JP6828879B2 - Defect inspection equipment and defect inspection method - Google Patents

Description

The present invention relates to a defect inspection device and a defect inspection method for obtaining a measurement result of the film thickness device and a defect inspection result.

A continuous sheet-like object such as an optical film is inspected, and the film thickness of the continuous sheet-like object is measured by a film thickness device in parallel with a device that detects defects such as stains and scratches on the continuous sheet, and defect detection and film thickness are performed. Defect inspection equipment that acquires the information is known. Such a defect inspection device is disclosed in, for example, Patent Document 1. In Patent Document 1, a sheet-like object is sandwiched between a receiving roll and a touch roll, the thickness of the sheet-like object is measured according to the movement of the touch roll, and the defect inspection result and the film thickness measurement obtained from the defect inspection apparatus are performed. The configuration for obtaining the result of is described.

Japanese Unexamined Patent Publication No. 9-3004026

Here, when inspecting the object to be inspected, if both the defect inspection result and the film thickness measurement result can be obtained, there is a relationship between the defect inspection result and the film thickness measurement result. It may be judged whether or not. For example, if the position on the object to be inspected where a defect is detected as a defect inspection result and the position on the object to be inspected where an abnormality in the film thickness is detected in the film thickness measurement result are approximately the same position. These measurements may be relevant. On the other hand, if their positions are some distance apart, they may not be relevant. It is desirable that it is easy to judge such a relationship.

The present invention has been made in view of such circumstances, and an object of the present invention is to provide a defect inspection apparatus and a defect inspection method for easily grasping the relationship between the result of defect inspection of an inspected object and the result of film thickness measurement. To provide.

In order to solve the above-mentioned problems, the present invention is a defect inspection device that inspects an object to be inspected while transporting the object to be inspected in the transport direction, and detects defects in the object to be inspected based on image data obtained from a line sensor. A defect detection unit that performs detection, a film thickness measuring unit that measures the film thickness of the object to be inspected in a direction orthogonal to the transport direction of the object to be inspected, and a defect detection unit obtained by the defect detection unit. In the defect inspection result including the result and the first coordinate indicating the position of the defect detection result in the inspected object, the film thickness measured by the film thickness measuring unit, and the inspected object in which the film thickness was measured. An inspection in which the defect detection result and the film thickness measurement result are represented on a map representing coordinates corresponding to the object to be inspected based on the film thickness measurement result including the second coordinate representing the position. It has an inspection result generation unit that generates a result map and an output unit that outputs an inspection result map generated by the inspection result generation unit.
For example, if the film thickness measurement result and the defect detection result overlap the position where the film thickness abnormality is found and the position where the defect is detected in the inspection result map, it is a defect caused by the film thickness abnormality. Can be judged.

Further, according to the present invention, in the above-mentioned defect inspection apparatus, the film thickness measuring unit is provided on the downstream side of the defect detecting unit in the transport direction of the object to be inspected, and the film thickness measuring unit is the defect detecting unit. The film thickness is measured at the position corresponding to the coordinates where the defect is detected.
As a result, the film thickness can be measured at the position corresponding to the coordinates where the defect is detected by the defect detection unit, so that the film thickness can be grasped for the position of the defect, and the relationship between the defect and the film thickness can be determined. Can be grasped.

Further, according to the present invention, in the above-mentioned defect inspection apparatus, the film thickness measuring unit is a measurement section for measuring the measurement target portion of the inspected object and is located substantially at the center of the measurement section in the transport direction of the inspected object. Measure so that the defect is located.
As a result, the measurement is performed so that the defect is located substantially in the center of the measurement section in the transport direction of the inspected object, so that the defect can be detected even while the transport speed of the inspected object is being accelerated or decelerated. The film thickness can be measured so that the position is at the center.

Further, according to the present invention, in the above-mentioned defect inspection apparatus, the inspection result generation unit generates the inspection result map in which the film thickness measurement result is in a mode corresponding to the measured film thickness.
Further, according to the present invention, in the above-mentioned defect inspection apparatus, the inspected object has a multi-layer structure, the film thickness measuring unit measures the film thickness of each layer of the inspected object, and the inspection result generating unit , The inspection result map is different for each of the layers, and each inspection result map generates an inspection result map including the film thickness of the corresponding layer and the defect inspection result.
Further, according to the present invention, in the above-mentioned defect inspection apparatus, the film thickness measuring unit is provided on the first film thickness measuring unit and on the downstream side of the first film thickness measuring unit in the transport direction of the object to be inspected. There is a second film thickness measuring unit, and the second film is between the measurement target parts when the first film thickness measuring unit measures a plurality of measurement target parts with respect to the transport direction of the object to be inspected. The thickness measuring unit measures the film thickness at a plurality of points in the transport direction.

According to the present invention, since the inspection result map in which the film thickness measurement result and the defect detection result are displayed on the same map is generated, the film thickness measurement result and the defect detection result are the coordinates in the inspected object. Since the positional relationship in the above can be easily grasped, the relationship between the film thickness and the defect can be easily grasped based on this positional relationship.

It is a schematic block diagram which shows the structure of the defect inspection apparatus 1 by one Embodiment of this invention. It is a flowchart explaining the flow of the process of film thickness measurement and defect detection of a defect inspection apparatus 1. It is a figure which shows the control timing of an inspection part 17 and a film thickness measuring part 16. It is a figure which shows an example of the film thickness measurement. It is a figure which shows an example of the film thickness measurement. It is a figure which shows an example of the film thickness map display. It is a figure which shows an example of the film thickness map display. It is a figure which shows an example of the defect detection map generated by the inspection part 17. It is a figure which shows an example of the inspection map which combined the defect detection result and the film thickness information. It is a figure which shows an example of the inspection map which combined the defect detection result and the film thickness information. It is a figure which shows the processing step of the film thickness measurement and defect detection in the 2nd Embodiment. It is a figure which shows the control timing of the film thickness measuring part 16 in the defect inspection apparatus of 2nd Embodiment. It is a figure which shows the relationship between the image pickup unit 11 and the film thickness sensor 14 in the 2nd Embodiment. It is a figure which shows the relationship between the image pickup unit 11 and the film thickness sensor 14 in the 2nd Embodiment. It is a figure which shows the relationship between the position of a defect classified into a film thickness and the range where measurement is performed by a film thickness sensor 14. It is a figure which shows an example of the map which combined the defect detection and the film thickness information of 2nd Embodiment. It is a figure which shows the structure of the defect inspection apparatus in 3rd Embodiment. It is a figure which shows the processing step of the film thickness measurement and defect detection in the 3rd Embodiment. It is a figure explaining the process step of film thickness measurement and defect detection in 4th Embodiment. It is a figure which shows the control timing of the defect inspection apparatus and the film thickness apparatus in 4th Embodiment. It is a figure which shows an example of the film thickness map which is the result of the film thickness measurement in 4th Embodiment. It is a figure which shows an example of the film thickness map which is the result of the film thickness measurement in the case of using the multi-point film thickness apparatus in the 4th Embodiment.

Hereinafter, the defect inspection apparatus according to the embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a schematic configuration diagram showing a configuration of a defect inspection device 1 according to an embodiment of the present invention.
The defect inspection device 1 includes an image pickup unit 11, a defect detection unit 12, a rotary encoder 13, an inspection unit 17, a film thickness sensor 14, a robot 15, and a film thickness measurement unit 16, and inspects the object to be inspected 50.
The object to be inspected 50 is in the form of a continuous sheet, and includes, for example, a metal plate, a rubber plate, a resin plate, etc. coated with a film or a transparent film. In the following embodiment, the case where the object to be inspected 50 is a film will be described as an example. The object to be inspected 50 has a long shape in the transport direction described later. The minor axis direction of the object to be inspected 50 corresponds to the width direction (X-axis direction), and the major axis (long) direction (Y-axis direction) corresponds to the transport direction.

