JP2015220086A - Multi-contact connector - Google Patents

Abstract

PROBLEM TO BE SOLVED: To resolve a problem that a multi-contact connector capable of flattening many connection terminals by a simple configuration and of securing the reliability and safety of connection is desired as a multi-contact connector for connecting a semiconductor device and the like with a motherboard.SOLUTION: A multi-contact connector consists of: a first frame molded by a resin and that has a plurality of through-holes at a predetermined interval; a first connector into which a plurality of metal pins are inserted so that projections are provided above and under the through-holes of the first frame; a second frame that has a plurality of through-holes at a predetermined interval; and a second connector that is inserted into the through-holes of the second frame, that has uniform elasticity in a circumferential direction, and that has a metal pin holding member.

Description

  The present invention relates to a multi-contact connector used for connection of circuit boards and semiconductor devices, and more particularly to a small and highly reliable multi-contact connector.

  In recent years, a multi-contact connector for connecting a circuit board to a motherboard or connecting a BGA (Ball Grid Array) type semiconductor device to the motherboard has been widely used.

  These flat mount type multi-point connectors are designed so that the lead member extending from the frame is aligned with the electrode pattern of the circuit board or the mother board, and the soldering part of the lead member is not attached when soldering is performed. It is necessary to flatten it so that it may be on the same plane. However, in the case of a multi-contact connector in which a plurality of through holes are provided in a frame made of resin molding and a plurality of metal pins and pin holding members are inserted and fixed in the through holes, the multi-contact connector extends from the frame due to residual strain generated in the manufacturing process. The lead member is bent, and it is difficult to flatten the lead member when it is attached to the electrode pattern of the circuit board or the mother board by soldering. In such a multi-contact connector, it has been proposed to realize flattening in a state where a lead member is soldered to an electrode pattern of a circuit board or a mother board. (For example, Patent Document 1)

  A description will be given below of flattening in the state where the lead member of the conventional multi-contact connector is soldered to the electrode pattern of the circuit board or the mother board. 1 to 4 of Patent Document 1 are pins in a multi-contact connector in which a plurality of pin contacts (metal pins) are inserted into through holes of an insulating housing (frame) which is resin-molded and has a plurality of through holes at predetermined intervals. A configuration is described in which a header (insertion-side connector) is positioned and fixed to a printed wiring board (motherboard). That is, in the configuration of Patent Document 1, a metal plating layer is formed from the inner wall surface of the through hole of the insulating housing of the resin molded body constituting the pin header to the mounting surface and the top surface, and this metal plating layer is used as a lead member for printed wiring. The conductive pattern provided on the substrate is soldered and fixed in position.

  Further, FIG. 5 and FIG. 6 of Patent Document 1 describe a configuration of a socket connector (receiving side connector) that cooperates with the pin header. That is, in FIG. 5 and FIG. 6, the socket contact is provided with a bifurcated contact member made of a conductive metal plate corresponding to the pin contact, and the pin contact is sandwiched between the pin contacts when the multi-contact connector is connected. It comes to be connected.

JP-A-7-169539

  The multi-contact connector described in Patent Document 1 is a metal plating layer formed around a through hole of an insulating housing as a lead member for soldering and fixing a pin header to a conductive pattern provided on a printed wiring board. Therefore, there is no warping or bending compared to a conventional lead member obtained by processing a metal plate, and positioning and fixing by soldering is performed in a flattened manner.

  However, forming a metal plating layer from the inner wall surface of the through hole of the insulating housing of the resin molded body to the mounting surface and the top surface requires a considerable number of processing steps and increases the manufacturing equipment size, which increases the cost. There's a problem. In addition, a bifurcated contact member made of a conductive metal plate is provided corresponding to the pin contact as a structure of the socket connector, and the bifurcated contact member is sandwiched and connected when the multi-contact connector is coupled and connected. However, in this contact structure, since the contact between the pin contact and the bifurcated contact member is a point contact at two locations, the contact is unstable with respect to an impact, and there is a risk that a contact failure may occur during operation.

