JP2017004704A - Connector assembly - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a connector assembly comprising a pair of film-shaped low profile connectors and preventing breakage of contacts due to misalignment upon mating.SOLUTION: A first connector 10A has a guide protrusion 12 and a pin-like contact 13 formed on a polyimide film 101. The guide protrusion 12 and the pin-like contact 13 have substantially the same height. A second connector 20A has a polyimide film 201 as a base material, a guide hole 22, and a contact portion 23. By fitting the guide protrusion 12 into the guide hole 22, the first connector 10A and the second connector 20A are positioned. The contact portion 23 has a shape in which the periphery of the hole is bent in a direction away from the first connector 10A. Therefore, after the guide protrusion 12 starts fitting into the guide hole 22 and positioning is performed, the pin-shaped contact 13 comes into contact with the contact portion 23. Therefore, fitting without misalignment is avoided, and breakage of the contact is prevented.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a connector assembly including a pin-shaped contact and a pair of connectors in which contact portions that are electrically connected to the pin-shaped contact are formed on respective insulating films.

  In recent years, in various fields, there is a demand for miniaturization, low profile, and multiple pins of connectors that are responsible for electrical connection. As one connector satisfying these requirements, a connector based on a flexible circuit board and having electrical contacts formed using lithography and plating techniques has been proposed (Patent Document 1).

  Moreover, the proposal which raises the retention strength between the connectors after a fitting is made | formed, making use of this technique (patent document 2). Patent Document 2 proposes a film connector. A connection pin and a columnar projection are provided on one surface of one flexible circuit board in the film connector. The other flexible circuit board is provided with a pad portion, and an engaging member in which a ring hole corresponding to the columnar protrusion is formed is fixedly arranged.

Japanese Patent No. 4059522 JP 2009-277534 A

  The technology proposed in the above-mentioned Patent Document 1 is suitable for the above-described demands for miniaturization, low profile, and multiple pins related to connectors. However, as the size and the number of pins increase, it becomes difficult to align the pair of connectors that are fitted to each other. In addition, the individual electrical contacts are extremely small, and the electrical contacts cannot be connected well unless they are precisely aligned. In addition, the individual electrical contacts are very small and are vulnerable to mechanical forces. For this reason, there is a possibility that the electrical contact is easily broken if it is attempted to be fitted with a slight displacement.

  The structure proposed in the above-mentioned Patent Document 2 increases the holding force between the connectors after the pair of connectors are correctly fitted. In other words, the structure of Patent Document 2 does not correct the misalignment at the time of fitting, and therefore does not reduce the possibility of breakage of the electrical contacts at the time of fitting.

  An object of this invention is to provide the connector assembly which reduced the possibility of the failure | damage of the electrical contact at the time of a fitting.

The connector assembly of the present invention that achieves the above-described object provides:
A first connector having a first insulating film, a guide protrusion and a pin-like contact standing on the first insulating film at substantially the same height;
A second insulating film, a guide hole that is formed in the second insulating film and that has a guide projection for positioning the first connector when fitted with the first connector, and a pin-shaped contact that is fitted with the first connector; A second connector having a contact portion that conducts,
The contact portion extends in a planar shape on the second insulating film, and a hole is formed with the second insulating film, and the periphery of the hole is bent in a direction away from the first connector at the time of fitting. At the time of fitting with one connector, after the guide projection starts to be fitted into the guide hole, the contact portion starts contact with the pin-shaped contact.

  The guide protrusions are positioned in the connectors by fitting into the guide holes of the second connector. A hole is formed in the connecting portion that is electrically connected to the pin-shaped contact, and the periphery of the hole is bent in a direction away from the first connector. For this reason, after a guide protrusion starts fitting to a guide hole, a pin-shaped contact and a contact part start a contact. In other words, after positioning by the guide protrusion and the guide hole, the pin-shaped contact and the contact portion come into contact with each other. Thereby, damage to the pin-shaped contact or the contact portion during fitting is prevented.

