JP2017034224A - Electronic module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic module whose mounting reliability of a connection bump is improved.SOLUTION: Among electrode pads 2a for a signal positioned at an outermost periphery of an array out of a plurality of electrode pads 2a provided at a principal plane of an insulation substrate 1, those disposed in a region where a reinforcement resin 6 is not provided out of the outermost periphery of the principal plane of the insulation substrate 1 are positioned inside of those disposed in a region where the reinforcement resin 6 is provided.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an electronic module in which a reinforcing resin is disposed between an insulating substrate on which electronic components are mounted and an external circuit board.

  Semiconductor integrated circuit elements such as IC and LSI, LD (semiconductor laser diode), LED (light emitting diode), PD (photodiode), optical semiconductor elements such as image sensors, and other various electronic components are mounted on a wiring board, etc. Thus, an electronic module is formed and mounted as a component in various electronic devices. The following are frequently used as this wiring board. That is, an insulating substrate such as a rectangular shape made of a glass-ceramic sintered body, etc., and a plurality of electrode terminals provided on one main surface of the insulating substrate for electrically connecting an electronic component and an external circuit board, One having a plurality of connection pads for external connection provided on the other main surface of the insulating substrate is often used. The electrode terminals and the connection pads are electrically connected to each other corresponding to signals and the like.

  On the external circuit board to which the wiring board is electrically and mechanically connected, a plurality of terminals are arranged so as to face the plurality of connection pads provided on the main surface of the insulating board, and face each other. Each connection pad and terminal are electrically connected via connection bumps made of metal such as solder to form an electronic module.

  In recent years, there has been a demand for a larger insulating substrate as the wiring density of electronic components such as semiconductor integrated circuit elements has increased. When the insulating substrate becomes larger, when the temperature of the electronic module changes, the coefficient of linear thermal expansion between the insulating substrate and the external circuit substrate is increased at the outer peripheral portion (especially the corner portion and its vicinity) of the main surface of the insulating substrate. The thermal stress caused by the difference is larger than before. This stress increases the possibility of breakage such as cracks in the connection bumps and the periphery thereof.

  Therefore, in order to suppress this destruction, a reinforcing resin (so-called underfill) may be provided between the insulating substrate and the external circuit substrate.

JP 2000-299356 A Japanese Patent Laid-Open No. 11-163049 JP 2008-218531 A

  Regarding the above-mentioned reinforcing resin, in the case where a so-called repair process is required to replace an electronic component when a defect is found in the electronic component after the electronic module is mounted, It may be provided in a part of the outer periphery between the external circuit board. In this case, the reinforcing resin is provided at least in a portion where the stress is particularly likely to be concentrated, that is, in a portion overlapping the corner portion of the insulating substrate in plan view.

  However, when the reinforcing resin is provided on a part of the outer peripheral portion between the insulating substrate and the external circuit substrate such as the corner portion, the inventor of the present invention may cause the following problem. As a result of prediction and examination, the present invention has been completed.

  That is, in the above case, since there is a portion where the reinforcing resin is not provided in the outer peripheral portion between the insulating substrate and the external circuit board, even if the stress is a relatively small region, the reinforcing resin There is a possibility that a new problem that a crack such as a breakage occurs in the connection bump located in the vicinity of the portion where the metal layer is not provided and the periphery thereof may occur.

  An electronic module according to one aspect of the present invention includes an insulating substrate having a rectangular main surface, and a plurality of electrode pads for signals, reference potentials, and power supplies arranged on the main surface of the insulating substrate. Each of the plurality of connection pads, the external circuit board having a plurality of terminals disposed opposite to the plurality of connection pads, and the plurality of connection pads and the plurality of terminals. A plurality of connection bumps electrically connecting the connection pads and the plurality of terminals, respectively, and at least a portion overlapping the corner portion of the main surface of the insulating substrate in plan view and the external circuit And the signal electrode pad located on the outermost periphery of the array among the plurality of electrode pads is disposed in a region where the reinforcement resin is not provided. Those, characterized in that the reinforcing resin is located inside the ones arranged in the area provided.

  In the electronic module according to one aspect of the present invention, the signal electrode pad located on the outermost periphery of the array among the plurality of electrode pads is arranged in a region where the reinforcement resin is not provided. Because it is located on the inner side than the one arranged in the provided area, the reliability of electrical connection between the signal electrode pad and the terminal of the external circuit board is improved compared to the conventional electronic module. Yes.

  That is, the connection portion between the insulating substrate (wiring substrate) including the electrode pad and the terminal connected to the electrode pad via the connection bump and the external circuit substrate acts even if it is not reinforced with the reinforcing resin. Thermal stress is effectively reduced. As a result, mechanical destruction of the connection bumps and the like due to thermal stress is effectively suppressed. Therefore, it is possible to provide an electronic module with high long-term reliability of signal transmission / reception between the external circuit board and the electronic component.

(A) is sectional drawing in the electronic module of the 1st Embodiment of this invention, (b) is a plane perspective view of (a), (c) is a plane perspective view which shows the modification of (b). It is. (A) And (b) is a principal part expanded sectional view which shows the modification of Fig.1 (a), respectively. (A) And (b) is an important section expanded sectional view showing other modifications of Drawing 1 (a), respectively. (A) And (b) is a plane perspective view which shows the other modification of FIG.1 (b), respectively. (A) And (b) is a plane perspective view which shows the other modification of FIG.1 (b), respectively. It is a plane perspective view which shows the other modification of FIG.1 (b). (A) is sectional drawing in the electronic module of the 2nd Embodiment of this invention, (b) is a plane perspective view of (a), (c) is a plane perspective view which shows the modification of (b). It is. (A) And (b) is a plane perspective view which shows the other modification of FIG.7 (b), respectively. It is a plane perspective view which shows the other modification of FIG.7 (b). It is a plane perspective view in the electronic module of the 3rd Embodiment of this invention. It is a plane perspective view in the electronic module of the 4th Embodiment of this invention. (A) is a plane perspective view in the electronic module of the 5th Embodiment of this invention, (b) is a principal part enlarged plan view of (a), (c) is the AA line of (b). It is a principal part expanded sectional view in FIG. (A) is a plane perspective view in the electronic module of the 6th Embodiment of this invention, (b) is a plane perspective view which shows the modification of (a). (A) And (b) is a plane perspective view which shows the other modification of Fig.13 (a), respectively.

  The electronic module of the present invention will be described with reference to the accompanying drawings. Note that the distinction between the upper and lower sides in the following description is for convenience, and does not limit the upper and lower sides when a wiring board or the like is actually used.

