JP2017069283A - Package, light-emitting device, light-emitting module and package manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a package having high dissipation, a light-emitting device, a light-emitting module and a package manufacturing method.SOLUTION: A package 1 includes: an insulating substrate 2; a first wiring part 3 provided on the top surface of the insulating substrate; and a second wiring part 5 which is conductively connected to a first wiring part and provided on the lower surface of the insulating substrate. The second wiring part has a thickness of 100 μm or more downward from the lower surface of the insulating substrate, a metal film containing gold as the main component is applied to the surface of the second wiring part, and an area of connection surfaces 6a, 7a connected to the lower surface of the insulating substrate and an area of tip surfaces 6b, 7b in the thickness direction are formed so as to be different from each other.SELECTED DRAWING: Figure 1

Description

  The present disclosure relates to a package that uses an insulating substrate, a light emitting device, a light emitting module, and a method for manufacturing the package.

  Conventionally, light emitting elements such as a light emitting diode (LED) and a laser diode (LD) are provided on an upper surface of an insulating substrate to form a light emitting device. In this light emitting device, conductor wiring is provided on the upper and lower surfaces of the insulating substrate, and the conductor wiring provided on the lower surface is soldered to the conductor wiring provided on the mounting substrate to form a solder connection portion. Thus, it is electrically connected to the mounting substrate. Many of the materials for the insulating substrate described above use a resin, but recently, for the purpose of improving the heat resistance and light resistance of the light emitting device, a material using an insulating substrate is also provided. (For example, refer to Patent Document 1).

JP 2007-201041 A

  In the light-emitting device, thermal expansion and thermal contraction are repeated in the light-emitting device body by repeatedly increasing the temperature after starting lighting and decreasing the temperature after turning off the light. Generally, in a light emitting device using ceramics as a material for an insulating substrate, there is a difference in thermal expansion coefficient between the insulating substrate and the mounting substrate. For this reason, when the temperature rise and fall due to turning on and off of the light emitting device are repeated, the solder connecting portion that connects the light emitting device and the mounting substrate repeatedly receives stress due to the difference in thermal expansion coefficient. And in the connection part which receives the stress resulting from a thermal expansion coefficient difference, damages, such as a solder crack (crack), may arise. Such a solder crack causes an electrical and mechanical connection failure between the light emitting device and the mounting substrate, which causes a decrease in the reliability of the light emitting device.

Therefore, as one of the methods for improving the solder resistance, there is a terminal structure capable of forming a solder fillet. This terminal structure is a technique for enhancing the strength of the solder itself by scooping up the solder not only on the bottom surface of the terminal but also on the side surface of the terminal. Therefore, in a light-emitting device using a material having a thermal expansion coefficient different from that of a mounting substrate such as ceramics, a solder fillet is generally formed by providing a castellation.
However, a light emitting device provided with a castellation has many negative factors such as a complicated structure, an increase in the number of processing steps, an increased risk of plating defects on terminals, and an increase in price.

  An object of the embodiment of the present disclosure is to provide a package, a light-emitting device, a light-emitting module, and a method for manufacturing the package with high heat dissipation.

  A package according to an embodiment of the present disclosure includes an insulating substrate, a first wiring portion provided on an upper surface of the insulating substrate, and a second wiring provided on the lower surface of the insulating substrate and electrically connected to the first wiring portion. The second wiring part has a thickness of 100 μm or more downward from the lower surface of the insulating substrate, and a metal film mainly composed of gold is applied to the surface of the second wiring part. In addition, the area of the connection surface connected to the lower surface of the insulating substrate is different from the area of the tip surface in the thickness direction.

  A method for manufacturing a package according to an embodiment of the present disclosure includes a step of applying a first plating mainly composed of copper to a lower surface of an insulating substrate with a thickness of 100 μm or more, and a resist in a predetermined region on the lower surface of the first plating. Applying and etching, and applying a second plating mainly composed of gold on the etched first plating surface, and in the etching step, the step of connecting to the insulating substrate is performed. Etching is performed so that the areas of the connection surface of the first plating and the tip surface of the first plating in the thickness direction are different. Here, the thickness direction refers to the thickness direction of the first plating.

According to the present disclosure, it is possible to provide a package, a light emitting device, a light emitting module, and a method for manufacturing the package with high heat dissipation.
By setting the second wiring portion of the insulating substrate to a predetermined configuration, the solder adheres to the side surface and the bottom surface of the second wiring portion to form a solder fillet, thereby improving the bonding strength.

FIG. 3 is a perspective view schematically showing a part of the package according to the first embodiment of the present disclosure as a cross-section, looking up from below. FIG. 6 is a bottom view schematically showing a package according to a first embodiment of the present disclosure. FIG. 3 is a cross-sectional view schematically showing a portion of the package according to the first embodiment of the present disclosure, taken along line IIIA-IIIA in FIG. 2. FIG. 3 is a cross-sectional view schematically showing a portion of the package according to the first embodiment of the present disclosure, taken along line IIIB-IIIB in FIG. 2. It is a perspective view showing typically the state where a light emitting element was carried in the package concerning a 1st embodiment of this indication, and it was set as a light emitting device in a section. It is a perspective view showing typically the state where a light emitting device using a package concerning a 1st embodiment of this indication was mounted in a mounting substrate, and it was set as a light emitting module in a section. It is a figure which shows the manufacturing process of the package which concerns on 1st Embodiment of this indication, and is sectional drawing which shows typically the state which laminates | stacks a ceramic green sheet. It is a figure which shows the manufacturing process of the package which concerns on 1st Embodiment of this indication, and is sectional drawing which shows typically the state which provided the conductor material of the 1st wiring part and the via | veer in the ceramic green sheet. It is a figure which shows the manufacturing process of the package which concerns on 1st Embodiment of this indication, and is sectional drawing which shows typically the state which sintered the ceramic green sheet and formed the insulating substrate. It is a figure which shows the manufacturing process of the package which concerns on 1st Embodiment of this indication, and is sectional drawing which shows typically the state which apply | coated the metal plating used as a 2nd wiring part to the sintered insulating board | substrate. It is a figure which shows the manufacturing process of the package which concerns on 1st Embodiment of this indication, and is sectional drawing which shows typically the state which provided the resist in metal plating. It is a figure which shows the manufacturing process of the package which concerns on 1st Embodiment of this indication, and is sectional drawing which shows typically the state etched through the resist of metal plating. It is sectional drawing which shows typically the state which gave 2nd plating to the 2nd wiring part of the package which concerns on 1st Embodiment of this indication. It is sectional drawing which shows typically the state which mounted the light emitting element in the package which concerns on 1st Embodiment of this indication, and was set as the light-emitting device. It is sectional drawing which shows typically the state which mounted the light-emitting device which concerns on 1st Embodiment of this indication on the implementation board | substrate, and was set as the light-emitting module. FIG. 9 is a perspective view schematically showing a part of a package according to a second embodiment of the present disclosure as viewed from below with a cross-section. It is a bottom view showing typically the package concerning a 2nd embodiment of this indication. FIG. 9 is a cross-sectional view schematically showing a portion of the package according to the second embodiment of the present disclosure, taken along line IXA-IXA in FIG. 8. FIG. 9 is a cross-sectional view schematically showing a portion of the package according to the second embodiment of the present disclosure, taken along line IXB-IXB in FIG. 8. It is a perspective view which shows typically a part of light emitting module which mounted the light emitting device which provided the light emitting element in the package which concerns on 2nd Embodiment of this indication on the mounting board in cross section. It is a bottom view showing typically a package concerning a 3rd embodiment of this indication. It is a bottom view showing typically the package concerning a 4th embodiment of this indication.

