JP2016504491A - エッジ除外シールドを整備するための方法及びシステム - Google Patents
エッジ除外シールドを整備するための方法及びシステム Download PDFInfo
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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- C23C16/042—Coating on selected surface areas, e.g. using masks using masks
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- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
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Abstract
Description
Claims (15)
- 基板処理システム(1000)の処理チャンバ(200;1400)からシールディング要素(190;290;1490)を抽出する方法、又は前記シールディング要素を前記処理チャンバ内に挿入する方法であって、前記基板処理システムは、前記処理チャンバ、基板の部分への材料の適用を除外するための第1シールディング要素(190;290;1490;1890)、及び、基板(60)又は基板キャリア(62)を前記処理チャンバ内へ搬入及び前記処理チャンバから搬出するための基板搬送システム(300;400;1010)を備え、前記方法は、
前記基板搬送システムによって前記第1シールディング要素を搬送することを含む、方法。 - 第1フックアップデバイス(100)を前記基板搬送システム内にロードすること、
前記処理チャンバ内の前記第1フックアップデバイスを前記第1シールディング要素へと搬送すること、及び
前記第1フックアップデバイスを用いて前記第1シールディング要素をフックで持ち上げることを含み、
前記基板搬送システムによって前記第1シールディング要素を搬送することは、前記基板搬送システムによって前記処理チャンバから前記第1シールディング要素を保持する前記第1フックアップデバイスを搬出することを含む、請求項1に記載の方法。 - 前記第1シールディング要素を、前記処理チャンバ内に配置されるシールドフレーム(140)の内部の作業位置から前記基板搬送システムに移送することを含み、
前記基板搬送システムによって前記処理チャンバから前記第1シールディング要素が搬出される、請求項1に記載の方法。 - 前記基板搬送システムによって前記第1シールディング要素が前記処理チャンバから搬送され、前記方法は、
前記基板搬送システムによって第2シールディング要素(1895)を前記処理チャンバ内に搬送することをさらに含む、請求項1から3のいずれか一項に記載の方法。 - 前記第2シールディング要素を保持する第2フックアップデバイスを前記基板搬送システム内にロードすることと、
前記第2シールディング要素を保持する前記第2フックアップデバイスを前記処理チャンバ内に搬送することと、
前記第2シールディング要素を前記処理チャンバ内に設置することと、
前記基板搬送システムを使用して、前記処理チャンバから空の前記第2フックアップデバイスを搬出することと
を含む、請求項4に記載の方法。 - 前記第2シールディング要素を、前記基板搬送システムから前記処理チャンバ内に配置されるシールドフレーム(140)の内部の作業位置に移送することを含む、請求項4に記載の方法。
- 前記第1シールディング要素及び/又は前記第2シールディング要素が、フックで持ち上げられる、又はそれぞれ、機械的係合によって、前記シールドフレームの内部の前記作業位置に移送される又は前記作業位置から移送される、請求項2、3、5、又は6のいずれか一項に記載の方法。
- 前記第1シールディング要素が交換が必要かどうかを判定することを含み、
前記第1シールディング要素が交換が必要かどうかを判定することは、任意選択的に、
ソースから材料が適用された期間から、前記第1シールディング要素上に適用された材料の量を推定し、前記判定をこの推定に基づかせること、及び/又は
処理の均一性及び/又は原位置の外の基板上の粒子の存在を測定し、前記判定を、測定された前記均一性のデータ及び/又は測定された前記粒子のデータに基づかせること、
を含む、請求項1から7のいずれか一項に記載の方法。 - 前記第1シールディング要素上に整備を実行することと、
前記基板搬送システムを使用して、前記整備された第1シールディング要素を前記処理チャンバ内に搬送することと、
前記整備された第1シールディング要素を前記処理チャンバ内に再設置することと
を含む、請求項1から8のいずれか一項に記載の方法。 - 前記設置された第2シールディング要素及び/又は前記再設置された第1シールディング要素を調整することを含み、
調整することは、加熱及び/又はプラズマ洗浄を任意選択的に含む、請求項1から9のいずれか一項に記載の方法。 - 基板(60)の部分への材料の適用を除外するためのシールディング要素(190;290;1490;1890;1895)であって、
前記基板のエッジをシールディングするためのシールディング部(191)、
及び
(i)基板搬送システム(300;400;1010)内の搬送のために、前記シールディング要素をシールドフレーム(140)の内部の位置から基板処理システム(1000)の前記基板搬送システムに移送するための係合部(192、194)、
又は
(ii)前記基板処理システムの前記基板搬送システム内の共同搬送のために、前記シールディング要素をフックアップデバイスにフックで持ち上げるための係合部(292)
のいずれかを含む、シールディング要素。 - (i)シールドフレーム(140)、
又は
(ii)フックアップデバイス(100)
のいずれかであって、
