JP2017034083A - Substrate unit, adhesive substrate unit, and conductive unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate unit, an adhesive substrate unit, and a conductive unit, which can electrically and physically join the substrate unit and a conductive device while preventing damages.SOLUTION: A substrate unit is equipped with base portions 35 and 36; a plurality of supporting portions 12 provided on the base portions 35 and 36; and a plurality of substrate terminals 33 provided on the plurality of supporting portions 12. Each of the plurality of supporting portions 12 has a flat-shaped top portion 13, and the top portions 13 of the plurality of supporting portions 12 have the same height from the base portion 35 and 36. The substrate terminals 33 provided on such top portions 13 are accurately formed in flat shapes. Therefore, even if device terminals 34 are disposed on the substrate terminals 33 and crimp force F is applied on the substrate terminals 33 and the device terminals 34, the force is not locally concentrated, and the substrate terminals 33 and the device terminals 34 can be electrically and physically properly joined while preventing damages.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a substrate unit, an adhesive substrate unit, and a conductive unit, and more particularly to a technique for electrically bonding a terminal of a substrate unit and a terminal of a conductive device while physically bonding the substrate unit and the conductive device.

  Anisotropic conductive film (ACF) is widely used for mounting a conductive device such as a semiconductor on a substrate unit. ACF exhibits conductivity in the crimping direction after crimping, but has an insulating property in a direction perpendicular to the crimping direction. Therefore, ACF is often used for electrical bonding with a fine pitch. It is used for fine pitch bonding in fields such as panels.

  For example, Patent Document 1 discloses an electronic component mounting method in which an opaque electrode portion of an opaque conductive film provided in an FPC (Flexible Printed Circuits) is bonded to a transparent electrode portion of an ITO (Indium Tin Oxide) film using an ACF tape. Disclose.

  On the other hand, it is also possible to attach the conductive device to the substrate unit without using the ACF. For example, in Patent Document 2, an electronic component is mounted on the substrate overhanging portion via a sealing resin made of a thermosetting resin. An implementation method is disclosed. In this mounting structure, the board extension includes a plurality of terminals having different heights on the upper surface bonded to the bump electrode of the electronic component, and variations in the height of the terminal due to elastic deformation of the internal resin of the bump electrode. By being absorbed, the bump electrode of the electronic component and the terminal of the substrate overhanging portion are joined.

JP 2006-040978 A JP 2009-099764 A

  The above-mentioned ACF is made by mixing fine conductive particles having conductivity with a thermosetting resin. The conductive particles are an outermost layer having insulating properties and a conductive portion provided inside the outermost layer. And have. When pressure is partially applied to the ACF, conductive portions of the conductive particles are attracted to each other in the pressure direction in the portion where the pressure is applied, and a conductive path is formed. However, in the portion where no pressure is applied, the conductive particles are formed. The insulating property is maintained by the outermost insulating layer.

  The conductive particles contained in such an ACF do not necessarily have the same particle size, but generally have various particle sizes. Further, although the conductive particles are randomly scattered in the ACF, the density of the conductive particles is not necessarily uniform throughout the ACF, and there may be a place where the density of the conductive particles is locally higher than the surroundings. For this reason, when a pressing force is applied to the substrate unit and the conductive device with the ACF interposed, it is relatively unaffected at locations where conductive particles having a relatively large particle size exist or where the density of the conductive particles is locally high. Large force may be applied to the board unit or the terminals of the conductive device.

  FIG. 4 is a perspective view of the substrate unit 30, the ACF 31, and the conductive device 32 that are pressure-bonded to each other. FIG. 5 is a plan view illustrating an example of the board terminal 33 of the board unit 30. FIG. 6 is a conceptual diagram illustrating an example of a cross section of the crimping portion of the substrate unit 30, the ACF 31, and the conductive device 32 illustrated in FIG. In general, the ACF 31 is disposed between the substrate unit 30 and the conductive device 32, and the substrate terminal 33 and the device terminal 34 are connected to the pad P by applying a crimping force F to the portion where the substrate terminal 33 and the device terminal 34 are disposed. Joined in units. At the time of joining, the force is locally concentrated at a place where the conductive particles 37 having a relatively large particle diameter are disposed or a place where the density of the conductive particles 37 is high, and the device terminal of the conductive device 32 34 and the substrate terminal 33 and the base (the base layer 36 and the base material layer 35) of the substrate unit 30 may be damaged (see “damaged portion D” in FIG. 6).

