JP2016219835A - LED module - Google Patents

LED module Download PDF

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Publication number
JP2016219835A
JP2016219835A JP2016159904A JP2016159904A JP2016219835A JP 2016219835 A JP2016219835 A JP 2016219835A JP 2016159904 A JP2016159904 A JP 2016159904A JP 2016159904 A JP2016159904 A JP 2016159904A JP 2016219835 A JP2016219835 A JP 2016219835A
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Prior art keywords
covering member
substrate
led module
sealing resin
metal wiring
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JP2016159904A
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JP6262816B2 (en
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小早川　正彦
Masahiko Kobayakawa
正彦 小早川
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Rohm Co Ltd
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Rohm Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

PROBLEM TO BE SOLVED: To provide a highly reliable LED module.SOLUTION: An LED module includes: a substrate 1; an LED chip 3 supported on the substrate; a metal wiring 2 installed on the substrate and including a mounting portion on which the LED chip is mounted; and an encapsulating resin 4 configured to cover the LED chip and the metal wiring. The LED module also includes a clad member 6 configured to cover the metal wiring to expose the mounting portion. The encapsulating resin covers the clad member. The metal wiring includes a wire bonding portion spaced apart from the mounting portion, and a wire configured to interconnect the LED chip and the wire bonding portion. The clad member covers the metal wiring to expose the wire bonding portion. The substrate includes a first edge and a second edge located on opposite sides to each other in a first direction. A first clad member is spaced apart from the fist edge.SELECTED DRAWING: Figure 2

Description

本発明は、発光ダイオード（以下、ＬＥＤ）を内蔵するＬＥＤモジュールに関する。   The present invention relates to an LED module incorporating a light emitting diode (hereinafter referred to as LED).

図１０には従来のＬＥＤモジュールの一例を示している（特許文献１参照）。図１０に示すＬＥＤモジュールＸは、基板９１と、基板９１に設けられた金属電極９２，９３、金属電極９２，９３と導通するＬＥＤチップ９４、ワイヤ９５、およびこれらを覆う封止樹脂９６を備えている。基板９１は、たとえばガラスエポキシ樹脂製である。金属電極９２，９３は、基板９１の両端縁に離間配置されており、それぞれが基板９１の表面から側面を経て裏面にわたる領域を覆っている。金属電極９２の基板９１の表面を覆う部分にはＬＥＤチップ９４が搭載されている。金属電極９３の基板９１の表面を覆う部分にはワイヤ９５の一端が固定されている。ワイヤ９５の他端はＬＥＤチップ９４に接続されている。このＬＥＤモジュールＸは、たとえば照明装置に内蔵されている回路基板９７に組み込まれて使用される。図１０に示すように、金属電極９２，９３の基板９１の裏面側を覆う部分は、回路基板９７に設けられた配線９８に接続されている。ＬＥＤモジュールＸを回路基板９７に設置する際には、たとえば金属電極９２，９３と配線９８との間にはんだ材料を挟んでリフロー炉で加熱する工程が行われる。   FIG. 10 shows an example of a conventional LED module (see Patent Document 1). The LED module X shown in FIG. 10 includes a substrate 91, metal electrodes 92 and 93 provided on the substrate 91, an LED chip 94 that is electrically connected to the metal electrodes 92 and 93, wires 95, and a sealing resin 96 that covers these. ing. The substrate 91 is made of, for example, a glass epoxy resin. The metal electrodes 92 and 93 are spaced apart from both ends of the substrate 91, and each cover a region extending from the surface of the substrate 91 through the side surface to the back surface. An LED chip 94 is mounted on the portion of the metal electrode 92 that covers the surface of the substrate 91. One end of a wire 95 is fixed to the portion of the metal electrode 93 that covers the surface of the substrate 91. The other end of the wire 95 is connected to the LED chip 94. The LED module X is used by being incorporated in a circuit board 97 built in, for example, a lighting device. As shown in FIG. 10, the portions of the metal electrodes 92, 93 that cover the back side of the substrate 91 are connected to the wiring 98 provided on the circuit substrate 97. When installing the LED module X on the circuit board 97, for example, a process of heating in a reflow furnace with a solder material sandwiched between the metal electrodes 92 and 93 and the wiring 98 is performed.

封止樹脂９６は、ＬＥＤチップ９４およびワイヤ９５を保護するためのものであり、ＬＥＤチップ９４からの光に対して透光性を有するエポキシ樹脂製である。封止樹脂９６は、金属電極９２，９３の基板９１の表面側の部分を覆うように形成されている。金属電極９２，９３の表面には導電性を高めるためにしばしば金製のメッキ層が設けられている。しかしながら、エポキシ樹脂と金とが接着されにくいため以下のような問題が生じることがあり得る。上述したように、ＬＥＤモジュールＸを回路基板９７に設置する際には加熱処理が行われる。このとき封止樹脂９６は熱変形するが、エポキシ樹脂と金メッキ層とが強固に接着されていないため、封止樹脂９６と金属電極９２，９３とが剥離してしまうことがある。このような事態になると、ＬＥＤチップ９４が点灯しなくなることも起こりえる。   The sealing resin 96 is for protecting the LED chip 94 and the wire 95, and is made of an epoxy resin that transmits light from the LED chip 94. The sealing resin 96 is formed so as to cover portions of the metal electrodes 92 and 93 on the surface side of the substrate 91. Gold plating layers are often provided on the surfaces of the metal electrodes 92 and 93 in order to increase conductivity. However, since the epoxy resin and gold are not easily bonded, the following problems may occur. As described above, when the LED module X is installed on the circuit board 97, heat treatment is performed. At this time, although the sealing resin 96 is thermally deformed, the sealing resin 96 and the metal electrodes 92 and 93 may be peeled off because the epoxy resin and the gold plating layer are not firmly bonded. In such a situation, the LED chip 94 may not light up.

特開２００９−２８９４４１号公報JP 2009-289441 A

本発明は、上記した事情のもとで考え出されたものであって、より信頼性の高いＬＥＤモジュールを提供することをその課題とする。   The present invention has been conceived under the above circumstances, and an object thereof is to provide a more reliable LED module.

本発明によって提供されるＬＥＤモジュールは、基板と、上記基板に支持されるＬＥＤチップと、上記基板に設置され、上記ＬＥＤチップが搭載される搭載部を有する金属配線と、上記ＬＥＤチップおよび上記金属配線を覆う封止樹脂と、を備えたＬＥＤモジュールであって、上記搭載部を露出させるように上記金属配線を覆う被覆部材を備えており、上記封止樹脂は上記被覆部材を覆っていることを特徴とする。   The LED module provided by the present invention includes a substrate, an LED chip supported by the substrate, a metal wiring that is installed on the substrate and has a mounting portion on which the LED chip is mounted, the LED chip, and the metal. An LED module comprising: a sealing resin that covers the wiring; and a covering member that covers the metal wiring so as to expose the mounting portion, and the sealing resin covers the covering member It is characterized by.

