases the first elevating member in a direction toward the holding position.

  According to a sixth aspect of the present invention, in the invention according to the fourth or fifth aspect, the second chuck swings about a rotating shaft that faces in a vertical direction, thereby the holding position and the delivery position. Rotate between.

  According to the first aspect of the present invention, since the plurality of chucks can be rotated synchronously by the action of the first elevating plate, the substrate can be simultaneously held by the plurality of chucks, and the substrate is eccentric. It can be prevented from being held. Further, the action of the rotating chamber and the fixed chamber makes it possible to isolate the magnet, the opening / closing mechanism, and the lifting mechanism from the atmosphere of the processing liquid.

  According to the second aspect of the present invention, the substrate can be securely held by the chuck by the action of the spring.

  According to the third aspect of the present invention, the chuck can be easily rotated between the holding position and the delivery position.

  According to the invention described in claim 4, even when the shape of the edge of the substrate is not a perfect circle, the substrate can be reliably held by the action of the second chuck.

  According to the fifth aspect of the present invention, the substrate can be reliably held by the second chuck by the action of the spring.

  According to the sixth aspect of the present invention, the second chuck can be easily rotated between the holding position and the delivery position.

1 is a schematic side view showing a substrate holding apparatus according to a first embodiment of the present invention together with a processing liquid supply nozzle. 3 is a perspective view showing an opening / closing mechanism for rotating the chuck 11 together with the chuck 11 and a first lifting plate 31. FIG. It is the perspective view which removed the rotation chamber 91 and the fixed chamber 92, and looked at the principal part of the board | substrate holding apparatus which concerns on 1st Embodiment of this invention. FIG. 6 is an explanatory diagram showing an arrangement of a semiconductor wafer 100 and a chuck 11. It is a block diagram which shows the main control systems of the board | substrate holding | maintenance apparatus concerning this invention. It is a flowchart which shows the substrate processing method using the substrate holding | maintenance apparatus which concerns on this invention. It is the perspective view which removed the rotation chamber 91 and the fixed chamber 92, and showed the principal part of the board | substrate holding apparatus which concerns on 2nd Embodiment of this invention. It is a top view of the 2nd raising / lowering board 37 which concerns on 2nd Embodiment. It is a perspective view of the 2nd opening-and-closing mechanism for rotating the 2nd chuck 12.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic side view showing a substrate holding apparatus according to a first embodiment of the present invention together with a processing liquid supply nozzle 10. FIG. 2 is a perspective view showing an opening / closing mechanism for rotating the chuck 11 together with the chuck 11 and the first lifting plate 31. FIG. 3 is a perspective view of the main part of the substrate holding apparatus according to the first embodiment of the present invention, with the rotating chamber 91 and the fixed chamber 92 removed.

  This substrate holding device is used in a substrate processing apparatus for supplying a processing liquid from a processing liquid supply nozzle 10 of the semiconductor wafer 100 while rotating the semiconductor wafer 100 as a substrate and processing the semiconductor wafer 100. Is rotatably held in a plane parallel to the main surface. The substrate holding apparatus includes a rotating chamber 91 that rotates by driving a motor 61 and a fixed chamber 92.

  The rotating chamber 91 is provided with six chucks 11 for holding the semiconductor wafer 100 by contacting the edge of the semiconductor wafer 100 having a substantially circular shape except for the orientation flat portion. The chuck 11 is configured to rotate between a holding position and a delivery position, which will be described later, by swinging about a rotating shaft 21 disposed in the rotating chamber 91 and facing in the vertical direction.

  As shown in FIG. 1, a first elevating plate 31 is disposed in the rotary chamber 91 in a state where it can be raised and lowered by an elevating mechanism (not shown). The first elevating plate 31 is urged downward by the action of the plurality of springs 35. A ring-shaped magnet 33 is attached to the lower surface of the first lifting plate 31.

