JP2017013116A - Thread solder tip opening in thread solder feeding device - Google Patents

Thread solder tip opening in thread solder feeding device Download PDF

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JP2017013116A
JP2017013116A JP2015141659A JP2015141659A JP2017013116A JP 2017013116 A JP2017013116 A JP 2017013116A JP 2015141659 A JP2015141659 A JP 2015141659A JP 2015141659 A JP2015141659 A JP 2015141659A JP 2017013116 A JP2017013116 A JP 2017013116A
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solder
flux
thread solder
feed
thread
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正一 北野
Shoichi Kitano
正一 北野
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Abstract

PROBLEM TO BE SOLVED: To provide a thread solder feeding device which is configured to prevent a flux-cored thread solder from scattering, while preventing adherence, deposition and sticking of the flux to avoid malfunction in feeding during feeding of the flux-core thread solder containing adhesive resin.SOLUTION: In a thread solder feeding step, a flux is fed without being opened as a preliminary processing to allow a thin film of solder alloy to remain closed, and then a tip of the fed thread solder is opened.SELECTED DRAWING: Figure 11

Description

本発明は、フラックス内包糸半田の自動半田付け装置で使用される糸半田送り機の飛散防止に関する。  The present invention relates to prevention of scattering of a yarn solder feeder used in an automatic soldering apparatus for flux-embedded yarn solder.

フラックスを内包した糸半田の、半田付け時に発生する半田、フラックス飛散防止を目的として、糸半田送り機の挟み送りロ−ラ−で、糸半田の線上に沿ってフラックスを開腹加工させる。開腹半田断面形状には[図1]イ)、ロ)、ハ)、ニ)、その他の形態がある。
自動半田付けにおいては、該加工でフラックスが開腹された糸半田が、送りガイド等を通して半田付けポイントへ送給される。
近年、半田付部品の小型化、部品同士の間隔が狭い、フレキ基板実装、振動、熱衝撃、接合力不足、半田ショート、半田飛散、フラックス飛散、フラックス残渣による剥離等に対し、半田付けの高信頼性が重要になっている。そのことから、フラックスに接着性のある樹脂を含ませた糸半田が使用されるようになって来た。
For the purpose of preventing solder generated during soldering and flux scattering of the thread solder containing the flux, the flux is opened along the line of the thread solder by a pin feed roller of the thread solder feeder. The open solder cross-sectional shape includes [Fig. 1] a), b), c), d), and other forms.
In automatic soldering, thread solder whose flux is opened by the processing is fed to a soldering point through a feed guide or the like.
In recent years, high soldering is required for miniaturization of soldered parts, narrow spacing between parts, flexible board mounting, vibration, thermal shock, insufficient bonding force, solder short, solder scattering, flux scattering, separation due to flux residue, etc. Reliability is important. For this reason, thread solder in which an adhesive resin is included in the flux has been used.

発明が解決しようとする課題Problems to be solved by the invention

接着性樹脂含有だけでは、半田飛散防止は不十分であるため、フラックス開腹が求められる。
フラックス開腹加工機能を持った、糸半田送り機の挟み送りロ−ラ−でフラックスを開腹加工したとき、フラックスに接着性樹脂を含まない場合は、挟み送りロ−ラ−や送りガイド、その他糸半田接触部等に、フラックスは付着するが糸半田送りを阻害することはない。
近年、使用されるようになった接着性樹脂を含んだフラックスは、挟み送りロ−ラ−、並びに送りガイド、その他糸半田接触部等に付着、堆積、固着し、糸半田送りが不能となる、従って該フラックスを含んだ糸半田の糸半田送り機が機能せず、自動半田付けが出来ない。
Since only the adhesive resin is contained is insufficient to prevent solder scattering, flux laparotomy is required.
When flux is opened with a pin feed roller of a thread solder feeder with a flux opening process, if the flux does not contain adhesive resin, the pin feed roller, feed guide, and other threads The flux adheres to the solder contact portion or the like but does not hinder the thread solder feeding.
In recent years, flux containing adhesive resin, which has been used, adheres, accumulates, and adheres to pinch feed rollers, feed guides, and other thread solder contact portions, making yarn solder feed impossible. Therefore, the thread solder feeder for thread solder containing the flux does not function and automatic soldering cannot be performed.

課題を解決するための手段Means for solving the problem

糸半田送り機の挟みロ−ラ−ではフラックスの開腹が行われない予備加工とし、半田合金薄膜を残存させてフラックス未開腹状態のまま送り出し、送りガイド先端部分で開腹するための仕上げ加工を行う。  The soldering roller of the yarn solder feeder is preliminarily processed so that the flux is not opened, and the solder alloy thin film is left as it is, and the flux is not opened, and the finish is performed to open at the tip of the feed guide. .

