JPH08102348A - Connector for substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a substrate connector having a small number of part items, a low back height, and a high flatness of a solder connecting part. SOLUTION: A substrate connector 1 has first and second connectors 10 and 50 fitted each other, and also mounted on the surfaces of substrates 2 and 4 respectively. The first connector 19 has two beam parts 16, arranged with a recess 14 nipped, and the beam parts 16 are wound by FPCs 40 at the own periphery together with elastic members 30, and also are fixed by adhesive. The substrates 2 and 4 are connected with each other by the contact of exposed contact patterns 44 of the FPCs 40 with a conductive pattern 64 in the connector 50 outer periphery. The conductive pattern 64 of the connector 50 can be the conductive pattern of an FPC 60, and can be a plated layer directly formed on the surface of a housing 52.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrical connector, and more particularly to a board connector for interconnecting lands of a pair of boards each having a plurality of lands formed therein.

[0002]

2. Description of the Related Art With the miniaturization of electronic devices, the packaging density of electronic circuits has increased dramatically in recent years. In order to increase the packing density of electronic circuits, various board connectors for interconnecting a pair of boards have been proposed and put into practical use.

Such a board connector is generally composed of a contact formed by processing a metal material and an insulating housing for fixing the contact.
However, in order to obtain a high mounting density, there is a limit in a connector having a contact formed of a metal material, and further, a narrow pitch of the contact causes a problem that the strength of the contact itself and a housing for fixing the contact is reduced. is there.

Therefore, F is used as a contact (contact member).
A connector using a conductor pattern of a PC (flexible printed circuit board) has been proposed. For example, the connector disclosed in Japanese Patent Laid-Open No. 3-112082 uses a conductive pattern of an FPC as a contact member, and a receptacle connector of a pair of connectors has a coil spring arranged on the back surface of the FPC. . A predetermined contact pressure is applied between the FPCs of the pair of connectors by the restoring force of the coil spring.

The connector disclosed in Japanese Patent Laid-Open No. 4-87172 also uses a conductive pattern of FPC as a contact member. The difference from the connector disclosed in JP-A-3-12082 is that an elastic member such as rubber is used instead of the coil spring.

The connectors disclosed in the above two publications are both F-type.
Since PC is used as the contact member, the arrangement pitch of the contacts can be significantly reduced and the contact reliability is high.

[0007]

However, in both of the above-mentioned connectors, each of the plug connector and the receptacle connector constituting a pair of connectors is constructed by assembling a plurality of housing parts. Therefore, there are problems that the number of parts is increased, the manufacturing is complicated and the cost is high, and the connector is bulky due to the combination of the parts, and there is a limitation in reducing the height.

Further, since one end of the FPC is insert-molded and the middle portion of the FPC is sandwiched by a plurality of housing parts, when applied to a smaller connector, not only the insert-molding itself becomes difficult, but also the FPC Insufficient retention tends to occur.

Furthermore, since the other end of the FPC is a free end that is not supported by the housing, it is not only susceptible to deformation by external force, but also cannot maintain flatness (coplanarity) and is soldered to the conductive pad of the substrate. The connections may be misaligned.

Therefore, an object of the present invention is to provide a board connector which solves the above problems.

[0011]

A board connector according to claim 1 is a board connector for interconnecting the lands of a first board and a second board having a plurality of lands, respectively, in the longitudinal direction of a housing. A pair of beam portions formed so as to sandwich a concave portion formed along the elastic body, an elastic body arranged in the concave portion in parallel with the beam portion, and wound around the elastic body and the outer periphery of the beam portion. A flexible printed circuit board that is adhesively fixed to the beam portion; a conductive pattern of the flexible printed circuit board is connected to the land of the first circuit board; It is characterized by comprising a second connector which is connected to the land and has a contact which comes into contact with the conductive pattern, and which is housed in the recess of the first connector.

The contact of the second connector may be a conductive pattern on a flexible printed circuit board that is adhesively fixed to the outer periphery of the housing of the second connector, or may be formed on the surface of the housing of the second connector. It may be a plating layer.

Further, when the size of the first connector or the second connector is small and the electrical connection portion is close to the soldering portion, a resin layer may be provided for preventing the spread of the molten solder during soldering. .

