JP2010182442A - Method and apparatus for manufacturing device, device, and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce the generation of defective devices due to variations in discharge characteristic among nozzles by detecting the discharge characteristic of each nozzle electrically in a short time, and correcting head action. <P>SOLUTION: An inkjet unit for manufacturing a device includes an inkjet head 101 which discharges ink droplets to a pattern formation area 103 of a base 102, and a dummy area 104 in a portion other than the pattern formation area 103. The inkjet head 101 discharges ink droplets onto the dummy area 104, and a high-frequency circuit characteristic evaluation device 105 detects the position, the size and the shape of each ink droplet discharged. Depending on the detection result, a predetermined process (purging process, wiping process, flashing process or the like) is performed on the inkjet head 101 and the action to discharge an ink droplet onto the pattern formation area 103 is performed. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a manufacturing method and a manufacturing apparatus for manufacturing a device using a droplet discharge head.

  In recent years, as a method for manufacturing an organic electroluminescence device, a method for manufacturing a device using an ink jet method has attracted attention. In the device manufacturing using the ink jet method, an ink jet head having a plurality of nozzles is usually used. However, there are cases where the ink discharge amount and the discharge position are different due to a difference in discharge characteristics such as channel resistance for each nozzle.

  In this case, the ink cannot be uniformly provided on the substrate, which causes a problem that it becomes difficult to manufacture a device having a predetermined accuracy.

  The conventional invention has been made in view of such circumstances, and when manufacturing a device using an inkjet head that discharges ink from a plurality of nozzles, a device that can reduce the occurrence of defective devices due to variations in ejection characteristics. The object was to provide a manufacturing method and apparatus.

  Patent Document 1 discloses a method of reducing the occurrence of defective devices due to variations in ejection characteristics by detecting an ejection abnormality from an imaged print pattern and correcting the operation. FIG. 9 shows a manufacturing apparatus for performing the conventional inspection described in Patent Document 1.

In FIG. 9, an ink jet head 901 ejects ink droplets to a dummy region 904 other than the pattern formation region 903 in the substrate 902, measures the size and shape of the ink droplets with the imaging device 905, and detects nozzles with abnormal ejection. Was. In accordance with the detection result, drive control is performed by the head controller 906, and ink droplets are ejected to the pattern formation region 903.
JP 2003-282247 A JP-A-57-51781 JP 59-194393 A

  However, with such a conventional configuration, the image processing time becomes significantly longer as the print pattern becomes finer and the substrate becomes larger. During that time, the ejection characteristics of each nozzle, such as the ink ejection speed, angle, and ink droplet size, vary greatly, making it difficult to accurately correct the head operation, making it difficult to manufacture a device having a predetermined accuracy. Arise.

  The present invention solves the above-mentioned conventional problems, and electrically detects the discharge characteristics of each nozzle in a short time and corrects the head operation, thereby correcting the defective device caused by the discharge characteristic variation of each nozzle. The purpose is to reduce the occurrence.

  In order to achieve the above object, a device manufacturing method according to claim 1 of the present invention includes a step of discharging a liquid material from a droplet discharge head to a pattern formation region of a substrate. A first step of discharging liquid material droplets to a predetermined region other than the pattern formation region, and a plurality of positions, sizes, and shapes of the droplets discharged to the predetermined region were formed on the base of the predetermined region It has the 2nd process detected by the high frequency circuit characteristic change of a functional element, and the 3rd process which performs the discharge operation with respect to a pattern formation area, It is characterized by the above-mentioned.

  According to a second aspect of the present invention, in the device manufacturing method, a configuration for controlling the discharge operation based on the result of electrical detection is employed. As a result, it is possible to specify an abnormal nozzle based on the detection result of the position, size, and shape of the droplet discharged to the predetermined region, and to perform control such as not using the abnormal nozzle, for example. Occurrence can be suppressed.

  According to a third aspect of the present invention, in the device manufacturing method, a configuration is employed in which a predetermined process is performed on the droplet discharge head based on the detection result. As a result, when an abnormal nozzle is identified, for example, a predetermined process such as a nozzle wiping process or a flushing process can be performed to improve the discharge state of the droplet discharge head.

  According to a fourth aspect of the present invention, in the device manufacturing method, a configuration is adopted in which the droplet discharge head is replaced with another droplet discharge head in accordance with the detection result. This avoids device manufacturing using an abnormal droplet discharge head.

  In the device manufacturing method according to the fifth aspect of the present invention, a configuration is adopted in which detection is performed by an electrical inspection apparatus (high-frequency circuit characteristic evaluation apparatus). As a result, the position, size, and shape of the droplets discharged to the predetermined area can be detected with high accuracy in a short time.

  According to a sixth aspect of the present invention, in the device manufacturing method, a configuration for detecting the ejection position in a predetermined region with respect to the reference position of the droplet is employed. Thereby, the error of the ejection position with respect to the target position of the droplet can be obtained, and an abnormal nozzle can be specified based on the obtained result. And if an abnormal nozzle is specified, the device which has predetermined performance can be manufactured by performing control which does not use this abnormal nozzle, for example.

