JP2016215336A5 - - Google Patents

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Publication number
JP2016215336A5
JP2016215336A5 JP2015104552A JP2015104552A JP2016215336A5 JP 2016215336 A5 JP2016215336 A5 JP 2016215336A5 JP 2015104552 A JP2015104552 A JP 2015104552A JP 2015104552 A JP2015104552 A JP 2015104552A JP 2016215336 A5 JP2016215336 A5 JP 2016215336A5
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JP
Japan
Prior art keywords
polishing
composition
water
soluble polymer
polymer
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JP2015104552A
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English (en)
Japanese (ja)
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JP6174625B2 (ja
JP2016215336A (ja
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Priority claimed from JP2015104552A external-priority patent/JP6174625B2/ja
Priority to JP2015104552A priority Critical patent/JP6174625B2/ja
Priority to PCT/JP2016/064226 priority patent/WO2016190128A1/ja
Priority to KR1020177023361A priority patent/KR102574629B1/ko
Priority to TW105115551A priority patent/TWI758249B/zh
Priority to TW109122108A priority patent/TW202041646A/zh
Publication of JP2016215336A publication Critical patent/JP2016215336A/ja
Publication of JP2016215336A5 publication Critical patent/JP2016215336A5/ja
Publication of JP6174625B2 publication Critical patent/JP6174625B2/ja
Application granted granted Critical
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JP2015104552A 2015-05-22 2015-05-22 研磨方法及び組成調整剤 Active JP6174625B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2015104552A JP6174625B2 (ja) 2015-05-22 2015-05-22 研磨方法及び組成調整剤
PCT/JP2016/064226 WO2016190128A1 (ja) 2015-05-22 2016-05-13 研磨方法及び組成調整剤
KR1020177023361A KR102574629B1 (ko) 2015-05-22 2016-05-13 연마 방법 및 조성 조정제
TW109122108A TW202041646A (zh) 2015-05-22 2016-05-19 研磨方法及組成調整劑
TW105115551A TWI758249B (zh) 2015-05-22 2016-05-19 研磨方法及組成調整劑

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015104552A JP6174625B2 (ja) 2015-05-22 2015-05-22 研磨方法及び組成調整剤

Publications (3)

Publication Number Publication Date
JP2016215336A JP2016215336A (ja) 2016-12-22
JP2016215336A5 true JP2016215336A5 (cg-RX-API-DMAC7.html) 2017-06-29
JP6174625B2 JP6174625B2 (ja) 2017-08-02

Family

ID=57392757

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015104552A Active JP6174625B2 (ja) 2015-05-22 2015-05-22 研磨方法及び組成調整剤

Country Status (4)

Country Link
JP (1) JP6174625B2 (cg-RX-API-DMAC7.html)
KR (1) KR102574629B1 (cg-RX-API-DMAC7.html)
TW (2) TW202041646A (cg-RX-API-DMAC7.html)
WO (1) WO2016190128A1 (cg-RX-API-DMAC7.html)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210062041A1 (en) * 2018-01-18 2021-03-04 Hitachi Chemical Company, Ltd. Polishing liquid, polishing liquid set, and polishing method
US10683439B2 (en) * 2018-03-15 2020-06-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing composition and method of polishing a substrate having enhanced defect inhibition
JP7237933B2 (ja) * 2018-03-28 2023-03-13 株式会社フジミインコーポレーテッド 研磨用組成物
JP7253335B2 (ja) * 2018-07-31 2023-04-06 株式会社フジミインコーポレーテッド 研磨用組成物、その製造方法および研磨用組成物を用いた研磨方法
TWI794474B (zh) * 2019-04-15 2023-03-01 日商昭和電工材料股份有限公司 研磨液、研磨液套組及研磨方法
KR102804301B1 (ko) * 2023-10-04 2025-05-12 주식회사 플롯퍼실리티스 반도체 공정 챔버 내 오염물 세정용 패드

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5598607U (cg-RX-API-DMAC7.html) 1978-12-28 1980-07-09
JP5148948B2 (ja) * 2007-08-23 2013-02-20 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 研磨用スラリーのリサイクル方法
JP5297695B2 (ja) * 2008-05-30 2013-09-25 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 スラリー供給装置及び同装置を用いる半導体ウェーハの研磨方法
JP5760403B2 (ja) * 2010-11-24 2015-08-12 株式会社Sumco 薬液リサイクル方法および該方法に用いる装置
US20130302984A1 (en) * 2011-01-26 2013-11-14 Fujimi Incorporated Polishing composition, polishing method using same, and substrate production method
JP5656960B2 (ja) * 2012-11-14 2015-01-21 株式会社フジミインコーポレーテッド Ｌｐｄ低減剤及びそれを用いたシリコンウエハの欠陥低減方法
JP5843036B1 (ja) * 2015-06-23 2016-01-13 コニカミノルタ株式会社 再生研磨材スラリーの調製方法

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