  When the substrate unit and the conductive device are joined using the ACF as described above, the substrate unit and the conductive device may be damaged due to variations in the particle size and density of the conductive particles contained in the ACF. . Such damage to the substrate unit and the conductive device may cause poor conductivity, and deteriorate the quality of the product, leading to a decrease in yield. Therefore, it is desired to propose a new technique capable of joining the substrate unit and the conductive device in a desired manner electrically and physically while preventing damage to the substrate unit and the conductive device.

  The present invention has been made in view of the above-described circumstances, and an object thereof is to provide a technique capable of electrically and physically joining a substrate unit and a conductive device while preventing damage.

  One embodiment of the present invention includes a base, a plurality of support portions provided on the base portion, and a plurality of substrate terminals provided on the plurality of support portions, and each of the plurality of support portions has a flat top portion. The plurality of board terminals are provided on tops of the plurality of support parts, and the top parts of the plurality of support parts relate to a board unit having the same height from the base part.

  According to this aspect, since the substrate terminal is provided on the flat top portions of the plurality of support portions having the same height from the base portion, the substrate terminal can be formed flat with high accuracy. Therefore, even if the device terminal and the substrate terminal are pressed while the device terminal of the conductive device is overlaid on the substrate terminal, the device terminal contacts over the entire surface of the substrate terminal on the top, so that the force is locally applied to the device terminal and the substrate terminal. Can be avoided. Therefore, the substrate unit (substrate terminal) and the conductive device (device terminal) can be appropriately joined electrically and physically while preventing damage.

  The top portions of the plurality of support portions may be arranged on the same plane.

  According to this aspect, the substrate terminal can be formed accurately and flat on each top.

  Each of the plurality of substrate terminals may be provided over a plurality of top portions.

  According to this aspect, since each board | substrate terminal is provided over several top parts, a space is formed between these several top parts, and the said space can be effectively utilized for the arrangement | positioning space etc. of an adhesive agent.

  The plurality of top portions on which each of the plurality of substrate terminals is provided may be spaced apart from each other in one direction.

  The plurality of top portions on which each of the plurality of substrate terminals is provided may be spaced apart from each other in a plurality of directions.

  According to these aspects, a space can be formed with respect to the separation direction of the top portion, and the space can be effectively used as an adhesive placement space or the like.

  Each of the plurality of substrate terminals may be provided over the tops of the two or more support portions.

  According to this aspect, since each board terminal is provided over the top part of two or more support parts, a space can be formed between the top parts allocated to each board terminal, and the space can be effectively used as an arrangement space for the adhesive.

  The plurality of top portions on which each of the plurality of substrate terminals is provided may be formed by a single support portion.

  According to this aspect, the plurality of top portions assigned to each substrate terminal are formed by the single support portion, and each substrate terminal can be accurately supported by the support portion.

  The cross section of the notch between the tops formed by a single support may include a curved portion at the boundary between the notch and the single support.

  The cross section of the notch between the plurality of top portions formed by the single support portion may include a plurality of linear portions at the boundary between the notch portion and the single support portion.

  According to these aspects, depending on the desired physical adhesion of the substrate unit to the conductive device and the desired electrical connection of the substrate terminal to the device terminal of the conductive device, a notch having an appropriate shape is provided. It can be formed between the tops of the supports.

  Each of the plurality of support portions may have a quadrangular cross-sectional shape.

  According to this aspect, the flat top portion of the support portion can be formed with high accuracy.

  The base part may include a base material layer and a base layer provided between the base material layer and the support part.

  According to this aspect, the substrate unit and the conductive device can be electrically and physically bonded while preventing not only the base material layer but also the underlying layer from being damaged.

