JP2016225373A - Semiconductor device and adhesive sheet - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor device and an adhesive sheet capable of suppressing generation of poor appearance of the semiconductor device.SOLUTION: A semiconductor device 10 comprises: a support member 11; a cured product 12 of an adhesive agent layer provided on the support member 11; a second semiconductor chip S2 provided on the cured product 12 of the adhesive agent layer; and an encapsulation material 13 that encapsulates the second semiconductor chip S2. A color tone of the cured product 12 of the adhesive agent layer is the same as that of the encapsulation material 13. Thereby, generation of poor appearance of the device can be suppressed.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a semiconductor device and an adhesive sheet.

  An adhesive sheet (die-bonded dicing sheet) is known which is formed by laminating a film-like adhesive used for a wafer back surface pasting method and a dicing tape (see, for example, Patent Document 1). . The adhesive sheet described in Patent Document 1 has, for example, a four-layer structure of peelable sheet / adhesive layer / adhesive layer / base material sheet. An embedded semiconductor device has been developed in which an adhesive sheet functioning as such a die bond dicing sheet is used and a semiconductor chip bonded and fixed on a support member is sealed with a sealing material.

JP 7-44557 A

  In the process of manufacturing the embedded semiconductor device described above, the adhesive layer corresponding to the volume of the embedded semiconductor chip may protrude in the lateral direction of the semiconductor chip at the same time as the semiconductor chip is embedded with the adhesive layer. In order to obtain a small-sized semiconductor device, it is necessary to divide into pieces at a position close to the end of the embedded semiconductor chip. If the cured product of the adhesive layer is exposed from the surface of the sealing material on the outer surface of the obtained semiconductor device, or the cured product of the adhesive layer is transparent from the surface of the sealing material, the appearance of the device is poor. May occur.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a semiconductor device and an adhesive sheet that can suppress appearance defects.

  A semiconductor device according to one aspect of the present invention seals a support member, a cured product of an adhesive layer provided on the support member, a semiconductor chip provided on the cured product of the adhesive layer, and the semiconductor chip The color of the cured product of the adhesive layer is the same as the color of the sealing material.

  In this semiconductor device, the color of the cured product of the adhesive layer is the same as the color of the sealing material. For this reason, even when the cured product of the adhesive layer is exposed from the surface of the sealing material on the outer surface of the semiconductor device or the cured product of the adhesive layer is transparent from the surface of the sealing material, It is possible to show the cured product and the sealing material together. Therefore, it is possible to suppress the occurrence of defective appearance of the device.

  The cured product of the adhesive layer may be exposed from the surface of the sealing material. When the hardened | cured material of an adhesive bond layer is exposed from the surface of a sealing material, the external appearance defect by the difference between the color of the hardened | cured material of an adhesive bond layer and the color of a sealing material tends to produce especially. Therefore, by making the color of the cured product of the adhesive layer and the color of the sealing material the same, it is possible to suitably suppress the occurrence of the appearance defect of the device.

  The brightness of the cured product of the adhesive layer may be the same as the brightness of the sealing material. In this case, the hardened | cured material of an adhesive bond layer and a sealing material can be shown more reliably integrally.

  The saturation of the cured product of the adhesive layer may be the same as the saturation of the sealing material. In this case, the hardened | cured material of an adhesive bond layer and a sealing material can be shown more reliably integrally.

  The color of the cured product of the adhesive layer may be the same as or adjacent to the color of the sealing material in the hue ring. In this case, the hardened | cured material of an adhesive bond layer and a sealing material can be shown more reliably integrally.

  The color of the cured product of the adhesive layer may be the same as the color of the sealing material. In this case, the cured product of the adhesive layer and the sealing material can be more reliably integrated.

  An adhesive sheet according to an aspect of the present invention is an adhesive sheet used for manufacturing a semiconductor device in which a semiconductor chip provided on a support member is sealed with a sealing material via a cured product of an adhesive layer. A peelable sheet, an adhesive layer provided on one side of the peelable sheet, an adhesive layer provided on the adhesive layer so as to cover the adhesive layer, and an adhesive layer so as to cover the adhesive layer And a base sheet provided on the agent layer, and the color after curing of the adhesive layer is the same as the color of the sealing material.

  This adhesive sheet is used for manufacturing a semiconductor device, and the color after the adhesive layer is cured is the same as the color of the sealing material. For this reason, even when the cured product of the adhesive is exposed from the surface of the sealing material on the outer surface of the manufactured semiconductor device or the cured product of the adhesive layer is transparent from the surface of the sealing material, the adhesive It becomes possible to show the cured product of the layer and the sealing material integrally. Therefore, it is possible to suppress the occurrence of defective appearance of the device.

  The brightness of the cured product of the adhesive layer may be the same as the brightness of the sealing material. In this case, the hardened | cured material of an adhesive bond layer and a sealing material can be shown more reliably integrally.

  The saturation of the cured product of the adhesive layer may be the same as the saturation of the sealing material. In this case, the hardened | cured material of an adhesive bond layer and a sealing material can be shown more reliably integrally.

  The color of the cured product of the adhesive layer may be the same as or adjacent to the color of the sealing material in the hue ring. In this case, the hardened | cured material of an adhesive bond layer and a sealing material can be shown more reliably integrally.