  The “hole” of the guide hole includes not only an opening independent from the outer periphery of the second insulating film but also a notch that opens to the outer periphery and continues to the outer periphery.

  Here, in the connector assembly of the present invention, the second connector protrudes in a position adjacent to the guide hole in a direction approaching the first connector at the time of fitting, and guides the guide protrusion at the time of fitting with the first connector. It is preferable to have a guide step for guiding the hole.

  Providing this guide step makes it easy to align the guide projection and the guide hole before fitting.

  In the connector assembly of the present invention, it is also preferable that the second insulating film has a spring portion that protrudes toward the center of the guide hole and pushes the guide protrusion that is inserted into the guide hole toward the center of the guide hole. It is.

  In order to fit the guide protrusion into the guide hole, the dimension of the guide hole needs to be slightly larger than the dimension of the guide protrusion. By doing so, the guide protrusion can be fitted into the guide hole even if the dimensions thereof vary within a tolerance range. However, the fact that the size of the guide hole is larger than that of the guide projection means that play occurs after insertion. Therefore, by providing the above-described spring portion in the second insulating film, this play is absorbed, and the first connector and the second connector are positioned with higher accuracy.

  That is, the pin-shaped contact and the contact portion are prevented from being damaged with higher reliability.

  According to the present invention described above, a connector assembly is realized in which the risk of breakage of the pin-shaped contact and the contact portion, that is, the electrical contact at the time of fitting is reduced.

The 1st connector which comprises the connector assembly as 1st Embodiment of this invention is shown, (A) A perspective view, (B) Top view. It is the figure which showed the outline | summary of the manufacturing process of the 1st connector shown in FIG. The 2nd connector which comprises the connector assembly as 1st Embodiment of this invention is shown, (A) Perspective view, (B) Top view. It is the figure which showed the outline | summary of the manufacturing process of the 2nd connector shown in FIG. It is sectional drawing which faced and showed the 1st connector and the 2nd connector in the attitude | position at the time of a fitting. The 1st connector which comprises the connector assembly as 2nd Embodiment of this invention is shown, (A) A perspective view, (B) Top view. The 2nd connector which comprises the connector assembly as 2nd Embodiment of this invention is shown, (A) Perspective view, (B) Top view. FIG. 8 is a cross-sectional view taken along arrows XX shown in FIGS. 6 and 7 (FIG. 8A), and a side view seen in the direction of arrow Y (FIG. 8B). The 2nd connector which comprises the connector assembly as 3rd Embodiment of this invention is shown, (A) A perspective view, (B) A top view. FIG. 10 is an enlarged view of one guide hole in the second connector shown in FIG. 9 (A) perspective view and (B) plan view. It is sectional drawing which showed the 1st connector and 2nd connector in 3rd Embodiment according to the attitude | position at the time of a fitting.

  Embodiments of the present invention will be described below.

  FIG. 1 is a view showing a first connector constituting a connector assembly as a first embodiment of the present invention. Here, FIGS. 1A and 1B are a perspective view and a plan view, respectively. In FIG. 1, the fitting surface combined with a second connector 20 </ b> A (see FIG. 3) described later is shown upward.

  A first connector 10A shown in FIG. 1 includes a first insulating film 11, and guide protrusions 12 and pin-shaped contacts 13 that are erected on the first insulating film 11.

  The first insulating film 11 is a rectangular, flexible insulating film spreading in a flat plate shape, and here a polyimide film is employed. Further, in this first embodiment, a total of four guide protrusions 12 are formed, one at each of the four corners of the rectangular first insulating film 11. A number of pin-like contacts 13 are two-dimensionally arranged on the inner side of the guide projection 12 of the first insulating film 11. Here, the guide protrusion 12 and the pin-shaped contact 13 are formed at the same time and have the same height due to manufacturing restrictions described below. If the guide protrusion and the pin-shaped contact are simultaneously formed on the first insulating film by using lithography and plating techniques, they have the same height.