  Another aspect of the present invention relates to an adhesive substrate unit comprising the above substrate unit and an adhesive portion provided on at least one of a base portion of the substrate unit, a plurality of support portions, and a plurality of substrate terminals. .

  Another aspect of the present invention is the above-described substrate unit, a conductive device having a plurality of device terminals electrically connected to each of the plurality of substrate terminals of the substrate unit, and an adhesive portion for bonding the substrate unit and the conductive device And a conductive unit.

  According to the present invention, the substrate terminal is provided on the flat top portions of the plurality of support portions having the same height from the base portion, and the substrate terminal can be formed flat with high accuracy. Therefore, even if the device terminal and the substrate terminal are pressed while the device terminal of the conductive device is overlaid on the substrate terminal, the device terminal contacts over the entire surface of the substrate terminal on the top, so that the force is locally applied to the device terminal and the substrate terminal. Can be avoided. As described above, according to the present invention, the board unit and the conductive device can be appropriately joined electrically and physically while preventing damage.

FIG. 1 is a view showing an example of a cross section of a crimping portion of a substrate unit and a conductive device according to an embodiment of the present invention. FIG. 2 is a diagram illustrating an example of an arrangement form of support portions in units of pads. FIG. 3 is a diagram illustrating an example of a cross-sectional shape of the support portion in units of pads. FIG. 4 is a perspective view of the substrate unit, the ACF, and the conductive device to be bonded to each other. FIG. 5 is a plan view illustrating an example of a substrate terminal of the substrate unit. FIG. 6 is a conceptual diagram illustrating an example of a cross section of the crimping portion of the substrate unit, the ACF, and the conductive device illustrated in FIG. 4.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is a diagram illustrating an example of a cross section of a crimping portion of a substrate unit 30 and a conductive device 32 according to an embodiment of the present invention.

  In the present embodiment, the substrate terminal 33 is formed on the flat top portion 13 of the support portion 12 provided in the substrate unit 30, and the substrate terminal 30 and the conductive device 32 are brought into contact with each other by contacting the substrate terminal 33 and the device terminal 34. The electrical connection is realized. On the other hand, physical bonding between the substrate unit 30 and the conductive device 32 is realized by the adhesive 10 such as an adhesive interposed between the substrate unit 30 and the conductive device 32. In the present specification, the term “adhesion” is used as a concept including “adhesion”.

  That is, the substrate unit 30 of this embodiment includes a base material layer 35, a base layer 36 stacked on the base material layer 35, and a plurality of support portions 12 provided on the base layer 36. An underlayer 36 is provided between 35 and the support portion 12. The constituent members of the base material layer 35 and the base layer 36 are not particularly limited, and the base material layer 35 can be made of a film such as glass or resin, and the base layer 36 is made of, for example, PI (polyimide) or other overcoat agent. Can be configured. The underlayer 36 is installed as a member that exhibits an arbitrary function such as improvement of the holding performance of the support portion 12 and the substrate terminal 33 on the base material layer 35 and adjustment of the refractive index. The formation 36 can be provided. In this example, the base portion that supports the support portion 12 is configured by the base material layer 35 and the base layer 36, but the base portion may include other layers, or the base portion may be configured only by the base material layer 35. Good.

  Each of the plurality of support portions 12 has a flat top portion 13 on which the substrate terminal 33 is placed. The top portions 13 of the plurality of support portions 12 have the same height from the base layer 36 (base portion) and are arranged on the same plane. A plurality of substrate terminals 33 are placed on the top portions 13 of the plurality of support portions 12. The constituent member of the substrate terminal 33 is not particularly limited, and the substrate terminal 33 can be configured by, for example, ITO, silver paste, or other metal wiring.

The “flat top portion 13” here is ideally the same in height from the base layer 36 (base portion) of each top portion 13. The same identity is not required. That is, the height from the base layer 36 (base) at an arbitrary position in each top portion 13 is represented by “h”, and the average height from the base layer 36 (base portion) in each top portion 13 is represented by “h _ave. , The representative value of the height of each top 13 from the base layer 36 (base) (for example, the average value (h _ave )) is represented by “H”, and the average value of the representative values of each top 13 is represented by “H _ave ”. "The flat top 13" satisfies the following relational expression 1, and the tops 13 of the plurality of support parts 12 having the same height from the base layer 36 (base) are represented by the following relational expression 2. It is preferable from the viewpoint of improving the reliability of a product (for example, a product made by photolithography).