  According to a seventh aspect of the present invention, in the device manufacturing method, a configuration in which the predetermined region is provided in a portion of the substrate other than the pattern formation region is employed. Thereby, it is possible to grasp whether the surface state of the substrate is normal (predetermined state). That is, for example, the pattern formation region and the predetermined region of the substrate have the same structure (for example, the shape of a bank or an electrode) and the same surface treatment (liquid repellent treatment, lyophilic treatment, etc.) is performed, In the case where the liquid droplets in are not in a predetermined position, size and shape, it can be determined that the structure and the surface treatment state in the pattern formation region are also abnormal. In this way, a predetermined area having the same surface condition (structure and surface treatment) as the pattern formation area is provided on the substrate, and the position, size, and shape of the droplets discharged to the predetermined area are detected, thereby forming the pattern. The surface state of the region can be grasped.

  According to an eighth aspect of the present invention, in the device manufacturing method, a configuration in which the predetermined region is provided in a portion other than the substrate supporting portion of the stage supporting the substrate is employed. Thereby, it is possible to grasp only the ejection characteristics of the nozzles without considering the surface state of the substrate. That is, a glass plate that has not been subjected to surface treatment, for example, is disposed on the stage as a predetermined region, and a plurality of nozzles are detected by detecting the position, size, and shape of droplets discharged from a plurality of nozzles on the glass plate. The position, amount, etc., of each droplet discharged from the nozzle can be obtained. In this way, it is possible to grasp the ejection characteristics of each of the plurality of nozzles based on the position, size, and shape of the droplets ejected to a predetermined area provided on the stage.

  According to a ninth aspect of the present invention, in the method for manufacturing a device, a structure in which a material for forming an organic electroluminescence device is discharged onto a substrate is employed. Thereby, an organic electroluminescent device can be manufactured with high accuracy.

  A device manufacturing apparatus according to a tenth aspect of the present invention is a device manufacturing apparatus having a droplet discharge head capable of discharging liquid material droplets to a pattern formation region of a substrate, and is provided in a portion other than the pattern formation region. And a detection device that detects a position, a size, and a shape of a droplet discharged from the droplet discharge head with respect to the dummy region.

  According to the manufacturing apparatus of the present invention, a detection device that detects the position, size, and shape of the liquid droplets discharged to a predetermined region other than the pattern formation region of the substrate is provided, and based on this detection result. It is possible to grasp variations in ejection characteristics of a plurality of nozzles of a droplet ejection head and to identify abnormal nozzles. Therefore, the occurrence of defective devices due to variations in ejection characteristics can be reduced.

  According to an eleventh aspect of the present invention, in the device manufacturing apparatus, a configuration including a control device that controls the discharge operation of the droplet discharge head based on the detection result of the detection device is employed. As a result, it is possible to specify an abnormal nozzle based on the detection result of the position, size, and shape of the droplet discharged to the predetermined region, and to perform control such as not using the abnormal nozzle, for example. Occurrence can be suppressed.

  According to a twelfth aspect of the present invention, in the device manufacturing apparatus, a configuration is adopted in which the substrate has a stage that supports the substrate, and the dummy region is provided in a portion of the stage other than the substrate. Thus, since the substrate and the predetermined region are close to each other, the discharge operation can be immediately performed on the pattern formation region of the substrate after the liquid droplets are discharged to the predetermined region.

  According to a thirteenth aspect of the present invention, in the device manufacturing apparatus, the detection apparatus has an electrical inspection apparatus (high frequency circuit characteristic evaluation apparatus). As a result, the position, size, and shape of the droplets discharged to the predetermined area can be detected with high accuracy in a short time.

  According to a fourteenth aspect of the present invention, in the device manufacturing apparatus, the droplet discharge head adopts a configuration for discharging the organic electroluminescence device forming material. Thereby, an organic electroluminescent device can be manufactured with high accuracy.

  A device according to claims 15 and 16 of the present invention is manufactured by the above-described device manufacturing method or device manufacturing apparatus. According to this, a device having a predetermined performance can be provided by being formed with a precise pattern.

  An electronic apparatus according to a seventeenth aspect of the present invention includes the above-described device. According to this, it is possible to obtain an electronic apparatus having a thin high-definition display unit having a predetermined performance.

  Here, the droplet discharge method may be any method such as flexographic printing, gravure printing, planographic printing, screen printing, dispensing, die coating, and inkjet. The ink jet method may be a piezo jet method in which a fluid is ejected by a change in volume of a piezoelectric element, or a method using an electrothermal transducer as an energy generating element. By adopting an ink jet method as a droplet discharge head for forming a pattern, it is possible to provide a liquid material at an arbitrary thickness at an arbitrary place in a pattern formation region with inexpensive equipment.

