JPH09245913A - Connector for board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a board-to-board connector of in which the number of parts is small, in which the number of manufacturing mandays is small, of which height is low, and of which characteristic impedance can be easily controlled. SOLUTION: A connector has a first connector 1 and a second connector 2 which can be engaged with each other. Each connector 1, 2 is provided with a flexible board (FPC) bound and fixed onto a housing. Each FPC has first and second patterns 24a, 24b, 54a, 54b formed in one surface of a base, and third patterns 24c, 54c formed almost in the whole range of the other surface. The second pattern 24b, 54b are respectively connected to third patterns 24c, 54c through through holes 25, 55 in the respective bases. The first and third patterns 24a, 54a, 24c, 54c form a microstrip structure, in which impedance control is easy. By alternately disposing the first and the second patterns, crosstalk can be restricted.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrical connector, and more particularly to a board connector for interconnecting a pair of boards using a flexible board.

[0002]

2. Description of the Related Art With the recent increase in the speed of signal transmission in electronic equipment, it has been required to provide a circuit capable of high-speed transmission in a substrate or an electronic component so as to cope with the processing capacity of a processor such as a CPU. . For this reason, there is a demand for high-speed board connectors for interconnecting boards, which is generally achieved by arranging a ground line between opposing signal lines.

Such a board connector is generally composed of contacts formed by processing a metal material and an insulating housing for fixing these contacts.
However, in order to realize high-density mounting accompanying miniaturization of electronic devices, there is a limit in a connector using contacts formed of a metal material, and the contact pitch or the housing for fixing the contacts is narrowed by narrowing the pitch of the contacts. This leads to a decrease in strength. Further, there is a problem that it becomes difficult to assemble the contacts to the housing.

Therefore, a board connector using a conductive pattern of a flexible board (hereinafter referred to as FPC) as a contact is disclosed in Japanese Patent Laid-Open Nos. 112082/1993 and 4-87 / 1987.
No. 172, etc. Since the board connectors disclosed in these publications use the FPC as a contact member, the arrangement pitch of the contacts (conductive patterns) can be reduced.

[0005]

However, in the board connector described in the above publication, each of the plug connector and the receptacle connector forming a pair is constructed by assembling a plurality of housing parts. Therefore, there are problems that the number of parts is large, the manufacturing is complicated and the cost is high, and the connector is bulky by assembling the parts, so that it is difficult to reduce the height.

Further, since it does not have a structure adapted to high-speed signal transmission, it has a problem that it cannot be matched with the characteristic impedance of the substrate, and further, crosstalk occurs between adjacent conductive patterns.

Therefore, the present invention provides a board connector which solves the above-mentioned problems, that is, a board connector which has a small number of parts and a small number of manufacturing steps, and has a low profile and whose characteristic impedance can be easily controlled. The purpose of 1.

A second object of the present invention is to provide a board connector which has a small number of parts and a small number of manufacturing steps, has a low profile, and suppresses the occurrence of crosstalk.

[0009]

A board connector according to a first aspect of the present invention is a board connector for interconnecting the lands of a first and a second board, each having a plurality of lands formed therein. A first connector, in which a conductive pattern of a first flexible substrate, which is adhesively fixed on the outer periphery, is connected to the land of the first substrate, and the first connector is accommodated along the longitudinal direction of the second housing. A pair of beam portions formed so as to sandwich the recessed portion, an elastic body arranged in the recessed portion in parallel with the beam portion, and wound around the outer periphery of the elastic body and the beam portion and adhesively fixed to the beam portion Second flexible substrate, the conductive pattern of the second flexible substrate being connected to the land of the second substrate and being in contact with the conductive pattern of the first connector. Each of the flexible substrates The electric pattern is connected to the first pattern formed on one surface of the base of each flexible substrate in parallel with each other, the second pattern formed on the one surface, and connected to the second pattern through a through hole of the base. And a third pattern formed on substantially the entire other surface of the base.

