JP2016523443A - 固体発光体パッケージ、発光デバイス、可撓性ledストリップ及び照明器具 - Google Patents
固体発光体パッケージ、発光デバイス、可撓性ledストリップ及び照明器具 Download PDFInfo
- Publication number
- JP2016523443A JP2016523443A JP2015563022A JP2015563022A JP2016523443A JP 2016523443 A JP2016523443 A JP 2016523443A JP 2015563022 A JP2015563022 A JP 2015563022A JP 2015563022 A JP2015563022 A JP 2015563022A JP 2016523443 A JP2016523443 A JP 2016523443A
- Authority
- JP
- Japan
- Prior art keywords
- light
- solid state
- light emitter
- state light
- die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007787 solid Substances 0.000 title claims abstract description 360
- 239000000463 material Substances 0.000 claims abstract description 147
- 238000009826 distribution Methods 0.000 claims abstract description 97
- 230000003287 optical effect Effects 0.000 claims abstract description 48
- 230000003595 spectral effect Effects 0.000 claims abstract description 36
- 238000009877 rendering Methods 0.000 claims abstract description 21
- 238000010521 absorption reaction Methods 0.000 claims description 35
- 239000000758 substrate Substances 0.000 claims description 22
- 239000002245 particle Substances 0.000 claims description 20
- 238000001228 spectrum Methods 0.000 claims description 14
- 239000002096 quantum dot Substances 0.000 claims description 6
- 241001455273 Tetrapoda Species 0.000 claims description 3
- 230000001747 exhibiting effect Effects 0.000 claims description 2
- 239000003086 colorant Substances 0.000 abstract description 15
- 229920001296 polysiloxane Polymers 0.000 description 28
- 238000000295 emission spectrum Methods 0.000 description 21
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 18
- 238000006243 chemical reaction Methods 0.000 description 13
- 239000011347 resin Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 238000005286 illumination Methods 0.000 description 7
- 239000011159 matrix material Substances 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- ORQBXQOJMQIAOY-UHFFFAOYSA-N nobelium Chemical compound [No] ORQBXQOJMQIAOY-UHFFFAOYSA-N 0.000 description 7
- 230000010354 integration Effects 0.000 description 6
- 229910004122 SrSi Inorganic materials 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- CNQCVBJFEGMYDW-UHFFFAOYSA-N lawrencium atom Chemical compound [Lr] CNQCVBJFEGMYDW-UHFFFAOYSA-N 0.000 description 5
- 230000005855 radiation Effects 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 4
- 230000000153 supplemental effect Effects 0.000 description 4
- 235000006679 Mentha X verticillata Nutrition 0.000 description 3
- 235000002899 Mentha suaveolens Nutrition 0.000 description 3
- 235000001636 Mentha x rotundifolia Nutrition 0.000 description 3
- 229910004283 SiO 4 Inorganic materials 0.000 description 3
- 238000002835 absorbance Methods 0.000 description 3
- 238000000862 absorption spectrum Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- 239000012780 transparent material Substances 0.000 description 3
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 description 2
- 229910016066 BaSi Inorganic materials 0.000 description 2
- 235000008733 Citrus aurantifolia Nutrition 0.000 description 2