好ましい実施の形態において、上記被覆部材は、上記基板の厚み方向視において、上記ＬＥＤチップを囲むように形成された開口部を有している。   In a preferred embodiment, the covering member has an opening formed so as to surround the LED chip in the thickness direction of the substrate.

たとえば、上記搭載部は、上記基板の厚み方向視において矩形状であり、上記開口部は、上記基板の厚み方向視において円形である。   For example, the mounting portion is rectangular in the thickness direction of the substrate, and the opening is circular in the thickness direction of the substrate.

一例では、上記被覆部材が上記搭載部の一部を覆っている。   In one example, the covering member covers a part of the mounting portion.

好ましい実施の形態においては、上記金属配線は、上記搭載部と離間するワイヤボンディング部を有しており、上記ＬＥＤチップと上記ワイヤボンディング部とを接続するワイヤを備えており、上記被覆部材は、上記ワイヤボンディング部を露出させるように上記金属配線を覆っている。   In a preferred embodiment, the metal wiring has a wire bonding portion that is separated from the mounting portion, and includes a wire that connects the LED chip and the wire bonding portion. The metal wiring is covered so that the wire bonding portion is exposed.

好ましい実施の形態においては、上記被覆部材は、上記ワイヤが延びる方向において上記搭載部に近付くように凹む凹部を有しており、上記基板の厚み方向視において上記凹部は上記ワイヤボンディング部と重なる位置に設けられている。   In a preferred embodiment, the covering member has a recessed portion that is recessed so as to approach the mounting portion in a direction in which the wire extends, and the recessed portion overlaps the wire bonding portion as viewed in the thickness direction of the substrate. Is provided.

好ましい実施の形態においては、上記金属配線は、上記搭載部を含む第１の金属端子と、上記ワイヤボンディング部を含む第２の金属端子とを備えており、上記第１の金属端子は、第１の方向における上記基板の一方の端縁を覆うように形成されており、上記第２の金属端子は、上記第１の方向における上記基板の他方の端縁を覆うように形成されており、上記封止樹脂は、上記第１の方向において上記基板よりも短くなっている。   In a preferred embodiment, the metal wiring includes a first metal terminal including the mounting portion and a second metal terminal including the wire bonding portion, and the first metal terminal includes: The second metal terminal is formed so as to cover the other edge of the substrate in the first direction, so as to cover one edge of the substrate in the first direction, The sealing resin is shorter than the substrate in the first direction.

好ましい実施の形態においては、上記基板は上記第１の方向の両端に上記第１の方向に凹む１対の凹部を有しており、上記金属配線は上記１対の凹部を覆っており、上記封止樹脂は、上記１対の凹部を露出させるように形成されている。   In a preferred embodiment, the substrate has a pair of recesses recessed in the first direction at both ends in the first direction, the metal wiring covers the pair of recesses, and The sealing resin is formed so as to expose the pair of recesses.

好ましい実施の形態においては、上記第１の方向における上記被覆部材の一方の端縁と、上記封止樹脂の一方の端縁とが上記第１の方向において同一の位置にある。   In a preferred embodiment, one end edge of the covering member in the first direction and one end edge of the sealing resin are in the same position in the first direction.

好ましい実施の形態においては、上記第１の方向における上記被覆部材の一方の端縁は、上記封止樹脂の一方の端縁よりも上記第１の方向における一方側に位置している。   In a preferred embodiment, one end edge of the covering member in the first direction is located on one side in the first direction with respect to one end edge of the sealing resin.

好ましい実施の形態においては、上記第１の方向における上記被覆部材の他方の端縁と、上記封止樹脂の他方の端縁とが上記第１の方向において同一の位置にある。   In a preferred embodiment, the other edge of the covering member in the first direction and the other edge of the sealing resin are at the same position in the first direction.

好ましい実施の形態においては、上記第１の方向における上記被覆部材の他方の端縁は、上記封止樹脂の他方の端縁よりも上記第１の方向における他方側に位置している。   In a preferred embodiment, the other edge of the covering member in the first direction is located on the other side in the first direction with respect to the other edge of the sealing resin.

好ましい実施の形態においては、上記封止樹脂は上記第１の方向と直交する第２の方向において上記基板の全幅を覆うように形成されており、上記被覆部材の上記第２の方向における両端は上記基板の第２の方向における両端と上記第２の方向において同一の位置にある。   In a preferred embodiment, the sealing resin is formed so as to cover the entire width of the substrate in a second direction orthogonal to the first direction, and both ends of the covering member in the second direction are The both ends of the substrate in the second direction and the same position in the second direction.

本発明のより好ましい実施の形態においては、上記基板は第１の方向において上記封止樹脂よりも長く形成されており、上記封止樹脂の上記第１の方向における一方の側面は、上記基板の厚み方向において上記基板から遠い位置ほど上記第１の方向における他方側に位置するように傾斜している。   In a more preferred embodiment of the present invention, the substrate is formed longer than the sealing resin in a first direction, and one side surface of the sealing resin in the first direction is Inclination is such that the farther from the substrate in the thickness direction, the farther the position is on the other side in the first direction.

たとえば、上記一方の側面は、上記基板の厚み方向に対して６°以上傾斜する斜面を含んでいる。   For example, the one side surface includes a slope inclined by 6 ° or more with respect to the thickness direction of the substrate.

別の実施形態では、上記一方の側面は、上記封止樹脂の上記厚み方向において上記基板から遠い方の端面と連結される曲面を有している。 In another embodiment, the one side surface has a curved surface connected to an end surface far from the substrate in the thickness direction of the sealing resin.

好ましくは、上記封止樹脂の上記第１の方向における他方の側面は、上記基板の厚み方向において上記基板から遠い位置ほど上記第１の方向における一方側に位置するように傾斜している。   Preferably, the other side surface of the sealing resin in the first direction is inclined so that a position farther from the substrate in the thickness direction of the substrate is located on one side in the first direction.

たとえば、上記他方の側面は、上記基板の厚み方向に対して６°以上傾斜する斜面を含んでいる。   For example, the other side surface includes a slope inclined by 6 ° or more with respect to the thickness direction of the substrate.

別の実施形態では、上記他方の側面は、上記封止樹脂の上記厚み方向において上記基板から遠い方の端面と連結される曲面を有している。   In another embodiment, the other side surface has a curved surface connected to an end surface far from the substrate in the thickness direction of the sealing resin.