発明の効果Effect of the invention

糸半田送り機の挟みロ−ラ−、送りガイド、その他糸半田接触部等の送り機構部分での接着性樹脂含有フラックスの付着,堆積を防ぎ、自動半田付けが可能となる。さらに、仕上げ加工に熱線、熱風、誘導加熱、高周波加熱、光ビーム、レ−ザ−光を使用すれば、余熱機能も加わり、半田、フラックス飛散防止、半田付け時間短縮に寄与する。  Adhesive resin-containing flux is prevented from adhering and accumulating at a feed mechanism portion such as a pinch roller of a yarn solder feeder, a feed guide, and other yarn solder contact portions, thereby enabling automatic soldering. Furthermore, if hot wire, hot air, induction heating, high-frequency heating, light beam, or laser light is used for finishing, an additional heat function is added, which contributes to prevention of solder and flux scattering and shortening of the soldering time.

フラックス内包糸半田のイ)〜ニ)等の開腹形態例断面。  Cross section of an example of laparotomy of flux-embedded yarn solders (i) to (d). 図1のイ)の形態の予備加工糸半田の断面、上面、側断面。  The cross section of the pre-processed yarn solder of the form of a) of FIG. 図1のイ)の形態の仕上げ加工糸半田の断面、上面、側断面。  FIG. 1 is a cross-sectional view, a top surface, and a side cross-section of a finish-processed yarn solder in the form of a) in FIG. 図1のロ)の形態の予備加工糸半田の断面、上面、側断面。  The cross section of the pre-processed yarn solder of the form of b) of FIG. 図1のロ)の形態の仕上げ加工糸半田の断面、上面、側断面。  The cross section of the finishing thread solder of the form of b) of FIG. 図1のハ)の形態の予備加工糸半田の断面、上面、側断面。  The cross section of the pre-processed yarn solder of the form of (c) of FIG. 図1のハ)の形態の仕上げ加工糸半田の断面、上面、側断面。  FIG. 1 is a cross-sectional view, a top surface, and a side cross-section of a finish-processed yarn solder in the form shown in FIG. 図1のニ)の形態の予備加工糸半田の断面、上面、側断面。  Section of the pre-processed yarn solder in the form of d) in FIG. 図1のニ)の形態の仕上げ加工糸半田の断面、上面、側断面。  FIG. 1 is a cross-sectional view, a top surface, and a side cross-section of a finish-processed yarn solder in the form of d) in FIG. 糸半田の断面図。  Sectional drawing of a thread solder. 糸半田の予備加工をする、糸半田送り機の正面図。  The front view of the thread solder feeder which pre-processes thread solder. 図1のイ)の形態の挟み送りローラーの断面図。  Sectional drawing of the pinch | feeding roller of the form of (a) of FIG. 実施例1の半田送給先端部正面図と半田付け部の断面図。  FIG. 2 is a front view of a solder feeding front end portion according to the first embodiment and a cross-sectional view of a soldering portion. 実施例2の半田送給先端部正面図、上面図、側面図。  FIG. 6 is a front view, a top view, and a side view of a solder feeding tip portion according to the second embodiment. 実施例3の半田送給先端部正面図、上面図、側面図。  FIG. 6 is a front view, a top view, and a side view of a solder feed tip according to a third embodiment. 実施例4の半田送給先端部正面図、上面図、側面図。  FIG. 6 is a front view, a top view, and a side view of a solder feed tip according to a fourth embodiment. 実施例5の半田送給先端部正面図、上面図、側面図。  FIG. 6 is a front view, a top view, and a side view of a solder feeding tip portion according to a fifth embodiment. 実施例6の半田送給先端部正面図、上面図、側面図。  FIG. 10 is a front view, a top view, and a side view of a solder feed tip according to a sixth embodiment. 実施例7の半田送給先端部正面図、上面図、側面図。  FIG. 10 is a front view, a top view, and a side view of a solder feeding tip portion according to a seventh embodiment.

糸半田の送り機の挟み送りロ−ラ−にフラックス未達開腹の予備加工を担わせ、半田合金の薄膜を残存させて、送りガイド先端部で仕上げ加工を行う。
フラックス開腹の仕上げ加工力は予備加工によって低減、あるいは最少化されている。従って、半田合金の該薄膜を、挟み送りローラーの送り力を使用した切断、または加熱等の種々の僅少な加工力で開腹させる。
The pinch roller of the yarn solder feeder is responsible for pre-processing to open the flux, and the solder alloy thin film is left, and finishing is performed at the tip of the feed guide.
The finishing force for flux opening is reduced or minimized by pre-processing. Therefore, the thin film of the solder alloy is opened by various slight processing forces such as cutting using the feed force of the sandwich feed roller or heating.