  On the other hand, in the fixed chamber 92, the second elevating plate 32 is arranged in a state of being opposed to the first elevating plate 31. The second elevating plate 32 is connected to a slider 63 that is guided up and down by a guide member 64 via a support member 65. The second elevating plate 32 is connected to the cylinder rod of the air cylinder 62 disposed in the fixed chamber 92. For this reason, the second elevating plate 32 moves up and down by driving the air cylinder 62. On the upper surface of the second elevating plate 32, a ring-shaped magnet 34 having a characteristic of repelling the ring-shaped magnet 33 attached to the lower surface of the first elevating plate 31 is disposed.

  For this reason, when the 2nd raising / lowering board 32 in the fixed chamber 92 raises by the drive of the air cylinder 62, the 1st raising / lowering board 31 in the rotation chamber 91 also raises by the effect | action of the magnets 33 and 34 which repel each other. . On the other hand, when the second elevating plate 32 in the fixed chamber 92 is lowered by driving the air cylinder 62, the first elevating plate 31 in the rotating chamber 91 is caused by the weight of the first elevating plate 31 itself and the action of the spring 35. Also descends.

  Note that the magnet 33 and the magnet 34 do not necessarily have a ring shape. A plurality of magnets may be arranged on the first lifting plate 31 and the second lifting plate 32 as long as the above-described lifting operation of the first lifting plate 31 can be performed.

  As shown in FIG. 2, the first elevating plate 31 is provided with a cam plate 24 via a connecting member 25. The cam plate 24 is formed with a hole 23 that faces in an oblique direction. The tip of a shaft 22 attached to the rotary shaft 21 is engaged with the hole 23. For this reason, when the 1st raising / lowering board 31 raises / lowers, the rotating shaft 21 rotates centering on the shaft center by the effect | action of the hole 23 and the axis | shaft 22 which face the diagonal direction. Along with the rotation of the rotating shaft 21, the chuck 11 is also rotated about the axis of the rotating shaft 21. The rotation angle position of the chuck 11 is determined by the height position of the first elevating plate 31.

  An opening / closing mechanism for rotating the chuck 11 provided with the cam plate 24 and the shaft 22 is provided for each of the six chucks 11. In FIG. 3, only the connecting member 25 is shown, and the cam plate 24 and the shaft 22 are not shown.

  FIG. 4 is an explanatory view showing the arrangement of the semiconductor wafer 100 and the chuck 11. 4A shows a state where the chuck 11 is disposed at the delivery position, and FIG. 4B shows a state where the chuck 11 is disposed at the holding position.

  As shown in FIG. 4, the chuck 11 includes a support portion 13 formed of a tapered surface disposed to face the lower surface of the semiconductor wafer 100 so as to support the lower surface near the edge of the semiconductor wafer 100, and the vicinity of the edge of the semiconductor wafer 100. The guide part 14 which consists of a taper surface opposingly arrange | positioned is provided. The distance from the rotating shaft 21 to the tip of the support portion 13 is larger than the distance from the rotating shaft 21 to the tip of the guide portion 14. That is, when the chuck 11 is disposed at a holding position for holding the semiconductor wafer 100, the tip of the guide portion 14 extending toward the rotation center of the semiconductor wafer 100 faces the rotation center of the semiconductor wafer 100. It is arranged at a position separated from the center of rotation of the semiconductor wafer 100 from the tip of the support portion 13 extending in the direction.

  As the first elevating plate 31 moves to the above-described raised position, the chuck 11 is rotated to an angular position rotated by a predetermined angle (15 to 45 degrees) from the state shown in FIG. At this time, due to the difference between the distance from the rotating shaft 21 to the tip of the support portion 13 and the distance from the rotating shaft 21 to the tip of the guide portion 14, as shown in FIG. The tip is disposed inside the edge of the semiconductor wafer 100, and the tip of the guide portion 14 in the chuck 11 is disposed outside the edge of the semiconductor wafer 100. In this state, the semiconductor wafer 100 is supported by the support portion 13 in the chuck 11 but is movable upward. In the state where the chuck 11 is disposed at the delivery position shown in FIG. 4A, the semiconductor wafer 100 supported by the chuck 11 can be delivered between the chuck 11 and a transfer arm or the like (not shown). Become.

