JP2009205916A - Inter-board connector - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inter-board connector that achieves high density and reduction in height. <P>SOLUTION: Circuit boards 1A, 1B are respectively configured such that a conductive pattern 12 is formed on the surface of a board 11 formed of an insulating material while an umbrella-shaped bump 13 is formed on the conductive pattern 12. A connection board 2 is configured such that a plurality of conductive elastic bodies 22, respectively formed into a columnar shape by conductive rubber, are insert-molded to an insulating substrate 21 so as to integrally form the insulating substrate 21 and the conductive elastic bodies 22. A round through-hole 23 is formed at the center part of each conductive elastic body 22. The inside face of the through-hole 23 is formed with fitting grooves 24, 24 to which bumps 13 of the circuit boards 1A, 1B are protrusion-recess-fitted respectively, on axial both end sides. The conductive elastic body 22 is held by the insulating substrate 21 while exposing its both end parts to both side faces. Consequently, it is possible to connect each bump 13 to each fitting groove 24 at both end parts from both ends in the thickness direction of the insulating substrate 21. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an inter-board connector.

  2. Description of the Related Art Conventionally, there has been provided an inter-board connector for connecting electrical circuits formed on both printed wiring boards in a form in which two printed wiring boards are opposed to each other (see, for example, Patent Document 1).

The board-to-board connector disclosed in the above publication is composed of a socket mounted on one printed wiring board and a header mounted on the other printed wiring board. The socket includes a plurality of contacts connected to an electric circuit formed on the printed wiring board, and the header includes a plurality of posts connected to the electric circuit formed on the printed wiring board and contacting the contacts provided on the socket. ing.
JP 2004-55464 A

  The board-to-board connector with the above configuration is used in electronic devices such as mobile phones and digital cameras, for example, but with the downsizing of electronic devices, connector height reduction (thinning) and density increase. It is requested.

  However, in the above-described board-to-board connector, when the header body is fitted to the socket body, the spring portion of the contact is elastically contacted with the post so that the two are electrically and mechanically connected. In order to obtain elasticity, it was necessary to increase the elasticity of the spring portion. Therefore, the spring part is formed in a complicated three-dimensional shape, and since the size of the spring part itself is increased, it is necessary to take a large installation space for the spring part so that the spring part does not interfere with other parts. There was a limit to the reduction in height and density of connectors.

  The present invention has been made in view of the above problems, and an object thereof is to provide a board-to-board connector that is further reduced in height and density.

  In order to achieve the above object, the invention of claim 1 includes a connection board for electrically and mechanically connecting two circuit boards, and the connection board is formed in a columnar shape by conductive rubber. Conductive elastic body having fitting means on both ends in the axial direction for fitting concave and convex to the conductive connection part of each circuit board, and conductive with both ends of the conductive elastic body exposed on both sides And an insulating substrate for holding an elastic body.

  According to a second aspect of the present invention, in the first aspect of the present invention, the conductive connection portions provided on the two circuit boards are each formed of a bump formed in an umbrella shape, and are provided at both ends of the conductive elastic body. Each of the means includes a fitting recess provided in a portion facing each bump of each circuit board and into which the bump is inserted.

  According to a third aspect of the present invention, in the first aspect of the invention, the conductive connection portion provided on one of the two circuit boards is a bump formed in an umbrella shape, and the conductive connection provided on the other circuit board. The part consists of a through hole with conductive plating applied to the inner surface of the through-hole penetrating the circuit board, and is connected to the bump of one circuit board among the fitting means provided at both ends of the conductive elastic body The fitting means includes a fitting recess provided in a portion facing the bump and into which the bump is fitted, and the fitting means connected to the through hole of the other circuit board is formed in a tapered shape. It consists of a fitting protrusion to be fitted into the through hole.