The board connector according to claim 5 is
In a board connector for interconnecting the lands of the first and second boards, each having a plurality of lands,
A pair of beam portions formed so as to sandwich a recess formed along the longitudinal direction of the housing, and formed on the outer periphery of the beam portions,
A first connector having a contact connected to the land of the first substrate, a housing, an elastic body arranged along a longitudinal direction of the housing, and winding around the elastic body and the outer periphery of the housing. And a second connector having a conductive pattern connected to the land of the second substrate, the second connector being housed in the recess. The conductive pattern on the outer side of the elastic body elastically contacts with the contact.

The contact of the first connector may be a conductive pattern on a flexible printed board that is adhesively fixed to the outer periphery of the beam portion of the first connector, or formed on the surface of the beam portion of the first connector. It may be a plated layer.

Further, when the size of the first connector or the second connector is small and the electrical connection portion is close to the soldering portion, a resin layer may be provided to prevent the spread of the molten solder during soldering. .

[0017]

Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. 1A and 1B show an embodiment of a board connector of the present invention, in which FIG.
(B) It is a disassembled perspective view and (C) is a C arrow line view of (A). FIG. 2 is a diagram showing a cross section taken along line II-II of FIG. 1C together with the substrates to be connected. FIG. 3 is a partially enlarged view of the part III in FIG. Note that, in FIG. 2, the conductive patterns 44 and 64 are omitted for easy understanding of the drawing.

The board connector 1 comprises a first connector 10 and a second connector 50 in which contacts are arranged in two rows.
Consists of The first connector 10 is basically the first
The housing 12, the elastic body 30, and the flexible printed board (hereinafter referred to as F
40). The first housing 12 made of an insulating resin such as liquid crystal polymer has a recess 14 extending therethrough in the longitudinal direction. Elastic members 30 are provided on opposite side surfaces of the elongated beam portions 16, 16 extending in parallel with the concave portion 14 interposed therebetween.
30 is arranged along the beam portions 16, 16. The elastic body 30 is an elastic insulator such as silicone rubber or urethane resin, but may be made of metal such as phosphor bronze, beryllium copper alloy, or shape memory alloy having an appropriate shape such as a coil shape or a cylindrical shape. . The FPC 40 is wound around and fixed to the outer circumferences of the beam portion 16 and the elastic body 30. That is, the FPC 40 includes the upper surface 16a of the beam 16 and the elastic body.
They are arranged along the outer surface of 30, the bottom surface 16c of the beam portion 16 and a part of the outer surface 16d, and are fixed by adhesion. The FPC40 is a beam
The upper surface 16a of 16, the outer surface of the elastic body 30, the bottom surface 16c of the beam portion 16,
The upper surface 16a may be overlapped and fixed by adhesion via the outer side surface 16d. The adhesive is the base film 42 of FPC40.
The sheet-like adhesive "three bond" has good adhesiveness to both the polyimide resin which is the material of the above and the liquid crystal polymer which is the material of the first housing 12 and has heat resistance against high temperature such as reflow temperature. 1650 "(ThreeBond) is preferred. By using the sheet-shaped adhesive, the amount of the adhesive is made uniform, and there is no variation in the bonding location. A large number of conductive patterns 44 are formed on the outer periphery of the base film 42 of the FPC 40 at predetermined intervals of, for example, 0.5 mm, and the conductive patterns 44 form contacts.
Each conductive pattern 44 continuously extends from above the elastic body 30 and below the elastic body 30 and via the bottom surface 16c of the beam portion 16 to the outer surface 16d of the beam portion 16. The conductive pattern 44a on the flat portion at the substantially center of the elastic body 30 constitutes a contact portion with the contact (conductive pattern) 64a on the second connector 50, and the bottom surface 16 of the beam portion 16 is formed.
The conductive pattern 44b on c and a part of the outer surface 16d is the substrate 2
A solder connection portion with the upper land 3 is formed. As an option, slots 20 communicating with the openings 18 may be formed at both longitudinal ends of the first housing 12. The slot 20 accommodates a metal fixing plate 22 by press fitting. Fixed plate
22 is soldered and fixed to a pad (not shown) of the substrate 2 to reduce an external force applied to a solder connection portion between the conductive pattern 44b and the land 3.