  SUMMARY OF THE INVENTION An object of the present invention is to solve the above problems, and provide a multi-contact connector that can flatten a large number of connection terminals with a simple configuration and can ensure connection reliability and safety. That is.

  In order to achieve the above object, the multi-contact connector according to the present invention has a resin-molded first frame having a plurality of through holes at predetermined intervals, and protrusions above and below the through holes of the first frame. A first connector having a plurality of metal pins inserted therein, a second frame having a plurality of through holes at predetermined intervals, and a uniform elasticity in the circumferential direction inserted in the through holes of the second frame, It consists of a 2nd connector which has a metal pin holding member.

  According to the above configuration, the plurality of metal pins are inserted so as to have the protruding portions above and below the through holes of the first frame that is resin-molded and has the plurality of through holes at predetermined intervals, and the protruding portions of the plurality of metal pins By directly soldering to the wiring electrode of the motherboard, the positioning and fixing are made flat, and the elasticity of the metal pin holding member inserted into the through hole of the second frame is uniformly directed from the circumferential direction toward the center. By having it, connection reliability and safety can be secured.

  The second frame may be formed of an elastic member, and the pin holding member may be elastic in the circumferential direction by the elasticity of the second frame.

  According to the above configuration, since the pin holding member of the second connector is elastically held by the elastic member of the second frame, even if there is a slight shift in the mounting position of the first connector and the second connector, It is absorbed by the elastic member of two frames, and can be safely assembled as a multi-contact connector.

  A connection electrode provided on the mounting board may be electrically directly connected to the non-insertion side of each metal pin of the first connector and the non-insertion side of each pin holding member of the second connector.

  According to the above configuration, since the protruding portions of the first connector and the second connector also serve as lead terminals and serve as mounting terminals to the wiring electrodes of the motherboard, the mounting position is flattened and the configuration is simplified. Thus, the manufacturing cost can be reduced.

  As described above, according to the present invention, a plurality of metal pins are inserted so as to have protrusions above and below the through holes of the first frame that are resin-molded and have a plurality of through holes at predetermined intervals. By directly soldering the projecting portion of the wire to the wiring electrode of the motherboard, the positioning and fixing are performed flat, and the metal pin holding member inserted into the through hole of the second frame is uniformly centered from the circumferential direction. Provided is a multi-contact connector capable of ensuring the reliability and safety of connection by imparting elastic properties.

It is a top view which shows the 1st connector in 1st Embodiment of the multi-contact connector of this invention. It is AA sectional drawing of the 1st connector shown in FIG. It is a top view which shows the 2nd connector in 1st Embodiment of the multi-contact connector of this invention. It is AA sectional drawing of the 2nd connector shown in FIG. It is a perspective view of the pin holding member of the metal pin of the 1st connector and the 2nd connector. It is sectional drawing in the 1st Embodiment of the multi-contact connector of this invention before the 1st connector and the 2nd connector are assembled. FIG. 7 is a cross-sectional view of the multi-contact connector shown in FIG. 6 after the first connector and the second connector are assembled. It is sectional drawing before the connection which shows the mounting state of the 1st connector and mounting board in 1st Embodiment of the multi-contact connector of this invention. It is sectional drawing which shows the mounting state of the 1st connector and mounting board which are shown in FIG. It is sectional drawing before the connection which shows the mounting state of the 2nd connector and motherboard in 1st Embodiment of the multi-contact connector of this invention. It is sectional drawing which shows the mounting state of the 2nd connector shown in FIG. 10, and a motherboard. It is sectional drawing in the board | substrate mounting state of the multi-contact connector in 1st Embodiment of this invention. It is a top view which shows the 1st connector in 2nd Embodiment of the multi-contact connector of this invention. It is AA sectional drawing of the 1st connector shown in FIG. It is a top view which shows the 2nd connector in 2nd Embodiment of the multi-contact connector of this invention. It is AA sectional drawing of the 2nd connector shown in FIG. FIG. 16 is an enlarged plan view of the pin holding member (point circle S portion) shown in FIG. 15. It is sectional drawing of the pin holding member shown in FIG. It is sectional drawing before the assembly of the 1st connector and the 2nd connector in 2nd Embodiment of the multi-contact connector of this invention. FIG. 20 is a cross-sectional view of the multi-contact connector shown in FIG. 19 after the first connector and the second connector are assembled. It is sectional drawing before the connection in the board | substrate mounting state of the multi-contact connector in 2nd Embodiment of this invention. It is sectional drawing in the board | substrate mounting state of the multi-contact connector in 2nd Embodiment of this invention.