  The color of the cured product of the adhesive layer may be the same as the color of the sealing material. In this case, the cured product of the adhesive layer and the sealing material can be more reliably integrated.

  The viscosity at 80 ° C. of the adhesive layer may be 10,000 Pa · s or less. In this case, the embedding property of the semiconductor chip by the adhesive layer can be sufficiently enhanced in the die bonding process using the adhesive sheet.

  A state in which a peelable sheet has a long shape and a plurality of laminates in which an adhesive layer, a pressure-sensitive adhesive layer, and a base material sheet are laminated are spaced apart from each other along the longitudinal direction of the peelable sheet It may be wound in a roll. In this case, the laminated body and the semiconductor wafer can be sequentially bonded while feeding the adhesive sheet from the roll, so that the productivity of the semiconductor device can be improved.

  According to the present invention, it is possible to suppress the appearance defect of the semiconductor device.

1 is a perspective view of a semiconductor device according to an embodiment. It is sectional drawing along the II-II line of FIG. It is sectional drawing along the III-III line of FIG. It is a perspective view of the adhesive sheet used in order to manufacture the semiconductor device of FIG. It is the top view and sectional drawing of the adhesive sheet of FIG. It is a figure which shows the state which bonded the laminated body and the semiconductor wafer. It is a figure which shows the state which is dicing the semiconductor wafer of FIG. It is a figure which shows the state which has picked up the semiconductor wafer and adhesive layer which were separated into pieces of FIG. It is a top view of the 1st semiconductor chip provided on the substrate. FIG. 10 is a diagram showing a state where the second semiconductor chip of FIG. 8 is die-bonded on the first semiconductor chip of FIG. 9. It is a figure which shows the state which carried out the wire bonding of the 2nd semiconductor chip of FIG. 10 on the board | substrate. It is a figure for demonstrating the modification of the manufacturing method of a semiconductor device.

  Hereinafter, this embodiment will be described in detail with reference to the accompanying drawings. In the description, the same reference numerals are used for the same elements or elements having the same function, and redundant description is omitted.

(Semiconductor device)
The configuration of the semiconductor device 10 according to the embodiment will be described with reference to FIGS. FIG. 1 is a perspective view of a semiconductor device according to the embodiment. FIG. 2 is a cross-sectional view taken along line II-II in FIG. FIG. 3 is a cross-sectional view taken along line III-III in FIG.

  As shown in FIGS. 1 to 3, the semiconductor device 10 has a substantially rectangular parallelepiped shape. The semiconductor device 10 includes outer surfaces 10a to 10f as device outer surfaces. The outer surfaces 10a and 10b are opposed to each other. The outer surfaces 10c and 10d are opposed to each other. The outer surfaces 10e and 10f are opposed to each other. The direction in which the outer surfaces 10a and 10b face each other, the direction in which the outer surfaces 10c and 10d face each other, and the direction in which the outer surfaces 10e and 10f face each other are orthogonal to each other.

  As shown in FIGS. 2 and 3, the semiconductor device 10 includes a support member 11, a first semiconductor chip S <b> 1, a cured product 12 of the adhesive layer, and a cured product 12 provided on the cured product 12 of the adhesive layer. 2 semiconductor chip S2 and sealing material 13 are provided.

  The support member 11 is a flat plate having a substantially rectangular shape in plan view. Here, the support member 11 has a substantially rectangular shape in plan view. The support member 11 is, for example, a lead frame. One main surface of the support member 11 forms the outer surface of the semiconductor device 10. The side surface of the support member 11 forms part of the outer surfaces 10 c to 10 f of the semiconductor device 10.

  The first semiconductor chip S1 has a substantially rectangular shape in plan view. Here, the first semiconductor chip S1 has a substantially rectangular shape in plan view. The first semiconductor chip S1 is fixed on the other main surface of the support member 11 via a cured product 14 formed by curing a silver paste or a film-like adhesive layer. The first semiconductor chip S1 is wire bonded to the support member 11 with a plurality of wires W1.

  The cured product 12 of the adhesive layer is a cured product obtained by curing the adhesive layer 23p (see FIG. 8). The adhesive layer 23p will be described later. The cured product 12 of the adhesive layer is provided on the support member 11 so as to embed the wire W1 and the first semiconductor chip S1. The color of the cured product 12 of the adhesive layer is black.

  As shown in FIG. 1, the cured product 12 of the adhesive layer is exposed from the surface of the sealing material 13 on the outer surfaces 10e and 10f (see FIG. 2) of the semiconductor device 10, and the exposed portion 12a is exposed to the outer surfaces 10e and 10f. Part of 10f. The cured product 12 of the adhesive layer is not exposed on the outer surfaces 10 a to 10 d (see FIG. 3) of the semiconductor device 10.

  The exposed portion 12a has a strip shape or a substantially rectangular shape. The exposed portion 12a extends along the opposing direction of the outer surface 10e and the outer surface 10f (see FIG. 2) at a position from the support member 11. Here, “substantially rectangular” means to include a shape with rounded corners. In addition, the exposed part 12a is the periphery of the outer surfaces 10e and 10f (that is, the end on the outer surfaces 10a to 10d (see FIG. 3) side of the outer surface 10e and the end on the outer surfaces 10a to 10d side of the outer surface 10f) of the outer surfaces 10e and 10f. It is away from. The exposed portion 12a is also separated from the side surface of the support member 11 on the outer surfaces 10e and 10f.

