JP2017020850A - Manufacturing monitor device of film circuit substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing monitor device that can suppress defect occurrence of a film circuit pattern attached to a surface of a film-like substrate material beforehand.SOLUTION: A manufacturing monitor device 1 is used in a manufacturing device 2 that forms a circuit pattern on a flexible and elastic film substrate 100 using a printing plate, and manufactures a film circuit substrate, and manages a manufacturing situation of the film circuit substrate. The manufacturing monitor device 1 comprises: an image measurement unit that measures a distance between arbitrary two points in a circuit pattern, a distance between continuous different circuit patterns, a circuit line width of the circuit pattern, or a width between lines on the basis of an image photographed by an imaging unit 5 photographing the circuit pattern; a detection unit that analyzes a tendency of measurement data measured by the image measurement unit; and a determination output unit that, when it is determined that a defect is likely to occur in the manufacturing of the film circuit substrate on the basis of the analysis result, outputs warning information.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an apparatus for manufacturing management of a film circuit board, which is used together with a manufacturing apparatus for a film circuit board for forming a circuit pattern on a roll-like or sheet-like flexible and stretchable film.

  For example, flexible and stretchable films, sheets, and tapes as substrate materials used for circuit boards, which are one of the main materials used in integrated circuits used in semiconductor devices such as liquid crystal display devices and memories Etc. are being widely used. A circuit board using a substrate material such as a film is manufactured by forming a fine circuit pattern on the surface of the substrate material using a means such as printing or photolithography.

  In such a film circuit board, in the process of adding a circuit pattern by printing or photolithography, various defects such as disconnection, short circuit, protrusion, dent, etc. occur in the circuit pattern. The demand for effective inspection is increasing rapidly.

  On the other hand, in these film circuit boards, circuit pattern line width and line width (L / S) have been miniaturized, and in recent years, extremely fine circuit patterns of 30 μm or less are used. In addition, the market needs for products exceeding 50 inches used for large touch panels and white boards are expanding, and the product size tends to increase.

  It is virtually impossible to carry out visual inspection for all the circuit boards whose circuit patterns are miniaturized and products are enlarged, and detection of defects is a problem. For this reason, there is known an electrical continuity tester that uses a device for inspecting a defect in a circuit pattern, applies weak electricity to the circuit pattern, and measures its resistance value to inspect the circuit pattern.

  However, this device can detect a disconnection or a short circuit, which is a typical functional defect of a circuit pattern, but cannot detect an L / S defect such as a half disconnection or a short circuit. On the other hand, in a circuit pattern to be miniaturized, since the resistance value and impedance change depending on the line width and the line width, the product that should be judged as a non-defective product may be judged as defective, and there is a problem in the reliability of inspection. It was.

  As an apparatus for discriminating a defect of a film circuit board that has solved the above-mentioned problem, for example, Patent Document 1 (Japanese Patent Laid-Open No. 2005-283583) acquires an optical image and processes it by image processing and a computer. An apparatus for determining the quality of a pattern is disclosed.

  This device uses the video data acquired from the printed circuit board using transmitted light and reflected light, and the brightness meter brightness of each pixel is determined in comparison with the data of the standard appropriate as a non-defective product. A different threshold is used as a threshold according to level, and the pattern area is subdivided and determined. According to this apparatus, since the non-defective product is discriminated using the subdivided reference threshold, it is possible to prevent overdetection.

JP-A-2005-283583

  However, since the film circuit board measures the circuit board formed on the stretchable film, the circuit pattern attached to the surface is deformed by the expansion / contraction or deflection of the film itself, which is the substrate material. There is a problem that alignment with images is difficult and comparative inspection is not easy.

  Moreover, in order to continuously inspect circuit patterns using a roll film as a substrate material, it is necessary to incorporate these imaging devices in the middle of the production line, and inspection is required at the line feed rate. Therefore, there has been a problem that 100% inspection is difficult.

  In particular, these problems are particularly apparent in the inspection of film substrates with finer circuit patterns and larger products, and it is still very difficult to perform defect inspections with high accuracy and high speed, particularly 100% inspection. Met.