  The liquid material (fluid) refers to a medium having a viscosity that can be discharged from a nozzle of a droplet discharge head. It does not matter whether it is aqueous or oily. It is sufficient if it has fluidity (viscosity) that can be discharged from a nozzle or the like. In addition, the solid material contained in the liquid material may be dissolved by being heated to a temperature higher than the melting point, or may be dispersed as fine particles in a solvent, and a dye, pigment or other functional material added in addition to the solvent It may be.

  In addition to the surface of the flat substrate, the pattern formation region may be a curved substrate. Furthermore, the pattern forming surface does not need to have a high hardness, and may be a flexible surface such as a film, paper, or rubber.

  According to the present invention, a droplet is ejected to a predetermined region immediately before ejecting the droplet to the pattern formation region of the substrate, and the position, size, and shape of the ejected droplet can be changed in a short time. Since it is possible to detect the variation in ejection characteristics such as the ejection amount and ejection position of each of the plurality of nozzles of the droplet ejection head based on the detection result, it is possible to identify an abnormal nozzle In addition, by performing a predetermined process on the abnormal nozzle and then performing a discharge operation on the pattern formation region, it is possible to reduce the occurrence of defective devices due to variations in discharge characteristics.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

(Embodiment 1)
FIGS. 1A and 1B are diagrams showing a device manufacturing apparatus according to Embodiment 1 of the present invention, and are schematically shown in the configuration of an ink jet apparatus (droplet discharge apparatus) having an ink jet head (droplet discharge head). It is a perspective view.

  In FIG. 1A, an ink jet apparatus is an ink jet that can eject a stage 107 that supports a substrate 102 and ink (a liquid material or a fluid) containing a predetermined material onto the substrate 102 that is supported by the stage 107. A head 101 and a head controller 106 that controls the ink ejection operation of the inkjet head 101 are provided. Furthermore, although not shown, the ink jet apparatus has a moving device that relatively moves the ink jet head 101 and the stage 107 that supports the substrate 102 in a predetermined direction.

  In the first embodiment, the moving device moves the stage 107 in the X-axis direction, and ink is ejected from the inkjet head 101 while the substrate 102 supported by the stage 107 is scanned in the X-axis direction. Here, in the following description, the moving direction (scanning direction) of the stage 107 is the X-axis direction, the direction orthogonal to the X-axis direction in the horizontal plane is the Y-axis direction (non-scanning direction), the X-axis direction, and the Y-axis direction. The direction orthogonal to each is taken as the Z-axis direction.

  The stage 107 holds the substrate 102 and positions it at a predetermined position. Further, the stage 107 has a suction holding device (not shown), and the substrate 102 is sucked and held on the stage 107 by operating the suction holding device.

  The inkjet head 101 has a plurality of nozzles arranged in the Y-axis direction, and ejects ink droplets to the substrate 102 from the nozzles. The ink jet head 101 according to the first embodiment has a configuration in which a volume change is generated in a piezoelectric element and ink is ejected. May be. The ink jet head 101 is supported by a support device (not shown) and can be moved stepwise in the Y-axis direction by a moving device (not shown).

  The substrate 102 includes a pattern formation region 103 where a pattern is formed, and a dummy region (predetermined region) 104 provided in a portion other than the pattern formation region 103. In the first embodiment, the dummy region 104 is provided on one side of the pattern forming region 103 in the X-axis direction (scanning direction). The size of the pattern formation region 103 in the Y-axis direction and the size of the dummy region 104 in the Y-axis direction are set to be approximately the same.

  Above the stage 107, a high frequency circuit characteristic evaluation device (detection device) 105 including a plurality of high frequency probes capable of detecting the amount of ink droplets ejected from the inkjet head 101 to the dummy region 104 is provided. . A plurality of high-frequency probes of the high-frequency circuit characteristic evaluation apparatus 105 are provided side by side in the Y-axis direction.

  In FIG. 1B, a dummy region 104 on the substrate 102 includes a partition wall 108 having the same number as the number of ejection nozzles of the inkjet head 101, and a plurality of FET (Field Effect Transistor) elements arranged in a lattice pattern inside the cell partition wall. 109 and a protective film 110 for protecting the FET element 109, and ink droplets 111 ejected from the inkjet head 101 land on the protective film 110. The partition 108 and the protective film 110 are preferably formed with the same film material and shape as the pattern formation region 103, but the partition 108 may not be provided, and each of the plurality of nozzles arranged in the Y-axis direction of the inkjet head 101 may be provided. It is possible to detect the position, size, and shape of each of the ink droplets discharged to the dummy region 104.

  Each of the high-frequency probes constituting a part of the high-frequency circuit characteristic evaluation apparatus 105 is connected to each electrode drawn from the FET element 109 formed in the dummy region 104 on the substrate 102 to measure the S parameter. The result is output to a data processing device constituting a part of the high-frequency circuit characteristic evaluation device 105. The data processing device obtains the position, size, and shape of the ink droplet based on the detection result (S parameter measurement result) of the high-frequency circuit characteristic evaluation device 105.