  The second semiconductor chip S2 has a substantially rectangular shape in plan view. Here, the second semiconductor chip S2 has a substantially rectangular shape in plan view. The area of the second semiconductor chip S2 in plan view is slightly larger than the area of the first semiconductor chip S1 in plan view. The second semiconductor chip S2 is wire bonded to the support member 11 with a plurality of wires W2.

  The sealing material 13 is composed of, for example, an epoxy resin, a curing agent, a curing accelerator, and a filler. The sealing material 13 seals the wire W2 and the second semiconductor chip S2. The sealing material 13 constitutes a part of the outer surfaces 10 c to 10 f of the semiconductor device 10 and the outer surface 10 b. The color of the sealing material 13 is black, similar to the cured product 12 of the adhesive layer.

  In the semiconductor device 10, as described above, the cured product 12 of the adhesive layer is exposed on the outer surfaces 10 e and 10 f of the semiconductor device 10. That is, the cured product 12 of the adhesive layer is exposed from the surface of the sealing material 13 in a band shape or a substantially rectangular shape, and the outer surfaces 10e and 10f of the semiconductor device 10 are seen from the support member 11 side as viewed from the support member 11 side. 13, the exposed portions 12 a of the cured product 12 of the adhesive layer and the sealing material 13 are alternately arranged.

  In contrast to such a configuration, in the semiconductor device 10, the cured product 12 and the sealing material 13 of the adhesive layer are both black. Therefore, on the outer surfaces 10e and 10f of the semiconductor device 10, the exposed portion 12a of the cured product 12 of the adhesive layer and the sealing material 13 have the same color, so that the exposed portion 12a can be seen integrally with the sealing material 13. Become.

  The cured product 12 and the sealing material 13 of the adhesive layer do not necessarily need to be black, and may have the same color. The same color means that the color difference is not noticeable in addition to the case of the same color. For example, when the cured product 12 and the sealing material 13 of the adhesive layer are made the same color, each may be a dark color such as blue, green, and brown. Alternatively, one of the cured product 12 and the sealing material 13 of the adhesive layer may be black, and the other may be a dark color such as blue, green, and brown.

  The brightness of the cured product 12 of the adhesive layer may be the same as the brightness of the sealing material 13, and the saturation of the cured product 12 of the adhesive layer may be the same as the saturation of the sealing material 13. Specifically, in the color sample book 2015 H edition issued by the Japan Paint Manufacturers Association, the brightness of the cured product 12 and the sealing material 13 of the adhesive layer is 0 to 55 when the color is achromatic. The brightness may be a value close to 0. The colors of the cured product 12 and the sealing material 13 of the adhesive layer may be color categories 05, 19, 22, 25, 35, 45, 55, 65, 75, 85, and 95. The color of the cured product 12 and the sealing material 13 of the adhesive layer may have a lightness of 40 or less or a lightness close to 0 in any color classification.

  Further, the color of the cured product 12 of the adhesive layer and the color of the sealing material 13 may be similar colors. That is, the color of the cured product 12 of the adhesive layer may be the same as or adjacent to the color of the sealing material 13 in the hue ring. For example, in the hue circle of the Nippon Color Research Coordination System (PCCS), 24 hues are consecutive in the order of red → orange → yellow → green → blue → indigo → purple. Therefore, one of the adjacent hues in this hue ring may be selected as the color of the cured product 12 of the adhesive layer, and the other may be selected as the color of the sealing material 13. It should be noted that the color of the cured product 12 of the adhesive layer and the color of the sealing material 13 do not necessarily have to be the same or adjacent colors in the hue ring, and at least do not have a complementary color relationship.

(Adhesive sheet)
With reference to FIG.4 and FIG.5, the structure of the adhesive sheet 20 used in order to manufacture the said semiconductor device 10 is demonstrated. FIG. 4 is a perspective view of an adhesive sheet used for manufacturing the semiconductor device of FIG. Fig.5 (a) is a top view of the adhesive sheet of FIG. FIG. 5B is a cross-sectional view taken along the line Vb-Vb in FIG. The adhesive sheet 20 is a die bond dicing sheet used for manufacturing the semiconductor device 10.

  As shown in FIGS. 4 and 5, the adhesive sheet 20 is long and is wound around a cylindrical winding core 21 in a roll shape. The adhesive sheet 20 includes a peelable sheet 22, and a laminate L formed by laminating an adhesive layer 23, an adhesive layer 24, and a base sheet 25 in this order.

  The peelable sheet 22 is a long sheet or film. The longitudinal direction of the peelable sheet 22 coincides with the longitudinal direction of the adhesive sheet 20. The peelable sheet 22 is wound around the winding core 21 in a roll shape in a state in which a plurality of laminated bodies L are arranged apart from each other along the longitudinal direction of the peelable sheet 22.

  The peelable sheet 22 is, for example, a polyester film such as a polyethylene terephthalate film, a polytetrafluoroethylene film, a polyethylene film, a polypropylene film, a polymethylpentene film, a polyolefin film such as a polyvinyl acetate film, a polyvinyl chloride film, or a polyimide film. Made of plastic film. The peelable sheet 22 may be made of paper, non-woven fabric, metal foil, or the like, for example.