  According to a fourth aspect of the present invention, in the first aspect of the invention, the conductive connection portions provided on the two circuit boards are each composed of a through hole in which the inner surface of the through hole penetrating each circuit board is subjected to conductive plating. The fitting means provided at both ends of the conductive elastic body is characterized by comprising fitting protrusions that are each formed in a tapered shape and are fitted into the through holes.

  According to the first aspect of the present invention, the connection substrate is configured by holding the conductive elastic body provided with fitting means at both ends on the insulating substrate, and the conductive elastic body is provided at both ends. By fitting the fitting means to the conductive connection portion of the circuit board, the conductive connection portions of both circuit boards are electrically connected via the conductive elastic body. As compared with the case of using a contact formed in a complicated three-dimensional shape, there is an effect that it is easy to reduce the height and the density of the portion where the conductive elastic body and the conductive connection portion are unevenly fitted. Further, since the conductive elastic body itself has elasticity, it is not necessary to provide means for electrically connecting the conductive connection portions of both circuit boards to the insulating substrate that holds the conductive elastic body. There is also an effect that the configuration of the insulating substrate can be simplified.

  According to the invention of claim 2, by inserting the bumps provided on both circuit boards into the fitting recesses of the conductive elastic bodies, the conductive connection portions of both circuit boards are electrically connected via the conductive elastic bodies. Since they are connected, the bumps having an umbrella shape are caught in the fitting recesses, so that the bumps can be hardly removed, and the reliability of electrical connection is improved. Further, since the conductive elastic body itself has conductivity, it can be ensured that the electrical connection between the bump and the fitting recess can be ensured regardless of the position of the bump in the fitting recess. effective.

  According to the invention of claim 3, the bump and the conductive elastic body are electrically and mechanically connected by fitting the bump provided on one circuit board into the fitting recess of the conductive elastic body. Therefore, when the umbrella-shaped bump is caught in the fitting recess, it is difficult to remove the bump, and the reliability of electrical connection is improved. Further, since the conductive elastic body itself has conductivity, it can be ensured that the electrical connection between the bump and the fitting recess can be ensured regardless of the position of the bump in the fitting recess. effective. In addition, the other circuit board is electrically and mechanically connected between the through hole and the conductive elastic body by inserting the fitting protrusion of the conductive elastic body into the through hole. It can be easily attached compared to the case of fitting in the recess. In addition, bumps are not formed on the other circuit board, but only through-holes are formed. This reduces the man-hours required for manufacturing the board and reduces the manufacturing cost, and also increases the distance between the boards by the height of the bumps. The connector can be shortened to reduce the height of the connector.

  According to the invention of claim 4, both circuit boards are electrically and mechanically connected between the through hole and the conductive elastic body by inserting the fitting protrusion of the conductive elastic body into the through hole. Therefore, the bump can be easily attached as compared with the case where the bump is fitted into the fitting recess. In addition, bumps are not formed on the circuit board, but only through-holes are formed. This reduces the number of steps to create the board and reduces manufacturing costs, and shortens the distance between the boards by the height of the bumps. Thus, the height of the connector can be reduced.

  Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment 1)
Embodiment 1 of this invention is demonstrated based on FIGS. The inter-board connector A of the present embodiment is electrically connected between two circuit boards 1A and 1B arranged in parallel via a connection board 2 arranged in parallel between both circuit boards 1A and 1B. And it connects mechanically.

  A plurality of connection substrates 2 are formed in a cylindrical shape by a conductive rubber (for example, a mixture of silicone rubber and silver or copper) on a rectangular plate-shaped insulating substrate 21 made of an insulating material such as polyimide resin. The insulating substrate 21 and the conductive elastic body 22 are integrally formed by insert molding the individual conductive elastic bodies 22 (see FIGS. 4 and 5).