  1A is a cross-sectional view of the electronic module according to the first embodiment of the present invention, FIG. 1B is a plan perspective view of FIG. 1A, and FIG. It is a plane perspective view which shows the modification of b). FIGS. 1B and 1C are plan views showing a state in which the electronic module of the first embodiment is viewed from the main surface side of the insulating substrate described later through the external circuit board (see through). The positional relationship between a reinforcing resin, which will be described later, and connection pads is shown. Also in the following description, a view similar to FIGS. 1B and 1C is referred to as a plan perspective view. In the following description, viewing the electronic module from the main surface side of the insulating substrate may be simply referred to as a plan view.

  An insulating substrate 1 having a rectangular main surface, a plurality of connection pads 2 arranged on the main surface of the insulating substrate 1, an external circuit substrate 4 having terminals 5 connected to the connection pads 2 by connection bumps 3, An electronic module 10 including an electronic component 9 mounted on the insulating substrate 1 is basically formed by the reinforcing resin 6 interposed between the insulating substrate 1 and the external circuit substrate 4.

  In the example of FIG. 1, the main surface of the insulating substrate 1 on which the connection pads 2 are provided is the lower surface. In the following description, the main surface may be referred to as a lower surface, and the main surface opposite to the main surface may be referred to as an upper surface.

  The insulating substrate 1 has, for example, a flat plate shape, and has a rectangular main surface (lower surface in the example of FIG. 1 as described above) and a main surface (upper surface) opposite to the main surface. In addition, when the insulating substrate 1 is a material that is easily chipped, such as a ceramic sintered body, the edge portion of the insulating substrate 1 is chamfered in order to suppress chipping starting from the edge portion of the insulating substrate 1. May be. In such a case, the insulating substrate 1 has a shape in which a corner portion between the rectangular main surface and the side surface is cut off.

  A plurality of connection pads 2 are arranged on the lower surface of the insulating substrate 1 as described above. In the example of FIG. 1, the plurality of connection pads 2 have a circular shape in plan view, but may have an elliptical shape, a polygonal shape, or the like.

  The insulating substrate 1 has a mounting portion (not shown) on which the electronic component 9 is mounted, and the electronic component 9 is mounted on the mounting portion. The electronic component mounting portion is, for example, a central portion of the upper surface of the insulating substrate 1 and overlaps the electronic component 9 when viewed from the upper surface side. The mounting portion may be deviated from the central portion of the upper surface of the insulating substrate 1 in one direction of the outer periphery. In other words, the central portion of the mounting portion may not be located at the same position with respect to the central portion of the main surface of the insulating substrate 1.

In the example of FIG. 1A, a lid 11 is disposed so as to cover the electronic component 9. The lid 11 is mechanically connected to the outer peripheral portion of the upper surface of the insulating substrate 1 with a resin material, a solder material or the like (not shown). The lid 11 is provided, for example, to protect the electronic component 9. The lid 11 may be provided to dissipate the heat generated when the electronic component 9 is driven to the outside (as a so-called heat dissipation material). In this case, the upper surface of the electronic component 9 and the lid 11 may be connected by an adhesive (not shown) such as a heat conductive resin.

  The insulating substrate 1 functions as a base for mounting and fixing the electronic component 9. The insulating substrate 1 is also used as a base for arranging a conductor such as a connection pad 2 to electrically connect the electronic component 9 and the external circuit board 4 while avoiding an electrical short circuit between them. Also works.

  The insulating substrate 1 is, for example, a glass-ceramic sintered body, an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, or a glass fiber cloth impregnated with an epoxy resin or the like, and heat-cured. A plurality of insulating layers made of an organic resin material made into a plate shape by applying (No sign as an insulating layer) are stacked one above the other.

If the insulating substrate 1 is made of, for example, a glass ceramic sintered body, it can be manufactured as follows. First, a raw material powder composed mainly of powders of silicon oxide, boron oxide, aluminum oxide and the like is kneaded with an organic solvent and a binder, and formed into a sheet shape by a molding method such as a doctor blade method or a lip coater method, and then glass ceramic. A green sheet (hereinafter referred to as a green sheet) is prepared. Next, after laminating a plurality of green sheets, the insulating substrate 1 can be manufactured by firing at a firing temperature of about 900 to 1000 ° C.

  The plurality of connection pads 2 include a plurality of electrode pads 2a for signals, reference potentials, and power supplies. The plurality of terminals 5 of the external circuit board 4 are arranged to face the plurality of connection pads 2, respectively. The plurality of connection bumps 3 are electrically connected to the plurality of connection pads 2 and the plurality of terminals 5 facing each other. A plurality of connection pads 2 and a plurality of terminals 5 are electrically connected to each other via the connection pads 2. In this case, among the connection pads 2, the signal, reference potential, and power supply electrode pads 2 a are electrically connected to the corresponding terminals 5, respectively. The connection pad 2 may include a dummy pad in addition to the electrode pad 2a. The dummy connection pads 2 will be described later.

  The plurality of electrode pads 2a are electrically connected to the mounting portion of the electronic component 9 on the upper surface of the insulating substrate 1 via a wiring conductor (not indicated) formed so as to extend from the lower surface of the insulating substrate 1 to the upper surface through the inside. Has been derived. The electrode of the electronic component 9 is electrically connected to a portion of the wiring conductor provided in the mounting portion, and the electronic component 9 (electrode) and the electrode pad 2a are electrically connected to each other. The wiring conductor may include a portion that penetrates a part of the insulating substrate 1 in the thickness direction (a predetermined one of the plurality of insulating layers), a so-called via conductor.

  The conductors such as the plurality of connection pads 2 and the wiring conductor are, for example, a metal material such as copper, silver, palladium, gold, platinum tungsten, molybdenum or manganese, or an alloy material or a mixed material mainly composed of these metal materials. Is formed by.

  For example, the connection pads 2 and the like are prepared by kneading a powder of a metal material such as copper together with an organic solvent and a binder, printing the metal paste on a green sheet to be the insulating substrate 1 in a predetermined pattern, and simultaneously firing. Can be formed. In this case, if a through hole is formed in advance in the ceramic green sheet to be an insulating layer, and the metal paste is filled into the through hole and fired at the same time, the via conductor portion of the wiring conductor is another It can be formed simultaneously with the conductor.

The reinforcing resin 6 is provided between the insulating substrate 1 and the external circuit board 4 at least in a portion overlapping the corner portion of the main surface of the insulating substrate 1 (hereinafter also simply referred to as a corner portion or a corner portion of the insulating substrate 1). Yes. In order to more effectively reinforce the mechanical connection between the insulating substrate 1 and the external circuit substrate 4, the reinforcing resin 6 extends from the portion overlapping the corner of the insulating substrate 1 in plan view to the inside or outside, or both inside and outside. Is provided. When the reinforcing resin 6 extends inward from a position overlapping the corner of the insulating substrate 1 in a plan view, the insulating substrate 1 (main surface) and the external circuit substrate in the extended portion (that is, near the corner). 4 is joined. That is, in a portion that overlaps with the outer peripheral portion of the main surface of the insulating substrate 1 in plan view (hereinafter also simply referred to as the outer peripheral portion), at least a portion that overlaps with the corner portion in plan view (hereinafter also simply referred to as a corner portion). Reinforcing resin 6 is interposed between 1 and external circuit board 4.