  For this reason, in the conventional inspection apparatus, the fluctuation of the circuit pattern is checked by sampling inspection of a part of the manufactured product. However, the sampling inspection after manufacturing cannot suppress the occurrence of defective product itself. As a result, there was a problem that the loss of product disposal increased.

  Therefore, the technical problem to be solved by the present invention is to suppress the occurrence of defects in the film circuit pattern in which the circuit pattern is attached to the surface of the film-like substrate material or to immediately detect the occurrence of defects. An object of the present invention is to provide a production monitoring device for a film circuit pattern. That is, the monitoring in the present invention represents two meanings: monitoring for preventing the occurrence of defects in advance and monitoring for immediately detecting the generated defects.

  In order to solve the above technical problems, the present invention provides a film circuit pattern production monitoring apparatus having the following configuration.

According to the first aspect of the present invention, a film circuit board is manufactured for use in a manufacturing apparatus for manufacturing a film circuit board for forming a circuit pattern on a substrate material composed of a film, and monitors the manufacturing status of the film circuit board. A monitoring device,
An imaging unit for imaging the circuit pattern of the film circuit board;
Based on the image of the circuit pattern imaged by the imaging unit, at least a distance between any two points in the circuit pattern, a distance between two consecutive circuit patterns, a circuit line width or an inter-line width of the circuit pattern An image measuring unit for measuring one;
A film circuit board production monitoring apparatus comprising: a detection unit that detects fluctuation based on measurement data measured by the image measurement unit.

  According to a second aspect of the present invention, when it is determined that a defect occurs in the film circuit board based on a detection result by the detection unit, the first aspect includes a determination output unit that outputs information. A film circuit board production monitoring apparatus is provided.

  According to a third aspect of the present invention, the detection unit compares the measurement data measured by the image measurement unit in time series, and derives a predicted value that the measurement data exceeds a threshold value, thereby the film circuit. There is provided a film circuit board production monitoring apparatus according to a second aspect, characterized by comprising analysis means for judging that a defect occurs in a substrate.

  According to a fourth aspect of the present invention, the determination output unit outputs the information at a timing at which the predicted value is predicted to exceed a threshold value. A monitoring device is provided.

According to a fifth aspect of the present invention, the manufacturing apparatus uses a rotary printing machine, uses a roll-shaped film as a substrate material, and the circuit pattern is conveyed during path conveyance for continuously feeding the roll-shaped film. Is configured to form,
The determination output unit includes a signal for controlling a conveyance speed of the roll-shaped film or a rotation speed of the plate in the information, and manufacturing the film circuit board according to any one of the second to fourth aspects, A monitoring device is provided.

According to a sixth aspect of the present invention, the manufacturing apparatus is a screen printing machine,
The determination output unit provides a film circuit board production monitoring apparatus according to any one of the second to fifth aspects, wherein the information includes a signal for controlling an ink discharge amount of the screen printing machine. .

  According to the present invention, an in-line inspection is possible by imaging a circuit pattern with an imaging unit provided in the middle of a production line and measuring at least one of a distance, a line width, or a line width of the circuit pattern. Moreover, since the tendency of fluctuation of the measurement value is analyzed and it is determined whether or not a defect occurs, the occurrence of a defective defect can be prevented in advance. In addition, when an abnormal measurement value is detected, it is possible to immediately detect the occurrence of a defective defect. That is, as a measurement item, measure at least one of the distance between any two points in the circuit pattern, the distance between the same points of consecutive different circuit patterns, the circuit line width or the line width of the circuit pattern. Thus, it is possible to predict the cause of defective defects such as plate deterioration and unstable production speed of the film circuit board. Further, by generating warning information based on the prediction result and making it possible to suppress the occurrence of defective defects, it is possible to reduce the occurrence of disposal loss and the like. In addition, when a sudden abnormality in the measured value is detected, the continuous generation of defective defects can be suppressed by performing control such as stopping the manufacturing apparatus.

  In addition, as a determination of whether or not a defect occurs, a predicted value of measurement data can be derived by using a temporal change of measurement data, and the determination can be performed with high accuracy using the predicted value.