The imaging unit 11 includes a line-shaped lighting device that illuminates the entire width of the object to be inspected 50, and a line sensor that receives the transmitted light or the reflected light. The longitudinal direction of the imaging range of the imaging unit 11 is arranged so as to be orthogonal to the traveling direction of the object to be inspected 50.
As this line-shaped lighting device, for example, a fluorescent lamp, a quartz rod lighting, an LED lighting or the like is used. As this line sensor, for example, one having 2048 to 8192 elements is used. As for the number of elements, an appropriate number of elements and speed (for example, data rate, scan rate, etc.) are used for a predetermined number of elements according to the width, traveling speed, resolution, installation space, etc. of the object to be inspected 50. .. Further, the line sensor receives the transmitted light transmitted through the object 50 to be inspected by the light emitted from the line-shaped lighting device. The light received by the line sensor is received in a state where the object to be inspected 50 is conveyed in the conveying direction. The line sensor outputs an electric signal (defect data) according to the shade of the color tone of the surface of the object to be inspected 50 to the defect detection unit 12. In other words, the line sensor outputs an electric signal according to the light intensity distribution on the surface of the object to be inspected 50 in units of lines (hereinafter, inspection lines) in a direction orthogonal to the traveling direction of the object to be inspected 50. Examples of the line sensor include a CMOS (complementary MOS) camera and a CCD (Charge-Coupled Device) camera.

The line-shaped illumination device of the imaging unit 11 is arranged on the back surface side of the object to be inspected 50, and the line sensor of the imaging unit 11 is arranged on the front surface side of the object to be inspected 50. Here, a case where the transmitted light transmitted through the object 50 to be inspected is received by the line sensor will be described. However, the line-shaped illumination device is arranged on the surface side of the object 50 to be inspected, and the light from the line-shaped illumination device is inspected. The line sensor may receive the reflected light reflected by the object 50.

The defect detection unit 12 is composed of an image processing computer and an image board connected to the line sensor of the imaging unit 11, and detects defects in the object 50 to be inspected based on the image data obtained from the line sensor. The defect detection unit 12 includes, for example, a binarization unit, a run-length coding unit, and a connectivity processing unit. The defect detection unit 12 binarizes the defect data input from the line sensor of the imaging unit 11 based on a predetermined threshold value, compresses the defect data, performs a connectivity process, and performs a defect feature amount (defect feature amount (defect detection unit 12). Information representing the characteristics of the shape of the defect, for example, the peripheral length, area, width, length, aspect ratio, area ratio of the defect) is measured. As the defect detection unit 12, an image processing device LSC-6000 manufactured by MEC Co., Ltd. can be used.

The rotary encoder 13 mainly brings the wheels of its own measuring unit into contact with the transfer roll, and measures the inspection length based on the rotation speed of the transfer roll. This transport roll transports the object to be inspected 50 in the transport direction. Here, the inspection length represents the distance from the inspection start position in the Y-axis direction of the object to be inspected 50.

The film thickness sensor 14 is transported by the robot 15 in a direction orthogonal to the transport direction of the object to be inspected, so that the film thickness sensor 14 reciprocates in the width direction of the object to be inspected 50. The moving range of the film thickness sensor 14 is determined according to the product width obtained by the inspection unit 17. With respect to this product width, the positions of both ends of the object to be inspected 50 can be detected by data analysis of the imaging result obtained from the imaging unit 11 in the defect detecting unit 12.
The film thickness sensor 14 has an optical fiber that irradiates the object 50 to be inspected with light from a light source. In the film thickness sensor 14, the light emitted from the optical fiber is reflected by the surface of the object to be inspected 50 and each layer in the laminated structure of the object to be inspected 50, and the reflected light is transmitted by the light receiving portion of the probe head for incident. Receive light. The received light is incident on the film thickness measuring unit 16 via the optical fiber.

The robot 15 has a linear guide rail provided along a direction along the width direction of the object to be inspected 50 (a direction orthogonal to the transport direction), and a moving table that moves along the guide rail. The rail moves the moving table according to the control signal from the inspection unit 17. The robot 15 is, for example, a uniaxial robot. A film thickness sensor 14 is mounted on the moving table, and the film thickness sensor 14 is reciprocated along the guide rail in the width direction of the object to be inspected 50. In this embodiment, the case where the robot 15 is arranged on the downstream side of the imaging unit 11 in the transport direction of the object to be inspected 50 will be described, but the robot 15 may be arranged so as to be on the upstream side with respect to the imaging unit 11. Good.

The film thickness measuring unit 16 is a spectroscopic film thickness measuring device. Visible halogen is used as the light source, and light is emitted to the optical fiber of the film thickness sensor 14. Further, the film thickness measuring unit 16 incidents the light emitted from the optical fiber and reflected from the object 50 to be inspected through the incident probe head of the film thickness sensor 14, and disperses the incident light to measure the film thickness. Do. In this case, since the film thickness measuring unit 16 is a film thickness measuring device that utilizes the reflection of visible light, only the transparent film and the transparent coating layer are measured, but the object 50 to be inspected is composed of a plurality of layers. Even if it is, it is possible to measure the film thickness for each layer.
The film thickness measuring unit 16 measures the thickness of the object to be inspected 50 while moving the film thickness sensor 14 for measuring the thickness of the object to be inspected 50 in the width direction of the object to be inspected 50.

The inspection unit 17 calculates the distance that the inspected object 50 is conveyed in the conveying direction based on the encoder value obtained from the rotary encoder 13, and obtains the coordinate value of the y coordinate.
Further, the inspection unit 17 outputs a control signal indicating an instruction for performing the film thickness measurement and the film thickness measurement unit 16 to the robot 15. The inspection unit 17 sets the coordinate position x in the X-axis direction of the robot 15 when the control signal is output and the control signal with respect to the film thickness information obtained from the film thickness measuring unit 16 in response to the control signal. The coordinates (x, y) consisting of the encoder value obtained from the rotary encoder 13 at the time of output are stored in association with each other. However, here, the coordinates to be stored in association with each other are corrected as described later.

The inspection unit 17 includes a defect detection result obtained by the defect detection unit 12, a defect inspection result including the first coordinate indicating the position of the defect detection result in the object to be inspected, and a film measured by the film thickness measuring unit 16. Based on the film thickness measurement result including the thickness and the second coordinate indicating the position of the film thickness in the inspected object, the defect detection result and the film thickness measurement result correspond to the inspected object 50. Generate a test result map represented against a map representing the coordinates.
The inspection unit 17 outputs the obtained inspection result on the screen of the display device. This display device may be provided by the inspection unit 17, or a display such as a liquid crystal display device may be connected to the outside. Further, this output may be not only display on the screen but also output of electronic data or printing.

The inspection unit 17 acquires the defect inspection result output from the defect detection unit 12, the film thickness information output from the film thickness measurement unit 16, and the robot position (x, y) at the time of film thickness measurement.
When the coordinates of the defect center detected by the imaging unit 11 are (X, Y) and the coordinates of the robot 15 (film thickness sensor 14) are (x, y), the inspection unit 17 has the coordinates as follows. Make corrections.
The x-coordinate of the robot 15 (thickness sensor 14) is the robot 15 when the origin of the robot 15 in the X-axis direction is 0 and the product end (product start point end) of the imaging unit 11 at the X coordinate is W ₀ = ₀ mm. The x-coordinate of (thickness sensor 14) (x-coordinate of the robot 15 corresponding to the product end W ₀ = ₀ mm) is x = Δxmm. Therefore, the inspection unit 17 obtains the x-coordinate of the robot 15 (film thickness sensor 14) based on X = x−Δx.
Assuming that the y coordinate of the film thickness sensor 14 is L mm away from the Y coordinate of the imaging unit 11, offset processing of L mm is performed from the current position of the film thickness sensor 14 to correct the coordinate deviation from the imaging unit 11. .. Therefore, the inspection unit 17 obtains the y coordinate of the robot 15 (film thickness sensor 14) based on Y = y−L (y = Y + L). Here, L represents the distance between the imaging unit 11 and the film thickness sensor 14.
By correcting the coordinates in this way, the inspection unit 17 makes the coordinates (x, y) of the film thickness sensor 14 match the coordinates (X, Y) of the imaging unit 11. The defect inspection result includes the coordinate X in the X-axis direction representing the coordinates of the object 50 in which the defect is detected, the coordinate Y in the Y-axis direction, and the defect inspection result.

Table 1 shown below is a table explaining examples of the equipment and the object to be inspected 50 used in the case of inspecting by the above-mentioned defect inspection apparatus 1. Examples have been described in this table, but the present invention is not limited to this, and various devices and objects to be inspected 50 can be applied.

