JP2009009898A - Lighting device and luminaire - Google Patents

Lighting device and luminaire Download PDF

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JP2009009898A
JP2009009898A JP2007172377A JP2007172377A JP2009009898A JP 2009009898 A JP2009009898 A JP 2009009898A JP 2007172377 A JP2007172377 A JP 2007172377A JP 2007172377 A JP2007172377 A JP 2007172377A JP 2009009898 A JP2009009898 A JP 2009009898A
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light
light emitting
substrate
base
led
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JP5601556B2 (en
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Erika Takenaka
絵梨果 竹中
Kozo Ogawa
光三 小川
Nobuo Shibano
信雄 柴野
Akiko Saito
明子 斉藤
Kiyoshi Nishimura
潔 西村
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Toshiba Lighting and Technology Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a lighting device using a semiconductor light emitting element, which reduces the generation of dark part at the corner of the device, and to provide a luminaire using the same. <P>SOLUTION: A lighting device 10 includes: a base 11; semiconductor light-emitting elements 12 arranged substantially linearly; and a light emitting section 13 for illuminating between the semiconductor light emitting elements and the base end portion. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、発光ダイオード等の半導体発光素子を光源とした照明装置および照明装置を用いた照明器具に関する。    The present invention relates to an illuminating device using a semiconductor light emitting element such as a light emitting diode as a light source, and an illumination fixture using the illuminating device.

近年、半導体発光素子、例えば、発光ダイオードの発光効率の向上により、一般照明用の光源として発光ダイオードを採用する照明器具が商品化され、特に、発光ダイオードは小型・薄型化を図ることが可能なため複数個の発光ダイオードを直線状に配置して線モジュールからなる照明装置を構成し、それらを連結してライン状をなす照明器具を構成することが行われている。   In recent years, due to the improvement of the light emission efficiency of semiconductor light emitting devices, for example, light emitting diodes, lighting fixtures that employ light emitting diodes as light sources for general illumination have been commercialized, and in particular, light emitting diodes can be reduced in size and thickness. Therefore, a plurality of light emitting diodes are arranged in a straight line to form a lighting device composed of a line module, and they are connected to form a lighting device that forms a line.

特許文献1に示す照明装置は、発光ダイオードを直線状に配置した長尺な発光素子基板、発光ダイオードの光を制御するレンズ、および電源回路基板を本体ケースに配設した照明装置を構成し、この照明装置を2台長手方向に連結して、流し元灯を構成したものが示されている。   The illuminating device shown in Patent Document 1 constitutes an illuminating device in which a long light emitting element substrate in which light emitting diodes are linearly arranged, a lens for controlling light from the light emitting diodes, and a power circuit board are arranged in a main body case, A lighting source lamp is configured by connecting two of these lighting devices in the longitudinal direction.

また、特許文献2には、矩形状の基板の長手方向に沿ってライン状に実装された色の異なる複数個のLEDチップと、このLEDチップ全体を覆うかまぼこ形状の透明樹脂部でLED光源デバイスを構成し、このLED光源デバイスにより足元灯などの照明器具を構成したものが示されている。   Patent Document 2 discloses an LED light source device that includes a plurality of LED chips of different colors mounted in a line along the longitudinal direction of a rectangular substrate, and a kamaboko-shaped transparent resin portion covering the entire LED chip. The LED light source device constitutes a lighting fixture such as a foot lamp.

さらに、特許文献3には、複数のLED光源ユニットを長手方向の両端面を突き合わせ、隣接するLED光源ユニットの端子電極同士に連結基板を被せて1枚の放熱板にネジ止めすることによりライン型LED光源を形成したものが示されている。
特開2006−31969号公報 特開2002−299697号公報 特開2007−109404号公報
Furthermore, in Patent Document 3, a plurality of LED light source units are aligned with each other in the longitudinal direction, and a terminal board of adjacent LED light source units is covered with a connecting substrate and screwed to a single heat sink. An LED light source is shown.
Japanese Patent Laid-Open No. 2006-31969 JP 2002-299697 A JP 2007-109404 A

一方、例えば、住宅用のシーリングライト等の照明器具においては、グローブに輝度ムラが生じないように均斉度を高めた光源部が要求される。しかしながらこの種のライン状の照明装置においては、特許文献3にも示されるように、パッケージの両端部には連結したり固定するための固定部が必要であり、また、LEDチップにおける充電部との絶縁距離が必要となるために端部には発光源となるLEDチップを配置することができない。   On the other hand, for example, in a lighting fixture such as a ceiling light for a house, a light source unit with a high degree of uniformity is required so that luminance unevenness does not occur in the globe. However, in this type of line-shaped illumination device, as shown in Patent Document 3, both ends of the package need to be fixed or connected to each other. Therefore, an LED chip serving as a light emitting source cannot be disposed at the end.

このため、ライン状をなす照明装置においては、両端部が非発光部となって暗部が形成され輝度ムラが生じ、照明器具の光源としては適さない問題が生じる。特に、長手方向に複数台連結して構成した場合、連結部には両者の暗部がつながって、暗部の幅が倍に広くなり、発光部と非発光部が交互に並ぶことになり、見た目がラインとは程遠いものになってしまう。   For this reason, in the illuminating device which forms a line shape, both end portions become non-light emitting portions, dark portions are formed, luminance unevenness occurs, and there is a problem that it is not suitable as a light source of a lighting fixture. In particular, when a plurality of units are connected in the longitudinal direction, the dark part of both is connected to the connecting part, the width of the dark part is doubled, the light emitting part and the non-light emitting part are alternately arranged, and the appearance is It will be far from the line.