本発明のより好ましい実施の形態においては、上記被覆部材は、上記被覆部材と上記金属配線との密着強度および上記被覆部材と上記封止樹脂との密着強度が、上記金属配線と上記封止樹脂との密着強度よりも強くなる材質からなる。   In a more preferred embodiment of the present invention, the covering member has an adhesive strength between the covering member and the metal wiring and an adhesive strength between the covering member and the sealing resin. It is made of a material that is stronger than the adhesion strength.

たとえば、上記金属配線は、金製のメッキ層を有している。   For example, the metal wiring has a gold plating layer.

たとえば、上記被覆部材は、樹脂製である。   For example, the covering member is made of resin.

たとえば、上記被覆部材は、白色である。   For example, the covering member is white.

たとえば、上記被覆部材は、上記基板の厚み方向において１μｍ以上１０μｍ以下の厚みを有する。   For example, the covering member has a thickness of 1 μm or more and 10 μm or less in the thickness direction of the substrate.

このような構成によれば、金属配線と封止樹脂との間に被覆部材が挟まれることになり、金属配線と封止樹脂とが接着されにくい問題の改善を図ることができる。さらに、本発明のより好ましい実施の形態によれば、上記ＬＥＤモジュールを製造する際に、金型を用いて封止樹脂を形成した後に封止樹脂を金型から引き抜きやすくなる。このことは、上記封止樹脂と上記基板との間にかかる力を低減し、上記金属配線と上記封止樹脂とが剥離するのを予防するのに適している。従って、本発明によって提供されるＬＥＤモジュールはより信頼性の高いものとなる。   According to such a configuration, the covering member is sandwiched between the metal wiring and the sealing resin, and the problem that the metal wiring and the sealing resin are hardly adhered can be improved. Furthermore, according to a more preferred embodiment of the present invention, when the LED module is manufactured, it becomes easy to pull out the sealing resin from the mold after forming the sealing resin using the mold. This is suitable for reducing the force applied between the sealing resin and the substrate and preventing the metal wiring and the sealing resin from peeling off. Therefore, the LED module provided by the present invention is more reliable.

本発明のその他の特徴および利点は、添付図面を参照して以下に行う詳細な説明によって、より明らかとなろう。   Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

本発明の第１実施形態に基づくＬＥＤモジュールを示す平面図である。It is a top view which shows the LED module based on 1st Embodiment of this invention. 図１のＩＩ−ＩＩ線に沿う断面図である。It is sectional drawing which follows the II-II line | wire of FIG. 図１に示すＬＥＤモジュールの封止樹脂を省略した平面図である。It is the top view which abbreviate | omitted sealing resin of the LED module shown in FIG. 本発明の第２実施形態に基づくＬＥＤモジュールの封止樹脂を省略した平面図である。It is the top view which abbreviate | omitted sealing resin of the LED module based on 2nd Embodiment of this invention. 本発明の第３実施形態に基づくＬＥＤモジュールの断面図である。It is sectional drawing of the LED module based on 3rd Embodiment of this invention. 本発明の第４実施形態に基づくＬＥＤモジュールの断面図である。It is sectional drawing of the LED module based on 4th Embodiment of this invention. 本発明の第５実施形態に基づくＬＥＤモジュールの断面図である。It is sectional drawing of the LED module based on 5th Embodiment of this invention. 本発明の第６実施形態に基づくＬＥＤモジュールの封止樹脂を省略した平面図である。It is the top view which abbreviate | omitted sealing resin of the LED module based on 6th Embodiment of this invention. 本発明の第７実施形態に基づくＬＥＤモジュールの封止樹脂を省略した平面図である。It is the top view which abbreviate | omitted sealing resin of the LED module based on 7th Embodiment of this invention. 従来のＬＥＤモジュールの一例を示す断面図である。It is sectional drawing which shows an example of the conventional LED module.

以下、本発明の好ましい実施の形態につき、図面を参照して具体的に説明する。   Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the drawings.

図１〜図３は、本発明の第１実施形態に基づくＬＥＤモジュールを示している。図１〜図３に示すＬＥＤモジュールＡ１は、基板１と、金属配線２と、ＬＥＤチップ３と、封止樹脂４と、ワイヤ５と、被覆部材６とを備えている。なお、図３はＬＥＤモジュールＡ１の内部を示すために封止樹脂４を省略したものである。図１〜図３に示すｘ，ｙ，ｚ方向は互いに直交する方向であり、ｚ方向は基板１の厚み方向となっている。以降の説明では、基板１の図２におけるｚ方向上側の面を表面とし、下側の面を裏面とし、ｘ方向における両端の面を側面とする。   1 to 3 show an LED module according to a first embodiment of the present invention. The LED module A1 shown in FIGS. 1 to 3 includes a substrate 1, a metal wiring 2, an LED chip 3, a sealing resin 4, a wire 5, and a covering member 6. In FIG. 3, the sealing resin 4 is omitted to show the inside of the LED module A1. The x, y, and z directions shown in FIGS. 1 to 3 are orthogonal to each other, and the z direction is the thickness direction of the substrate 1. In the following description, the upper surface in the z direction in FIG. 2 of the substrate 1 is referred to as the front surface, the lower surface is referred to as the back surface, and both end surfaces in the x direction are referred to as side surfaces.

基板１は、たとえばガラスエポキシ樹脂製であり、図３に示すようにｚ方向視においてｘ方向に長い長矩形状となっている。基板１のｘ方向における両端部には、ｘ方向に凹む１対の凹部１ａが設けられている。基板１は、たとえば基板材料を切断して製造されるものである。製造工程において、上記の基板材料には多数のスルーホールが形成される。凹部１ａは、基板材料に形成されたスルーホールが切断されて形成されたものである。   The substrate 1 is made of, for example, a glass epoxy resin and has a long rectangular shape that is long in the x direction when viewed in the z direction as shown in FIG. A pair of recesses 1a that are recessed in the x direction are provided at both ends of the substrate 1 in the x direction. The substrate 1 is manufactured by cutting a substrate material, for example. In the manufacturing process, a large number of through holes are formed in the substrate material. The recess 1a is formed by cutting a through hole formed in the substrate material.