  FIG. 2 is a diagram showing an outline of a manufacturing process of the first connector shown in FIG.

  FIG. 2A shows a substrate 100 that is a material of the first insulating film 11. The substrate 100 has a three-layer structure in which a polyimide film 101 is sandwiched between two thin copper plates 102. The substrate 100 is the same as that for manufacturing a flexible circuit board.

  Here, the substrate 100 of FIG. 2A is prepared. Then, the substrate 100 is subjected to laminating, exposure, development, etching and plating of dry film by photolithography and plating techniques to obtain the shape shown in FIG. The left region D1 is a region where the guide protrusion 12 shown in FIG. 1 is formed. The right region D2 is a region where the pin-shaped contact 13 shown in FIG. 1 is formed. Here, the manufacturing process of each of the guide protrusion 12 and the pin-like contact 13 is shown.

  In FIG. 2B, the polyimide film 101 remains as it is in the region D1 where the guide protrusion 12 is formed. On the other hand, in the region D2 where the pin-shaped contact 13 is formed, the polyimide film 101 is also removed by etching, and a hole 1011 is formed in the polyimide film 101. And the hole 1011 formed in the polyimide film 101 is filled with copper plating, and the copper of both front and back surfaces is connected to one. Note that, similarly to the region D2, a hole may be formed in the region D1.

  FIG. 2C shows a state in which copper plating is grown by further mask processing and plating processing after the production up to the stage shown in FIG. 2B.

  Here, as in FIG. 1, also in FIG. 2, the mating surface with the mating connector (second connector 20A shown in FIG. 3) is shown as the top surface.

  At the stage from FIG. 2B to FIG. 2C, the guide protrusion 12 and the pin-like contact 13 are formed simultaneously. That is, the guide protrusion 12 and the pin-like contact 13 have the same height.

  Here, copper plating is also grown on the lower surface side of the polyimide film 101. Thus, a soldering portion 13a for soldering the pin-shaped contact 13 to the circuit board 30A (see FIG. 5) is formed on the lower surface side of the pin-shaped contact 13. A fixing portion 19 is formed on the lower surface side of the guide protrusion 12 by soldering and fixing to the circuit board 30A (see FIG. 5). The fixing portion 19 has the same height as the soldering portion 13 a of the pin-shaped contact 13. The fixing portion 19 sandwiches the polyimide film 101 between the guide protrusion 12 and is not electrically connected to the guide protrusion 12. However, the fixing portion 19 may be fabricated so as to be electrically connected to the guide protrusion 12.

  The polyimide film 101 is thin and rich in flexibility, and as it is, handling as a connector is inconvenient. Therefore, next, as shown in FIG. 2D, the support plate 104 is attached to the lower surface of the polyimide film 101 with an adhesive 107. The support plate 104 is formed by punching a stainless plate 105 and further coated with an insulating agent 106, thereby avoiding an inadvertent short circuit by the insulating coating. The thickness of the support plate 104 is such that the fixing portion 19 and the soldered portion 13 a of the pin-like contact 13 slightly protrude from the hole of the support plate 104. Here, the stainless steel plate 105 is used as the support plate 104 with an insulation coating. However, the first connector 10A only needs to have an appropriate strength, and is not limited to the stainless steel plate 105. Instead of the stainless steel plate 105, a plate made of another metal with an insulating coating, a resin plate, or the like may be used. Alternatively, instead of attaching the support plate 104, a first insulating film having a material and thickness adjusted to have an appropriate strength may be employed instead of the polyimide film 101 employed here.

  The guide protrusion 12 and the pin-shaped contact 13 of the first contact 10A shown in FIG. 1 are manufactured through the above manufacturing process and are formed at the same height.

  FIG. 3 is a perspective view showing a second connector constituting the connector assembly as the first embodiment of the present invention. Here, FIGS. 3A and 3B are a perspective view and a plan view, respectively. The second connector 20A shown in FIG. 3 is a connector that fits with the first connector 10A shown in FIG. 1, and the fitting surface is shown as an upper surface.