前記シールドフレームは、前記シールディング要素を前記シールドフレームの内部の位置から前記基板搬送システムに移送するための前記係合部(192、194)に係合するように適合される機械的移送部(142、144)を含み、前記フックアップデバイスは、前記基板処理システムの前記基板搬送システム内へロードされるように構成されるフレーム部(134、136)、及び前記基板搬送システム内の共同搬送のために前記シールディング要素をフックで持ち上げて保持するように前記シールディング要素の前記係合部(292)に係合するためのフックアップ部(110、112、113)を含む、請求項11に記載のシールディング要素。 - 前記シールディング要素の前記係合部は、機械的係合要素(192、194、292)を含む、請求項11又は12に記載のシールディング要素。
- 基板処理システム(1000)であって、
処理チャンバ(200;1400)、
基板又は基板キャリアを前記処理チャンバ内へ搬入及び前記処理チャンバから搬出するための基板搬送システム(300;400;1010)、及び
請求項11から13のいずれか一項に記載のシールディング要素(190;290;1490;1890;1895)及びシールドフレーム(140)又はフックアップデバイス(100)を含み、
前記シールディング要素又は前記フックアップデバイスの前記フレーム部は、前記シールディング要素を前記処理チャンバ内へ搬入又は前記処理チャンバから搬出するために、前記基板搬送システム内の搬送のために適合される、基板処理システム。 - 材料の適用の均一性及び/又は前記処理チャンバの外の基板上の粒子の存在を測定するための検出システムと、
コントローラであって、
(i)前記シールディング要素の交換が必要であると判定された場合、前記フックアップデバイスを前記基板搬送システム内に自動的に挿入し、前記シールディング要素をフックで持ち上げることを制御し、且つ前記シールディング要素を前記処理チャンバから搬出するため、
又は
(ii)前記シールディング要素を前記基板搬送システムに移送し、且つ前記シールディング要素を前記処理チャンバから搬出することを自動的に制御するため、
のいずれかのために、前記測定された均一性のデータ及び/又は前記測定された粒子のデータに基づいて、前記シールディング要素が交換が必要かどうかを判定するために、前記測定された均一性のデータ及び/又は前記測定された粒子のデータを受信するように構成されるコントローラと
を含む、請求項14に記載の基板処理システム。
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US10479063B2 (en) | 2014-12-19 | 2019-11-19 | PDS IG Holding LLC | Roller masking system and method |
US10246936B2 (en) * | 2014-12-19 | 2019-04-02 | PDS IG Holding LLC | Masking systems and methods |
WO2017074484A1 (en) * | 2015-10-25 | 2017-05-04 | Applied Materials, Inc. | Apparatus for vacuum deposition on a substrate and method for masking the substrate during vacuum deposition |
CN105200374B (zh) * | 2015-10-31 | 2018-09-11 | 华有光电(东莞)有限公司 | 一种可防二次溅射污染的光学蒸发镀膜设备 |
KR102519797B1 (ko) * | 2016-04-12 | 2023-04-10 | 삼성디스플레이 주식회사 | 증착 장치 및 증착 방법 |
WO2018153480A1 (en) * | 2017-02-24 | 2018-08-30 | Applied Materials, Inc. | Positioning arrangement for a substrate carrier and a mask carrier, transportation system for a substrate carrier and a mask carrier, and methods therefor |
WO2018166636A1 (en) * | 2017-03-17 | 2018-09-20 | Applied Materials, Inc. | Apparatus for vacuum processing of a substrate, system for vacuum processing of a substrate, and method for transportation of a substrate carrier and a mask carrier in a vacuum chamber |
KR20190002415A (ko) * | 2017-05-16 | 2019-01-08 | 어플라이드 머티어리얼스, 인코포레이티드 | 기판을 프로세싱하기 위한 장치, 기판을 프로세싱하기 위한 프로세싱 시스템 및 기판을 프로세싱하기 위한 장치를 서비싱하기 위한 방법 |
KR102182582B1 (ko) * | 2017-06-28 | 2020-11-24 | 가부시키가이샤 아루박 | 스퍼터 장치 |
WO2019020166A1 (en) * | 2017-07-24 | 2019-01-31 | Applied Materials, Inc. | APPARATUS AND SYSTEM FOR PROCESSING A SUBSTRATE IN A VACUUM CHAMBER, AND METHOD FOR ALIGNING A SUBSTRATE CARRIER WITH A MASK CARRIER |
US10861692B2 (en) | 2017-10-26 | 2020-12-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | Substrate carrier deterioration detection and repair |
CN110024100A (zh) * | 2017-11-10 | 2019-07-16 | 应用材料公司 | 对准载体的方法、用于对准载体的设备和真空系统 |