<Relational expression 1>
0 μm ≦ | (h−h _ave ) | ≦ 3 μm

<Relational expression 2>
0 μm ≦ | (H−H _ave ) | ≦ 3 μm

  Each of the plurality of substrate terminals 33 is provided over the plurality of top portions 13, and each substrate terminal 33 is provided on two or more top portions 13 provided at positions separated from each other. In particular, in this example, each of the plurality of substrate terminals 33 is provided over the top portions 13 of the two or more support portions 12, and each substrate terminal 33 includes “the whole of these two or more support portions 12” and “these two”. It extends in “between the support parts 12”.

  In the example shown in FIG. 1, each of the plurality of support portions 12 has a trapezoidal cross-sectional shape, but the shape is not particularly limited as long as it has a flat portion at the top portion 13, and other quadrilateral cross-sectional shapes. Or may have other cross-sectional shapes as described later (see FIGS. 3A and 3B).

  As described above, the substrate unit 30 according to the present embodiment includes the base portion (base material layer 35 and base layer 36), the plurality of support portions 12, and the plurality of substrate terminals 33 placed on the top portions 13 of the plurality of support portions 12. Prepare. The conductive device 32 is bonded to the substrate unit 30 via the adhesive 10 that functions as an adhesive portion.

  The conductive device 32 has a device body 38 and device terminals 34 supported by the device body 38. Each device terminal 34 is placed on a corresponding substrate terminal 33, and electrical connection is established between the device terminal 34 (conductive device 32) and the substrate terminal 33 (substrate unit 30).

  The space between the conductive device 32 and the substrate unit 30 is filled with the adhesive 10, and the conductive device 32 (the device main body 38 and the device terminal 34) is located at a place other than the contact portion between the device terminal 34 and the substrate terminal 33. The substrate unit 30 (base (base layer 36) and substrate terminal 33) is physically bonded by the adhesive 10.

  The arrangement | positioning method of the adhesive agent 10 between the electroconductive device 32 and the board | substrate unit 30 is not specifically limited. For example, the adhesive 10 may be disposed on the substrate unit 30 (the substrate terminal 33 and the base layer 36) by an arbitrary device such as a dispenser or an inkjet device, or the substrate unit 30 (the substrate terminal 33) by a technique such as photolithography. And the adhesive 10 may be disposed on the underlying layer 36).

  There are no particular limitations on the composition and bonding mode of the adhesive 10, and the adhesive 10 may be composed of, for example, a thermosetting resin, a thermoplastic resin, a UV (Ultraviolet) curable resin, or an EB (Electron Beam) curable resin. . For example, the adhesive 10 is disposed at a predetermined location on the substrate unit 30, and heating, cooling, UV irradiation, or EB irradiation is performed in a state where the conductive device 32 is pressed against the substrate unit 30 on which the adhesive 10 is placed. The conductive unit 20 shown in FIG. 1 can be manufactured by curing the adhesive 10 by, for example. In addition, what provided the adhesive agent 10 on the predetermined location (at least one of the base part (underlayer 36), the some support part 12, and the some board terminal 33) of the board | substrate unit 30 is used as an adhesion board unit. Can be handled. In this case, the conductive unit 20 can be simply manufactured by simply curing the adhesive 10 by heating, cooling, UV irradiation, EB irradiation, or the like in a state where the conductive device 32 is disposed on the adhesive substrate unit.