  The reinforcing resin 6 is for reducing the thermal stress generated in the connection bump 3 by mechanically connecting the insulating substrate 1 and the external circuit substrate 4. Therefore, when the temperature change occurs in the electronic module 10, the reinforcing resin 6 has the highest thermal stress caused by the difference in thermal deformation amount (thermal expansion amount or thermal contraction amount) between the insulating substrate 1 and the external circuit substrate 4. It is provided at the corner and its vicinity, which is a larger part.

  As described above, the reinforcing resin 6 is provided at a position overlapping at least the corner of the insulating substrate 1 in plan view. This corresponds to the highest thermal stress at the corner and in the vicinity thereof. The connection by the connection bump 3 between the connection pad 2 and the terminal 5 is effectively reinforced by the reinforcing resin 6 in a portion where the thermal stress is relatively large.

  Further, among the plurality of electrode pads 2a, the signal electrode pad 2a located at the outermost periphery of the array is a region of the outer peripheral portion where the reinforcing resin 6 is not provided (hereinafter, a portion where the reinforcing resin 6 is not formed or simply non-existing What is arranged in the formation part) is located on the inner side than that arranged in the region where the reinforcing resin 6 is provided.

  The inner side in this case means a position closer to the center of the main surface of the insulating substrate 1 than the outermost periphery of the arranged electrode pads 2a in the vertical and horizontal directions. For example, in the example of FIG. 1B, the reinforcing resin 6 is provided among the plurality of connection pads 2 (electrode pads 2a) arranged vertically and horizontally (in a grid pattern) among those arranged at the outermost periphery of the array. For the part that is not located, that is, located in the side part, one line is not arranged. In other words, the electrode pad 2a is disposed only in the portion (corner portion) where the reinforcing resin is provided on the outer peripheral portion of the main surface of the insulating substrate 1. In the connection bump 3 in the region where the reinforcing resin 6 is provided, the reinforcing resin 6 is in contact with a part of the connection bump 3.

  Therefore, in the electronic module 10 of the embodiment, the reliability of electrical connection between the signal electrode pad 2a and the terminal 5 of the external circuit board 4 is improved as compared with the conventional electronic module.

  That is, in the electronic module 10 having the above-described configuration, the connection portion between the insulating substrate 1 including the electrode pad 2a and the terminal 5 connected to the electrode pad 2a via the connection bump 3 and the external circuit substrate 4 is as follows. Those not reinforced with the reinforcing resin 6 are located in a region where the thermal stress is smaller (a region where the distance from the center of the insulating substrate 1 is small). (The smaller the distance from the center of the insulating substrate 1, the smaller the difference in thermal deformation between the insulating substrate 1 and the external circuit substrate 4 and the smaller the thermal stress). The mechanical destruction such as is effectively suppressed. Therefore, it is possible to provide the electronic module 10 with high long-term reliability of signal transmission / reception between the external circuit board 4 and the electronic component 9.

Further, when the lid 11 as shown in FIG. 1A is connected to the upper surface of the insulating substrate 1, if the thermal expansion coefficients of the lid 11 and the insulating substrate 1 are different, the lid 11 is placed on the upper surface of the insulating substrate 1. The applied thermal stress affects the connection bump 3 located on the lower surface of the insulating substrate 1. Therefore, the effect of improving the connection reliability of the connection bump 3 may be reduced. In particular, the influence is great in the connection bump 3 in which the connection surface of the lid 11 and the insulating substrate 1 and the connection bump 3 overlap each other in a plan view. Therefore, in this case, it is desirable that the connection surface between the lid 11 and the insulating substrate 1 and the region where the reinforcing resin 6 is provided are arranged so as to overlap each other in a plan view.

  Note that the reinforcing resin 6 does not necessarily include the connection pads 2 and the connection bumps 3 on the inner side as in the example shown in FIG. 1C (the reinforcement resin 6 is in contact with a part of the connection bumps 3. It is not necessary to be formed in the form). In the example of FIG. 1C, the reinforcing resin 6 is disposed only on the corners and the outside from the corners. A plurality of connection pads 2 are arranged at corner portions in contact with the inside of the reinforcing resin 6.

  Also in this case, the same effect as in the above embodiment can be obtained, and mechanical destruction of the connection bumps 3 and the like due to thermal stress is effectively suppressed. Therefore, also in this case, it is possible to provide the electronic module 10 with high long-term reliability of signal transmission / reception between the external circuit board 4 and the electronic component 9. The example of FIG. 1B is more suitable for preventing mechanical destruction of the connection bumps 3 arranged in the vicinity of the corner (corner portion). Moreover, in order to improve repairability, the example of FIG.1 (c) is more suitable.

  2 and 3 are enlarged cross-sectional views of the main part showing a modification in the case where the reinforcing resin 6 is formed in a form not including the connection pads 2 and the connection bumps 3 as in the example of FIG. 1C. It is. 2 and 3, the covering layer 1a is provided in a wide range other than the portion where the connection pads 2 and the like are provided on the main surface of the insulating substrate 1. The covering layer 1 a covers, for example, the main surface of the insulating substrate 1 and the outer peripheral portion of the connection pad 2. Thereby, the strength of mechanical connection to the insulating substrate 1 in the outer peripheral portion of the connection pad 2 is improved. The covering layer 1a is formed of, for example, a ceramic material or an organic resin material similar to that of the insulating substrate 1. In this example, the outer periphery of the coating layer 1 a substantially coincides with the outer periphery of the insulating substrate 1 in plan view.

  2A is an example in which the reinforcing resin 6 is arranged so that the side surface portion of the insulating substrate 1 and the external circuit board 4 are connected, and FIG. 2B is a diagram illustrating the main surface of the insulating substrate 1 and the outside. This is an example in which a reinforcing resin 6 is interposed between the circuit board 4 and the circuit board 4. These examples are also more effective for improving repairability.