金属配線２は、金属電極２１と金属電極２２とを備えている。金属電極２１および金属電極２２は、基板１のｘ方向における両端縁に離間配置されており、それぞれが基板１の表面から側面を経て裏面にわたる領域を覆っている。なお、本実施形態では金属電極２１および金属電極２２は基板１の側面のうち凹部１ａのみを覆っている。金属電極２１および金属電極２２の基板１の裏面側の領域は、従来例の説明で示したのと同様にＬＥＤモジュールＡ１を所望の回路基板に実装するのに用いられる。   The metal wiring 2 includes a metal electrode 21 and a metal electrode 22. The metal electrode 21 and the metal electrode 22 are spaced from each other at both edges in the x direction of the substrate 1, and each covers a region extending from the surface of the substrate 1 through the side surface to the back surface. In the present embodiment, the metal electrode 21 and the metal electrode 22 cover only the recess 1 a on the side surface of the substrate 1. The regions on the back side of the substrate 1 of the metal electrode 21 and the metal electrode 22 are used for mounting the LED module A1 on a desired circuit board in the same manner as described in the description of the conventional example.

図３に示すように、金属電極２１は基板１の図中左端部をｙ方向における全幅に渡って覆う領域と、この領域からｙ方向図中右方に突出する細帯部２１１と、細帯部２１１のｙ方向図中右端に連結された搭載部２１２とを備えている。図３に示す例では、搭載部２１２はｚ方向視正方形となっている。搭載部２１２の一辺の長さは、ＬＥＤチップ３の一辺の長さよりも長く、基板１のｙ方向における幅よりも短くなっている。細帯部２１１は、ｙ方向における幅が搭載部２１２の一辺の長さよりも短くなるように形成されている。   As shown in FIG. 3, the metal electrode 21 includes a region covering the left end portion of the substrate 1 in the figure over the entire width in the y direction, a narrow band portion 211 protruding from the region to the right in the y direction diagram, And a mounting portion 212 connected to the right end of the portion 211 in the y direction view. In the example shown in FIG. 3, the mounting portion 212 is a square when viewed in the z direction. The length of one side of the mounting portion 212 is longer than the length of one side of the LED chip 3 and shorter than the width of the substrate 1 in the y direction. The narrow band portion 211 is formed so that the width in the y direction is shorter than the length of one side of the mounting portion 212.

図３に示すように、金属電極２２は基板１の図中右端部をｙ方向における全幅に渡って覆う領域と、この領域からｙ方向図中左方に突出する細帯部２２１とを備えている。図３に示す例では、細帯部２２１はｙ方向における幅が搭載部２１２の一辺の長さよりも短くなっている。この細帯部２２１には、ワイヤ５の図３中右端が接続されている。細帯部２２１の、被覆部材６に覆われていない部分が本発明におけるワイヤボンディング部に相当する。   As shown in FIG. 3, the metal electrode 22 includes a region that covers the right end of the substrate 1 in the drawing over the entire width in the y direction, and a narrow band portion 221 that protrudes from the region to the left in the y direction. Yes. In the example shown in FIG. 3, the narrow band portion 221 has a width in the y direction that is shorter than the length of one side of the mounting portion 212. The narrow band portion 221 is connected to the right end of the wire 5 in FIG. The portion of the narrow strip portion 221 that is not covered with the covering member 6 corresponds to the wire bonding portion in the present invention.

図２に示す例では省略しているが、金属配線２は複数の金属層が積層されたものである。複数の金属層のうち最表面の金属層は金からなるものである。このような金属配線２は、上述の基板材料にメッキ処理を施し、不要な部分をエッチングすることにより形成することができる。この際、基板材料に設けられたスルーホールの内周面を覆うようにメッキ処理を施すことで金属配線２が凹部１ａを覆う構造を容易に実現することができる。   Although omitted in the example shown in FIG. 2, the metal wiring 2 is formed by laminating a plurality of metal layers. Of the plurality of metal layers, the outermost metal layer is made of gold. Such a metal wiring 2 can be formed by performing a plating process on the above-described substrate material and etching an unnecessary portion. At this time, a structure in which the metal wiring 2 covers the recess 1a can be easily realized by performing plating so as to cover the inner peripheral surface of the through hole provided in the substrate material.

ＬＥＤチップ３は、たとえばｐｎ型の半導体素子であり、可視光あるいは赤外光を発光可能に構成されている。ＬＥＤチップ３の図２中下方の面に形成されたｎ側電極が図示しない銀ペーストを介して搭載部２１２に導通している。ＬＥＤチップ３の図２中上方の面に形成されたｐ側電極は、ワイヤ５を介して細帯部２２１と導通している。   The LED chip 3 is a pn-type semiconductor element, for example, and is configured to emit visible light or infrared light. The n-side electrode formed on the lower surface of the LED chip 3 in FIG. 2 is electrically connected to the mounting portion 212 via a silver paste (not shown). The p-side electrode formed on the upper surface of the LED chip 3 in FIG. 2 is electrically connected to the narrow strip portion 221 through the wire 5.

封止樹脂４は、ＬＥＤチップ３およびワイヤ５を保護するためのものであり、ＬＥＤチップ３からの光に対して透光性を有するたとえばエポキシ樹脂である。封止樹脂４のｘ方向長さは、基板１のｘ方向長さよりも短くなっている。封止樹脂４のｙ方向における長さは基板１のｙ方向における長さと同じとなっている。図１に示すように、封止樹脂４のｘ方向における図中左端４ａは基板１の左側の凹部１ａよりも右側に位置しており、右端４ｂは右側の凹部１ａよりも左側に位置している。図２に示すように、封止樹脂４のｘ方向における図中左方の側面４１は、ｚ方向における上方ほどｘ方向右方に位置する斜面となっている。側面４１はｚ方向に対して６°以上傾斜している。封止樹脂４のｘ方向における図中右方の側面４２は、ｚ方向における上方ほどｘ方向左方に位置する斜面となっている。側面４２はｚ方向に対して６°以上傾斜している。このような封止樹脂４は、トランスファーモールド法により形成することができる。トランスファーモールド法では、上記基板材料を金型に設置して、金型に液化した樹脂を充填する工程と、樹脂が硬化した後に金型と上記基板材料とを引き離す工程を行う。   The sealing resin 4 is for protecting the LED chip 3 and the wire 5 and is, for example, an epoxy resin having translucency with respect to light from the LED chip 3. The x-direction length of the sealing resin 4 is shorter than the x-direction length of the substrate 1. The length of the sealing resin 4 in the y direction is the same as the length of the substrate 1 in the y direction. As shown in FIG. 1, the left end 4a in the figure of the sealing resin 4 in the x direction is located on the right side of the left concave portion 1a of the substrate 1, and the right end 4b is located on the left side of the right concave portion 1a. Yes. As shown in FIG. 2, the left side surface 41 in the x direction of the sealing resin 4 is an inclined surface positioned to the right in the x direction as it extends upward in the z direction. The side surface 41 is inclined by 6 ° or more with respect to the z direction. The side surface 42 on the right side in the figure in the x direction of the sealing resin 4 is an inclined surface located on the left side in the x direction as it extends upward in the z direction. The side surface 42 is inclined by 6 ° or more with respect to the z direction. Such a sealing resin 4 can be formed by a transfer molding method. In the transfer molding method, a step of placing the substrate material in a mold and filling the mold with a liquefied resin and a step of separating the mold and the substrate material after the resin is cured are performed.