It is a block diagram which shows schematic structure of the manufacturing monitoring apparatus of the film circuit board concerning embodiment of this invention. It is a perspective view which shows typically the apparatus arrangement configuration of the manufacturing monitoring apparatus of FIG. It is a block diagram which shows the structure of the control calculating part of the manufacturing monitoring apparatus of FIG. It is a figure which illustrates typically the measurement item which an image measurement part measures about the substrate material in which the circuit pattern was formed. It is a figure which illustrates typically the measurement item which an image measurement part measures about the line of a piece contained in a circuit pattern, and the width between lines. It is a graph explaining an example of the time-dependent change of measurement data, and the calculation procedure of a predicted value.

  Hereinafter, a film circuit board production monitoring apparatus according to an embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is a block diagram showing a schematic configuration of a film circuit board production monitoring apparatus according to an embodiment of the present invention. The film circuit board production monitoring apparatus 1 according to the present embodiment is used in a production apparatus 2 for producing a film circuit board that forms a circuit pattern on the surface of a substrate material 100 composed of a flexible and stretchable film. It is what is done.

  The film circuit board manufacturing apparatus 2 according to this embodiment is an apparatus for manufacturing a film circuit board by printing a circuit pattern using a plate on the surface of a roll-shaped film as a substrate material 100 sent as indicated by an arrow 90. It is. The film circuit board manufacturing apparatus 2 includes a transport unit 3 that transports the substrate material 100 and a circuit pattern forming unit 4 that forms a circuit pattern on the surface of the substrate material.

  As the roll film as an example of the substrate material 100, a transparent synthetic resin film is used in this embodiment, but the material is not particularly limited. However, if a synthetic resin film is used as the substrate material 100, the inspection becomes difficult due to vibration during transportation, etc., so that the merit of using the present invention is great. In general, a PET film is often used as a base material for a conductive sheet for a touch panel.

  The width of the substrate material 100 is not particularly limited. However, if the width dimension is too small, the merit of using the inspection apparatus and method of the present embodiment is small, so that it is preferably 100 mm or more, and more preferably 300 mm or more. When the width dimension is large, cameras constituting the imaging unit can be provided in parallel as will be described later. However, if the width is too large, vibration during conveyance becomes excessive, so the sheet width is preferably 2000 mm or less.

  Further, the method for forming the circuit pattern on the surface of the substrate material 100 by the circuit pattern forming unit 4 is not particularly limited, and flat printing (for example) offset printing, letterpress printing, intaglio printing, stencil printing (for example, screen printing) In addition to various types of printing such as (printing), it is possible to adopt a configuration such as photolithography in which a circuit pattern is optically formed by exposing a plate or inkjet printing without using a plate.

  FIG. 2 is a perspective view schematically showing a device arrangement configuration of the film circuit board production monitoring device according to the present embodiment. In FIG. 2, the film circuit board production monitoring device 1 includes an imaging unit 5 and a light source unit 6 that are configured by line sensor cameras 10 a, 10 b, and 10 c. In FIG. 2, the frame of the apparatus is omitted, and only the printing drum 11 on which the two rollers 9 a and 9 b included in the transport unit 3 and the plate included in the circuit pattern forming unit 4 are formed is illustrated. .

  The roll film, which is the substrate material 100 sent by the rollers 9a and 9b as an example of the transport unit 3, was attached to the print drum 11 by the printing drum 11 included in the circuit pattern forming unit 4 during the transport. The circuit pattern 101 is continuously printed.

  The linear illumination 12 as an example of the light source unit 6 is a film circuit in which the longitudinal direction is arranged below the roll film in a direction orthogonal to the conveying direction of the substrate material 100 and a circuit pattern is attached by the manufacturing apparatus 2. Light L is irradiated toward the substrate. The kind of the linear illumination 12 is not specifically limited, For example, what uses an LED element as a light source can be used. The width of the light emitting surface of the linear illumination in the film transport direction is preferably narrow in order to obtain a clearer transmission image. The length of the light emitting surface of the linear illumination is preferably larger than the width of the roll film to be inspected.