  Hereinafter, the illumination device according to each embodiment will be described with reference to the drawings. The drawings referred to in the following description schematically show the respective embodiments, and therefore the scale, spacing, positional relationship, etc. of each member are exaggerated, or some of the members are not shown. There may be. Moreover, in the following description, the same name and code | symbol indicate the same or the same member in principle, and shall omit detailed description suitably. Furthermore, the directions shown in each figure indicate relative positions between components, and are not intended to indicate absolute positions.

<First Embodiment>
With reference to FIGS. 1 to 5, the package 1, the light emitting device S, and the light emitting module M according to the first embodiment will be described. FIG. 1 is a perspective view schematically showing a part of a package according to the first embodiment of the present disclosure as a cross-sectional view looking up from below. FIG. 2 is a bottom view schematically showing the package according to the first embodiment of the present disclosure. FIG. 3A is a package according to the first embodiment of the present disclosure, and is a cross-sectional view schematically showing a part taken along line IIIA-IIIA in FIG. 3B is a package according to the first embodiment of the present disclosure, and is a cross-sectional view schematically showing a part taken along line IIIB-IIIB in FIG. 2. FIG. 4 is a perspective view schematically showing a partial cross-section of a light emitting device in which a light emitting element is mounted on the package according to the first embodiment of the present disclosure. Furthermore, FIG. 5 is a perspective view schematically showing a partial cross-section of a light emitting module in which a light emitting device using the package according to the first embodiment of the present disclosure is mounted on a mounting substrate.

The light emitting module M includes at least one light emitting device S and a mounting substrate 20 on which the light emitting device S is mounted. The light emitting device S includes a light emitting element 10 and a package 1 on which the light emitting element 10 is mounted.
The package 1 includes an insulating substrate 2, a first wiring portion 3 provided on the upper surface of the insulating substrate 2, a second wiring portion 5 provided on the lower surface of the insulating substrate 2, a first wiring portion 3 and a second wiring portion. And a via 4 for electrically connecting the wiring part 5. The package 1 is a support member on which the light emitting element 10 is disposed on the first wiring part 3. Further, this package is mounted so as to be electrically connected to a mounting substrate 20 described later via the second wiring portion 5. In the package 1, the insulating substrate 2 is provided with a wall surface portion 2b on the periphery on the upper surface side of the substrate portion 2a. The light directly output from the light emitting element 10 and the light reflected by the wall surface portion 2b and output. Thus, the light from the light emitting element 10 is output. The package 1 is formed in a rectangle (square or rectangle) in plan view.

  The insulating substrate 2 includes a first lead 3a and a second lead 3b. The light emitting element 10 is disposed on the second lead 3b, and the light emitting element 10 and the first lead 3a are electrically connected via a wire. The insulating substrate 2 includes a substrate portion 2a on which the light emitting element 10 is installed, and a wall surface portion 2b that protrudes from the peripheral edge of the substrate portion 2a and is integrally formed, and is inside the wall surface portion 2b. It is formed in a concave shape having an opening in the center. The substrate portion 2a is configured to hold the first lead 3a and the second lead 3b and to be connected to the second wiring portion 5 via the vias 4a and 4b. Here, the wall surface portion 2b is formed in a cross-sectional shape that becomes thinner as the inner surface is inclined and separated from the substrate portion 2a.

  The insulating substrate 2 is formed of an insulating material that is integrally molded so as to enclose part of the first lead 3 a and the second lead 3 b of the first wiring portion 3. The insulating substrate 2 is made of, for example, PPA (polyphthalamide), PPS (polyphenylene sulfide), or a thermoplastic resin such as a liquid crystal polymer, an epoxy resin, a silicone resin, a modified epoxy resin, a urethane resin, or a phenol resin. A thermosetting resin such as can be used. The insulating substrate 2 is more preferably made of glass epoxy resin, ceramic, glass or the like. When ceramics is used for the insulating substrate 2, it is particularly preferable to use alumina, aluminum nitride, mullite, silicon carbide, silicon nitride, or the like.

  The first wiring unit 3 is electrically connected to the light emitting element 10. The first wiring portion 3 includes a first lead 3a and a second lead 3b as a pair of positive and negative electrodes. Here, the light emitting element 10 is configured to be placed on the second lead 3b. The first lead 3a and the second lead 3b are lead terminals for electrically connecting to an external power source or the like via the vias 4a and 4b and the second wiring part 5, and the shape, size, etc. are used. It is formed corresponding to the light emitting device to be manufactured and is not particularly limited. The first lead 3a and the second lead 3b are formed of Fe, Cu, Ni, Al, Ag, Au, and an alloy containing these.