ワイヤ５は金製であり、たとえば市販されているワイヤボンディング用キャピラリを用いて形成される。   The wire 5 is made of gold, and is formed using, for example, a commercially available wire bonding capillary.

被覆部材６は、図２に示すように、金属配線２を覆い、かつ、封止樹脂４に覆われている。被覆部材６は、被覆部材６と金属配線２との密着強度および被覆部材６と封止樹脂４との密着強度が、金属配線２と封止樹脂４との密着強度よりも強くなる材質からなる。たとえば、被覆部材６は、ｚ方向における厚みが１μｍ〜１０μｍの樹脂製の膜であるのが望ましい。このような樹脂膜として、たとえばエッチング処理の際に用いられるレジストを用いることができる。また、はんだ付けを行う際に用いられるソルダーレジストを用いてもよい。被覆部材６として白色のレジストを用いると、被覆部材６がＬＥＤチップ３からの光を反射しやすくなる。このため、被覆部材６として白色レジストを用いると、ＬＥＤモジュールＡ１がｚ方向に出射する光量を増やす効果が期待できる。   As shown in FIG. 2, the covering member 6 covers the metal wiring 2 and is covered with the sealing resin 4. The covering member 6 is made of a material in which the adhesion strength between the coating member 6 and the metal wiring 2 and the adhesion strength between the coating member 6 and the sealing resin 4 are stronger than the adhesion strength between the metal wiring 2 and the sealing resin 4. . For example, the covering member 6 is desirably a resin film having a thickness in the z direction of 1 μm to 10 μm. As such a resin film, for example, a resist used in the etching process can be used. Moreover, you may use the soldering resist used when soldering. When a white resist is used as the covering member 6, the covering member 6 easily reflects light from the LED chip 3. For this reason, when a white resist is used as the covering member 6, an effect of increasing the amount of light emitted from the LED module A1 in the z direction can be expected.

図３に示す例では、被覆部材６は、少なくともＬＥＤチップ３がダイボンディングされる領域およびワイヤ５がボンディングされる領域以外の領域に形成されている。被覆部材６は、ｘ方向において離間する第１の被覆部材６１および第２の被覆部材６２によって構成されている。図３に示すように、第１の被覆部材６１は、ｚ方向視においてｙ方向に長く延びる長矩形状に形成されている。第１の被覆部材６１のｙ方向における長さは基板１のｙ方向における長さよりも短くなっている。第１の被覆部材６１のｘ方向右端部は細帯部２１１の一部を覆っている。図２に示すように、第１の被覆部材６１のｘ方向図中左端６１ａは、封止樹脂４のｘ方向図中左端４ａとｘ方向において同じ位置にある。図３に示すように、第２の被覆部材６２は、ｚ方向視においてｙ方向に長く延びる長矩形状に形成されている。第２の被覆部材６２のｙ方向における長さは基板１のｙ方向における長さよりも短くなっている。第２の被覆部材６２のｘ方向左端部は細帯部２２１の一部を覆っている。図２に示すように、第２の被覆部材６２のｘ方向図中右端６２ａは、封止樹脂４のｘ方向図中右端４ｂとｘ方向において同じ位置にある。また、第１の被覆部材６１は金属配線２の金属電極２１の図２中上面のみならず基板１の表面も同時に覆うように形成されている。第２の被覆部材６２は、金属配線２の金属電極２２の図２中上面のみならず基板１の表面も同時に覆うように形成されている。   In the example shown in FIG. 3, the covering member 6 is formed in at least a region other than the region where the LED chip 3 is die-bonded and the region where the wire 5 is bonded. The covering member 6 includes a first covering member 61 and a second covering member 62 that are separated from each other in the x direction. As shown in FIG. 3, the first covering member 61 is formed in a long rectangular shape that extends long in the y direction when viewed in the z direction. The length of the first covering member 61 in the y direction is shorter than the length of the substrate 1 in the y direction. A right end portion in the x direction of the first covering member 61 covers a part of the narrow band portion 211. As shown in FIG. 2, the left end 61 a in the x direction view of the first covering member 61 is in the same position as the left end 4 a in the x direction view of the sealing resin 4 in the x direction. As shown in FIG. 3, the second covering member 62 is formed in a long rectangular shape extending long in the y direction when viewed in the z direction. The length of the second covering member 62 in the y direction is shorter than the length of the substrate 1 in the y direction. The left end portion in the x direction of the second covering member 62 covers a part of the narrow band portion 221. As shown in FIG. 2, the right end 62 a in the x direction view of the second covering member 62 is in the same position as the right end 4 b in the x direction view of the sealing resin 4 in the x direction. Further, the first covering member 61 is formed so as to cover not only the upper surface of the metal electrode 21 of the metal wiring 2 in FIG. 2 but also the surface of the substrate 1 at the same time. The second covering member 62 is formed so as to simultaneously cover not only the upper surface of the metal electrode 22 of the metal wiring 2 in FIG. 2 but also the surface of the substrate 1.

次に、ＬＥＤモジュールＡ１の作用について説明する。   Next, the operation of the LED module A1 will be described.

上述したＬＥＤモジュールＡ１では、金属配線２と封止樹脂４との間に被覆部材６が設けられている。従来例の説明でも記載したように、金属配線２の表面に金製の層が設けられている場合、導電性に優れる一方で金属配線２と封止樹脂４とが接着されにくい問題がある。ＬＥＤモジュールＡ１では、金属配線２と封止樹脂４との間に被覆部材６を挟むことにより、上記の問題の解消を図っている。このためＬＥＤモジュールＡ１は信頼性の向上を図りやすい構成となっている。   In the LED module A 1 described above, the covering member 6 is provided between the metal wiring 2 and the sealing resin 4. As described in the description of the conventional example, when a gold layer is provided on the surface of the metal wiring 2, there is a problem that the metal wiring 2 and the sealing resin 4 are not easily bonded while having excellent conductivity. In the LED module A1, the above problem is solved by sandwiching the covering member 6 between the metal wiring 2 and the sealing resin 4. For this reason, the LED module A1 has a configuration in which it is easy to improve reliability.

