JP2016509391A - フローティングコネクタシールド - Google Patents

フローティングコネクタシールド Download PDF

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Publication number
JP2016509391A
JP2016509391A JP2015549438A JP2015549438A JP2016509391A JP 2016509391 A JP2016509391 A JP 2016509391A JP 2015549438 A JP2015549438 A JP 2015549438A JP 2015549438 A JP2015549438 A JP 2015549438A JP 2016509391 A JP2016509391 A JP 2016509391A
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JP
Japan
Prior art keywords
conductive
line
electrical system
dielectric material
conductive line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2015549438A
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English (en)
Japanese (ja)
Other versions
JP2016509391A5 (enExample
Inventor
ズルフィカー エー． カーン，
ズルフィカー エー． カーン，
アレクサンダー ダブリュー． バー，
アレクサンダー ダブリュー． バー，
アレクサンダー アール． マシューズ，
アレクサンダー アール． マシューズ，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2016509391A publication Critical patent/JP2016509391A/ja
Publication of JP2016509391A5 publication Critical patent/JP2016509391A5/ja
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/081—Microstriplines
    • H01P3/084—Suspended microstriplines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Communication Cables (AREA)
  • Waveguides (AREA)
JP2015549438A 2012-12-20 2013-12-05 フローティングコネクタシールド Withdrawn JP2016509391A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261739953P 2012-12-20 2012-12-20
US61/739,953 2012-12-20
PCT/US2013/073228 WO2014099389A1 (en) 2012-12-20 2013-12-05 Floating connector shield

Publications (2)

Publication Number Publication Date
JP2016509391A true JP2016509391A (ja) 2016-03-24
JP2016509391A5 JP2016509391A5 (enExample) 2017-01-19

Family

ID=49887247

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015549438A Withdrawn JP2016509391A (ja) 2012-12-20 2013-12-05 フローティングコネクタシールド

Country Status (5)

Country Link
US (1) US9894750B2 (enExample)
JP (1) JP2016509391A (enExample)
KR (1) KR20150096719A (enExample)
CN (1) CN104885292B (enExample)
WO (1) WO2014099389A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2021182158A1 (enExample) * 2020-03-11 2021-09-16
JPWO2021182157A1 (enExample) * 2020-03-11 2021-09-16
WO2023176643A1 (ja) * 2022-03-17 2023-09-21 株式会社村田製作所 多層基板

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014130431A2 (en) 2013-02-21 2014-08-28 3M Innovative Properties Company Polymer composites with electromagnetic interference mitigation properties
JP2017502513A (ja) 2013-12-18 2017-01-19 スリーエム イノベイティブ プロパティズ カンパニー 一酸化チタン（ｔｉｏ）系材料を用いる電磁干渉（ｅｍｉ）シールド用製品
US9806392B2 (en) * 2015-05-19 2017-10-31 Intel Corporation Crosstalk, power supply noise and/or EMI reduction methods and apparatuses
CN106876850A (zh) * 2015-12-14 2017-06-20 泰科电子(上海)有限公司 介电波导
CN106876849A (zh) 2015-12-14 2017-06-20 泰科电子公司 介电波导组件
CN106876856B (zh) 2015-12-14 2020-12-22 泰连公司 具有介电波导和导电波导的波导组件
CN109804440A (zh) * 2016-10-14 2019-05-24 康普技术有限责任公司 具有浮动屏蔽的双绞线线缆
JP6575586B2 (ja) * 2017-12-21 2019-09-18 株式会社オートネットワーク技術研究所 シールド端子
KR101951429B1 (ko) * 2018-01-05 2019-02-22 국방과학연구소 3차원 형상의 단위 구조체의 배열을 이용한 전파흡수체
CN109346808B (zh) * 2018-10-11 2020-12-08 西安电子科技大学 基于多层自封装悬置共面波导与微带混合的传输线结构
US10694618B2 (en) * 2018-10-29 2020-06-23 Cellink Corporation Flexible hybrid interconnect circuit
WO2020116237A1 (ja) * 2018-12-06 2020-06-11 株式会社村田製作所 伝送線路
EP3787100B1 (en) 2019-08-30 2025-04-23 TE Connectivity Germany GmbH Redirecting device for mm-waves, connection assembly
CN112821065A (zh) * 2021-02-05 2021-05-18 深圳市通用测试系统有限公司 一种差分馈电网络和天线
EP4195402B1 (en) * 2021-12-13 2025-10-15 Nxp B.V. Rf component and method

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6600395B1 (en) * 2000-12-28 2003-07-29 Nortel Networks Limited Embedded shielded stripline (ESS) structure using air channels within the ESS structure
CN100483886C (zh) 2001-11-14 2009-04-29 Fci公司 用于电连接器的串扰减小
US20040048420A1 (en) 2002-06-25 2004-03-11 Miller Ronald Brooks Method for embedding an air dielectric transmission line in a printed wiring board(PCB)
US6758695B2 (en) 2002-06-28 2004-07-06 Tyco Electronics Corporation Connector assembly with a floating shield dividing contacts formed in differential pairs
JP2004104382A (ja) 2002-09-09 2004-04-02 Toshiba Corp マイクロ波移相器
US6786771B2 (en) 2002-12-20 2004-09-07 Teradyne, Inc. Interconnection system with improved high frequency performance
US8035980B2 (en) * 2004-09-15 2011-10-11 Yu-Chiang Cheng Circuit structure and circuit substance for modifying characteristic impedance using different reference planes
US7371117B2 (en) 2004-09-30 2008-05-13 Amphenol Corporation High speed, high density electrical connector
WO2008124054A2 (en) 2007-04-04 2008-10-16 Amphenol Corporation Differential electrical connector with skew control
US7581990B2 (en) 2007-04-04 2009-09-01 Amphenol Corporation High speed, high density electrical connector with selective positioning of lossy regions
JP4624401B2 (ja) * 2007-12-17 2011-02-02 シャープ株式会社 高周波回路および受信装置
EP2209172A1 (en) 2009-01-15 2010-07-21 3M Innovative Properties Company Telecommunications Jack with a Multilayer PCB

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2021182158A1 (enExample) * 2020-03-11 2021-09-16
JPWO2021182157A1 (enExample) * 2020-03-11 2021-09-16
JP7400941B2 (ja) 2020-03-11 2023-12-19 株式会社村田製作所 樹脂多層基板
JP7435734B2 (ja) 2020-03-11 2024-02-21 株式会社村田製作所 樹脂多層基板
WO2023176643A1 (ja) * 2022-03-17 2023-09-21 株式会社村田製作所 多層基板
JPWO2023176643A1 (enExample) * 2022-03-17 2023-09-21

Also Published As

Publication number Publication date
US9894750B2 (en) 2018-02-13
KR20150096719A (ko) 2015-08-25
CN104885292A (zh) 2015-09-02
US20150327357A1 (en) 2015-11-12
WO2014099389A1 (en) 2014-06-26
CN104885292B (zh) 2018-02-02

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