  The via 4 electrically connects the first wiring part 3 and the second wiring part 5. The via 4 is configured by filling a conductive material in a through hole penetrating the insulating substrate 2. Here, as an example, four vias 4 are formed on the center line (IIIA-IIIA line) of the insulating substrate 2, the first vias 4 a and 4 a are provided on the first lead 3 a side, and the first vias 4 b are provided on the second lead 3 b side. Two vias 4b and 4b are formed. The number of vias 4 is not particularly limited, and heat from the light emitting element can be efficiently released to the outside by increasing the number of vias. When the via 4 is formed, for example, a through hole is formed in the substrate portion 2a, the through hole is closed with a conductive paste containing a conductive material, and then fired, or the substrate portion 2a is formed or fired. There is a method of penetrating with a drill or a drill later. In addition, as the conductive material, when the insulating substrate 2 is, for example, glass or ceramics as a base material, a metal conductive paste or the like generally used for the via 4 in the through hole at the time of firing is used. Material is used.

  The second wiring unit 5 is electrically connected to an external power source and supplies power to the light emitting element 10 mounted on the package 1. The second wiring portion 5 includes a first external lead 6 and a second external lead 7 as a pair of positive and negative electrodes. Here, the first external lead 6 and the second external lead 7 are formed so as to have a thickness of 100 μm or more from the lower surface (bottom surface) of the insulating substrate 2 by metal plating, and the surface is mainly composed of gold. Second plating (metal film 8) is applied. Further, the first external lead 6 and the second external lead 7 have different areas of the connection surfaces 6a and 7a connected to the lower surface of the insulating substrate 2 and the areas of the respective front end surfaces 6b and 7b in the thickness direction. Is formed. In the first external lead 6 and the second external lead 7, the area of the connection surfaces 6a and 7a connected to the lower surface of the insulating substrate 2 and the area of the respective front end surfaces 6b and 7b in the thickness direction are at least 5%. It is preferable that the difference is 10% or more, more preferably 15% or more. Thereby, the contact | adherence area with solder can be increased. The first external lead 6 is formed so that the length (diameter) L1 of the connecting portion 6A connected to the lower surface of the insulating substrate 2 is different from the length (diameter) L2 of the distal end portion 6B in the thickness direction. Has been. In the first external lead 6, the length (diameter) L1 of the connecting portion 6A connected to the lower surface of the insulating substrate 2 and the length (diameter) L2 of the distal end portion 6B in the thickness direction are 2% or more, preferably Is preferably 5% or more, more preferably 10% or more. Here, the diameter is not limited to the diameter of a circle or an ellipse, and indicates a diameter of a predetermined area.

The second wiring portion 5 preferably has an internal angle of 20 degrees to 70 degrees with respect to the bottom surface of the insulating substrate 2, and particularly preferably has an internal angle of 25 degrees to 65 degrees. Thereby, joining with solder can be made stronger. In particular, the second wiring part 5 can have a configuration in which a solder fillet is easily generated by having an internal angle of 20 degrees to 70 degrees with respect to the bottom surface of the insulating substrate 2.
Here, the “inner angle” refers to a point that is a half of the height of the second wiring part 5 on the side surface of the second wiring part 5 when viewed in a cross section perpendicular to the bottom surface of the insulating substrate 2, and insulation. It means the angle inside the straight line connecting the bottom surface of the insulating substrate 2 and the junction point of the second wiring part 5 and the straight line of the bottom surface of the insulating substrate 2.

  The first external lead 6 is formed in a substantially rectangular ring shape. The first external lead 6 is formed so as to have an extended portion 6 d extending toward the outer surface of the package 1 on one side of the rectangular ring. The first external lead 6 is formed such that a connection surface 6a is formed at a position entering the inside from the outer surface of the package 1, and only two extending portions 6d extend to the outer surface. The first external lead 6 is formed so that the area of the front end surface 6b in the thickness direction is smaller than the connection surface 6a connected to the lower surface of the insulating substrate 2. Here, the first external lead 6 is configured such that the length of the distal end portion 6B is shorter than the length L1 of the connection portion 6A in a sectional view in the thickness direction. That is, the first external lead 6 is configured so that the diameter decreases (shortens) from the connection portion 6A toward the tip portion 6B.

For example, the first external lead 6 has copper or copper as a main component, and the surface thereof is provided with a metal whose main component is gold. The first external lead 6 is formed by copper or first plating mainly containing copper, and second plating (metal film 8) mainly containing gold is applied on the surface thereof. This metal film 8 is for facilitating adhesion of a connecting material such as solder Hd when electrical connection with a mounting substrate 20 described later is performed.
Here, “the length of the connecting portion 6A” or “the diameter of the connecting portion 6A” means the length of a straight line passing through the center of the ring width formed in a rectangular ring shape and extending from one side surface 6c to the other side surface 6c. (See FIGS. 3A and 3B). Further, the connecting portion 6A is a portion closer to the connecting surface 6a than the center in the thickness direction including the connecting surface 6a. And let the front-end | tip part 6B be a part of the front end surface 6b side rather than the center of the thickness direction containing the front end surface 6b. The sectional view in the thickness direction means a state in which a section obtained by cutting the second wiring part 5 (the first external lead 6 and the second external lead 7) from the vertical direction is visible.

The first external lead 6 has the tip surface 6b smaller than the connection surface 6a (by the diameter becoming smaller (shorter) from the connection portion 6A toward the tip portion 6B), and excludes the end surface of the extension portion 6d. The side surface 6c of the portion is inclined from the connection surface 6a toward the tip surface 6b. Therefore, the first external lead 6 can easily adhere to the solder described later on the side surface 6c and can serve as a solder fillet.
The second external lead 7 is formed in a rectangular ring shape and includes a connection surface 7a, a tip surface 7b, a side surface 7c, and extending portions 7d and 7d, and a second plating (metal film 8) is applied to the surface. Since the configuration is symmetrical to the first external lead 6 already described and has the same shape, size, material, and configuration, description thereof is omitted. However, the second external lead 7 may have a shape, size, material, and configuration different from those of the first external lead 6.
The first external lead 6 and the second external lead 7 are both formed in the thickness direction from the bottom surface (back surface) of the insulating substrate 2 in the thickness direction of 100 to 150 μm, preferably in the range of 110 to 130 μm. ing. By setting the first external lead 6 and the second external lead 7 to a predetermined thickness, solder adheres to the side surfaces of the first external lead 6 and the second external lead 7 and efficiently dissipates heat from the light emitting element to the outside. can do.