  FIG. 3A shows an example in which the edge portion of the insulating substrate is chamfered. In this example, the reinforcing resin 6 is arranged so that the chamfered portion and the external circuit board 4 are connected, and the edge of the insulating substrate 1 is protected by the reinforcing resin 6. Chipping starting from the part can be further suppressed. In addition, since the reinforcing resin 6 and the insulating substrate 1 are bonded even in a direction perpendicular to the main surface of the insulating substrate 1, the possibility of displacement in the direction along the main surface of the insulating substrate 1 is more effective. Reduced to

  FIG. 3B is an example in which a recess (no reference numeral) is provided on the outer peripheral portion of the main surface of the insulating substrate 1 and the reinforcing resin 6 fills the recess. The concave portion is, for example, a groove shape (indentation) in a cross-sectional view, and is annular as a whole. Moreover, you may provide partially in the inner peripheral side of the area | region where reinforcement resin is provided among outer peripheral parts. With this form of the reinforcing resin 6, the outer peripheral portion of the main surface of the insulating substrate 1 and the external circuit substrate 4 are firmly connected to each other with a larger contact area. In the example of FIG. 3B, a recess is provided on the main surface of the insulating substrate 1, but a recess (not shown) may be provided on the external circuit board 4 side. The examples shown in FIGS. 2 and 3 may be selected in consideration of repairability and connection reliability of the connection bump 3.

Further, for example, as in the example shown in FIGS. 4A and 4B, among the signal electrode pads 2a located on the outermost periphery of the array, the arrangement of those arranged in the region where the reinforcing resin 6 is not provided. However, it may be in a form that is biased to the inner side of the arrangement of those arranged in the region where the reinforcing resin 6 is provided. 4 (a) and 4 (b) are plan perspective views showing other modifications of FIG. 1 (b), respectively. 4, parts similar to those in FIG. 1 are denoted by the same reference numerals. Also in this case, the electrode pad 2a arranged in the region where the reinforcing resin 6 is not provided is located on the inner side of the electrode pad 2a provided with the reinforcing resin 6 (from the array to the center of the main surface of the insulating substrate 1). Is biased in the direction of the part).

  Also in this case, the same effect as in the above embodiment can be obtained, and mechanical destruction of the connection bumps 3 and the like due to thermal stress is effectively suppressed. Therefore, also in this case, it is possible to provide the electronic module 10 with high long-term reliability of signal transmission / reception between the external circuit board 4 and the electronic component 9.

  FIGS. 5A and 5B are plan perspective views showing other modifications of FIG. 1B, respectively. 5, parts similar to those in FIG. 1 are denoted by the same reference numerals. In these examples, the reinforcing resin 6 is provided over substantially the entire periphery between the outer peripheral portion of the main surface of the insulating substrate 1 and the external circuit substrate 4, and has a non-formed portion in a part thereof. . Further, similarly to the example shown in FIG. 1C, the reinforcing resin 6 is disposed only on the outer side from the outer periphery of the main surface including the corners and the corners of the insulating substrate 1.

  In the example shown in FIG. 5A, a part (one in this example) of the electrode pads 2a arranged vertically and horizontally is not formed in a part adjacent to the non-formed part of the reinforcing resin 6. . Further, in the example of FIG. 5B, a part (one in this example) of the electrode pads 2a arranged vertically and horizontally in a part adjacent to the non-formed part of the reinforcing resin 6 is more than the other. It is arranged inwardly. That is, also in these examples, the electrode pad 2a arranged in the region where the reinforcing resin 6 is not provided has a non-formed portion or is in the direction of the central portion of the main surface of the insulating substrate 1. It is biased and is located on the inner side of the reinforcing resin 6 provided.

  In these cases, the same effects as those in the above-described embodiment and the modification can be obtained, and mechanical destruction of the connection bumps 3 and the like due to thermal stress is effectively suppressed. Therefore, also in this case, it is possible to provide the electronic module 10 with high long-term reliability of signal transmission / reception between the external circuit board 4 and the electronic component 9.

  FIG. 6 is a plan perspective view showing another modification of FIG. In FIG. 6, the same parts as those in FIG. In this example, the reinforcing resin 6 is provided over a corner portion of the insulating substrate 1 and the external circuit substrate 4 and a relatively wide range adjacent to the corner portion, and has a non-forming portion at the central portion of the side portion. . Further, similarly to the example shown in FIG. 1C, the reinforcing resin 6 is disposed only from the outer periphery including the corner portion of the insulating substrate 1 to the outside.

  In the example of FIG. 6, in a portion adjacent to the non-formed portion of the reinforcing resin 6, a part of the electrode pads 2 a arranged in a staggered (diagonal lattice shape) (in this example, in the uppermost row and the lowermost row of the arrangement). Two, one in the leftmost column and the rightmost column) are not formed. In this example, the electrode pad 2a that is disposed in the region where the reinforcing resin 6 is not provided has a non-forming portion and is located on the inner side of the electrode pad 2a that is provided with the reinforcing resin 6. Yes.

  Also in this case, the same effects as those of the above-described embodiment and the modification can be obtained, and mechanical destruction of the connection bumps 3 and the like due to thermal stress is effectively suppressed. Therefore, also in this case, it is possible to provide the electronic module 10 with high long-term reliability of signal transmission / reception between the external circuit board 4 and the electronic component 9.

Further, the electrode pads 2a disposed only in the region where the reinforcing resin is disposed on the outer peripheral portion of the main surface of the insulating substrate 1 may be the reference potential and power supply electrode pads 2a. In this case, the stability of the reference potential or power supply provided on the reference potential and power supply electrode pads 2a and the external circuit board 4 can be further increased. Therefore, in this case, in addition to the effect of improving the long-term reliability of signal transmission / reception between the external circuit board 4 and the electronic component 9 as in the first embodiment and the modifications, the electrical characteristics An electronic module more advantageous in improvement can be provided.

  Note that the reference potential and the power source (such as a conductor pattern) included in the external circuit board 4 and the like are electrically connected to the plurality of electrode pads 2a, so that the potential can be maintained even if some of them break. However, the greater the number of connected electrode pads 2a, the more advantageous the potential stability.

  FIG. 7A is a cross-sectional view of an electronic module according to a second embodiment of the present invention, FIG. 7B is a plan perspective view of FIG. 7A, and FIG. It is a plane perspective view which shows the modification of b). In FIG. 7, the same parts as those in FIG.

  In the electronic module 10 of the second embodiment, the plurality of connection pads 2 include a plurality of electrode pads 2a as in the electronic module 10 of the first embodiment, and are electrically connected to these electrode pads 2a. It further includes an independent dummy pad 2b. The dummy pad 2b is disposed in a region of the outer peripheral portion of the main surface of the insulating substrate 1 where the electrode pad 2a is not disposed. This dummy pad 2b is considered to be located in a portion where the electrode pad 2a is not arranged in the electronic module of the first embodiment and arranged in a vertical and horizontal arrangement as the whole connection pad 2. You can also. The electronic module 10 of the second embodiment is the same as the electronic module of the first embodiment except that the connection pad 2 includes the dummy pad 2b, and the description of the same points is omitted.

  In this example as well, a portion where the electrode pad 2a is not provided is a portion where the reinforcing resin 6 is not provided, whereby the electrode pad 2a disposed in a region where the reinforcing resin 6 is not provided. The electrode pad 2a on which the reinforcing resin 6 is provided is located on the inner side.