The second connector 50 basically comprises a second housing 52 and an FPC 60. Second housing 52
Is made of the same material as the first housing 12 and has a substantially prismatic shape. Chamfers 54 are formed on the four edges on the mating side to facilitate mating with the first connector 10. The FPC 60 is arranged along the outer periphery of the second housing 52, that is, from one side surface 52a to the bottom surface 52b and the other side surface 52c, and is fixed by the adhesive described above. Conductive pattern 64 on FPC60
Are formed at the same pitch as the conductive pattern 44 of the FPC 40, and are separated in approximately the center of the bottom surface 52b and arranged in two rows. Conductive pattern 64a on the side surfaces 52a and 52c of the second housing 52
Constitutes a contact portion with the conductive pattern 44a of the FPC 40, and the conductive pattern 64b on the bottom surface 52b and a part of the side surfaces 52a, 52c.
Form a solder connection portion with the land 5 of the substrate 4.

The manufacturing process of the first connector 10 is as follows. First, the sheet-like adhesive described above is temporarily adhered to the back surface of the FPC 40 by a thermocompression bonding machine or the like. Next, the FPC 40 with an adhesive so as to wrap the elastic body 30 is arranged on the upper surface 16a, the bottom surface 16c and a part of the outer surface 16d of the beam portion 16 of the first housing 12, and again under a pressure of, for example, 4 kg / cm ² . FPC40 and first housing by heating at 160-200 ℃ for 10-30 seconds.
12 is temporarily bonded, and then heated at 150 ° C. for 2 hours to cure the adhesive.

The manufacturing process of the second connector 50 is substantially the same as the above-described process. After the FPC 60 to which the adhesive is temporarily adhered is arranged on the outer periphery of the second housing 52, the adhesive is heat-cured. Even if the FPC40 (60) is placed on the outer circumference of the housing 12 (52) and the FPC40 (60) is fixed to the housing 12 (52) after the adhesive is temporarily adhered to the outer circumference of the housing 12 (52). Good.

After the surface mounting of the first and second connectors 10 and 50 manufactured in the above steps on the substrates 2 and 4, respectively, the second connector 50 is inserted or fitted into the recess 14 of the first connector 10. , The conductive pattern 44 of the first connector 10 and the second
The conductive patterns 64 of the connector 50 are interconnected. As a result, the two rows of lands 3 and 5 formed on the facing surfaces of the two substrates 2 and 4 facing each other have the first and second connectors 1 respectively.
They are electrically interconnected via 0, 50 conductive patterns 44, 64.

Since the conductive patterns 44b and 64b of the first and second connectors 10 and 50 are respectively supported by the flat beam portion 16 and the second housing 52, deformation due to an external force is unlikely to occur and the conductive patterns 44b and 64b are not deformed. Flatness (coplanarity) can be secured. Therefore, good solder fillets 46, 66 are provided between the lands 3, 5 and the conductive patterns 44b, 64b.
Since the solder joint is formed, the solder joint having high strength can be obtained and the visual inspection of the solder joint can be facilitated. Furthermore, since the first and second connectors 10 and 50 have a simple structure in which the FPCs 40 and 60 are adhered to the outer peripheries of the housings 12 and 52, further height reduction is possible and the number of parts is small,
Since there are no complicated steps, it is easy to manufacture. Also, FPC
Since 40 and 60 are held in the housings 12 and 52 by an adhesive, the FPCs 40 and 60 are held securely.

Since the conductive pattern 64 which is the contact of the second connector 50 does not need elasticity, the second connector 50 may have the following structure. That is, the contact of the second connector 50 forms a conductive pattern three-dimensionally on the surface of the second housing 52 by electroless plating or electrolytic plating by the additive method, so-called injection molded circuit component (hereinafter referred to as “Molded Interconnection Device”). It may be formed by using the method “abbreviated as“ MID ”). As a conductive pattern forming method by MID, a one-shot molding method and a two-shot molding method are mainly known. The one-shot molding method is a method in which a plating resist or an etching resist is applied (masked) to the surface of an insulating resin and a conductive pattern is formed by a photolithography process (see JP-A-61-113295, etc.). On the other hand, the two-shot molding method is a method in which two types of materials, that is, a resin that can be plated and a resin that cannot be plated, are double-molded to form a conductive pattern only on the surface of the resin that can be plated (JP-A-63-63). -504
(See No. 82, etc.). Set the conductive pattern of the second connector 50 to M
Since the number of components is further reduced by forming the second connector 50 by plating with the ID, the second connector 50 can be easily manufactured and the manufacturing cost can be reduced.

FIG. 4 is a sectional view showing a fitted state of another embodiment of the present invention. FIG. 5: is sectional drawing which shows the fitting state of further another embodiment of this invention. The same members as those of the first embodiment are designated by the same reference numerals, and the conductive patterns are omitted for easy understanding of the drawings.