A board connector according to a second aspect of the present invention is a board connector for interconnecting the lands of the first and second boards, each having a plurality of lands formed thereon, and is fixed to the outer periphery of the first housing by adhesion. The conductive pattern of the first flexible substrate is formed by sandwiching a first connector connected to the land of the first substrate and a recessed portion along the longitudinal direction of the second housing for accommodating the first connector. A pair of beam portions, an elastic body arranged in the recess in parallel with the beam portion, and a second flexible member wound around the outer periphery of the elastic body and the beam portion and adhesively fixed to the beam portion. A flexible substrate, the conductive pattern of the second flexible substrate being connected to the land of the second substrate and contacting the conductive pattern of the first connector. The conductive pattern of the flexible substrate is Characterized in that the first surface of the base of the flexible substrate which is a signal pattern and a ground pattern formed on the parallel and alternate with one another.

[0011]

Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a perspective view showing a first embodiment of the first connector of the present invention. FIG. 2 shows FIG.
FIG. 3 is an exploded perspective view of the first connector of FIG. FIG. 3 is an exploded perspective view of the FPC used for the first connector of FIG. FIG. 4 is a perspective view showing a first embodiment of the second connector of the present invention. FIG. 5 is an exploded perspective view of the second connector of FIG. FIG. 6 is an exploded perspective view of the FPC used for the second connector of FIG. Figure 7
1A and 1B show a state in which the first connector of FIG. 1 and the second connector of FIG. 4 are fitted to each other, and (A) conductive patterns 24a and 54a are cross-sectional views, and (B) conductive pattern 24, respectively.
It is sectional drawing on b, 54b.

The board connector of the present invention comprises a first connector 1 (FIGS. 1 to 3) and a second connector 2 (FIGS. 4 to 6). The first connector 1 includes a housing 10 made of an insulating resin such as liquid crystal polymer and an FPC 20. The housing 10 has an FP having a conductive pattern 24.
It has the beam part 11 in which C20 is arrange | positioned, and the pedestal part 12 of the longitudinal direction both ends of this beam part 11.

As shown in FIG. 3, the FPC 20 has a rectangular shape in a developed state, and a large number of first conductive patterns 24a serving as signal patterns are formed on one surface 22 of a base 21 made of an insulating resin such as polyimide. Two rows are formed in parallel. Second conductive patterns 24b, which are ground patterns, are formed in parallel with the first conductive patterns 24a at both ends in the longitudinal direction on the one surface 22 of the FPC 20. Furthermore,
The third conductive pattern 24c is formed so as to cover substantially the entire other surface 23 of the base 21, and the through hole 2 of the base 21 is formed.
Second, which is a ground pattern through the pattern on the inner wall of No. 5
It is connected to the conductive pattern 24b. By disposing the first conductive pattern 24a, which is a signal pattern, and the third conductive pattern 24c, which is a wide ground pattern, with the insulating base 21 having a predetermined thickness interposed therebetween, a microstrip structure is obtained. Therefore, a desired characteristic impedance can be obtained by appropriately setting the thickness of the base 21. The conductive pattern 24c is preferably a pattern that uniformly covers the entire other surface 23, but may be a mesh pattern having good bending workability.

The FPC 20 includes a beam portion 11 of the housing 10.
The third conductive pattern 24c on the other surface 23 of the FPC 20 is bonded and fixed to the beam portion 11.
Therefore, the first and second conductive patterns 24a and 24b are exposed to the outside. As will be described later, when the first connector 1 is soldered to the substrate 3 (see FIG. 7), the first conductive pattern 24a passes through the solder and the third conductive pattern 24
c is connected to a predetermined conductive pad on the substrate 3 through the through hole 25, the second conductive pattern 24b and the solder.