  In the configuration of the package 1 described above, the second wiring portion 5 has a distal end surface 6b having a smaller area than the connection surface 6a of the first external lead 6 and a distal end from the connection surface 7a of the second external lead 7. Since the area of the surface 7b is reduced, the side surfaces 6c and 7c are inclined and the surface area is increased. Therefore, the package 1 has high heat dissipation, and the side surfaces 6c and 7c of the second wiring part 5 are inclined, so that solder fillets can be provided on the side surfaces 6c and 7c.

Next, the light emitting element 10 mounted on the package 1 will be described.
As shown in FIG. 4, the light emitting element 10 is a semiconductor element such as a light emitting diode (LED) or a semiconductor laser (LD), and the semiconductor layer constitutes a light emitting portion. The semiconductor layer is formed, for example, on the c-plane (main surface) of the sapphire substrate via a buffer layer, and has a structure in which an n-type semiconductor layer, an active layer, and a p-type semiconductor layer are stacked in this order from the bottom. doing. The active layer has a quantum well structure having, for example, a well layer (light emitting layer) and a barrier layer. The semiconductor layer is a group III-V nitride semiconductor (In _X Al _Y Ga _1- XYN (0 ≦ X, 0 ≦ Y, X + Y <1)) that is GaN, AlN, InN, or a mixed crystal thereof. It is preferable that it is comprised.

  In addition, you may comprise the light emitting element 10 so that the light of a desired wavelength may be irradiated through a wavelength conversion member. The wavelength conversion member covers the light emitting element 10 and converts the irradiation light from the light emitting element 10 into light having a different wavelength. The wavelength conversion member is, for example, a phosphor particle, and is provided so as to cover the light emitting element 10 via a binder such as a resin. Moreover, in the light emitting element 10, it is good also as a structure which provides the glass plate which covers the recessed part opening of the package 1, and contains the wavelength conversion member in the glass plate.

  As shown in FIG. 4, the light emitting device S is configured by joining a light emitting element 10 to a package 1 via an adhesive and electrically connecting with a wire. In the light emitting device S, the light emitting element 10 in the recess of the package 1 may be sealed with a translucent member such as a sealing resin. The light emitting device S may have a configuration in which a light transmitting member in the recess of the package 1 is provided and a glass plate is provided in the opening of the recess.

Furthermore, as a configuration of the light emitting module M, a mounting substrate 20 for mounting the light emitting device S will be described.
As shown in FIG. 5, the shape of the mounting substrate 20 is not particularly limited, but here, the mounting substrate 20 is formed in a rectangular shape, and the mounting region 21 of the light emitting device S is formed in the center. In the mounting area 21 of the mounting substrate 20, wiring that can be electrically connected when the light emitting device S is mounted is formed in advance. For the mounting substrate 20, it is preferable to use an insulating material as a material, and it is preferable to use a material that hardly transmits light emitted from the light emitting device S, external light, or the like. The mounting substrate 20 may be a material having a certain degree of strength or a flexible material.

  The mounting substrate 20 has a wiring portion (including a relay wiring portion) and a pad electrode for electrical connection with the outside along the periphery of the mounting region 21. Furthermore, the wiring part of the mounting substrate 20 may be configured to be connected to a protective element (for example, a Zener diode) that suppresses application of excessive voltage. The pad electrode may be formed on the back surface opposite to the mounting area 21 of the mounting substrate 20.

  Further, the number of light emitting devices S mounted on the mounting substrate 20 may be one or more. For example, the light emitting devices S are arranged on the wiring pattern in the mounting region 21 of the mounting substrate 20 so as to be aligned in the matrix direction (vertical and horizontal directions). It may be a configuration. Further, when the light emitting device S mounted on the mounting substrate 20 is mounted via solder, the side surface 6c of the first external lead 6 and the side surface 7c of the second external lead 7 which are the second wiring part 5 of the package are inclined. Therefore, solder Hd can easily adhere to the side surfaces 6c and 7c, and a solder fillet can be formed. In the light emitting module M, when it is confirmed whether the light emitting device S is properly bonded to the mounting substrate 20, it is visually recognized from the outside that solder fillets are formed on the side surfaces 6c and 7c of the package 1 in the light emitting device S. It can be detected from the video, and it is easy to judge whether the product is good or bad. Further, in the light emitting module, the solder fillet is formed, so that the connection strength is high even when the stress due to the difference in thermal expansion coefficient due to the on / off of the light emitting element 10 is repeatedly received, and the cause of the occurrence of solder cracks is extremely low. is there.

  Next, a manufacturing method of the package 1, a manufacturing method of the light emitting device S, and a manufacturing method of the light emitting module will be described. FIG. 6A is a diagram illustrating a manufacturing process of the package according to the first embodiment of the present disclosure, and is a cross-sectional view schematically illustrating a state in which ceramic green sheets are stacked. FIG. 6B is a diagram illustrating a manufacturing process of the package according to the first embodiment of the present disclosure, and is a cross-sectional view schematically illustrating a state in which the first wiring portion and the via conductor material are provided on the ceramic green sheet. FIG. 6C is a diagram illustrating a manufacturing process of the package according to the first embodiment of the present disclosure, and is a cross-sectional view schematically illustrating a state in which an insulating substrate is formed by sintering a ceramic green sheet. FIG. 6D is a diagram illustrating a manufacturing process of the package according to the first embodiment of the present disclosure, and is a cross-sectional view schematically illustrating a state in which a metal plating serving as a second wiring portion is applied to a sintered insulating substrate. It is. FIG. 6E is a diagram illustrating a manufacturing process of the package according to the first embodiment of the present disclosure, and is a cross-sectional view schematically illustrating a state in which a resist is provided on metal plating. FIG. 6F is a diagram illustrating a manufacturing process of the package according to the first embodiment of the present disclosure, and is a cross-sectional view schematically illustrating a state of being etched through a metal plating resist. FIG. 6G is a cross-sectional view schematically illustrating a state in which the second plating is applied to the second wiring portion of the package according to the first embodiment of the present disclosure. FIG. 6H is a cross-sectional view schematically illustrating a state where the light emitting device is mounted on the package according to the first embodiment of the present disclosure to obtain a light emitting device. FIG. 6I is a cross-sectional view schematically showing a state where the light emitting device according to the first embodiment of the present disclosure is mounted on an implementation substrate to form a light emitting module.