この問題は、ライン状をなす照明装置において、特に顕著に現れるが、発光ダイオードをマトリックス状に配設した矩形状をなす照明装置でも、さらには、点モジュールを構成する円板状に形成した照明装置やLED電球等においても同様の問題が生じる。   This problem appears particularly prominently in a line-shaped illumination device, but even in a rectangular illumination device in which light-emitting diodes are arranged in a matrix, the illumination is further formed in the shape of a disk constituting a point module. Similar problems occur in devices and LED bulbs.

このため、光源を発光ダイオード等の半導体発光素子で構成する照明装置においては、非発光部である暗部を装置の端部に如何にして発生させないかが重要な課題となっている。   For this reason, in an illuminating device in which the light source is configured by a semiconductor light emitting element such as a light emitting diode, an important issue is how to prevent a dark portion, which is a non-light emitting portion, from being generated at the end of the device.

本発明は、上記課題に鑑みてなされたもので、装置端部における暗部の発生を低減することが可能な半導体発光素子を用いた照明装置およびこの照明装置を用いた照明器具を提供しようとするものである。   The present invention has been made in view of the above problems, and intends to provide an illuminating device using a semiconductor light-emitting element capable of reducing the occurrence of dark portions at the end of the device and an illuminating device using the illuminating device. Is.

請求項1に記載の照明装置の発明は、基体と;基体に略直線状に配設された半導体発光素子と;半導体発光素子と基体端部との間を発光させるための発光部と;を具備することを特徴とする。   The invention of the lighting device according to claim 1 includes: a base; a semiconductor light emitting element disposed substantially linearly on the base; and a light emitting portion for causing light emission between the semiconductor light emitting element and the end of the base. It is characterized by comprising.

本発明によれば、半導体発光素子と基体端部との間を発光させるための発光部により、装置端部における暗部の発生を低減することが可能となる。   According to the present invention, it is possible to reduce the occurrence of a dark portion at the device end by the light emitting portion for emitting light between the semiconductor light emitting element and the substrate end.

本発明において、照明装置は、シーリングライト等の光源として組み込まれ照明器具を構成することが好ましいが、液晶表示装置のバックライトや看板灯を構成するものであってもよい。   In the present invention, the illuminating device is preferably incorporated as a light source such as a ceiling light to constitute a lighting fixture, but may constitute a backlight or a signboard lamp of a liquid crystal display device.

基体は、光源としての半導体発光素子を配置するための部材で、半導体発光素子を実装した回路基板と回路基板を覆い収納するケース部材で構成することが好ましいが、発光ダイオードをケース部材に設置して回路基板を省略しても、逆にケース部材を省略して回路基板のみで構成してもよい。   The substrate is a member for arranging a semiconductor light emitting element as a light source, and is preferably composed of a circuit board on which the semiconductor light emitting element is mounted and a case member that covers and stores the circuit board, but the light emitting diode is installed on the case member. Even if the circuit board is omitted, the case member may be omitted and the circuit board alone may be used.

基体を構成するケース部材の材質は、光の反射性能を考慮して、耐光性、耐熱性および電気絶縁性を有する白色の合成樹脂、例えば、PBT(ポリブチレンテレフタレート)等で構成してもよい。さらに、半導体発光素子の放熱性能を考慮して、アルミニウム等、熱伝導性の良好な金属で構成してもよい。形状は、線モジュールを構成する長尺なライン状をなす形状をなしていても、点モジュールを構成するために円板状をなしていてもよく、目的とする配光特性を得るための全ての形状が許容される。   The material of the case member constituting the base may be composed of a white synthetic resin having light resistance, heat resistance, and electrical insulation, for example, PBT (polybutylene terephthalate) in consideration of light reflection performance. . Furthermore, in consideration of the heat dissipation performance of the semiconductor light emitting device, the semiconductor light emitting device may be made of a metal having good thermal conductivity such as aluminum. The shape may be the shape of a long line constituting the line module, or it may be a disk shape to constitute a point module, all for obtaining the desired light distribution characteristics. Is acceptable.

基体を構成する回路基板は、半導体発光素子を実装し支持した配線基板からなることが好ましいが、回路基板の構成および実装するための手段は特定のものに限定されない。   The circuit board constituting the base is preferably a wiring board on which a semiconductor light emitting element is mounted and supported. However, the configuration of the circuit board and the means for mounting are not limited to specific ones.

半導体発光素子は、発光ダイオードやEL(エレクトロルミネッセンス)素子、半導体レーザーなど、半導体を発光源とした発光素子が許容される。また半導体発光素子は、複数個の半導体発行素子を直線または曲線等をなして配設し線モジュールの照明装置を構成することが好ましいが、半導体発光素子をマトリックス状に配設した矩形状をなす照明装置でも、さらには、1個または複数個の半導体発光素子により点モジュールを構成するように円板状に形成した照明装置やLED電球等を構成するものであってもよく、個数および配設される形状等は特定のものに限定されない。   As the semiconductor light emitting element, a light emitting element using a semiconductor as a light emitting source, such as a light emitting diode, an EL (electroluminescence) element, or a semiconductor laser, is allowed. Further, the semiconductor light emitting element preferably includes a plurality of semiconductor issuing elements arranged in a straight line or a curve to constitute a lighting device for a line module. However, the semiconductor light emitting element has a rectangular shape in which the semiconductor light emitting elements are arranged in a matrix. The lighting device may further constitute a lighting device or an LED bulb formed in a disk shape so as to form a point module by one or a plurality of semiconductor light emitting elements. The shape to be formed is not limited to a specific one.