- 240000007817 Olea europaea Species 0.000 description 2
- 235000011941 Tilia x europaea Nutrition 0.000 description 2
- 239000005083 Zinc sulfide Substances 0.000 description 2
- 229910052980 cadmium sulfide Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000000875 corresponding effect Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 230000031700 light absorption Effects 0.000 description 2
- 239000004571 lime Substances 0.000 description 2
- 238000004020 luminiscence type Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- ORFSSYGWXNGVFB-UHFFFAOYSA-N sodium 4-amino-6-[[4-[4-[(8-amino-1-hydroxy-5,7-disulfonaphthalen-2-yl)diazenyl]-3-methoxyphenyl]-2-methoxyphenyl]diazenyl]-5-hydroxynaphthalene-1,3-disulfonic acid Chemical compound COC1=C(C=CC(=C1)C2=CC(=C(C=C2)N=NC3=C(C4=C(C=C3)C(=CC(=C4N)S(=O)(=O)O)S(=O)(=O)O)O)OC)N=NC5=C(C6=C(C=C5)C(=CC(=C6N)S(=O)(=O)O)S(=O)(=O)O)O.[Na+] ORFSSYGWXNGVFB-UHFFFAOYSA-N 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229920002994 synthetic fiber Polymers 0.000 description 2
- 239000010981 turquoise Substances 0.000 description 2
- 229910052984 zinc sulfide Inorganic materials 0.000 description 2
- 229910003373 AgInS2 Inorganic materials 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- 229910017639 MgSi Inorganic materials 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- YNXRTZDUPOFFKZ-UHFFFAOYSA-N [In].[Ag]=S Chemical compound [In].[Ag]=S YNXRTZDUPOFFKZ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- AQCDIIAORKRFCD-UHFFFAOYSA-N cadmium selenide Chemical compound [Cd]=[Se] AQCDIIAORKRFCD-UHFFFAOYSA-N 0.000 description 1
- 230000021615 conjugation Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- LCUOIYYHNRBAFS-UHFFFAOYSA-N copper;sulfanylideneindium Chemical compound [Cu].[In]=S LCUOIYYHNRBAFS-UHFFFAOYSA-N 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/62—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using mixing chambers, e.g. housings with reflective walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
- H01L33/06—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
Description
- (Lu1-x-y-a-bYxGdy)3(Al1-z-uGazSiu)5O12-uNu:CeaPrb、但し、Lu3Al5O12:Ce3+及びY3Al5O12:Ce3+等のように、0<=X<=1, 0<=y<=1, 0<z<=0.1, 0<=u<=0.2, 0<a<=0.2及び0<b<=0.1;
- (Sr1-a-b-cCabBac)SixNyOz:Eua 2+、但し、例えばSrSi2N2O2:Eu2+及びBaSi2N0.67O4:Eu2+を含み、a=0.002〜0.2, b=0.0〜0.25, c=0.0〜1.0, x=1.5〜2.5, y=0.67〜2.5, z=1.5〜4;
- 例えばSrGa2S4:Eu2+を含む、(Sr1-u-v-xMguCavBax)(Ga2-y-zAlyInzS4):Eu2+;
- 例えばBaSrSiO4:Eu2+,(Ca1-x-y-a-bYxLuy)3(Sc1-zAlz)2(Si1-x-yAlx+y)3O12:CeaPrbを含む、(Sr1-xBax)2SiO4:Eu、但しCa3Sc2Si3O12:Ce3+等のように0<=x<=1, 0<=y<=1, 0<z<=1, 0<=u<=0.2, 0<a<=0.2及び0<b<=0.1、
であり、他の好適な無機ルミネッセント材料は図2cの前後関係で説明する。
Claims (15)
- 固体発光体パッケージであって、
− 紫色/青色光を放出する青色発光固体発光体ダイと、
− 赤色光を放出する赤色発光固体発光体ダイと、
− 紫外、紫色及び青色スペクトル範囲のうちの少なくとも1つのスペクトル範囲内の波長の光を持つ他の光を放出する他の固体発光体ダイと、
− ルミネッセント材料を有し、前記他の光を受光するルミネッセント変換器であって、前記ルミネッセント材料は吸収カラー分布内の光を吸収すると共に該吸収された光の一部を放射カラー分布に従って緑がかった光に変換し、前記吸収カラー分布は前記他の光の波長と少なくとも部分的に重なり、前記放射カラー分布はシアン及び緑色スペクトル範囲のうちの少なくとも一方のスペクトル範囲内にピーク波長を有すると共に所定の最小値より高い演色評価数を得るために固有の幅を有し、前記演色評価数は当該固体発光体パッケージが黒体軌跡に近いカラー点の光を放出する場合に該固体発光体パッケージにより放出される光に関係するものであるルミネッセント変換器と、
− 光を当該固体発光体パッケージの周囲へと透過させる光出射窓と、