(First embodiment)
The configuration of the multi-contact connector according to the first embodiment of the present invention will be described below with reference to the drawings.
FIGS. 1-12 shows the structure and each component of the multi-contact connector 100 in 1st Embodiment. FIG. 1 is a plan view of the first connector 10 constituting the multi-contact connector 100, and FIG. 2 is a cross-sectional view taken along line AA of the first connector 10 shown in FIG. The first connector 10 is provided with a plurality of through holes 12 at predetermined intervals in a resin-molded first frame 11, and a plurality of metal pins 13 are inserted into the plurality of through holes 12. As for the pin 13, the lead part 13a is formed in the upper surface side of the through-hole 12 in the 1st flame | frame 11, and the connector pin 13b is formed in the lower surface side of the through-hole 12 as a protrusion part, respectively. Further, an insertion inclined portion 13c for guiding insertion is provided at the tip of the connector pin 13b.

3 is a plan view of the second connector 20 constituting the multi-contact connector 100, and FIG. 4 is a cross-sectional view taken along the line AA of the second connector 20 shown in FIG. The second connector 20 is provided with a plurality of through holes 22 at predetermined intervals in a resin-molded second frame 21, and a plurality of metal pin holding members 23 are inserted into the plurality of through holes 22. Each pin holding member 23 has an insertion port 23 a on the upper surface side of the through hole 22 in the second frame 21, a jaw portion 23 b around the insertion port 23 a, and a lead portion 23 c on the lower surface side of the through hole 22. Are formed as protrusions. In the present embodiment, the second frame 21 is made of an elastic member made of an elastic resin material, and the pin holding member 23 is made by drawing a metal plate material as will be described later, and the insertion slot side becomes narrower. It has a shape and is configured to give elasticity in the circumferential direction to the connector pin 13b of the first connector 10 to be inserted.

FIG. 5 is a perspective view of the metal pin 13 in the first connector 10 and the pin holding member 23 in the second connector 20. The upper non-insertion side of the metal pin 13 is a lead portion 13a. The tip of 13b serves as an insertion inclined portion 13c.
In addition, an upper portion of the pin holding member 23 has an insertion port 23a, a jaw portion 23b, and a plurality of slits 23d provided between the jaw portions 23b, and a lower surface side serves as a lead portion 23c. That is, the shape of the pin holding member 23 is drawn so that the lead portion 23c has a large diameter on the lower surface side and the shape of the insertion port 23a on the upper surface side has a small diameter.

  Accordingly, when the metal pin 13 is inserted from the insertion inclined portion 13c through the upper insertion opening 23a of the pin holding member 23, the pin holding member 23 receives the insertion pressure of the metal pin 13 and opens the slit 23d, whereby the pin holding member The connector pin 13b of the metal pin 13 is inserted into 23 and connected. In this state, an elastic force is applied to the connector pin 13b in the circumferential direction by the restoring force of the slit 23d of the pin holding member 23. In the present embodiment, the number of the slits 23d is four. However, the number of the slits 23d is not limited to this. The elastic force in the circumferential direction can be applied, and the contact between the pin holding member 23 and the connector pin 13b, that is, the contact as a connector can be stabilized.