FIG. 2 is a flowchart illustrating a flow of processing for film thickness measurement and defect detection of the defect inspection device 1 in FIG. 1 (the first outbound route of film thickness measurement from the start of inspection).
Step S11: The inspection unit 17 starts a defect inspection. Here, the inspection unit 17 resets the value of the Y coordinate of the inspected object 50 as Y = 0 at the start of the defect inspection, and obtains the distance that the inspected object 50 is conveyed by the transfer roll from the rotary encoder 13. Measure based on the encoder value. The reset timing is, for example, the timing when the inspection start signal by the inspection start button is input.
Further, at the start of the inspection, the inspection unit 17 detects both ends of the inspection object 50 in the width direction based on the imaging result of the inspection object 50 obtained via the imaging unit 11 and the defect detection unit 12. Then, the inspection width (corresponding to the product width) W of the object to be inspected 50 is measured. Based on this, the inspection unit 17 obtains the X coordinate (Δx) of the product end W _{0 and} sets X = 0.

Step S12: When the robot 15 receives the inspection start control signal from the inspection unit 17, the robot 15 receives the inspection start control signal, and based on the measurement result of the inspection width W, the range in the X-axis direction corresponding to the inspection width W (x = Δx + D to Δx + WD). ), Make a round trip. Here, the distance (distance from the product edge) D is the position where the film thickness measurement (defect inspection) is actually started from the coordinates of one end of the product edge (the product edge that is the reference for starting the defect) in the X-axis direction. The distance to the coordinates to be represented.
Here, when the robot 15 mounts the film thickness sensor 14 and moves, the measurement position of the film thickness sensor 14 corresponds to the range (x = Δx + D to Δx + WD) in the X-axis direction corresponding to the inspection width W. Move back and forth as you do.

Step S13: The inspection unit 17 outputs a control signal indicating an instruction to cause the film thickness measuring unit 16 to perform the measurement. The film thickness measuring unit 16 measures the film thickness based on the result obtained from the film thickness sensor 14 based on the control signal from the inspection unit 17.

Step S14: The inspection unit 17 acquires the robot position (measurement position (x coordinate)) when the control signal is output to the film thickness measuring unit 16 and the y coordinate corresponding to the encoder value of the rotary encoder 13. The film thickness measuring unit 16 includes a film thickness measurement result based on the value obtained from the film thickness sensor 14 and coordinates (x, y) representing coordinates in the object 50 in which the film thickness is measured. The film thickness information including the above is output to the inspection unit 17.

Step S15: The inspection unit 17 outputs an inspection map in real time on the screen of a display device provided inside or outside. Here, the inspection unit 17 displays the defect inspection result and the film thickness measurement result on the inspection map.

Here, the inspection unit 17 includes the result of the defect inspection obtained from the defect detection unit 12, the coordinate position where the defect inspection was performed, and the coordinates included in the film thickness information output from the film thickness measurement unit 16. Based on the above, the defect inspection result and the film thickness measurement result are superimposed and displayed on the same inspection map. The inspection unit 17 corrects the coordinates when displaying them in an overlapping manner.
Here, the coordinates (x, y) of the film thickness sensor 14 are
X = x-Δx, Y = y-L
By calculating based on the equation of, the coordinate position is corrected so that the position corresponds to the (X, Y) coordinate system of the defect inspection result in the imaging unit 11.

FIG. 3 is a diagram showing control timings of the inspection unit 17 and the film thickness measuring unit 16 in the above-described embodiment. The horizontal axis represents the result of time, and the vertical axis represents each part or control item in the defect inspection device 1.
When the defect inspection is started at time T1, the inspection unit 17 measures the product width (inspection width) of the object to be inspected 50 (inspection width measurement) at the inspection start timing (inspection start).
When the measurement of the product width of the object to be inspected 50 is completed, the robot 15 is made to move (robot movement) at the time T2 when the measurement is completed, and the film thickness measurement start position (the product edge on the reference side of the imaging unit) is moved. .. Further, at the time T3 when the robot 15 completes the movement to the film thickness measurement start position, the film thickness measuring unit 16 starts counting the measurement interval (30 mm) based on the signal obtained from the rotary encoder 13. This measurement interval is a distance in the Y-axis direction (distance in which the object to be inspected 50 is conveyed). The measurement interval (30 mm) is counted a predetermined number of times (38 times) until the robot 15 reaches the object to be inspected 50 from one end side to the other end side. For example, if the product width is 380 mm and the x-direction measurement interval is 10 mm, the measurement is performed 38 times as a predetermined number of times.

Further, the inspection unit 17 outputs a control signal for requesting film thickness measurement to the film thickness measurement unit 16 at time T3. At time T3, the film thickness measuring unit 16 starts film thickness measurement and analyzes the film thickness data based on this control signal. The inspection unit 17 acquires the position (x coordinate) in the width direction of the robot 15 at the time when the control signal of the film thickness measurement request is output and the y coordinate of the encoder value obtained from the rotary encoder 13. The inspection unit 17 calculates the correction of the positions of the image pickup unit 11 and the film thickness sensor 14 at the respective coordinates based on the equations of X = x−Δx and Y = y−L. At the time T4 when the film thickness data analysis by the film thickness measuring unit 16 is completed, the film thickness measuring unit 16 tells the inspection unit 17 the film thickness measurement result obtained as the analysis result of the film thickness data as the film thickness data. Send (film thickness information transmission). Further, the robot 15 is moved to the next film thickness measurement position in the x coordinate (robot movement).

When the inspection unit 17 detects that a predetermined measurement interval (30 mm) has arrived after starting the measurement of the measurement interval at time T3 based on the encoder value from the rotary encoder 13, it indicates that this measurement interval has arrived. At the time T3', which is the detected timing, the film thickness measurement unit 16 is output with a control signal for requesting film thickness measurement, and the film thickness measurement unit 16 is made to perform film thickness measurement and film thickness data analysis. At time T3', the film thickness measuring unit 16 starts film thickness measurement and analyzes the film thickness data based on this control signal. The position in the X direction in which the film thickness is measured at this timing is a position moved to the other end side in the X-axis direction of the object 50 to be inspected by 10 mm from the position in the X direction in which the previous measurement was performed.

The inspection unit 17 acquires the position (x coordinate) in the width direction of the robot 15 at the time when the control signal of the film thickness measurement request is output (time T3') and the y coordinate of the encoder value obtained from the rotary encoder 13. The inspection unit 17 calculates the correction of the positions of the image pickup unit 11 and the film thickness sensor 14 at the respective coordinates based on the equations of X = x−Δx and Y = y−L.
The film thickness measuring unit 16 transmits the film thickness data to the inspection unit 17 at the time T4', which is the timing when the film thickness data analysis is completed, and moves the robot 15 to the next film thickness measuring position in the X-axis direction. Further, the processing from the time T3'to the time T4'(from the time T3' to the time T4') is performed, and after that, the film thickness sensor 14 continues the inspection start position (inspection of the imaging unit 11) of the object 50 to be inspected in the X-axis direction. Repeat until the other end, which is the opposite side of the one end side corresponding to the start reference side end), is reached (for example, until the count number of the measurement interval reaches 38 times). When the film thickness sensor 14 completes the measurement of the film thickness up to the other end side opposite to the inspection start position in the X-axis direction of the object 50 to be inspected, the film thickness measuring unit 16 moves the robot 15 to the object 50 to be inspected. It is moved to the inspection start position in the X-axis direction (the end of the imaging unit 11 on the inspection start reference side).

In other words, the film thickness in the X-axis direction is measured 38 times between the time T3 and the time T3 ″. Since the distance of the object to be inspected 50 transported in the Y-axis direction per film thickness measurement is 30 mm, the robot 15 is 10 mm × in the X-axis direction between the time T3 and the time T3''. Since it is 38 times, it advances by 380 mm, and the object to be inspected 50 advances by 30 mm × 38 times = 1140 mm in the Y-axis direction.

Here, the transport distance (inspected object 50) in which the object to be inspected 50 from the time T3'' when the counting of the measurement interval ends to the time T3'''' when the counting of the next measurement interval is started is conveyed in the transport direction. The transport distance (transportation distance) at which the inspected object 50 is conveyed in the conveying direction until the robot 15 that reaches the other end side of the object 50 returns to the one end side of the inspected object 50) is 150 mm.
Further, in this embodiment, when the width of the object to be inspected 50 in the X-axis direction is 380 mm, the robot 15 reaching the other end side in the X-axis direction of the object to be inspected 50 is in the X-axis direction of the object to be inspected 50. The moving time until returning to one end side (inspection start reference side of the imaging unit 11) is 1.5 sec.