− 前記緑がかった光の一部を前記紫色/青色光の一部及び前記赤色光の一部の少なくとも一方と前記光出射窓を介して放出される前に混合する光学エレメントと、
を有し、前記赤色発光固体発光体ダイが前記青色発光固体発光体ダイと前記他の固体発光体ダイとの間に配置される、固体発光体パッケージ。 - 前記放射カラー分布の前記ピーク波長が490ナノメートルから570ナノメートルの範囲内にある、請求項1に記載の固体発光体パッケージ。
- 前記放射カラー分布のスペクトル的半値全幅が、当該固体発光体パッケージが黒体軌跡に近いカラー点の光を放出する場合に該固体発光体パッケージにより放出される光の演色評価数を増加させるために少なくとも40ナノメートルである、請求項1に記載の固体発光体パッケージ。
- 前記他の固体発光体ダイが他の光を放出し、且つ、該他の光が青色スペクトル範囲内の光である場合に、該他の光の少なくとも30%の部分が前記ルミネッセント材料により吸収され、放出される前記緑がかった光と前記他の光の残りの部分との組み合わせが前記光出射窓を介して放出される、請求項1に記載の固体発光体パッケージ。
- 前記ルミネッセント変換器が、前記他の固体発光体ダイの表面上に設けられる前記ルミネッセント材料の層である、請求項1に記載の固体発光体パッケージ。
- 前記ルミネッセント変換器は前記ルミネッセント材料が分散された第1透光性材料を有し、前記他の固体発光体ダイの1以上の発光面が該第1透光性材料により覆われる、請求項1に記載の固体発光体パッケージ。
- 前記赤色発光固体発光体ダイの1以上の発光面も前記第1透光性材料により覆われ、これにより、前記光学エレメントが前記緑色光を前記赤色光と少なくとも部分的に混合するようにする、請求項6に記載の固体発光体パッケージ。
- 前記ルミネッセント材料の前記吸収カラー分布は前記紫色/青色光のスペクトルと、該紫色/青色光の30%以下が該ルミネッセント材料により吸収される程度に重なり合い、前記青色発光固体発光体ダイの1以上の発光面も前記第1透光性材料により覆われ、これにより、前記光学エレメントが、前記緑がかった光を前記紫色/青色光と少なくとも部分的に混合するようにする、請求項6又は請求項7に記載の固体発光体パッケージ。
- 前記光学エレメントが、前記青色発光固体発光体ダイ、前記赤色発光固体発光体ダイ及び前記ルミネッセント変換器の1以上の発光面と光学的に結合された第2透光性材料を有する、請求項1に記載の固体発光体パッケージ。
- 前記光学エレメントが前記第2透光性材料と前記ルミネッセント変換器との間に配置された透光壁を更に有する、請求項9に記載の固体発光体パッケージ。
- 前記ルミネッセント材料は、有機蛍光体、無機蛍光体及び量子閉じ込めを示すと共に少なくとも1つの次元においてナノメートル範囲内の寸法を有する粒子のうちの1つであり、前記粒子の例が量子ドット、量子ロッド及び量子テトラポッドである、請求項1に記載の固体発光体パッケージ。
- 請求項1に記載の固体発光体パッケージであって、
i)追加の紫色/青色光を放出すると共に他のルミネッセント材料が設けられた追加の青色発光固体発光体ダイであって、前記他のルミネッセント材料は前記追加の紫色/青色光の一部を少なくとも吸収すると共に該吸収された光を黄色スペクトル範囲内又は橙色スペクトル範囲内にピーク波長を持つ放射カラー分布の光に変換し、当該追加の青色発光固体発光体ダイ及び前記ルミネッセント材料が前記黒体軌跡に近いカラー点を持つ光を放出する追加の青色発光固体発光体ダイ、及び
ii)緑色光を放出する緑色発光固体発光体ダイ、
のうちの少なくとも一方を更に有する、固体発光体パッケージ。 - 少なくとも1つの請求項1に記載の固体発光体パッケージを有する発光デバイスであって、該少なくとも1つの固体発光体パッケージが電気的に結合される導電トラックが設けられた基板を少なくとも有する、発光デバイス。
- 請求項13に記載の発光デバイスを有し、前記基板が可撓性であると共に長尺形状を有し、該基板上に複数の固体発光体パッケージが設けられ、該固体発光体パッケージの固体発光体ダイが発光ダイオードダイである、可撓性LEDストリップ。
- 請求項1に記載の固体発光体パッケージを有するか、請求項13に記載の発光デバイスを有するか、又は請求項14に記載の可撓性LEDストリップを有する、照明器具。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP13197726 | 2013-12-17 | ||
EP13197726.6 | 2013-12-17 | ||
PCT/EP2014/077332 WO2015091191A1 (en) | 2013-12-17 | 2014-12-11 | A solid state light emitter package, a light emission device, a flexible led strip and a luminaire |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016523443A true JP2016523443A (ja) | 2016-08-08 |
JP6223479B2 JP6223479B2 (ja) | 2017-11-01 |
Family
ID=49765948
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015563022A Active JP6223479B2 (ja) | 2013-12-17 | 2014-12-11 | 固体発光体パッケージ、発光デバイス、可撓性ledストリップ及び照明器具 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9537062B2 (ja) |
EP (1) | EP2959211B1 (ja) |
JP (1) | JP6223479B2 (ja) |
CN (1) | CN105164464B (ja) |
WO (1) | WO2015091191A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020505787A (ja) * | 2017-01-13 | 2020-02-20 | ユーハ ランタラRANTALA, Juha | Led構造及び連続消毒用照明器具 |
US11598508B2 (en) | 2020-06-30 | 2023-03-07 | Nichia Corporation | Light emitting device |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016049507A1 (en) * | 2014-09-26 | 2016-03-31 | Glo Ab | Monolithic image chip for near-to-eye display |
TWI565102B (zh) * | 2015-04-29 | 2017-01-01 | 隆達電子股份有限公司 | 發光二極體模組及使用該發光二極體模組的燈具 |
