JP2005276707A - Connector - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To minimize a connecting board area, reduce and miniaturize a packaging volume in packaging of an IC, a chip, a connector, or the like on the board, and reduce a manufacturing cost. <P>SOLUTION: The connector 10 being connected to a board of a connecting object has a plurality of module members 10a, 10b..., 10i comprising a substrate, an adhesive layer, and a conductor having a terminal part. At least one of the substrate and the adhesive layer has elasticity. The module members 10a, 10b..., 10i are bent so as to arrange erminal parts 6a, 6b..., 6i at both end parts, and by exposing the terminal parts 6a, 6b..., 6i, the bent module members 10a, 10b..., 6i are laminated, and each space between the module members 10a, 10b..., 10i is stuck with the adhesive layer. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a connector, and more particularly to a grid-like wiring pattern double-sided connection connector for connecting a connection object such as a substrate and a manufacturing method.

  2. Description of the Related Art Conventionally, IC chips, connectors, and the like having grid-like wiring have been developed in order to reduce the mounting area of a substrate such as an electronic component. As such mounting connection structures, the following are common.

  FIG. 9 is a perspective view showing a conventional computer device for a communication network server. FIGS. 10A and 10B are perspective views showing a few main examples of the micro PGA socket mounted on the substrate of the server unit of the computer apparatus of FIG.

  The computer apparatus shown in FIG. 9 is an aggregate of a plurality of server units 80. Electronic components 82 and 83 such as a memory and various controller ICs, and a CPU (central processing unit) are provided on a substrate 81 of each server unit 80. PGA (Pin Grid Array) socket connectors 84 and 85 for mounting are mounted.

  As shown in FIGS. 10A and 10B, the CPU sockets 111 and 112 have pin holes corresponding to pins arranged on one surface of the CPU. Many of the connection methods using the PGA type socket connector have a ZIF (Zero Insertion Force) structure. Therefore, there is a problem that not only the degree of difficulty is high as a manufacturing technology having a high number of connector components but also high in cost, and there is a limit to miniaturization.

  In contrast, a system called BGA (Ball Grid Array) has been developed. This is a mounting method using, for example, a sheet-like double-sided connector (for example, AMP).

  FIG. 11 is a view showing a typical BGA connector, FIG. 12 is a view showing a connection method of the BGA device 53 using the BGA connector, (a) is an exploded perspective view, (b) is a completed connection view, (c) ) Is a side view. FIG. 13 is a partial sectional view showing a connection state of the BGA socket.

  As shown in FIG. 11, the BGA connector 55 is provided with a ball receiving hole (well) corresponding to the BGA ball of the BGA device to be mounted on the mounting surface.

  As shown in FIG. 12, a printed circuit board 56 is overlaid on a support board 57 having a plurality of fixing pins 58 erected at the corners, and a BGA socket 55 similar to that shown in FIG. As shown in FIG. 13, each ball 63 is overlapped with the surface on which the receiving hole is further formed so as to be an upper surface, and further, the ball forming surface of the BGA device 63 is placed thereon. Is inserted into the ball receiving hole 65, and the upper support plate 52 is overlaid thereon, and a spring plate 51 having a spring 54 biased in the vertical direction is mounted on the lower surface of the center, and pins 58 protruding from the four corners are mounted. By fixing with a screw provided at the front end of the ball, the contact 61 of the ball housing hole 65 and the ball 63 are pressed and connected.

  As shown in FIG. 13, the ball receiving hole 65 is formed by injection molding of the MPI polymer column 61 formed on the polyamide carrier 64, and the ball 63 is formed by the MPI polymer column in the ball receiving hole (well) 65. The upper end surface of 61 is contacted and electrically connected.

  In the case of the BGA method described above, the size can be reduced by performing solder connection, but it is difficult to remove the connected IC, chips, and the like thereafter.

  On the other hand, when not using solder connection, another structural mechanism for applying contact pressure (contact pressure) to obtain electrical connection is required, which increases costs and is limited to miniaturization. There is a problem that there is.

  On the other hand, Patent Document 1 discloses a connector in which a holding plate provided with a plurality of slits is formed in a bar shape having a semi-oval cross section and is arranged in parallel along the longitudinal direction with a group of fine metal wires wound around a curved surface. An electrical connector in which is inserted is disclosed.

  Patent Document 2 uses a conductor module in which an adhesive material layer is formed on one surface of a tape-like substrate, and a plurality of strip-like metal thin films are provided on the tape material so as to be parallel to each other in one direction. A connector that has been disclosed is disclosed. However, this connector cannot be applied to a connector having a large number of cores because the width dimension becomes too long.

JP 2002-8810 A JP 2001-210933 A

  Therefore, the technical problems of the present invention are to minimize the connection board area, reduce the mounting volume when mounting ICs, chips, connectors, etc. on the board, reduce the size, and reduce the manufacturing cost.