Therefore, when the transport speed of the inspected object 50 is 5 m / min, the inspected object 50 is conveyed by 125 mm in the Y-axis direction in the moving time of 1.5 sec until the robot 15 returns. Therefore, in this embodiment, the object to be inspected 50 is conveyed in the Y-axis direction from the time T3'' when the measurement interval (30 mm) count ends 38 times to the time T3'''' when the next film thickness measurement is started. The distance was set to 150 mm with a margin. That is, the film thickness sensor 14 returns from the other end side to the one end side of the inspected object 50 while the inspected object 50 is conveyed by 150 mm in the Y-axis direction based on the encoder value of the rotary encoder 13. Wait until the next film thickness measurement is started.

Next, the film thickness measuring unit 16 starts counting the measurement interval (30 mm) in the Y-axis direction at time T3 ″, based on the encoder value from the rotary encoder 13. Similarly, at time T3'', the inspection unit 17 outputs a control signal for requesting film thickness measurement to the film thickness measurement unit 16, and in response to this control signal, the film thickness measurement unit 16 measures the film thickness and the film. Perform thickness data analysis. The inspection unit 17 acquires the coordinates (x, y) of the object to be inspected 50 at the time when the signal of the film thickness measurement request is issued.

From time T3 to time T4 (or time T3'to time T4', time T3'' to time T4'', or time T3'''to time T4'''), the measurement time of the film thickness measuring unit 16 It depends on the analysis time required for film thickness data analysis.
For example, the time for the film thickness measuring unit 16 to measure the film thickness once (one place in the X-axis direction) is 3 msec, the time for analyzing the film thickness data is about 100 msec, and the robot movement time (when the x-direction measurement interval is 10 mm). ) Is 50 msec, so the time required from T3 to T3'is about 0.2 sec (= 153 msec). When the transport speed of the inspection target is 5 m / min, 17 mm is transported in 0.2 sec. That is, the transport distance, which is the distance at which the object to be inspected 50 is transported in the Y-axis direction while the film thickness measuring unit 16 measures one position in the X-axis direction, is 17 mm. Therefore, the measurement interval was set to 30 mm with a margin. Therefore, the film thickness measurement at one location is completed while the object to be inspected 50 is conveyed by 30 mm in the Y-axis direction.

4 and 5 are diagrams showing an example of film thickness measurement in the above-described embodiment.
The film thickness measuring unit 16 has a robot moving width 9 corresponding to the inspection width (distance that the robot 15 moves from one end side to the other end side of the object 50 to be inspected in the X-axis direction) measured by the defect inspection device 1. While the 15 makes one round trip, the film thickness measuring unit 16 repeatedly moves and stops until it reaches the other end side of the inspected object 50 in the X-axis direction on the outward route, and then the X of the inspected object 50 is measured. Return to one end side in the axial direction.
The film thickness sensor 14 measures only on the outward path from the film thickness measurement position (start point position) 101 to the film thickness measurement position (end point position) 103 in the X-axis direction, and does not stop at the film thickness measurement position (intermediate) 102 on the return path. Return to the film thickness measurement position (start point position) 101 (without measuring the film thickness). The measurement interval A for measuring the film thickness in the x direction may be arbitrarily set. The film thickness sensor 14 is not measured between the robot zero position 15a and the film thickness measurement position (start point position) 101.

In this embodiment, the film thickness of the object to be inspected 50 having a width (distance in the X-axis direction) from the product end W ₀ to the product end (product end point end) W ₁ was measured. The film thickness measurement position (start point position) 101 is set at 5 mm (distance D) from the product end W ₀ , and the x-direction measurement interval A is set at 10 mm intervals, and the film thickness is measured 38 times in the X-axis direction in one round trip. went.
The film thickness sensor 14 measures while moving in the width direction while the continuous sheet-like object (object to be inspected 50) is being conveyed in the Y-axis direction. Therefore, the measurement area 131 on the inspection target, which measures the film thickness at one time, shifts in the oblique direction for each measurement.
The width B of the measurement area 131 in the X-axis direction depends on the fiber diameter of the film thickness sensor 14. Further, the film thickness measurement length C in the Y-axis direction of the measurement area 131 depends on the exposure time of the film thickness measurement unit 16 and the transport speed of the object to be inspected 50. Further, the measurement interval E, which is the distance from the measurement start in the Y-axis direction of the measurement area to the measurement start position in the Y-axis direction of the next measurement area, is 30 mm of the measurement interval as described with reference to FIG. Become.

6 and 7 are diagrams showing an example of a film thickness map display showing the results of film thickness measurement in the embodiment described with reference to FIGS. 4 and 5.
According to the measurement methods shown in FIGS. 4 and 5, the film thickness was measured on the track 151 (outward path) of the film thickness sensor 14, and not on the track 152 (return path) of the film thickness measuring unit.
In FIG. 6, the film thickness map shows the measured area when the film thickness in the region of the normal film thickness is 2.1 μm to 1.9 μm and the film thickness is 1.9 μm or less. It is displayed as white (film thickness display F). When the film thickness is measured to be 2.1 μm or more, the measured area is displayed as black (film thickness display G). The normal film thickness portion (2.1 μm to 1.9 μm) is displayed as gray (film thickness display H). Then, the film thickness measuring unit 16 follows a display rule for displaying the film thickness measurement result according to the measured film thickness, for example, the vertical axis is the X-axis direction of the object 50 to be inspected, and the horizontal axis is the inspected object. The film thickness map 141 displayed in a display mode according to the measurement result of the film thickness is displayed at the positions (x, y) corresponding to the X-axis and the Y-axis in the Y-axis direction of the object 50.
Here, the normal film thickness portion is determined by the sheet-shaped product used as the object to be inspected 50, and is, for example, a value defined as normal in the specifications (or standards) of the sheet-shaped product to be inspected. Determined based on the range of.

In FIG. 7, the film thickness map 141 has a film thickness display block 161 as a region surrounded by a width I centered on the x position of the measurement start position in the X-axis direction and a distance J from the measurement start position to the next measurement. , Each film thickness display block is continuously arranged and displayed on the inspection map according to the coordinates measured in the X-axis direction and the Y-axis direction. The width I is the same as the x-direction measurement interval (reference numeral A in FIG. 5). Further, the distance J is evenly spaced.
In the film thickness display block 161, the measurement area 131 is displayed so as to be located at the boundary from the measurement area start position to the next measurement area start position, and the measurement area 131 is the center (width I and distance) of the film thickness display block 161. It is also possible to display so as to be a position corresponding to each center of J).
The film thickness map 141 is generated and displayed by the inspection unit 17 based on the inspection result of the defect detection unit 12 and the measurement result of the film thickness measurement unit 16.

FIG. 8 is a diagram showing an example of a defect detection map generated by the inspection unit 17 in the above-described embodiment.
The inspection unit 17 performs defect detection processing based on the image data obtained from the line sensor of the imaging unit 11, generates a defect detection map 170, and displays it on the screen of the display device. The position of the defect displayed on the defect detection map 170 and the symbol indicating the type thereof can be set under the conditions of the inspection unit 17.
For example, it can be set as follows.
If a foreign matter defect is detected, it is displayed as "○". In this figure, the foreign matter defect 181 is indicated by “◯” corresponding to the position where the defect is detected. The foreign matter defect is, for example, a defect in which a foreign matter is attached to the object to be inspected.
If an uneven defect is detected, it is displayed as "☆". In this figure, the uneven defect 182 is indicated by "☆" corresponding to the position where this defect is detected. The uneven defect is a defect in which the surface of the object to be inspected 50 is not flat and has a convex or concave shape.
If a streak defect is detected, it is displayed as "□". In this figure, the streak defect 183 is indicated by “□” corresponding to the position where the defect is detected. The streak defect is unevenness and dirt that occur continuously in parallel with the transport direction.
Based on this display condition, the inspection unit 17 generates and displays a defect detection map 170 in which symbols corresponding to the types of detected defects are displayed at positions corresponding to the coordinates where the defects are detected. To do.