  The adhesive 10 disposed on the substrate unit 30 is preferably disposed so as to protrude in the height direction from the substrate terminal 33 provided on the top portion 13. In this case, the adhesive 10 can be reliably brought into contact with the conductive device 32 when the conductive device 32 is pressed against the substrate unit 30 (adhesive substrate unit), and the adhesive unit 10 allows the substrate unit 30 and the conductive device 32 to be brought into contact with each other. Can be properly bonded. In consideration of the portion of the adhesive 10 that is pushed away by the conductive device 32 when the conductive device 32 is pressed against the substrate unit 30 (adhesive substrate unit), the arrangement mode and the arrangement amount of the adhesive 10 on the entire substrate unit 30 are determined. It is preferable to decide. In particular, the adhesive 10 pushed away by the conductive device 32 does not enter the contact portion between the device terminal 34 and the board terminal 33 and cause an electrical contact failure between the device terminal 34 and the board terminal 33. As described above, it is required to determine the arrangement mode and the arrangement amount of the adhesive 10 arranged on the base (base layer 36) and the substrate terminal 33.

  As described above, the conductive unit 20 according to the present embodiment includes the substrate unit 30, the conductive device 32 having the plurality of device terminals 34 electrically connected to each of the plurality of substrate terminals 33 of the substrate unit 30, and the substrate unit 30. And an adhesive 10 for bonding the conductive device 32 to each other.

<Planar shape of the support part 12>
If an appropriate electrical connection is established between the substrate terminal 33 provided on the top portion 13 of the support portion 12 and the device terminal 34, the substrate terminal 33 and the support portion 12 connected to each device terminal 34. There is no particular limitation on the arrangement form and the planar shapes of the substrate terminals 33 and the support portions 12.

  FIG. 2 is a diagram showing an example of the arrangement form of the support portions 12 in units of pads P. For convenience of explanation, only the planar shape of the top portion 13 of the support portion 12 is shown. Each pad P includes a single device terminal 34, a substrate terminal 33 electrically connected to the single device terminal 34, and a support portion 12 that supports the substrate terminal 33.

  The plurality of top portions 13 provided with each of the plurality of substrate terminals 33 may be spaced apart from each other in one direction, for example, as shown in FIGS. Is not particularly limited. For example, in each pad P, a plurality of (for example, three) elongated top portions 13 may be arranged apart from each other in a direction perpendicular to the extending direction (see FIG. 2A). The two top portions 13 may be spaced apart so that the top portion 13 is divided at the center portion of each pad P (see FIG. 2B).

  Further, the plurality of top portions 13 provided with each of the plurality of substrate terminals 33 may be arranged to be separated from each other in a plurality of directions as shown in FIG. For example, in each pad P, a plurality (for example, three in the vertical direction and three in the horizontal direction (a total of nine)) of the top portions 13 are mutually connected with respect to each of the vertical direction and the horizontal direction of the pads P that are perpendicular to each other. They may be spaced apart (see FIG. 2C).

  Each of the plurality of substrate terminals 33 may be provided on a single top portion 13. For example, as shown in FIG. 2 (d), a single portion is provided at a location (central portion) other than the peripheral portion of each pad P. A top 13 may be arranged.

  In addition, the adhesive 10 is arrange | positioned between the some top parts 13, and the ratio for which the adhesive 10 occupies can be enlarged from a viewpoint of giving priority to the physical adhesiveness between the board | substrate unit 30 and the electrically-conductive device 32. FIG. preferable. Further, from the viewpoint of giving priority to the electrical connectivity between the substrate unit 30 (substrate terminal 33) and the conductive device 32 (device terminal 34), the proportion of the top portion 13 on which the substrate terminal 33 is placed is increased. It is preferable to do. Moreover, in order to adhere | attach the board | substrate unit 30 and the electrically conductive device 32 over the whole of each pad P physically appropriately, it is preferable that the adhesive agent 10 is arrange | positioned over the whole of each pad P. Further, in order to electrically connect the board unit 30 and the conductive device 32 over the entire pad P, it is preferable that the top portion 13 on which the board terminal 33 is placed is arranged over the entire pad P. .

<Cross-sectional shape of the support part 12>
If each support portion 12 is formed with a flat top portion 13 and an appropriate electrical connection is established between the substrate terminal 33 and the device terminal 34 on each top portion 13, it is connected to each device terminal 34. The cross-sectional shapes of the substrate terminal 33 and the support portion 12 to be used are not particularly limited.