半導体発光素子と基体端部との間を発光させるための発光部は、例えば、半導体発光素子を覆う光透過性樹脂を基体端部まで配設し、半導体発光素子から放射される光を基体端部まで導入して発光させるものでもよい。さらに、反射体を半導体発光素子に対向して基体端部に配設し、半導体発光素子から放射される光を反射体により基体端部に向けて反射させ端部を発光させるものであってもよい。さらには、半導体発光素子自体で発光部を構成してもよい。例えば、端部に位置する半導体発光素子を基体の長手方向に発光面を対向させて、換言すれば、素子チップを縦に配置して素子チップの発光面を基体端部に向けて光を端部に導入させるようにしてもよい。   The light emitting unit for emitting light between the semiconductor light emitting element and the substrate end is, for example, a light-transmitting resin that covers the semiconductor light emitting element is disposed up to the substrate end, and the light emitted from the semiconductor light emitting element is transmitted to the substrate end. It is also possible to introduce light up to a part to emit light. Further, the reflector may be disposed at the end of the base so as to face the semiconductor light emitting element, and the light emitted from the semiconductor light emitting element may be reflected toward the base end by the reflector to emit light at the end. Good. Furthermore, the light emitting unit may be configured by the semiconductor light emitting element itself. For example, the semiconductor light emitting device located at the end is opposed to the light emitting surface in the longitudinal direction of the substrate, in other words, the device chip is arranged vertically and the light emitting surface of the device chip is directed toward the end of the substrate. You may make it introduce into a part.

請求項2に記載の照明装置の発明は、基体と;基体に略直線状に配設された半導体発光素子と;半導体発光素子を覆い基体端部まで配設された光透過性樹脂と;を具備することを特徴とする。   The invention of the lighting device according to claim 2 includes: a base; a semiconductor light emitting element disposed substantially linearly on the base; and a light-transmitting resin that covers the semiconductor light emitting element and is disposed up to an end of the base. It is characterized by comprising.

光透過性樹脂は、例えば、透明なシリコーン樹脂やエポキシ樹脂が好適であるが、半透明など光透過性を有する全ての樹脂が許容される。また、光透過性樹脂は、所定の蛍光体をシリコーン樹脂やエポキシ樹脂等の透明な樹脂に加えて混合・分散させた層として形成してもよい。蛍光体は、予め形成された光透過性の樹脂の上に蛍光体を含む層として形成してもよい。   For example, a transparent silicone resin or an epoxy resin is suitable as the light transmissive resin, but any resin having a light transmissive property such as translucent is acceptable. The light transmissive resin may be formed as a layer in which a predetermined phosphor is mixed and dispersed in a transparent resin such as a silicone resin or an epoxy resin. The phosphor may be formed as a layer containing the phosphor on a light-transmitting resin formed in advance.

請求項3に記載の照明装置の発明は、基体と;基体に略直線状に配設された半導体発光素子と;半導体発光素子に対向して基体端部に配設された反射体と;を具備することを特徴とする。   According to a third aspect of the present invention, there is provided a lighting device comprising: a base; a semiconductor light emitting element disposed substantially linearly on the base; and a reflector disposed at an end of the base so as to face the semiconductor light emitting element. It is characterized by comprising.

反射体は、基体と一体に形成されても、または、基体と別体にPBT等の白色の合成樹脂、アルミニウムやステンレス等を鏡面または半鏡面加工等を施して形成したものであってもよい。   The reflector may be formed integrally with the substrate, or may be formed by subjecting a white synthetic resin such as PBT, aluminum, stainless steel, or the like to a mirror or semi-mirror surface process. .

請求項4記載の照明装置の発明は、基体と;基体に略直線状に配設された半導体発光素子と;基体端部に基体の長手方向に発光面を対向させて配置した端部半導体発光素子と;を具備することを特徴とする。   According to a fourth aspect of the present invention, there is provided a lighting device comprising: a base; a semiconductor light emitting element disposed substantially linearly on the base; and an end semiconductor light emitting device disposed at an end of the base with a light emitting surface facing the longitudinal direction of the base And an element.

基体端部に基体の長手方向に発光面を対向させて配置した端部半導体発光素子は、例えば、チップを縦方向に配置して、チップ側部の発光面を基体の端部に対向させて、端部に光を導入させる手段が許容されるが、厳密に縦方向になっている必要はなく、チップ側部の発光面の光が効果的に端部に導入されるように適宜傾斜させたものであってもよい。   For example, an end semiconductor light emitting device that is disposed with a light emitting surface facing a longitudinal direction of the substrate at an end of the substrate has, for example, a chip disposed in the vertical direction and a light emitting surface on the side of the chip facing the edge of the substrate. , Means for introducing light into the end portion are allowed, but it is not necessary to be strictly in the vertical direction, and is appropriately inclined so that light on the light emitting surface of the chip side portion is effectively introduced into the end portion. It may be.

請求項5記載の照明器具の発明は、器具本体と;器具本体に配設された請求項1ないし4いずれか一記載の照明装置とを具備することを特徴とする。   The invention of a lighting fixture according to claim 5 is characterized by comprising: a fixture body; and the lighting device according to any one of claims 1 to 4 disposed in the fixture body.

本発明において、照明器具は、住宅用のシーリングライト等が好適であるが、住宅用に限らず、店舗、オフィス等施設・業務用の照明器具であってもよい。形状は、流し元灯、足元灯、階段埋込灯などライン形状のものでも、さらに、円形、楕円形等の丸形、正方形や長方形等の角形、さらには6角形や8角形等の多角形状をなしていてもよく、特定の形状には限定されない。   In the present invention, the lighting fixture is preferably a residential ceiling light or the like. However, the lighting fixture is not limited to a residential use, and may be a lighting fixture for a facility or business such as a store or office. The shape can be a line shape such as a sink lamp, a foot lamp, or a staircase lamp, a round shape such as a circle or an ellipse, a square shape such as a square or rectangle, and a polygon such as a hexagon or octagon. However, it is not limited to a specific shape.