  The second connector 20 </ b> A shown in FIG. 3 includes a second insulating film 21, a guide hole 22, and a contact portion 23.

  Similar to the first insulating film 11 shown in FIG. 1, the second insulating film 21 is a rectangular, flexible insulating film spreading in a flat plate shape. The second insulating film 21 is also a polyimide film here.

  Further, a total of four guide holes 22 are formed, one at each of the four corners of the rectangular second insulating film 21, corresponding to the guide protrusion 12 shown in FIG. The guide protrusion 12 is inserted into the guide hole 22 when the first connector 10A is fitted. By this insertion, the first connector 10A is positioned with respect to the second connector 20A.

  Further, a large number of contact portions 23 are two-dimensionally arranged in correspondence with the arrangement of the pin-like contacts 13 inside the guide holes 22 of the second insulating film 21. The contact portion 23 is a contact that is electrically connected to the pin-like contact 13 by fitting with the first connector 10A and is responsible for signal transmission.

  Although the contact portion 23 will be described in detail with reference to FIGS. 4 and 5, the contact portion 23 is formed of a thin copper plate spreading in a planar shape on the second insulating film 21. And the hole H (refer FIG. 4) is formed in the copper plate with the 2nd insulating film 21, and the periphery of the hole H becomes the shape bent in the direction away from the 1st connector 10A at the time of fitting. Yes. Since the contact portion 23 has this shape, the guide protrusion 12 first starts to be fitted into the guide hole 22 when the contact portion 23 is fitted to the first connector 10A. By this fitting, the first connector 10A is positioned with respect to the second connector 20A. Then, after the guide protrusion 12 starts to be inserted into the guide hole 22, that is, after being positioned, the contact of the pin-shaped contact 13 with the contact portion 23 is started.

  If the pin-shaped contact 13 comes into contact with the contact portion 23 with a positional deviation, the peripheral portion of the hole H of the contact portion 23 may be deformed or the pin-shaped contact 13 may be bent. If it becomes so, contact failure will arise easily and the reliability of contact will fall.

  In the present embodiment, the guide protrusion 12 starts to be inserted into the guide hole 22 and is positioned, and the pin-shaped contact 13 starts to contact the contact portion 23 later than that. Thus, this embodiment has a structure in which contact reliability is highly maintained.

  FIG. 4 is a diagram showing an outline of a manufacturing process of the second connector shown in FIG.

  FIG. 4A shows a substrate 200 that is a material of the second insulating film 21. The substrate 200 has the same structure as the substrate 100 shown in FIG. That is, the substrate 200 has a three-layer structure in which a polyimide film 201 is sandwiched between two thin copper plates 202. The substrate 200 is the same type of substrate as the substrate 100 and is used for manufacturing a flexible substrate.

  A lithography technique and a plating technique are applied to the substrate 200 in FIG. 4A to process into the shape in FIG.

  In FIG. 4, as in the case of FIG. 2, the manufacturing process for each of the guide hole 22 and the guide portion 23 is shown. Further, in FIG. 4, as in FIG. 2, a fitting surface with the first connector 10A is formed on the upper surface side of FIG.

  At the stage of FIG. 4B, the guide hole 22 has already been formed in the region D1. Further, a region D2 shown in FIG. 4B is a region where the contact portion 23 shown in FIG. 3 is formed. At the stage shown in FIG. 4B, the copper plate 202 in the region D2 is separated from the surroundings and formed in an island shape. Further, a hole H penetrating the copper plate 202 and the polyimide film 201 is formed in the region D2.

  Further, in this region D2, there is a partial region D3 in which the copper plate 202 is connected to the back surface of the polyimide film 201 through the hole 2011 of the polyimide film 201. In the partial region D3, a soldering portion 23a (see FIGS. 4C to 4E) for soldering the contact portion 23 to the circuit board 40 (see FIG. 5) is formed.