  Next, FIGS. 6 and 7 show the configuration of the multi-contact connector 100, and the connection state between the first connector 10 and the second connector 20 constituting the multi-contact connector 100 will be described. FIG. 6 shows a state before the first connector 10 and the second connector 20 are joined in the multi-contact connector 100, and FIG. 7 shows a state where the first connector 10 and the second connector 20 are joined. In FIG. 6, the first connector 10 shown in FIG. 2 and the second connector 20 shown in FIG. 4 are aligned before insertion. FIG. 7 shows a coupling state of the first connector 10 and the second connector 20. As the coupling operation, the position of the insertion inclined portion 13 c in each metal pin 13 of the first connector 10 in FIG. Is positioned in the insertion port 23a.

  When the metal pin 13 of the first connector 10 is inserted into the insertion port 23a of the second connector 20 from this state, the insertion port 23a of the second connector 20 is opened by the slit 23d due to the inclination of the insertion inclined portion 13c. As the pins 13b are inserted, the connector pins 13b of the first connector 10 are brought into close contact with the inner periphery of the second connector 20, and the multi-contact connector 100 shown in FIG. The slit 23d of the second connector 20 in this state spreads in the peripheral direction, but strong elasticity is given in the circumferential direction by the deformation of the second frame 21 made of an elastic material, and a strong contact force with the connector pin 13b is obtained.

Next, a method for attaching the first connector 10 and the second connector to the connection electrode provided on the mounting board such as the mother-ode and the circuit board will be described with reference to FIGS.

8 and 9 show a method of attaching the first connector 10 to the circuit board 50 on which the electronic element 51 is mounted. FIG. 8 shows a state before attachment, and FIG. 9 shows a state after attachment. In FIG. 8, the lead portions 13 a of the metal pins 13 of the first connector 10 are aligned and set on the connection electrodes 52 provided on the circuit board 50.
Next, as shown in FIG. 9, the first connector 10 and the circuit board 50 are used for heat treatment by sandwiching the solder paste 52 for bonding between the connection electrodes 52 of the circuit board 50 and the lead portions 13a of the respective metal pins 13. And joining.

10 and 11 show how to attach the second connector 20 to the mother board 60. FIG. 10 shows a state before the attachment, and FIG. 11 shows a state after the attachment. In FIG. 10, each lead portion 23 b of the pin holding member 23 of the second connector 20 is positioned and set on the connection electrode 62 provided on the mother board 60.
Next, as shown in FIG. 11, the second connector 20 and the mother board are obtained by performing the heat treatment by sandwiching the solder paste 5 for bonding between the connection electrodes 62 of the mother board 60 and the lead portions 23 c of the pin holding members 23. Joining with 60 is performed.

  As described above, one of the features of the present invention is that the upper end surface of the metal pin 13 in the first connector 10 is connected to the connection electrode 52 of the circuit board 50 as the lead portion 13c, and the pin holding member 23 of the second connector 20 is connected. That is, the lower end surface is connected to the connection electrode 62 of the mother board 60 as the lead portion 23c. In this way, a part (end surface) of the connection member such as the metal pin 13 or the pin holding member 23 constituting each connector is directly connected to the connection electrode of the board member such as the circuit board 50 or the mother board 60 as a lead member. As a result, the mounting position accuracy is improved, a lead member as a separate member as in the prior art is not required, and a complicated plating process as in Patent Document 1 is not required, which is advantageous in terms of position accuracy and manufacturing cost. It becomes.

  Next, the connection of the circuit board 50 to the mother board 60 by joining the first connector 10 to which the circuit board 50 on which the electronic element 51 is mounted and the second connector 20 attached to the mother board 60 will be described with reference to FIG. To do. By inserting each metal pin 13 of the first connector 10 to which the circuit board 50 on which the electronic element 51 is mounted is inserted into each pin holding member 23 of the second connector 20 attached to the motherboard 60, the electronic element 51 becomes the motherboard. 60 connection electrodes 62 are electrically connected. At this time, the connection between the first connector 10 and the second connector 20 is performed by the contact of the connector pin 13b with the inner wall of the pin holding member 23 by the slit 23d of the pin holding member 23 and an elastic member as described in FIG. The second frame 21 is brought into close contact with the deformation.

