JP2016513941A5 - - Google Patents

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Publication number
JP2016513941A5
JP2016513941A5 JP2016502833A JP2016502833A JP2016513941A5 JP 2016513941 A5 JP2016513941 A5 JP 2016513941A5 JP 2016502833 A JP2016502833 A JP 2016502833A JP 2016502833 A JP2016502833 A JP 2016502833A JP 2016513941 A5 JP2016513941 A5 JP 2016513941A5
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JP
Japan
Prior art keywords
protective layer
wafer
trenches
ultrasonic transducers
depositing
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JP2016502833A
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English (en)
Japanese (ja)
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JP6297131B2 (ja
JP2016513941A (ja
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Priority claimed from PCT/US2014/028552 external-priority patent/WO2014152987A1/en
Publication of JP2016513941A publication Critical patent/JP2016513941A/ja
Publication of JP2016513941A5 publication Critical patent/JP2016513941A5/ja
Application granted granted Critical
Publication of JP6297131B2 publication Critical patent/JP6297131B2/ja
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JP2016502833A 2013-03-14 2014-03-14 ウェハスケールトランスデューサコーティング及び方法 Active JP6297131B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361781159P 2013-03-14 2013-03-14
US61/781,159 2013-03-14
PCT/US2014/028552 WO2014152987A1 (en) 2013-03-14 2014-03-14 Wafer-scale transducer coating and method

Publications (3)

Publication Number Publication Date
JP2016513941A JP2016513941A (ja) 2016-05-16
JP2016513941A5 true JP2016513941A5 (enExample) 2017-08-10
JP6297131B2 JP6297131B2 (ja) 2018-03-20

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ID=51530489

Family Applications (1)

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JP2016502833A Active JP6297131B2 (ja) 2013-03-14 2014-03-14 ウェハスケールトランスデューサコーティング及び方法

Country Status (5)

Country Link
US (1) US10123775B2 (enExample)
EP (1) EP2973767B1 (enExample)
JP (1) JP6297131B2 (enExample)
CN (1) CN105122488B (enExample)
WO (1) WO2014152987A1 (enExample)

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JP6189033B2 (ja) * 2012-12-14 2017-08-30 株式会社日立製作所 超音波探触子の製造方法、超音波探触子、及び超音波診断装置
JP6569473B2 (ja) * 2015-10-29 2019-09-04 セイコーエプソン株式会社 超音波デバイス、超音波プローブ、電子機器、および超音波画像装置
JP2017080132A (ja) 2015-10-29 2017-05-18 セイコーエプソン株式会社 超音波デバイス、超音波プローブ、電子機器、および超音波画像装置
US10618079B2 (en) * 2016-02-29 2020-04-14 Qualcomm Incorporated Piezoelectric micromechanical ultrasonic transducers and transducer arrays
WO2018125185A1 (en) * 2016-12-30 2018-07-05 Intel Corporation Packaging for ultrasonic transducers
CN110958916B (zh) * 2017-06-30 2022-03-29 皇家飞利浦有限公司 用于管腔内超声成像换能器的埋入式沟槽以及相关的设备、系统和方法
JP6922651B2 (ja) 2017-10-26 2021-08-18 セイコーエプソン株式会社 超音波デバイス、及び超音波測定装置
CN108652669A (zh) * 2018-03-14 2018-10-16 业成科技（成都）有限公司 超音波感测器及其运作方法
US11465177B2 (en) * 2018-05-21 2022-10-11 Fujifilm Sonosite, Inc. PMUT ultrasound transducer with damping layer
US11890136B2 (en) * 2018-08-22 2024-02-06 Philips Image Guided Therapy Corporation Fluid barrier for intraluminal ultrasound imaging and associated devices, systems, and methods
WO2020068473A1 (en) 2018-09-25 2020-04-02 Exo Imaging, Inc. Imaging devices with selectively alterable characteristics
KR102670111B1 (ko) * 2018-09-28 2024-05-27 재단법인대구경북과학기술원 초음파 트랜스듀서 장치의 제조 방법
DE102019101325A1 (de) * 2019-01-17 2020-07-23 USound GmbH Herstellungsverfahren für mehrere MEMS-Schallwandler
CN115644917A (zh) * 2020-03-05 2023-01-31 艾科索成像公司 具有可编程解剖和流成像的超声成像装置
US20230247894A1 (en) * 2020-04-16 2023-08-03 Vuereal Inc. Micro thin-film device
JP2024509305A (ja) * 2021-03-09 2024-02-29 ワンプロジェクツ デザイン アンド イノベーション リミテッド 回転可能な撮像アレイを伴う使い捨て可能カテーテル
EP4348725A1 (de) * 2021-05-28 2024-04-10 Robert Bosch GmbH Verfahren zur herstellung eines mikro-elektronisch-mechanischen schwingungssystems und piezoelektrischer mikrogefertigter ultraschallwandler
US20240023929A1 (en) * 2022-07-20 2024-01-25 SoundCath, Inc. Ultrasonic catheter
FR3155598B1 (fr) * 2023-11-20 2025-10-10 Vermon Sonde ultrasonore à transducteurs MUT et méthode de fabrication d’une telle sonde

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JP2012151583A (ja) * 2011-01-18 2012-08-09 Yamaha Corp 圧電型アクチュエータ
CN106269451B (zh) * 2011-02-15 2020-02-21 富士胶卷迪马蒂克斯股份有限公司 使用微圆顶阵列的压电式换能器
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US10478858B2 (en) * 2013-12-12 2019-11-19 Qualcomm Incorporated Piezoelectric ultrasonic transducer and process

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