First, a method for manufacturing the package 1 will be described.
In the package 1, an insulating substrate 2 for mounting the light emitting element 10 is made of ceramics. The insulating substrate 2 can be formed with a portion corresponding to the substrate portion 2a and a portion corresponding to the wall surface portion 2b by, for example, a ceramic green sheet Gs having a thickness of typically 100 μm to 400 μm. The ceramic green sheet Gs is formed by kneading ceramic powder and an organic binder into a sheet shape. That is, the insulating substrate 2 can be formed in a concave shape including the substrate portion 2a and the wall surface portion 2b by laminating the ceramic green sheets Gs in a desired shape. The ceramic green sheet Gs is configured such that a plurality of packages 1 are formed on the sheet surface.

  In addition, a through hole ha of the first via 4a and the second via 4b, which are vias 4, is formed in advance in the ceramic green sheet in the portion that becomes the substrate portion 2a, and the through hole ha is filled with the conductive member Ct. Thus, the first via 4a and the second via 4b can be formed. Further, as the first wiring part 3, a member having high reflection efficiency such as a metal such as silver, copper, and aluminum is installed on the ceramic green sheet Gs, so that the first wiring part 3 is also combined with the insulating substrate 2. Can be formed. The first wiring part 3 can also use a refractory metal such as tungsten or molybdenum. When a refractory metal is used, a wiring pattern can be formed by mixing metal particles with a resin binder, coating or printing on the ceramic green sheet, and firing together with the ceramic green sheet Gs.

The ceramic material for the ceramic green sheet Gs is, for example, 90 to 96% by weight of the raw material powder is alumina, and 4 to 10% by weight of sintering aids such as clay, talc, magnesia, calcia and silica are added. Then, the insulating substrate 2 can be formed by sintering in a temperature range of 1500 to 1700 ° C. As another example, the ceramic material includes 40 to 60% by weight of the raw material powder as alumina, and 60 to 40% by weight of borosilicate glass, cordierite, forsterite, mullite, etc. as a sintering aid. Can be sintered in the temperature range of 800 to 1200 ° C. to form the insulating substrate 2. Of course, the material of the ceramic insulating substrate 2 is not limited as long as it can be formed. Further, _{ceramics, Cr 2 O 3, MnO 2} , etc. TiO 2, _Fe 2 _{O 3} can also be a dark color by incorporating in the ceramic green sheet itself.

After the insulating substrate 2 is formed by sintering the ceramic green sheet Gs, the second wiring portion 5 is provided on the insulating substrate 2 by the first plating Me. In the case of forming the second wiring portion 5, as an example, the first plating Me containing copper as a main component is applied to the bottom surface (back surface) of the insulating substrate 2 to a thickness of 100 μm or more (for example, in the range of 100 to 150 μm). Then, by providing a resist Re at a predetermined position of the first plating Me and performing etching, the first external lead 6 and the second external lead 7 as the second wiring part 5 are formed on the insulating substrate 2 in a desired shape (for example, , Rectangular annular shape (see FIG. 2). By adjusting the etching time of the first external lead 6 and the second external lead 7, the area of the connection surfaces 6a and 7a on the insulating substrate 2 side becomes larger than the area of the front end surfaces 6b and 7b in the thickness direction. I am doing so.
Subsequently, the resist provided on the front end surfaces 6b, 7b of the first external lead 6 and the second external lead 7 is removed from the insulating substrate 2, and the surfaces of the first external lead 6 and the second external lead 7 are removed. A second plating (metal film 8) containing gold as a main component is provided. Then, the individual substrates 1 are formed by cutting the insulating substrate 2 into pieces.

  Next, when the package 1 is formed, the light emitting element 10 is mounted on the second lead 3b to be the first wiring portion 3 of the package through a die bond member or the like. The light emitting element 10 is electrically connected to the first wiring portion 3 by connecting the element electrode on the upper surface thereof to the first lead 3a and the second lead 3b with wires. The light emitting device S is configured by electrically connecting the light emitting element 10 to the package 1. The light emitting element 10 and the second lead 3b can be bonded with a thermosetting resin or the like. Specifically, an epoxy resin, an acrylic resin, a polyimide resin, etc. are mentioned. In addition, the light emitting device S may have a configuration in which a sealing resin or a window member that covers the sealing resin is provided. Furthermore, when providing sealing resin and a window member, you may add a diffusion material and a wavelength conversion member.

  After the light emitting device S is separated into pieces, the light emitting device S is mounted on the mounting substrate 20 via the second wiring portion 5 with the solder Hd which is a connection material. Thus, the light emitting module M is configured. The second wiring portion 5 of the light emitting device S has a small diameter from the connection surface 6a of the first external lead 6 toward the distal end surface 6b and from the connection surface 7a of the second external lead 7 toward the distal end surface 7b. In this way, the connecting surfaces 6a and 7a and the tip surfaces 6b and 7b are formed with different areas. Therefore, the solder Hd adheres to the side surface 6c of the first external lead 6 and the side surface 7c of the second external lead 7 on which the second plating is performed, and can play a role equivalent to the solder flux.