9 and 10 are diagrams showing an example of an inspection map in which the defect detection result and the film thickness information in the above-described embodiment are combined. FIG. 9 shows an example of the inspection map 23 displaying the first layer among the plurality of layers of the object to be inspected 50, and FIG. 10 displays the second layer among the plurality of layers of the object to be inspected 50. It is a figure which shows an example of the inspection map 24.
Here, when the object to be inspected 50 is composed of a plurality of layers, the defect inspection device 1 can measure the film thickness for each layer. For example, when the object to be inspected 50 is composed of a plurality of layers, a coating layer is formed on one main surface (for example, the surface) of the base film, and the other main surface of the base film is formed. A coating layer may be formed on (for example, the back surface). In such a case, the film thickness of each layer can be measured by performing a curve fitting method or FFT (Fast Fourier Transform) and analyzing the spectrum of the reflected light (or transmitted light) from the object 50 to be inspected. .. In this case, a film thickness map is obtained for each layer. Then, for example, when the inspection map 23 (FIG. 9) displaying the first layer and the inspection map 24 (FIG. 10) displaying the second layer among the plurality of layers of the object 50 to be inspected are compared, uneven defects are found. In addition, it becomes possible to easily determine in which layer the streak defect occurs.
For such an inspection map for each layer, for example, it is possible to select which layer to display according to an instruction input via an input device (keyboard or mouse) provided in the inspection unit 17. Specifically, the inspection map of a specific layer may be selected and displayed, or two or more arbitrary layers may be selected and displayed side by side from a large number of layers.

In FIG. 9, the inspection map 23 is a result map when the film thickness map and the defect detection map in the first layer are overlapped. In FIG. 10, the inspection map 24 is a result map when the film thickness map and the defect detection map in the second layer are overlapped. In FIGS. 9 and 10, the vertical axis corresponds to the X-axis direction of the inspected object 50, and the horizontal axis corresponds to the Y-axis direction of the inspected object 50. When the coordinates of the uneven defect (uneven defect 182, ☆ mark) and the streak defect (streak defect 183, □ mark) generated due to the film thickness abnormality are located within the area of the film thickness abnormality obtained by the film thickness measurement. Can be easily confirmed by the inspection map 23 and the inspection map 24. If the coordinates match, it can be classified as an "abnormal film thickness defect".
Here, the inspection unit 17 determines whether or not the coordinates match, for example, when the coordinates of the film thickness information are within a predetermined range of the coordinates of the defect in the defect inspection result, the coordinates match. You may judge.
In FIG. 9, an area having a film thickness different from that of the other area in the first layer is displayed in a display mode different from the display mode of the other area. That is, in FIG. 10, it can be seen that the film thickness of the second layer is within the standard range in any area, but in FIG. 9, in the second layer, the film thickness of the area having the uneven defect 182 is found. It can be seen that the thickness is thinner than the other areas, and that the film thickness of the area with the streak defect 183 is thicker than that of the other areas.

Hereinafter, a second embodiment of the present invention will be described with reference to the drawings.
The configuration of the defect inspection device 1 in the second embodiment is almost the same as the configuration in the first embodiment, but the robot 15 installed downstream from the imaging unit 11 has films at regular intervals in the X-axis direction. Instead of measuring the thickness, the film thickness is measured at the coordinates where the defect is detected based on the fact that the defect is detected by the defect detection unit 12. That is, the measurement interval A does not apply.

FIG. 11 is a diagram showing processing steps of film thickness measurement and defect detection in the second embodiment.
In step S21, the inspection unit 17 starts defect detection and resets the coordinate Y in the Y-axis direction (Y = 0). Further, the inspection unit 17 measures the inspection width (product width) W of the inspection target, obtains the X coordinate (Δx) in the case of the product end W ₀ , and sets X = 0.
In step S22, when the defect detecting unit 12 detects a defect based on the imaging result obtained by the imaging unit 11, the inspection unit 17 classifies the result into the film thickness (unevenness, streaks, etc.). Determine if it is a defect. The inspection unit 17 controls to move to the X coordinate where the defect is detected when it is classified as having a defect related to the film thickness (when a defect related to the film thickness is detected) based on the inspection result of the defect detection unit 12. The signal is output to the robot 15. The robot 15 moves to the designated X coordinate (x = X + Δx) according to this control signal.

In step S23, the inspection unit 17 measures the transport speed of the object to be inspected 50 immediately before the film thickness measurement, and calculates the film thickness measurement length C (C = transport speed × measurement time). The transport speed is measured, for example, based on the pulse obtained from the rotary encoder. Further, the inspection unit 17 calculates the position of y = Y + LC / 2 based on the encoder value of the rotary encoder 13 at the Y coordinate in which the defect is detected, and measures the film thickness sensor 14 at the coordinate y. Output the control signal to be set. In response to this control signal, the film thickness sensor 14 measures the film thickness.

In step S24, the film thickness measuring unit 16 outputs the film thickness information obtained by measuring with the film thickness sensor 14 to the inspection unit 17. In step S25, the inspection unit 17 displays the film thickness information on the result map based on the defect detection result, and also superimposes the film thickness information sent from the film thickness measuring unit 16 on the same result map based on the measurement position. To display.

FIG. 12 is a diagram showing the control timing of the film thickness measuring unit 16 in the defect inspection device of the second embodiment.
When a defect classified into the film thickness (unevenness, streaks, etc.) is detected at time T1, the inspection unit 17 refers to the robot 15 at time T2 at coordinate X (x =), which is the position of the X coordinate at which the defect is detected. Move to X + Δx).
After the robot 15 moves to the coordinates X (x = X + Δx) at time T2, the transfer speed is measured at time T3 before the film thickness measurement is performed, and the film thickness measurement length (C = transfer speed × measurement time). ) Is calculated. Then, based on the Y coordinate when the defect is detected, at the time T4 obtained from Y + LC / 2, the inspection unit 17 outputs the film thickness measurement request control signal to the film thickness measurement unit 16, and the film thickness is measured. The measuring unit 16 performs film thickness measurement and film thickness data analysis based on this control signal.
The film thickness measuring unit 16 transmits the film thickness data to the inspection unit 17 at the time T5 when the film thickness data analysis is completed.

13 and 14 are diagrams showing the relationship between the image pickup unit 11 and the film thickness sensor 14 in the second embodiment. Here, the film thickness measuring unit 16 starts the measurement so that the defect is located substantially in the center of the measurement section in the transport direction of the inspected object 50, which is the measurement section in which the measurement target portion of the inspected object 50 is measured. The timing is determined and measured according to the transport speed.
When the imaging unit 11 detects a defect classified as a film thickness (unevenness, streaks, etc.), the defect moves to the X coordinate of the defect before reaching the robot 15 (the film thickness sensor 14) (FIG. 13). ). After the robot 15 (the film thickness sensor 14) moves, the film thickness sensor 14 waits until the defect is reached, and measures the film thickness at a timing obtained from Y + LC / 2 (FIG. 14). Thereby, for example, the film thickness sensor 14 can measure the film thickness at the coordinates where the uneven defect 182 is detected.
By measuring the film thickness under the above conditions, it is possible to measure the film thickness directly above the target defect even if the transport speed of the object to be inspected 50 fluctuates. When the transport speed of the inspected object 50 fluctuates, for example, the transport speed of the inspected object 50 is being accelerated immediately after the start of transport, or the transport speed of the inspected object 50 is being decelerated immediately before the end of transport. Or, there are cases where there is an instruction to change the transport speed during transport.

FIG. 15 is a diagram showing the relationship between the positions of defects classified into film thickness and the range measured by the film thickness sensor 14. In FIG. 15A, when the transport speed is slower than a predetermined speed, the measurement area 131 measured by the film thickness sensor 14 (the range of the so-called exposed object 50 to be exposed) is Y of the object 50 to be inspected. It is the range of the distance C1 in the axial direction. Then, the position just before C1 / 2 of the uneven defect 182 is obtained as the start position (reference numeral 221) of the film thickness measurement (Y + LC1 / 2) so that the uneven defect 182 is located at the center of the distance C1. The measurement is made from the position. In FIG. 15B, when the transport speed is faster than a predetermined speed, the measurement area 131 measured by the film thickness sensor 14 (the range of the so-called exposed object 50 to be exposed) is Y of the object 50 to be inspected. It is the range of the distance C2 in the axial direction. Then, the position just before C2 / 2 of the uneven defect 182 is obtained as the start position (reference numeral 222) of the film thickness measurement (Y + L-C2 / 2) so that the uneven defect 182 is located at the center of the distance C2. The measurement is made from the position.
Here, when the exposure time is constant, the distance C1 and the distance C2 are longer because the transport speed is faster.