  The dummy pad 2b is mechanically connected to a dummy terminal (not labeled as a dummy) provided on the external circuit board 4 through, for example, a dummy bump 3b. The dummy pad 2b does not relate to the electrical connection between the electronic component 9 and the external circuit board 4, but may be mechanically connected to the insulating substrate 1 and the external circuit board 4.

  In this case, the mechanical connection between the insulating substrate 1 and the external circuit substrate 4 in the portion where the electrode pad 2a is not provided becomes stronger. Further, even if a crack or the like due to thermal stress occurs in a part of the connection pad 2, the crack or the like is first the outermost connection pad 2 on which the thermal stress acts relatively greatly, and is reinforced with the reinforcing resin 6. There is a high possibility that it will occur in the dummy pad 2b that is located in a portion that is not formed. Therefore, the electrical connection between the electrode pad 2a and the terminal 5 can be more effectively maintained over a long period.

  The example shown in FIG. 7B is similar to the example shown in FIG. 1B. Among the electrode pads 2a arranged vertically and horizontally (in a lattice pattern), the electrode pads 2a are arranged on the outermost periphery of the array. A portion where the reinforcing resin 6 is not provided, that is, a portion located in the side portion, is not arranged in one row. Further, a dummy pad 2b is arranged in a portion where the electrode pad 2a is not provided. That is, a plurality of connection pads 2 constituted by a plurality of electrode pads 2a and a plurality of dummy pads 2b are arranged vertically and horizontally as a whole (in a lattice pattern). In other words, the connection pads 2 are arranged at all positions corresponding to the lattice points.

Also in this case, like the electronic module 10 of the first embodiment, the signal electrode pad 2a is used.
The electrical connection reliability with the terminal 5 of the external circuit board 4 is improved over the conventional electronic module.

  In this case, as described above, since the effect of improving the mechanical connection strength between the insulating substrate 1 and the external circuit substrate 4 by the dummy pad 2b is obtained, the electrical connection between the electrode pad 2a and the terminal 5 is obtained. Thus, it is possible to provide the electronic module 10 that is advantageous in maintaining an effective connection over a long period of time.

  In the example shown in FIG. 7C, the reinforcing resin 6 is disposed only on the outer side from the corner of the insulating substrate 1 as in the example shown in FIG. A plurality of connection pads 2 are arranged in the inner part (corner part) from the corner part in contact with the inner side of the reinforcing resin 6. Further, the electrode pad 2a is disposed in the vicinity of the corner portion where the reinforcing resin 6 is provided, and the electrode pad 2a is not disposed in the side portion where the reinforcing resin 6 is not provided. A dummy pad 2b is disposed in a portion where the electrode pad 2a is not disposed. Accordingly, the plurality of connection pads 2 are arranged vertically and horizontally as a whole.

  Also in this case, the same effect as the example of the first embodiment can be obtained, and similarly to the example shown in FIG. 7B, the machine between the insulating substrate 1 and the external circuit substrate 4 by the dummy pad 2b. Therefore, it is possible to provide the electronic module 10 that is advantageous in maintaining the electrical connection between the electrode pad 2a and the terminal 5 more effectively and over a long period of time.

  FIGS. 8A and 8B are plan perspective views showing other modifications of FIG. 7B, respectively. In FIG. 8, the same parts as those in FIG. In the example shown in FIGS. 8A and 8B, the reinforcing resin 6 is provided over substantially the entire circumference between the insulating substrate 1 and the external circuit board 4, as in the examples shown in FIG. Some of them have non-formed parts. Electrodes arranged in a region where the reinforcing resin 6 is not provided in the portion adjacent to the non-forming portion of the reinforcing resin 6 where the electrode pads 2a (one portion) arranged in the vertical and horizontal directions are not formed. The pad 2a is located inside the electrode pad 2a on which the reinforcing resin 6 is provided.

  In the example of FIG. 8A, a part (one in this example) of the electrode pads 2a arranged vertically and horizontally is not formed in a part adjacent to the non-formed part of the reinforcing resin 6. The dummy pad 2b is disposed in a portion where the electrode pad 2a is not provided. Further, similarly to the example shown in FIG. 1C, the reinforcing resin 6 is disposed only from the outer periphery including the corner portion of the insulating substrate 1 to the outside. Also in this example, effects such as improvement of mechanical connection strength between the insulating substrate 1 and the external circuit substrate 4 by the dummy pad 2b can be obtained. That is, it is possible to provide the electronic module 10 that is advantageous in maintaining the electrical connection between the electrode pad 2a and the terminal 5 more effectively and over a long period of time.

  Also in the example of FIG. 8B, a part (one in this example) of the electrode pads 2a arranged vertically and horizontally in the part adjacent to the non-formed part of the reinforcing resin 6 is more than the others. Is also arranged inwardly. Further, in the example shown in FIG. 8B, the reinforcing resin 6 is provided so as to be in direct contact with the connection pads 2 arranged in the vertical and horizontal directions and located on the outermost periphery of the array. In other words, in the example of FIG. 8B, the reinforcing resin 6 is provided with a wider width to the inside than the example of FIG.

Also in this case, as in the example shown in FIG. 8A, effects such as improvement in mechanical connection strength between the insulating substrate 1 and the external circuit substrate 4 by the dummy pad 2b can be obtained. Further, since the reinforcing resin 6 is provided in a wider range, the strength of the mechanical connection between the insulating substrate 1 and the external circuit board 4 is improved, and the electrical connection between the electrode pad 2a and the terminal 5 is improved. It is possible to provide an electronic module 10 that is advantageous for further improving long-term reliability.

  FIG. 9 is a plan perspective view showing another modification of FIG. 9, parts similar to those in FIG. 7 are given the same reference numerals. In the example shown in FIG. 9, as in the example shown in FIG. 1C, the reinforcing resin 6 is disposed only on the outer side from the corner of the insulating substrate 1 and the outer periphery adjacent thereto. Similarly to the example shown in FIG. 6, the reinforcing resin 6 is provided over a relatively wide range of corner portions of the insulating substrate 1 and the external circuit substrate 4, and has a non-formed portion at the center portion of the side portion. ing. In a portion adjacent to the portion where the reinforcing resin 6 is not formed, a part of the electrode pads 2a arranged in a staggered (diagonal lattice) pattern (in this example, two in the top row and the bottom row of the array, two in the top row of the array). 1 in the left column and the rightmost column) is not formed. A dummy pad 2b is disposed in a portion where the electrode pad 2a is not provided.

  That is, in the example shown in FIG. 9 as well, as in the example shown in FIG. 8, the electrode pads 2a (one or two) arranged vertically and horizontally in the portion adjacent to the non-formed portion of the reinforcing resin 6 are arranged. Is not formed, and the electrode pad 2a arranged in the region where the reinforcing resin 6 is not provided is located inside the electrode pad 2a provided with the reinforcing resin 6.