  One surface (one surface) 22a of the release sheet 22 may be a release surface treated with a release agent such as a silicone release agent, a fluorine release agent, or a long-chain alkyl acrylate release agent. The thickness of the peelable sheet 22 is appropriately set as long as the workability is not impaired. The thickness of the peelable sheet 22 is usually 1000 μm or less, preferably 1 to 100 μm, more preferably 2 to 20 μm, and particularly preferably 3 to 10 μm.

  The adhesive layer 23 is provided on one surface 22 a of the peelable sheet 22. The adhesive layer 23 has a substantially circular shape in plan view. The adhesive layer 23 is made of various known thermosetting adhesives, photocurable adhesives, thermoplastic adhesives, oxygen reactive adhesives, or the like that are used for bonding (bonding) semiconductor chips. The adhesive layer 23 may be composed of these alone or in combination of two or more.

  The thickness of the adhesive layer 23 is usually 1 to 200 μm, preferably 3 to 150 μm. The thickness of the adhesive layer 23 is more preferably 40 to 140 μm for the purpose of embedding wires and semiconductor chips. If the thickness of the adhesive layer 23 is thinner than 40 μm, it is difficult to sufficiently embed the wire and the semiconductor chip. In addition, when the thickness of the adhesive layer 23 is greater than 200 μm, the amount of adhesive used increases, which may increase the manufacturing cost of the semiconductor device 10.

  The adhesive layer 23 is colored black in advance by adding a pigment, for example. The adhesive layer 23 may be one that does not change color before and after curing, or one that changes color before and after curing. When the color of the adhesive layer 23 is changed before and after curing, the color may be changed with the progress of curing of the adhesive layer 23, or the color may be changed by a thermal history.

  Generally, the method for manufacturing the semiconductor device 10 includes a sealing material curing step (for example, 170 ° C., about 3 hours) for curing the sealing material 13. For this reason, the adhesive layer 23 may be configured to be colored at 170 ° C. for about 3 hours, for example. Further, the sealing step of sealing the second semiconductor chip S2 with the sealing material 13 (for example, about 175 ° C. for about 5 minutes) completes the curing of the sealing material 13, and the manufacturing method of the semiconductor device 10 is sealed. In some cases, the material curing step is not included. Accordingly, the adhesive layer 23 may be colored by a wire bonding step (generally about 150 ° C. for about 30 minutes) or a die bonding step (for example, about 120 ° C. for about 1 minute). In this case, the adhesive layer 23 is colored at 150 ° C. for about 30 minutes, or 120 ° C. for about 1 minute, for example.

  In order to embed the first semiconductor chip S1 in the die bonding process, the adhesive layer 23 needs to flow sufficiently by the heat applied in the die bonding process. The viscosity at 80 ° C. of the adhesive layer 23 is preferably 10,000 Pa · s or less. In consideration of the embedding property of the first semiconductor chip S1, the viscosity of the adhesive layer 23 at 80 ° C. is preferably 5000 Pa · s or less, and more preferably 3000 Pa · s or less. The viscosity of the adhesive layer 23 at 80 ° C. is measured with a rotary viscoelasticity measuring device (ARES-RDA) manufactured by TA Instruments Japan Co., Ltd., an 8 mmφ jig, a sample having a thickness of 100 to 200 μm. It is done using. As measurement conditions, for example, a strain of 5%, a torque of 200 g · cm, and an initial load of 100 g may be used.

  The pressure-sensitive adhesive layer 24 is provided on the adhesive layer 23 so as to cover the entire adhesive layer 23. The pressure-sensitive adhesive layer 24 has a substantially circular shape in plan view. The area of the pressure-sensitive adhesive layer 24 in plan view is slightly larger than the area of the adhesive layer 23 in plan view. The peripheral edge of the pressure-sensitive adhesive layer 24 does not overlap the adhesive layer 23 and is provided in direct contact with one surface 22 a of the peelable sheet 22.

  The component contained in the pressure-sensitive adhesive layer 24 is not particularly specified. The pressure-sensitive adhesive layer 24 includes, for example, a compound having a diol group, an isocyanate compound, a urethane (meth) acrylate compound, a diamine compound, a urea methacrylate compound, and a high energy ray polymerizable copolymer having an ethylenically unsaturated group in the side chain. Consists of. The component contained in the pressure-sensitive adhesive layer 24 is preferably a component that has little change in adhesiveness due to storage environment such as temperature, humidity, time, and the presence or absence of oxygen, and more preferably a component that has no change due to the environment. In addition, the component contained in the pressure-sensitive adhesive layer 24 may be a component that is cured by high energy rays such as ultraviolet rays or radiation and heat (that is, the adhesive force is reduced), and particularly a component that is cured by high energy rays is preferable. Is preferably a component that is cured by ultraviolet rays.

  The base material sheet 25 is provided on the pressure-sensitive adhesive layer 24 so as to cover the whole pressure-sensitive adhesive layer 24. The base sheet 25 has a substantially circular shape in plan view. The area of the base material sheet 25 in plan view is the same as the area of the pressure-sensitive adhesive layer 24 in plan view. The entire base sheet 25 overlaps the pressure-sensitive adhesive layer 24. Thereby, the base material sheet 25 functions as a protective film for protecting the pressure-sensitive adhesive layer 24.