さらにＬＥＤモジュールＡ１では、封止樹脂４の側面４１，４２が斜面となっている。このことは、トランスファーモールド法において樹脂が硬化した後に金型を基板材料から引き離す際に、封止樹脂４が金型に引っ掛かるのを防ぐのに適している。封止樹脂４が金型に引っ掛かる場合、より長い時間封止樹脂４と基板１とを引き離す方向に力を加えることになり、金属配線２と封止樹脂４との剥離を誘発する危険性が増す。このような問題を防止できるため、ＬＥＤモジュールＡ１は信頼性の向上を図りやすい構成である。   Furthermore, in LED module A1, the side surfaces 41 and 42 of the sealing resin 4 are inclined surfaces. This is suitable for preventing the sealing resin 4 from being caught on the mold when the mold is pulled away from the substrate material after the resin is cured in the transfer molding method. When the sealing resin 4 is caught on the mold, a force is applied in a direction for separating the sealing resin 4 and the substrate 1 for a longer time, and there is a risk of inducing separation between the metal wiring 2 and the sealing resin 4. Increase. Since such a problem can be prevented, the LED module A1 is configured to easily improve reliability.

なお、図３に示す例では、被覆部材６のｙ方向における長さは基板１のｙ方向における長さよりも短くなっているが、被覆部材６のｙ方向における長さは基板１のｙ方向における長さと同じであっても構わない。   In the example shown in FIG. 3, the length in the y direction of the covering member 6 is shorter than the length in the y direction of the substrate 1, but the length in the y direction of the covering member 6 is in the y direction of the substrate 1. It may be the same as the length.

また、上記の実施形態では、被覆部材６は封止樹脂４の外にはみだしていないが、被覆部材６が封止樹脂４の外側にはみだしていても構わない。   In the above embodiment, the covering member 6 does not protrude outside the sealing resin 4, but the covering member 6 may protrude outside the sealing resin 4.

図４〜図９は、本発明の他の実施形態を示している。なお、これらの図において、上記実施形態と同一または類似の要素には、上記実施形態と同一の符号を付しており、適宜説明を省略する。   4 to 9 show other embodiments of the present invention. In these drawings, the same or similar elements as those in the above embodiment are denoted by the same reference numerals as those in the above embodiment, and description thereof will be omitted as appropriate.

図４は、本発明の第２実施形態に基づくＬＥＤモジュールＡ２を示している。図４に示すＬＥＤモジュールＡ２は、被覆部材６の形状がＬＥＤモジュールＡ１の場合と異なっており、その他の構成はＬＥＤモジュールＡ１と同様となっている。図４は封止樹脂４を省略した平面図である。   FIG. 4 shows an LED module A2 according to the second embodiment of the present invention. The LED module A2 shown in FIG. 4 is different from the LED module A1 in the shape of the covering member 6, and the other configuration is the same as that of the LED module A1. FIG. 4 is a plan view in which the sealing resin 4 is omitted.

本実施形態の被覆部材６は図４に示すように、ｚ方向視において基板１の両端部を除く大部分を覆うように形成されている。さらに被覆部材６は搭載部２１２の一部を露出させる開口部６３と、細帯部２２１の一部を露出させる凹部６４とを備えている。   As shown in FIG. 4, the covering member 6 of the present embodiment is formed so as to cover most of the substrate 1 excluding both end portions when viewed in the z direction. Further, the covering member 6 includes an opening 63 that exposes a part of the mounting part 212 and a recess 64 that exposes a part of the narrow band part 221.

ＬＥＤモジュールＡ２の被覆部材６は、開口部６３および凹部６４が設けられている部分以外ではｙ方向における全長に渡って基板１を覆っている。被覆部材６のｘ方向における両端６５，６６は図示していない封止樹脂４のｘ方向における両端（図１の４ａ，４ｂ参照）と重なっているのが望ましい。なお、封止樹脂４の外側に被覆部材６がはみ出していても構わない。   The covering member 6 of the LED module A2 covers the substrate 1 over the entire length in the y direction except for the portion where the opening 63 and the recess 64 are provided. It is desirable that both ends 65 and 66 of the covering member 6 in the x direction overlap with both ends of the sealing resin 4 (not shown) in the x direction (see 4a and 4b in FIG. 1). Note that the covering member 6 may protrude outside the sealing resin 4.

図４に示す例では、開口部６３はｚ方向視円形であり、搭載部２１２の四隅は被覆部材６に覆われている。開口部６３の大きさはＬＥＤチップ３が設置できる面積であればよく、適宜変更可能である。   In the example shown in FIG. 4, the opening 63 is circular when viewed in the z direction, and the four corners of the mounting portion 212 are covered with the covering member 6. The size of the opening 63 may be an area where the LED chip 3 can be installed, and can be changed as appropriate.

図４に示す例では凹部６４は、被覆部材６のｘ方向における図中右端６６からｘ方向図中左方に凹むように形成されている。凹部６４は、ワイヤ５をボンディングするのに必要な領域だけ細帯部２２１を露出させることができればよく、その形状は適宜変更可能である。   In the example shown in FIG. 4, the recess 64 is formed so as to be recessed from the right end 66 in the x direction of the covering member 6 to the left in the x direction view. The concave portion 64 only needs to expose the narrow strip portion 221 only in an area necessary for bonding the wire 5, and the shape thereof can be changed as appropriate.

また、被覆部材６は、基板１よりもＬＥＤチップ３により出射される光の反射率が大きいことが好ましい。図４に示すように基板１の表面は被覆部材６によって覆われており、反射率が比較的大きな被覆部材６を採用することにより、覆わない場合よりも光の取り出し効率を向上させることができる。逆に、被覆部材６の反射率が基板１よりも小さい場合、たとえば図１に示す場合のように基板１の表面を覆う面積が小さくなるようにするか、または、図９に示す場合のように被覆部材６は金属配線２の上面のみを覆うように形成することが好ましい。   The covering member 6 preferably has a higher reflectance of light emitted from the LED chip 3 than the substrate 1. As shown in FIG. 4, the surface of the substrate 1 is covered with the covering member 6, and by adopting the covering member 6 having a relatively high reflectance, the light extraction efficiency can be improved as compared with the case where it is not covered. . Conversely, when the reflectance of the covering member 6 is smaller than that of the substrate 1, for example, the area covering the surface of the substrate 1 is made small as in the case shown in FIG. 1, or as shown in FIG. Further, the covering member 6 is preferably formed so as to cover only the upper surface of the metal wiring 2.