  A plurality of through holes 21a are provided in the insulating substrate 21 in two rows along the longitudinal direction, and a conductive elastic body 22 is inserted into each through hole 21a. Both ends of the conductive elastic body 22 in the axial direction are integrally provided with flanges 22a and 22a having a larger diameter than the intermediate part in the axial direction, and the insulating substrate 21 is sandwiched between the flanges 22a at both ends. Thus, the conductive elastic body 22 is held on the insulating substrate 21. In the vicinity of the central axis of the conductive elastic body 22, a round hole-like through hole 23 that penetrates the conductive elastic body 22 in the axial direction is formed. On the inner side surface of the through hole 23, Fitting grooves 24 and 24 (fitting means) in which bumps 13 (conductive connection portions) of circuit boards 1A and 1B, which will be described later, are concavo-convex fitted are formed. That is, the conductive elastic body 22 is provided with fitting grooves 24 for engaging with bumps 13 (conductive connection portions) of the circuit boards 1A and 1B at both ends, and both ends are exposed on both sides. The bumps 13 can be connected to the fitting grooves 24 at both ends from both sides in the thickness direction of the insulating substrate 21.

  Further, as shown in FIGS. 2 and 3, the circuit boards 1 </ b> A and 1 </ b> B are arranged in two rows along the width direction on the substrate 11 formed of an insulating material such as glass epoxy resin and one end of the surface of the substrate 11. And a plurality of daruma-shaped conductive patterns 12 provided. Each conductive pattern 12 is provided with umbrella-shaped bumps (so-called mushroom bumps) 13 and through holes 14 on both sides, and electrically connected to the conductive patterns 15 formed on the back surface of the substrate 11 through the through holes 14. Has been.

  Each bump 13 is formed of a metal material (for example, copper) having good conductivity and relatively hard, and as shown in FIG. 3C, a columnar shaft portion 16 erected from the conductive pattern 12, and a shaft It consists of a disk-shaped umbrella portion 17 provided at the tip of the portion 16, and is formed on the substrate 11 integrally with the conductive pattern 12. The diameters of the shaft portion 16 and the umbrella portion 17 of the bump 13 and the height of the bump 13 are determined when the bump 13 is inserted into the fitting groove 24 of the conductive elastic body 22 described above. The size is set such that the umbrella portion 17 is caught by the elastic pressure in the fitting groove 24 and is not easily removed from the fitting groove 24.

  The circuit boards 1A and 1B and the connection board 2 have the above-described configuration. When the circuit boards 1A and 1B are connected via the connection board 2, bumps 13 are formed. When the circuit board 1A is arranged with the surface facing upward, when the connection holes 2 are brought close to the circuit board 1A by aligning the positions of the through holes 23 of the conductive elastic body 22 and the bumps 13, the bumps 13 of the circuit board 1A are formed. The conductive elastic body 22 is inserted into the through hole 23 from below. Thereafter, when the connecting board 2 is further pushed into the circuit board 1A side, the umbrella portion 17 of the bump 13 is fitted into the fitting groove 24 provided on the inner surface of the through hole 23, and the elastic force of the conductive elastic body 22 is used. The bumps 13 and the fitting grooves 24 are unevenly fitted, whereby the connection board 2 is mechanically connected to the circuit board 1A. Next, when the circuit board 1B is connected to the connection board 2, the positions of the through holes 23 of the conductive elastic body 22 and the bumps 13 are aligned with the surface on which the bumps 13 are formed facing downward. Is brought closer to the connection substrate 2, the bumps 13 of the circuit board 1 </ b> B are inserted into the through holes 23 of the conductive elastic body 22 from the upper side. Thereafter, when the circuit board 1B is further pushed into the connection board 2, the umbrella portion 17 of the bump 13 is fitted into the fitting groove 24 provided on the inner side surface of the through hole 23, and the elastic force of the conductive elastic body 22 causes the bump. The circuit board 1 </ b> B is mechanically connected to the connection board 2 by the concave and convex fitting 13 and the fitting groove 24 (see FIG. 1). The bumps 13 of the two circuit boards 1A and 1B are formed by fitting the fitting grooves 24 provided at both ends of the conductive elastic body 22 held by the insulating board 21 to the bumps 13 of the circuit boards 1A and 1B. Since it is electrically connected via the conductive elastic body 22, the bump 13 and the conductive elastic body 22 are compared with the case of using a contact formed in a complicated three-dimensional shape like a conventional inter-board connector. There is an effect that it is easy to reduce the height and the density of the portion where the concave and convex portions are fitted. Further, at this time, the umbrella portion 17 of the bump 13 provided on both the circuit boards 1A and 1B engages with the fitting groove 24 and is caught by the small diameter portion of the opening end of the through hole 23, so that it is difficult to remove the bump 13. It is possible to prevent the bump 13 from being easily detached from the conductive elastic body 22. In addition, the conductive elastic body 22 is formed by mixing a conductive material such as silver or copper with silicone rubber. Since the conductive elastic body 22 itself has conductivity, the bumps 13 and 13 are interposed between the conductive elastic bodies 22. It will be electrically connected. Since the conductive elastic body 22 itself that mechanically holds the bumps 13 and 13 of both circuit boards 1A and 1B has conductivity, the connection substrate 2 that holds the conductive elastic body 22 has the bump 13 and It is not necessary to form a circuit for conducting between 13 and the electrical connection between the bump 13 and the conductive elastic body 22 no matter where the bump 13 is fitted in the conductive elastic body 22. Can be maintained.