  The base sheet 25 can be composed of a sheet similar to the sheet forming the peelable sheet 22 or a film similar to the film forming the peelable sheet 22. That is, the base sheet 25 is, for example, a polyester film such as a polyethylene terephthalate film, a polytetrafluoroethylene film, a polyethylene film, a polypropylene film, a polymethylpentene film, a polyolefin film such as a polyvinyl acetate film, a polyvinyl chloride film, It consists of a plastic film such as a polyimide film. The thickness of the base material sheet 25 is 10-500 micrometers normally, Preferably it is 50-200 micrometers.

(Method for manufacturing semiconductor device)
A method for manufacturing the semiconductor device 10 according to the embodiment will be described with reference to FIGS. FIG. 6 is a diagram illustrating a state in which the stacked body and the semiconductor wafer are bonded to each other. FIG. 7 is a view showing a state where the semiconductor wafer of FIG. 6 is diced. FIG. 8 is a diagram showing a state where the separated semiconductor wafer and adhesive layer of FIG. 7 are picked up. FIG. 9 is a plan view of the first semiconductor chip provided on the substrate. FIG. 10 is a diagram showing a state where the second semiconductor chip of FIG. 8 is die-bonded on the first semiconductor chip of FIG. FIG. 11 is a diagram showing a state where the second semiconductor chip of FIG. 10 is wire-bonded on the substrate.

  First, the peelable sheet 22 is peeled and removed from the adhesive sheet 20 shown in FIG. 5 to expose the adhesive layer 23. The peeling and removal of the peelable sheet 22 is gradually performed from the periphery of the adhesive sheet 20.

  Subsequently, as illustrated in FIG. 6, the stacked body L and the semiconductor wafer 26 are bonded together. Specifically, the entire other surface 26b of the semiconductor wafer 26 is bonded to the central portion excluding the peripheral edge portion of the exposed one surface 23a of the adhesive layer 23. Further, the other surface 27 b of the dicing ring frame 27 is bonded to the peripheral portion of the one surface 24 a of the pressure-sensitive adhesive layer 24, that is, the portion outside the adhesive layer 23. The ring frame 27 is an annular molded body made of metal or plastic. The inner diameter of the ring frame 27 is larger than the outer diameter of the semiconductor wafer 26 and larger than the outer diameter of the adhesive layer 23.

  Next, as shown in FIG. 7, the semiconductor wafer 26 and the adhesive layer 23 are cut into a predetermined size by a blade 28 such as a rotary blade (first dicing step). Here, the semiconductor wafer 26 and the adhesive layer 23 are cut in the thickness direction, and the pressure-sensitive adhesive layer 24 is cut. Note that the adhesive layer 23 may not be completely cut in the thickness direction, and an uncut portion may be left as a part. Moreover, you may cut | disconnect only the semiconductor wafer 26 and the adhesive bond layer 23 so that the adhesive layer 24 may not be cut | disconnected. By the first dicing step, the semiconductor wafer 26 and the adhesive layer 23 are separated into pieces simultaneously, and a plurality of pairs of the semiconductor wafer 26p and the adhesive layer 23p are obtained. Here, the semiconductor wafer 26p corresponds to the second semiconductor chip S2.

  A commercially available dicer can be used for the first dicing step. Examples of the dicer include a full automatic dicing saw 6000 series and a semi-automatic dicing saw 3000 series manufactured by DISCO Corporation. Examples of the blade 28 include dicing blades NBC-ZH05 series and NBC-ZH series manufactured by DISCO Corporation.

  In the first dicing step, a laser can be used instead of the blade 28. Examples of the laser-type dicer include a fully automatic laser saw 7000 series manufactured by DISCO Corporation.

  Next, the adhesive force between the adhesive layer 23p and the pressure-sensitive adhesive layer 24 is reduced by irradiating ultraviolet rays or the like. Subsequently, as shown in FIG. 8, the second semiconductor chip S2 with the adhesive layer 23p is picked up (pickup process).

  Next, as shown in FIG. 9, a substrate 31 to which the first semiconductor chip S1 is fixed is prepared. The substrate 31 is, for example, a lead frame or a resist substrate. The first semiconductor chip S1 is fixed to the substrate 31 with a cured product 14 (see FIG. 2) of a silver paste or a film-like adhesive layer. The first semiconductor chip S1 is wire bonded to the substrate 31 with a wire W1. Wire bonding is performed on two sides of the first semiconductor chip S1 that are opposed to each other in plan view.

  Subsequently, the second semiconductor chip S2 with the adhesive layer 23p is placed on the first semiconductor chip S1, and heated and pressurized (die bonding step). Thereby, as shown in FIG. 10, the adhesive layer 23p embeds the first semiconductor chip S1 and the wire W1. Here, when the embedding property is insufficient, additional embedding and heat curing are performed using a pressure oven as necessary.

  Next, as shown in FIG. 11, the second semiconductor chip S2 is wire-bonded to the substrate 31 with a wire W2 (wire bonding step). Wire bonding is performed with respect to two sides of the second semiconductor chip S2 facing each other in plan view.