The second connector 2 comprises a housing 30 made of an insulating resin such as liquid crystal polymer, a columnar elastic body 40 such as silicone rubber or urethane rubber, and an FPC 50. The housing 30 has a recess 31 formed in the center thereof along the longitudinal direction, and has two elongated beam portions 32 that extend in parallel to each other with the recess 31 interposed therebetween. F
Similar to the FPC 20, the PC 50 has a large number of parallel first conductive patterns 54a on one surface 52 of a base 51 made of polyimide or the like, and second conductive patterns 54b formed at the ends of the rows of the first conductive patterns 54a. . In addition, the third conductive pattern 54 that covers substantially the entire other surface 53 of the base 51.
c is formed, and this pattern 54c is connected to the second conductive pattern 54b through the pattern on the inner wall of the through hole 55 of the base 51a. The FPC 50 is wound along substantially the entire circumference of the elastic body 40, and the third conductive patterns 54c on the other surface 53 are bonded to each other so that one end protrudes longer than the other end, and the FPC 50 has the beam portion 32 of the housing 30. They are arranged and adhered and fixed along substantially the entire area of the four surfaces. At the time of this adhesive fixing, it is the FPC that contacts the elastic body 40 and the beam portion 32.
50 third conductive patterns 54c.

In FIG. 7A, the upper first substrate 3
Signals from the conductive pads (lands) 3a, the solder 5
a, the first conductive pattern 24a of the first connector 1, the first conductive pattern 54a of the second connector 2, the solder 6a, and the conductive pad 4a to be transmitted to the lower second substrate 4. 7B, the conductive pads (lands) 3b of the first substrate 3, the solder 5b, the second conductive pattern 24b of the first connector 1 and the second conductive pattern 54 of the second connector 2 are referred to.
A ground connection line is formed between the solder pad 6b, the solder 6b, and the conductive pad of the second substrate 4. The first and second connectors 1, 2 are
Since both use the first conductive patterns 24a and 54a of the FPCs 20 and 50 as contacts, a narrow pitch arrangement of the contacts and a reduction in the number of components can be achieved. Also,
FP on beams 11, 32 of single housing 10, 30
By fixing C20 and 50 by adhesion, connectors 1 and 2
As a result, the number of manufacturing steps can be reduced to facilitate the manufacturing, and the height of the connector can be reduced. Furthermore, FPC2
Nos. 0 and 50 have the first conductor patterns 24a and 54a for signals formed on one surface of the base and the third conductor patterns 24c and 54c for grounding on the other surface, respectively, so that the characteristic impedance can be easily controlled. is there.

FIG. 8 is a perspective view showing a second embodiment of the first connector of the present invention. FIG. 9 is an exploded perspective view of the first connector of FIG. FIG. 10 is an exploded perspective view of the FPC used for the first connector of FIG. FIG. 11 is a perspective view showing a second embodiment of the second connector of the present invention. FIG. 12 is an exploded perspective view of the second connector of FIG. FIG. 13 is an exploded perspective view of the FPC used for the second connector of FIG.

The first and second connectors 1'and 2'shown in FIGS. 8 to 13 differ from those of the first embodiment in the arrangement of the conductor patterns on the FPCs 20 'and 50'. That is, as clearly shown in FIG. 10 and FIG.
The conductor patterns 24a 'and the second conductor patterns 24b' are alternately arranged. Therefore, since the second conductor pattern 24b 'constituting the ground line is interposed between the two adjacent first conductor patterns 24a' constituting each signal line, an arbitrary signal line is shielded and crosstalk occurs. To reduce.

Although the preferred embodiment of the board connector of the present invention has been described above, the present invention should not be limited to the above-described embodiment, and various modifications and changes can be made as necessary. For example, the board connector of the above-described embodiment is a type in which two boards are interconnected in parallel with each other, but the housing of the first connector is formed into an L-shaped cross section so that the two boards can be connected to each other. It may be a type in which they are mutually connected in a state of being orthogonal to each other. Further, although the FPC 50 of the second connector described above is arranged on the beam portion 32 after being wound around the elastic body 40, the beam portion 32 and the elastic body 40 may be wound integrally. . That is, in a state where the beam portion 32 and the elastic body 40 are in direct contact with each other, starting from the outer surface 32d or the upper surface 32a of the beam portion 32, covering approximately half the surface of the elastic body 40, passing through the bottom surface of the beam portion 32 and the outer surface 32d. May be arranged up to a part of. In this case, the electric path on the FPC 50 becomes short, which is suitable for high-speed signal transmission. Furthermore, when changing the characteristic impedance, it is sufficient to replace it with an FPC or the like having a different base thickness, and the circuit can be easily changed.

