JP2016526107A - めっき信頼性の向上機能を有する内蔵型アンテナの製造方法 - Google Patents
めっき信頼性の向上機能を有する内蔵型アンテナの製造方法 Download PDFInfo
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- JP2016526107A JP2016526107A JP2016518249A JP2016518249A JP2016526107A JP 2016526107 A JP2016526107 A JP 2016526107A JP 2016518249 A JP2016518249 A JP 2016518249A JP 2016518249 A JP2016518249 A JP 2016518249A JP 2016526107 A JP2016526107 A JP 2016526107A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/024—Electroplating of selected surface areas using locally applied electromagnetic radiation, e.g. lasers
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
- H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
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- Electroplating Methods And Accessories (AREA)
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Abstract
Description
(発明を実施するための形態)
上記のように構成された本発明の一実施例による、めっき信頼性の向上機能を有する内蔵型アンテナの製造方法をより具体的に説明すると、次のとおりである。
さらに、前記塗料層110が形成された樹脂成形物100を60℃〜80℃で強制乾燥を行った。
上記のような前処理用塗料を樹脂成形物100に塗布して塗料層110を形成した後、その上に前記金属めっき層120を施してみたところ、ABS+PC樹脂はもちろんであり、PC、PC+GLASS_FIBER(GLASS_FIBER含有率60%まで)などのような樹脂からなる成形物にもめっきが滑らかでかつ堅固に密着形成され、携帯電話のような無線通信機器のブランドが要求する内蔵型アンテナの信頼性項目をすべて満足することができた。
この時、前記放射パターン部121とアンテナ接点部122の通電のための貫通孔124は、レーザエッチングによって形成された境界線の内側に位置するように設ける。
この時、前記電気めっき槽240には、硫酸銅200g/L、硫酸60ml/Lの濃度で溶解されており、これは、通常の硫酸銅電気銅めっき液の組成と同等な濃度の範囲に該当する。
この時、上記のように設定された積算電流量に到逹して警報が鳴る電気めっき用引っ掛け台210を順次に電気めっき槽240から取り出して、水洗処理を行った。
これにより、非放射パターン部123に形成された金属めっき層120の剥離のための作業時間を著しく短縮し、生産性向上を極大化することができる。
この時、前記金属めっき層120の剥離時に剥離槽において生じた被膜がなくなる。
この時、前記ニッケル電気めっき槽240には、硫酸ニッケル260g/L、塩化ニッケル50g/L、ほう酸50g/L、pH4.0〜pH5.0、温度52℃の通常の装飾用電気ニッケルめっき液と同一の組成を有する液である。
配列目録Free Text
内蔵型アンテナ、インテナ、均一なめっき層、めっき信頼性
Claims (5)
- 電気めっきを利用した内蔵型アンテナの製造方法において、
(a)樹脂成形物に前処理用塗料で塗料層を形成するステップと;
(b)前記塗料層の上面に金属めっき層を形成するステップと;
(c)前記金属めっき層に放射パターン部及びアンテナ接点部が非放射パターン部と電気的に分離形成されるようにレーザでエッチングするステップと;
(d)前記放射パターン部及びアンテナ接点部が非放射パターン部と電気的に分離されるようにレーザエッチングされた樹脂成形物を引っ掛け台にかけて電気めっき槽に浸漬させるステップと;
(e)前記放射パターン部とアンテナ接点部に第1次伝導層を形成するステップと;
(f)前記放射パターン部とアンテナ接点部を除く非放射パターン部に形成された金属めっき層を強制剥離するステップと;
(g)前記放射パターン部とアンテナ接点部に第2次伝導層を形成するステップと;
(h)前記2次伝導層が形成された放射パターン部とアンテナ接点部に電解ニッケルめっき層を形成するステップと;
(i)前記ニッケルめっき層が形成された樹脂成形物を封孔処理、水洗、乾燥するステップ;
を含んでなることを特徴とする、めっき信頼性の向上機能を有する内蔵型アンテナの製造方法。 - 前記塗料は、アセトン30〜40重量%と、メチルエチルケトン30〜40重量%と、シクロヘキサノン10〜20重量%と、ABS樹脂またはLCP樹脂10〜20重量%とからなることを特徴とする、請求項1に記載のめっき信頼性の向上機能を有する内蔵型アンテナの製造方法。
- 前記(c)ステップにおいて、放射パターン部及びアンテナ接点部は、非放射パターン部との間隔を100μm〜200μm設けるようにして、電気めっきの際にショート現象による不良を防止するようにしたことを特徴とする、請求項1に記載のめっき信頼性の向上機能を有する内蔵型アンテナの製造方法。
- 前記(f)ステップにおいて、金属めっき層を強制剥離することは、電解剥離ではなく、硫酸、過酸化水素水を含む化学的剥離であることを特徴とする、請求項1に記載のめっき信頼性の向上機能を有する内蔵型アンテナの製造方法。