  On the other hand, when the circuit boards 1A and 1B are removed from the connection board 2, when the circuit boards 1A and 1B are pulled away from each other, the bumps 13 provided on one of the circuit boards 1A and 1B become conductive elastic bodies. Accordingly, one circuit board can be removed from the connection board 2. Thereafter, when the other of the circuit boards 1A and 1B and the connection board 2 are pulled away from each other, the bumps 13 provided on the circuit board are removed from the fitting grooves 24 of the conductive elastic body 22, and thus the connection board. The other circuit board can be removed from 2. As described above, in this embodiment, the bumps 13 of the circuit boards 1A and 1B are fitted into the fitting grooves 24 of the conductive elastic body 22 held on the connection board 2 so that the two circuit boards 1A and 1B are fitted. Since it is connected to the connection board 2, the circuit boards 1 A and 1 B can be easily detached from the connection board 2 simply by pulling the circuit boards 1 A and 1 B away from the connection board 2.

  In the present embodiment, the circuit boards 1A and 1B are electrically and mechanically connected to each other by the connection board 2. However, each circuit board 1A and 1B is connected to a parent board (not shown) such as a flexible board. In this case, the circuit board 1A, 1B and the connection board 2 may be used to electrically and mechanically connect the two parent boards.

(Embodiment 2)
A second embodiment of the present invention will be described with reference to FIG. In addition, the same code | symbol is attached | subjected to the same component as the board | substrate connection connector of Embodiment 1, the description is abbreviate | omitted, and the characteristic part of this embodiment is demonstrated below.

  In the first embodiment, the bumps 13 are formed on both of the two circuit boards 1A and 1B, whereas in the present embodiment, the bumps (so-called mushroom bumps) 13 are formed only on one circuit board 1A, and the other In the circuit board 1B, a plurality of through holes 11a are formed at positions overlapping with the plurality of bumps 13 provided on the circuit board 1A in the thickness direction, and through plating is applied to the inner side surface of each through hole 11a. A hole 19 is formed.

  On the other hand, the connection substrate 2 is formed in a cylindrical shape by a conductive rubber (for example, a mixture of silicone rubber and silver or copper) on a rectangular plate-like insulating substrate 21 made of an insulating material such as polyimide resin. The insulating substrate 21 and the conductive elastic body 22 are integrally formed by insert molding a plurality of conductive elastic bodies 22.

