JP2017008297A - 硬化性樹脂組成物、光学素子および光半導体装置 - Google Patents

硬化性樹脂組成物、光学素子および光半導体装置 Download PDF

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Publication number
JP2017008297A
JP2017008297A JP2016092360A JP2016092360A JP2017008297A JP 2017008297 A JP2017008297 A JP 2017008297A JP 2016092360 A JP2016092360 A JP 2016092360A JP 2016092360 A JP2016092360 A JP 2016092360A JP 2017008297 A JP2017008297 A JP 2017008297A
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JP
Japan
Prior art keywords
resin composition
curable resin
general formula
group
represented
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016092360A
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English (en)
Japanese (ja)
Inventor
信一 小川
Shinichi Ogawa
信一 小川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hoya Candeo Optronics Corp
Original Assignee
Hoya Candeo Optronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoya Candeo Optronics Corp filed Critical Hoya Candeo Optronics Corp
Priority to KR1020160066386A priority Critical patent/KR20160148449A/ko
Priority to TW105117913A priority patent/TW201700547A/zh
Priority to CN201610411111.0A priority patent/CN106256854A/zh
Priority to US15/183,247 priority patent/US9741911B2/en
Priority to DE102016110945.2A priority patent/DE102016110945A1/de
Publication of JP2017008297A publication Critical patent/JP2017008297A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Led Device Packages (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
JP2016092360A 2015-06-16 2016-05-02 硬化性樹脂組成物、光学素子および光半導体装置 Pending JP2017008297A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020160066386A KR20160148449A (ko) 2015-06-16 2016-05-30 경화성 수지 조성물, 광학 소자 및 광반도체 장치
TW105117913A TW201700547A (zh) 2015-06-16 2016-06-07 固化性樹脂組成物，光學元件和光半導體裝置
CN201610411111.0A CN106256854A (zh) 2015-06-16 2016-06-13 固化性树脂组合物、光学元件及光半导体装置
US15/183,247 US9741911B2 (en) 2015-06-16 2016-06-15 Curable resin composition, optical element and optical semiconductor device
DE102016110945.2A DE102016110945A1 (de) 2015-06-16 2016-06-15 Härtbare Harzzusammensetzung, optisches Bauelement, und optische Halbleitervorrichtung

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015121293 2015-06-16
JP2015121293 2015-06-16

Publications (1)

Publication Number Publication Date
JP2017008297A true JP2017008297A (ja) 2017-01-12

Family

ID=57763171

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016092360A Pending JP2017008297A (ja) 2015-06-16 2016-05-02 硬化性樹脂組成物、光学素子および光半導体装置

Country Status (2)

Country Link
JP (1) JP2017008297A (zh)
TW (1) TW201700547A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150145201A (ko) * 2014-06-17 2015-12-29 서울대학교산학협력단 알츠하이머 질환 모델용 형질전환 돼지 및 이의 용도

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009239242A (ja) * 2007-06-22 2009-10-15 Mitsubishi Chemicals Corp 半導体発光デバイス用部材形成液、半導体発光デバイス用部材、航空宇宙産業用部材、半導体発光デバイス、及び蛍光体組成物
JP2011202154A (ja) * 2010-03-01 2011-10-13 Yokohama Rubber Co Ltd:The 加熱硬化性光半導体封止用シリコーン樹脂組成物およびこれを用いる光半導体封止体
JP2014043572A (ja) * 2012-08-01 2014-03-13 Sumitomo Chemical Co Ltd シリコーン樹脂組成物
JP2016186063A (ja) * 2015-03-27 2016-10-27 Ｈｏｙａ Ｃａｎｄｅｏ Ｏｐｔｒｏｎｉｃｓ株式会社 硬化性樹脂組成物、および光半導体装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009239242A (ja) * 2007-06-22 2009-10-15 Mitsubishi Chemicals Corp 半導体発光デバイス用部材形成液、半導体発光デバイス用部材、航空宇宙産業用部材、半導体発光デバイス、及び蛍光体組成物
JP2011202154A (ja) * 2010-03-01 2011-10-13 Yokohama Rubber Co Ltd:The 加熱硬化性光半導体封止用シリコーン樹脂組成物およびこれを用いる光半導体封止体
JP2014043572A (ja) * 2012-08-01 2014-03-13 Sumitomo Chemical Co Ltd シリコーン樹脂組成物
JP2016186063A (ja) * 2015-03-27 2016-10-27 Ｈｏｙａ Ｃａｎｄｅｏ Ｏｐｔｒｏｎｉｃｓ株式会社 硬化性樹脂組成物、および光半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150145201A (ko) * 2014-06-17 2015-12-29 서울대학교산학협력단 알츠하이머 질환 모델용 형질전환 돼지 및 이의 용도

Also Published As

Publication number Publication date
TW201700547A (zh) 2017-01-01

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