The first connector 10 'shown in FIGS. 4 and 5.
10 ″ differs from the first connector 10 shown in FIGS. 1 and 2 in that the FPC 40 ′, 40 ″ does not collectively surround the beam portion 16 and the elastic body 30 of the first housing 12. , Elastic body 30
The FPCs 40 ′ and 40 ″ wound around substantially the entire circumference are bonded to each other so that one end thereof is longer than the other end, arranged along the surface of the beam portion 16, and fixedly bonded to the beam portion 16. . FPC40 '
, 40 ″ are first wound around the elastic body 30 and adhered, and then adhered to the beam portion 16, so that the manufacture is facilitated and the automation of the manufacture is facilitated.

In the case of the embodiment of FIG. 4, the upper surface 16 of the beam portion 16 is
a, the outer surface 16d and a part of the bottom surface 16c to the FPC 40 '
Is a structure that is fixed by adhesion. The inner surface 16b does not necessarily have to be fixed by adhesion. Therefore, although the electric path from the contact portion 44a 'with the conductive pattern of the second connector 50 to the solder connection portion 44b' becomes relatively long, the FPC 40 'does not have the beam portion 16.
Since it is adhesively fixed to the upper surface 16a of the FPC 40 ', the elastic body 30 and the FPC 40' are hardly moved downward when the second connector 50 is inserted. Therefore, since the contact length between the conductive patterns of the first connector 10 'and the second connector 50, that is, the effective fitting length is large, the contact stability between the conductive patterns is high.
The recess 14 of the first connector 10 'may be a recess having a bottom instead of penetrating as shown in the drawing.

Further, in the case of the embodiment shown in FIG. 5, F is applied to the inner side surface 16b, the bottom surface 16c and a part of the outer side surface 16d of the beam portion 16.
It has a structure in which the PC 40 ″ is fixed by adhesion. Therefore, the second
Although there is a slight downward movement of the elastic body 30 and the FPC 40 'due to the insertion of the connector 50, and the effective fitting length becomes relatively small, the contact portion 44 with the conductive pattern of the second connector 50.
This has the advantage of shortening the electrical path from a '' to the solder contact 44b ''.

FIG. 6 is a perspective view of a second connector having a resin layer for preventing the spread of molten solder, and FIG. 7 is a sectional view showing a state in which the second connector shown in FIG. 6 is mounted on a substrate.

In the embodiment of FIGS. 2, 4 and 5, when the connection height between the boards is about 3 mm or less, the solder connection portion of the board 4 and the land 5 and the conductive patterns 44, 64 in the second connector 50. The distance of the contact portion is 1.5 mm or less, and the molten solder may spread during soldering to cover the contact surface. When gold plating or the like is selected for the surface treatment of the contact portion, this phenomenon may cover the gold plating or the like of the contact portion with solder, which may adversely affect the electrical performance of the connector.

In such a case, as shown in FIG. 6, for example, a resist 68 may be provided as a resin layer for preventing solder rising. When this connector is soldered on the substrate, the spread of the solder 66 is suppressed by the resist 68 as shown in FIG. 7, and the contact surface 64a of the FPC 60 is protected.

The second connector houses the FPC 60 in the housing 5
In the case of the structure arranged and fixed on the outer circumference of 2,
The resist 68 can be formed by printing or another method in the previous step of fixing the PC. The resist 68 is M
You may form in the connector of ID.

FIG. 8 is a perspective view showing still another embodiment of the board connector of the present invention. FIG. 9: shows the fitting state of the connector of FIG. 8, (A) top view, (B) side view,
(C) It is a bottom view. FIG. 10 is a cross-sectional view taken along the line XX of FIG. 11 to 14 are cross-sectional views showing modified embodiments of the second connector of FIG.

The board connector shown in FIGS. 8 to 14 differs from the board connector shown in FIGS. 1 to 5 in that the elastic body 130 is not provided on the female first connector 110 side. This is the point provided on the male second connector 150 side. That is, the first connector 110 is the first
The second connector 150 includes the housing 112 and the FPC 140, while the second connector 150 includes the second housing 152 and the FPC 140.
It is composed of a PC 160 and an elastic body 130. Elastic body 1
30 is arranged along the longitudinal direction of the second housing 152, and the outer periphery thereof is substantially surrounded by the FPC 160 together with the second housing 152. Further, as shown in FIG. 10, since the width is slightly larger than the width of the second housing, the effective compression amount of the elastic body 130 is secured.