  When the first elevating plate 31 moves to the above-described lowered position, the chuck 11 is rotated to an angular position slightly rotated (5 to 10 degrees) from the state shown in FIG. At this time, as shown in FIG. 4B, the support portion 13 and the guide portion 14 in the chuck 11 are arranged at positions where they abut against the edge of the semiconductor wafer 100 (that is, the rotation is stopped). In this state, the semiconductor wafer 100 comes into contact with the support portion 13 and the guide portion 14 in the chuck 11. In the state where the chuck 11 is disposed at the holding position shown in FIG. 4B, the semiconductor wafer 100 is securely held by the chuck 11.

  FIG. 5 is a block diagram showing a main control system of the substrate holding apparatus according to the present invention.

  The substrate holding apparatus includes a control unit 80 having a ROM 81 that stores an operation program necessary for controlling the apparatus, a RAM 82 that temporarily stores data and the like during control, and a CPU 83 that executes a logical operation. The control unit 80 is connected to an air cylinder 62 for moving up and down the second lifting plate 32 and a motor 61 for rotating the rotating chamber 91. The control unit 80 controls the opening / closing operation of the chuck 11 and the rotating operation of the rotating chamber 91. Further, the processing liquid supply operation from the processing liquid supply nozzle 10 and other processing operations are also controlled by the control unit 80.

  Next, a substrate processing method when processing the semiconductor wafer 100 with the processing liquid using the substrate holding apparatus according to the present invention will be described. FIG. 6 is a flowchart showing a substrate processing method using the substrate holding apparatus according to the present invention.

  When processing the semiconductor wafer 100, the semiconductor wafer 100 is first carried in (step S1). Specifically, the control unit 80 drives the air cylinder 62 to move the second lifting plate 32 to the raised position. By moving the second lifting plate 32 to the raised position, the first lifting plate 31 in the rotating chamber 91 is also moved to the raised position by the action of the magnets 33 and 34 repelling each other. In this state, the chuck 11 rotates around the rotation shaft 21 and is disposed at the delivery position shown in FIG. Then, the semiconductor wafer 100 is transferred onto the six chucks 11 by a transfer arm (not shown). As a result, as shown in FIG. 4A, the semiconductor wafer 100 is supported by the six chucks 11 in a state where the edge thereof is in contact with the support portion 13 in the chuck 11.

  Next, the semiconductor wafer 100 is held by the six chucks 11 (step S2). Specifically, the controller 80 drives the air cylinder 62 to move the second elevating plate 32 in the fixed chamber 92 to the lowered position. As a result, the first elevating plate 31 in the rotation chamber 91 moves to the lowered position by its own weight and the action of the spring 35. In this state, the chuck 11 is rotated about the rotation shaft 21 and rotated so as to approach the holding position shown in FIG.

  The six chucks 11 are connected to the first elevating plate 31 via an opening / closing mechanism including a shaft 22, a cam plate 24, a connecting member 25, and the like. For this reason, when the six chucks 11 are rotated, they are rotated in complete synchronization with each other as the first elevating plate 31 moves up and down. Therefore, even when there is an error in the diameter of the semiconductor wafer 100 having a substantially circular shape, the center of the semiconductor wafer 100 can always be arranged at a fixed position (the center of the rotating chamber 91), and the semiconductor wafer 100 is eccentric. It can be prevented from being held. The holding force of the semiconductor wafer 100 by the chuck 11 at this time is kept constant by the action of the spring 35.

  When the holding operation of the semiconductor wafer 100 by the six chucks 11 is completed, the control unit 80 drives the motor 61 to rotate the rotating chamber 91 together with the chuck 11 and the semiconductor wafer 100 (step S3).

  When the rotating semiconductor wafer 100 held by the chuck 11 reaches a predetermined number of revolutions, the control unit 80 supplies the processing liquid from the processing liquid supply nozzle 10 toward the main surface of the semiconductor wafer 100 (step S4). The processing liquid supply operation may be stopped at a fixed time, or the processing liquid may be continuously supplied during a continuous processing step described later.