FIG. 16 is a diagram showing an example of a map (inspection map 25) in which defect detection and film thickness information are combined in the second embodiment.
By displaying the defect detection results and the film thickness information obtained in FIGS. 13 and 14 on the result map, it can be easily determined that the film thickness abnormality has occurred at the defect portion. Further, when the film thickness abnormality is measured at the position where the film thickness is classified as having a defect in the defect inspection result, it can be classified as a "film thickness abnormality defect". In the result map display, when the normal film thickness is 2.1 μm to 1.9 μm, the coordinates measured with the film thickness being 1.9 μm or less display the area including the measured coordinates as white (film). Thickness display F). When the film thickness is measured as 2.1 μm or more, the area including the measured coordinates is displayed as black (in FIG. 16, there is no defect displayed in black). The measurement area where the film thickness is within the normal value range (2.1 μm to 1.9 μm) is displayed as gray (reference numeral H). In addition, the display of defect detection is set as follows. Further, here, as a defect inspection result, the foreign matter defect 181 is indicated by the symbol 〇, the uneven defect 182 is indicated by the symbol ☆, and the streak defect 183 is indicated by the symbol □.
Here, the size when the measurement area representing the film thickness measurement position is displayed on the result map is arbitrarily set as the film thickness display block width K in the X-axis direction and the film thickness display block length M in the Y-axis direction. It is possible. Further, the map display of the film thickness measurement position can be centered on the defect center coordinates.

Hereinafter, the third embodiment will be described in detail with reference to the drawings.
FIG. 17 is a diagram showing a configuration of a defect inspection device according to a third embodiment. In this third embodiment, the same configuration as that of the first (second) embodiment will be omitted, and the differences will be mainly described. In this third embodiment, the difference from the first (second) embodiment is that the film thickness sensor 18, the robot 19, and the film thickness measuring unit 20 are provided on the upstream side of the imaging unit 11. .. Here, the case where the rotary encoder 13 is located between the robot 19 and the image pickup unit 11 in the Y-axis direction is shown, but if the position is the same as the image pickup unit 11 and the film thickness sensors 14 and 18. It can be anywhere.

FIG. 18 is a diagram showing processing steps of film thickness measurement and defect detection in the third embodiment.
In step S31, the inspection unit 17 starts defect detection. At that time, the Y coordinate is reset (Y = 0). Further, the inspection unit 17 measures the inspection width (product width) W of the inspection target, and determines the difference (Δx ₁ , Δx ₂ ) from the x coordinate when the product end W ₀ is ₀ at the coordinate X. Calculate for (Δx ₂ ) and robot 19 (Δx ₁ ). Next, in step S32, based on the measurement of the test width W, the robot 19 (thickness sensor 18) reciprocates the range of _{(x 1 = Δx 1 + D~Δx} 1 + W-D) in the width direction movement To start. Next, in step S33, the inspection unit 17 outputs a control signal for measurement to the film thickness measuring unit 20, and the film thickness measuring unit 20 uses the film thickness sensor 18 to measure the film thickness based on the control signal from the inspection unit 17. Make a measurement.
In step S34, the inspection unit 17, the position of the robot 19 at the time of the output control signal to perform a measurement on the film thickness measuring unit 20 (measuring position (x ₁ coordinates)) and y ₁ coordinate of the encoder value, the robot 19 , Obtained from the rotary encoder 13.
The film thickness measuring unit 20 outputs the measured film thickness information to the inspection unit 17.

Next, in step S35, the inspection unit 17 displays the defect detection result on the result map. Further, the film thickness information transmitted from the film thickness measuring unit 20 is also superimposed and displayed on the same result map based on the measurement position.
Here, the coordinates (x ₁ , y ₁ ) of the film thickness sensor 18 are
X = x _{1 −} Δx ₁ , Y = y ₁ + L ₁
The coordinates are corrected based on the above, and the coordinates are matched with the (X, Y) coordinates of the imaging unit 11. Here, L ₁ is the distance from the film thickness sensor 18 to the imaging unit 11 in the Y-axis direction.
Next, in step S36, when it is determined that there is a defect classified as "film thickness abnormality defect" based on the above measurement result, a control signal for moving to the X coordinate of the defect is output to the robot 15. The robot 15 moves to the X coordinate (x ₂ = X + Δx ₂ ) where the defect is detected.
The inspection unit 17 measures the transport speed of the object to be inspected 50 immediately before the film thickness measurement, and calculates the film thickness measurement length C (C = transport speed × measurement time).
Further, the inspection unit 17 outputs a control signal for causing the film thickness sensor 14 to measure the film thickness at the position of y ₂ = Y + L ₂ −C / 2 based on the Y coordinate of the defect obtained from the encoder value. , The film thickness sensor 14 measures the film thickness based on this control signal. Here, L ₂ is the distance from the imaging unit 11 to the film thickness sensor 14 in the Y-axis direction.

In this third embodiment, the control timings of the defect detection unit 12 and the film thickness sensor 14 are the same as those in FIG. 3, and the control timings of the defect detection unit 12 and the film thickness sensor 18 are the same as those in FIG. The relationship between the image pickup unit 11 and the film thickness sensor 14 is the same as in FIGS. 13 and 14.

Next, a fourth embodiment of the present invention will be described. The configuration in the fourth embodiment is the same as the configuration in FIG. 17, but some processing contents are different.
FIG. 19 is a diagram illustrating a processing step of film thickness measurement and defect detection in the fourth embodiment.
In step S41, the inspection unit 17 starts detecting defects and resets the coordinates Y in the Y-axis direction (Y = 0). Further, the inspection unit 17 measures the inspection width (inspection target product width) W of the inspection target, and the difference from the x coordinate when the X coordinate in the case of the product end W ₀ is X = 0 (Δx ₁ , Δx ₂ ) is calculated for the robot 15 (Δx ₂ ) and the robot 19 (Δx ₁ ).
In step S42, based on the measurement of the test width W, the robot 19 (thickness sensor 18) starts moving back and forth the range in the width direction of the _{(x 1 = Δx 1 + D~Δx} 1 + W-D) .. Next, in step S43, the inspection unit 17 outputs a control signal for measurement to the film thickness measuring unit 20, and the film thickness measuring unit 20 uses the film thickness sensor 18 to receive a control signal from the defect inspection device from the inspection unit 17. , Measure the film thickness.
In step S44, the inspection unit 17, the position of the robot 19 when outputting a control signal to the film thickness measuring unit 20 (measuring position _{(x 1} coordinates)) and _{y 1} coordinate encoder values robot 19, from the rotary encoder 13 get.
The film thickness measuring unit 20 outputs the measured film thickness information to the inspection unit 17.

Next, in step S45, the inspection unit 17 displays the defect detection result on the result map. Further, the film thickness information transmitted from the film thickness measuring unit 20 is also superimposed and displayed on the same result map based on the measurement position.
Here, the coordinates (x ₁ , y ₁ ) of the film thickness sensor 18 are
X = x _{1 −} Δx ₁ , Y = y ₁ + L ₁
The coordinates are corrected based on the above, and the coordinates are matched with the (X, Y) coordinates of the imaging unit 11.
Next, in step S46, when the "film thickness abnormality" is measured by the film thickness measuring unit 20, a control signal for moving to the X coordinate in which the "film thickness abnormality" is measured is sent to the robot 15, and the robot 15 causes the robot 15. , Move to the X coordinate (x ₂ = X + Δx ₂ ) where the defect of abnormal film thickness is detected.
The inspection unit 17 outputs a control signal for measuring the film thickness from the position of y ₂ = Y + L ₂ −J to the film thickness sensor 14 based on the Y coordinate in which the film thickness abnormality occurs, and the film thickness sensor 14 causes the film thickness sensor 14. , The film thickness is measured at the position of the X coordinate (x ₂ = X + Δx ₂ ) based on the control signal from the inspection unit 17. The Y-axis in this film thickness measurement is performed a plurality of times at equal intervals up to the position of y ₂ = Y + L ₂ + J.
Therefore, the measurement interval of the film thickness sensor 14 is finely measured in a range narrower than the measurement interval of the film thickness sensor 18. Here, J is the distance from the measurement position to the next measurement position in the Y-axis direction of the film thickness measurement performed by the film thickness measuring unit 20, and the coordinates on the X-axis are not changed during this period. Therefore, when the "film thickness abnormality" is measured by the film thickness measuring unit 20, the X-axis coordinates at which the "film thickness abnormality" is found are the same, and the coordinates are set at equal intervals within a certain range in the Y-axis direction. Perform multiple film thickness measurements. As a result, the film thickness can be finely measured within a specific range including the area where the "film thickness abnormality" is measured.