Second Embodiment
Next, a second embodiment will be described with reference to FIGS. In the second embodiment, the cross-sectional shape of the second wiring portion is different from that of the first embodiment, and the cross-sectional shape of the second wiring portion will be mainly described. The configuration of the second wiring portion, etc., or other configurations Since this is the same as that of the first embodiment, the same reference numerals are given and description thereof is omitted as appropriate.
FIG. 7 is a perspective view schematically showing a part of a package according to the second embodiment of the present disclosure as a cross-section, looking up from below. FIG. 8 is a bottom view schematically showing a package according to the second embodiment of the present disclosure. 9A is a package according to the second embodiment of the present disclosure, and is a cross-sectional view schematically showing a part taken along line IXA-IXA in FIG. 9B is a package according to the second embodiment of the present disclosure, and is a cross-sectional view schematically showing a part taken along line IXB-IXB in FIG. FIG. 10 is a perspective view schematically showing, in section, a part of a light emitting module in which a light emitting device provided with a light emitting element in a package according to a second embodiment of the present disclosure is mounted on a mounting substrate.

The package 1A includes an insulating substrate 2, a first wiring portion 3 provided on the upper surface of the insulating substrate 2, a second wiring portion 15 provided on the lower surface of the insulating substrate 2, a first wiring portion 3 and a second wiring portion. Vias 4 (first vias 4a and second vias 4b) that electrically connect the wiring part 15 are provided.
The second wiring portion 15 is for electrically connecting the first via 4a and the second via 4b and an external power source to supply power to the light emitting element 10 mounted on the package 1A. The second wiring portion 15 includes a first external lead 16 and a second external lead 17 as a pair of positive and negative electrodes, and a second plating (metal film 8) mainly composed of gold is applied to the surface. Further, the first external lead 16 and the second external lead 17 have different areas of the connection surfaces 16a and 17a connected to the lower surface of the insulating substrate 2 and the areas of the respective front end surfaces 16b and 17b in the thickness direction. Is formed. That is, the first external lead 16 is formed so that the length (diameter) L1 of the connecting portion 16A connected to the lower surface of the insulating substrate 2 is different from the length (diameter) L2 of the distal end portion 16B in the thickness direction. Has been.

  The second wiring portion 15 preferably has an internal angle of 110 degrees to 160 degrees with respect to the bottom surface of the insulating substrate 2, and particularly has an internal angle of 115 degrees to 155 degrees. preferable. Thereby, joining with solder can be made stronger. In particular, the second wiring portion 15 has an internal angle of 110 degrees to 160 degrees with respect to the bottom surface of the insulating substrate 2, so that the second wiring section 15 can be caught and the light emitting device can be prevented from being detached. Here, the “inner angle” refers to a point that is a half of the height of the second wiring portion 15 on the side surface of the second wiring portion 15 when viewed in a cross section perpendicular to the bottom surface of the insulating substrate 2, and insulation. It means the angle inside the straight line connecting the bottom surface of the insulating substrate 2 and the junction point of the second wiring part 15 and the straight line of the bottom surface of the insulating substrate 2.

  For example, the first external lead 16 is formed in a substantially rectangular ring shape at an inner position from the outer edge of the insulating substrate 2 by copper or a first plating mainly composed of copper, and is connected to the lower surface of the insulating substrate 2. It is formed so that the area of the front end surface 16b in the thickness direction is larger than the surface 16a. Here, the first external lead 16 is configured such that the length L2 of the distal end portion 16B is longer than the length L1 of the connection portion 16A in a sectional view in the thickness direction. That is, the first external lead 16 is configured to have a larger (longer) diameter from the connecting portion 16A toward the distal end portion 16B.

  Here, “the length of the connecting portion 16A” or “the diameter of the connecting portion 16A” means the length L1 of a straight line passing through the center of the ring width formed in a rectangular ring shape and extending from one side surface 16c to the other side surface 16c. , L2 (see FIG. 8). Further, the connecting portion 16A is a portion closer to the connecting surface 16a than the center in the thickness direction including the connecting surface 6a. The sectional view in the thickness direction means a state in which a section obtained by cutting the second wiring portion 15 (the first external lead 16 and the second external lead 17) from the vertical direction is visible.

  The first external lead 6 has a distal end surface 6b larger than the connection surface 6a (by increasing (longer) in diameter from the connection portion 6A toward the distal end portion 6B), and excludes the end surface of the extension portion 16d. The side surface 16c of the portion is inclined so as to spread from the connection surface 16a toward the tip surface 16b. Therefore, the first external lead 16 can easily adhere to the solder described later on the side surface 16c and can serve as a solder fillet.

  The second external lead 17 is formed in a rectangular ring shape, and includes a connection surface 17a, a tip surface 17b, a side surface 17c, and extending portions 17d and 17d, and a second plating (metal film 8) is provided on the surface. Since the configuration is symmetrical to the first external lead 16 already described and has the same shape, size, and configuration, description thereof is omitted. The first external lead 16 and the second external lead 17 are both formed in the thickness direction from the bottom surface (back surface) of the insulating substrate 2 in the thickness direction of 100 to 150 μm, or preferably in the range of 110 to 130 μm. ing.

When the second wiring portion 15 is formed, the processing time for etching through the resist Re is longer in the manufacturing direction than the second wiring portion 15 of the first embodiment. Therefore, the second wiring portion 15 has a diameter (length) smaller than that of the distal end portion 16B side including the distal end surface 16b because the connection portion 16A side including the connection surface 16a of the first external lead 16 is etched away. (The same applies to the second external lead 17).
Note that the shape and size of the resist Re for forming the first external lead 16 and the second external lead 17 are preset in the areas of the end faces 16b and 17b and the areas of the connection faces 16a and 17a by etching. It is formed to have a shape and size.
Thereafter, the resist Re is removed, and the second plating is performed in the same manner as described above to manufacture the package 1A.