  Subsequently, a sealing material is provided on the substrate 31 so as to cover the second semiconductor chip S2 and the entire cured product 12 of the adhesive layer. Thereby, 2nd semiconductor chip S2 is sealed with a sealing material (sealing process). Here, the process of hardening a sealing material is performed as needed (sealing material hardening process). Through the steps so far, the adhesive layer 23p is cured to become a cured product 12 of the adhesive layer.

  Next, the sealing material and the substrate 31 are cut into a predetermined size (second dicing step). For the second dicing step, for example, a dicer similar to the first dicing step can be used. The semiconductor device 10 is obtained by the second dicing process. That is, the separated sealing material corresponds to the sealing material 13 (see FIG. 3), and the separated substrate 31 corresponds to the support member 11 (see FIG. 3). 6 to 11 exemplify the case of using the substrate 31 provided with a set of the first semiconductor chip S1 and the second semiconductor chip S2, a plurality of sets of the first semiconductor chip S1 and the second semiconductor chip are used. The substrate 31 provided with S2 may be used.

  In this case, as shown in FIG. 12, first, a substrate 31 provided with a plurality of sets of first semiconductor chips S1 and second semiconductor chips S2 is prepared. Here, a set of the first semiconductor chip S1 and the second semiconductor chip S2 is arranged in a 5 × 3 grid pattern on the substrate 31. Next, a sealing process and a sealing material hardening process are performed as needed. Thereafter, the substrate 31 is cut into a grid shape along a plurality of dicing lines D formed of straight lines. Thereby, a plurality of semiconductor devices 10 can be obtained.

  As described above, in the semiconductor device 10, the cured product 12 of the adhesive layer is exposed in a strip shape or a substantially rectangular shape from the surface of the sealing material 13 on the outer surfaces 10 e and 10 f. Thereby, in the outer surfaces 10e and 10f, the sealing material 13, the exposed portion 12a of the cured product 12 of the adhesive layer, and the sealing material 13 are alternately arranged when viewed from the support member 11 side. That is, the appearance defect due to the difference between the color of the cured product 12 of the adhesive layer and the color of the sealing material 13 is particularly likely to occur.

  Here, in the semiconductor device 10, the color of the cured product 12 and the sealing material 13 of the adhesive layer are both black and the same color, and the color is the same. Moreover, in the adhesive sheet 20 used for manufacture of the semiconductor device 10, the adhesive layer 23 is colored black in advance by adding a pigment, for example, and does not change color before and after curing. For this reason, in the semiconductor device 10, the cured product 12 of the adhesive layer and the sealing material 13 are reliably integrated with each other even though the cured product 12 of the adhesive layer is exposed from the surface of the sealing material 13. It becomes possible to show it. Therefore, it is possible to reliably suppress the appearance defect of the semiconductor device 10.

  The viscosity at 80 ° C. of the adhesive layer 23 is 10000 Pa · s or less. For this reason, in the die-bonding process using the adhesive sheet 20, the embedding property of the wire W1 and the first semiconductor chip S1 by the separated adhesive layer 23p can be sufficiently enhanced. Thereby, it is possible to suppress the occurrence of defects due to insufficient embedding.

  While the peelable sheet 22 has a long shape, the plurality of laminated bodies L are wound in a roll shape in a state of being separated from each other along the longitudinal direction of the peelable sheet 22. For this reason, the laminated body L and the semiconductor wafer 26 can be bonded together sequentially while paying out the adhesive sheet 20 from the roll. Thereby, the productivity of the semiconductor device 10 can be improved.

  As mentioned above, although embodiment of this invention was described, this invention is not limited to the said embodiment, A various change is possible in the range which does not change the summary. For example, the cured product 12 of the adhesive layer may not be exposed from the surface of the sealing material 13 on the outer surfaces 10 a to 10 f of the semiconductor device 10. That is, the sealing material 13 may seal the wire W2 and the second semiconductor chip S2 together with the cured product 12 of the adhesive layer. Even in such a case, the appearance of the semiconductor device 10 may be deteriorated due to the cured product 12 of the adhesive layer being transparent from the surface of the sealing material 13. In the semiconductor device 10, since the color of the cured product 12 of the adhesive layer is the same as the color of the encapsulant 13, the cured product 12 of the adhesive layer and the encapsulant 13 are shown integrally. Therefore, the appearance defect of the semiconductor device 10 can be suppressed.

  The entire color of the cured product 12 of the adhesive layer is not limited to the same color as the color of the sealing material 13, for example, only the exposed portion 12 a of the cured product 12 of the adhesive layer is colored black, The color of the sealing material 13 may be the same.

  The semiconductor device 10 only needs to include the support member 11, the cured product 12 of the adhesive layer, the second semiconductor chip S2, and the sealing material 13, and may not include the first semiconductor chip S1. . Further, the second semiconductor chip S2 may be electrically connected to the support member 11 by connection means other than the wire W2.

  The shape of the semiconductor device 10 is not limited to a substantially rectangular parallelepiped, and can be appropriately changed according to the shape of the second semiconductor chip S2. Further, the shapes of the adhesive layer 23, the pressure-sensitive adhesive layer 24, and the base material sheet 25 of the adhesive sheet 20 are not limited to a circle, and can be appropriately changed according to the shapes of the semiconductor wafer 26 and the ring frame 27. Further, the shape of the first semiconductor chip S1 and the shape of the second semiconductor chip S2 are not limited to a rectangular shape, and may be a square shape or the like.