  FIG. 3 is a diagram showing an example of a cross-sectional shape of the support portion 12 in the pad P unit. For example, when each of the plurality of substrate terminals 33 is provided on the plurality of top portions 13, the “plurality of top portions 13” on which each substrate terminal 33 is provided may be formed by the plurality of support portions 12 (FIG. 1). (See FIG. 3 (a) and (b)). In the example shown in FIG. 1, each device terminal 34 is electrically connected to a substrate terminal 33 provided on the top portions 13 of the plurality of support portions 12, and each support portion 12 has one flat top portion 13. ing. On the other hand, in the example shown in FIGS. 3A and 3B, each device terminal 34 is electrically connected to the substrate terminal 33 provided on the plurality of top portions 13 included in the single support portion 12. Each device terminal 34 is a board terminal 33 provided over the plurality of support parts 12, and may be electrically connected to the board terminal 33 provided on the plurality of top parts 13 included in each support part 12.

  In addition, when the plurality of top portions 13 provided with the respective substrate terminals 33 are formed by the single support portion 12, the cross-sectional shape of the notch portions 14 between the plurality of top portions 13 formed by the single support portion 12 is also particularly great. It is not limited. For example, the cross section of each notch portion 14 may include an arcuate curved portion as shown in FIG. 3 (a) at the boundary between the notch portion 14 and the support portion 12, or FIG. 3 (b). As shown, a plurality of straight portions may be included. The shape and size of the notch 14 are such that the workability of the support 12, the ease of forming the substrate terminal 33 on the support 12, the electrical connection performance between the substrate terminal 33 and the device terminal 34, and the adhesive 10 Can be determined as appropriate based on various viewpoints such as the disposition of the substrate and the physical adhesion performance between the substrate terminal 33 and the device terminal 34.

<Manufacturing method>
The conductive unit 20 (the substrate unit 30, the adhesive 10, and the conductive device 32) can be manufactured by any method. Typically, the adhesive 10 is interposed between the “substrate unit 30 including the base layer 35, the base layer 36, the support 12, and the substrate terminal 33” and the “conductive device 32 including the device body 38 and the device terminal 34”. The conductive unit 20 can be manufactured by arranging the substrate 10, curing the adhesive 10, and bonding the substrate unit 30, the conductive device 32, and the adhesive 10. Alternatively, the “adhesive substrate unit including the substrate unit 30 and the adhesive 10” and the “conductive device 32 including the device main body 38 and the device terminal 34” are arranged in an overlapping manner, and the adhesive 10 is cured to be conductive with the substrate unit 30. The conductive unit 20 can be manufactured by joining the device 32 via the adhesive 10.

  A method for manufacturing individual members constituting the substrate unit 30 and the conductive device 32 is not particularly limited, and the desired substrate unit 30 and the conductive device 32 can be formed by using, for example, an arbitrary coating technique (coating technique).

  In particular, the “support portion 12 having the flat top portion 13” can be preferably manufactured by photolithography, and the support portion 12 can be preferably configured by a photo-curing type photosensitive resin (for example, acrylic resin). Photolithography generally includes a resist coating process on a base, a resist exposure process using a mask, and a development process for removing unnecessary resist, and a pre-bake process and a developer for promoting solidification of the resist as necessary. Other processes such as a post-bake process for urging the removal are performed. For example, by forming the support portion 12 with a negative resist used in photolithography, the top portion 13 of the support portion 12 can be formed accurately and flatly, and a substrate terminal 33 and a device terminal 34 provided on the top portion 13 are formed. Effectively prevent damage during crimping. For example, when the conductive unit 20 is applied to a touch panel sensor, the substrate terminal 33 is connected to a detection electrode provided in the conductive unit 20.

<Specific application examples>
The specific configurations and application fields of the substrate unit 30 and the conductive device 32 are not particularly limited. The substrate unit 30 can typically be configured by a glass substrate, FPC, TCP (Tape Carrier Package), IC (Integrated Circuit), and / or PCB (Printed Circuit Board). The conductive unit 20 including the substrate unit 30 and the conductive device 32 is preferably used in the field of touch sensors and the like, and can be applied to various methods such as an OGS (One Glass Solution) method, an in-cell method, and an on-cell method.

