JP2017028200A5 - - Google Patents

Download PDF

Info

Publication number
JP2017028200A5
JP2017028200A5 JP2015147882A JP2015147882A JP2017028200A5 JP 2017028200 A5 JP2017028200 A5 JP 2017028200A5 JP 2015147882 A JP2015147882 A JP 2015147882A JP 2015147882 A JP2015147882 A JP 2015147882A JP 2017028200 A5 JP2017028200 A5 JP 2017028200A5
Authority
JP
Japan
Prior art keywords
lead frame
lead
opening
semiconductor element
resin layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015147882A
Other languages
English (en)
Japanese (ja)
Other versions
JP6505540B2 (ja
JP2017028200A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2015147882A priority Critical patent/JP6505540B2/ja
Priority claimed from JP2015147882A external-priority patent/JP6505540B2/ja
Publication of JP2017028200A publication Critical patent/JP2017028200A/ja
Publication of JP2017028200A5 publication Critical patent/JP2017028200A5/ja
Application granted granted Critical
Publication of JP6505540B2 publication Critical patent/JP6505540B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2015147882A 2015-07-27 2015-07-27 半導体装置及び半導体装置の製造方法 Active JP6505540B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015147882A JP6505540B2 (ja) 2015-07-27 2015-07-27 半導体装置及び半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015147882A JP6505540B2 (ja) 2015-07-27 2015-07-27 半導体装置及び半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2017028200A JP2017028200A (ja) 2017-02-02
JP2017028200A5 true JP2017028200A5 (enrdf_load_stackoverflow) 2018-04-26
JP6505540B2 JP6505540B2 (ja) 2019-04-24

Family

ID=57949955

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015147882A Active JP6505540B2 (ja) 2015-07-27 2015-07-27 半導体装置及び半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP6505540B2 (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6909629B2 (ja) * 2017-05-10 2021-07-28 ローム株式会社 半導体装置
JP7022541B2 (ja) * 2017-09-11 2022-02-18 ローム株式会社 半導体装置
JP2019110278A (ja) * 2017-12-20 2019-07-04 株式会社デンソー 半導体装置
TWI737505B (zh) * 2020-09-29 2021-08-21 力成科技股份有限公司 封裝結構
JP7450575B2 (ja) 2021-03-18 2024-03-15 株式会社東芝 半導体装置及びその製造方法
WO2024203110A1 (ja) * 2023-03-24 2024-10-03 ローム株式会社 半導体装置、および半導体装置の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3436159B2 (ja) * 1998-11-11 2003-08-11 松下電器産業株式会社 樹脂封止型半導体装置の製造方法
JP3046024B1 (ja) * 1999-04-23 2000-05-29 松下電子工業株式会社 リ―ドフレ―ムおよびそれを用いた樹脂封止型半導体装置の製造方法
JP5122835B2 (ja) * 2007-02-27 2013-01-16 ローム株式会社 半導体装置、リードフレームおよび半導体装置の製造方法
JP5126687B2 (ja) * 2009-02-16 2013-01-23 大日本印刷株式会社 樹脂封止型半導体装置、リードフレーム、リードフレームの製造方法、および樹脂封止型半導体装置の製造方法
JP5319571B2 (ja) * 2010-02-12 2013-10-16 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US8389330B2 (en) * 2010-06-24 2013-03-05 Stats Chippac Ltd. Integrated circuit package system with package stand-off and method of manufacture thereof

Similar Documents

Publication Publication Date Title
JP2017028200A5 (enrdf_load_stackoverflow)
JP2016018931A5 (enrdf_load_stackoverflow)
JP2013247131A5 (ja) 半導体装置
JP2014195041A5 (enrdf_load_stackoverflow)
JP2019515509A5 (enrdf_load_stackoverflow)
JP2015035590A5 (enrdf_load_stackoverflow)
JP2016072492A5 (enrdf_load_stackoverflow)
JP2016072493A5 (enrdf_load_stackoverflow)
JP2008227531A5 (enrdf_load_stackoverflow)
JP2013179295A5 (enrdf_load_stackoverflow)
JP2013168644A5 (ja) 半導体装置
EP3267485A3 (en) Sensor package structure
JP2017183578A5 (enrdf_load_stackoverflow)
JP2015008237A5 (enrdf_load_stackoverflow)
JP2013219253A5 (enrdf_load_stackoverflow)
JP2016059148A5 (ja) パワー半導体モジュール及びその製造方法、電力変換装置
JP2016082048A5 (enrdf_load_stackoverflow)
JP2013225595A5 (enrdf_load_stackoverflow)
JP2015119011A5 (enrdf_load_stackoverflow)
JP2012209396A5 (enrdf_load_stackoverflow)
JP2015159321A5 (enrdf_load_stackoverflow)
JP2010171181A5 (enrdf_load_stackoverflow)
JP2015111667A5 (ja) 半導体装置
EP2927953A3 (en) Semiconductor device
JP2015015313A5 (enrdf_load_stackoverflow)