  The line sensor cameras 10a, 10b, and 10c as the imaging unit 5 are disposed above the film circuit board so as to face the linear illumination 12 with the film circuit board interposed therebetween. The line sensor cameras 10a, 10b, and 10c collect the transmitted light from the roll film with a lens, and receive the light with a built-in linear imaging device.

  A linear imaging device is an imaging device in which cells that sense light are arranged in a line. The fact that the line sensor cameras 10a, 10b, and 10c are arranged to face the linear illumination 12 means that the linear imaging device is arranged in parallel and opposite to the linear illumination. As the linear imaging device, a device constituted by a CCD or a CMOS can be used. The analog image signal from the linear image sensor is also quantized into a multi-tone digital image, that is, a grayscale image (also referred to as a multi-value image) by an AD converter inside the line sensor camera.

  As the line sensor cameras 10a, 10b, and 10c, a linear imaging device having about 16000 cells and 210 gradations is commercially available. By combining this with an appropriate lens, a grayscale image having a width of about 160 mm can be generated with an optical resolution of about 10 μm. If the width of the substrate material 100 is larger than this, a plurality of licensor cameras may be arranged in the width direction. For example, in FIG. 2, three line sensor cameras are juxtaposed.

  Further, as shown in FIG. 1, the film circuit board production monitoring device 1 includes a control calculation unit 7 and a monitor 8 for performing production management of the film circuit board using an image taken by the imaging unit 5.

  The image data obtained by each line sensor camera 10a, 10b, 10c is processed as an image in which the entire circuit pattern is imaged by the control calculation unit 7, and film is obtained by image inspection appropriately subjected to image processing as necessary. Various calculations used for circuit board manufacturing management are performed. By processing based on the entire image of the circuit pattern, any point in the circuit pattern can be measured, and a plurality of points can be measured simultaneously. Part of information for manufacturing management of the film circuit board obtained by the control calculation unit 7 is displayed on the monitor 8. The information displayed on the monitor 8 and the display means thereof are not particularly limited, but for a film circuit board manufactured continuously, the progress of measurement items is displayed in a graph, and the trend of the manufacturing state (depending on the time) It is preferable that the tendency of change in the production state is visible.

  Further, when it is determined that there is a problem with the production of the film circuit board as a result of the production management process of the film circuit board, which will be described later, the control calculation unit 7 feeds back to the production apparatus 2 and conveys it. Control is performed so as to adjust the operating conditions of the unit 3 and the circuit pattern forming unit 4. Details of information for manufacturing management of the film circuit board and control of the manufacturing apparatus 2 will be described later.

  Next, the manufacturing management process performed by the control calculation unit 7 will be described. As described above, the film circuit board manufactured by the manufacturing apparatus 2 used in the present embodiment has a printing drum of the circuit pattern forming unit 4 as an example of a plate on the surface of a roll film as an example of the substrate material 100. 11, the circuit pattern is continuously printed. The circuit pattern can be obtained as a plurality of pieces with a single plate, and in this embodiment, as shown in FIGS. The film circuit board having such a configuration is imaged by the line sensor cameras 10a, 10b, and 10c of the production monitoring apparatus, and the operation condition of the production apparatus 2 is controlled by performing image analysis on the control calculation unit.

  FIG. 3 is a block diagram illustrating a configuration of a control calculation unit of the manufacturing monitoring apparatus according to the present embodiment. The control calculation unit 7 analyzes the image data obtained by the line sensor cameras 10a, 10b, and 10c, predicts the manufacturing state of the film circuit board, and appropriately forms a circuit pattern on the substrate material 100 so that the film circuit board is formed. Determine if the manufacturing status of the product is appropriate. As the control calculation unit 7, a computer such as a personal computer (PC) or a workstation (WS) can be used.

  As shown in FIG. 3, the control calculation unit 7 includes an image measurement unit 13, a detection unit 14, and a determination output unit configured as software operating on the control calculation unit 7 or a circuit mounted in the control calculation unit 7. 15, each functional block of the data storage unit 16 is provided.

