JP2016517352A5 - - Google Patents

Download PDF

Info

Publication number
JP2016517352A5
JP2016517352A5 JP2016502438A JP2016502438A JP2016517352A5 JP 2016517352 A5 JP2016517352 A5 JP 2016517352A5 JP 2016502438 A JP2016502438 A JP 2016502438A JP 2016502438 A JP2016502438 A JP 2016502438A JP 2016517352 A5 JP2016517352 A5 JP 2016517352A5
Authority
JP
Japan
Prior art keywords
speed
target position
laser
beam axis
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016502438A
Other languages
English (en)
Japanese (ja)
Other versions
JP6636417B2 (ja
JP2016517352A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2014/027439 external-priority patent/WO2014152526A1/en
Publication of JP2016517352A publication Critical patent/JP2016517352A/ja
Publication of JP2016517352A5 publication Critical patent/JP2016517352A5/ja
Application granted granted Critical
Publication of JP6636417B2 publication Critical patent/JP6636417B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2016502438A 2013-03-15 2014-03-14 Aod移動減少用aodツール整定のためのレーザシステム及び方法 Active JP6636417B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201361791656P 2013-03-15 2013-03-15
US201361791160P 2013-03-15 2013-03-15
US61/791,160 2013-03-15
US61/791,656 2013-03-15
PCT/US2014/027439 WO2014152526A1 (en) 2013-03-15 2014-03-14 Laser systems and methods for aod tool settling for aod travel reduction

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2019195232A Division JP2020037135A (ja) 2013-03-15 2019-10-28 Aod移動減少用aodツール整定のためのレーザシステム及び方法

Publications (3)

Publication Number Publication Date
JP2016517352A JP2016517352A (ja) 2016-06-16
JP2016517352A5 true JP2016517352A5 (cg-RX-API-DMAC7.html) 2017-04-20
JP6636417B2 JP6636417B2 (ja) 2020-01-29

Family

ID=51522887

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2016502438A Active JP6636417B2 (ja) 2013-03-15 2014-03-14 Aod移動減少用aodツール整定のためのレーザシステム及び方法
JP2019195232A Pending JP2020037135A (ja) 2013-03-15 2019-10-28 Aod移動減少用aodツール整定のためのレーザシステム及び方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2019195232A Pending JP2020037135A (ja) 2013-03-15 2019-10-28 Aod移動減少用aodツール整定のためのレーザシステム及び方法

Country Status (6)

Country Link
US (1) US9724782B2 (cg-RX-API-DMAC7.html)
JP (2) JP6636417B2 (cg-RX-API-DMAC7.html)
KR (1) KR102245812B1 (cg-RX-API-DMAC7.html)
CN (2) CN105121088B (cg-RX-API-DMAC7.html)
TW (1) TWI637803B (cg-RX-API-DMAC7.html)
WO (1) WO2014152526A1 (cg-RX-API-DMAC7.html)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10838406B2 (en) 2013-02-11 2020-11-17 The Aerospace Corporation Systems and methods for the patterning of material substrates
US10613513B2 (en) * 2013-02-11 2020-04-07 The Aerospace Corporation Systems and methods for modifying material substrates
WO2016144290A1 (en) * 2015-03-06 2016-09-15 Intel Corporation Acousto-optics deflector and mirror for laser beam steering
SG11201701698VA (en) * 2015-06-22 2017-04-27 Electro Scient Ind Inc Multi-axis machine tool and methods of controlling the same
WO2017044646A1 (en) 2015-09-09 2017-03-16 Electro Scientific Industries, Inc. Laser processing apparatus, methods of laser-processing workpieces and related arrangements
WO2018126078A1 (en) 2016-12-30 2018-07-05 Electro Scientific Industries, Inc. Method and system for extending optics lifetime in laser processing apparatus
WO2019236616A1 (en) * 2018-06-05 2019-12-12 Electro Scientific Industries, Inc. Laser-processing apparatus, methods of operating the same, and methods of processing workpieces using the same
JP6684872B2 (ja) * 2018-08-17 2020-04-22 株式会社アマダホールディングス レーザ加工機及びレーザ加工方法
US11090765B2 (en) * 2018-09-25 2021-08-17 Saudi Arabian Oil Company Laser tool for removing scaling
KR102864252B1 (ko) * 2020-03-04 2025-09-26 삼성디스플레이 주식회사 전자 장치 제조 방법
EP4046741B1 (fr) 2021-02-23 2023-11-01 DM Surfaces SA Procede d'usinage laser d'un composant horloger

