JP2016535299A - ウェブベース処理用のマスクレスリソグラフィ - Google Patents
ウェブベース処理用のマスクレスリソグラフィ Download PDFInfo
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- JP2016535299A JP2016535299A JP2016525042A JP2016525042A JP2016535299A JP 2016535299 A JP2016535299 A JP 2016535299A JP 2016525042 A JP2016525042 A JP 2016525042A JP 2016525042 A JP2016525042 A JP 2016525042A JP 2016535299 A JP2016535299 A JP 2016535299A
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- JP
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- Prior art keywords
- substrate
- processing
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- roller
- alignment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/24—Curved surfaces
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/703—Non-planar pattern areas or non-planar masks, e.g. curved masks or substrates
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/7084—Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Inking, Control Or Cleaning Of Printing Machines (AREA)
Abstract
Description
Claims (15)
- ウェブ基板を処理する方法であって、
前記基板が歪んでいることを検知することと、
前記検知された歪みに基づいて、前記歪んだ基板をフォトリソグラフィ処理することと
を含む、方法。 - 前記検知することは、前記基板上の複数のアラインメントマークの位置を検知することを含む、請求項1に記載の方法。
- 前記検知することは、前記基板がローラと接触しているときに、起こる、請求項2に記載の方法。
- 前記検知されたアラインメントマークに基づいて、前記基板の歪みを計算することを更に含む、請求項3に記載の方法。
- 前記計算された歪みに基づいて、前記基板を処理するためのフォトリソグラフィ条件を調整することを更に含む、請求項4に記載の方法。
- 前記計算された歪みは、前記基板上に形成された第一の生産物に隣接している前記アラインメントマークの検知に基づく歪みである、請求項5に記載の方法。
- 前記計算された歪みは、前記基板の長さに沿って配置された複数のアラインメントマークについての平均の歪みである、請求項4に記載の方法。
- 前記フォトリソグラフィ処理することは、像形成器を用いることを含む、請求項7に記載の方法。
- 前記複数のアラインメントマークは、横方向に伸びる複数のアラインメントマークを含む、請求項8に記載の方法。
- 前記複数のアラインメントマークは、縦方向に伸びる複数のアラインメントマークを含む、請求項9に記載の方法。
- 前記検知することは、前記基板がウェブ処理システムの中で動いているときに、起こる、請求項10に記載の方法。
- 計算された歪みは、前記基板上に形成された第一の生産物に隣接しているアラインメントマークの検知に基づく歪みである、請求項1に記載の方法。
- チャンバ本体の中に配置されたローラと、
アラインメント測定装置と、
前記アラインメント測定装置に接続されたCPUと、
前記CPUに接続された処理装置と、
前記処理装置と前記ローラの間に配置された像形成器であって、前記ローラの形状に合うべき凸状且つ円柱状のフィールド形状を生成することができる像形成器と
を備える、ウェブベース処理装置。 - 前記アラインメント測定装置は、カメラを含む、請求項13に記載の装置。
- 前記処理装置は、フォトリソグラフィ処理装置を含む、請求項13に記載の装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361894328P | 2013-10-22 | 2013-10-22 | |
US61/894,328 | 2013-10-22 | ||
PCT/US2014/057348 WO2015060983A1 (en) | 2013-10-22 | 2014-09-25 | Maskless lithography for web based processing |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016535299A true JP2016535299A (ja) | 2016-11-10 |
JP2016535299A5 JP2016535299A5 (ja) | 2017-11-02 |
Family
ID=52993357
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016525042A Pending JP2016535299A (ja) | 2013-10-22 | 2014-09-25 | ウェブベース処理用のマスクレスリソグラフィ |
Country Status (7)
Country | Link |
---|---|
US (1) | US10073350B2 (ja) |
EP (1) | EP3060961A4 (ja) |
JP (1) | JP2016535299A (ja) |
KR (1) | KR20160077116A (ja) |
CN (2) | CN106896647B (ja) |
TW (1) | TWI659269B (ja) |
WO (1) | WO2015060983A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018116017A (ja) * | 2017-01-20 | 2018-07-26 | 旭化成株式会社 | アライメントマーク及び可撓性基板の歪量検出方法 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI753865B (zh) * | 2015-11-03 | 2022-02-01 | 以色列商奧寶科技有限公司 | 用於高解析度電子圖案化的無針跡直接成像 |
CA2924160A1 (en) * | 2016-03-18 | 2017-09-18 | Chaji, Reza | Maskless patterning |
US10585360B2 (en) | 2017-08-25 | 2020-03-10 | Applied Materials, Inc. | Exposure system alignment and calibration method |
Citations (12)
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JP2006073986A (ja) * | 2004-08-06 | 2006-03-16 | Fujitsu Ltd | 半導体装置の製造方法 |
JP2006098719A (ja) * | 2004-09-29 | 2006-04-13 | Fuji Photo Film Co Ltd | 露光装置 |