  In this state, the rotation of the semiconductor wafer 100 is continued and the semiconductor wafer 100 is processed with the processing liquid (step S5).

  As described above, when the semiconductor wafer 100 is processed with the processing liquid, the substrate holding apparatus includes the first elevating plate 31 including the magnet 33, the opening / closing mechanism including the shaft 22, the cam plate 24, the connecting member 25, and the like. Since the second elevating plate 32 provided with the magnet 34 and the elevating mechanism of the second elevating plate 32 are accommodated in the fixed chamber 92 while being accommodated in the rotating chamber 91, these members are treated in a processing liquid atmosphere. It can be isolated from below.

  When the processing using the processing liquid for the semiconductor wafer 100 is completed (step S6), the control unit 80 stops the supply of the processing liquid from the processing liquid supply nozzle 10. Then, the semiconductor wafer 100 is rotated at a high speed together with the rotating chamber 91 to perform a drying process. When the semiconductor wafer 100 is dried, the rotation of the rotation chamber 91 is stopped (step S7).

  Thereafter, the semiconductor wafer 100 is unloaded (step S8). Specifically, the control unit 80 drives the air cylinder 62 to move the second lifting plate 32 to the raised position. Thereby, the 1st raising / lowering board 31 also moves to a raise position. In this state, the chuck 11 rotates around the rotation shaft 21 and is disposed at the delivery position shown in FIG. Then, the semiconductor wafer 100 is unloaded by a transfer arm (not shown).

  As described above, in the substrate holding device according to the present invention, since the six chucks 11 can be rotated in complete synchronization, even when there is an error in the diameter of the semiconductor wafer 100, the semiconductor wafer The center of 100 can always be arranged at a fixed position, and the semiconductor wafer 100 can be prevented from being held eccentrically.

  Next, another embodiment of the present invention will be described. FIG. 7 is a perspective view of the main part of the substrate holding apparatus according to the second embodiment of the present invention, with the rotating chamber 91 and the fixed chamber 92 removed. FIG. 8 is a plan view of the second elevating plate 37 according to the second embodiment. Furthermore, FIG. 9 is a perspective view of a second opening / closing mechanism for rotating the second chuck 12. In addition, about the member similar to 1st Embodiment mentioned above, the same code | symbol is attached | subjected and detailed description is abbreviate | omitted.

  In the substrate holding apparatus according to the first embodiment described above, the six chucks 11 are rotated synchronously by the action of the first and second elevating plates 31 and 32. On the other hand, in the substrate holding apparatus according to the second embodiment, the three chucks 11 are rotated in synchronism by the action of the first and second elevating plates 36 and 37 by the same mechanism as in the first embodiment. In addition, the three second chucks 12 are individually rotated using the individual second opening / closing mechanisms.

  As in the chuck 11 shown in FIG. 4, the second chuck 12 includes a support portion 13 made of a tapered surface disposed opposite to the lower surface of the semiconductor wafer 100 so as to be able to support the lower surface near the edge of the semiconductor wafer 100, and a semiconductor. A guide portion 14 having a tapered surface disposed opposite to the upper surface near the edge of the wafer 100 is provided. Also in the second chuck 12, the distance from the rotary shaft 21 to the tip of the support portion 13 is larger than the distance from the rotary shaft 21 to the tip of the guide portion 14.

  In the second embodiment, as shown in FIGS. 7 and 8, the second elevating plate 37 is formed with three recesses, and the upper surface of the second elevating plate 37 has three pieces. A magnet 39 is provided. Further, as shown in FIG. 7, the first elevating plate 36 is also formed with three concave portions, and three magnets 39 in the second elevating plate 37 are formed on the lower surface of the first elevating plate 36. The three magnets 38 are disposed at positions facing each other. In addition, the 2nd raising / lowering board 37 performs the raising / lowering operation | movement to a raise position and a descent | fall position by the effect | action of the air cylinder 62 shown in FIG. 1 similarly to 1st Embodiment.