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5841099A (en) 1994-07-18 1998-11-24 Electro Scientific Industries, Inc. Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets
TW482705B (en) 1999-05-28 2002-04-11 Electro Scient Ind Inc Beam shaping and projection imaging with solid state UV Gaussian beam to form blind vias
JP3768730B2 (ja) * 1999-06-14 2006-04-19 松下電器産業株式会社 レーザ加工機およびその数値制御装置ならびにレーザ加工機の制御方法
US6676878B2 (en) 2001-01-31 2004-01-13 Electro Scientific Industries, Inc. Laser segmented cutting
WO2002067180A1 (en) * 2001-02-16 2002-08-29 Electro Scientific Industries, Inc. On-the-fly beam path error correction for memory link processing
US6816294B2 (en) 2001-02-16 2004-11-09 Electro Scientific Industries, Inc. On-the-fly beam path error correction for memory link processing
JP2003136270A (ja) 2001-11-02 2003-05-14 Hitachi Via Mechanics Ltd レーザ加工装置
US6706999B1 (en) * 2003-02-24 2004-03-16 Electro Scientific Industries, Inc. Laser beam tertiary positioner apparatus and method
DE10317363B3 (de) * 2003-04-15 2004-08-26 Siemens Ag Verfahren und Vorrichtung zum Bohren von Löchern in einem elektrischen Schaltungssubstrat
US6947454B2 (en) * 2003-06-30 2005-09-20 Electro Scientific Industries, Inc. Laser pulse picking employing controlled AOM loading
JP4443208B2 (ja) 2003-12-12 2010-03-31 日立ビアメカニクス株式会社 スキャナ装置
US7027199B2 (en) 2004-06-07 2006-04-11 Electro Scientific Industries, Inc. AOM modulation techniques for facilitating pulse-to-pulse energy stability in laser systems
US7923306B2 (en) 2004-06-18 2011-04-12 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots
US7259354B2 (en) * 2004-08-04 2007-08-21 Electro Scientific Industries, Inc. Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories
US20060114948A1 (en) * 2004-11-29 2006-06-01 Lo Ho W Workpiece processing system using a common imaged optical assembly to shape the spatial distributions of light energy of multiple laser beams
US7244906B2 (en) 2005-08-30 2007-07-17 Electro Scientific Industries, Inc. Energy monitoring or control of individual vias formed during laser micromachining
US7638731B2 (en) * 2005-10-18 2009-12-29 Electro Scientific Industries, Inc. Real time target topography tracking during laser processing
US8084706B2 (en) 2006-07-20 2011-12-27 Gsi Group Corporation System and method for laser processing at non-constant velocities
JP2008049383A (ja) 2006-08-28 2008-03-06 Sumitomo Heavy Ind Ltd ビーム照射方法及びビーム照射装置
DE102007012815B4 (de) 2007-03-16 2024-06-06 Dmg Mori Ultrasonic Lasertec Gmbh Verfahren und Vorrichtung zur Bildung eines Gesenks
US8026158B2 (en) 2007-06-01 2011-09-27 Electro Scientific Industries, Inc. Systems and methods for processing semiconductor structures using laser pulses laterally distributed in a scanning window
GB0800333D0 (en) 2008-01-09 2008-02-20 Ucl Business Plc Beam deflection apparatus and methods
US8680430B2 (en) * 2008-12-08 2014-03-25 Electro Scientific Industries, Inc. Controlling dynamic and thermal loads on laser beam positioning system to achieve high-throughput laser processing of workpiece features
US20100252959A1 (en) 2009-03-27 2010-10-07 Electro Scientific Industries, Inc. Method for improved brittle materials processing
TWI523720B (zh) * 2009-05-28 2016-03-01 伊雷克托科學工業股份有限公司 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法
GB201006679D0 (en) 2010-04-21 2010-06-09 Ucl Business Plc Methods and apparatus to control acousto-optic deflectors
KR101973660B1 (ko) 2010-10-22 2019-04-30 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 빔 디더링 및 스카이빙을 위한 레이저 처리 시스템 및 방법

Similar Documents

Publication Publication Date Title
JP2016517352A5 (cg-RX-API-DMAC7.html)
CN105121088B (zh) 激光处理设备和经由激光工具操作而处理工件的方法
JP2015529161A5 (cg-RX-API-DMAC7.html)
TWI583477B (zh) 使用基於雷射放射所控制的射束定位器的雷射機械加工系統及方法
CN104972221B (zh) 一种激光加工设备及激光加工寻焦方法
JP2005193285A5 (cg-RX-API-DMAC7.html)
WO2014206573A3 (de) Verfahren und bearbeitungsmaschine zum generieren eines dreidimensionalen bauteils durch selektives laserschmelzen
WO2006078920A8 (en) High-speed, precise, laser-based material processing method and system
JP2016516584A5 (cg-RX-API-DMAC7.html)
JP2020504675A5 (cg-RX-API-DMAC7.html)
MY185736A (en) Dividing method of workpiece and laser processing apparatus
CN102405122A (zh) 用于镭射加工的改良方法和设备
JP2006167804A5 (cg-RX-API-DMAC7.html)
JP2016516585A5 (cg-RX-API-DMAC7.html)
JP2019111583A (ja) Aodラウト加工用レーザシステム及び方法
JP2019038034A5 (ja) レーザ加工装置、レーザ加工方法、枠体の製造方法及び装置の製造方法
CN103921560B (zh) 一种激光彩色打标方法及系统
JP6535475B2 (ja) レーザ加工方法及びレーザ加工機
WO2015169544A3 (de) Verfahren zur laserbearbeitung einer oberfläche mit repositionierung der oberfläche gegenüber dem laserscanner oder durch steuerung eines encoder-eingang zur drehung einer ablenkung eines laserstrahles
KR101186258B1 (ko) 레이저 가공장치의 스테이지와 스캐너의 동기화 방법
JP2019005743A5 (cg-RX-API-DMAC7.html)
JP2016030294A (ja) レーザー装置の改良構造
JP2015089565A (ja) レーザ照射方法および装置
TWI455783B (zh) 雷射加工方法及其所形成的加工件
WO2013174468A3 (de) Verfahren zum schleifen von werkstücken, insbesondere zum zentrierenden schleifen von werkstücken wie optischen linsen