  Also in this example, effects such as improvement of mechanical connection strength between the insulating substrate 1 and the external circuit substrate 4 by the dummy pad 2b can be obtained. That is, it is possible to provide the electronic module 10 that is advantageous in maintaining the electrical connection between the electrode pad 2a and the terminal 5 more effectively and over a long period of time.

  Although it is possible to improve the long-term reliability of electrical connection by providing all the connection pads 2 located on the outermost periphery as dummy pads without providing the reinforcing resin 6, the insulating substrate 1 and the external circuit substrate In the case where the reinforcing resin 6 is provided between the electrode pads 2 and 4, the electrical connection strength between the electrode pads 2a and the terminals 5 is improved, and the number of electrode pads that can be arranged is increased.

  FIG. 10 is a plan perspective view of the electronic module according to the third embodiment of the present invention. 10, parts similar to those in FIG. 1 are given the same reference numerals. In the example shown in FIG. 10, the difference between the linear thermal expansion coefficient of the insulating substrate 1 and the linear thermal expansion coefficient of the external circuit board 4 is larger than the first direction along one side of the insulating substrate 1 in plan view. It is made smaller in the second direction perpendicular to the one side. Further, the reinforcing resin 6 is provided over a longer range in the first direction than in the second direction. In other words, the length of the reinforcing resin 6 provided on the pair of side portions facing each other on the main surface of the rectangular insulating substrate 1 is longer than the length of the reinforcing resin 6 provided on the other pair of side portions. Is also big. The reinforcing resin 6 is provided so as to extend outward from the outer periphery including the corners of the insulating substrate 1. Also in the example shown in FIG. 10, as in the examples shown in FIGS. 8 and 9, the electrode pad 2 a arranged in the region where the reinforcing resin 6 is not provided is replaced with the electrode pad 2 a provided with the reinforcing resin 6. Is located on the inside.

  In this case, the difference between the linear thermal expansion coefficient of the insulating substrate 1 and the linear thermal expansion coefficient of the external circuit board 4 is larger, and the thermal stress generated between the two is larger in the second direction. The strength of the mechanical connection with the circuit board 4 is enhanced more effectively by the reinforcing resin 6. That is, the strength of the mechanical connection between the insulating substrate 1 and the external circuit board 4 is effectively increased according to the magnitude of the thermal stress. Therefore, also in this case, it is possible to provide the electronic module 10 that is advantageous in maintaining the electrical connection between the electrode pad 2a and the terminal 5 more effectively and over a long period of time.

Note that the difference between the coefficient of linear thermal expansion of the insulating substrate 1 and the coefficient of linear thermal expansion of the external circuit board 4 is perpendicular to one side of the insulating substrate 1 rather than the first direction along one side of the insulating substrate 1 in plan view. As a small example in the second direction, for example, the thermal expansion coefficient of the insulating substrate 1 may be different in the first direction and the second direction, that is, in the vertical and horizontal directions. For example, when the external circuit board 4 is an organic material obtained by impregnating a glass fiber cloth with an epoxy resin and performing a thermosetting treatment, the difference in the thermal expansion coefficient is, for example, how to weave the glass fiber cloth. Due to etc.

  FIG. 11 is a plan perspective view of the electronic module 10 according to the fourth embodiment of the present invention. In FIG. 11, parts similar to those in FIG. In the example of FIG. 11, the reinforcing resin 6 is in contact with a part of the plurality of connection bumps 3. The area (hereinafter also simply referred to as area) of the electrode pad 2a connected to the connection bump 3 in contact with the reinforcing resin 6 in plan view (hereinafter also simply referred to as area) is the electrode pad 2a connected to the connection bump 3 not in contact with the reinforcing resin 6. Is smaller than the area in plan view. Further, in the portion where the reinforcing resin 6 is not provided, the outermost electrode pad 2a of the array is not provided. Also in the example shown in FIG. 11, the electrode pad 2 a arranged in the region where the reinforcing resin 6 is not provided is similar to the example shown in FIG. 1 than the electrode pad 2 a provided with the reinforcing resin 6. Is also located inside.

  Also in this case, in addition to the effect of reinforcing the mechanical connection between the insulating substrate 1 and the external circuit board 4 by the reinforcing resin 6, the electrode pad 2a is not provided in a portion where the reinforcing resin 6 is not provided. An effect, that is, an effect of suppressing mechanical breakage of the connection bump 3 and the like due to thermal stress can be obtained. Therefore, also in this case, it is possible to provide the electronic module 10 with high long-term reliability of signal transmission / reception between the external circuit board 4 and the electronic component 9.

  In this case, since the area of some of the electrode pads 2a is smaller than the area of the other electrode pads 2a, the electrode pads 2a can be easily miniaturized and densified in this area, and the electrode pads Since the reinforcing resin 6 is disposed in such a manner that the connection bumps 3 connected to the electrode pads 2a and the electrode pads 2a are included inside, the connection bumps 3 are effectively reinforced even if the electrode pads 2a are formed relatively small. . Therefore, it is possible to provide the electronic module 10 that is more effective for improving the reliability and miniaturization of the electrical and mechanical connection between the insulating substrate 1 and the external circuit substrate 4. Further, when the area of the signal electrode pad 2a is reduced, the parasitic capacitance in the electrode pad 2a can be reduced, so that the characteristic impedance can be easily adjusted and the transmission characteristics of the high frequency signal can be improved. Become.

  FIG. 12A is a plan perspective view of an electronic module according to a fifth embodiment of the present invention, and FIG. 12B is an enlarged plan view (perspective view) of the main part of FIG. (C) is a principal part expanded sectional view in the AA line of FIG.12 (b). 12, parts similar to those in FIG. 1 are denoted by the same reference numerals.

  In the example shown in FIG. 12, similarly to the example shown in FIG. 7A, the reinforcing resin 6 is provided only in a portion that overlaps the corner portion of the main surface of the insulating substrate 1 in plan view, and this reinforcing resin 6 is provided. The electrode pad 2a is disposed only in the part. In other words, the electrode pad 2a is not disposed in a portion where the reinforcing resin 6 is not provided. Further, a dummy pad 2b is disposed in a region of the outer peripheral portion of the insulating substrate 1 where the electrode pad 2a is not disposed. Also in the example shown in FIG. 12, the electrode pad 2 a arranged in the region where the reinforcing resin 6 is not provided is similar to the example shown in FIG. 7 than the electrode pad 2 a provided with the reinforcing resin 6. Is also located inside.

  The electronic module 10 of the fifth embodiment covers a plurality of connection pad conductors 7 provided on the main surface of the insulating substrate 1 and covers from the main surface of the insulating substrate 1 to the outer edge portions of the plurality of connection pad conductors. And a covering insulating layer 8.