JP2006098725A (ja) * | 2004-09-29 | 2006-04-13 | Fuji Photo Film Co Ltd | 描画位置の補正方法と、描画位置を補正可能な描画装置 |
JP2006098727A (ja) * | 2004-09-29 | 2006-04-13 | Fuji Photo Film Co Ltd | 伸縮状態の検出手段を設けた長尺の可撓性記録媒体と、この可撓性記録媒体に伸縮状態を補正して画像を描画可能な描画方法及び装置 |
JP2006106097A (ja) * | 2004-09-30 | 2006-04-20 | Fuji Photo Film Co Ltd | 画像記録装置及び画像記録方法 |
JP2006235448A (ja) * | 2005-02-28 | 2006-09-07 | Fuji Photo Film Co Ltd | 画像記録システム、画像記録方法、プログラムおよび画像形成方法 |
JP2006349945A (ja) * | 2005-06-15 | 2006-12-28 | Fujifilm Holdings Corp | 露光装置 |
JP2010122526A (ja) * | 2008-11-20 | 2010-06-03 | Shinko Electric Ind Co Ltd | マスクレス露光方法 |
US20110253425A1 (en) * | 2008-12-23 | 2011-10-20 | Haase Michael A | Roll-to-roll digital photolithography |
JP2013044972A (ja) * | 2011-08-24 | 2013-03-04 | V Technology Co Ltd | フィルム露光装置 |
JP2013045815A (ja) * | 2011-08-23 | 2013-03-04 | Nikon Corp | 露光方法及びデバイス製造方法 |
WO2013105317A1 (ja) * | 2012-01-12 | 2013-07-18 | 株式会社ニコン | 基板処理装置、基板処理方法、及び円筒状マスク |
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-
2014
- 2014-09-25 KR KR1020167013433A patent/KR20160077116A/ko not_active Application Discontinuation
- 2014-09-25 EP EP14856312.5A patent/EP3060961A4/en not_active Withdrawn
- 2014-09-25 CN CN201710069376.1A patent/CN106896647B/zh not_active Expired - Fee Related
- 2014-09-25 JP JP2016525042A patent/JP2016535299A/ja active Pending
- 2014-09-25 CN CN201480058382.1A patent/CN105659166B/zh not_active Expired - Fee Related
- 2014-09-25 WO PCT/US2014/057348 patent/WO2015060983A1/en active Application Filing
- 2014-09-25 US US15/026,810 patent/US10073350B2/en not_active Expired - Fee Related
- 2014-10-06 TW TW103134697A patent/TWI659269B/zh not_active IP Right Cessation
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2006073986A (ja) * | 2004-08-06 | 2006-03-16 | Fujitsu Ltd | 半導体装置の製造方法 |
JP2006098719A (ja) * | 2004-09-29 | 2006-04-13 | Fuji Photo Film Co Ltd | 露光装置 |
JP2006098725A (ja) * | 2004-09-29 | 2006-04-13 | Fuji Photo Film Co Ltd | 描画位置の補正方法と、描画位置を補正可能な描画装置 |
JP2006098727A (ja) * | 2004-09-29 | 2006-04-13 | Fuji Photo Film Co Ltd | 伸縮状態の検出手段を設けた長尺の可撓性記録媒体と、この可撓性記録媒体に伸縮状態を補正して画像を描画可能な描画方法及び装置 |
JP2006106097A (ja) * | 2004-09-30 | 2006-04-20 | Fuji Photo Film Co Ltd | 画像記録装置及び画像記録方法 |
JP2006235448A (ja) * | 2005-02-28 | 2006-09-07 | Fuji Photo Film Co Ltd | 画像記録システム、画像記録方法、プログラムおよび画像形成方法 |
JP2006349945A (ja) * | 2005-06-15 | 2006-12-28 | Fujifilm Holdings Corp | 露光装置 |
JP2010122526A (ja) * | 2008-11-20 | 2010-06-03 | Shinko Electric Ind Co Ltd | マスクレス露光方法 |
US20110253425A1 (en) * | 2008-12-23 | 2011-10-20 | Haase Michael A | Roll-to-roll digital photolithography |
JP2013045815A (ja) * | 2011-08-23 | 2013-03-04 | Nikon Corp | 露光方法及びデバイス製造方法 |
JP2013044972A (ja) * | 2011-08-24 | 2013-03-04 | V Technology Co Ltd | フィルム露光装置 |
WO2013105317A1 (ja) * | 2012-01-12 | 2013-07-18 | 株式会社ニコン | 基板処理装置、基板処理方法、及び円筒状マスク |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2018116017A (ja) * | 2017-01-20 | 2018-07-26 | 旭化成株式会社 | アライメントマーク及び可撓性基板の歪量検出方法 |
Also Published As
Publication number | Publication date |
---|---|
EP3060961A4 (en) | 2017-06-28 |
TW201531808A (zh) | 2015-08-16 |
CN105659166B (zh) | 2019-01-29 |
EP3060961A1 (en) | 2016-08-31 |
CN106896647B (zh) | 2019-05-10 |
KR20160077116A (ko) | 2016-07-01 |
CN106896647A (zh) | 2017-06-27 |
US10073350B2 (en) | 2018-09-11 |
CN105659166A (zh) | 2016-06-08 |
WO2015060983A1 (en) | 2015-04-30 |
TWI659269B (zh) | 2019-05-11 |
US20160238941A1 (en) | 2016-08-18 |
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