  A plurality of through holes 21a are formed in the insulating substrate 21 in two rows along the longitudinal direction, and a conductive elastic body 22 is held in each through hole 21a. A fitting hole 25 that is recessed in a round hole shape is formed on one end side (circuit board 1A side) in the axial direction of the conductive elastic body 22, and the umbrella portion 17 of the bump 13 is uneven on the inner side surface of the fitting hole 25. A fitting groove 24 to be fitted is formed. On the other hand, on the other end side in the axial direction of the conductive elastic body 22, a fitting protrusion 26 is provided that is cylindrical and has a tapered tip. The outer diameter of the fitting protrusion 26 is set to be slightly larger than the inner diameter of the through hole 19 provided in the circuit board 1B, and the tip surface of the fitting protrusion 26 is a tapered surface that tapers toward the tip side. 27 is formed. A fitting groove 28 into which the through hole 19 is fitted is formed in a portion of the fitting protrusion 26 that is below the tapered surface 27 (on the insulating substrate 21 side). The outer diameter of the flange 22a and the fitting protrusion 26 provided on one end side in the axial direction of the conductive elastic body 22 is set to be larger than the inner diameter of the through hole 21a. The conductive elastic body 22 is held on the insulating substrate 21 by sandwiching the insulating substrate 21 between the flange portion 22 a and the fitting protrusion 26.

  Here, the attaching / detaching operation of the inter-board connector A of the present embodiment will be described below. When connecting the two circuit boards 1A and 1B via the connection board 2, the through hole of the conductive elastic body 22 is disposed with the circuit board 1A disposed with the surface on which the bumps 13 are formed facing upward. When the connecting substrate 2 is brought close to the circuit board 1A by aligning the positions of the bumps 23 and the bumps 13, the bumps 13 of the circuit board 1A are inserted into the through holes 23 of the conductive elastic body 22 from below. Thereafter, when the connecting board 2 is further pushed into the circuit board 1A side, the umbrella portion 17 of the bump 13 is fitted into the fitting groove 24 provided on the inner surface of the through hole 23, and the elastic force of the conductive elastic body 22 is used. The bumps 13 and the fitting grooves 24 are unevenly fitted, whereby the connection board 2 is mechanically connected to the circuit board 1A. Next, when the circuit board 1B is connected to the connection board 2, when the circuit board 1B is brought close to the connection board 2 by aligning the positions of the fitting protrusions 26 of the conductive elastic body 22 and the through holes 19, the circuit board 1B. The fitting protrusion 26 of the conductive elastic body 22 is inserted into the through hole 19. Here, since the tapered surface 27 having a smaller diameter toward the distal end side is formed at the distal end portion of the fitting projection 26, the fitting projection 26 can be easily inserted into the through hole 19, and further, the circuit board. When 1B is pushed into the connection board 2 side, the circuit board 1B moves to a position where the through hole 19 of the circuit board 1B fits into the fitting groove 28 of the conductive elastic body 22, so that the through hole 19 is fitted into the fitting groove. By being caught by the edge of 28, the circuit board 1B is prevented from being detached from the connection board 2, and the circuit board 1B is mechanically connected to the connection board 2 (see FIG. 6).

  On the other hand, when the circuit boards 1A and 1B are removed from the connection board 2, if the circuit boards 1A and 1B are pulled away from each other, the bumps 13 provided on one circuit board 1A of the circuit boards 1A and 1B are formed. Since the fitting protrusion 26 of the conductive elastic body 22 is removed from the fitting groove 24 of the conductive elastic body 22 or from the through hole 19 provided in the other circuit board 1B, the circuit board 1A, 1B One can be removed from the connection substrate 2. Thereafter, when the other of the circuit boards 1A and 1B is pulled away from the connection board 2, the other circuit board and the connection board 2 are disengaged. Can be removed.