CN111312932A (zh) * | 2018-12-11 | 2020-06-19 | 机光科技股份有限公司 | 有机光电组件的连续式量产设备及有机光电组件的制造方法 |
US11440306B2 (en) | 2019-01-11 | 2022-09-13 | PDS IG Holdings LLC | Gantry based film applicator system |
KR102315980B1 (ko) * | 2019-12-16 | 2021-10-21 | 주식회사 에프티시스템 | 오염방지를 위한 소자증착장치 |
TWI788032B (zh) * | 2021-09-28 | 2022-12-21 | 天虹科技股份有限公司 | 開合式遮蔽機構及具有開合式遮蔽機構的薄膜沉積機台 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004335601A (ja) * | 2003-05-02 | 2004-11-25 | Ishikawajima Harima Heavy Ind Co Ltd | 薄膜形成装置の基板搬送装置 |
JP2012500900A (ja) * | 2008-08-25 | 2012-01-12 | アプライド マテリアルズ インコーポレイテッド | 可動シールドをもつコーティングチャンバ |
EP2432008A1 (en) * | 2010-09-17 | 2012-03-21 | Applied Materials, Inc. | Replaceable substrate masking on carrier and method for processing a substrate |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5478455A (en) * | 1993-09-17 | 1995-12-26 | Varian Associates, Inc. | Method for controlling a collimated sputtering source |
US5489369A (en) | 1993-10-25 | 1996-02-06 | Viratec Thin Films, Inc. | Method and apparatus for thin film coating an article |
US6809018B2 (en) | 2002-07-11 | 2004-10-26 | Macronix International Co., Ltd. | Dual salicides for integrated circuits |
EP1717339A2 (de) * | 2005-04-20 | 2006-11-02 | Applied Films GmbH & Co. KG | Kontinuierliche Beschichtungsanlage |
EP2159302B1 (en) | 2008-08-25 | 2015-12-09 | Applied Materials, Inc. | Coating chamber with a moveable shield |
DE102010000447A1 (de) * | 2010-02-17 | 2011-08-18 | Aixtron Ag, 52134 | Beschichtungsvorrichtung sowie Verfahren zum Betrieb einer Beschichtungsvorrichtung mit einer Schirmplatte |
-
2012
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- 2012-11-15 KR KR1020157015588A patent/KR102048847B1/ko active IP Right Grant
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004335601A (ja) * | 2003-05-02 | 2004-11-25 | Ishikawajima Harima Heavy Ind Co Ltd | 薄膜形成装置の基板搬送装置 |
JP2012500900A (ja) * | 2008-08-25 | 2012-01-12 | アプライド マテリアルズ インコーポレイテッド | 可動シールドをもつコーティングチャンバ |
EP2432008A1 (en) * | 2010-09-17 | 2012-03-21 | Applied Materials, Inc. | Replaceable substrate masking on carrier and method for processing a substrate |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024053912A1 (ko) * | 2022-09-06 | 2024-03-14 | 삼성디스플레이 주식회사 | 증착 장치 |
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EP2920339A1 (en) | 2015-09-23 |
TWI636493B (zh) | 2018-09-21 |
KR20150085002A (ko) | 2015-07-22 |
KR102048847B1 (ko) | 2019-11-26 |
US20150303041A1 (en) | 2015-10-22 |
JP6080027B2 (ja) | 2017-02-15 |
US9640372B2 (en) | 2017-05-02 |
CN104781448B (zh) | 2018-04-03 |
TW201428822A (zh) | 2014-07-16 |
CN104781448A (zh) | 2015-07-15 |
WO2014075729A1 (en) | 2014-05-22 |
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