JP2016527368A5 - - Google Patents
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- Publication number
- JP2016527368A5 JP2016527368A5 JP2016531845A JP2016531845A JP2016527368A5 JP 2016527368 A5 JP2016527368 A5 JP 2016527368A5 JP 2016531845 A JP2016531845 A JP 2016531845A JP 2016531845 A JP2016531845 A JP 2016531845A JP 2016527368 A5 JP2016527368 A5 JP 2016527368A5
- Authority
- JP
- Japan
- Prior art keywords
- organic medium
- thermally conductive
- thick film
- organic
- polymer thick
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361860288P | 2013-07-31 | 2013-07-31 | |
| US61/860,288 | 2013-07-31 | ||
| US201361888544P | 2013-10-09 | 2013-10-09 | |
| US61/888,544 | 2013-10-09 | ||
| PCT/US2014/048766 WO2015017489A1 (en) | 2013-07-31 | 2014-07-30 | Thermally conductive dielectric for thermoformable circuits |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016527368A JP2016527368A (ja) | 2016-09-08 |
| JP2016527368A5 true JP2016527368A5 (enExample) | 2017-09-14 |
| JP6523280B2 JP6523280B2 (ja) | 2019-05-29 |
Family
ID=51301368
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016531845A Expired - Fee Related JP6523280B2 (ja) | 2013-07-31 | 2014-07-30 | 熱成形可能回路のための熱伝導性誘電体 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9346992B2 (enExample) |
| EP (1) | EP3027686B1 (enExample) |
| JP (1) | JP6523280B2 (enExample) |
| CN (2) | CN113248902A (enExample) |
| TW (1) | TW201522606A (enExample) |
| WO (1) | WO2015017489A1 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9685270B2 (en) * | 2014-07-07 | 2017-06-20 | E I Du Pont De Nemours And Company | High K dielectric composition for thermoformable capacitive circuits |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE69635929D1 (de) * | 1996-05-16 | 2006-05-11 | Minnesota Mining & Mfg | Klebstoffzusammensetzungen und methoden zu ihrer verwendung |
| US20050154105A1 (en) * | 2004-01-09 | 2005-07-14 | Summers John D. | Compositions with polymers for advanced materials |
| US8207261B2 (en) * | 2009-03-25 | 2012-06-26 | E.I. Du Pont De Nemours And Company | Plastic articles, optionally with partial metal coating |
| TWI534256B (zh) * | 2011-05-16 | 2016-05-21 | Showa Denko Kk | Hardened heat dissipation composition |
| US20130068512A1 (en) * | 2011-09-20 | 2013-03-21 | Ei Du Pont De Nemours And Company | Thermoformable polymer thick film silver conductor and its use in capacitive switch circuits |
| JP5887106B2 (ja) * | 2011-11-15 | 2016-03-16 | 株式会社カネカ | 新規な感光性樹脂組成物作製キット及びその利用 |
-
2014
- 2014-07-14 US US14/330,075 patent/US9346992B2/en not_active Expired - Fee Related
- 2014-07-16 TW TW103124358A patent/TW201522606A/zh unknown
- 2014-07-30 CN CN202110509481.9A patent/CN113248902A/zh active Pending
- 2014-07-30 EP EP14750290.0A patent/EP3027686B1/en active Active
- 2014-07-30 WO PCT/US2014/048766 patent/WO2015017489A1/en not_active Ceased
- 2014-07-30 CN CN201480035694.0A patent/CN105452379A/zh active Pending
- 2014-07-30 JP JP2016531845A patent/JP6523280B2/ja not_active Expired - Fee Related