  In the adhesive sheet 20, at least one laminate L formed by laminating the adhesive layer 23, the pressure-sensitive adhesive layer 24, and the base material sheet 25 may be provided on the peelable sheet 22. Moreover, the adhesive sheet 20 does not necessarily have to be wound in a roll shape, and may be cut for each laminate L in advance.

  EXAMPLES Hereinafter, although this invention is demonstrated more concretely based on an Example and a comparative example, this invention is not limited to a following example.

  First, solutions 1 to 4 used for forming the adhesive layer were prepared. Solution 1 was prepared as a white solution without coloring. Solutions 2 to 4 were prepared as black solutions by coloring.

  Specifically, the solution 1 was prepared as follows. That is, SC2050-HLG (manufactured by Admatechs) 94.1 g, EXA-830CRP (manufactured by DIC) 27.4 g, CHN (cyclohexanone) 34.1 g (manufactured by Sinopec), YDCN-700-10 (manufactured by NSSMC) 31.2 g, XLC-LL (Mitsui Chemicals) 44.7 g, HTR-860P-3CSP (manufactured by Nagase ChemteX) 12.1% solution product 266.2 g, 2PZ-CN (Shikoku Chemicals) 1.4 g And stirred for 12 hours. The solution thus obtained was designated as Solution 1.

  Specifically, the solution 2 was prepared as follows. That is, 0.5 g of 10% FB Black (manufactured by Sanyo Dye) was added to Solution 1, and the mixture was further stirred for 5 hours. The solution thus obtained was designated as Solution 2.

  Specifically, the solution 3 was prepared as follows. That is, 1.0 g of a 10% solution of FB Black (manufactured by Sanyo Dye) was added to Solution 1, and the mixture was further stirred for 5 hours. The solution thus obtained was designated as Solution 3.

  Specifically, the solution 4 was prepared as follows. That is, 5.0 g of FB Black (manufactured by Sanyo Dye) 10% solution was added to Solution 1, and the mixture was further stirred for 5 hours. The solution thus obtained was designated as Solution 4.

  Next, using the solutions 1 to 4 prepared as described above, adhesive layers of Examples 1 to 4 and Comparative Examples 1 to 4 were formed as follows. That is, CHN was evaporated from each of the solutions 1 to 4 to form a film to obtain an adhesive layer having a thickness of 120 μm. The film obtained from the solution 1 was designated as Comparative Example 1, the film obtained from the solution 2 as Example 1, the film obtained from the solution 3 as Example 2, and the film obtained from the solution 4 as Example 3.

  Further, Comparative Example 2 was obtained by curing the film of Comparative Example 1 at 125 ° C. for 20 minutes. A film obtained by curing the film of Comparative Example 1 at 125 ° C. for 30 minutes was referred to as Comparative Example 3. A film obtained by curing the film of Example 2 at 125 ° C. for 20 minutes was defined as Example 4. A film obtained by curing the film of Example 2 at 125 ° C. for 30 minutes was referred to as Comparative Example 4.

Table 1 shows the conditions for forming the adhesive layers of Examples 1 to 4 and Comparative Examples 1 to 4. In Table 1, as the formation conditions of each adhesive layer, the solution used when forming each adhesive layer and the curing conditions (curing temperature, curing time) of each adhesive layer are shown. The curing conditions are shown only for the adhesive layers of Example 4 and Comparative Examples 2 to 4 where the curing treatment was performed.

  The adhesive layers of Examples 1 to 4 and Comparative Examples 1 to 4 were each cut into a size of 320 mmφ, and the base sheet with the adhesive layer was bonded so that the adhesive layer was in contact with the adhesive layer. Subsequently, the base sheet with the pressure-sensitive adhesive layer was cut into a size of 370 mmφ at a position where the circle and the center of the adhesive layer substantially coincided to obtain an adhesive sheet. Then, the laminated body which consists of an adhesive bond layer, an adhesive layer, and a base material sheet, and a semiconductor wafer were affixed at 70 degreeC so that an adhesive bond layer and a semiconductor wafer might contact | connect. Further, a second semiconductor chip with an adhesive layer of 10 mm × 10 mm was obtained by dicing.

  Next, a second semiconductor with an adhesive layer of 10 mm × 10 mm under the conditions of 120 ° C., 0.2 MPa, 5 seconds against the first semiconductor chip of 7 mm × 5 mm fixed on the substrate with silver paste or an adhesive film The chip was die bonded and cured in a pressure oven. Curing using a pressure oven was performed under predetermined pressure and temperature conditions. That is, the temperature was raised from room temperature to 90 ° C. over 5 minutes at a maximum of 0.7 MPa, and kept at 90 ° C. for 5 minutes. Thereafter, the temperature was raised again from 90 ° C. to 140 ° C. in 17 minutes and held at 140 ° C. for 40 minutes.

  Next, the second semiconductor chip was sealed by using an epoxy resin sealing material CEL-9750ZHF10AKLC1 manufactured by Hitachi Chemical Co., Ltd. as a black sealing material. Subsequently, the semiconductor device was singulated at a position of 0.5 mm outward from the end of the second semiconductor chip. During the separation, the cured product of the adhesive layer was exposed from the sealing material on the side surface of the semiconductor device.