  As described above, in this embodiment, the bumps 13 of the circuit board 1 </ b> A are concavo-convexly fitted into the fitting groove 24 provided on one end side in the axial direction of the conductive elastic body 22, and the other end side in the axial direction of the conductive elastic body 22. Since the circuit board 1A and 1B are connected to the connection board 2 by engaging the fitting protrusion 26 provided on the board with the through hole 19 of the circuit board 1B, the circuit board 1B is complicated like a conventional inter-board connector. Compared to the case where contacts formed in a three-dimensional shape are used, it is easy to reduce the height and increase the density of the portion where the conductive elastic body 22 and the conductive connection portion (bump 13 and through-hole 19) are unevenly fitted. Moreover, the circuit boards 1A and 1B can be easily detached from the connection board 2 simply by pulling the circuit boards 1A and 1B away from the connection board 2.

  Further, the bump 13 provided on one circuit board 1A is inserted into the fitting groove 24 of the conductive elastic body 22, whereby the bump 13 and the conductive elastic body 22 are electrically and mechanically connected. Therefore, when the umbrella-shaped bump 13 is caught in the fitting groove 24, it is difficult to remove the bump 13 and the reliability of electrical connection can be improved. Similarly, since the through hole 19 provided in the other circuit board 1B is engaged with the fitting groove 28 provided in the outer peripheral surface of the fitting protrusion 26, the circuit board 1B is easily detached from the connection board 2. Can be prevented.

  Further, since the conductive elastic body 22 itself has conductivity, the conductive connection portions of both circuit boards 1A and 1B are electrically connected to the insulating substrate 21 holding the conductive elastic body 22. There is no need to provide a means, the configuration of the insulating substrate 21 can be simplified, and the conductive elastic body 22 and the bump 13 can be easily connected to the bump 13 or the through hole 19 at any position. In addition, electrical connection with the through hole 19 can be secured. .

  The other circuit board 1B is electrically and mechanically connected between the through hole 19 and the conductive elastic body 22 by fitting the fitting protrusion 26 of the conductive elastic body 22 into the through hole 19. Therefore, the bump 13 can be easily attached as compared with the case where the bump 13 is fitted into the fitting groove 24. Further, the bump 13 is not formed on the other circuit board 1B, but only the through hole 19 is formed. Therefore, the number of steps for producing the substrate can be reduced and the manufacturing cost can be reduced. By shortening the distance between 1A and 1B, it is possible to reduce the height of the connector.

(Embodiment 3)
A third embodiment of the present invention will be described with reference to FIG. In addition, the same code | symbol is attached | subjected to the same component as the board | substrate connection connector of Embodiment 1, the description is abbreviate | omitted, and the characteristic part of this embodiment is demonstrated below.

  In the first embodiment, the bumps 13 are formed on both of the two circuit boards 1A and 1B, whereas in the present embodiment, a plurality of penetrations penetrating the board 11 in the thickness direction are provided in both the circuit boards 1A and 1B. The holes 11a are provided in two rows along the width direction of the substrate 11, and a plurality of through holes 19 are formed by applying conductive plating 18 to the inner surface of each through hole 11a.

  On the other hand, the connection substrate 2 is formed in a cylindrical shape by a conductive rubber (for example, a mixture of silicone rubber and silver or copper) on a rectangular plate-shaped insulating substrate 21 made of an insulating material such as polyimide resin. The insulating substrate 21 and the conductive elastic body 22 are integrally formed by insert molding a plurality of conductive elastic bodies 22.