FIG. 20 is a diagram showing control timing of the defect inspection device and the film thickness device according to the fourth embodiment.
The timing at which the film thickness abnormality is measured by the film thickness measuring unit 20 is time T1.
At time T2, the robot 15 moves to the X (x ₂ = X + Δx ₂ ) position where the film thickness is abnormal, based on the control signal from the inspection unit 17. The inspection unit 17 outputs a control signal for causing the film thickness measurement unit 16 to perform the film thickness measurement at the time T3 of y ₂ = Y + L _2- J based on the Y coordinate of the film thickness abnormality. In response to this control signal, the film thickness measuring unit 16 performs film thickness measurement and film thickness data analysis. Further, at this time T3, counting of the measurement interval (30 mm) is started. At the time T4 when the film thickness data analysis is completed by the film thickness measuring unit 16, the film thickness measuring unit 16 transmits the film thickness information to the inspection unit 17.
On the other hand, when the time T3'(T3 ") of the measurement interval (30 mm) arrives, the inspection unit 17 outputs a control signal of the film thickness measurement request to the film thickness measurement unit 16, and the film thickness measurement unit 16 outputs the film thickness. Perform measurement and film thickness data analysis.
At the time T4'(T4 ") when the film thickness data analysis by the film thickness measuring unit 16 is completed, the film thickness measuring unit 16 transmits the film thickness information to the inspection unit 17. The measurement interval count is y ₂ = Y + L. _The film thickness is measured up to ₂ + J. As a result, the film thickness is measured at equal intervals within the range of y ₂ = Y + L ₂ −J to y ₂ = Y + L ₂ + J. Here, the film thickness measuring unit 20 is performed at the same X coordinate position. When the film thickness abnormality is continuously measured as a defect detection result, the inspection unit 17 keeps counting the measurement interval with respect to the film thickness measuring unit 16 until the film thickness abnormality ends (until the film thickness abnormality disappears). It is possible.
On the other hand, regardless of the measurement timing of the film thickness measuring unit 16, the film thickness measuring unit 20 continuously measures the film thickness. The control timing of the film thickness measuring unit 20 is the same as the timing shown in FIG.

FIG. 21 is a diagram showing an example of a film thickness map which is a result of film thickness measurement in the fourth embodiment.
Based on the measurement conditions of the first embodiment described above, when the product width is 380 mm and the transfer speed is 5 m / min, the film thickness measuring unit 20 performs the measurement start position (for example, the first measurement position). The distance J from 300) to the next measurement position (for example, the second measurement position 301) is 1290 mm (1140 mm when 38 measurements are performed at 30 mm intervals), and 150 mm when the robot moves from the measurement end point to the next measurement start point. Since the distance between the two is not measured, the total distance is 1290 mm), and the total distance up to the next measurement position (for example, the third measurement position 302) is 2580 mm. When the film thickness abnormality is measured by the film thickness measuring unit 20 in the divided film thickness display block 310 which is a part of the film thickness display block at the second measurement position 301, the film thickness abnormality of the divided film thickness display block 310 is detected. With reference to the measured measurement position on the Y-axis (second measurement position 301), the front-back range (from the first measurement position 300 to the third measurement position 302) in the Y-axis direction is finely measured by the film thickness measuring unit 16. can do.

Specifically, the film thickness measuring unit 16 is a film from the Y coordinate (first measuring position 300) that traces a distance J from the position where the film thickness abnormality is detected by the film thickness measuring unit 20 (second measuring position 301). The thickness measurement is started, and the film thickness measurement is performed until the measurement area including the position where the film thickness abnormality is no longer detected by the film thickness measuring unit 20 is completed (here, up to the third measurement position 302).
The area where the film thickness measuring unit 20 can measure only three times (the positions of the first measurement position 300, the second measurement position 301, and the third measurement position 302) is measured by using the film thickness measuring unit 16 and the measurement interval is set to 30 mm. In the case of measurement, it is possible to measure from the first measurement position 300 to the position of the third measurement position 302 a total of 76 times. In addition, as for the map display of the film thickness information, the measurement area measured by the film thickness measuring unit 16 can be displayed in more detail (at short intervals) than the measurement area measured by the film thickness measuring unit 20. Become. For example, when the film thickness is measured using only the film thickness measuring unit 20 without using the film thickness measuring unit 16, the range shown from the second measurement position 301 to the third measurement position 302 is regarded as an abnormal film thickness. Although it is displayed on the screen, here, the film thickness measurement unit 16 further measures the film thickness, and the film thickness information is determined based on the measurement result. Therefore, for example, the film thickness abnormality is thinner than the specified value. The area measured as is displayed in white in a measurement area (divided film thickness display block group 320) narrower than the measurement area from the second measurement position 301 to the third measurement position 302.

Further, when a multi-point film thickness device (for example, C11295 (manufactured by Hamamatsu Photonics Co., Ltd.)) different from the film thickness measuring unit 20 is applied to the film thickness measuring unit 16, a plurality of points (2 points to 15) in the width direction are applied. It is also possible to measure points) at the same time.
FIG. 22 is a diagram showing an example of a film thickness map which is a result of film thickness measurement when a multi-point film thickness device is used in the fourth embodiment. In this example, when a multi-point film thickness device is used as the film thickness measuring unit 16 and the film thickness abnormality is measured in the width direction region 330 by the film thickness measuring unit 20, it is shown in the width direction region 330. In the range, the film thickness can be measured by the multi-point film thickness device (film thickness measuring unit 16), and a plurality of points (three points in FIG. 22) can be measured at the same time in the X-axis direction. As a result, it is possible to divide the measurement area measured by the film thickness measuring unit 20 in the X-axis direction into smaller pieces (here, divided into three), measure the film thickness for each divided area, and create a film thickness map. ..

In the above-described embodiment, since the spectrum of the reflected light from the inspected object is analyzed as the film thickness sensor based on the spectroscopic interference method, the film thickness can be measured without contacting the inspected object. it can. As a result, when a measuring device using a touch roll is used, it is possible to avoid a decrease in measurement accuracy due to the fact that the position in the height direction does not mechanically change.

Further, in the above-described embodiment, when the film thickness defect (unevenness, streaks, etc.) detected by the defect detection unit and the film thickness abnormality area obtained from the film thickness measurement unit match, the defect inspection device has a film thickness. It can be classified as an abnormal defect.
In addition, the defect inspection device can classify which coating layer the film thickness defect (unevenness, streaks, etc.) detected by the defect detection unit occurs in.

The defect inspection apparatus according to the above-described embodiment may be realized by a computer. In that case, the program for realizing this function may be recorded on a computer-readable recording medium, and the program recorded on the recording medium may be read by the computer system and executed. The term "computer system" as used herein includes hardware such as an OS and peripheral devices. Further, the "computer-readable recording medium" refers to a portable medium such as a flexible disk, a magneto-optical disk, a ROM, or a CD-ROM, or a storage device such as a hard disk built in a computer system. Further, a "computer-readable recording medium" is a communication line for transmitting a program via a network such as the Internet or a communication line such as a telephone line, and dynamically holds the program for a short period of time. It may also include a program that holds a program for a certain period of time, such as a volatile memory inside a computer system that serves as a server or a client in that case. Further, the above program may be for realizing a part of the above-mentioned functions, and may be for realizing the above-mentioned functions in combination with a program already recorded in the computer system. It may be realized by using a programmable logic device such as FPGA (Field Programmable Gate Array).

Although the embodiments of the present invention have been described in detail with reference to the drawings, the specific configuration is not limited to this embodiment, and includes designs and the like within a range that does not deviate from the gist of the present invention.