  FIG. 2 is a schematic diagram showing an example of the S parameter measurement result measured by the high frequency circuit characteristic evaluation apparatus 105. The curve in FIG. 2 shows the S-parameter power gain (S21) value when the measurement frequency is scanned, and the frequency and the minimum value that become the minimum depending on the amount of ink droplets present on the FET element 109. Change. For example, when there is no ink droplet, it is indicated by a broken line in FIG. 2, and when a predetermined ink droplet is present on the FET element 109, it is indicated by a solid line in FIG. At the same time, the minimum value increases.

  In order to detect the position, size, and shape of the ink droplets ejected from each of the plurality of nozzles using this characteristic change, an FET element 109 is disposed in the dummy region 104 of the substrate 102 as shown in FIG. FIG. 3 shows ink droplets ejected onto the dummy region 104 from each of No. 1 to No. 4 nozzles among a plurality of nozzles arranged in, for example, 180 of the inkjet head 101. A plurality of FET elements are arranged in a grid at predetermined positions where each ink drop lands, and the amount and the size of each ink drop are detected by detecting the amount of ink enemy from the S parameter measurement result of each FET element. Now, the shape can be determined.

  Here, droplets are discharged from each nozzle at three positions in the scanning direction of the dummy region 104 of the substrate 102 that scans in the X-axis direction. In FIG. 3, a broken-line circle indicates a desired ejected ink shape 114, a black region indicates an ejected ink shape 115, and ink droplets ejected from No. 1 to the dummy region 104 have positions and sizes. Although the shape is normal, the position of the ink droplets ejected from No. 2 to the dummy area 104 is shifted from the center of the grid, and the ink droplets ejected from No. 3 to the dummy area 104 The size is different from the target size. Further, the shape of the ink droplets ejected from No. 4 to the dummy area 104 is an elliptical shape, which is different from the target shape (circular shape). The inspection result by the high-frequency circuit characteristic evaluation device 105 is output to the head control device 106.

  Next, a method of forming a pattern in the pattern formation region 103 by ejecting ink from the inkjet head 101 to the pattern formation region 103 of the substrate 102 supported by the stage 107 using the above-described inkjet device. explain.

  When the substrate 102 is carried into the stage 107, the stage 107 sucks and holds the substrate 102 and positions it. Then, the stage 107 that supports the substrate 102 moves so that the dummy region 104 of the substrate 102 and the inkjet head 101 face each other.

  The head controller 106 ejects ink from each of a plurality of nozzles arranged in the Y-axis direction with respect to the dummy region 104 from the inkjet head 101.

  Here, in the first embodiment, the ink jet device manufactures an organic electroluminescence device by laminating a material layer on the substrate 102, and the ejected ink droplets are arranged at predetermined positions on the substrate 102. A bank (partition wall) is formed in advance. Further, the substrate 102 is previously subjected to a predetermined surface treatment such as a liquid repellent treatment or a lyophilic treatment. Specifically, a bank (partition) having a circular shape in plan view is formed on the substrate 102, and surface treatment including liquid repellent treatment and lyophilic treatment is performed on the bank. Then, by ejecting the ink droplets to the bank, the ink droplets are arranged in the bank by the effect of the surface treatment.

  Here, when the nozzles are normal and the shape of the bank and the surface treatment for the bank are normal, the nozzles are arranged in the bank like the ink droplets ejected from the No. 1 nozzle shown in FIG. The ink droplet has a circular shape in plan view. On the other hand, when the nozzle is abnormal or the surface treatment for the bank is uneven, for example, the ink droplets ejected from the nozzles No. 2, No. 3, and No. 4 shown in FIG. Unlike the target shape, for example, it is an elliptical shape in plan view. Each of the pattern formation region 103 and the dummy region 104 is previously formed with the same structure, that is, a bank having the same shape, and is subjected to the same surface treatment.

  When droplets are ejected from the inkjet head 101 to the dummy area 104, the stage 107 moves to make the high-frequency circuit characteristic evaluation apparatus 105 and the dummy area 104 face each other. Each of the droplets ejected to the dummy area 104 is based on the measurement result of the high frequency circuit characteristic evaluation apparatus 105 measured by the high frequency circuit characteristic evaluation apparatus 105, and the position and size of the ink droplet arranged in the dummy area 104. Find the shape.

  The high frequency circuit characteristic evaluation apparatus 105 includes a target position, size, and shape of an ink droplet on a preset substrate, and an actual ink droplet position and size detected using the high frequency circuit characteristic evaluation apparatus 105. Compare the shape. The high-frequency circuit characteristic evaluation apparatus 105 determines whether each ink droplet is within an allowable range with respect to the target position, size, and shape based on the comparison result, and determines whether the ink droplet is good or bad. .

  That is, in FIG. 3, when the shape on the dummy region 104 is circular and the size and position are within the allowable range, like the ink droplet ejected from the No. 1 nozzle, the high frequency circuit characteristic evaluation apparatus 105 It is determined that the ink droplet ejected from the No. 1 nozzle has a predetermined position, size, and shape. On the other hand, when the position on the dummy area 104 is different from the target position as in the case of the ink droplet ejected from the No. 2 nozzle, the high frequency circuit characteristic evaluation apparatus 105 ejected from the No. 2 nozzle. It is determined that the ink droplet is not at a predetermined position.

