JP2016517352A5 - - Google Patents
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- JP2016517352A5 JP2016517352A5 JP2016502438A JP2016502438A JP2016517352A5 JP 2016517352 A5 JP2016517352 A5 JP 2016517352A5 JP 2016502438 A JP2016502438 A JP 2016502438A JP 2016502438 A JP2016502438 A JP 2016502438A JP 2016517352 A5 JP2016517352 A5 JP 2016517352A5
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- JP
- Japan
- Prior art keywords
- speed
- target position
- laser
- beam axis
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims 14
- 230000001052 transient effect Effects 0.000 claims 6
- 230000001934 delay Effects 0.000 claims 1
- 230000003111 delayed effect Effects 0.000 claims 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361791656P | 2013-03-15 | 2013-03-15 | |
| US201361791160P | 2013-03-15 | 2013-03-15 | |
| US61/791,160 | 2013-03-15 | ||
| US61/791,656 | 2013-03-15 | ||
| PCT/US2014/027439 WO2014152526A1 (en) | 2013-03-15 | 2014-03-14 | Laser systems and methods for aod tool settling for aod travel reduction |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019195232A Division JP2020037135A (ja) | 2013-03-15 | 2019-10-28 | Aod移動減少用aodツール整定のためのレーザシステム及び方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016517352A JP2016517352A (ja) | 2016-06-16 |
| JP2016517352A5 true JP2016517352A5 (cg-RX-API-DMAC7.html) | 2017-04-20 |
| JP6636417B2 JP6636417B2 (ja) | 2020-01-29 |
Family
ID=51522887
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016502438A Active JP6636417B2 (ja) | 2013-03-15 | 2014-03-14 | Aod移動減少用aodツール整定のためのレーザシステム及び方法 |
| JP2019195232A Pending JP2020037135A (ja) | 2013-03-15 | 2019-10-28 | Aod移動減少用aodツール整定のためのレーザシステム及び方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019195232A Pending JP2020037135A (ja) | 2013-03-15 | 2019-10-28 | Aod移動減少用aodツール整定のためのレーザシステム及び方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9724782B2 (cg-RX-API-DMAC7.html) |
| JP (2) | JP6636417B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR102245812B1 (cg-RX-API-DMAC7.html) |
| CN (2) | CN105121088B (cg-RX-API-DMAC7.html) |
| TW (1) | TWI637803B (cg-RX-API-DMAC7.html) |
| WO (1) | WO2014152526A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10838406B2 (en) | 2013-02-11 | 2020-11-17 | The Aerospace Corporation | Systems and methods for the patterning of material substrates |
| US10613513B2 (en) * | 2013-02-11 | 2020-04-07 | The Aerospace Corporation | Systems and methods for modifying material substrates |
| WO2016144290A1 (en) * | 2015-03-06 | 2016-09-15 | Intel Corporation | Acousto-optics deflector and mirror for laser beam steering |
| SG11201701698VA (en) * | 2015-06-22 | 2017-04-27 | Electro Scient Ind Inc | Multi-axis machine tool and methods of controlling the same |
| WO2017044646A1 (en) | 2015-09-09 | 2017-03-16 | Electro Scientific Industries, Inc. | Laser processing apparatus, methods of laser-processing workpieces and related arrangements |
| WO2018126078A1 (en) | 2016-12-30 | 2018-07-05 | Electro Scientific Industries, Inc. | Method and system for extending optics lifetime in laser processing apparatus |
| WO2019236616A1 (en) * | 2018-06-05 | 2019-12-12 | Electro Scientific Industries, Inc. | Laser-processing apparatus, methods of operating the same, and methods of processing workpieces using the same |
| JP6684872B2 (ja) * | 2018-08-17 | 2020-04-22 | 株式会社アマダホールディングス | レーザ加工機及びレーザ加工方法 |
| US11090765B2 (en) * | 2018-09-25 | 2021-08-17 | Saudi Arabian Oil Company | Laser tool for removing scaling |
| KR102864252B1 (ko) * | 2020-03-04 | 2025-09-26 | 삼성디스플레이 주식회사 | 전자 장치 제조 방법 |
| EP4046741B1 (fr) | 2021-02-23 | 2023-11-01 | DM Surfaces SA | Procede d'usinage laser d'un composant horloger |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5841099A (en) | 1994-07-18 | 1998-11-24 | Electro Scientific Industries, Inc. | Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets |
| TW482705B (en) | 1999-05-28 | 2002-04-11 | Electro Scient Ind Inc | Beam shaping and projection imaging with solid state UV Gaussian beam to form blind vias |