請求項1記載の発明によれば、半導体発光素子と基体端部との間を発光させるための発光部により、装置端部における暗部の発生を低減することが可能な照明装置を提供することができる。   According to the first aspect of the present invention, it is possible to provide an illuminating device capable of reducing the occurrence of a dark portion at the end portion of the device by the light emitting portion for emitting light between the semiconductor light emitting element and the base end portion. it can.

請求項2記載の発明によれば、半導体発光素子を覆い基体端部まで配設された光透過性樹脂により、半導体発光素子から放射される光を基体端部まで導入して発光させ、装置端部における暗部の発生を低減することが可能な照明装置を提供することができる。   According to the second aspect of the present invention, the light radiated from the semiconductor light emitting element is introduced to the substrate end portion to emit light by the light transmitting resin that covers the semiconductor light emitting device and is disposed up to the substrate end portion. It is possible to provide an illuminating device capable of reducing the occurrence of dark parts in the part.

請求項3記載の発明によれば、半導体発光素子に対向して基体端部に配設された反射体により、半導体発光素子から放射される光を反射体により基体端部に向けて反射させ、装置端部における暗部の発生を低減することが可能な照明装置を提供することができる。   According to the invention described in claim 3, the light emitted from the semiconductor light emitting element is reflected toward the base end by the reflector by the reflector disposed at the base end facing the semiconductor light emitting element, It is possible to provide an illuminating device capable of reducing the occurrence of dark portions at the device end.

請求項4記載の発明によれば、基体端部に基体の長手方向に発光面を対向させて配置した端部半導体発光素子により、チップの発光面を基体端部に向けて光を端部に導入させ、装置端部における暗部の発生を低減することが可能な照明装置を提供することができる。   According to the fourth aspect of the present invention, the edge semiconductor light emitting device is arranged with the light emitting surface facing the substrate end in the longitudinal direction of the substrate, and the light is emitted to the end with the light emitting surface of the chip facing the substrate end. It is possible to provide an illuminating device that can be introduced to reduce the occurrence of dark portions at the end of the device.

請求項5記載の発明によれば、装置端部における暗部の発生を低減することが可能な照明装置を光源部することにより、輝度ムラを低減して均斉度の高い照明器具を提供することができる   According to the fifth aspect of the present invention, it is possible to provide a lighting device with high uniformity by reducing luminance unevenness by providing a light source unit with a lighting device capable of reducing the occurrence of dark portions at the end of the device. it can

以下、本発明に係る照明装置およびこの照明装置を用いた照明器具の実施形態について説明する。   Hereinafter, an embodiment of a lighting device according to the present invention and a lighting fixture using the lighting device will be described.

図1に示すように、本実施例の照明装置10は、基体11、基体に略直線状に配設された半導体発光素子12、半導体発光素子と基体端部との間を発光させるための発光部13で構成する。   As shown in FIG. 1, the illumination device 10 of the present embodiment includes a base 11, a semiconductor light emitting element 12 disposed substantially linearly on the base, and light emission for emitting light between the semiconductor light emitting element and the end of the base. The unit 13 is configured.

基体11は、ケース部材11aと回路基板11bからなり、ケース部材11aは、熱伝導性の良好なアルミニウムで構成され、照明装置に必要とされる発光面積を得るために横断面がコ字状の長い凹溝11cを形成した薄いライン状をなし、その凹溝の内面を反射面となし、その表面に可視光の反射率の高い白色塗料等を塗布して形成する。回路基板11bは、長尺のプリント配線基板で構成する。   The base 11 is composed of a case member 11a and a circuit board 11b. The case member 11a is made of aluminum having good thermal conductivity, and has a U-shaped cross section in order to obtain a light emitting area required for the lighting device. The long groove 11c is formed in a thin line shape, and the inner surface of the groove is formed as a reflecting surface, and a white paint having a high visible light reflectance is applied to the surface. The circuit board 11b is composed of a long printed wiring board.

半導体発光素子12は、発光ダイオード(以下「LED」と称す)で構成し、LED12は、同一色、本実施形態では青色LEDチップとこの青色LEDチップにより励起される黄色蛍光体により白色を発光する高輝度、高出力の複数個のLEDからなり、この各LEDは、一方向、すなわちLEDの光軸方向に光線が主として放射される同種性能のもので構成する。複数個のLED12は、長尺の回路基板11b上に等間隔に実装される。LEDを実装した回路基板は、ライン状をなす基板の凹溝11cの内底面に熱伝導性の良好な放熱シートやグリス等を介して取り付けられる。   The semiconductor light emitting element 12 is composed of a light emitting diode (hereinafter referred to as “LED”), and the LED 12 emits white light by the same color, in this embodiment, a blue LED chip and a yellow phosphor excited by the blue LED chip. It consists of a plurality of high-brightness and high-power LEDs, and each LED has the same kind of performance that mainly emits light in one direction, that is, the optical axis direction of the LED. The plurality of LEDs 12 are mounted on the long circuit board 11b at equal intervals. The circuit board on which the LED is mounted is attached to the inner bottom surface of the groove 11c of the line-shaped board via a heat radiation sheet or grease having good thermal conductivity.

さらに、LED12が収納された基体の凹溝11c内に、本発明の光透過性樹脂を構成する蛍光体層14を充填する。すなわち、この充填は、各LED12の外側を覆い、所定の蛍光体をシリコーン樹脂やエポキシ樹脂等の透明な樹脂に加えて混合・分散させた層として形成する。この蛍光体層は、図1に示すように、基体の両端部11d、11dまで行きわたるように充填し、各LED、特に端部に位置するLED12aから放射される光を透明な樹脂からなる蛍光体層14内に導入して両端部11d、11dを発光させる発光部13を形成する。なお、LED12は、青色LEDチップからなり、蛍光体層14は、この青色LEDチップにより励起される黄色蛍光体で構成する。   Further, the phosphor layer 14 constituting the light-transmitting resin of the present invention is filled in the concave groove 11c of the base body in which the LED 12 is accommodated. That is, this filling is formed as a layer covering the outside of each LED 12 and adding and mixing and dispersing a predetermined phosphor in a transparent resin such as a silicone resin or an epoxy resin. As shown in FIG. 1, the phosphor layer is filled so as to reach both end portions 11d and 11d of the base, and light emitted from each LED, particularly the LED 12a located at the end portion, is made of a fluorescent resin. A light emitting portion 13 is formed which is introduced into the body layer 14 and emits light from both end portions 11d and 11d. In addition, LED12 consists of a blue LED chip, and the fluorescent substance layer 14 is comprised with the yellow fluorescent substance excited by this blue LED chip.

上記のように各LED12を配置し構成された基体11は、ヒートシンクとしてのアルミニウムからなる基盤11eの凹部に嵌合され密着してボルト11fにより固着される。これにより、複数個のLED12を等間隔に配設した直線状の長さが約100mmの線状の発光モジュールからなる照明装置10が構成され、必要な個数、本実施例では5本の照明装置が連結されて1本の長尺な照明装置が構成される(図3(b))。   The base body 11 configured by arranging the respective LEDs 12 as described above is fitted into and closely attached to a concave portion of a base 11e made of aluminum as a heat sink, and is fixed by a bolt 11f. As a result, a lighting device 10 composed of a linear light-emitting module having a linear length of about 100 mm in which a plurality of LEDs 12 are arranged at equal intervals is formed, and the necessary number of lighting devices, in this embodiment, five lighting devices. Are connected to form one long lighting device (FIG. 3B).

上記に構成された長尺の照明装置10を点灯すると、各照明装置のLED12が発光し、青色LEDチップから発光した光が基体11の凹溝11cに形成された反射面に反射して黄色蛍光体層14を通過して放射される。この際、基体の両端部11d、11dには蛍光体層14が充填されているので、各LED、特に端部に位置するLED12aから放射される光が透明な樹脂からなる蛍光体層14内に導入され基体両端部の発光部13が発光する。これにより、複数の照明装置10を連結した継ぎ目(目地)による暗部が形成されることがなく、長手方向に輝度ムラがなく均斉度の高い光が放射される。   When the long illuminating device 10 configured as described above is turned on, the LED 12 of each illuminating device emits light, and the light emitted from the blue LED chip is reflected by the reflecting surface formed in the concave groove 11c of the base 11 to cause yellow fluorescence. Radiated through the body layer 14. At this time, since both end portions 11d and 11d of the substrate are filled with the phosphor layer 14, light emitted from each LED, particularly the LED 12a located at the end portion, enters the phosphor layer 14 made of a transparent resin. When introduced, the light emitting sections 13 at both ends of the base emit light. Thereby, the dark part by the joint (joint) which connected the some illuminating device 10 is not formed, but there is no brightness nonuniformity in a longitudinal direction, and light with high uniformity is radiated | emitted.

上記構成の照明装置は、レンズ体等の光制御部材を組み込むことにより光源体を構成し、各種照明器具の光源体として用いられる。次に上記照明装置を光源体として用いた住宅用のシーリングライトからなる照明器具の構成を図2〜図6に従い説明する。まず、レンズ体を組み込んだ光源体の構成を説明する。   The illumination device having the above configuration constitutes a light source body by incorporating a light control member such as a lens body, and is used as a light source body of various lighting fixtures. Next, the structure of the lighting fixture which consists of a ceiling light for houses using the said illuminating device as a light source body is demonstrated according to FIGS. First, the configuration of a light source body incorporating a lens body will be described.

光源体20は図2〜図3に示すように、上記構成の照明装置10、照明装置に入射面を対向して設けた導光体21および導光体の出射面に対向して設けられるレンズ体22からなる。   As shown in FIGS. 2 to 3, the light source body 20 includes the illumination device 10 having the above-described configuration, a light guide 21 provided on the illumination device with an incident surface facing the light source 21, and a lens provided facing the emission surface of the light guide. It consists of a body 22.

導光体21は、一端面に光の入射面21aを他端面に出射面21bを形成した断面が長方形状の立方体をなす透明なアクリル樹脂等の合成樹脂で形成された導光板で構成する。導光体の入射面21aは、平面状に形成され、その平坦面を上記照明装置10の基体の凹溝11cに対し光が漏れないように対向させて装着する。この際、各LED12の発光中心xが導光体の入射面21aの中心に位置するように装着する。   The light guide 21 is composed of a light guide plate formed of a synthetic resin such as a transparent acrylic resin having a rectangular cross section in which a light incident surface 21a is formed on one end surface and an output surface 21b is formed on the other end surface. The incident surface 21a of the light guide is formed in a flat shape, and the flat surface is mounted so as to face the concave groove 11c of the base of the lighting device 10 so that light does not leak. At this time, the LED 12 is mounted so that the light emission center x is positioned at the center of the light incident surface 21a.