  Similarly, when the size on the dummy area 104 is different from the target size, as in the case of the ink droplets ejected from the No. 3 nozzle, the high frequency circuit characteristic evaluation device 105 starts from the No. 3 nozzle. When it is determined that the ejected ink droplet is not of a predetermined size and the size on the dummy area 104 is different from the target shape, such as the ink droplet ejected from the No. 4 nozzle, the high frequency circuit The characteristic evaluation apparatus 105 determines that the ink droplets ejected from the No. 4 nozzle are not in a predetermined shape.

  The determination result of the high-frequency circuit characteristic evaluation device 105 is output to the head control device 106. The head control device 106 controls the ejection operation of the inkjet head 101 based on the determination result (detection result) of the high-frequency circuit characteristic evaluation device 105. Specifically, when the high frequency circuit characteristic evaluation apparatus 105 determines that the ink droplets are ejected normally, the head control apparatus 106 determines that there are no abnormal nozzles in the ink jet head 101 and forms a pattern on the substrate 102. A predetermined discharge operation is performed on the region 103. A predetermined pattern is formed in the pattern formation region 103 of the substrate 102.

  On the other hand, if the high frequency circuit characteristic evaluation apparatus 105 determines that the ink droplet is not ejected normally, that is, the high frequency circuit characteristic evaluation apparatus 105 determines that the ink droplet corresponding to the No. 2 nozzle is different from the target position. Then, the head control device 106 determines that the nozzle No. 2 is an abnormal nozzle, and performs predetermined processing on the inkjet head 101 such as purge processing, wiping processing, and ink flushing processing for the abnormal nozzle.

  In this way, when predetermined processing is performed on the inkjet head 101, the head control device 106 ejects ink droplets again from the inkjet head 101 to the dummy region 104, and the high-frequency circuit characteristic evaluation device 105 performs the operation on the dummy region 104. The position, size, and shape of the ink droplet are detected. When the position, size, and shape of the ink droplet corresponding to the No. 2 nozzle, which was abnormal last time, are within the allowable range with respect to the target value, the head control device 106 performs the ejection operation of the inkjet head 101. A discharge operation is performed on the pattern formation region 103 of the substrate 102 while being controlled.

  On the other hand, when the position, size, and shape of the ink droplets are different from the target values even though the predetermined processing (purge processing, wiping processing, or flushing processing) is performed, the head control device 106 performs ink jetting. While controlling the ejection operation of the head 101, the ejection operation to the pattern formation region 103 of the substrate 102 is performed. Specifically, the head control device 106 determines that the nozzle No. 2 among the plurality of nozzles of the inkjet head 101 is an abnormal nozzle based on the determination result by the high-frequency circuit characteristic evaluation device 105, and this abnormal A discharge operation is performed on the pattern formation region 103 by complementing with another nozzle without using the nozzle. Alternatively, the head controller 106 adjusts drive energy such as voltage, pressure, time, and temperature applied to the drive unit, thereby performing an ejection operation on the pattern formation region 103.

  Alternatively, the inkjet head 101 having an abnormal nozzle may be replaced with another new inkjet head 101. In this case, the support device that supports the inkjet head 101 supports at least two inkjet heads, and the head control device 106 determines that the first inkjet head 101 is abnormal. Replace with a new inkjet head 101. Since the inkjet apparatus has the replacement inkjet head 101, the replacement operation can be performed in a short time.

  As described above, ink droplets are ejected to the dummy region 104 before ejecting droplets to the pattern formation region 103 of the substrate 102, and the position, size, and shape of the ejected ink droplets are discharged. Can be detected in advance by the high-frequency circuit characteristic evaluation apparatus 105, so that variations in the ejection characteristics of the plurality of nozzles of the inkjet head 101 can be grasped or abnormal nozzles can be identified based on the detection result. The occurrence of defective devices can be reduced by performing a discharge operation on the pattern formation region 103 after taking measures (processing) for variations in discharge characteristics and abnormal nozzles.

  In the first embodiment, it has been described that there is only one pattern formation region 103. However, as shown in FIG. 4A, a plurality of pattern formation regions 103 on the substrate 102 may be set. In FIG. 4A, the dummy region 104 is provided at the end of one side in the X-axis direction of the plurality of pattern regions 103 in the substrate 102. Note that the dummy region 104 does not need to be provided at the end of the substrate 102, and may be the central portion of the substrate 102 as shown in FIG. Further, as shown in FIG. 4C, there may be a plurality at both ends of the substrate 102.

(Embodiment 2)
FIG. 5 is a diagram showing a device manufacturing apparatus according to the second embodiment of the present invention. Here, in the following description, components having the same functions corresponding to the components described in FIG. 1 of the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  As shown in FIG. 5, the ink jet apparatus includes a stage 107 that supports the substrate 102, and a dummy region 104 </ b> B that is provided in a portion of the stage 107 other than the substrate 102. The dummy area 104B is provided on one side of the substrate 102 in the X-axis direction. The dummy region 104B is formed of, for example, a glass plate and is not subjected to surface treatment or is subjected to surface treatment uniformly.