  The image measurement unit 13 analyzes the image data of the circuit pattern obtained by the line sensor cameras 10a, 10b, and 10c, and measures the measurement items described later. Information on measurement items measured by the image measurement unit 13 is analyzed over time by the detection unit 14 and used as an index indicating manufacturing information of film circuit boards that are continuously manufactured. The determination output unit 15 outputs information when it is determined that a defect occurs in the production of the film circuit board based on the index indicating the production information of the film circuit board analyzed by the detection unit 14. Examples of output information include a control signal for controlling the manufacturing apparatus 2 and a warning notification by a monitor or an alarm.

  The data storage unit 16 stores information on measurement items measured by the image measurement unit 13 over time. The data storage unit 16 can use various storage devices such as a hard disk device.

  FIG. 4 is a diagram schematically illustrating measurement items measured by the image measurement unit for the substrate material on which the circuit pattern is formed. As shown in the enlarged view of FIG. 5, each piece 102 is formed with a number of fine lines 103, and a line interval 104 is formed between adjacent circuit lines 103. For example, the line 103 is formed by printing a conductive material or the like. At the same time, a short circuit occurs between the lines 104 or the line 103 is interrupted in the middle of the line 103 becomes a defective product.

  In this embodiment, the measurement items measured by the image measurement unit 13 are (1) a distance between any two points in the circuit pattern (piece pitch), and (2) a distance between two consecutive circuit patterns (sheets). (Pitch) and (3) Circuit line width or line width (L / S) of the circuit pattern. The image measurement unit 13 acquires measurement data of these measurement items and transmits the measurement data to the detection unit 14 as described later.

  (1) The distance (piece pitch) between any two points in the circuit pattern is equivalent to A in FIG. 4, and as an example, the distance between the same points 102a of the pieces 102 in the circuit pattern. Corresponds to distance. In the present embodiment, the image measuring unit 13 measures the distance between the points 102a at the front right end of two pieces arranged in the film transport direction. As 102a, a characteristic shape in an individual piece, an alignment mark, or the like can be used. For example, the coordinates of 102a can be registered in advance, and an accurate distance between two points can be measured by image pattern matching or the like.

  (2) The distance (sheet pitch) between two consecutive circuit patterns corresponds to B in FIG. 4, and as an example, between the points 101a at the front right end of adjacent circuit patterns to be printed continuously. It corresponds to. The image measuring unit 13 may measure the distance between the same points of the circuit pattern of the film that is continuously conveyed, or may measure the distance between any two points of each circuit pattern. Like the individual pitch, an accurate distance can be measured by pattern matching or the like using a characteristic shape.

  (1) The distance between any two points in the circuit pattern, or (2) the distance between two consecutive circuit patterns is due to reasons such as plate deterioration or unstable roll film transport speed. When a slip or the like occurs between the film and the plate, the value is often different from the normal value.

  (3) The circuit line width or line width (L / S) of the circuit pattern corresponds to L / S shown in FIG. 5, and as an example, the circuit line in the piece 102 included in the circuit pattern This corresponds to a line width L of 103 and a width S of 104 between adjacent circuit lines. The pieces 102 included in the circuit pattern are arbitrary, and all pieces may be measured, or only the pieces 102 selected as a sample may be measured. Moreover, the whole surface in the piece 102 may be measured, and you may measure partially.

  As shown in FIG. 5, the circuit lines 103 and the line intervals 104 of the circuit pattern pieces 102 are subject to print fading when the printing operation is repeated continuously, and the line width L and the line width S change. . Depending on the circuit pattern forming means, for example, in the case of screen printing, the holes in the plate gradually become clogged, so that the line width L becomes narrower as shown in the circuit line 103b. The space width S is often wide. That is, as the line width of the circuit line 103b becomes narrower than the normal line width L shown by the reference numeral 105, the line width S shown by the reference numeral 104b becomes wider.

  The measurement of the line width L and the line width S may be acquired as a relative ratio by comparing circuit patterns that are continuously manufactured. That is, by continuously measuring the values of the line width L and the line width S of the same part in the individual piece, and detecting the fluctuation within a predetermined range compared to the initial value, the determination of the occurrence of the defect It is used for.