[0020]

According to the board connector of the first aspect, the flexible board is bonded and fixed to the housing, and the flexible board is formed with the third pattern having a large area on the other surface of the base. Therefore, there are advantages that the number of parts and the number of manufacturing steps are small, the height is low, and the characteristic impedance can be easily controlled.

Further, according to the board connector of the second aspect, the flexible board is bonded and fixed to the housing, and the ground pattern is arranged between the adjacent signal patterns on the flexible board. It has advantages that the number of points and the number of manufacturing steps are small, the height is low, and the occurrence of crosstalk is suppressed.

[Brief description of drawings]

FIG. 1 is a perspective view showing a first embodiment of a first connector of the present invention.

FIG. 2 is an exploded perspective view of the first connector of FIG.

3 is an exploded perspective view of an FPC used in the first connector of FIG.

FIG. 4 is a perspective view showing a first embodiment of a second connector of the present invention.

5 is an exploded perspective view of the second connector of FIG.

6 is an exploded perspective view of an FPC used in the second connector of FIG. 4 in an exploded manner.

7A and 7B show a state in which the first connector of FIG. 1 and the second connector of FIG. 4 are fitted to each other, and FIG. 7A is a cross-sectional view on conductive patterns 24a and 54a, and FIG. 7B is conductive patterns 24b and 54b. FIG.

FIG. 8 is a perspective view showing a second embodiment of the first connector of the present invention.

9 is an exploded perspective view of the first connector of FIG.

FIG. 10 is an exploded perspective view of the FPC used in the first connector of FIG.

FIG. 11 is a perspective view showing a second embodiment of the second connector of the present invention.

FIG. 12 is an exploded perspective view of the second connector of FIG.

13 is an exploded perspective view of the FPC used for the second connector of FIG.

[Explanation of symbols]

1, 1'First connector 2, 2'Second connector 3 First substrate 3a, 3b, 4a, 4b Land 4 Second substrate 10, 10 '(first) housing 20, 20' 50, 50 'Flexible Substrate 21, 21 ', 51, 51' Base 24a, 24a ', 54a, 54a' First (signal)
Pattern 24b, 24b ', 54b, 54b' Second (ground)
Pattern 24c, 24c ', 54c, 54c' Third pattern

Claims (2)

[Claims] 1. A first device having a plurality of lands, respectively.
And a board connector for interconnecting the lands of the second board, wherein the conductive pattern of the first flexible board adhered and fixed on the outer periphery of the first housing is connected to the lands of the first board. One connector, a pair of beam portions formed along the longitudinal direction of the second housing with a recess for accommodating the first connector interposed therebetween, and an elastic body arranged in the recess in parallel with the beam portion. And a second flexible substrate which is wound around the outer circumference of the elastic member and the beam portion and fixedly adhered to the beam portion, and the conductive pattern of the second flexible substrate is the second substrate. A second connector connected to the land and in contact with the conductive pattern of the first connector, wherein the conductive pattern of each flexible substrate is formed parallel to one surface of the base of each flexible substrate. First pattern and the shape on the one side And a third pattern which is connected to the second pattern through a through hole of the base and is formed on substantially the entire other surface of the base. . 2. A first device having a plurality of lands, respectively.
And a board connector for interconnecting the lands of the second board, wherein the conductive pattern of the first flexible board adhered and fixed on the outer periphery of the first housing is connected to the lands of the first board. One connector, a pair of beam portions formed along the longitudinal direction of the second housing with a recess for accommodating the first connector interposed therebetween, and an elastic body arranged in the recess in parallel with the beam portion. And a second flexible substrate which is wound around the outer circumference of the elastic member and the beam portion and fixedly adhered to the beam portion, and the conductive pattern of the second flexible substrate is the second substrate. A second connector connected to the land and in contact with a conductive pattern of the first connector, wherein the conductive patterns of each of the flexible boards are parallel to and alternate with one surface of the base of each of the flexible boards. Signal pattern formed on the ground and ground Board connector, which is a turn.