The semiconductor device obtained as described above was subjected to SAT (ultrasonic imaging device) analysis, and the embedding property of the first semiconductor chip was confirmed. The results of SAT analysis are shown in Table 2. In Table 2, “A” indicates that the embeddability is sufficient, and “B” indicates that the embeddability is insufficient. In addition, the external appearance of the side surface of the semiconductor device is observed, and “A” indicates that the cured product of the adhesive layer and the sealing material can be seen integrally, and the cured product of the adhesive layer and the sealing material appear to be separate. Things are shown as “B”.

  As shown in Table 2, when the adhesive layers of Examples 1 to 4 were used, the chip embeddability was sufficient. Moreover, the hardened | cured material of the adhesive bond layer exposed to the side surface of a semiconductor device was black with respect to the black sealing material, and the hardened | cured material of the adhesive bond layer and the sealing material were visually recognized integrally. On the other hand, in the adhesive layers of Comparative Examples 1 and 2, although the chip embeddability was sufficient, the cured product of the adhesive layer exposed on the side surface of the semiconductor device was white with respect to the black sealing material. The cured product of the adhesive layer and the sealing material were visually recognized as separate bodies.

  In the adhesive layer of Comparative Example 3, the chip embeddability was insufficient. Moreover, the hardened | cured material of the adhesive bond layer exposed to the side surface of a semiconductor device was white with respect to the black sealing material, and the hardened | cured material of the adhesive bond layer and the sealing material were visually recognized as a different body. In the adhesive layer of Comparative Example 4, the cured product of the adhesive layer exposed on the side surface of the semiconductor device is black with respect to the black encapsulant, and the cured product of the adhesive layer and the encapsulant are integrally formed. Although visible, the chip embeddability was insufficient.

  From the above results, in the semiconductor devices of Examples 1 to 4 and Comparative Example 4, it is possible to suppress the appearance failure of the device by making the color of the cured product of the adhesive layer the same as the color of the sealing material. It was confirmed that In Examples 1 to 4 and Comparative Examples 1 and 2, the adhesiveness of the chip by the adhesive layer is sufficiently enhanced by using an adhesive sheet having an adhesive layer having a viscosity at 80 ° C. of 10,000 Pa · s or less. I was able to confirm.

  DESCRIPTION OF SYMBOLS 10 ... Semiconductor device, 10a-10f ... Outer surface, 11 ... Support member, 12 ... Hardened | cured material of an adhesive bond layer, 13 ... Sealing material, 20 ... Adhesive sheet, 22 ... Release sheet, 22a ... One side, 23, 23p ... Adhesive layer, 24 ... Adhesive layer, 25 ... Base sheet, L ... Laminate, S2 ... Second semiconductor chip.

Claims (13)

A support member;
A cured product of an adhesive layer provided on the support member;
A semiconductor chip provided on the cured product of the adhesive layer;
A sealing material for sealing the semiconductor chip,
The semiconductor device in which the color of the cured product of the adhesive layer is the same as the color of the sealing material.   The semiconductor device according to claim 1, wherein a cured product of the adhesive layer is exposed from a surface of the sealing material.   The semiconductor device according to claim 1, wherein the brightness of the cured product of the adhesive layer is the same as the brightness of the sealing material.   The semiconductor device according to claim 1, wherein a saturation of the cured product of the adhesive layer is the same as a saturation of the sealing material.   The semiconductor device according to claim 1, wherein a color of the cured product of the adhesive layer is the same as or adjacent to a color of the sealing material in a hue ring.   The semiconductor device according to claim 1, wherein the color of the cured product of the adhesive layer is the same as the color of the sealing material. An adhesive sheet used for manufacturing a semiconductor device in which a semiconductor chip provided on a support member is sealed with a sealing material via a cured product of an adhesive layer,
A peelable sheet;
An adhesive layer provided on one side of the peelable sheet;
A pressure-sensitive adhesive layer provided on the adhesive layer so as to cover the adhesive layer;
A base sheet provided on the pressure-sensitive adhesive layer so as to cover the pressure-sensitive adhesive layer,
The adhesive sheet in which the color after curing of the adhesive layer is the same as the color of the sealing material.   The adhesive sheet according to claim 7, wherein the brightness of the cured product of the adhesive layer is the same as the brightness of the sealing material.   The adhesive sheet according to claim 7 or 8, wherein the saturation of the cured product of the adhesive layer is the same as the saturation of the sealing material.   The adhesive sheet according to any one of claims 7 to 9, wherein the color of the cured product of the adhesive layer is the same as or adjacent to the color of the sealing material in a hue ring.   The adhesive sheet according to any one of claims 7 to 10, wherein the color of the cured product of the adhesive layer is the same as the color of the sealing material.   The adhesive sheet according to claim 7, wherein the adhesive layer has a viscosity at 80 ° C. of 10,000 Pa · s or less.   The peelable sheet has a long shape, and a plurality of laminates in which the adhesive layer, the pressure-sensitive adhesive layer, and the base sheet are laminated are separated from each other along the longitudinal direction of the peelable sheet. The adhesive sheet according to any one of claims 7 to 12, wherein the adhesive sheet is wound into a roll shape in a state of being disposed.

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