(Second Embodiment)
Next, the multi-contact connector according to the second embodiment of the present invention will be described with reference to FIGS. 13 to 18 show the configuration of the multi-contact connector 200 and each component in the second embodiment. 13 is a plan view of the first connector 30 constituting the multi-contact connector 200, FIG. 14 is a cross-sectional view taken along line AA of the multi-contact connector 200 shown in FIG. 13, and the basic configuration of the first connector 30 is shown in FIG. This is the same as the first connector 10 of the multi-contact connector 100 shown in FIG. The difference between the first connector 30 of the multi-contact connector 200 and the first connector 10 of the multi-contact connector 100 is that the metal pin 33 constituting the first connector 30 of the multi-contact connector 200 is different from the first connector 10 of the multi-contact connector 100. Is the same shape as that of the metal pin 13 that constitutes, but the thickness is slightly reduced. That is, the material and shape of the first frame 31 and the center position of the through hole 32 are the same as those of the first frame 11, but the diameter of the through hole 32 is small and the diameter of the inserted metal pin 33 is also small. . This is because the diameter of the metal pin 33 is slightly reduced corresponding to the shape of the second connector 40 of the multi-contact connector 200 described later.

  14 is a cross-sectional view taken along line AA of the first connector 30 shown in FIG. A plurality of through holes 32 are provided at predetermined intervals in the resin-molded first frame 31, and a plurality of metal pins 33 are inserted into the plurality of through holes 32. Lead portions 33a are formed on the upper surface side of the through holes 32 in the frame 31, and connector pins 33b are formed on the lower surface side of the through holes 32 as protruding portions. Further, an insertion inclined portion 33c for guiding insertion is provided at the tip of the connector pin 33b.

  15 is a plan view of the second connector 40 constituting the multi-contact connector 200, and FIG. 16 is a cross-sectional view taken along line AA of the second connector 40 shown in FIG. The second connector 40 is provided with a plurality of through holes 42 at predetermined intervals in a resin-molded second frame 41, and a plurality of metal pin holding members 43 are inserted into the plurality of through holes 42. Yes. Each pin holding member 43 has an insertion port 43a on the upper surface side of the through hole 42 in the second frame 41, a jaw portion 43b around the insertion port 43a, and a lead portion 43c on the lower surface side of the through hole 42, respectively. It is formed as a protrusion. In the multi-contact connector 200, unlike the multi-contact connector 100, the second frame 41 is not made of an elastic resin material but is formed of a resin molded body, and the pin holding member 43 is formed by drawing a metal plate material as will be described later. The inner peripheral surface is provided with a spring-shaped portion having elasticity in the circumferential direction, and is configured to give elasticity in the circumferential direction to the connector pin 33 of the first connector 30 to be inserted.

  17 and 18 are an enlarged plan view and a cross-sectional view of a portion indicated by a dotted line S of the second connector 40 shown in FIG. 15, and an AA cross-sectional view and a BB cross-sectional view in the plan view of FIG. Since they have the same shape, they are collectively shown in one sectional view of FIG. 17 and 18, a pin holding member 43 is inserted into the through hole 42 of the second frame 41, and the lead holding portion 43 on the lower surface side is integrally formed with the pin holding member 43. The side insertion port 43a portion is divided into a plurality of opposing spring body portions 41e.

  The spring body portion 43e has a flange portion 43b and a spring portion 43h. The spring portion 43h is formed with a relief portion 43g that connects the two protrusion portions 43f and the two protrusion portions 43f by bending drawing. . In the present embodiment, two sets of opposing spring body portions 43e1, 43e2, 43e3, 43e4 are provided. Further, a relief groove 41g is formed on the inner peripheral surface of the through hole 42 of the second frame 41 at a position corresponding to the relief portion 43g of the spring portion 43h, and when the metal pin 33 is inserted into the pin holding member 43. Further, when the connector pin 33 comes into contact with the protrusion 43f of the spring portion 43h, the connector pin 33 receives a pressure in the circumferential direction, so that a good contact as a connector can be made, and excess pressure is applied to the protrusion of the spring portion 43h. The escape portion 43g connecting 43f escapes into the escape groove 41g provided on the inner peripheral surface of the through hole 42 of the second frame 41, so that the pressure is optimized.