図５は、本発明の第３実施形態に基づくＬＥＤモジュールＡ３を示している。図５に示すＬＥＤモジュールＡ３では、封止樹脂４の角が丸くなっており、その他の構成はＬＥＤモジュールＡ１と同様となっている。   FIG. 5 shows an LED module A3 according to a third embodiment of the present invention. In the LED module A3 shown in FIG. 5, the corners of the sealing resin 4 are rounded, and other configurations are the same as those of the LED module A1.

本実施形態では、封止樹脂４の側面４１，４２とｚ方向図５中上面との間に曲面４３，４４が設けられている。このような曲面４３，４４を設けることで、封止樹脂４を金型から引き抜く際の抵抗をさらに低減する効果を期待することができる。   In the present embodiment, curved surfaces 43 and 44 are provided between the side surfaces 41 and 42 of the sealing resin 4 and the upper surface in FIG. By providing such curved surfaces 43 and 44, an effect of further reducing the resistance when the sealing resin 4 is pulled out from the mold can be expected.

図６は、本発明の第４実施形態に基づくＬＥＤモジュールＡ４を示している。図６に示すＬＥＤモジュールＡ４では、被覆部材６が封止樹脂４からはみ出すように形成されており、その他の構成はＬＥＤモジュールＡ３と同様となっている。   FIG. 6 shows an LED module A4 according to a fourth embodiment of the present invention. In LED module A4 shown in FIG. 6, the covering member 6 is formed so as to protrude from the sealing resin 4, and the other configuration is the same as that of the LED module A3.

図６に示すように、第１の被覆部材６１の図中左端６１ａは封止樹脂４の図中左端４ａよりもｘ方向において図中左側に位置している。図６に示す例では、第１の被覆部材６１の左端６１ａは、金属配線２の図中左端まで達している。なお、第１の被覆部材６１の左端６１ａが封止樹脂４の左端４ａと金属配線２の図中左端との間に位置するようにしてもよい。   As shown in FIG. 6, the left end 61a of the first covering member 61 in the drawing is located on the left side in the drawing in the x direction with respect to the left end 4a of the sealing resin 4 in the drawing. In the example shown in FIG. 6, the left end 61 a of the first covering member 61 reaches the left end of the metal wiring 2 in the drawing. Note that the left end 61 a of the first covering member 61 may be positioned between the left end 4 a of the sealing resin 4 and the left end of the metal wiring 2 in the drawing.

第２の被覆部材６２の図６中右端６２ａは封止樹脂４の図６中右端４ｂよりもｘ方向において図６中右側に位置している。図６に示す例では、第２の被覆部材６２の右端６２ａは、金属配線２の図中右端まで達している。なお、第２の被覆部材６２の右端６２ａが封止樹脂４の右端４ｂと金属配線２の図中右端との間に位置するようにしてもよい。   The right end 62a in FIG. 6 of the second covering member 62 is located on the right side in FIG. 6 in the x direction with respect to the right end 4b in FIG. In the example shown in FIG. 6, the right end 62 a of the second covering member 62 reaches the right end of the metal wiring 2 in the drawing. The right end 62a of the second covering member 62 may be positioned between the right end 4b of the sealing resin 4 and the right end of the metal wiring 2 in the drawing.

図７は、本発明の第５実施形態に基づくＬＥＤモジュールＡ５を示している。図７に示すＬＥＤモジュールＡ５では、被覆部材６が封止樹脂４の内側に入り込むように形成されており、その他の構成はＬＥＤモジュールＡ３と同様となっている。   FIG. 7 shows an LED module A5 according to a fifth embodiment of the present invention. In the LED module A5 shown in FIG. 7, the covering member 6 is formed so as to enter the inside of the sealing resin 4, and other configurations are the same as those of the LED module A3.

図７に示すように、第１の被覆部材６１の図中左端６１ａは封止樹脂４の図中左端４ａよりもｘ方向において図中右側に位置している。第２の被覆部材６２の図７中右端６２ａは封止樹脂４の図７中右端４ｂよりもｘ方向において図６中左側に位置している。   As shown in FIG. 7, the left end 61a of the first covering member 61 in the drawing is located on the right side in the drawing in the x direction from the left end 4a of the sealing resin 4 in the drawing. The right end 62a in FIG. 7 of the second covering member 62 is located on the left side in FIG. 6 in the x direction with respect to the right end 4b in FIG.

図８は、本発明の第６実施形態に基づくＬＥＤモジュールＡ６を示している。図８に示すＬＥＤモジュールＡ６では、凹部６４の代わりにｚ方向視円形の開口部６７が形成されている。ＬＥＤモジュールＡ６のその他の構成はＬＥＤモジュールＡ２と同様である。   FIG. 8 shows an LED module A6 according to a sixth embodiment of the present invention. In the LED module A6 shown in FIG. 8, an opening 67 having a circular shape in the z direction is formed instead of the recess 64. Other configurations of the LED module A6 are the same as those of the LED module A2.

このようにすると、被覆部材６は金属配線２をより広く覆うことになり、封止樹脂４の剥がれをより一層抑制することができる。   If it does in this way, the covering member 6 will cover the metal wiring 2 more widely, and it can suppress peeling of the sealing resin 4 further.

図９は、本発明の第７実施形態に基づくＬＥＤモジュールＡ７を示している。図９に示すＬＥＤモジュールＡ７では、被覆部材６が金属配線２の上面のみを覆うように形成されている。ＬＥＤモジュールＡ７のその他の構成はＬＥＤモジュールＡ１と同様である。前述したように、このような構成は被覆部材６の反射率が基板１よりも小さい場合に有効である。   FIG. 9 shows an LED module A7 according to a seventh embodiment of the present invention. In the LED module A7 shown in FIG. 9, the covering member 6 is formed so as to cover only the upper surface of the metal wiring 2. The other configuration of the LED module A7 is the same as that of the LED module A1. As described above, such a configuration is effective when the reflectance of the covering member 6 is smaller than that of the substrate 1.

本発明に係るＬＥＤモジュールは、上述した実施形態に限定されるものではない。本発明に係るＬＥＤモジュールの各部の具体的な構成は、種々に設計変更自在である。   The LED module according to the present invention is not limited to the above-described embodiment. The specific configuration of each part of the LED module according to the present invention can be changed in various ways.

たとえば、上記実施形態ではダイボンディングおよびワイヤボンディングをした例を説明したが、左右の電極にそれぞれワイヤボンディング部を設け、ＬＥＤチップと２つのワイヤボンディングにより接続する形態にも適用できる。また、左右の電極にフリップチップ接続をする形態にも適用可能である。いずれにせよ、ＬＥＤチップと金属配線との接続部分は除いて被覆部材が形成される。   For example, in the above embodiment, an example in which die bonding and wire bonding are performed has been described. However, the present invention can also be applied to a form in which wire bonding portions are provided on the left and right electrodes, respectively, and are connected to the LED chip by two wire bonding. Further, the present invention can be applied to a form in which flip-chip connection is made to the left and right electrodes. In any case, the covering member is formed except for the connection portion between the LED chip and the metal wiring.