The covering insulating layer 8 in this example is similar to the covering layer 1a described above, but covers the outer edge of the connection pad conductor 7 (having an area larger than a predetermined area as the connection pad 2), It is different from the coating layer 1a in that the connection pad 2 having a predetermined area is formed.

  In the electronic module 10 of the fifth embodiment, a plurality of connection pads 2 are formed by an exposed portion inside the outer edge portion covered with the coating insulating layer 8 among the plurality of connection pad conductors 7. Further, the reinforcing resin 6 is in contact with a part of the plurality of connection bumps 3. The area in plan view of the connection pad conductor 7 connected to the connection bump 3 in contact with the reinforcing resin 6 is the area in plan view of the connection pad conductor 7 connected to the connection bump 3 not in contact with the reinforcement resin 6. Smaller than. The areas of the plurality of connection pads 2 are the same. That is, the connection pad conductors 7 having different areas are covered with the covering insulating layer 8 at the outer edges in different ranges. Thereby, the areas of the exposed portions (connection pads 2) of the plurality of connection pad conductors 7 are the same.

  In this case, unlike the example shown in FIG. 11, for example, the connection bumps 3 can be formed with solder balls having the same volume, so that assembly can be performed relatively easily. Further, when the area of the signal connection pad conductor 7 is reduced, the parasitic capacitance in the electrode pad 2a can be reduced, so that the characteristic impedance can be easily adjusted and the transmission characteristics of the high frequency signal can be improved. It becomes.

  FIG. 13A is a plan perspective view of an electronic module according to a sixth embodiment of the present invention, and FIG. 13B is a plan perspective view showing a modification of FIG. 13A. In FIG. 13, the same parts as those in FIG.

  In the example shown in FIG. 13, the reinforcing resin 6 is provided so as to include a plurality of connection pads 2 inside from the connection pad 2 closest to the corner of the main surface of the insulating substrate 1 toward the center of the main surface. In the example shown in FIG. 13 (a), the connection pad 2 (hereinafter also referred to as the outermost connection pad) 2 closest to the corner of the main surface is located at a corner portion of the plurality of connection pads 2 in the vertical and horizontal arrangements. is there. Further, the outermost connection pad 2 in the example shown in FIG. 13A is an electrode pad 2a.

  In other words, the electronic module 10 of the sixth embodiment is provided with the reinforcing resin 6 extending from the outermost connection pad 2 to the inner connection pad 2 of the array so as to include a plurality of rows of connection pads 2 inside. It is a form. The extending direction of the reinforcing resin 6 is a direction toward the center of the main surface along the diagonal line of the main surface of the insulating substrate 1. Except for this point, the sixth embodiment is the same as the first embodiment.

  When the reinforcing resin 6 is provided extending in the direction of the central portion of the main surface of the insulating substrate 1 as described above, the insulating substrate 1 and the external circuit substrate 4 via the connection pads 6 are provided at the corners of the insulating substrate 1. Is effectively reinforced. Therefore, it is possible to effectively improve the reliability of electrical connection between the signal electrode pad 2a and the terminal of the external circuit board.

  In the example shown in FIG. 13A, the electrode pad 2a included inside the reinforcing resin 6 may be a reference potential and power source electrode pad 2a. As a result, as described in the first embodiment, the stability of the reference potential and the power source can be improved.

  Further, with respect to the arrangement positions of the plurality of electrode pads 2a, the position inside the area where the reinforcing resin 6 is provided is, for example, an area surrounded by an imaginary line A shown in FIG. It is. That is, in each of the vertical and horizontal arrangements, a rectangular region in which the innermost electrode pad 2a included in the reinforcing resin 6 is close to the outside of each corner. Of the electrode pads 2a, the signal electrode pad 2a is disposed within the rectangular region. Also in each example described later, the position inside the electrode pad 2a disposed in the region where the reinforcing resin 6 is provided is the same as this, and is a region surrounded by the virtual line A.

  Also in the example shown in FIG. 13A, the dummy pad 2b as described in the second embodiment is arranged. A plurality of pads 2 are arranged so that the electrode pads 2a and the dummy pads 2b are combined to form a vertical and horizontal arrangement (lattice shape).

A plurality of dummy pads 2b are arranged on the outer periphery of the array. Therefore, even if mechanical destruction occurs in the peripheral connection pad 2 (dummy pad 2b) having a relatively large thermal stress, the electrical connection between the wiring board 10 and the external circuit board 4 via the electrode pad 2a. Connection reliability can be improved.

In the sixth embodiment, the reinforcing resin 6 includes only the outermost connection pad 2 and the connection pad 2 adjacent to the central portion of the main surface immediately inside thereof as in the example shown in FIG. May be provided in such a pattern as to include the inside. Also in this case, the reinforcing resin 6 is provided from the outermost connection pad 2 toward the center of the main surface so as to include the plurality of connection pads 2 inside. Therefore, the wiring board 10 and the external circuit board 4 at the corners of the insulating board 1 are reinforced with the reinforcing resin 6.
Can be effectively reinforced. Therefore, the electrical connection reliability between the wiring board 10 and the external circuit board 4 through the electrode pad 2a can be improved.

  In the example shown in FIGS. 13A and 13B, the extending range of the reinforcing resin 6 is set to be as narrow as possible. The shape of the reinforcing resin 6 in plan view is a hook shape or a “<” shape as shown in FIG. 13A, and is a belt shape in the example shown in FIG. As a result, repairability is also improved.

  14 (a) and 14 (b) are plan perspective views showing other modifications of FIG. 13 (a), respectively. 14, parts similar to those in FIGS. 1 and 13 are denoted by the same reference numerals. In the example shown in FIG. 14, the reinforcing resin 6 is provided in a wider range toward the central portion of the main surface of the insulating substrate 1 than in the example shown in FIG. Is contained inside the reinforcing resin 6. Also in these cases, the bonding with the external circuit board 4 at the corners of the insulating substrate 1 is reinforced to improve the electrical connection reliability between the wiring board 10 and the external circuit board 4 via the electrode pads 2a. be able to.

  In the example shown in FIG. 14A, the reinforcing resin 6 has a quadrangular shape (a shape close to a square) in plan view. Further, a plurality of rows (three rows) of connection pads 2 are included inside the reinforcing resin 6 inward from the outermost connection pads 2 along the diagonal line of the main surface of the insulating substrate 1 toward the center of the main surface. It is. This effectively reinforces the bonding between the wiring board 10 and the external circuit board 4 in the diagonal direction.

  Also in the example shown in FIG. 14B, the reinforcing resin 6 has a quadrangular shape (a shape close to a square) in a plan view, and the reinforcing resin 6 is effective in joining the wiring board 10 and the external circuit board 4 in the diagonal direction. Is reinforced.