レンズ体22は、焦点を出た光が無収差の平行光となってレンズを出るコリメータレンズで構成する。コリメータレンズ22は、長尺状をなし平滑な入射面22a、入射面の中心に第一焦点aを有する断面略楕円形状をなす出射面22b、入射面の上下部分を切り欠いて形成した断面三角形状の凹部22c、22cおよび凹部の両側に一体に形成した支持部22d、22dを一体に形成する。このコリメータレンズは、導光体21の出射面21bに対向して配設される。すなわち、導光体の出射面21bは平面状に形成され、その平坦面をコリメータレンズの入射面22aに光が漏れないように密着し装着する。この際、導光体21の出射面21bの発光中心b、これは入射面21aの中心と一致する。換言すれば、各LED12の発光中心xがコリメータレンズ22の第一焦点aより所定の寸法cだけ片寄って、図2において下方(図3(a)において上方)、これは、本光源体により後述する照明器具を構成する場合にグローブ側に片寄って位置するようにして装着する。さらに、コリメータレンズ22は、支持部22d、22dを使用して照明装置10のヒートシンクである基盤11eの発光面側にボルト22eにより取り付けて支持され光源体20が構成される。   The lens body 22 is configured by a collimator lens that exits the lens from the focused light as non-aberration parallel light. The collimator lens 22 has a long and smooth entrance surface 22a, an exit surface 22b having a substantially elliptical cross section with the first focal point a at the center of the entrance surface, and a cross-sectional triangle formed by cutting out the upper and lower portions of the entrance surface. The concave portions 22c and 22c having a shape and support portions 22d and 22d integrally formed on both sides of the concave portion are integrally formed. The collimator lens is disposed to face the light exit surface 21 b of the light guide 21. That is, the exit surface 21b of the light guide is formed in a flat shape, and the flat surface is closely attached to the entrance surface 22a of the collimator lens so that light does not leak. At this time, the emission center b of the exit surface 21b of the light guide 21 coincides with the center of the entrance surface 21a. In other words, the light emission center x of each LED 12 is offset from the first focal point a of the collimator lens 22 by a predetermined dimension c, and is lower in FIG. 2 (upward in FIG. 3A). When constructing a lighting fixture to be mounted, it is mounted so as to be offset from the glove side. Furthermore, the collimator lens 22 is attached and supported by the bolt 22e on the light emitting surface side of the base 11e which is the heat sink of the lighting device 10 using the support portions 22d and 22d, and the light source body 20 is configured.

なお、コリメータレンズ22は、長さ約500mmの長尺な1本のコリメータレンズで長さ約100mmの5本の照明装置10(全長約500mm)を全て覆うように配設して光源体20を構成する。(図3(b))
次に、上記に構成された光源体20を用いた住宅用のシーリングライトからなる照明器具30の構成を図4〜図5に従い説明する。
The collimator lens 22 is disposed so as to cover all of the five illumination devices 10 (total length: about 500 mm) having a length of about 100 mm with a single long collimator lens having a length of about 500 mm. Constitute. (Fig. 3 (b))
Next, the structure of the lighting fixture 30 which consists of the ceiling light for houses using the light source body 20 comprised above is demonstrated according to FIGS.

照明器具30は、器具本体31、上記構成の2台の光源体20、反射体32およびグローブ33からなる。   The lighting fixture 30 includes a fixture main body 31, two light source bodies 20 having the above-described configuration, a reflector 32, and a globe 33.

器具本体31は、鉄板等の金属に白色塗装を施した一辺が約500mmの正方形をなすシャーシーとして構成され、シャーシーの略中央部には天井等の器具取付面に設置された引掛シーリングに着脱可能に設置されるアダプタ34を設ける。さらに、アダプタの周囲の空間部に照明装置10を点灯するための点灯装置35を取り付け、対向する辺の外縁部36、37に照明装置10を用いた光源体20設置するための設置部38、39を設ける。図中40は、リモコン受光部である。   The instrument body 31 is configured as a chassis with a white coating on a metal such as an iron plate, and a square with a side of approximately 500 mm. The chassis main body 31 is detachable from a hook ceiling installed on the instrument mounting surface such as the ceiling at the approximate center of the chassis. An adapter 34 is provided. Further, a lighting device 35 for lighting the lighting device 10 is attached to the space around the adapter, and an installation portion 38 for installing the light source body 20 using the lighting device 10 on the outer edge portions 36 and 37 of the opposite sides, 39 is provided. In the figure, reference numeral 40 denotes a remote control light receiving unit.

光源体20は、2台用意され器具本体31の対向する辺の外縁部36、37に設けられた設置部38、39に1台ずつ、照明装置10の各LED12がそれぞれ対向するようにして器具本体31の外縁部に配設する。すなわち、器具本体31のそれぞれの設置部38、39にはシャーシーから一体に形成された支持板41が立設され、支持板に各光源体20の基盤11eを取り付けて支持する(図4(b))。   Two light source bodies 20 are prepared, one for each of the installation portions 38 and 39 provided on the outer edge portions 36 and 37 of the opposite sides of the device main body 31 so that each LED 12 of the lighting device 10 faces each other. Arranged at the outer edge of the main body 31. That is, a support plate 41 integrally formed from the chassis is erected on each installation portion 38, 39 of the instrument main body 31, and the base 11e of each light source body 20 is attached to and supported by the support plate (FIG. 4B). )).

この際、図2(a)に示すように、各照明装置10におけるLED11の発光中心x、すなわち導光体21の出射面21bの中心点bをコリメータレンズ22の第一焦点aに対して所定の寸法cだけグローブ33側(図2(a)おいて下方)に偏心させて装着する。   At this time, as shown in FIG. 2A, the light emission center x of the LED 11 in each illumination device 10, that is, the center point b of the emission surface 21 b of the light guide 21 is predetermined with respect to the first focal point a of the collimator lens 22. Is attached eccentrically to the glove 33 side (downward in FIG. 2A) by the dimension c.