Ａ１〜Ａ７ ＬＥＤモジュール
ｘ （第１の）方向
ｙ （第２の）方向
ｚ （厚み）方向
１ 基板
１ａ 凹部
２ 金属配線
２１ （第１の）金属電極
２２ （第２の）金属電極
２１１ 細帯部
２１２ 搭載部
２２１ 細帯部
３ ＬＥＤチップ
４ 封止樹脂
４１，４２ 側面
４３，４４ 曲面
５ ワイヤ
６ 被覆部材
６１ 第１の被覆部材
６２ 第２の被覆部材
６３ 開口部
６４ 凹部
６７ 開口部 A1 to A7 LED module x (first) direction y (second) direction z (thickness) direction 1 substrate 1a recess 2 metal wiring 21 (first) metal electrode 22 (second) metal electrode 211 narrow band Part 212 mounting part 221 narrow band part 3 LED chip 4 sealing resin 41, 42 side face 43, 44 curved surface 5 wire 6 covering member 61 first covering member 62 second covering member 63 opening 64 recessed part 67 opening

Claims (8)

基板と、
上記基板に支持されるＬＥＤチップと、
上記基板に設置され、上記ＬＥＤチップが搭載される搭載部を有する金属配線と、
上記ＬＥＤチップおよび上記金属配線を覆う封止樹脂と、
を備えたＬＥＤモジュールであって、
上記搭載部を露出させるように上記金属配線を覆う被覆部材を備えており、
上記封止樹脂は上記被覆部材を覆っているとともに、
上記金属配線は、上記搭載部と離間するワイヤボンディング部を有しており、
上記ＬＥＤチップと上記ワイヤボンディング部とを接続するワイヤを備えており、
上記被覆部材は、上記ワイヤボンディング部を露出させるように上記金属配線を覆っており、
上記金属配線は、上記搭載部を含む第１の金属端子と、上記ワイヤボンディング部を含む第２の金属端子とを備えており、
上記被覆部材は、上記第１の金属端子の一部を覆う第１の被覆部材と上記第２の金属端子の一部を覆う第２の被覆部材とによって構成されており、
上記基板は、互いに第１の方向において反対側に位置する、上記第１の金属端子が到達する第１の端縁と上記第２の金属端子が到達する第２の端縁とを有しており、
上記第１の被覆部材は、上記第１の端縁から離間していることを特徴とする、ＬＥＤモジュール。 A substrate,
An LED chip supported by the substrate;
Metal wiring installed on the substrate and having a mounting portion on which the LED chip is mounted;
A sealing resin covering the LED chip and the metal wiring;
An LED module comprising:
A covering member that covers the metal wiring so as to expose the mounting portion;
The sealing resin covers the covering member,
The metal wiring has a wire bonding part separated from the mounting part,
A wire connecting the LED chip and the wire bonding portion;
The covering member covers the metal wiring so as to expose the wire bonding portion,
The metal wiring includes a first metal terminal including the mounting portion and a second metal terminal including the wire bonding portion,
The covering member is composed of a first covering member that covers a part of the first metal terminal and a second covering member that covers a part of the second metal terminal,
The substrate has a first edge at which the first metal terminal reaches and a second edge at which the second metal terminal reaches, which are located on opposite sides in the first direction. And
The LED module, wherein the first covering member is separated from the first edge. 上記第１の端縁には、平面視において凹む第１の凹部が形成されている、請求項１に記載のＬＥＤモジュール。   The LED module according to claim 1, wherein the first end edge is formed with a first recess that is recessed in a plan view. 上記第２の被覆部材は、上記第２の端縁から離間している、請求項１または２に記載のＬＥＤモジュール。   The LED module according to claim 1, wherein the second covering member is separated from the second end edge. 上記第２の端縁には、平面視において凹む第２の凹部が形成されている、請求項３に記載のＬＥＤモジュール。   The LED module according to claim 3, wherein a second recess that is recessed in plan view is formed on the second end edge. 上記第１の被覆部材の上記第１の方向における上記第２の端縁側の端縁は、上記ＬＥＤチップよりも上記第１の方向において上記第１の端縁側に位置し且つ上記封止樹脂によって覆われている、請求項１ないし４のいずれかに記載のＬＥＤモジュール。   An end edge of the first covering member on the second end side in the first direction is located on the first end side in the first direction with respect to the LED chip and is formed by the sealing resin. The LED module according to claim 1, wherein the LED module is covered. 上記第２の被覆部材の上記第１の方向における上記第１の端縁側の端縁は、上記ワイヤの上記ワイヤボンディング部に接続された端部よりも上記第１の方向において上記第２の端縁側に位置し且つ上記封止樹脂によって覆われている、請求項１ないし５のいずれかに記載のＬＥＤモジュール。   The edge of the second covering member on the first end side in the first direction is closer to the second end in the first direction than the end connected to the wire bonding portion of the wire. The LED module according to claim 1, which is located on an edge side and is covered with the sealing resin. 上記基板は、平面視において上記第１の方向と直角である第２の方向に互いに離間し且つ上記第１の方向に延びる一対の第３の端縁を有しており、
上記第１の金属端子と上記第３の端縁とが重なる部分の長さは、上記第２の金属端子と上記第３の端縁とが重なる部分の長さよりも大である、請求項１ないし６のいずれかに記載のＬＥＤモジュール。 The substrate has a pair of third edges that are separated from each other in a second direction perpendicular to the first direction in a plan view and extend in the first direction;
The length of the portion where the first metal terminal and the third end edge overlap is greater than the length of the portion where the second metal terminal and the third end edge overlap. The LED module in any one of 6 thru | or 6. 上記第１の被覆部材は、上記第２の方向に互いに離間し且つ上記第１の方向に延びる一対の第１の側縁を有しており、
上記第２の被覆部材は、上記第２の方向に互いに離間し且つ上記第１の方向に延びる一対の第２の側縁を有しており、
上記第１の側縁の長さは、上記第２の側縁の長さよりも大である、請求項７に記載のＬＥＤモジュール。 The first covering member has a pair of first side edges that are separated from each other in the second direction and extend in the first direction;
The second covering member has a pair of second side edges that are separated from each other in the second direction and extend in the first direction,
The LED module according to claim 7, wherein a length of the first side edge is larger than a length of the second side edge.
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