JP2017022409A5

JP2017022409A5 -

Info

Publication number: JP2017022409A5
Application number: JP2016196315A
Authority: JP
Filing date: 2016-10-04
Publication date: 2017-03-02
Anticipated expiration: 2034-02-06

Description

実施形態の一態様に係る基板処理方法は、処理液供給工程と、収容工程と、取出工程と、除去工程とを含む。処理液供給工程は、内部に形成される金属配線の少なくとも一部が露出したドライエッチング後またはアッシング後であって反応生成物が付着した基板に対し、揮発成分を含み基板上に膜を形成するための処理液を供給する。収容工程は、揮発成分が揮発することによって処理液が固化または硬化した基板を搬送容器へ収容する。取出工程は、搬送容器に収容された処理液供給工程後の基板を取り出す。除去工程は、取出工程後、固化または硬化した処理液を基板から除去する。また、除去工程は、固化または硬化した処理液に対して該処理液を除去する除去液を供給することにより、固化または硬化した処理液とともに反応生成物を基板から除去する。 The substrate processing method which concerns on the one aspect | mode of embodiment contains a process liquid supply process, the accommodation process, the extraction process, and the removal process . In the treatment liquid supply process, a film containing a volatile component is formed on the substrate after the dry etching or ashing in which at least a part of the metal wiring formed therein is exposed and the reaction product is attached. The processing liquid for supplying is supplied. In the storing step, the substrate in which the processing liquid is solidified or hardened by volatilization of the volatile component is stored in the transport container. In the extraction step, the substrate after the processing liquid supply step accommodated in the transfer container is extracted. In the removing step, the solidified or hardened processing liquid is removed from the substrate after the removing step. Further, in the removing step, the reaction product is removed from the substrate together with the solidified or hardened processing liquid by supplying a removing liquid for removing the processing liquid to the solidified or hardened processing liquid.

Claims

Supply processing liquid to form a film on the substrate containing volatile components to the substrate to which reaction products have adhered after dry etching or ashing where at least part of the metal wiring formed inside is exposed A processing liquid supply step to perform,
An accommodating step of accommodating the substrate in which the processing liquid is solidified or cured by volatilization of the volatile component in a transport container ;
An extraction step of taking out the substrate after the treatment liquid supply step accommodated in the transfer container;
After the removal step, seen including a removal step of removing the solidified or cured the processing liquid from the substrate,
The removal step includes
A substrate processing method, wherein the reaction product is removed from the substrate together with the solidified or hardened processing liquid by supplying a removing liquid for removing the processing liquid to the solidified or hardened processing liquid. .

In the accommodating step, the reaction product is contained in the processing liquid covering the metal wiring in a state of being separated from the substrate.
The substrate processing method according to claim 1.

Prior to the treatment liquid supply step, a pretreatment step for performing a chemical treatment for facilitating removal of the reaction product.
The substrate processing method according to claim 1, further comprising:

A post-processing step of performing a chemical treatment for removing the remaining reaction product on the substrate after the removing step
The substrate processing method according to claim 1, comprising:

Perform dry etching on the substrate before the process liquid supply step to form inside the substrate
A dry etching step of exposing at least a part of the metal wiring to be performed;
After the dry etching process, the substrate is kept outside until the process liquid supply process is started.
And the outside air blocking process
The substrate processing method according to claim 1, further comprising:

A placement unit for placing a transport container capable of accommodating a plurality of substrates; and
Supply processing liquid to form a film on the substrate containing volatile components to the substrate to which reaction products have adhered after dry etching or ashing where at least part of the metal wiring formed inside is exposed A processing liquid supply unit
A first substrate transport device that transports the substrate on which the processing liquid is solidified or hardened by volatilization of the volatile component to the placement unit, and stores the substrate in the transport container placed on the placement unit ;
A second substrate transfer device for taking out the substrate accommodated in the transfer container;
A removal liquid supply unit for supplying a removal liquid for removing the solidified or hardened processing liquid from the substrate taken out by the second substrate transfer device;
With
The removal liquid supply unit includes:
A removal liquid that removes the reaction product from the substrate is supplied together with the solidified or cured treatment liquid by supplying a removal liquid that removes the treatment liquid to the solidified or cured treatment liquid. Substrate processing system.

In the substrate accommodated in the transfer container, the reaction product is contained in the processing liquid covering the metal wiring in a state of being separated from the substrate.
The substrate processing system according to claim 6.

Prior to the supply of the treatment liquid by the treatment liquid supply unit, a first chemical solution supply unit that supplies a chemical solution for facilitating removal of the reaction product.
The substrate processing system according to claim 6, further comprising:

A second chemical solution supply unit that supplies a chemical solution for removing the remaining reaction product to the substrate processed by the removal solution supplied by the removal solution supply unit
The substrate processing system according to claim 6, further comprising:

A dry etching portion that performs dry etching on the substrate and exposes at least part of the metal wiring formed in the substrate;
A first block including the placement unit, the first and second substrate transfer devices, and the dry etching unit;
A second block including the processing liquid supply unit;
A connecting portion having an internal space cut off from the atmosphere and connecting the first block and the second block;
The substrate processing system according to claim 6, further comprising:

A computer-readable storage medium that operates on a computer and stores a program for controlling the substrate processing system,
A storage medium characterized by causing the computer to control the substrate processing system so that the substrate processing method according to any one of claims 1 to 5 is performed when the program is executed.