  As described above, according to the present embodiment, the substrate terminal 33 is provided on the flat top portions 13 of the plurality of support portions 12 having the same height from the base portion (the base layer 36), and the substrate terminal 33 can be formed flat with high accuracy. Therefore, even if the device terminal 34 and the substrate terminal 33 are pressed in a state where the device terminal 34 of the conductive device 32 is superimposed on the substrate terminal 33, the device terminal 34 contacts the entire surface of the substrate terminal 33 on the top portion 13. It is possible to prevent the force from being concentrated locally at the terminal 34 and the board terminal 33. Thus, according to the present embodiment, the substrate unit 30 (substrate terminal 33) and the conductive device 32 (device terminal 34) can be appropriately joined electrically and physically while preventing damage.

  In particular, even if the base portion includes the base layer 36 as in the above-described embodiment shown in FIG. 1, by forming the substrate terminal 33 on the support portion 12 having the flat top portion 13, The substrate unit 30 (substrate terminal 33) and the conductive device 32 (device terminal 34) can be appropriately electrically and physically bonded while preventing the film breakage of the formation 36.

  The present invention is not limited to the above-described individual embodiments, but may include forms with various modifications that can be conceived by those skilled in the art, and the effects of the present invention are not limited to the above-described contents. . That is, various additions, changes, and partial deletions can be made without departing from the concept and spirit of the present invention derived from the contents defined in the claims and equivalents thereof.

DESCRIPTION OF SYMBOLS 10 Adhesive 12 Support part 13 Top part 14 Notch part 20 Conductive unit 30 Substrate unit 32 Conductive device 33 Substrate terminal 34 Device terminal 35 Base material layer 36 Underlayer 37 Conductive particle 38 Device main body F Crimping force D Damaged part P Pad

Claims (13)

The base,
A plurality of support portions provided on the base;
A plurality of substrate terminals provided on the plurality of support parts,
Each of the plurality of support portions has a flat top portion,
The plurality of substrate terminals are provided on the tops of the plurality of support portions,
The top portions of the plurality of support portions are substrate units having the same height from the base portion.   The substrate unit according to claim 1, wherein the top portions of the plurality of support portions are arranged on the same plane.   The substrate unit according to claim 1, wherein each of the plurality of substrate terminals is provided over the plurality of top portions.   The board unit according to claim 3, wherein the plurality of top portions on which each of the plurality of board terminals is provided are spaced apart from each other in one direction.   The board unit according to claim 3, wherein the plurality of top portions on which each of the plurality of board terminals is provided are spaced apart from each other in a plurality of directions.   6. The board unit according to claim 3, wherein each of the plurality of board terminals is provided over the top parts of the two or more support parts.   The substrate unit according to claim 3, wherein the plurality of top portions on which the plurality of substrate terminals are provided are formed by a single support portion.   8. The substrate unit according to claim 7, wherein a cross section of the cutout portion between the plurality of top portions formed by the single support portion includes a curved portion at a boundary between the cutout portion and the single support portion.   The substrate unit according to claim 7, wherein a cross section of the notch portion between the plurality of top portions formed by the single support portion includes a plurality of linear portions at a boundary between the notch portion and the single support portion. .   Each of these support parts is a board | substrate unit as described in any one of Claims 1-9 which has square-shaped cross-sectional shape.   The said base part is a board | substrate unit as described in any one of Claims 1-10 containing a base material layer and the base layer provided between the said base material layer and the said support part. The substrate unit according to any one of claims 1 to 11,
An adhesive substrate unit comprising: an adhesive portion provided on at least one of the base portion, the plurality of support portions, and the plurality of substrate terminals of the substrate unit. The substrate unit according to any one of claims 1 to 11,
A conductive device having a plurality of device terminals electrically connected to each of the plurality of substrate terminals of the substrate unit;
A conductive unit comprising: an adhesive portion that bonds the substrate unit and the conductive device.

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