  FIG. 4C shows a stage where the soldering portion 23a is further formed from the stage shown in FIG. 4B.

Further, after that, a jig (not shown) is inserted into the hole H from above, and the hole H is expanded to the shape shown in FIG. Further, when the hole H is expanded, the peripheral edge of the hole H is plastically deformed into a shape bent downward. That is, the peripheral edge of the hole H has a shape bent in a direction away from the first connector 10A when fitted to the first connector 10A.
Similarly to the first connector 10A, the second connector 20A is too flexible and inconvenient to handle as a connector at the stage of FIG. 4D. Therefore, as in the case of the first connector 10A, the support plate 204 is adhered to the lower surface of the polyimide film 201 with an adhesive 207 as shown in FIG. The support plate 204 is obtained by drilling a stainless plate 205 and further coating with an insulating agent 206. The coating with the insulating agent 206 prevents an inadvertent short circuit. The thickness of the support plate 204 is a thickness at which the soldered portion 23 a of the contact portion 23 slightly protrudes from the hole of the support plate 204.

  In this case, as in the case of the first connector 10A, instead of the insulating coated stainless steel plate, a plate made of another kind of metal coated with an insulating coating, a resin plate, or the like may be used. Or it may replace with sticking of a support plate and may employ | adopt the 2nd insulating film with moderate intensity | strength.

  FIG. 5 is a cross-sectional view showing the first connector and the second connector facing each other in the posture at the time of fitting.

  The first connector 10A and the second connector 20A are mounted on the circuit boards 30A and 40A, respectively. Also in this FIG. 5, about the 1st connector 10A, the guide protrusion 12 and the pin-shaped contact 13 are shown one each. Further, the guide hole 22 and the contact portion 23 are shown one by one for the second connector 20A. The first connector 10A and the second connector 20A face each other in the direction shown in FIG.

  As shown in FIG. 5, the peripheral edge of the hole H of the contact portion 23 is bent in a direction away from the first connector 10A. For this reason, the distance L <b> 2 until the pin-shaped contact 13 starts to contact the contact portion 23 is longer than the distance L <b> 1 until the guide protrusion 12 starts to fit into the guide hole 22. Therefore, when the first connector 10 </ b> A and the second connector 20 </ b> A are fitted, the guide protrusion 12 starts to be inserted into the guide hole 22, and thereafter, the pin-shaped contact 13 starts to contact the contact portion 23. That is, positioning between the first connector 10 </ b> A and the second connector 20 </ b> A is performed first, and then the pin-shaped contact 13 starts to contact the contact portion 23. Accordingly, it is possible to suppress the occurrence of a problem that the peripheral edge of the hole H of the contact portion 23 is forcibly pushed and deformed by the pin-shaped contact 13 or the pin-shaped contact 13 is bent.

  After contacting the contact portion 23, the pin-shaped contact 13 expands the hole H by elastically deforming the peripheral edge of the hole H of the contact portion 23 and enters the hole H. As a result, the pin-shaped contact 13 and the contact portion 23 are brought into contact with each other with a predetermined regular contact pressure and are electrically conducted.

  Above, description about 1st Embodiment is complete | finished, and embodiment after 2nd Embodiment is described next.

  FIG. 6 is a view showing a first connector constituting a connector assembly as a second embodiment of the present invention. Here, FIGS. 6A and 6B are a perspective view and a plan view, respectively. Similar to FIG. 1, the upper surface is the fitting surface. In the first connector 10B shown in FIG. 6, the elements corresponding to the elements of the first connector 10A shown in FIG.

  The first connector 10B shown in FIG. 6 is different from the first connector 10A shown in FIG. The guide protrusions 12 of the first connector 10B shown in FIG. 6 are formed as ridges extending along the left and right sides, one on each side of the first insulating film 11. The height of the guide protrusion 12 is the same as the height of the pin-like contact 13 as in the case of the first connector A shown in FIG. Further, a notch 11 a is formed in a portion adjacent to the guide projection 12 of the first insulating film 11.