  According to the present invention, in the connector to be connected to the connection object, the connector includes a plurality of module members each including a base material, an adhesive layer, and a conductor having a Zuiko part, At least one of the pressure-sensitive adhesive layers has elasticity, and the module member is formed by bending so that the terminal portions are arranged at both ends, and the bent module members are laminated by exposing the terminal portions. In addition, a connector is obtained in which the module members are attached with an adhesive layer.

  Here, in the present invention, a substrate or the like can be used as the connection object, a tape, a sheet, or the like can be used as the base material, and a metal foil, a metal piece, or a metal thin film can be used as the conductor. .

  According to the present invention, in the connector, the connector is characterized in that the module member is bent in a U shape.

  Further, according to the present invention, in the connector, the connector characterized in that the U-shaped module members have substantially the same shape.

  Further, according to the present invention, in the connector, the connector further includes a base material having a tapered outer peripheral surface, and the first laminated module member has the adhesive layer on the outer peripheral surface. A connector characterized in that a surface opposite to the formed one surface is bonded.

  According to the present invention, in the connector, the auxiliary base material is disposed in at least one of the spaces formed between the pair of module members stacked adjacent to each other. Is obtained.

  According to the invention, in the connector, the module member includes a first module member and a second module member that overlap each other, and the conductor of the first module member and the second module member A connector is obtained in which grooves are provided so as to accommodate the conductors of the first module member in portions of the substrate of the second module member that overlap each other. .

  According to the present invention, it is possible to minimize the connection board area, reduce the mounting volume when mounting ICs, chips, connectors, and the like on the board, reduce the size, and reduce the manufacturing cost.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a perspective view showing a connector according to a first embodiment of the present invention. FIG. 2 is a side view of the connector of FIG. 3 is a perspective view of a module member constituting the connector of FIG. 4 is a partially enlarged side view of the connector of FIG. FIG. 5 is a perspective view of components used for connecting the connector of FIG. 1 as viewed from the bottom side. FIG. 6 is an exploded perspective view of the connector of FIG.

  First, the module member will be described with reference to FIG. Referring to FIG. 3, the module member 10 is formed by providing the adhesive layer 2 on one surface of the substrate 1 such as a tape or a sheet, and the conductor 3 made of an elongated strip-shaped metal thin film at the same interval in the width direction. (For further details, see Patent Document 2).

  Referring to FIGS. 1 to 4, the connector 101 is U-shaped at the center (folded portions 13a, 13b, 13c) of the module members 10a, 10b, 10c,. The conductor of the module member 10a is formed on the outer peripheral surface of the base material main body 11a by the adhesive force of the base material adhesive portion 11b formed on the outer peripheral surface of the base material 11 along the base material edge 11c. By pasting the opposite surface (anti-adhesive surface) to the surface, and then laminating and laminating the module members 10a, 10b, 10c,... This is an ultra-thin double-sided connector having a grid-like wiring pattern on both sides.

  Referring to FIG. 4, contact terminal portions 6a, 6b, 6c,... At the tip of conductor 3 forming electrical connection terminals are parallel to the connection substrate surface, and these terminal parallel portions 6a, 6b, 6c. ,... Can be electrically connected to the conductor on the substrate.

  In the double-sided connection connector according to the first embodiment of the present invention, the adhesive force of the adhesive tape is used for mounting connection and fixing to the substrate. Further, the contact pressure for obtaining the electrical connection can be generated by a mechanical coupling force by an adhesive force.

  At the time of forming the terminal parallel portions forming the upper and lower surfaces of the connector, the tape base material, the adhesive material, and the bent portion of the electrical connection terminal can be easily formed because the tape base material and the adhesive material are elastic bodies.

  Next, an example in which an IC and a CPU package are connected to a substrate using the connector according to the first embodiment of the present invention will be described.

  Referring to FIG. 5, the IC / CPU package 21 has a grid-like wiring pattern on one surface of the connection side.

  As shown in FIG. 6, the connector 102 is arranged between the grid-like wiring pattern 22 of the IC / CPU package 21 and the grid-like pattern 31 of the substrate 30, and the IC / CPU package is mounted on the substrate 30.

  Thus, by interposing the connector 101 according to the first embodiment of the present invention, it is possible to reduce the mounting area (volume) with the substrate 30 and to reduce the size.

  Moreover, since the connection of the connector 101 according to the first embodiment of the present invention is a connection structure using the base material 1 having an adhesive layer, that is, an adhesive tape, it is easy to remove the mounted ICs.

  Moreover, the mechanical coupling force connection by the adhesive layer 2 of the connector 101 is possible, the mounting connection is simple, and it is effective in reducing the mounting man-hours.

  Moreover, in the connector by the 1st Embodiment of this invention, the whole base material thickness can be restrained thin by using the thin base material 1, for example, a tape.

  In addition, the connector assembling method according to the embodiment of the present invention can be easily realized by applying the prior art, and can be manufactured at a low cost with a simple structure.