| JP3768730B2 (ja) * | 1999-06-14 | 2006-04-19 | 松下電器産業株式会社 | レーザ加工機およびその数値制御装置ならびにレーザ加工機の制御方法 |
| US6676878B2 (en) | 2001-01-31 | 2004-01-13 | Electro Scientific Industries, Inc. | Laser segmented cutting |
| WO2002067180A1 (en) * | 2001-02-16 | 2002-08-29 | Electro Scientific Industries, Inc. | On-the-fly beam path error correction for memory link processing |
| US6816294B2 (en) | 2001-02-16 | 2004-11-09 | Electro Scientific Industries, Inc. | On-the-fly beam path error correction for memory link processing |
| JP2003136270A (ja) | 2001-11-02 | 2003-05-14 | Hitachi Via Mechanics Ltd | レーザ加工装置 |
| US6706999B1 (en) * | 2003-02-24 | 2004-03-16 | Electro Scientific Industries, Inc. | Laser beam tertiary positioner apparatus and method |
| DE10317363B3 (de) * | 2003-04-15 | 2004-08-26 | Siemens Ag | Verfahren und Vorrichtung zum Bohren von Löchern in einem elektrischen Schaltungssubstrat |
| US6947454B2 (en) * | 2003-06-30 | 2005-09-20 | Electro Scientific Industries, Inc. | Laser pulse picking employing controlled AOM loading |
| JP4443208B2 (ja) | 2003-12-12 | 2010-03-31 | 日立ビアメカニクス株式会社 | スキャナ装置 |
| US7027199B2 (en) | 2004-06-07 | 2006-04-11 | Electro Scientific Industries, Inc. | AOM modulation techniques for facilitating pulse-to-pulse energy stability in laser systems |
| US7923306B2 (en) | 2004-06-18 | 2011-04-12 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots |
| US7259354B2 (en) * | 2004-08-04 | 2007-08-21 | Electro Scientific Industries, Inc. | Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories |
| US20060114948A1 (en) * | 2004-11-29 | 2006-06-01 | Lo Ho W | Workpiece processing system using a common imaged optical assembly to shape the spatial distributions of light energy of multiple laser beams |
| US7244906B2 (en) | 2005-08-30 | 2007-07-17 | Electro Scientific Industries, Inc. | Energy monitoring or control of individual vias formed during laser micromachining |
| US7638731B2 (en) * | 2005-10-18 | 2009-12-29 | Electro Scientific Industries, Inc. | Real time target topography tracking during laser processing |
| US8084706B2 (en) | 2006-07-20 | 2011-12-27 | Gsi Group Corporation | System and method for laser processing at non-constant velocities |
| JP2008049383A (ja) | 2006-08-28 | 2008-03-06 | Sumitomo Heavy Ind Ltd | ビーム照射方法及びビーム照射装置 |
| DE102007012815B4 (de) | 2007-03-16 | 2024-06-06 | Dmg Mori Ultrasonic Lasertec Gmbh | Verfahren und Vorrichtung zur Bildung eines Gesenks |
| US8026158B2 (en) | 2007-06-01 | 2011-09-27 | Electro Scientific Industries, Inc. | Systems and methods for processing semiconductor structures using laser pulses laterally distributed in a scanning window |
| GB0800333D0 (en) | 2008-01-09 | 2008-02-20 | Ucl Business Plc | Beam deflection apparatus and methods |
| US8680430B2 (en) * | 2008-12-08 | 2014-03-25 | Electro Scientific Industries, Inc. | Controlling dynamic and thermal loads on laser beam positioning system to achieve high-throughput laser processing of workpiece features |
| US20100252959A1 (en) | 2009-03-27 | 2010-10-07 | Electro Scientific Industries, Inc. | Method for improved brittle materials processing |
| TWI523720B (zh) * | 2009-05-28 | 2016-03-01 | 伊雷克托科學工業股份有限公司 | 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法 |
| GB201006679D0 (en) | 2010-04-21 | 2010-06-09 | Ucl Business Plc | Methods and apparatus to control acousto-optic deflectors |
| KR101973660B1 (ko) | 2010-10-22 | 2019-04-30 | 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 | 빔 디더링 및 스카이빙을 위한 레이저 처리 시스템 및 방법 |
-
2014
- 2014-03-14 KR KR1020157022813A patent/KR102245812B1/ko active Active
- 2014-03-14 CN CN201480014010.9A patent/CN105121088B/zh active Active
- 2014-03-14 JP JP2016502438A patent/JP6636417B2/ja active Active
- 2014-03-14 US US14/211,162 patent/US9724782B2/en active Active
- 2014-03-14 CN CN201710092567.XA patent/CN107150168B/zh active Active
- 2014-03-14 WO PCT/US2014/027439 patent/WO2014152526A1/en not_active Ceased
- 2014-03-14 TW TW103109582A patent/TWI637803B/zh active
-
2019
- 2019-10-28 JP JP2019195232A patent/JP2020037135A/ja active Pending
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