  A plurality of through holes 21a are formed in the insulating substrate 21 in two rows along the longitudinal direction, and a conductive elastic body 22 is held in each through hole 21a. On both ends of the conductive elastic body 22 in the axial direction, fitting protrusions 26 and 26 each having a cylindrical shape and a tapered tip are provided. The outer diameter of each fitting protrusion 26 is set to be slightly larger than the inner diameter of the through hole 19 provided in the circuit board 1B, and the tip of the fitting protrusion 26 is tapered so as to be tapered toward the tip. A surface 27 is formed. A fitting groove 28 into which the through hole 19 is fitted is formed in a portion of the fitting protrusion 26 that is below the tapered surface 27 (on the insulating substrate 21 side). Since the outer diameters of the fitting protrusions 26 and 26 are set to be larger than the inner diameter of the through hole 21a of the insulating substrate 21, the insulating substrate 21 is sandwiched between the fitting protrusions 26 and 26 on both sides. Thus, the conductive elastic body 22 is held on the insulating substrate 21.

  Here, the attaching / detaching operation of the inter-board connector A of the present embodiment will be described below. When connecting the two circuit boards 1A and 1B through the connection board 2, the position of the fitting protrusions 26 on the lower side of the conductive elastic body 22 and the through holes 19 are aligned and the upper side of the circuit board 1A. When the connection board 2 is brought close to the circuit board 1 </ b> A, the lower fitting protrusion 26 is inserted into the through hole 19. Here, since the tapered surface 27 having a smaller diameter toward the distal end side is formed at the distal end portion of the fitting projection 26, the fitting projection 26 can be easily inserted into the through hole 19, and then further the circuit. When the board 1A is pushed into the connection board 2 side, the circuit board 1A moves to a position where the through hole 19 of the circuit board 1A fits into the fitting groove 28 of the fitting projection 26, so that the through hole 19 becomes the fitting groove. By being caught by the edge of 28, the circuit board 1A is prevented from being detached from the connection board 2, and the circuit board 1A is mechanically connected to the connection board 2.

  Next, when the circuit board 1B is connected to the connection board 2, the circuit board 1B is connected from the upper side of the connection board 2 by aligning the fitting protrusions 26 on the upper side of the conductive elastic body 22 with the through holes 19. When approaching the circuit board 2, the upper fitting protrusion 26 is inserted into the through hole 19 of the circuit board 1 </ b> B. Thereafter, when the circuit board 1B is further pushed into the connection board 2 side, the circuit board 1B moves to a position where the through hole 19 of the circuit board 1B fits into the fitting groove 28 of the conductive elastic body 22, and therefore the through hole When 19 is caught by the edge of the fitting groove 28, the circuit board 1B is prevented from being detached from the connection board 2, and the circuit board 1B is mechanically connected to the connection board 2 (see FIG. 7). .

  At this time, the through hole 19 provided in one circuit board 1A engages with the fitting groove 24 provided in the lower fitting protrusion 26, and the through hole 19 provided in the other circuit board 1B is engaged with the upper fitting. Since it engages with the fitting groove 28 provided in the mating protrusion 26, it is possible to prevent the circuit boards 1A and 1B from being easily detached from the connection board 2. Further, since the conductive elastic body 22 itself has conductivity, the through holes 19 and 19 of both the circuit boards 1A and 1B are electrically connected via the conductive elastic body 22. . Since the conductive elastic body 22 itself that mechanically holds the through holes 19 and 19 of both circuit boards 1A and 1B has conductivity, the connection board 2 that holds the conductive elastic body 22 has a through hole. It is not necessary to form a circuit for conducting between the holes 19 and 19, and no matter what position the through holes 19 and 19 of the circuit boards 1A and 1B are in contact with the conductive elastic body 22, the through hole 19 , 19 and the conductive elastic body 22 can be maintained.

  On the other hand, when the circuit boards 1A and 1B are removed from the connection board 2, if the circuit boards 1A and 1B are pulled away from each other, a conductive elastic body is formed from the through hole 19 provided in either of the circuit boards 1A and 1B. Thus, one of the circuit boards 1 </ b> A and 1 </ b> B can be removed from the connection board 2. Thereafter, when the other of the circuit boards 1A and 1B is pulled away from the connection board 2, the fitting protrusions 26 of the conductive elastic body 22 are removed from the through holes 19 provided in the board. The other of 1B can be removed from the connection substrate 2.