US10756074B2 (en) | 2017-03-21 | 2020-08-25 | Signify Holding B.V. | Light emitting assembly, a spot lamp and luminaire |
EP3647650B1 (en) * | 2017-06-27 | 2024-10-09 | Seoul Semiconductor Co., Ltd. | Light emitting device |
KR102452484B1 (ko) * | 2017-08-11 | 2022-10-11 | 삼성전자주식회사 | 발광소자 패키지 및 발광소자 패키지 모듈 |
US10837607B2 (en) * | 2017-09-26 | 2020-11-17 | Lumileds Llc | Light emitting device with improved warm-white color point |
CN113178437B (zh) * | 2017-12-21 | 2023-08-11 | 厦门市三安光电科技有限公司 | 一种白光led封装结构以及白光源系统 |
KR20200139307A (ko) | 2019-06-03 | 2020-12-14 | 삼성전자주식회사 | 발광장치, 백라이트 유닛 및 디스플레이 장치 |
CN114325641A (zh) * | 2021-11-26 | 2022-04-12 | 深圳阜时科技有限公司 | 光感应芯片及其制造方法、激光雷达及电子设备 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007507910A (ja) * | 2004-09-10 | 2007-03-29 | ルクスピア カンパニー リミテッド | 多様な色実現が可能な半導体発光装置及びその製造方法 |
JP2009239242A (ja) * | 2007-06-22 | 2009-10-15 | Mitsubishi Chemicals Corp | 半導体発光デバイス用部材形成液、半導体発光デバイス用部材、航空宇宙産業用部材、半導体発光デバイス、及び蛍光体組成物 |
JP2010034184A (ja) * | 2008-07-28 | 2010-02-12 | Citizen Electronics Co Ltd | 発光装置 |
WO2012090356A1 (ja) * | 2010-12-28 | 2012-07-05 | パナソニック株式会社 | 発光装置、発光モジュール及びランプ |
JP2013051375A (ja) * | 2011-08-31 | 2013-03-14 | Nichia Chem Ind Ltd | 発光装置 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7005679B2 (en) * | 2003-05-01 | 2006-02-28 | Cree, Inc. | Multiple component solid state white light |
JP2006114854A (ja) * | 2004-10-18 | 2006-04-27 | Sharp Corp | 半導体発光装置、液晶表示装置用のバックライト装置 |
KR101258227B1 (ko) | 2006-08-29 | 2013-04-25 | 서울반도체 주식회사 | 발광 소자 |
JP5220381B2 (ja) | 2007-10-16 | 2013-06-26 | ミネベア株式会社 | 面状照明装置 |
US8018139B2 (en) | 2007-11-05 | 2011-09-13 | Enertron, Inc. | Light source and method of controlling light spectrum of an LED light engine |
US8907368B2 (en) * | 2007-11-08 | 2014-12-09 | Dialight Corporation | Double collimator LED color mixing system |
CN101463975A (zh) * | 2007-12-19 | 2009-06-24 | 富士迈半导体精密工业(上海)有限公司 | 固态光源装置 |
JP5056520B2 (ja) | 2008-03-21 | 2012-10-24 | 東芝ライテック株式会社 | 照明装置 |
KR101562772B1 (ko) * | 2008-03-31 | 2015-10-26 | 서울반도체 주식회사 | 백열등 색의 발광 디바이스 |
CN101621054A (zh) * | 2008-07-01 | 2010-01-06 | 展晶科技(深圳)有限公司 | 发光二极管光源装置 |
KR100924912B1 (ko) | 2008-07-29 | 2009-11-03 | 서울반도체 주식회사 | 웜화이트 발광장치 및 그것을 포함하는 백라이트 모듈 |
US8415870B2 (en) * | 2008-08-28 | 2013-04-09 | Panasonic Corporation | Semiconductor light emitting device and backlight source, backlight source system, display device and electronic device using the same |
US8901583B2 (en) * | 2010-04-12 | 2014-12-02 | Cree Huizhou Opto Limited | Surface mount device thin package |
CN102261582A (zh) * | 2010-05-24 | 2011-11-30 | 台达电子工业股份有限公司 | 提高输出色彩显色性的单一封装发光二极管光源 |
TWI422073B (zh) | 2010-05-26 | 2014-01-01 | Interlight Optotech Corp | 發光二極體封裝結構 |
DE202011000007U1 (de) * | 2011-01-04 | 2012-04-05 | Zumtobel Lighting Gmbh | LED-Anordnung zur Erzeugung von weißem Licht |
-
2014
- 2014-12-11 CN CN201480025163.3A patent/CN105164464B/zh active Active
- 2014-12-11 WO PCT/EP2014/077332 patent/WO2015091191A1/en active Application Filing
- 2014-12-11 US US14/906,594 patent/US9537062B2/en active Active
- 2014-12-11 EP EP14809867.6A patent/EP2959211B1/en active Active