In the manufactured package 1A, the light emitting element 10 is installed. Then, the light emitting device S1 is configured by electrically connecting the light emitting element 10 to the first wiring unit 3 with a wire. Further, the light emitting module M1 is configured by mounting the light emitting device S1 on the mounting substrate 20. The light emitting module M1 can form a solder fillet because the side surfaces 16c and 17c are inclined when the package 1A of the light emitting device S1 is mounted on the second wiring portion 15 via the solder Hd. Therefore, the light emitting module M1 has a connection strength that allows easy confirmation of the mounting state of the light emitting device S1 and can withstand repeated stress caused by the difference in coefficient of thermal expansion.
The package 1A according to the second embodiment can increase the bonding strength with the solder by providing the catch. Further, since the bottom area of the package 1A can be increased, the stability is excellent.

<Third Embodiment and Fourth Embodiment>
Next, the packages 1B and 1C according to the third embodiment and the fourth embodiment will be described with reference to FIGS. 11A and 11B. The package 1B according to the third embodiment is a modification of the shape of the second wiring portion 5 of the package 1 described with reference to FIG. 1, and the package 1C according to the fourth embodiment is the package 1A described with reference to FIG. The shape of the second wiring portion 5 is modified, and the deformed portion will be mainly described. FIG. 11A is a bottom view schematically illustrating a package according to the third embodiment of the present disclosure, and FIG. 11B is a bottom view schematically illustrating the package according to the fourth embodiment of the present disclosure.
The package 1B includes an insulating substrate 2, a first wiring portion 3 provided on the upper surface of the insulating substrate 2, a second wiring portion 25 provided on the lower surface of the insulating substrate 2, a first wiring portion 3 and a second wiring portion. Vias 4 (first vias 4a and second vias 4b) that electrically connect the wiring part 25 are provided. The second wiring portion 25 includes a first external lead 26 and a second external lead 27 as a pair of positive and negative electrodes, and a second plating (metal film 8) mainly composed of gold is applied to the surface. In the first external lead 26, a groove 26e is formed on the side surface 26c on which the extending portion 26d is formed from the connection surface 26a toward the distal end surface 26b.

  It is preferable that at least one groove portion 26e is formed in the side surface 26c corresponding to one side of the package 1B (two locations in the drawing). The groove portion 36e is formed to be a curved surface that is recessed from the side surface 26c in the in-ring direction of the first external lead 26. Further, the groove 26e is formed here so as to have the same groove width and the same groove depth in the thickness direction. The first external lead 26 plays the same role as the groove 26e between the extended portions 26d and 26d. Further, the second external lead 27 is formed in a shape symmetrical to the first external lead 26.

  Then, as a method for manufacturing the package 1B, for the second wiring part 25, the resist Re is shaped so as to form the groove parts 26e and 27e, thereby forming the groove parts 26e and 27e together with the side faces 26c and 27c by etching. It becomes possible to do. The package 1C can be manufactured by performing the other steps as described above.

Next, as shown in FIG. 11B, the package 1C includes the insulating substrate 2, the first wiring portion 3 provided on the upper surface of the insulating substrate 2, the first wiring portion 3, and the first vias 4a and 4a. And a second wiring portion 35 provided on the lower surface of the insulating substrate 2. The second wiring portion 35 includes a first external lead 36 and a second external lead 37 as a pair of positive and negative electrodes, and a second plating (metal film 8) mainly composed of gold is provided on the surface. In the first external lead 36 and the second external lead 37, grooves 36e and 37e are formed on the side surfaces 36c and 37c formed with the extending portions 36d and 37d from the connection surfaces 36a and 37a toward the tip surfaces 36b and 37b. Yes. The grooves 36e and 37e are the same as those shown in FIG. 11A described above except that the inclination direction extends from the connection surface 36a toward the front end surface 36b or from the connection surface 37a toward the front end surface 37b. It is configured in the same way.
As a manufacturing method of the package 1C, the second wiring portion 35 can be formed together with the side surfaces 36c and 37c by etching by making the shape of the resist Re so as to form the groove portions 36e and 37e. Further, the inclination direction of the side surfaces 36c and 37c and the groove portions 36e and 37e can be changed by extending the etching processing time as compared with that shown in FIG. 11A.

  The packages 1B and 1C are configured such that grooves 26e, 27e, 36e, and 37e are formed on the side surfaces 26c, 27c, 36c, and 37c on one side of the outer periphery where the extending portions 26d, 27d, 36d, and 37d are formed. As described above, the groove portions 26e, 27e, 36e, and 37e may be formed on the side surfaces 26c, 27c, 36c, and 37c on all sides of the outer periphery and the inner periphery. Further, the packages 1B and 1C are configured so that the groove depths of the groove portions 26e, 27e, 36e, and 37e gradually become deeper from the connection surfaces 26a, 27a, 36a, and 37a toward the front end surfaces 26b, 27b, 36b, and 37b. Or you may form so that it may become shallow gradually. Further, the packages 1B and 1C are configured so that the groove widths of the groove portions 26e, 27e, 36e, and 3e gradually decrease from the connection surfaces 26a, 27a, 36a, and 37a toward the front end surfaces 26b, 27b, 36b, and 37b, or Alternatively, it may be formed to gradually increase. And although the groove parts 26e, 27e, 36e, and 37e were demonstrated as a curved surface, the groove shape which consists of a plane which bends in the groove center may be sufficient.

Moreover, although the package 1, 1A-1C demonstrated above demonstrated the shape of the 2nd wiring part 5,15,25,35 as a rectangular ring shape, for example, it is set as a rectangle, side 6c, 7c, 16c, 17c , 26c, 27c, 36c, and 37c are not limited as long as the solder fillet can be formed by inclining.
The packages 1 and 1A to 1C may be formed with three or more extending portions 6d, 7d, 16d, 17d, 26d, 27d, 36d, and 37d, or may not be provided at all.
Further, the package is described as being separated after the light emitting element is provided. However, the package may be separated before the light emitting element is provided.
Since the package 1A according to the third embodiment can have a wide contact area with the solder, the bonding strength with the solder can be increased.

Hereinafter, a package and a light emitting device according to an example will be described with reference to FIGS. However, the description overlapping with the content described in the first embodiment may be omitted.
The package 1 includes an insulating substrate 2, a first wiring portion 3 provided on the upper surface of the insulating substrate 2, a second wiring portion 5 provided on the lower surface of the insulating substrate 2, a first wiring portion 3 and a second wiring portion. And a via 4 for electrically connecting the wiring part 5. The package 1 has a substantially rectangular shape, and has an outer shape of 4.1 mm in length, 4.0 mm in width, and 1.0 mm in height. The package 1 has a concave shape and has an inner shape of 2.5 mm in length, 2.5 mm in width, and 0.3 mm in depth.
The insulating substrate 2 includes a first wiring part 3 and a second wiring part 5 mainly composed of copper. On the surface of the first wiring part 3 and the surface of the second wiring part 5, a metal film 8 is formed by plating with gold (gold ratio is 99% by weight or more). The material of the insulating substrate 2 is alumina. The vias 4a and 4b use copper.

The light emitting element 10 is disposed on the second lead 3b of the first wiring part 3 on the bottom surface of the concave shape. The light emitting element 10 uses a blue light emitting LED having an emission peak at 455 nm.
The light emitting element 10 disposed in the recess is covered with a sealing member. The sealing member is a silicone resin. This sealing member contains a phosphor that converts the wavelength of light from the light emitting element 10. The phosphor emits yellow light, and is, for example, a YAG phosphor or a silicate phosphor.
The first external lead 6 and the second external lead 7 have an internal angle of about 30 degrees with respect to the bottom surface of the insulating substrate 2.
As described above, by providing the first external lead 6 and the second external lead 7 large in thickness, the bonding strength with the mounting substrate 20 can be increased. Moreover, the creeping of the solder to the side surface of the package 1 can be prevented. In addition, the light emitting device can improve heat dissipation and increase the bonding strength with solder.

  The package and the light-emitting device of the embodiment can be used for a lighting device, a vehicle-mounted light-emitting device, and the like.

1, 1A, 1B, 1C package 2 insulating substrate 2a substrate portion 2b wall surface portion 3 first wiring portion 3a first lead 3b second lead 4 via 5, 15, 25, 35 second wiring portion 6, 16, 26, 36 1st external lead 6A, 7A, 16A, 17A Connection part 6B, 7B, 16B, 17A Tip part 6a, 16a, 26a, 36a Connection surface 6b, 16b, 26b, 36b Tip surface 6c, 16c, 26c, 36c Side face 6d , 16d, 26d, 36d Extension portion 26e, 27e, 36e, 37e Groove portion 7, 17, 27, 37 Second external lead 7a, 17a, 27a, 37a Connection surface 7b, 17b, 27b, 37b Tip surface 7c, 17c, 27c, 37c Side surface 7d, 17d, 27d, 37d Extension part 8 Metal film 10 Light emitting element 20 Mounting substrate 21 Mounting area 26e, 36e, 27e, 37e Groove Ct Conductive member Gs Ceramic green sheet Hd Solder M, M1 Light emitting module Re resist S, S1 Light emitting device ha Through hole

Claims (15)

An insulating substrate;
A first wiring portion provided on the upper surface of the insulating substrate;
A second wiring portion that is electrically connected to the first wiring portion and provided on a lower surface of the insulating substrate;
The second wiring portion has a thickness of 100 μm or more downward from the lower surface of the insulating substrate, a metal film mainly composed of gold is applied to the surface of the second wiring portion, and the insulating substrate The package is formed so that the area of the connecting surface connected to the lower surface of the substrate is different from the area of the front end surface in the thickness direction. An insulating substrate;
A first wiring portion provided on the upper surface of the insulating substrate;
A second wiring portion that is electrically connected to the first wiring portion and provided on a lower surface of the insulating substrate;
The second wiring portion has a thickness of 100 μm or more downward from the lower surface of the insulating substrate, a metal film mainly composed of gold is applied to the surface of the second wiring portion, and a cross section in the thickness direction The package formed so that the length of the connecting portion connected to the lower surface of the insulating substrate is different from the length of the distal end portion in the thickness direction.   3. The package according to claim 2, wherein the second wiring part is formed so that a diameter thereof decreases from the connection part toward the tip part in a cross-sectional view in the thickness direction.   The package according to claim 2, wherein the second wiring part is formed so that a diameter thereof increases from the connection part toward the tip part in a cross-sectional view in the thickness direction.   The package according to claim 1, wherein the second wiring portion is formed so that an area decreases from the connection surface toward the tip surface.   The said 2nd wiring part is formed so that the said connection surface may be arrange | positioned inside from the outer edge of the lower surface of the said insulated substrate, and an area may become large toward the said front end surface from the said connection surface. package.   The package according to claim 1, wherein the second wiring portion has an inner angle of 20 degrees to 70 degrees, or 110 degrees to 160 degrees with respect to the bottom surface of the insulating substrate. .   The groove portion is formed in the second wiring portion from the connection surface toward the tip end surface, and the groove portion is provided on the outer periphery in a plan view. Package as stated.   The package according to any one of claims 1 to 8, wherein the second wiring portion has copper as a main component.   The package according to any one of claims 1 to 9, wherein the insulating substrate is made of ceramics.   The said 1st wiring part and the said 2nd wiring part are electrically connected through the via | veer which penetrates the said insulating substrate in the thickness direction, It is any one of Claims 1-10. package.   A light-emitting device comprising: the package according to any one of claims 1 to 11; and a light-emitting element electrically connected to the first wiring portion of the insulating substrate.   A light emitting module comprising: the light emitting device according to claim 12; and a mounting substrate on which the light emitting device is mounted via the second wiring portion. The mounting substrate and the light emitting device are mounted via the second wiring portion by solder,
The light emitting module according to claim 13, wherein the solder is provided from a side surface to a tip surface of the second wiring portion. Applying a first plating mainly composed of copper to the lower surface of the insulating substrate with a thickness of 100 μm or more;
Applying a resist to a predetermined region of the lower surface of the first plating and etching;
Performing a second plating mainly composed of gold on the surface of the etched first plating,
The manufacturing method of the package which etches so that the area of the connection surface of the said 1st plating connected to the said insulating substrate and the front end surface of the said 1st plating of the thickness direction may differ in the said process to etch.

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