  Note that the image measuring unit 13 can also have a function as an image inspection apparatus for determining whether or not a defect exists in the circuit pattern based on the imaged data of the captured circuit pattern. That is, the image data captured in a state where an appropriate light source is provided by the linear illumination 12 can be preferably used as image data for inspecting whether or not the circuit pattern itself has a defect. Thus, for example, by comparing with a non-defective image (master image), it is possible to perform an image inspection as to whether or not there is a defect in the imaged film circuit board.

  The detection unit 14 analyzes the tendency of fluctuation based on the measurement data measured by the image measurement unit 13. The detection unit 14 has a function as the analyzing unit 14a, compares the measurement data continuously measured in order of time series, and analyzes the transition of the data series.

  The analysis of the measurement data performed by the detection unit 14 is used to prevent the occurrence of defective products that occur in the future when the film circuit board is created. Specifically, the transition of the measurement data value of the measurement item over time is statistically analyzed. For example, an abnormality in the distance between any two points in the circuit pattern (individual pitch monitoring) can be caused by, for example, the plate slipping or the substrate This is due to a sudden printing abnormality such as defective printing due to deformation. In addition, an abnormality in the distance between two successive circuit patterns (sheet pitch monitoring) is caused by an abnormality in conveyance of the substrate material, slippage between the roll film and the plate, and the rotation speed of the printing drum 11, for example. This is probably due to the fact that is not appropriate. An abnormality in the circuit line width or the line width (L / S monitoring) of the circuit pattern is caused by a printing defect due to ink fading for each circuit pattern.

  The detection unit 14 obtains a predicted measurement value by monitoring the measurement data obtained by the image measurement unit 13 in time series, and analyzes the possibility of occurrence of a defect that may occur in the future.

  For example, as shown in FIG. 6, the measurement expected value is a predetermined value with respect to a threshold value D0 that is determined to cause defects in the production of the film circuit board by processing the measurement data as necessary and arranging them in time series. The displacement of the measurement data is predicted at a timing T0 when the value D1 is less than the value D1 with the expected width. In addition, as a specific example of processing of measurement data, an average of measurement data values for several times can be exemplified. As described above, since the roll film has flexibility and stretchability, depending on the measurement conditions, there is a possibility that a value exceeding the assumed range is measured in the above measurement items, but measurement data for several times By taking the average of the values, it is possible to reduce the influence of the measured values outside the assumed range.

  The displacement prediction of the measurement data is performed by deriving an expected value that is expected to be obtained after the fact in consideration of a change in the value of the measurement data. When there is a difference between the predicted value and the actual measurement value due to the continuous operation of the manufacturing apparatus, the predicted value is updated using the actual measurement value each time. After that, when the predicted value reaches the timing T1 when it falls below D0, the information is output to the determination output unit 15.

  Note that the data relating to the item values measured by the image measurement unit 13 and the graph of the data values of the measurement data and the time shown in FIG. 6 created by the detection unit 14 are output and displayed on the monitor 8. Further, these data are accumulated in the data accumulating unit 16 and are used by the detecting unit 14 to determine the occurrence of defects.

  The determination output unit 15 outputs warning information at a defect prediction timing T1 by the detection unit 14 and executes manufacturing management of the film circuit board. As warning information, in addition to warning display information on the monitor 8 and occurrence of an alarm, the operating conditions of the transport unit 3 and the circuit pattern forming unit 4 of the manufacturing apparatus 2 are adjusted.

  As described above, the individual pitch abnormality is a sudden printing abnormality such as slipping of the plate, and therefore, when this is detected, an operation stop control signal can be sent to the manufacturing apparatus 2. . Further, the sheet pitch abnormality is considered to be caused by an inappropriate rotation speed of the printing drum 11, and therefore a control signal for changing the manufacturing speed can be sent to the transport unit and the circuit pattern manufacturing unit 4. For example, when the monitoring value becomes smaller than a preset reference sheet pitch, the manufacturing speed (conveying speed and plate rotation speed) is decreased. On the other hand, when the monitoring value becomes large, it is possible to control to increase the manufacturing speed. The production speed refers to the film conveyance speed and the rotation speed of the printing drum interlocked therewith. Further, since the abnormality in L / S monitoring is considered to be caused by ink fading for each circuit pattern, the circuit pattern manufacturing unit 4 is controlled to increase the amount of ink, or the printing drum 11 is replaced. An operation stop control signal can be sent to

  The transmission of information by the determination output unit 15 may be arbitrarily transmitted independently for each measurement item or at a timing when a plurality of measurement items are generated and determined as defect prediction.