- 2014-12-11 JP JP2015563022A patent/JP6223479B2/ja active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007507910A (ja) * | 2004-09-10 | 2007-03-29 | ルクスピア カンパニー リミテッド | 多様な色実現が可能な半導体発光装置及びその製造方法 |
JP2009239242A (ja) * | 2007-06-22 | 2009-10-15 | Mitsubishi Chemicals Corp | 半導体発光デバイス用部材形成液、半導体発光デバイス用部材、航空宇宙産業用部材、半導体発光デバイス、及び蛍光体組成物 |
JP2010034184A (ja) * | 2008-07-28 | 2010-02-12 | Citizen Electronics Co Ltd | 発光装置 |
WO2012090356A1 (ja) * | 2010-12-28 | 2012-07-05 | パナソニック株式会社 | 発光装置、発光モジュール及びランプ |
JP2013051375A (ja) * | 2011-08-31 | 2013-03-14 | Nichia Chem Ind Ltd | 発光装置 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020505787A (ja) * | 2017-01-13 | 2020-02-20 | ユーハ ランタラRANTALA, Juha | Led構造及び連続消毒用照明器具 |
JP7227922B2 (ja) | 2017-01-13 | 2023-02-22 | カリクスピュア インコーポレイテッド | Led構造及び連続消毒用照明器具 |
US11598508B2 (en) | 2020-06-30 | 2023-03-07 | Nichia Corporation | Light emitting device |
Also Published As
Publication number | Publication date |
---|---|
WO2015091191A1 (en) | 2015-06-25 |
CN105164464A (zh) | 2015-12-16 |
JP6223479B2 (ja) | 2017-11-01 |
US9537062B2 (en) | 2017-01-03 |
CN105164464B (zh) | 2017-03-01 |
EP2959211B1 (en) | 2016-08-17 |
US20160284949A1 (en) | 2016-09-29 |
EP2959211A1 (en) | 2015-12-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6223479B2 (ja) | 固体発光体パッケージ、発光デバイス、可撓性ledストリップ及び照明器具 | |
JP3223302U (ja) | Led発光装置 | |
CA2755838C (en) | Illumination device with remote luminescent material | |
US8779455B2 (en) | Semiconductor light-emitting device, semiconductor light-emitting system and illumination fixture | |
US9046228B2 (en) | Light-emitting device for emitting light of multiple color temperatures | |
JP6769449B2 (ja) | 照明装置 | |
US20110089815A1 (en) | Light-emitting device | |
WO2012121304A1 (ja) | 発光装置及び発光装置を備えた照明装置 | |
US20060214562A1 (en) | Light-emitting diode package structure, cold cathode flourescent lamp and photoluminescent material thereof | |
US8039849B2 (en) | LED module | |
EP2334147B1 (en) | Illumination device | |
JP2007059911A (ja) | Uvled及びuv反射器を備えた光源 | |
JP2010182724A (ja) | 発光装置 | |
US11756939B2 (en) | Light emitting element with particular phosphors | |
JP2011249476A (ja) | 半導体発光装置 | |
CN103311412A (zh) | 照明装置 | |
JP2012191225A (ja) | 発光装置 | |
WO2015072120A1 (ja) | 発光装置、発光モジュール、照明器具及びランプ | |
WO2020246395A1 (ja) | 蛍光体、波長変換部材および照明装置 | |
KR20130027653A (ko) | Led 백색 광원모듈 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160606 |
|
A975 | Report on accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A971005 Effective date: 20160704 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20160719 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20161017 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20161122 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170317 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20170327 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20170419 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170711 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20170904 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20171003 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6223479 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |