JP2016213068A - Luminaire - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a luminaire capable of achieving reduction in cost and thickness without lowering a luminous flux while securing a sufficient luminance uniformity ratio in a translucent cover.SOLUTION: A luminaire includes: an LED module 10 having a long substrate 11 and a plurality of LEDs 12 arranged on a surface of the substrate 11 along the longitudinal direction of the substrate 11; a power supply device 20 for generating power for allowing the LEDs 12 to emit light; a luminaire body 30 mounted on an installation part, and for storing the LED module 10 and the power supply device 20; a reflection plate 40 provided at the luminaire body 30, and for reflecting the light from the LED module 10 in the direction opposite from the installation part side; and a translucent cover 50 arranged so as to face the reflection plate 40. The LED module 10 is arranged so that the light of the LED module 10 emits toward a space region between the reflection plate 40 and the translucent cover 50, and the power supply device 20 is arranged in the region on the back surface side of the substrate 11.SELECTED DRAWING: Figure 6

Description

  The present invention relates to a lighting device.

  Solid light-emitting elements such as light emitting diodes (LEDs) are widely used in various light source devices such as lighting applications and display applications as high-efficiency and space-saving light sources.

  There are several types of light source devices that use LEDs as light sources. For example, the type in which the LEDs are arranged so that the emitted light of the LED is in a direction along the optical axis of the light source device (for example, the vertical direction), and the direction in which the emitted light of the LED is perpendicular to the optical axis of the light source device (for example, There is a type in which LEDs are arranged so as to be in the horizontal direction.

  As the former type, for example, a light source device having a configuration in which a plurality of LEDs are arranged two-dimensionally (planar) so as to face a translucent panel is known (for example, Patent Document 1). Further, as the latter type, a light source device having a configuration in which a plurality of LEDs are arranged in a row so as to face the end face of the light guide plate is known (for example, Patent Document 2).

  This type of light source device includes an LED illumination device for illumination using LEDs. The LED lighting device includes, for example, an appliance main body, a plurality of LEDs arranged in the appliance main body, and a translucent cover (translucent panel) arranged to cover the plurality of LEDs. Such an LED lighting device is installed on a ceiling or the like, for example, and irradiates light vertically downward.

  For example, a direct type LED illuminating device in which LEDs are arranged directly under the inner surface of a translucent cover includes an instrument main body installed on a ceiling surface, a plurality of LEDs arranged two-dimensionally in the instrument main body, and a plurality of LEDs And a translucent cover disposed to face the LEDs. In such a direct type LED lighting device, LED light emitted vertically downward enters the main surface of the light-transmitting cover and is emitted vertically downward through the light-transmitting cover.

  On the other hand, horizontal LED illuminating devices that emit LED light in the horizontal direction of the main surface of the translucent cover are mainly edge-lighted using a light guide plate. A light guide plate disposed therein, a plurality of LEDs arranged in a row so as to face the end face of the light guide plate, and a light-transmitting cover arranged to face the main surface of the light guide plate. In such a horizontal type LED lighting device, the LED light emitted in the horizontal direction of the main surface of the translucent cover is reflected toward the main surface of the light guide plate while guiding the light guide plate, and the translucent cover is And exits vertically downward.

JP 2008-288202 A JP 2013-195510 A

  In an illumination device using a plurality of light sources, there is a problem that a crushing feeling (bright spot) is conspicuous at the time of lighting, and uneven brightness occurs. In particular, since the LED is a point light source with strong directivity, the luminance unevenness is conspicuous in the LED illumination device using a plurality of LEDs. For this reason, as a translucent cover which covers several LED, what has light diffusibility (diffusion cover) is used in many cases. By using the diffusion cover, it is possible to diffuse light from the LED and suppress uneven brightness.

  In recent years, thinning of lighting devices has been demanded. However, in direct type LED lighting devices, if the distance between the LED and the diffusion cover is shortened to reduce the thickness, the light from the LED is sufficiently diffused by the diffusion cover. The brightness uniformity at the diffusion cover is reduced. In other words, surface light emission with uniform luminance cannot be obtained in the diffusion cover, and uneven luminance remains.

  In order to suppress the crushing feeling caused by the LED and to ensure sufficient brightness uniformity in the diffusion cover, it is necessary to narrow the arrangement interval (pitch) between two adjacent LEDs or to spread the LED light in front of the LED. What is necessary is just to arrange | position the light distribution control members, such as a wide angle lens which can be performed.

  However, in order to narrow the LED arrangement interval, it is necessary to increase the number of LEDs, which increases the cost. In addition, in order to provide the light distribution control member, it is necessary to secure a certain space between the diffusion cover and the LED, and it becomes impossible to reduce the thickness.

  On the other hand, in the horizontal type LED lighting device, since the light of the LED is emitted in the horizontal direction of the main surface of the translucent cover, it is not necessary to increase the distance between the LED and the translucent cover. For this reason, the horizontal LED lighting device is suitable for thinning. However, when a light guide plate is used to emit light from the entire surface of the translucent cover, the light flux is reduced by the light guide plate, and the illuminance directly below the illumination device is reduced.

  As described above, in an illumination device using a plurality of light sources such as LEDs, it is difficult to achieve cost reduction and thinning while ensuring sufficient luminance uniformity in the light-transmitting cover without reducing the luminous flux. Met.