In the board connector of the present embodiment, the structure of the second connector 150 can be simplified by disposing the elastic body 130 on the second connector 150 side. Further, since the elastic body 130 projects from each of the opposite side surfaces of the second housing 152, a single elastic body 130 is sufficient. Therefore, it is possible to further reduce the number of components forming the board connector 100 and also to reduce the width W (see FIG. 9A) of the connector. Therefore, the width W
= About 5 mm and height H (see FIG. 9B) = about 2 mm, a board connector can be realized. In addition, a protrusion (not shown) may be formed in the second housing 152, and a hole for receiving the protrusion may be formed in the elastic body 130 to position the elastic body 130.

In the modified embodiment shown in FIG. 11, the soldering portion is widened by forming the protrusion 254 in the soldering portion supporting portion of the second housing 252. As a result, the protruding elastic body 130 does not interfere with the visual inspection of the solder fillet 266, and the solder fillet 266 can be easily confirmed.

In another modified embodiment shown in FIG. 12, the second housing 352 has two end portions 354 sandwiched therebetween.
Book elastic bodies 330, 330 are arranged. With this, the tip portion 354 can be used as an abutting portion for the mating substrate or the first connector (neither is shown) at the time of fitting, so that the fitting height can be uniquely determined. Further, the end of the FPC 360 is generally located on the soldering surface, but since it can be located on the tip 354 in the present embodiment, the degree of freedom in winding the FPC 360 is large.

In a further modified embodiment shown in FIG. 13, the elastic body 430 and the second housing 452 are insert-molded. Since the connecting portion 432 of the elastic body 430 penetrates the hole 456 of the second housing 452 and is held therein, there is no risk of the elastic body 430 falling off the second housing 452. Moreover, since the second housing 452 has the tip portion 454 as in the embodiment of FIG. 12, the height at the time of fitting can be determined. Furthermore, since the second housing 452 and the elastic body 430 can be handled as one component, the work of winding the FPC 460 becomes easy.
Further, the degree of freedom in winding the FPC 460 is large, as in the embodiment of FIG.

In another modified embodiment shown in FIG. 14, a concave portion 558 for accommodating the elastic body 530 is formed on the tip side of the second housing 552, and the elastic body 530 is press-fitted or filled into the concave portion 558. The walls 559 and 559 defining the recess 558 are extremely thin, about 0.2 mm, so that they can be bent inward by being pressed by the first housing (not shown). Since the cross section of the second housing 552 accommodating the elastic body 530 is substantially rectangular, FP
Winding work of C560 is easy. Also, FPC5
Since it is not necessary to wrap the elastic body 530 with 60, F
The second housing 55 is used instead of the conductor pattern of the PC 560.
It is also possible to form a contact on the outer surface of 2 by plating.

Since the first connector 110 does not require elasticity, the FPC 14 is attached to the outer periphery of the first housing 112.
Instead of winding 0, contacts may be formed on the outer surface of the first housing 112 by plating. Further, as in the embodiment of FIG. 6, a resist may be formed on one or both of the first connector 110 and the second connector 150, 250, 350, 450, 550, or the first connector or the second connector by MID. A resist may be formed on.

The preferred embodiment of the board connector of the present invention has been described above in detail. However, the present invention should not be limited to this embodiment, and various modifications and changes can be made as necessary. Those of ordinary skill in the art will readily understand. For example, although the board connector of the present embodiment is a horizontal mounting type in which two boards are arranged in parallel, it may be a vertical mounting type in which two boards are arranged vertically.

[0042]

As can be understood from the above description, according to the board connector of the first aspect, the number of parts constituting the connector is small and the number of manufacturing steps is small, so that the height can be further reduced. At the same time, a low-cost connector that is easy to manufacture can be obtained.

Further, the FP for constructing the solder connection part to the substrate
Since the conductive pattern of C is supported by the flat housing, the solder connection portion having good flatness can be obtained, and the solder connection portion having high reliability can be obtained.

According to the board connector of the fourth aspect, the number of parts constituting the connector is small, a solder connection portion having good flatness can be obtained, and the dimension in the width direction of the connector can be reduced.

When a resin layer is provided on the surface of the contact or the conductive pattern, the spread of solder can be prevented and the contact surface can be protected.