1 ... Defect inspection device, 9 ... Robot movement width, 11 ... Imaging unit, 12 ... Defect detection unit, 13 ... Rotary encoder, 14, 18 ... Film thickness sensor, 15, 19 ... Robot, 15a ... Robot zero position, 16, 20 ... film thickness measurement unit, 17 ... inspection unit, 23, 24, 25 ... inspection map, 50 ... inspected object, 101 ... film thickness measurement position (start point position), 102 ... film thickness measurement position (intermediate), 103 ... Film thickness measurement position (end point position), 131 ... measurement area, 141 ... film thickness map, 161 ... film thickness display block, 151 ... start (outward route), 152 ... orbit (return route), 170 ... defect detection map, 181 ... foreign matter Defects, 182 ... unevenness defects, 183 ... streak defects, 221,222 ... measurement start position, 300 ... first measurement position, 301 ... second measurement position, 302 ... third measurement position, 310 ... divided film thickness display block, 320 ... Divided film thickness display block group, 330 ... Area in width direction, A ... Measurement interval, B ... Width, C ... Film thickness measurement length, C1, C2 ... Distance (distance in Y-axis direction), D ... Distance (product Interval from edge), E ... Measurement interval, F ... Film thickness display (thinner result than normal part), G ... Film thickness display (thicker result than normal part), H ... Thickness display (normal part), I ... Width (Thickness display block width, 1st embodiment), J ... Distance (Thickness display block length, 1st embodiment), K ... Film thickness display block width, L ... Distance (with image pickup unit and film thickness sensor) Distance), L ₁ ... Distance (distance between film thickness sensor and imaging unit), L ₂ ... Distance (distance between imaging unit and film thickness sensor), M ... Film thickness display block length, W ... Inspection width (inspection) Target product width), W ₀ ... Product end (product start point end), W ₁ ... Product end (product end point end)

Claims (8)

A defect inspection device that inspects an object to be inspected while transporting it in the transport direction.
A defect detection unit that detects defects in the object to be inspected based on image data obtained from the line sensor,
A film thickness measuring unit that measures the film thickness of the object to be inspected in a direction orthogonal to the transport direction of the object to be inspected.
The defect inspection result including the defect detection result obtained by the defect detection unit and the first coordinate indicating the position of the defect detection result in the inspected object, the film thickness measured by the film thickness measuring unit, and the film. Based on the film thickness measurement result including the second coordinate representing the position in the inspected object whose thickness was measured, the defect detection result and the film thickness measurement result are the coordinates corresponding to the inspected object. The inspection result generator that generates the inspection result map represented by the map representing
An output unit for outputting a test result map generated by the inspection result generation unit,
Have,
The defect inspection device is
The first coordinate of the defect detection result obtained by the defect detection unit and the second coordinate measured as a film thickness abnormality based on the film thickness obtained by the film thickness measuring unit and the reference range coincided with each other. Classify defects as abnormal film thickness defects
Defect inspection apparatus. The film thickness measuring unit is provided on the downstream side of the defect detecting unit in the transport direction of the object to be inspected.
The film thickness measuring unit is a measurement section for measuring a measurement target portion of the inspected object at a position corresponding to the coordinates where the defect is detected by the defect detecting unit, and is a transport direction of the inspected object. The defect inspection apparatus according to claim 1 , wherein the defect is measured so as to be located substantially in the center of the measurement section in the above . The film thickness measuring unit includes a first film thickness measuring unit and a second film thickness measuring unit provided on the downstream side of the first film thickness measuring unit in the transport direction of the object to be inspected.
When the first film thickness measuring unit measures a plurality of measurement target parts with respect to the transport direction of the object to be inspected, the second film thickness measuring unit is in the transport direction. The defect inspection apparatus according to claim 1 or 2 , wherein the film thickness is measured at a plurality of locations as measurement targets. A defect inspection device that inspects an object to be inspected while transporting it in the transport direction.
A defect detection unit that detects defects in the object to be inspected based on image data obtained from the line sensor,
A film thickness measuring unit that measures the film thickness of the object to be inspected in a direction orthogonal to the transport direction of the object to be inspected.
The defect inspection result including the defect detection result obtained by the defect detection unit and the first coordinate indicating the position of the defect detection result in the inspected object, the film thickness measured by the film thickness measuring unit, and the film. Based on the film thickness measurement result including the second coordinate representing the position in the inspected object whose thickness was measured, the defect detection result and the film thickness measurement result are the coordinates corresponding to the inspected object. The inspection result generator that generates the inspection result map represented by the map representing
An output unit for outputting a test result map generated by the inspection result generation unit,
Have,
The film thickness measuring unit is a measurement section for measuring the measurement target portion of the object to be inspected, and is a defect inspection device for measuring so that the defect is located substantially in the center of the measurement section in the transport direction of the object to be inspected. .. A defect inspection device that inspects an object to be inspected while transporting it in the transport direction.
A defect detection unit that detects defects in the object to be inspected based on image data obtained from the line sensor,
A film thickness measuring unit that measures the film thickness of the object to be inspected in a direction orthogonal to the transport direction of the object to be inspected.
The defect inspection result including the defect detection result obtained by the defect detection unit and the first coordinate indicating the position of the defect detection result in the inspected object, the film thickness measured by the film thickness measuring unit, and the film. Based on the film thickness measurement result including the second coordinate representing the position in the inspected object whose thickness was measured, the defect detection result and the film thickness measurement result are the coordinates corresponding to the inspected object. The inspection result generator that generates the inspection result map represented by the map representing
An output unit for outputting a test result map generated by the inspection result generation unit,
Have,
The film thickness measuring unit includes a first film thickness measuring unit and a second film thickness measuring unit provided on the downstream side of the first film thickness measuring unit in the transport direction of the object to be inspected.
When the first film thickness measuring unit measures a plurality of measurement target parts with respect to the transport direction of the object to be inspected, the second film thickness measuring unit is in the transport direction. A defect inspection device that measures the film thickness at multiple locations . This is a defect inspection method in a defect inspection device that inspects an object to be inspected while transporting it in the transport direction.
The defect detection unit detects defects in the inspected object based on the image data obtained from the line sensor.
The film thickness measuring unit measures the film thickness of the object to be inspected in a direction orthogonal to the transport direction of the object to be inspected.
The inspection result generation unit measures the defect inspection result including the defect detection result obtained by the defect detection unit and the first coordinate representing the position of the defect detection result in the inspected object, and the film thickness measuring unit. Based on the film thickness measurement result including the film thickness and the second coordinate indicating the position of the film to be inspected, the defect detection result and the film thickness measurement result are the subject. The inspection result map generated for the map representing the coordinates corresponding to the inspection object is generated, and the output unit is a defect inspection method for outputting the inspection result map generated by the inspection result generation unit .
The defect inspection device measures the film thickness as an abnormality based on the first coordinates of the defect detection result obtained by the defect detection unit and the film thickness and the reference range obtained by the film thickness measurement unit. A defect inspection method that classifies defects that match the coordinates as abnormal film thickness defects . This is a defect inspection method in a defect inspection device that inspects an object to be inspected while transporting it in the transport direction.
The defect detection unit detects defects in the inspected object based on the image data obtained from the line sensor.
The film thickness measuring unit measures the film thickness of the object to be inspected in a direction orthogonal to the transport direction of the object to be inspected.
The inspection result generation unit measures the defect inspection result including the defect detection result obtained by the defect detection unit and the first coordinate representing the position of the defect detection result in the inspected object, and the film thickness measuring unit. Based on the film thickness measurement result including the film thickness and the second coordinate indicating the position of the film to be inspected, the defect detection result and the film thickness measurement result are the subject. The inspection result map generated for the map representing the coordinates corresponding to the inspection object is generated, and the output unit is a defect inspection method for outputting the inspection result map generated by the inspection result generation unit .
The film thickness measuring unit is a measurement section for measuring the measurement target portion of the object to be inspected, and is a defect inspection method for measuring so that the defect is located substantially in the center of the measurement section in the transport direction of the object to be inspected. .. This is a defect inspection method in a defect inspection device that inspects an object to be inspected while transporting it in the transport direction.
The defect detection unit detects defects in the inspected object based on the image data obtained from the line sensor.
The film thickness measuring unit measures the film thickness of the object to be inspected in a direction orthogonal to the transport direction of the object to be inspected.
The inspection result generation unit measures the defect inspection result including the defect detection result obtained by the defect detection unit and the first coordinate representing the position of the defect detection result in the inspected object, and the film thickness measuring unit. Based on the film thickness measurement result including the film thickness and the second coordinate indicating the position of the film to be inspected, the defect detection result and the film thickness measurement result are the subject. The inspection result map generated for the map representing the coordinates corresponding to the inspection object is generated, and the output unit is a defect inspection method for outputting the inspection result map generated by the inspection result generation unit .
The film thickness measuring unit includes a first film thickness measuring unit and a second film thickness measuring unit provided on the downstream side of the first film thickness measuring unit in the transport direction of the object to be inspected.
When the first film thickness measuring unit measures a plurality of measurement target parts with respect to the transport direction of the object to be inspected, the second film thickness measuring unit is in the transport direction. A defect inspection method that measures the film thickness at multiple locations .

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