図6では図1のイ)〜ニ)断面に見合った、予備加工を施す糸半田供給機を示し、1の糸半田は2の半田合金と3のフラックスで構成される、図6aの断面を有す。1の糸半田は、4の糸半田リールから、糸半田供給機の5のベースに取り付けた、6の入口ガイドをとおして、図1のイ)〜ニ)いずれかの7の予備加工ロ−ラ−と8のガイドロ−ラ−で予備加工されながら、9の送りガイドへ挟み送りされる。
予備加工された糸半田はそれぞれ図2a、図3a、図4a、図5aの予備加工図の形態を有する。
図7では、図1のイ)形態を形成する、10の予備加工ロ−ラ−と11のガイドロ−ラ−で、図2aの断面を形成しつつ挟み送りをする。これらの挟み送りローラーは糸半田供給機の5aのベースに組み付けてあり、5bのモーターで駆動される。
図8では、12の送りガイド先端部で、予備加工半田に図1のイ)の形態の開腹仕上げ加工を施す。仕上げ加工された糸半田は図2b)の断面を有し、該糸半田及び13の基板の14のピンと15の基板ランド部に熱源を与えられることによって半田接合する。
FIG. 6 shows a yarn solder feeder for performing preliminary processing corresponding to the cross section of FIGS. 1) to 4), wherein 1 yarn solder is composed of 2 solder alloys and 3 fluxes. Yes. The yarn solder 1 is supplied from the yarn solder reel 4 to the base 5 of the yarn solder supply machine 6 through the inlet guide 6 of FIG. While being preliminarily processed by the rollers and the guide rollers of 8, they are nipped and fed to the feed guide of 9.
The pre-processed yarn solder has the form of the pre-processed diagrams of FIGS. 2a, 3a, 4a, and 5a, respectively.
In FIG. 7, 10 preliminary processing rollers and 11 guide rollers that form the form (a) of FIG. 1 are used to feed the paper while forming the cross section of FIG. 2a. These pinch rollers are assembled to the base of the solder wire feeder 5a and are driven by the motor 5b.
In FIG. 8, the pre-finished solder is subjected to a laparoscopic finish in the form of a) in FIG. The finished thread solder has a cross section as shown in FIG. 2b), and is soldered by applying a heat source to the thread solder and 14 pins of the 13 substrates and 15 substrate land portions.

図8では、図1のイ)の形態例の挟み送りされた予備加工糸半田は9の送りガイドをとおり、12の送りガイド先端部で、16のホルダ−Aに取り付けられた図1のイ)の形態例に見合った17の回転刃で仕上げ加工され、フラックスが開腹される。該回転刃は挟み送りする時の送り力による回転で加工を行い、開腹加工された糸半田は図2bの断面を有す。  In FIG. 8, the pre-processed yarn solder that has been nipped and fed in the embodiment of FIG. 1 a) passes through 9 feed guides, and is attached to 16 holders-A at the tip of 12 feed guides. ) Is finished with 17 rotary blades suitable for the form example, and the flux is opened. The rotary blade performs the processing by the rotation by the feeding force at the time of pinching and feeding, and the thread solder subjected to the laparotomy has a cross section of FIG.

図9では、図1のイ)の形態例の挟み送りされた予備加工糸半田は、9の送りガイドをとおり、12の送りガイド先端部で、18のホルダ−Bに取り付けられた図1のイ)の形態例に見合った19の切断刃で仕上げ加工され、フラックスが開腹される。
該切断刃は、挟み送りする時の送り力による押切で加工を行い、開腹加工された糸半田は図2bの断面を有す。
In FIG. 9, the pre-processed yarn solder that has been nipped and fed in the embodiment of FIG. 1 b) passes through 9 feed guides and is attached to 18 holders-B at 12 feed guide tips. Finishing is performed with 19 cutting blades corresponding to the embodiment of (a), and the flux is opened.
The cutting blade performs processing by pressing with a feed force when pinching and feeding, and the thread solder subjected to the laparotomy has a cross section of FIG. 2b.

図10では、図1のイ)の形態例の挟み送りされた予備加工糸半田は9の送りガイドをとおり、12の送りガイド先端部で、20のホルダ−Cに取り付けた21の電線で給電された22のヒータ−で熱せられる23の熱線によって、予備加工におけるフラックス未達部の半田合金が溶かされ、フラックスが開腹される。  In FIG. 10, the pre-processed yarn solder that has been nipped and fed in the embodiment of FIG. 1 b) is fed through 9 feed guides and fed by 21 wires attached to 20 holders-C at the tip of 12 feed guides. By the 23 hot wires heated by the 22 heaters, the solder alloy at the flux unachieved part in the preliminary processing is melted, and the flux is opened.