  When ejecting ink droplets to the pattern formation region 103 of the substrate 102 using the ink jet device shown in FIG. 5, the head control device 106 first performs ink from the ink jet head 101 to the dummy region 104B of the stage 107. Discharge drops. Next, the high frequency circuit characteristic evaluation device 105 detects the position, size, and shape of the ink droplet on the dummy region 104B.

  Here, the dummy region 104B is made of a glass plate, and unlike the first embodiment, a bank is not formed and a patterned surface treatment is not performed. Therefore, for example, when the ink droplet on the dummy region 104B does not have a predetermined position, size, and shape, the high frequency circuit characteristic evaluation device 105 can identify an abnormal nozzle of the inkjet head 101. That is, in the first embodiment, when an abnormal ink droplet is detected, the cause is either that the nozzle of the inkjet head 101 is abnormal or the surface treatment of the substrate 102 is abnormal. Could not be identified.

  On the other hand, when an ink droplet is ejected to the dummy area 104B made of a uniform glass plate and the position, size, and shape of the ink droplet are detected as in the second embodiment, an abnormal ink droplet is detected. Therefore, it can be specified that the cause of the abnormality is the inkjet head 101. For example, in the dummy area 104B made of a glass plate provided on the stage 107, if the size of ink droplets from a specific nozzle is smaller than the ink droplets from other nozzles, it is determined that the ejection amount is small. Thus, it can be determined that the specific nozzle is abnormal. The head control device 106 can perform a discharge operation with a predetermined discharge amount by performing control such as increasing the voltage applied to the nozzle with a small discharge amount.

  When the head control device 106 determines that there is no abnormal nozzle based on the detection result of the high-frequency circuit characteristic evaluation device 105, the head control device 106 performs an ejection operation on the pattern formation region 103 of the substrate 102. On the other hand, if it is determined that there is an abnormal nozzle, the head control device 106 performs a predetermined process on the ink-jet head 101 or sets the position of the ink-jet head 101 relative to the substrate 102 in the Y-axis direction, as in the first embodiment. The ejection operation is performed with a shift, or the ink jet head 101 is replaced with a new one.

  Note that the dummy region 104B may be provided on the stage 107, and the dummy region 104 may be provided on the substrate 102, and these may be used together. After confirming that all of the plurality of nozzles of the inkjet head 101 are normal nozzles using the dummy area 104B on the stage 107, ink droplets are applied to the dummy area 104 provided on the substrate 102. If the position, size, and shape of the ink droplets ejected and disposed in the dummy region 104 of the substrate 102 are abnormal, it can be determined that the bank shape or surface treatment of the substrate 102 is abnormal.

  In each of the above embodiments, while the high frequency circuit characteristic evaluation apparatus 105 performs processing based on the ink droplet inspection result by the high frequency circuit characteristic evaluation apparatus 105, the inkjet head 101 waits without performing an ejection operation on the pattern formation region 103. However, the ejection operation may be started with respect to the substrate 102 scanned by the inkjet head 101 while the high-frequency circuit characteristic evaluation apparatus 105 is processing.

  By doing so, throughput can be improved. If the high frequency circuit characteristic evaluation apparatus 105 determines that the position, size, and shape of the ink droplets in the dummy area are abnormal during the ejection operation of the inkjet head 101, the head control apparatus 106 determines that the inkjet head 101 The discharge operation and the scanning of the substrate 102 are interrupted, and the predetermined processing (purge processing, wiping processing, and flushing processing) is performed.

  In each of the above embodiments, the determination as to whether or not the ink droplets ejected to the dummy area are normal is performed by the high-frequency circuit characteristic evaluation device 105 (or the head control device 106). A display unit capable of displaying the inspection result may be provided in the apparatus 105, and the operator may determine whether the ink droplet is normal or abnormal based on the display on the display unit.

  The dummy region 104B provided on the stage 107 has a flat shape without unevenness, and can be repeatedly used semipermanently by performing a predetermined cleaning process such as a wiping process.

  The ink jet apparatus (device manufacturing apparatus) described in each embodiment of the present invention can be applied to manufacture of an organic electroluminescence apparatus (hereinafter referred to as an organic EL apparatus). FIG. 6 is a cross-sectional view showing an example of an organic EL device. In FIG. 6, an organic EL device 601 includes a substrate 602 that can transmit light, and an organic EL (nearly sandwiched between a pair of cathode (electrode) 607 and anode (electrode) 608 provided on one surface side of the substrate 602. An organic EL element (light-emitting element) 609 including a light-emitting layer 605 made of an electroluminescent material and a hole transport layer 606; and a sealing layer 604 provided between the substrate 602 and the organic EL element 609. ing.