[Brief description of drawings]

FIG. 1 shows an embodiment of a board connector of the present invention,
(A) Perspective view of mating state, (B) exploded perspective view, (C)
It is a C arrow line view of (A).

FIG. 2 is a sectional view taken along line II-II in FIG.

FIG. 3 is a partially enlarged view of a part III in FIG.

FIG. 4 is a view showing a cross section showing a fitted state of another embodiment of the present invention together with a substrate to be connected.

FIG. 5 is a cross-sectional view showing a fitted state of still another embodiment of the present invention.

FIG. 6 is an embodiment in which a resist for preventing the spread of molten solder is provided on the board connector of the present invention.

7 is a cross-sectional view taken along the line VII-VII of FIG.

FIG. 8 is a perspective view showing still another embodiment of the board connector of the present invention.

9 is a plan view (A), a side view (B), and a bottom view (C) showing a fitted state of the connector of FIG. 8;

10 is a cross-sectional view taken along the line XX of FIG.

11 is a cross-sectional view showing a modified embodiment of the second connector of FIG.

12 is a cross-sectional view showing a modified embodiment of the second connector of FIG.

13 is a sectional view showing a modified embodiment of the second connector of FIG.

14 is a cross-sectional view showing a modified embodiment of the second connector of FIG.

[Explanation of symbols]

1, 100 Board connector 2, 4, 102, 104 Board 3, 5, 103, 105 Land 10, 10 ', 10'', 110 First connector 12, 112 First housing 14, 114 Recessed section 16, 116 Beam section 30, 130, 330, 430, 530 Elastic body 40, 40 ', 40'', 60, 140, 160, 26
0, 360, 460, 560
Flexible printed board 44, 64, 144, 164 Conductive pattern 50, 150, 250, 350, 450, 550
Second connector 52, 152, 252, 352, 452, 552
Second housing 68 Solder resist

Front Page Continuation (72) Inventor Hiroshi Shirai 1-1, Nikkocho, Fuchu-shi, Tokyo J Tower 16F Amp Technology Japan Ltd. (72) Inventor Koji Furuya 1 Nikkocho, Fuchu-shi, Tokyo No. 1 J-TOWER 16th floor Amp Technology Japan Co., Ltd. (72) Inventor Hiroyuki Okazaki 1-1, Nikkocho, Fuchu-shi, Tokyo J-TOWER 16F Amp Technology Japan Co., Ltd.

Claims (8)

[Claims] 1. A first device having a plurality of lands, respectively.
And a board connector for interconnecting the lands of the second board with each other, wherein a pair of beam portions formed by sandwiching a concave portion formed along a longitudinal direction of the housing and parallel to the beam portion in the concave portion. An elastic body disposed on the elastic body; and a flexible printed circuit board wound around the outer periphery of the elastic body and the beam section and fixedly bonded to the beam section, wherein the conductive pattern of the flexible printed circuit board is the first pattern. A first connector that is connected to the land of the board; and a contact that is attached to the second board and that is connected to the land and that contacts the conductive pattern, and is housed in the recess of the first connector. And a second connector, which is a board connector. 2. The board connector according to claim 1, wherein the contact is a conductive pattern on a flexible printed board that is adhesively fixed to the outer periphery of the housing of the second connector. 3. The board connector according to claim 1, wherein the contact is a plating layer formed on a housing surface of the second connector. 4. The board connector according to claim 1, wherein a resin layer for preventing the spread of the molten solder is provided on the surface of the contact or the conductive pattern. 5. A first device having a plurality of lands, respectively.
And a board connector for interconnecting the lands of the second board, wherein a pair of beam portions formed by sandwiching a recess formed along the longitudinal direction of the housing and an outer periphery of the beam portion are formed,
A first connector having a contact connected to the land of the first substrate; a housing; an elastic body arranged along the longitudinal direction of the housing; and winding around the elastic body and the outer circumference of the housing. And a second connector having a conductive pattern connected to the land of the second substrate, the second connector being housed in the recess. The connector for a board, wherein the conductive pattern on the outside of the elastic body elastically comes into contact with the contact when the contact is made. 6. The board connector according to claim 5, wherein the contact is a conductive pattern on a flexible printed board that is adhesively fixed to the outer periphery of the housing of the first connector. 7. The board connector according to claim 5, wherein the contact is a plating layer formed on a housing surface of the first connector. 8. The board connector according to claim 5, wherein a resin layer for preventing the spread of the molten solder is provided on the surface of the contact or the conductive pattern.