  Although not shown in FIG. 7, the opening / closing mechanism of the chuck 11 having the same cam plate 24 and shaft 22 as in the first embodiment is connected to the first lifting plate 36 via the connecting member 25. Yes. Therefore, the three chucks 11 connected to the first lifting plate 31 are driven by the air cylinder 62 shown in FIG. 1 to drive the second lifting plate 37 and the first lifting plate, as in the first embodiment. They are rotated in complete synchronization with each other via 36.

  A second opening / closing mechanism shown in FIG. 9 for rotating the second chuck 12 is disposed at a location corresponding to the recess formed in the first lifting plate 36 and the second lifting plate 37. The second chuck 12 is disposed along the edge of the semiconductor wafer 100 in the region between the three chucks 11 in the rotating chamber 91. The second chuck 12 swings around a rotation shaft 41 disposed in the rotation chamber 91 and facing the vertical direction, thereby rotating between the holding position and the delivery position, similar to the chuck 11 described above. It is configured to move.

  As shown in FIG. 9, a cam plate 44 in which a hole 43 facing in an oblique direction is formed is disposed in the rotating chamber 91. The lower end portion of the cam plate 44 is connected to the first elevating member 40, and a magnet 45 is attached to the lower surface of the first elevating member 40. The cam plate 44 is provided with a slider 50 guided by the guide member 49. The guide member 49 is supported in a rotating chamber 91 by a bracket 48 fixed to the rotating chamber 91. The cam plate 44 is provided with a spring 51 that biases the cam plate 44 downward.

  On the other hand, a second elevating member 47 that elevates and lowers by the action of the air cylinder 52 is disposed in the fixed chamber 92 so as to be opposed to the first elevating member 40. On the upper surface of the second elevating member 47, a magnet 46 having a characteristic of repelling the magnet 45 attached to the lower surface of the first elevating member 40 is disposed. The second lifting member 47 moves up and down between the raised position and the lowered position by the action of the air cylinder 52. Here, in FIG. 9, the arc-shaped second elevating member 47 is used. As the second elevating member 47, any member that can connect the cylinder lot of the air cylinder 52 and the magnet 46 is used. Any shape can be adopted.

  A tip end of a shaft 42 attached to the rotating shaft 41 is engaged with a hole portion 43 formed in the cam plate 44 and facing in an oblique direction. For this reason, when the 1st raising / lowering member 40 raises / lowers, the rotating shaft 41 rotates centering | focusing on the axis center by the effect | action of the hole 43 and the axis | shaft 42 which face the diagonal direction. Along with the rotation of the rotating shaft 41, the second chuck 12 is also rotated around the axis of the rotating shaft 41. The rotational angle position of the second chuck 12 is determined by the height position of the first elevating member 40. That is, in the second chuck 12, the first and second elevating members 40 and 47 reciprocate between the raised position and the lowered position, so that the second chuck 12 is moved between the delivery position and the holding position in the same manner as the chuck 11. To move.

  When the semiconductor wafer 100 is processed using the substrate holding apparatus according to the second embodiment, the chuck 11 and the second chuck 12 are rotated in synchronism with each other, and thus the same as the first embodiment described above. The processing of the semiconductor wafer 100 can be executed by the operation. In particular, in the processing step of processing the semiconductor wafer 100 with the processing liquid, the chuck 11, the second chuck 12, and the semiconductor wafer 100 are switched by switching the second chuck 12 and the chuck 11 to the holding position. It is possible to effectively prevent the occurrence of processing unevenness due to retention of the processing liquid at the contact portion.

  In the substrate holding apparatus according to the second embodiment, the diameter of the semiconductor wafer 100 having a substantially circular shape is obtained by the action of the three chucks 11 that are coupled to the first elevating plate 36 and rotate in synchronization with each other. Even if there is an error, the center of the semiconductor wafer 100 can always be arranged at a fixed position, and the semiconductor wafer 100 can be prevented from being held eccentrically. Even if the shape of the edge of the semiconductor wafer 100 is not a perfect circle due to the action of the three second chucks 12 having the individual second opening / closing mechanisms, the three chucks 11 and the three chucks The semiconductor wafer 100 can be reliably held by both the second chucks 12.