- 前記塗料は、使用温度が85℃以下である場合は、ABS樹脂を用い、使用温度が85℃以上〜240℃以下である場合は、LCP樹脂を用いることを特徴とする、請求項2に記載のめっき信頼性の向上機能を有する内蔵型アンテナの製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2013-0063464 | 2013-06-03 | ||
KR1020130063464A KR101290670B1 (ko) | 2013-06-03 | 2013-06-03 | 도금 신뢰성 향상 기능을 갖는 내장형 안테나 제조방법 |
PCT/KR2013/007624 WO2014196692A1 (ko) | 2013-06-03 | 2013-08-26 | 도금 신뢰성 향상 기능을 갖는 내장형 안테나 제조방법 |
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JP2016526107A true JP2016526107A (ja) | 2016-09-01 |
JP6123025B2 JP6123025B2 (ja) | 2017-04-26 |
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JP2016518249A Active JP6123025B2 (ja) | 2013-06-03 | 2013-08-26 | 内蔵型アンテナの製造方法 |
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US (1) | US9819076B2 (ja) |
EP (1) | EP3007271B1 (ja) |
JP (1) | JP6123025B2 (ja) |
KR (1) | KR101290670B1 (ja) |
CN (1) | CN105453337B (ja) |
WO (1) | WO2014196692A1 (ja) |
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KR101537466B1 (ko) * | 2014-01-13 | 2015-07-16 | 하명석 | 인테나 특성 및 성능향상을 위한 핸드폰 체결형 금속 테두리 케이스 제조 방법 |
KR101392881B1 (ko) * | 2014-02-12 | 2014-05-08 | 주식회사 유텍솔루션 | 휴대단말기용 nfc 안테나 제조방법 |
CN104168730B (zh) * | 2014-02-26 | 2019-06-11 | 深圳富泰宏精密工业有限公司 | 壳体、应用该壳体的电子装置及其制作方法 |
DE202016008419U1 (de) * | 2015-12-23 | 2017-12-20 | Apple Inc. | Gehäuse mit metallischer lnnenflächenschicht |
US10447834B2 (en) | 2016-09-21 | 2019-10-15 | Apple Inc. | Electronic device having a composite structure |
CN106532240B (zh) * | 2016-12-26 | 2023-09-26 | 青岛伟林电子有限公司 | 一种手机天线及其化镀工艺 |
CN106935965B (zh) * | 2017-03-24 | 2024-03-19 | 苏州胜利精密制造科技股份有限公司 | 一种具有天线装饰功能的壳体及制备工艺 |
KR102011405B1 (ko) * | 2017-12-19 | 2019-10-21 | (주)드림텍 | Led 램프 제조 방법 및 그 램프 |
CN108382719B (zh) * | 2018-01-31 | 2019-11-12 | 成都优印佳科技有限公司 | 一体式rfid防伪瓶盖生产方法及系统 |
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- 2013-08-26 EP EP13886382.4A patent/EP3007271B1/en active Active
- 2013-08-26 WO PCT/KR2013/007624 patent/WO2014196692A1/ko active Application Filing
- 2013-08-26 JP JP2016518249A patent/JP6123025B2/ja active Active
- 2013-08-26 US US14/895,491 patent/US9819076B2/en active Active
- 2013-08-26 CN CN201380078709.7A patent/CN105453337B/zh active Active
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Publication number | Publication date |
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KR101290670B1 (ko) | 2013-07-29 |
US9819076B2 (en) | 2017-11-14 |
EP3007271B1 (en) | 2020-02-19 |
CN105453337B (zh) | 2017-11-17 |
EP3007271A1 (en) | 2016-04-13 |
US20160149294A1 (en) | 2016-05-26 |
EP3007271A4 (en) | 2017-02-08 |
JP6123025B2 (ja) | 2017-04-26 |
CN105453337A (zh) | 2016-03-30 |
WO2014196692A1 (ko) | 2014-12-11 |
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