図11では、図1のイ)の形態例の挟み送りされた予備加工糸半田は9の送りガイドをとおり、12の送りガイド先端部で、24のノズルから噴出される25の熱風によって、予備加工におけるフラックス未達部の半田合金が溶かされ、フラックスが開腹される。  In FIG. 11, the preliminarily processed yarn solder that has been nipped and fed in the embodiment of FIG. 1 b) passes through 9 feed guides, and at the 12 feed guide tips, 25 hot air blown from 24 nozzles is spared. The solder alloy at the flux unachieved part is melted and the flux is opened.

図12では、図1のイ)の形態例の挟み送りされた予備加工糸半田は9の送りガイドをとおり、12の送りガイド先端部で、26の鏡筒、導管から照射される27の光ビ−ム、レ−ザ−によって、予備加工におけるフラックス未達部の半田合金が溶かされ、フラックスが開腹される。  In FIG. 12, the pre-processed yarn solder that has been nipped and fed in the embodiment of FIG. 1) passes through 9 feed guides, and at the tip of 12 feed guides, 27 light beams are emitted from 26 barrels and conduits. By the beam and the laser, the solder alloy at the flux unachieved part in the pre-processing is melted, and the flux is opened.

図13では、図1のイ)の形態例の挟み送りされた予備加工糸半田は、9の送りガイドをとおり、12の送りガイド先端部で、28の極細ファイバーから照射される29のレ−ザ−によって、予備加工におけるフラックス未達部の半田合金が溶かされ、フラックスが開腹される。  In FIG. 13, the pre-processed yarn solder that has been fed and fed in the embodiment shown in FIG. 1) passes through 9 feed guides and is fed from 28 ultrafine fibers at 12 feed guide tips. The solder melts the solder alloy that has not reached the flux in the preliminary processing, and the flux is opened.

図14は、図1のイ)の形態例の挟み送りされた予備加工糸半田は、9の送りガイドをとおり、12の送りガイド先端部で、30の電磁コイルの誘導加熱、高周波加熱によって、予備加工におけるフラックス未達部の半田合金が溶かされ、フラックスが開腹される。  FIG. 14 shows the pre-processed yarn solder that has been nipped and fed in the embodiment of FIG. 1) through the 9 feed guides, 12 feed guide tips, and 30 induction coils by induction heating and high frequency heating. The solder alloy at the flux unachieved part in the pre-processing is melted and the flux is opened.

1 糸半田
2 半田合金
3 フラックス
4 糸半田リ−ル
5a ベース
5b モーター
6 入口ガイド
7 予備加工ローラー
8 ガイドローラー
9 送りガイド
10 図1のイ)形態の予備加工ローラー
11 図1のイ)形態のガイドローラー
12 送りガイド先端部
13 基板
14 ピン
15 基板ランド
16 ホルダ−A
17 回転刃
18 ホルダ−B
19 切断刃
20 ホルダ−C
21 電線
22 ヒ−タ−
23 熱線
24 ノズル
25 熱風
26 鏡筒、導管
27 光ビーム、レーザー
28 極細ファイバ−
29 レーザー
30 電磁コイル
DESCRIPTION OF SYMBOLS 1 Yarn solder 2 Solder alloy 3 Flux 4 Yarn solder reel 5a Base 5b Motor 6 Entrance guide 7 Preliminary processing roller 8 Guide roller 9 Feeding guide 10 Preliminary processing roller 11 of the form of FIG. Guide roller 12 Feed guide tip 13 Substrate 14 Pin 15 Substrate land 16 Holder-A
17 Rotating blade 18 Holder B
19 Cutting blade 20 Holder-C
21 Electric wire 22 Heater
23 Hot wire 24 Nozzle 25 Hot air 26 Lens tube, conduit 27 Light beam, laser 28 Extra fine fiber
29 Laser 30 Electromagnetic coil

Claims (2)

フラックス入り糸半田の半田飛散防止を目的とした送り装置にあって、該糸半田の線上に沿ってフラックス開腹に到達しないように、厚さ0.01mmから0.3mmの半田合金薄膜生成加工をする挟み送りローラーで挟み送りをするか、あるいは予め該加工された糸半田を挟み送りローラーで再加工する、もしくは挟み送りをするかして、半田ガイドを通して送り出された該加工糸半田を、半田ガイド出口部分で開腹する装置。  In a feeding device for the purpose of preventing solder scattering of flux-cored yarn solder, a solder alloy thin film generation process having a thickness of 0.01 mm to 0.3 mm is performed so as not to reach the flux opening along the yarn solder line. The processed yarn solder sent out through the solder guide by either pinching with the pinch feeding roller, or reprocessing the pinned solder with the pinching roller, or pinching feed, A device that opens at the guide exit. 請求項1の開腹による半田付け。  Soldering by laparotomy according to claim 1.
JP2015141659A 2015-06-29 2015-06-29 Thread solder tip opening in thread solder feeding device Pending JP2017013116A (en)

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