  Next, FIG. 19 and FIG. 20 show the configuration of the multi-contact connector 200, and the connection state between the first connector 30 and the second connector 40 constituting the multi-contact connector 200 will be described. FIG. 19 shows a state before the first connector 30 and the second connector 40 are joined in the multi-contact connector 200, and FIG. 20 shows a state where the first connector 30 and the second connector 40 are joined. In FIG. 19, the first connector 30 shown in FIG. 14 and the second connector 40 shown in FIG. 16 are aligned before insertion. FIG. 20 shows a coupling state of the first connector 30 and the second connector 40. As the coupling operation, the position of the insertion inclined portion 33c in each metal pin 33 of the first connector 30 in FIG. Is positioned in the insertion opening 43a.

  When the metal pin 33 of the first connector 30 is inserted into the insertion port 43a of the second connector 40 from this state, two sets of spring bodies are opposed to the insertion port 43a of the second connector 40 due to the inclination of the insertion inclined portion 33c. The connector pin 33b is inserted by being opened by the portions 43e1, 43e2, 43e3, 43e4, and the connector pins 33b of the first connector 30 are two sets of spring body portions 43e1, 43e2, 43e3, 43e4 facing the second connector 40. 20 is brought into close contact with each other to be in a joined state of the multi-contact connector 200 shown in FIG. In this state, as described above, when the connector pin 33 contacts the protrusion 43f of the spring portion 43h, the connector pin 33 receives a pressure in the circumferential direction, and can perform good contact as a connector. Further, the excess pressure can be optimized by the relief portion 43g of the spring portion 43h escaping into the relief groove 41g provided on the inner peripheral surface of the through hole 42 of the second frame 41. That is, in the state before the first connector 30 and the second connector 40 are coupled as shown in FIG. 19, there is a gap between the relief portion 43g of the spring portion 43h and the relief groove 41g provided on the inner peripheral surface of the through hole 42. However, in the coupled state of the first connector 30 and the second connector 40 shown in FIG. 20, there is no gap between the relief portion 43g of the spring portion 43h and the relief groove 41g of the through hole 42. It can be seen that the spring portion 43h is released.

  Next, connection of the circuit board 50 to the mother board 60 by joining the first connector 30 to which the circuit board 50 on which the electronic element 51 is mounted and the second connector 40 attached to the mother board 60 will be described with reference to FIG. As shown in FIG. 21, by inserting each metal pin 33 of the first connector 30 to which the circuit board 50 on which the electronic element 51 is mounted is inserted into each pin holding member 43 of the second connector 40 attached to the mother board 60, The electronic element 51 is electrically connected to the connection electrode 62 of the mother board 60. At this time, the connection between the first connector 30 and the second connector 40 is as described in FIG.

10, 30 First connector 20, 40 Second connector 11, 31 First frame 21, 41 Second frame 12.22, 32, 42 Through hole 13, 33 Metal pin 23, 43 Pin holding members 13a, 33a, 23c, 43c Lead part 13b, 33b Connector pin 13c, 33c Insert inclination part 23a, 43a Insertion port 23d, 43d Slit 50 Circuit board 51 Electronic element 52, 62 Connection electrode 60 Mother board
100,200 Multi-contact connector

Claims (3)

  A first frame which is resin-molded and has a plurality of through holes at predetermined intervals; a first connector having a plurality of metal pins inserted so as to have protrusions above and below the through holes of the first frame; and a predetermined interval A second frame having a plurality of through holes and a second connector having a metal pin holding member having uniform elasticity in the circumferential direction inserted into the through holes of the second frame. Multi-contact connector.   The multi-contact connector according to claim 1, wherein the second frame is formed of an elastic member, and the pin holding member has elasticity in a circumferential direction due to elasticity of the second frame. A connection electrode provided on a mounting board is electrically connected to an insertion side of each metal pin of the first connector and an insertion side of each pin holding member of the second connector. The multi-contact connector according to claim 1 or 2.

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