反射体32は、鉄板等の金属に白色塗装を施した平板状をなし、両端部を2台のそれぞれの光源体20における各LED12に対向させ、中間部分から器具本体の略中央部に向かって連続的に徐々に傾斜させた傾斜部32aを形成する。反射体は、器具本体31を構成するシャーシーの略中央部に、ネジ若しくはスポット溶接等の手段で固定される。   The reflector 32 has a flat plate shape in which a metal such as an iron plate is coated with white paint, both ends are opposed to the LEDs 12 in the two light source bodies 20, and from an intermediate portion toward a substantially central portion of the instrument body. An inclined portion 32a that is continuously inclined gradually is formed. The reflector is fixed to a substantially central portion of the chassis constituting the instrument body 31 by means such as screws or spot welding.

グローブ33は、透光性を有する乳白色の半透明な合成樹脂で構成し、浅い皿状の球面状をなす発光部33aと、器具本体31の外縁部36、37に対応する部分に外周部を残して上面を開口することにより形成した開口部33bとを一体に形成し、器具本体の下方から被せることにより光源体20および反射体32を覆うように器具本体31の下面全体を覆い囲むようにして取り付けられる。なお、グローブ33は公知の凹凸の係合手段や取付金具等の手段で器具本体の外縁部に着脱可能に取り付けられる。   The globe 33 is made of translucent milky white translucent synthetic resin and has a light emitting portion 33a having a shallow dish-like spherical shape and an outer peripheral portion at portions corresponding to the outer edge portions 36 and 37 of the instrument body 31. The opening 33b formed by opening the remaining upper surface is integrally formed, and is attached so as to cover the entire lower surface of the instrument body 31 so as to cover the light source body 20 and the reflector 32 by covering from below the instrument body. It is done. The globe 33 is detachably attached to the outer edge portion of the instrument main body by means of a known uneven engagement means, a mounting bracket or the like.

上記のように構成されたシーリングライトからなる照明器具30は、天井等の器具取付面に設けられた引掛シーリングにアダプタ34を係合し、アダプタを器具本体に係合することにより、電気的に電源と接続されると同時に、機械的に支持され設置される(図4(a))。   The luminaire 30 including the ceiling light configured as described above is electrically connected by engaging the adapter 34 with a hook ceiling provided on a fixture mounting surface such as a ceiling, and engaging the adapter with the fixture body. At the same time as being connected to the power source, it is mechanically supported and installed (FIG. 4 (a)).

上記に設置された照明器具30を点灯すると、2台の光源体20を構成する各照明装置10のLED12が発光する。この際、各照明装置10の基体11の両端部11d、11dには蛍光体層14が充填されているので、照明装置を連結した連結部には各発光部13が隣り合って位置し発光するので暗部が形成されることがない。これにより、照明装置10からは長手方向に輝度ムラがなく均斉度の高い光線が放射される。   If the lighting fixture 30 installed above is lighted, LED12 of each illuminating device 10 which comprises the two light source bodies 20 will light-emit. At this time, since both end portions 11d and 11d of the base 11 of each lighting device 10 are filled with the phosphor layer 14, each light emitting portion 13 is positioned adjacent to the connecting portion where the lighting devices are connected to emit light. Therefore, no dark part is formed. As a result, the illumination device 10 emits a light beam having no luminance unevenness in the longitudinal direction and high uniformity.

照明装置10から放射された光は、光源体20を構成する導光体21の入射面21aから導光体内に導入され、導光体内で青色LEDチップから放射される青色の光と黄色蛍光体から放射される黄色の光が混色されて白色の光となり出射面から出射される。出射された白色の光はコリメータレンズ22の第一焦点aから導入され、第一焦点aを出た光が無収差の平行光となって断面略楕円形状をなす出射面23bから上方に出射される。   The light emitted from the illumination device 10 is introduced into the light guide from the incident surface 21a of the light guide 21 constituting the light source body 20, and the blue light and the yellow phosphor emitted from the blue LED chip in the light guide. The yellow light emitted from the light is mixed into white light and emitted from the emission surface. The emitted white light is introduced from the first focal point a of the collimator lens 22, and the light emitted from the first focal point a becomes parallel light with no aberration and is emitted upward from the emission surface 23 b having a substantially elliptical cross section. The

コリメータレンズ22から放射された光は、照明器具における反射体32の傾斜部32aに向かって放射され、さらに反射体で反射した光はグローブ33を内面側から照射し、部屋全体にわたり略均一な明るさで照明する。   The light radiated from the collimator lens 22 is radiated toward the inclined portion 32a of the reflector 32 in the lighting fixture, and the light reflected by the reflector irradiates the globe 33 from the inner surface side, so that the brightness is substantially uniform throughout the room. Now illuminate.

この際、2台の光源体20が、それぞれ器具本体31の外縁部36、37に配設され、従来のように環形蛍光ランプが器具本体の中央部に存在しない。このため、ランプイメージがグローブの照射中心部に現れずに均斉度が向上する。   At this time, the two light source bodies 20 are respectively disposed on the outer edge portions 36 and 37 of the instrument main body 31, and the ring-shaped fluorescent lamp does not exist in the central part of the instrument main body as in the prior art. For this reason, a lamp image does not appear in the irradiation center part of a glove, but a uniformity improves.

以上、本実施例の照明装置10によれば、各照明装置10の基体11の両端部11d、11dには蛍光体層14が充填されているので、照明装置を連結した連結部には各発光部13が隣り合って位置し発光するので暗部が形成されることがない。これにより、長手方向に輝度ムラがなく均斉度の高い光線が放射することができる。さらに、1本の長尺なコリメータレンズ22によって長さ約100mmの5本の照明装置10の連結部を覆っているので、コリメータレンズ22からは一層輝度ムラのない均一な光が放射される。   As described above, according to the illuminating device 10 of the present embodiment, the phosphor layers 14 are filled in the both end portions 11d and 11d of the base 11 of each illuminating device 10, so Since the portions 13 are located next to each other and emit light, no dark portion is formed. Thereby, there is no uneven brightness in the longitudinal direction, and light with high uniformity can be emitted. Furthermore, since one long collimator lens 22 covers the connecting portions of the five illumination devices 10 having a length of about 100 mm, the collimator lens 22 emits uniform light with no further unevenness in luminance.