  As described above, according to the film circuit board manufacturing monitoring apparatus according to the present embodiment, the measurement value fluctuates by imaging the circuit pattern and analyzing the image by the imaging unit provided in the middle of the manufacturing line. Therefore, the occurrence of defective defects can be prevented in advance. Therefore, it is possible to monitor the production status of the film circuit board manufacturing apparatus. The monitoring of the production status can omit the sampling inspection process of the produced film circuit board, and can prevent the occurrence of defects according to the predicted value of the measurement item.

  In addition, this invention is not limited to the said embodiment, It can implement in another various aspect. Further, the length of the substrate material 100 is not particularly limited. In addition, it is not limited to a sheet that can be wound in a roll shape, and may be a sheet.

  Further, the configuration of the circuit pattern forming unit 4 is not limited to printing by the drum 11, and photolithography that optically forms a circuit pattern is used in addition to printing performed by bringing a lithographic plate into contact with a substrate material. It may be by means.

  Furthermore, the measurement items measured by the image measurement unit do not need to measure all three items described in the embodiment, and can be appropriately selected according to the configuration of the film circuit board manufacturing apparatus. For example, in a manufacturing apparatus that uses a single plate including a single piece in one plate, the piece pitch does not need to be added to the measurement item. In a manufacturing apparatus that uses a sheet-like film substrate, The sheet pitch can be excluded from the measurement items.

DESCRIPTION OF SYMBOLS 1 Manufacturing monitoring apparatus 2 Film circuit board manufacturing apparatus 3 Conveyance part 4 Circuit pattern formation part 5 Imaging part 6 Light source part 7 Control calculating part 8 Monitor 9a, 9b Roller 10a, 10b, 10c Line sensor camera 11 Print drum 12 Linear illumination 13 Image measurement unit 14 Detection unit 15 Determination output unit 16 Data storage unit

Claims (6)

A film circuit board production monitoring apparatus that is used in a production apparatus for producing a film circuit board that forms a circuit pattern on a substrate material composed of a film, and that monitors the production status of the film circuit board,
An imaging unit for imaging the circuit pattern of the film circuit board;
Based on the image of the circuit pattern imaged by the imaging unit, at least a distance between any two points in the circuit pattern, a distance between two consecutive circuit patterns, a circuit line width or an inter-line width of the circuit pattern An image measuring unit for measuring one;
A film circuit board production monitoring apparatus comprising: a detection unit that detects fluctuation based on measurement data measured by the image measurement unit.   2. The film circuit board production monitoring apparatus according to claim 1, further comprising a determination output unit configured to output information when it is determined that a defect occurs in the film circuit board based on a detection result of the detection unit. .   The detection unit compares the measurement data measured by the image measurement unit in time series, and derives a predicted value that the measurement data exceeds a threshold value, thereby determining that a defect occurs in the film circuit board. The production monitoring apparatus for a film circuit board according to claim 2, comprising:   The said determination output part outputs the said information at the timing estimated that the said predicted value exceeds a threshold value, The manufacturing monitoring apparatus of the film circuit board of Claim 3 characterized by the above-mentioned. The manufacturing apparatus uses a rotary printing machine, utilizes a roll-shaped film as a substrate material, and is configured to form the circuit pattern during path conveyance for continuously feeding the roll-shaped film,
5. The film circuit board according to claim 2, wherein the determination output unit includes a signal for controlling a conveyance speed of the roll-shaped film or a rotation speed of the plate in the information. Manufacturing monitoring equipment. The manufacturing apparatus is a screen printing machine,
6. The film circuit board production monitoring device according to claim 2, wherein the determination output unit includes a signal for controlling an ink discharge amount of the screen printing machine in the information.

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