  In the example shown in FIG. 14B, the connection pads 2 are not formed at three positions corresponding to the corners in the vertical and horizontal arrangements of the plurality of connection pads 2. This increases the degree of freedom of thermal expansion and contraction at the corners of the insulating substrate 1 and reduces the thermal stress itself that can occur at the corners. Therefore, it is possible to improve the reliability of electrical connection between the wiring board 10 and the external circuit board 4 via the electrode pads 2a.

  The outermost connection pads 2 in the example shown in FIG. 14B are four outermost connection pads 2 among the plurality of connection pads 2 arranged in the diagonal direction of the rectangular main surface of the insulating substrate 1. Connection pad 2.

  Also in the example shown in FIG. 14, the electrode pad 2a included inside the reinforcing resin 6 may be the electrode pad 2a for the reference potential and the power source. As a result, as described in the first embodiment, the stability of the reference potential and the power source can be improved.

  In each example described above, the reinforcing resin 6 is formed of, for example, an epoxy resin including an epoxy resin. The reinforcing resin 6 may be made of an epoxy resin to which filler particles made of an inorganic material such as glass are added.

  If an uncured epoxy resin is disposed between the insulating substrate 1 and the external circuit board 4 together with a curing agent or the like and cured by means such as heating, a reinforcing resin is provided between the insulating substrate 1 and the external circuit board 4. 6 can be interposed. In this case, for example, if an uncured epoxy resin or the like is applied in advance to a predetermined portion of the upper surface of the external circuit board 4, and the lower surface of the insulating substrate 1 is aligned and set on the external circuit board 4, the insulating substrate An uncured epoxy resin can be disposed between 1 and the external circuit board 4.

  Further, when the reinforcing resin 6 is formed of an epoxy resin, even if silicone oil molecules adhere to a portion of the main surface (lower surface) of the insulating substrate 1 where the reinforcing resin 6 is not provided. Good. In this way, when the silicone oil molecules are attached, the reinforcing resin 6 is disposed at a predetermined portion due to the effect of repelling the uncured epoxy resin having high polarity by the hydrophobic silicone oil molecules. It will be easier to do. That is, it is possible to reliably form the reinforcing resin 6 in a portion that overlaps at least the corner portion of the outer peripheral portion of the main surface of the insulating substrate 1 in a plan view while avoiding a portion where the reinforcing resin 6 is not desired to be provided.

  Further, in each of the above examples, the electronic module 10 has a surface roughness at a portion where the reinforcing resin 6 is provided in the main surface of the insulating substrate 1 as compared with a surface roughness at a portion where the reinforcing resin 6 is not provided. May be large.

  In this case, the flowability of the uncured epoxy resin as the reinforcing resin 6 on the main surface of the insulating substrate 1 is improved by a capillary phenomenon at a portion where the surface roughness is relatively large. Therefore, in this case, it is possible to provide the electronic module 10 having the same configuration and effects as the above-described examples, and more advantageous in productivity and the like.

  In addition, this invention is not limited to the example of the above embodiment, A various change is possible in the range which does not deviate from the summary of this invention. For example, in the plurality of corners of the insulating substrate, the arrangement form of the reinforcing resin 6 at each corner may be different from each other, and the other three or two corners may be provided at one or two corners. And may be different from each other.

DESCRIPTION OF SYMBOLS 1 ... Insulating substrate 2 ... Connection pad 2a ... Electrode pad 2b ... Dummy pad 3 ... Connection bump 3a ... Electrode bump 3b ... Dummy bump 4 ... External circuit board 5 ... Terminal 6 ... Reinforcing resin 7 ... Connector pad conductor 8 ... Coating insulation layer 9 ... Electronic components
10 ... Electronic module
11 ... Cover body

Claims (9)

An insulating substrate having a rectangular main surface;
A plurality of connection pads including a plurality of electrode pads for signal, reference potential and power supply arranged on the main surface of the insulating substrate;
An external circuit board having a plurality of terminals disposed opposite to the plurality of connection pads,
A plurality of connection bumps interposed between the plurality of connection pads and the plurality of terminals, and electrically connecting the plurality of connection pads and the plurality of terminals, respectively;
A reinforcing resin provided between the insulating substrate and the external circuit board in a portion overlapping at least a corner portion of the main surface of the insulating substrate in a plan view;
Among the plurality of electrode pads, the signal electrode pad located on the outermost periphery of the array is arranged in a region where the reinforcing resin is not provided, but is arranged in a region where the reinforcing resin is provided. An electronic module characterized in that the electronic module is located on the inner side than the formed one. 2. The electron according to claim 1, wherein the electrode pads for reference potential and power supply are arranged only in a region where the reinforcing resin is arranged in an outer peripheral portion of the main surface of the insulating substrate. module. The connection pad is electrically independent from the electrode pad, and further includes a dummy pad disposed in a region where the electrode pad is not disposed in an outer peripheral portion of the main surface of the insulating substrate. The electronic module according to claim 1, wherein the electronic module is an electronic module. The difference between the linear thermal expansion coefficient of the insulating substrate and the linear thermal expansion coefficient of the external circuit substrate is a second value perpendicular to the one side than the first direction along one side of the insulating substrate in plan view. Is made smaller in the direction,
The electronic module according to claim 1, wherein the reinforcing resin is provided in a longer range in the first direction than in the second direction. The reinforcing resin is in contact with a part of the plurality of connection bumps, and an area of the electrode pad connected to the connection bump in contact with the reinforcement resin in a plan view is not in contact with the reinforcement resin. The electronic module according to claim 1, wherein the electronic module is smaller than an area of the electrode pad connected to the bump in a plan view. A plurality of connection pad conductors provided on the main surface of the insulating substrate, and a covering insulating layer covering the main surface of the insulating substrate and the respective outer edges of the plurality of connection pad conductors. Has
Among the plurality of connection pad conductors, the plurality of connection pads are formed by an exposed portion inside the outer edge portion covered with the covering insulating layer,
The reinforcing resin is in contact with a part of the plurality of connection bumps, and the connection pad conductor for signals connected to the connection bumps in contact with the reinforcement resin among the plurality of connection bumps in a plan view. The area is smaller than the area in a plan view of the connection pad conductor connected to the connection bump not in contact with the reinforcing resin, and the areas of the plurality of connection pads are the same as each other. The electronic module in any one of 1-4. The said reinforcement resin is provided including the said some connection pad inside by the direction of the center part of the said main surface from the said connection pad nearest to the corner | angular of the said main surface. Electronic module. The said reinforcement resin consists of epoxy-type resin, and the molecule | numerator of the silicone oil has adhered in the site | part in which the said reinforcement resin is not provided among the said main surfaces of the said insulated substrate. The electronic module in any one of. 8. The surface roughness of a portion of the main surface of the insulating substrate where the reinforcing resin is provided is larger than the surface roughness of a portion where the reinforcing resin is not provided. The electronic module in any one of.

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