  Here, the organic EL device 601 shown in FIG. 6 has a form in which light emitted from the light emitting layer 605 is extracted from the substrate 602 side to the outside of the device, and a material for forming the substrate 602 is transparent or translucent capable of transmitting light. Examples of the material include transparent glass, quartz, sapphire, or transparent synthetic resin such as polyester, polyacrylate, polycarbonate, and polyetherketone. In particular, as a material for forming the substrate 602, inexpensive soda glass is preferably used.

  On the other hand, in the case where the emitted light is extracted from the side opposite to the substrate, the substrate may be opaque. In this case, a ceramic sheet such as alumina or a metal sheet such as stainless steel is subjected to an insulation treatment such as surface oxidation. A thermosetting resin, a thermoplastic resin, or the like can be used.

  The anode 608 is a transparent electrode made of indium tin oxide (ITO) or the like, and can transmit light. The hole transport layer 606 is made of, for example, a triphenylamine derivative (TPD), a pyrazoline derivative, an arylamine derivative, a stilbene derivative, a triphenyldiamine derivative, or the like. Of these, triphenyldiamine derivatives are preferable, and 4,4'-bis (N (3-methylphenyl) -N-phenylamino) biphenyl is particularly preferable.

  Note that a hole injection layer may be formed instead of the hole transport layer, and both the hole injection layer and the hole transport layer may be formed. In this case, as a material for forming the hole injection layer, for example, copper phthalocyanine (CuPc), polytetravinylthiophene polyphenylene vinylene, 1,1-bis- (4-N, N-ditolylaminophenyl) cyclohexane , Tris (8-hydroxyquinolinol) aluminum and the like, and copper phthalocyanine (CuPc) is particularly preferable.

  As a material for forming the light emitting layer 605, low molecular organic light emitting dyes and polymer light emitters, that is, light emitting materials such as various fluorescent materials and phosphorescent materials, and organic EL materials such as Alq3 (aluminum chelate complex) can be used. . Among the conjugated polymers that serve as the light-emitting substance, those containing an arylene vinylene or polyfluorene structure are particularly preferable. In the low-molecular light emitters, for example, naphthalene derivatives, anthracene derivatives, perylene derivatives, polymethine-based, xanthene-based, coumarin-based, cyanine-based pigments, 8-hydroquinoline and its metal complexes, aromatic amines, tetraphenylcyclo Pentadiene derivatives or the like, or known ones described in Patent Document 2, Patent Document 3, and the like can be used. The cathode 607 is a metal electrode made of aluminum (Al), magnesium (Mg), gold (Au), silver (Ag), or the like.

  Note that an electron-transporting layer or an electron-injecting layer can be provided between the cathode 607 and the light-emitting layer 605. The material for forming the electron transport layer is not particularly limited, but is an oxadiazole derivative, anthraquinodimethane and its derivative, benzoquinone and its derivative, naphthoquinone and its derivative, anthraquinone and its derivative, tetracyanoanthraquinodimethane And derivatives thereof, fluorenone derivatives, diphenyldicyanoethylene and derivatives thereof, diphenoquinone derivatives, metal complexes of 8-hydroxyquinoline and derivatives thereof, and the like.

  The sealing layer 604 blocks air from entering the organic EL element 609 including the electrodes 607 and 608 from the outside on the substrate 602 side. The sealing layer 604 transmits light by appropriately selecting a film thickness and a material. Transmission is possible. As a material constituting the sealing layer 604, for example, a transparent material such as ceramic, silicon nitride, silicon oxynitride, or silicon oxide is used, and silicon oxynitride is particularly preferable from the viewpoints of transparency and gas barrier properties. Note that the thickness of the sealing layer 604 is preferably set to be smaller than the wavelength of light emitted from the light emitting layer 605 (for example, 0.1 μm).

  Although not shown, this organic EL device 601 is of an active matrix type, and actually a plurality of data lines and a plurality of scanning lines are arranged in a grid pattern, and are arranged in a matrix partitioned by these data lines and scanning lines. The organic EL element 609 is connected to each of the pixels through a driving TFT (Thin Film Transistor) such as a switching transistor or a driving transistor. When a driving signal is supplied via the data line or the scanning line, a current flows between the electrodes, the light emitting layer 605 of the organic EL element 609 emits light, and light is emitted to the outer surface side of the substrate 602. Light.

  Further, in the organic EL device 601, a seal that blocks air from entering the organic EL element 609 including the electrodes 607 and 608 on the surface opposite to the sealing layer 604 across the organic EL element 609. A stop member 610 is formed.

  Manufactured using the device manufacturing apparatus of the present invention by forming the material for forming each material layer (anode 608, hole transport layer 606, light emitting layer 605, etc.) of the organic EL device 601 described above into an ink with a predetermined solvent. can do.

  An example of an electronic apparatus provided with the organic EL device 601 of a device manufactured according to each embodiment described above will be described. FIG. 7 is a perspective view showing an example of a mobile phone. In FIG. 7, reference numeral 700 denotes a mobile phone body, and reference numeral 701 denotes a display unit using the organic EL device for display.