  The present invention has been made in order to solve such problems, and it is possible to reduce the cost and thickness without reducing the luminous flux and ensuring sufficient brightness uniformity in the light-transmitting cover. It aims at providing the illuminating device which can implement | achieve.

  In order to achieve the above object, one aspect of an illumination device according to the present invention includes an elongated substrate and a plurality of solid state light emitting elements disposed on a first surface of the substrate along a longitudinal direction of the substrate. A light emitting module, a power supply device that generates electric power for causing the solid state light emitting element to emit light, an appliance main body that is attached to an installation portion and accommodates the light emitting module and the power supply device, and is provided in the appliance main body. A light reflecting module that reflects light from the light emitting module toward a direction opposite to the portion to be installed, and a translucent cover that is arranged to face the light reflecting plate, the light emitting module comprising: The light emitting module is arranged to emit light toward a space region between the reflector and the light transmitting cover, and the power supply device is opposite to the first surface of the substrate. The first It is arranged in the region of the side.

  According to the present invention, it is possible to realize a reduction in cost and thickness without reducing the luminous flux and ensuring the luminance uniformity in the light-transmitting cover.

It is a perspective view when the illuminating device which concerns on embodiment is seen from the front side (light emission side). It is a perspective view when the illuminating device which concerns on embodiment is seen from the back side. It is a perspective view which shows the state which removed the instrument main body in the illuminating device of FIG. 2A. It is a disassembled perspective view of the illuminating device which concerns on embodiment. It is sectional drawing in the XZ plane of the illuminating device which concerns on embodiment. It is sectional drawing in the YZ plane of the illuminating device which concerns on embodiment installed in the ceiling. It is sectional drawing which shows typically the optical path at the time of lighting of the illuminating device which concerns on embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. Each of the embodiments described below shows a preferred specific example of the present invention. Therefore, the numerical values, shapes, materials, components, component arrangement positions, connection forms, and the like shown in the following embodiments are merely examples, and are not intended to limit the present invention. Therefore, among the constituent elements in the following embodiments, constituent elements that are not described in the independent claims showing the highest concept of the present invention are described as optional constituent elements.

  Each figure is a schematic diagram and is not necessarily illustrated strictly. Moreover, in each figure, the same code | symbol is attached | subjected to the substantially same structure, The overlapping description is abbreviate | omitted or simplified.

(Embodiment)
The structure of the illuminating device 1 which concerns on embodiment is demonstrated using FIG.1, FIG.2A, FIG.2B, FIG.3 and FIG.4.

  FIG. 1 is a perspective view of the illumination device 1 according to the embodiment as viewed from the front side (light emission side). 2A is a perspective view of the illumination device 1 when viewed from the back side, and FIG. 2B is a perspective view of the illumination device 1 of FIG. 2A with the instrument body 30 removed. FIG. 3 is an exploded perspective view of the illumination device 1. FIG. 4 is a cross-sectional view in the XZ plane of the illumination device 1. FIG. 4 also shows an enlarged view of a region X surrounded by a broken line.

  In the present specification and drawings, the X axis, the Y axis, and the Z axis represent the three axes of the three-dimensional orthogonal coordinate system. The Z axis direction is the vertical direction, and the direction perpendicular to the Z axis (in the XY plane). (Parallel direction) is the horizontal direction. Note that the plus direction in the Z-axis direction is defined as a vertically downward direction.

  The illuminating device 1 is an example of an illuminating device installed on a construction material (installed portion) such as a ceiling, for example, and as shown in FIGS. 1 to 4, an LED module 10, a power supply device 20, and an apparatus main body 30, a reflection plate 40, a translucent cover 50, a frame 60, and attachment members 71 and 72.

  As an example, the lighting device 1 is a ceiling light, and is installed on a ceiling 100 (installed portion) as shown in FIG. FIG. 5 is a cross-sectional view of the lighting device 1 according to the embodiment installed on the ceiling 100 in the YZ plane. Note that only the cross-sectional portion of the illumination device shown in FIG. 5 is shown.

  As shown in FIG. 5, in the present embodiment, lighting device 1 is attached to ceiling 100 with bolts 200. The bolt 200 is, for example, a suspension bolt, and the lighting device 1 is fixed to the ceiling 100 in a state of being spaced from the ceiling surface (installed surface) of the ceiling 100 (in a suspended state). The illuminating device 1 installed in this way irradiates illumination light vertically downward (floor surface).

  The lighting device 1 is a thin surface emitting lighting fixture. The length (total height) in the Z-axis direction of the lighting device 1 is, for example, 10 mm to 50 mm. As an example, when the lighting device 1 is a house ceiling light, the total height of the lighting device 1 is about 20 mm, and when the lighting device 1 is a facility base light, the total height of the lighting device 1 is about 10 mm.

  Hereafter, each structural member of the illuminating device 1 is demonstrated, referring FIGS.

[LED module]
The LED module 10 is a light source module of the lighting device 1 and emits white light, for example. As shown in FIGS. 3 and 4, the LED module 10 is accommodated in the instrument body 30. In the present embodiment, four LED modules 10 are accommodated in the instrument main body 30.

  As shown in FIGS. 3 and 4, each LED module 10 includes a long substrate 11 and LEDs 12 arranged on the substrate 11.

  The substrate 11 is a mounting substrate for mounting the LED 12, and a first surface 11 a (front surface) on which the LED 12 is mounted and a second surface 11 b (on the opposite side of the first surface 11 a ( Back side). The shape of the substrate 11 is, for example, a rectangular shape, but is not limited thereto.

  As the substrate 11, for example, a resin substrate, a metal base substrate, a ceramic substrate, a glass substrate, or the like can be used. The substrate 11 is not limited to a rigid substrate and may be a flexible substrate.

  Although not shown, metal wiring for electrically connecting the plurality of LEDs 12 is formed in a predetermined shape on the first surface 11a of the substrate 11. The first surface 11 a of the substrate 11 may be provided with a pair of connection terminals for receiving power supplied from the power supply device 20.

  The LEDs 12 are an example of a solid state light emitting device, and a plurality of LEDs 12 are arranged on the first surface 11 a of the substrate 11 along the longitudinal direction of the substrate 11. Since the LED module 10 in the present embodiment is a light emitting module having a surface mount device (SMD) structure, an SMD type LED element is used as the LED 12.

  The LED 12 which is an SMD type LED element has a white resin package (container) having a recess, an LED chip mounted on the bottom surface of the recess of the package, and a sealing member sealed in the recess of the package. . The sealing member is made of a translucent resin material such as silicone resin. The sealing member may be a phosphor-containing resin containing a wavelength conversion material such as a phosphor.

  The LED chip is an example of a semiconductor light emitting element that emits light with a predetermined DC power, and is a bare chip that emits monochromatic visible light. The LED chip is, for example, a blue LED chip that emits blue light when energized. In this case, in order to obtain white light, the sealing member contains a yellow phosphor such as YAG (yttrium, aluminum, garnet) that emits fluorescence using blue light from the blue LED chip as excitation light.

  Thus, LED12 in this Embodiment is a BY type white LED light source comprised with the blue LED chip and the yellow fluorescent substance. Specifically, the yellow phosphor absorbs a part of the blue light emitted from the blue LED chip and is excited to emit yellow light, and the yellow light and the blue light not absorbed by the yellow phosphor are mixed. White light.

  The LED module 10 is not limited to the SMD structure, but may be a COB (Chip On Board) structure. The LED module having a COB structure has a configuration in which LED chips are directly mounted on the substrate 11 as LEDs 12. For example, the substrate 11, a plurality of LED chips (LED 12) mounted in a row on the substrate 11, and a plurality of LED chips And a sealing member (phosphor-containing resin) for individually or collectively sealing.

  Each LED module 10 configured as described above has a long shape. As shown in FIG. 3, the four LED modules 10 are arranged in a rectangular frame shape so as to surround the translucent cover 50. Specifically, the four LED modules 10 are arranged so that two face each other in the X-axis direction, and the other two LED modules 10 are arranged so as to face each other in the Y-axis direction.

  Each of the four LED modules 10 is arranged so that the light of the LED module 10 is emitted toward the space region between the reflecting plate 40 and the translucent cover 50. Specifically, the two pairs of LED modules 10 are disposed so as to face each other with a space area between the reflecting plate 40 and the translucent cover 50. For example, in FIG. 4, two LED modules 10 that face each other in the X-axis direction emit light from the LED module 10 from one end to the other end of the space region between the reflecting plate 40 and the translucent cover 50. Are arranged as follows.

  The optical axis direction of each LED module 10 (LED 12) is a direction (horizontal direction) parallel to the bottom surface 41a of the bottom plate portion 41 of the reflection plate 40 and the inner surface of the translucent cover 50. Specifically, the optical axis direction of each of the two LED modules 10 facing in the X-axis direction is the X-axis direction, and the optical axis direction of each of the two LED modules 10 facing in the Y-axis direction is Y Axial direction.

  Each LED module 10 is fixed to the reflector 40, for example. As shown in FIG. 4, in this Embodiment, each LED module 10 is attached to the surface at the side of the baseplate part 41 in the sideplate part 42 (1st sideplate part) of the reflecting plate 40. As shown in FIG. Specifically, the substrate 11 of the LED module 10 is fixed to the side plate portion 42 of the reflecting plate 40 so as to be in a posture perpendicular to the bottom surface 41 a of the bottom plate portion 41. Thereby, the light of LED12 mounted in the board | substrate 11 is radiate | emitted toward the space area | region between the reflecting plate 40 and the translucent cover 50. FIG.

  The substrate 11 can be fixed to the reflecting plate 40 by caulking, for example. In this case, by inserting and sliding a projection obtained by cutting and raising a part of the reflecting plate 40 into a hole or notch formed in the substrate 11, bending the tip of the projection and caulking the substrate 11. The substrate 11 can be fixed to the reflecting plate 40.

  The method for fixing the substrate 11 to the reflecting plate 40 is not limited to caulking. For example, the substrate 11 may be fixed to the reflecting plate 40 by sliding the substrate 11 into a groove or the like formed in the reflecting plate 40, or the substrate 11 may be fixed using a fixing member such as an adhesive or a screw. 40 may be fixed.

[Power supply]
The power supply device 20 is a power supply circuit that generates power for causing the LED module 10 (LED 12) to emit light, and supplies the generated power to the LED module 10. For example, the power supply device 20 converts AC power from an external power source such as a commercial power source into DC power of a predetermined level by rectification, smoothing, stepping down, and the like, and supplies the DC power to the LED module 10.

  The output side terminal of the power supply device 20 and the LED module 10 are electrically connected by an electric wire or the like. Moreover, as shown in FIG. 2B, the terminal block 21 is accommodated in the instrument main body 30, and the input side terminal of the power supply device 20 and the output part of the terminal block 21 are connected by an electric wire or the like. Note that the input section of the terminal block 21 is connected to an external power source by an electric wire or the like.

  The power supply device 20 includes a printed circuit board and a plurality of electronic components mounted on the printed circuit board. The electronic component mounted on the circuit board is for lighting the LED module 10. For example, a capacitive element such as an electrolytic capacitor or a ceramic capacitor, a resistive element such as a resistor, a rectifier circuit element, a coil element, or a choke coil (Choke transformer), noise filter, diode, or semiconductor element such as an integrated circuit element. The power supply device 20 may be combined with a dimming circuit, a booster circuit, or the like.

  As shown in FIGS. 3 and 4, the power supply device 20 (power supply circuit) configured as described above is accommodated in a circuit cover 22 (power supply cover) made of metal or resin. For example, the power supply device 20 is fixed to the circuit cover 22 by fixing the circuit board of the power supply device 20 to the circuit cover 22. The power supply device 20 can be protected by covering the power supply device 20 with the circuit cover 22. The circuit cover 22 may not be provided.

  As shown in FIG. 4, the power supply device 20 is disposed in a region on the second surface 11 b side of the substrate 11 of the LED module 10 while being covered with the circuit cover 22. That is, the power supply device 20 is disposed in a region on the opposite side (back side) of the LED module 10 from the light emitting side. Specifically, the power supply device 20 is disposed in a space region between the side plate portion 42 (first side plate portion) of the reflecting plate 40 and the side plate portion 32 (second side plate portion) of the instrument main body 30.

[Equipment body]
The instrument body 30 houses the LED module 10 and the power supply device 20. In the present embodiment, the instrument body 30 also accommodates the reflector plate 40. Specifically, the instrument body 30 and the reflecting plate 40 are disposed so as to overlap in the Z-axis direction.

  The LED module 10 is accommodated in the instrument main body 30 so as to be positioned inside the reflector 40. Moreover, the power supply device 20 is accommodated in the instrument main body 30 so as to be positioned outside the reflector plate 40. That is, the LED module 10 and the power supply device 20 are partitioned by the reflecting plate 40.

  The instrument main body 30 is made of sheet metal, and includes a bottom plate portion 31 (second bottom plate portion) and a side plate portion 32 (second side plate) erected at a predetermined angle from the outer peripheral end of the bottom plate portion 31 so as to surround the bottom plate portion 31. Part). In the present embodiment, since the overall shape of the instrument body 30 in a plan view is substantially rectangular, the bottom plate portion 31 has a rectangular plate shape, and the side plate portion 32 has a rectangular frame shape. Specifically, the instrument main body 30 has a box shape having an opening. The length (total height) of the instrument body 30 in the Z-axis direction is, for example, 5 mm to 45 mm.

  A bottom plate portion 41 of the reflection plate 40 is disposed on the bottom plate portion 31 of the instrument main body 30. Specifically, the instrument body 30 is disposed such that the bottom surface 31 a (inner surface) of the bottom plate portion 31 faces the bottom surface 41 a of the bottom plate portion 41 of the reflection plate 40.

  Further, the side plate portion 32 of the instrument main body 30 is constituted by four side wall plates that stand from the four sides of the bottom plate portion 31. In the present embodiment, the side plate portion 32 (side wall plate) of the instrument main body 30 is erected at an angle of approximately 90 degrees with respect to the bottom surface 31 a of the bottom plate portion 31.

  The instrument body 30 can be formed by, for example, pressing a metal flat plate such as an iron plate or an aluminum steel plate. Specifically, the instrument main body 30 having the bottom plate part 31 and the side plate part 32 can be produced by bending the rectangular metal flat plate so as to raise four sides.

  The instrument body 30 is not limited to metal, and may be made of resin. However, from the viewpoint of heat dissipation of the heat generated in the LED module 10 and the heat generated in the power supply device 20, the material of the instrument body 30 may be a material having high thermal conductivity such as metal or high thermal conductive resin.

  As shown in FIG. 5, the instrument body 30 configured in this way is attached to the ceiling 100 (installed portion). In the present embodiment, the instrument body 30 is fixed to the ceiling 100 with four bolts 200 so that the outer surface of the bottom plate portion 31 faces the ceiling surface of the ceiling 100.

  Therefore, as shown in FIGS. 2A and 4, the bottom plate portion 31 of the instrument main body 30 is provided with four bolt opening holes 33 through which the bolts 200 for fixing the ceiling 100 and the instrument main body 30 are inserted. ing. Each bolt opening 33 is formed at a position outside the side plate portion 42 of the reflecting plate 40 in the bottom plate portion 31 of the instrument body 30. Specifically, the bolt opening hole 33 is located between the side plate portion 42 (first side plate portion) of the reflecting plate 40 and the side plate portion 32 (second side plate portion) of the instrument main body 30. Note that the bolt opening 33 is preferably provided at a position where a fixture such as the bolt 200 does not interfere with the power supply device 20 and the circuit cover 22.

  In addition, the bottom plate portion 31 is provided with a wire opening hole 34 through which a wire for supplying power from an external power source to the power supply device 20 is inserted. The wire opening hole 34 is formed at a position outside the side plate portion 42 of the reflecting plate 40 in the bottom plate portion 31 of the instrument body 30. Specifically, the wire opening hole 34 is located between the side plate portion 42 (first side plate portion) of the reflecting plate 40 and the side plate portion 32 (second side plate portion) of the instrument body 30. In addition, in this Embodiment, although the two opening holes 34 for electric wires are provided, one may be sufficient.

[reflector]
The reflection plate 40 reflects light from the LED module 10 in a direction opposite to the ceiling side (installed part side). Specifically, the reflecting plate 40 reflects the light emitted from the LED module 10 toward the translucent cover 50.

  As shown in FIG. 4, the reflector 40 is provided on the instrument body 30. Specifically, the reflection plate 40 is accommodated in the instrument body 30.

  As shown in FIG. 3, the reflecting plate 40 is made of sheet metal, and is erected at a predetermined angle from the bottom plate portion 41 (first bottom plate portion) and the outer peripheral end portion of the bottom plate portion 41 so as to surround the bottom plate portion 41. Side plate portion 42 (first side plate portion). In the present embodiment, since the overall shape of the reflection plate 40 in a plan view is substantially rectangular, the bottom plate portion 41 has a rectangular plate shape, and the side plate portion 42 has a rectangular frame shape. Specifically, the reflecting plate 40 has a box shape having an opening. The length (total height) of the reflecting plate 40 in the Z-axis direction is, for example, 5 mm to 40 mm.

  The bottom plate portion 41 of the reflection plate 40 is a reflection portion, and is provided to face the translucent cover 50 as shown in FIG. The reflection plate 40 is disposed so that the bottom surface 41 a of the bottom plate portion 41 faces the inner surface of the light transmitting cover 50. The bottom surface 41 a of the bottom plate portion 41 is a light reflecting surface and reflects light emitted from the LED module 10.

  The side plate portion 42 of the reflecting plate 40 is constituted by four side wall plates that stand from the four sides of the bottom plate portion 41. In the present embodiment, the side plate portion 42 (side wall plate) of the reflecting plate 40 is erected at an angle of approximately 90 degrees with respect to the bottom surface 41 a of the bottom plate portion 41.

  The LED module 10 (substrate 11) is attached to the side plate portion 42. Specifically, the substrate 11 is disposed and fixed on the side plate portion 42 such that the second surface 11b of the substrate 11 is in contact with the surface of the side plate portion 42 on the bottom plate portion 41 side.

  The side plate portion 42 is located between the LED module 10 and the power supply device 20. That is, the side plate portion 42 functions as a partition plate that partitions the LED module 10 and the power supply device 20.

  The reflecting plate 40 can be formed by, for example, pressing a metal flat plate such as an iron plate or an aluminum steel plate. Specifically, the reflecting plate 40 having the bottom plate portion 41 and the side plate portion 42 can be produced by bending the rectangular metal flat plate so as to raise four sides.

  The reflecting plate 40 is not limited to metal, and may be made of resin. However, from the viewpoint of heat dissipation of the heat generated in the LED module 10 and the heat generated in the power supply device 20, the material of the reflecting plate 40 may be a material having high thermal conductivity such as metal or high thermal conductive resin.

  Further, in order to improve the light reflectivity of the bottom surface 41a of the bottom plate portion 41, even if a white coating is applied to the bottom surface 41a of the bottom plate portion 41 or a metal vapor deposition film is formed, a light reflection film is formed on the bottom surface 41a. Good.

[Translucent cover]
The translucent cover 50 is a cover having translucency. In the present embodiment, the translucent cover 50 is a front cover that forms an outline of the lighting device 1, and light incident from the inner surface of the translucent cover 50 is transmitted through the translucent cover 50 and emitted to the outside. In the present embodiment, the translucent cover 50 is a plate-shaped translucent plate.

  The translucent cover 50 is made of, for example, a translucent resin material such as acrylic or polycarbonate, a glass material, or the like. In the present embodiment, the translucent cover 50 is a rectangular plate-shaped translucent panel having a constant thickness. The thickness of the translucent cover 50 is, for example, 1 mm to 3 mm.

  The translucent cover 50 may further have light diffusibility. That is, the translucent cover 50 may not be a transparent panel but a diffusion panel having translucency and light diffusibility. In this case, the translucent cover 50 can be a milky white diffusion panel in which a light diffusing material is dispersed. Such a diffusion panel can be manufactured by resin-molding a translucent resin material mixed with a light diffusing material into a predetermined shape. As the light diffusing material, light reflective fine particles such as silica particles can be used.

  The diffusion panel may be configured by forming a milky white light diffusion film containing a light diffusion material or the like on the surface (inner surface or outer surface) of the transparent panel, instead of dispersing the light diffusion material inside. Good. Further, the diffusion panel may be configured to have light diffusibility by performing diffusion processing instead of using a light diffusing material. For example, it may be configured to have light diffusibility by forming fine irregularities on the surface of the transparent panel by applying a surface treatment such as embossing or printing a dot pattern on the surface of the transparent panel. Good. Even in the case of diffusion processing, a light diffusing material may be further added in order to improve light diffusibility.

  As described above, by providing the light transmissive cover 50 with the light diffusing function, the light incident on the light transmissive cover 50 is diffused by the light transmissive cover 50 and is transmitted through the light transmissive cover 50 and emitted. That is, the translucent cover 50 having light diffusibility functions as a surface light emitting unit that diffuses the light of the LED 12 having high directivity and performs pseudo light emission. Thereby, sufficient brightness uniformity in the translucent cover 50 can be ensured.

  As shown in FIGS. 4 and 5, the translucent cover 50 is disposed so as to face the reflecting plate 40. Specifically, the translucent cover 50 is disposed so that the inner surface thereof faces the bottom surface 41a of the bottom plate portion 41 of the reflecting plate 40. In the present embodiment, the inner surface of the translucent cover 50 and the bottom plate portion 41 are arranged. It is parallel to the bottom surface 41a.

  The translucent cover 50 is fixed to the instrument body 30. Specifically, the translucent cover 50 is fixed to the instrument body 30 by sandwiching the outer peripheral end of the translucent cover 50 between the flange part of the opening end of the instrument body 30 and the opening end of the frame 60. Yes.

  Further, the reflection plate 40 and the frame 60 are fixed by attachment members 71 and 72 made of sheet metal. A pair of attachment members 71 and 72 are provided so as to face each other with the reflector 40 interposed therebetween. The attachment member 71 is an L-shaped material having an L-shaped cross section, and the attachment member 72 is a leaf spring material.

  Specifically, one plate portion of the attachment member 71 and the frame 60 are locked, and the other plate portion of the attachment member 71 is screwed to the bottom plate portion 41 of the reflection plate 40. Furthermore, an attachment member 72 that is engaged with a protruding portion cut and raised from the bottom plate portion 31 of the instrument body 30 is fitted into an opening formed in one plate portion of the attachment member 71. Thereby, the instrument main body 30, the reflecting plate 40, the translucent cover 50, and the flame | frame 60 are mutually connected and fixed.

[flame]
As shown in FIGS. 1 to 5, the frame 60 has a rectangular frame shape having an opening, and is disposed so as to surround the translucent cover 50 and the instrument body 30. The frame 60 is fixed to the instrument main body 30 by attachment members 71 and 72, for example. The frame 60 may be made of metal or resin. In the present embodiment, the frame 60 is formed using an iron plate.

  In the present embodiment, the frame 60 is formed to be inclined toward the ceiling 100 (installed portion). That is, the length (total height) of the frame 60 in the Z-axis direction gradually decreases from the opening of the frame 60 toward the outer peripheral end. In other words, the distance between the frame 60 and the ceiling surface of the ceiling 100 gradually decreases from the opening toward the outer peripheral end. In this way, the lighting device 1 can be made to appear thinner by inclining the frame 60 toward the ceiling 100.

[Lighting device when lit]
Next, a state when the lighting device 1 according to the embodiment is turned on will be described with reference to FIG. FIG. 6 is a cross-sectional view schematically showing an optical path when the lighting device 1 according to the embodiment is turned on. In FIG. 6, the optical path of the light emitted from the LED module 10 is schematically indicated by arrows.

  In the lighting device 1, the LED module 10 (LED 12) emits light when power is supplied from the power supply device 20 to the LED module 10.

  In the present embodiment, the luminaire 1 is a horizontal luminaire that emits the light of the LED 12 in the horizontal direction of the main surface of the translucent cover 50. That is, as shown in FIG. 6, the LED module 10 is arranged so that the light of the LED module 10 is emitted toward the space region between the reflecting plate 40 and the translucent cover 50. The light enters from the side surface side of the translucent cover 50.

  Thereby, the light emitted from the LED module 10 repeats multiple reflections on the bottom surface 41 a (light reflection surface) of the bottom plate portion 41 of the reflection plate 40 and the inner surface of the light transmission cover 50, and the reflection plate 40 and the light transmission cover 50. It travels through the horizontal space that is formed between the two. That is, the light emitted from the LED module 10 travels from one horizontal end to the other end of the spatial region while being subjected to multiple reflection.

  Thus, the space area between the reflecting plate 40 and the translucent cover 50 is an area where light emitted from the LED module 10 is guided, and functions as a multiple reflection area in the present embodiment.

  During the multiple reflection, a part of the light that reaches the inner surface of the translucent cover 50 is transmitted through the translucent cover 50 and emitted to the outside. As a result, uniform light can be emitted from the entire surface of the translucent cover 50.

[Summary]
As described above, in the illuminating device 1 according to the present embodiment, the light emitted from the LED module 10 travels while being subjected to multiple reflection in the spatial region between the reflector 40 and the translucent cover 50, so that the translucent cover 50 Light is emitted from the entire surface. Thereby, since sufficient brightness | luminance uniformity in the translucent cover 50 can be ensured, surface emission excellent in brightness | luminance uniformity can be implement | achieved.

  Further, in the present embodiment, sufficient brightness uniformity can be achieved without increasing the number of LEDs 12 in order to narrow the arrangement interval of the LEDs 12 or using a light distribution control member such as a wide-angle lens in order to widen the light of the LEDs 12. Therefore, a thin lighting device can be easily realized at low cost.

  Further, in the present embodiment, the power supply device 20 is disposed in a region on the second surface 11 b side of the substrate 11. That is, the power supply device 20 is disposed on the back side of the LED module 10. Specifically, the power supply device 20 and the LED module 10 are arranged in a direction (horizontal direction) perpendicular to the optical axis direction (Z-axis direction) of the lighting device 1, and in the optical axis direction of the lighting device 1. There is no overlap. Thereby, even if it is a case where the illuminating device 1 incorporates the power supply device 20, thickness reduction can be achieved.

  Moreover, in the present embodiment, the light of the LED module 10 is directly incident on the translucent cover 50 without using a light guide plate. Thereby, the fall of the light beam by a light-guide plate can be avoided.