  As described above, in the present embodiment, by fitting the fitting protrusions 26 provided on both sides in the axial direction of the conductive elastic body 22 with the through holes 19 of the circuit boards 1A and 1B, the both circuit boards 1A and 1B are fitted. Since it is connected to the connection substrate 2, the conductive elastic body 22 and the conductive connection portion (through hole 19) are compared with the case where a contact formed in a complicated three-dimensional shape like a conventional inter-board connection connector is used. It is easy to reduce the height and density of the part where the concave and convex portions are fitted, and the circuit boards 1A and 1B can be easily removed from the connection board 2 simply by pulling the circuit boards 1A and 1B away from the connection board 2. Can be removed.

  Further, the circuit boards 1A and 1B are electrically and mechanically connected between the through hole 19 and the conductive elastic body 22 by fitting the fitting protrusions 26 of the conductive elastic body 22 into the through hole 19. Therefore, the bump 13 can be easily attached as compared with the case where the bump 13 is fitted into the fitting groove 24. Further, since bumps are not formed on the circuit boards 1A and 1B, but only through holes 19 are formed, it is possible to reduce the manufacturing cost by reducing the number of board preparation steps, and the board 1A The distance between 1B can be shortened to reduce the height of the connector.

FIG. 3 is a cross-sectional view of a main part showing the inter-board connector according to Embodiment 1. It is an external appearance perspective view of the circuit board which comprises the same. The circuit board which comprises the same is shown, (a) is a top view, (b) is a side view, (c) is B-B 'sectional drawing. It is an external appearance perspective view of the board for connection which constitutes the same. The connection board | substrate which comprises the same is shown, (a) is a top view, (b) is sectional drawing seen from the right side, (c) is sectional drawing seen from the lower side, (d) is the C section enlarged view. . FIG. 6 is a cross-sectional view of a main part showing an inter-board connector according to Embodiment 2. FIG. 10 is a cross-sectional view of a main part showing an inter-board connector according to Embodiment 3.

Explanation of symbols

A board-to-board connector 1A, 1B circuit board 2 board for connection 11 board 12 conductive pattern 13 bump 21 insulating board 22 conductive elastic body 23 through hole 24 fitting groove

Claims (4)

  A connection board for electrically and mechanically connecting between two circuit boards is provided, and the connection board is formed in a column shape by conductive rubber and is fitted to fit into the conductive connection portion of each circuit board. A conductive elastic body provided with coupling means at both ends in the axial direction, and an insulating substrate that holds the conductive elastic body in a state where both ends of the conductive elastic body are exposed on both side surfaces. A board-to-board connector.   The conductive connection portions provided on the two circuit boards are each formed of an umbrella-shaped bump, and the fitting means provided on both ends of the conductive elastic body are opposed to the bumps of the respective circuit boards. The board-to-board connector according to claim 1, wherein the board-to-board connector is provided with a fitting recess provided in a part to be fitted and into which a bump is fitted.   Of the two circuit boards, the conductive connection portion provided on one of the circuit boards is an umbrella-shaped bump, and the conductive connection portion provided on the other circuit board is an inner surface of a through-hole penetrating the circuit board. Of the fitting means provided at both ends of the conductive elastic body, the fitting means connected to the bump of the one circuit board is formed at a portion facing the bump. The fitting means, which is provided with a fitting recess to be fitted into the bump and is connected to the through hole of the other circuit board, has a tapered shape and is fitted into the through hole. The board-to-board connector according to claim 1, comprising:   The conductive connection portions provided on the two circuit boards are each formed of a through hole in which conductive plating is applied to the inner side surface of the through hole penetrating each circuit board, and the fittings provided at both ends of the conductive elastic body. 2. The board-to-board connector according to claim 1, wherein each of the coupling means includes a fitting protrusion formed in a tapered shape and fitted into the through hole.

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