  The other elements of the first connector 10B shown in FIG. 6 are the same as the corresponding elements of the first connector 10A shown in FIG. 1, and a description thereof is omitted here.

  FIG. 7 is a view showing a second connector constituting a connector assembly as a second embodiment of the present invention. Here, FIGS. 7A and 7B are a perspective view and a plan view, respectively. Similar to FIG. 3, the upper surface is the fitting surface. The second connector 20B shown in FIG. 7 is fitted with the first connector 10B shown in FIG.

  As in the case of the first connector 10B shown in FIG. 6, the elements of the second connector 20B shown in FIG. 7 are denoted by the same reference numerals as the corresponding elements of the second connector 20A shown in FIG.

  In the second connector 20B shown in FIG. 7, long guide holes 22 are formed on the left and right sides of the second insulating film 21 corresponding to the guide protrusions 12 shown in FIG. The second connector 20 </ b> B is formed with a guide step portion 21 a swelled on the upper surface so as to be along the left and right sides of the second insulating film 21, adjacent to the left and right guide holes 22.

8 is a cross-sectional view (FIG. 8A) taken along arrows XX shown in FIGS. 6 and 7, respectively, and a side view seen in the direction of arrow Y (FIG. 8B).
FIGS. 8A and 8B show the first connector 10 </ b> B and the second connector 20 </ b> B in a fitting posture facing each other. Here, the first connector 10B and the second connector 20B are mounted on the circuit boards 30B and 40B. Further, here, as in the case of FIG. 5, for the first connector 10 </ b> B, one guide protrusion 12 and one pin-like contact 13 are shown. Moreover, the guide hole 22 and the contact part 23 are each shown about the 2nd connector 20B. The first connector 10B and the second connector 20B face each other in the direction shown in FIG.

The second connector 20B is formed with a guide step portion 21a protruding toward the first connector 10B. The guide step portion 21a is formed by mechanically applying a force from the lower surface side of the second connector 20B to cause plastic deformation.
The reason why the first connector 10B is provided with the notch 11a is to avoid interference with the guide step portion 21a during fitting.
The guide step portion 21a formed on the second connector 20B serves to guide the guide protrusion 12 to the guide hole 22 by fitting the side surface of the guide protrusion 12 along the guide step portion 21a when fitted to the first connector 10B. Is responsible. In the second embodiment, by providing the guide step portion 21a, it is easy to align the guide protrusion 12 and the guide hole 22 before fitting.
Other features of the second embodiment are the same as those of the first embodiment described above, and redundant description is omitted.

  FIG. 9 is a view showing a second connector constituting the connector assembly as the third embodiment of the present invention. The first connector constituting the connector assembly of the third embodiment is the same as the first connector 10A in the first embodiment shown in FIG. 1, and repeated illustration and description here will be omitted.

  In FIG. 9, FIGS. 9A and 9B are a perspective view and a plan view, respectively. Moreover, the upper surface is a fitting surface similarly to FIG. 3, FIG. Similarly to the case of the second connector 20B shown in FIG. 7, the elements of the second connector 20C shown in FIG. 9 are assigned the same reference numerals as the corresponding elements of the second connector 20A shown in FIG. And show.

A difference between the second connector 20C shown in FIG. 9 and the second connector 20A shown in FIG. The other elements of the second connector 20C shown in FIG. 9 other than the guide hole 22 are the same as those of the second connector 20A shown in FIG. 3, and a duplicate description thereof is omitted here.
10 is an enlarged perspective view (FIG. 10A) and a plan view (FIG. 10B) showing one guide hole in the second connector shown in FIG.

  Moreover, FIG. 11 is sectional drawing which showed the 1st connector and 2nd connector in 3rd Embodiment according to the attitude | position at the time of a fitting. The first connector 10C and the second connector 20C are mounted on the circuit boards 30C and 40C, respectively. As described above, the first connector 10C in the third embodiment has the same structure as the first connector 10A (see FIGS. 1 and 5) in the first embodiment.