  As mentioned above, according to the illuminating device 1 which concerns on this Embodiment, cost reduction and thickness reduction are implement | achieved, ensuring sufficient brightness | luminance uniformity in the translucent cover 50, without reducing a light beam. be able to.

  In particular, in the present embodiment, a diffusing panel in which the translucent cover 50 has light diffusibility is employed.

  Thereby, since the light of the light source is diffused by the translucent cover 50, it is possible to suppress the light of the light source from directly coming out of the translucent cover 50 even when a light source having strong directivity such as an LED is used. Therefore, in the translucent cover 50, surface light emission with higher luminance uniformity can be realized.

  Moreover, in this Embodiment, a pair of LED module 10 is arrange | positioned so that it may oppose through the space area | region between the reflecting plate 40 and the translucent cover 50. FIG.

  Thereby, compared with the case where the LED module 10 is arrange | positioned only at one edge part of a space area, the brightness | luminance uniformity in the translucent cover 50 whole surface can be improved further. In particular, in the present embodiment, since the plurality of LED modules 10 are disposed so as to surround the translucent cover 50, sufficient luminance uniformity can be ensured over the entire translucent cover 50.

  Moreover, in this Embodiment, the LED module 10 is attached to the baseplate part 41 side in the sideplate part 42 of the reflecting plate 40, and the sideplate part 42 is located between the LED module 10 and the power supply device 20. Yes.

  Thereby, since the power supply device 20 can be arrange | positioned in the area | region of the back surface side of the side plate part 42 to which the LED module 10 was attached, even if it is an illuminating device which incorporated the power supply device 20, it aims at thickness reduction easily. be able to. Moreover, since the power supply device 20 and the LED module 10 can be separated by the side plate portion 42, the insulation between the LED module 10 and the power supply device 20 can be ensured.

  Specifically, the power supply device 20 is disposed between the side plate portion 42 of the reflecting plate 40 and the side plate portion 32 of the instrument main body 30.

  Thereby, since the power supply device 20 can be arrange | positioned using the space between the side plate part 42 of the reflecting plate 40 and the side plate part 32 of the instrument main body 30, even if it is an illuminating device incorporating the power supply device 20, it is. It can be easily reduced in thickness.

  In the present embodiment, the wire opening hole 34 provided in the bottom plate portion 31 of the instrument main body 30 is located between the side plate portion 42 of the reflector 40 and the side plate portion 32 of the instrument main body 30.

  Thereby, since the opening 34 for electric wires can be formed using the space between the side-plate part 42 of the reflecting plate 40, and the side-plate part 32 of the instrument main body 30, a thin illuminating device can be implement | achieved easily.

  Further, in the present embodiment, the bolt opening hole 33 provided in the bottom plate portion 31 of the instrument main body 30 is located between the side plate portion 42 of the reflector 40 and the side plate portion 32 of the instrument main body 30.

  Thereby, since the bolt opening hole 33 can be formed using the space between the side plate portion 42 of the reflecting plate 40 and the side plate portion 32 of the instrument main body 30, a thin lighting device can be easily realized.

(Other variations)
As mentioned above, although the illuminating device which concerns on this invention was demonstrated based on embodiment, this invention is not limited to the said embodiment.

  For example, in the above-described embodiment, a lens that condenses the light emitted from the LED module 10 at the central portion of the light transmitting cover 50 and the reflecting plate 40 is disposed in front of the LED module 10 (LED 12) (light irradiation side). May be. When the LED module 10 is disposed at the outer peripheral end portion of the translucent cover 50, the central portion of the translucent cover 50 becomes relatively darker than the outer peripheral portion, and the brightness difference may be conspicuous between the central portion and the outer peripheral portion. However, by disposing the above lens in front of the LED module 10, it is possible to suppress a luminance difference between the central portion and the outer peripheral portion of the translucent cover 50.

  Moreover, in the said embodiment, although the power supply device 20 was arrange | positioned in the space between the side plate part 42 of the reflecting plate 40, and the side plate part 32 of the instrument main body 30, functional units other than the power supply device 20 are arrange | positioned. Also good. For example, a brightness sensor, a human sensor, a remote control light receiving device, an emergency light unit, or the like can be arranged.

  Moreover, in the said embodiment, although the illuminating device 1 was the structure attached directly to the ceiling 100 with the volt | bolt 200, it is not restricted to this. For example, the lighting device 1 may include a connecting member provided with a hooking blade that is connected to a hooking ceiling installed on the ceiling 100.

  Moreover, in the said embodiment, although the illuminating device 1 was installed so that a predetermined space | interval might exist between the ceiling surface of the ceiling 100 and the outer surface of the instrument main body 30 using a suspension bolt, It is not limited. For example, the lighting device 1 may be installed on the ceiling 100 so that the ceiling surface of the ceiling 100 and the outer surface of the fixture body 30 are in contact with each other. Or the illuminating device 1 may be installed in the ceiling 100 in the state in which a part of the instrument main body 30 is embedded in the opening provided in the ceiling 100.

  Moreover, in the said embodiment, although the illuminating device 1 was made into the square shape whose external shape of planar view shape is a rectangular shape, it is not restricted to this, Even if it is other shapes, such as a round shape or an ellipse shape Good.