  FIG. 7 is a partially enlarged perspective view showing the connector according to the second embodiment of the present invention. Referring to FIG. 7, in the connector 102 according to the second embodiment of the present invention, the groove 7 is provided on the anti-adhesive surface of the tape-like substrate 1 at a position corresponding to the conductor of the module member 10 to be overlaid. Thus, it is possible to improve the conduction stability by increasing the elasticity of the contact terminals 6a, 6b, 6c and 6d and improving the contact pressure and connection followability to the IC contact terminal portion.

  FIG. 8 is a side view showing a connector 103 according to the third embodiment of the present invention. As shown in FIG. 8, the base material is a trapezoid, and the anti-adhesive surface of the module member 10j similar to that shown in FIG. 3 is bonded to the base material. Further, the base material 14 has the same width (height in the figure). The module members 10k, 10l,..., 10t are sequentially laminated and bonded together via the auxiliary base material 15 having the same shape with a small thickness (that is, the length in the stacking direction in the direction along the substrate surface). Thus, a grid-like wiring pattern is formed. The substrate 30a and the substrate 30b are connected by this wiring pattern.

  Thus, in the connector 103 according to the third embodiment of the present invention, a connector for connecting the board 30a and the board 30b can be obtained by increasing the thickness of the connector, that is, the distance perpendicular to the board surface direction. Can be used.

  Moreover, as shown in FIG. 8, it is needless to say that the auxiliary base material 15 may be inserted into the space 12 in FIG. 4 to ensure the elasticity of the entire contact terminal.

Industrial applicability

  As described above, the connector according to the present invention is applied to a connection object, for example, a connector for connecting substrates.

1 is a perspective view showing a connector according to a first embodiment of the present invention. It is a side view of the connector of FIG. It is a perspective view of the module member which comprises the connector of FIG. FIG. 3 is a partially enlarged side view of the connector of FIG. 2. It is the perspective view which looked at the components used for the connection of the connector of FIG. 1 from the bottom face side. FIG. 2 is an exploded perspective view of the connector of FIG. 1. It is a partial expansion perspective view which shows the connector by the 2nd Embodiment of this invention. It is a side view which shows the connector 103 by the 3rd Embodiment of this invention. It is a perspective view which shows the computer apparatus for communication network servers by a prior art. (A) And (b) is a perspective view which shows the example of 2, 3 of the micro PGA socket mounted in the board | substrate of the server unit of the computer apparatus of FIG. It is a figure which shows a typical BGA connector. It is a figure which shows the connection method of the BGA device 53 using a BGA connector, (a) is a disassembled perspective view, (b) is a connection completion figure, (c) is a side view. It is a fragmentary sectional view which shows the connection state of a BGA socket.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Base material 2 Adhesive layer 3 Electric conductor 6a, 6b, 6c, ... Tip part (terminal parallel part)
10, 10a, 10b, 10c, 10d, 10e, 10f, 10g, 10h, 10i, 10j, 10k, 10l, 10m, 10n, 10o, 10p, 10q, 10r, 10s, 10t Module member 11 Base material 11a Base material body 11b Base material adhesion part 11c Base material edge 13a, 13b, 13c, ... 13n Center part (bending part)
DESCRIPTION OF SYMBOLS 14 Base material 15 Auxiliary base material 21 IC, CPU package 22 Grid-like wiring pattern 30, 30a, 30b Substrate 31 Pattern 51 Spring plate 52 Upper support plate 54 Spring 55 BGA connector 56 Printed circuit board 57 Support substrate 58 Fixed pin 61 MPI polymer Pillar 63 BGA device 65 Ball receiving hole 64 Carrier 80 Server unit 81 Substrate 82,83 Electronic component 84,85 PGA socket connector 101,102,103 Connector

Claims (6)

  In the connector to be connected to the connection object, the connector has a plurality of module members composed of a base material, an adhesive layer, and a conductor provided with a Seiko part, and among the base material and the adhesive layer, At least one has elasticity, the module member is formed by bending so that the terminal portions are arranged at both ends, and the bent module members are stacked by exposing the terminal portions, and between the module members. A connector characterized in that is attached with an adhesive layer.   The connector according to claim 1, wherein the module member is bent into a U shape.   The connector according to claim 1, wherein the U-shaped module members have substantially the same shape.   2. The connector according to claim 1, wherein the connector further includes a base material having a tapered outer peripheral surface, and the module member that is laminated first has one surface on which the adhesive layer is formed on the outer peripheral surface. A connector characterized in that the opposite surface is attached.   2. The connector according to claim 1, wherein an auxiliary base material is disposed in at least one of the spaces formed between a pair of module members stacked adjacent to each other. 2. The connector according to claim 1, wherein the module member includes a first module member and a second module member that overlap each other, and the conductor of the first module member and the base material of the second module member; The connector is characterized in that a groove is provided so as to accommodate the conductors of the first module member in portions of the base material of the second module member that overlap each other.

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