As shown in FIGS. 10 and 11, a spring portion 22 a protruding from the peripheral edge of the guide hole 22 toward the center is formed in the guide hole 22. As shown in FIG. 11, the spring portion 22 a is formed by a part of a polyimide film 201 that is the second insulating film 21.
An interval D between the spring portions 22a protruding to positions facing each other is substantially the same as the diameter of the pin-shaped contact 12. These spring portions 22 a function to push the guide protrusion 12 fitted in the guide hole 22 toward the center of the guide hole 22.

  The guide protrusion 12 is inserted into the guide hole 22. For this reason, the dimension of the guide hole 22 is formed larger than the dimension of the guide protrusion 12. Therefore, the guide protrusion 12 fitted in the guide hole 21 has play in the guide hole 21. In this embodiment, the play is absorbed by providing the spring portion 22a, and the first connector 10C and the second connector 20C are aligned with higher accuracy.

Other features of the third embodiment are the same as those of the first and second embodiments described above, and a duplicate description thereof is omitted.
According to the first to third embodiments described above, the risk of damage to the pin-like contact 13 and the contact portion 23 is reduced, and a highly reliable connector assembly that achieves downsizing, low profile, and multiple pins. Is realized.

  In addition, this invention is not limited to the above-mentioned embodiment, A various deformation | transformation is possible. For example, the pin-shaped contact 13 may be a square pin shape, and the guide protrusion 12 of the first embodiment may be a square pin shape.

  Moreover, although the guide protrusion 12 and the guide hole 22 in the first embodiment are provided one by one at the four corners, a plurality of guide protrusions 12 and guide holes 22 may be provided at each corner. You may combine with a guide hole and a guide step part.

  Further, the guide protrusion 12 and the pin-like contact may not be completely the same height.

  The first and second insulating films may be made of not only polyimide but also other resin such as liquid crystal polymer (LCP).

  Furthermore, the guide hole 22 is a hole that is independent from the side that forms the outer periphery of the insulating film. Good. When the guide hole is notched, there is an advantage that the first connector and the second connector can be easily released.

10A, 10B, 10C 1st connector 11 1st insulation film 11a Notch 12 Guide protrusion 13 Pin-like contact 13a Soldering part 19 Fixing part 20A, 20B, 20C 2nd connector 21 2nd insulation film 21a Guide step part 22 Guide hole 22a Spring portion 23 Contact portion 30A, 30B, 30C, 40A, 40B, 40C Circuit board 100, 200 Substrate 101, 201 Polyimide film 102, 202 Copper plate 104, 204 Support plate 105, 205 Stainless plate 106, 206 Insulating agent 107, 207 adhesive

Claims (3)

A first connector having a first insulating film, and a guide protrusion and a pin-like contact standing on the first insulating film at substantially the same height;
Fitting of the first connector with the first insulating film, a guide hole that is formed in the second insulating film and that positions the first connector by fitting the guide protrusion when the first connector is fitted. A second connector having a contact portion electrically connected to the pin-like contact,
The contact portion extends in a planar shape on the second insulating film, and a hole is formed with the second insulating film, and a peripheral edge of the hole is bent in a direction away from the first connector when fitted. Thus, the connector assembly is characterized in that the contact portion starts contact with the pin-shaped contact after the guide projection starts to be fitted into the guide hole during fitting with the first connector. Solid.   A guide step portion for projecting the guide projection into the guide hole when the second connector protrudes toward the first connector at the time of fitting at a position adjacent to the guide hole and is fitted with the first connector. The connector assembly according to claim 1, further comprising:   The said 2nd insulating film has a spring part which protrudes toward the center of the said guide hole, and pushes the said guide protrusion inserted in this guide hole toward the center of this guide hole, The said 1 or 2 characterized by the above-mentioned. A connector assembly according to claim 1.

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