  Moreover, in the said embodiment, although the reflecting plate 40 was made into the different body from the instrument main body 30, it may be integral with the instrument main body 30. FIG. That is, a part of the instrument body 30 may be the reflecting plate 40. Specifically, the bottom plate portion 31 of the instrument main body 30 may be configured to be the bottom plate portion 41 of the reflection plate 40.

  Moreover, in the said embodiment, although the reflecting plate 40 was made into the box shape, it is not restricted to this. For example, the reflecting plate 40 may be a metal flat plate or a white resin sheet such as PET, and the reflecting plate 40 may be configured by only the bottom plate portion 41.

  Moreover, in the said embodiment, although four LED modules 10 were arrange | positioned, it is not restricted to this. For example, two LED modules 10 may be arranged so as to face each other only in one axial direction, or only one LED module 10 may be arranged.

  Moreover, in the said embodiment, although the LED module 10 was comprised with the one board | substrate 11, it is not restricted to this. For example, a long LED module may be configured by arranging a plurality of substrates on which one LED 12 is mounted.

  Moreover, in the said embodiment, although LED12 was set as the BY type white LED light source which discharge | releases white light with a blue LED chip and a yellow fluorescent substance, it is not restricted to this. For example, a red phosphor and a green phosphor may be used and combined with a blue LED chip to emit white light. In addition to the yellow phosphor, a red phosphor or a green phosphor may be further mixed for the purpose of improving color rendering. Alternatively, an LED chip that emits a color other than blue may be used. For example, an RGB chip that emits ultraviolet light using an LED chip that emits ultraviolet light is used to emit fluorescent light (blue phosphor, green). The phosphor may be configured to emit white light by a red phosphor. Moreover, you may comprise so that white light may be discharge | released by the red LED chip which emits red light, the green LED chip which emits green light, and the blue LED chip which emits blue light, without using fluorescent substance.

  Moreover, in the said embodiment, although LED12 was only white LED light source, it is not restricted to this. For example, the LED module 10 may be configured using a red LED light source that emits red light, a green LED light source that emits green light, and a blue LED light source that emits blue light. Or you may comprise the LED module 10 using a red LED light source, a green LED light source, a blue LED light source, and a white LED light source. By using a light source that emits the three primary colors of light in this way, it is possible to realize an illuminating device that can perform toning control by RGB control. Moreover, you may comprise the LED module 10 using the several white LED light source from which color temperature differs. Thereby, the illuminating device which can change color temperature is realizable.

  Further, in the above embodiment, the LED is exemplified as the solid light emitting element, but other solid light emitting elements such as a semiconductor light emitting element such as a semiconductor laser, a light emitting element such as an organic EL (Electro Luminescence) or an inorganic EL, etc. Good.

  In addition, it is realized by arbitrarily combining the components and functions in the embodiments without departing from the scope of the present invention, and the forms obtained by subjecting each embodiment to various modifications conceived by those skilled in the art. This form is also included in the present invention.

1 Illumination Device 10 LED Module (Light Emitting Module)
DESCRIPTION OF SYMBOLS 11 Board | substrate 11a 1st surface 11b 2nd surface 12 LED (solid light emitting element)
20 Power supply device 30 Instrument body 31 Bottom plate (second bottom plate)
32 side plate (second side plate)
33 Bolt hole 34 Electric wire hole 40 Reflector 41 Bottom plate (first bottom plate)
42 Side plate (first side plate)
50 Translucent cover

Claims (7)

A light emitting module comprising an elongated substrate and a plurality of solid state light emitting elements disposed on a first surface of the substrate along a longitudinal direction of the substrate;
A power supply device for generating electric power for causing the solid-state light emitting element to emit light;
An instrument body which is attached to the installation part and houses the light emitting module and the power supply device;
A reflection plate provided in the instrument body and reflecting light from the light emitting module in a direction opposite to the portion to be installed;
A translucent cover disposed so as to face the reflecting plate;
The light emitting module is arranged so that light of the light emitting module is emitted toward a space region between the reflector and the light transmitting cover,
The said power supply device is arrange | positioned in the area | region of the 2nd surface side on the opposite side to the said 1st surface in the said board | substrate. The lighting device according to claim 1, wherein the translucent cover has light diffusibility. The light emitting modules are arranged in a pair,
The lighting device according to claim 1, wherein the pair of light emitting modules are arranged to face each other with the space region interposed therebetween. The reflection plate is a first bottom plate portion that is a reflection portion facing the translucent cover, and a first erected at a predetermined angle from an outer peripheral end portion of the first bottom plate portion so as to surround the first bottom plate portion. A side plate portion,
The light emitting module is attached to the first bottom plate portion side of the first side plate portion,
The lighting device according to claim 1, wherein the first side plate portion is located between the light emitting module and the power supply device. The instrument main body is erected at a predetermined angle from a second bottom plate portion where the first bottom plate portion of the reflecting plate is disposed and an outer peripheral end portion of the second bottom plate portion so as to surround the second bottom plate portion. A second side plate part,
The lighting device according to claim 4, wherein the power supply device is disposed between the first side plate portion and the second side plate portion. The second bottom plate portion is provided with an opening for electric wire through which an electric wire for supplying electric power from an external power source to the power supply device is inserted,
The lighting device according to claim 5, wherein the opening hole for electric wire is located between the first side plate portion and the second side plate portion. The second bottom plate portion is provided with a bolt opening hole through which a bolt for fixing the portion to be installed and the instrument body is inserted.
The lighting device according to claim 5, wherein the opening for electric wire is located between the first side plate portion and the second side plate portion.

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