  In the above-described embodiment, as the chuck 11 and the second chuck 12, the support portion 13 made of a tapered surface disposed to face the lower surface of the semiconductor wafer 100 so as to support the lower surface near the edge of the semiconductor wafer 100; A semiconductor wafer 100 having an upper surface in the vicinity of the edge and a guide portion 14 having a tapered surface disposed oppositely is used. However, a support portion that supports the semiconductor wafer 100 and a guide portion that guides and guides the semiconductor wafer 100 are provided, and the distance from the rotation shaft 21 to the tip of the support portion is the distance from the rotation shaft 21 to the tip of the guide portion. Other shapes may be used for larger configurations.

  In the above-described embodiment, the case where the semiconductor wafer 100 is held by six chucks has been described. However, at least three chucks may be used. Further, six or more chucks such as eight chucks may be provided.

DESCRIPTION OF SYMBOLS 10 Process liquid supply nozzle 11 Chuck 12 2nd chuck 13 Support part 14 Guide part 21 Rotating shaft 22 Shaft 23 Hole 24 Cam plate 25 Connection member 31 1st raising / lowering board 32 2nd raising / lowering board 33 Magnet 34 Magnet 35 Spring 36 1st Lift plate 37 Second lift plate 38 Magnet 39 Magnet 40 First lift member 41 Rotating shaft 42 Axis 43 Hole 44 Cam plate 45 Magnet 46 Magnet 47 Second lift member 49 Guide member 50 Slider 51 Spring 61 Motor 62 Air cylinder 63 Slider 64 Guide member 80 Control unit 91 Rotating chamber 92 Fixed chamber 100 Semiconductor wafer

Claims (6)

A substrate holding apparatus that is used in a substrate processing apparatus that performs processing while rotating a substrate and holds the substrate rotatably in a plane parallel to the main surface of the substrate,
A rotating chamber that rotates by driving a motor;
A plurality of chucks disposed in the rotating chamber and holding the substrate by contacting an edge of a substantially circular substrate;
A first elevating plate including a magnet and disposed in the rotating chamber so as to be movable up and down;
A plurality of chucks are connected to the first elevating plate, and when the first elevating plate moves up and down, a holding position for holding the substrate and a delivery position where the substrate can be delivered An opening / closing mechanism disposed in the rotating chamber, wherein the opening / closing mechanism rotates in synchronization with each other;
A fixed chamber;
A second elevating plate provided with a magnet and disposed opposite to the first elevating plate in the fixed chamber;
An elevating mechanism disposed in the fixed chamber for elevating the second elevating plate;
A substrate holding apparatus comprising: The substrate holding apparatus according to claim 1,
A substrate holding apparatus comprising a spring that biases the first elevating plate in a direction in which the plurality of chucks move toward the holding position. The substrate holding apparatus according to claim 1 or 2,
The plurality of chucks are substrate holding devices that rotate between the holding position and the delivery position by swinging about a rotation axis that faces in a vertical direction. The substrate holding apparatus according to any one of claims 1 to 3,
A second chuck that is disposed along an edge of the substrate in a region between the plurality of chucks in the rotating chamber and holds the substrate by contacting the edge of the substantially circular substrate;
A first elevating member provided with a magnet and arranged to be movable up and down in the rotating chamber;
The second chuck and the first elevating member are connected to each other, and in accordance with the elevating operation of the first elevating member, a holding position for holding the substrate and a delivery position where the substrate can be delivered A second opening / closing mechanism disposed within the rotating chamber,
A second elevating member provided with a magnet and disposed opposite to the first elevating member in the fixed chamber;
A second elevating mechanism disposed in the fixed chamber for elevating the second elevating member;
A substrate holding apparatus further comprising: The substrate holding apparatus according to claim 4, wherein
A substrate holding mechanism comprising a spring that biases the first elevating member in a direction in which the second chuck faces the holding position. In the substrate holding device according to claim 4 or 5,
The second chuck is a substrate holding device that rotates between the holding position and the delivery position by swinging about a rotating shaft that faces in a vertical direction.

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