  FIG. 8 is a perspective view showing an example of an information processing apparatus such as a personal computer or a television. In FIG. 8, reference numeral 800 denotes an information processing apparatus, reference numeral 802 denotes an input unit such as a keyboard, reference numeral 804 denotes an information processing apparatus body, and reference numeral 806 denotes a display unit that uses the organic EL device for display.

  Since the electronic apparatus shown in FIGS. 7 and 8 includes the display unit of the organic EL device according to the above-described embodiment, it is possible to realize an electronic apparatus that is excellent in display quality and includes a bright screen display unit.

  According to the device manufacturing method and manufacturing apparatus of the present invention, it is possible to manufacture a device with high reliability by reducing variations in ejection characteristics. The present invention can also be applied to various processes for manufacturing devices using a droplet discharge head, such as a forming process.

BRIEF DESCRIPTION OF THE DRAWINGS (a) is a schematic perspective view, (b) is an expanded sectional view of a dummy area | region in the device manufacturing apparatus in Embodiment 1 of this invention. The figure which shows the measurement result of the S parameter measured with the high frequency circuit characteristic evaluation apparatus The figure which shows an example of the droplet discharged to the dummy area | region The figure which shows the example of arrangement | positioning (a)-(c) of the dummy area | region formed on a board | substrate. In the device manufacturing apparatus in Embodiment 2 of this invention, (a) is a schematic perspective view, (b) is an expanded sectional view of a dummy area | region. Schematic cross section showing organic EL device The figure which shows the electronic device carrying the organic EL device The figure which shows the electronic device carrying the organic EL device Schematic perspective view showing a conventional device manufacturing apparatus

DESCRIPTION OF SYMBOLS 101 Inkjet head 102 Board | substrate 103 Pattern formation area 104,104B Dummy area 105 High frequency circuit characteristic evaluation apparatus 106 Head controller 107 Stage 108 Partition 109 FET element 110 Protective film 111 Ink drop 112 Measurement result without ink drop 113 Measurement with ink drop Result 114 Desired ejected ink shape
115 Actual shape of ejected ink
601 Organic EL device 602 Substrate 604 Sealing layer 605 Light emitting layer 606 Hole transport layer 607 Cathode (electrode)
608 Anode (electrode)
609 Organic EL device (light emitting device)
610 Sealing member

Claims (17)

In a device manufacturing method including a step of discharging a liquid material from a droplet discharge head to a pattern formation region of a substrate,
A first step of discharging droplets of the liquid material to a predetermined area other than the pattern formation area, and the position, size, and shape of the liquid droplets discharged to the predetermined area as a base of the predetermined area A device manufacturing method comprising: a second step of detecting a change in high-frequency circuit characteristics of a plurality of functional elements formed; and a third step of performing an ejection operation on the pattern formation region.   The device manufacturing method according to claim 1, wherein the ejection operation is controlled based on a detection result of the second step.   3. The device manufacturing method according to claim 1, wherein a predetermined process is performed on the droplet discharge head based on a detection result of the second step.   4. The device manufacturing method according to claim 1, wherein the droplet discharge head is replaced with another droplet discharge head according to the detection result of the second step. 5.   The device manufacturing method according to claim 1, wherein the detection in the second step is performed using a high-frequency circuit characteristic evaluation apparatus.   The device manufacturing method according to claim 1, wherein the second step detects a discharge position in the predetermined region with respect to a reference position of the droplet.   The device manufacturing method according to claim 1, wherein the predetermined region of the second step is provided in a portion of the substrate other than the pattern formation region.   The device manufacturing method according to claim 1, wherein the predetermined region of the second step is provided in a portion of the stage that supports the substrate other than that that supports the substrate.   The device manufacturing method according to claim 1, wherein a material for forming an organic electroluminescence device is discharged onto the substrate. In a device manufacturing apparatus having a droplet discharge head capable of discharging a droplet of a liquid material to a pattern formation region of a substrate,
A plurality of dummy regions provided in a portion other than the pattern formation region, and a plurality of positions, sizes, and shapes of droplets discharged from the droplet discharge head with respect to the dummy region are formed on the base of the dummy region. A device for manufacturing a device, comprising: a detection device configured to detect a change in high-frequency circuit characteristics of the functional element.   The device manufacturing apparatus according to claim 10, further comprising a control device that controls an ejection operation of the droplet ejection head based on a detection result of the detection device.   12. The device manufacturing apparatus according to claim 10, further comprising a stage that supports the substrate, wherein the dummy region is provided in a portion of the stage other than supporting the substrate.   The device manufacturing apparatus according to claim 10, wherein the detection apparatus includes a high-frequency circuit characteristic evaluation apparatus.   The device for manufacturing a device according to claim 10, wherein the droplet discharge head discharges a material for forming an organic electroluminescence device.   A device manufactured by the device manufacturing method according to claim 1.   A device manufactured by the device manufacturing apparatus according to claim 10.   An electronic apparatus comprising the device according to claim 15 or 16.

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