また、本実施例の光源体20よれば、上記の照明装置10を組み込んで構成したので、長手方向に輝度ムラがなく均斉度の高い光線を放射できると共に、コリメータレンズ22の焦点aを出た光が無収差の平行光となって光を無駄なく前方に照射して光を効率的に利用することができる。さらに、各LED1の発光中心xがコリメータレンズ22の第一焦点aより所定の寸法cだけ片寄っているので、光が拡散せずに必要とする方向(図3(a)において上方)に集中して放射することができ、無駄な方向への光が抑制される。同時に、導光体21内で青色LEDチップから放射される青色の光と黄色蛍光体から放射される黄色の光が混色されて白色の光となりコリメータレンズ22を介して色ムラのない光が出射される。   In addition, according to the light source body 20 of the present embodiment, since the above-described illumination device 10 is incorporated, it is possible to emit a light beam with high uniformity and no luminance unevenness in the longitudinal direction, and the focus a of the collimator lens 22 is emitted The light becomes non-aberration parallel light and can be used efficiently by irradiating the light forward without waste. Further, since the light emission center x of each LED 1 is offset from the first focal point a of the collimator lens 22 by a predetermined dimension c, the light is not diffused but concentrated in the required direction (upward in FIG. 3A). Can be emitted, and light in a useless direction is suppressed. At the same time, the blue light emitted from the blue LED chip and the yellow light emitted from the yellow phosphor in the light guide 21 are mixed to form white light, and light with no color unevenness is emitted through the collimator lens 22. Is done.

また、本実施例の照明器具30によれば、上記の光源体20を組み込んで構成したので、光源体から長手方向に輝度ムラがなく均斉度の高い光線が放射され、かつ、光が拡散せずに必要とする前方の反射体32に集中して放射し、さらに無駄なくグローブ33の内面全体を照射することにより光を効率的に利用して目的とする均斉度を容易かつ確実に得ることができる。しかも、グローブ33の透過率を変えることなく行えるので、一層簡易な手段で高い均斉度を得ることができる。同時に色ムラのない白色の光で照明を行うことができる。   Moreover, according to the lighting fixture 30 of the present embodiment, since the light source body 20 is incorporated, the light source body emits a light beam with high uniformity without luminance unevenness in the longitudinal direction, and the light is diffused. It is possible to easily and surely obtain a desired degree of uniformity by efficiently using light by irradiating the entire front reflector 32 without being concentrated and irradiating the entire inner surface of the globe 33 without waste. Can do. And since it can carry out without changing the transmittance | permeability of the globe 33, a high degree of uniformity can be obtained by a simpler means. At the same time, illumination can be performed with white light having no color unevenness.

また、本実施例の照明装置10は、複数個のLED12を配設する基体11のケース部材11aを、横断面がコ字状の長い凹溝11cを形成した薄い箱状をなして構成したので、基体の強度を向上させることができ、基体のソリ返りを防ぐことが可能となる。因みに、この種の基体は、通常はアルミニウムとエポキシ樹脂等の合成樹脂など、熱膨張率の異なる2枚の平板で構成されているため温度上昇時に熱膨張率の差から基体にソリが生じる。この現象はベアチップ実装の温度上昇時の実装不良を引き起こしたり、器具セット時に光軸がズレたり、点灯時の温度上昇で基板がソリ、ワイヤー切れや、放熱板である基盤11eとの密着が悪くなってLEDの放熱特性が悪化する要因となる。   Further, in the illumination device 10 of the present embodiment, the case member 11a of the base body 11 on which the plurality of LEDs 12 are arranged is configured in a thin box shape having a long concave groove 11c having a U-shaped cross section. The strength of the substrate can be improved, and the warping of the substrate can be prevented. Incidentally, since this type of substrate is usually composed of two flat plates having different coefficients of thermal expansion, such as a synthetic resin such as aluminum and an epoxy resin, the substrate is warped due to the difference in coefficient of thermal expansion. This phenomenon causes mounting failure when the temperature of the bare chip mounting rises, the optical axis shifts when the instrument is set, the substrate is warped due to the temperature rise during lighting, the wire is broken, and the adhesion to the substrate 11e which is a heat sink is poor. As a result, the heat dissipation characteristics of the LED deteriorate.

さらに、本実施例の基体のケース部材11aは、横断面がコ字状の長い凹溝11bを形成したので、凹溝の側面を反射面となすことができLEDの光を効果的に利用することができる。同時に放熱面積が広くなりLEDを効率よく放熱させることができる。さらに、実装時にヒーターブロックへの位置決めを容易に行うことができ、実装作業がし易くなる。   Furthermore, since the case member 11a of the base body of the present embodiment is formed with a long groove 11b having a U-shaped cross section, the side surface of the groove can be used as a reflecting surface, and the light of the LED can be used effectively. be able to. At the same time, the heat dissipating area is widened, and the LED can efficiently dissipate heat. Furthermore, positioning to the heater block can be easily performed at the time of mounting, which facilitates mounting work.

以上、本実施例の照明装置において、基体11の端部に蛍光体層14を充填し、各LED12、特に端部に位置するLED12aから放射される光を透明な樹脂からなる蛍光体層14内に導入して発光させたが、端部に位置するLED12aまたは端部近傍のLEDを含めて光出力を他のLEDより高出力のものにして、より一層明るく発光させ暗部の発生をより確実に解消させるようにしてもよい。   As described above, in the lighting device of the present embodiment, the phosphor layer 14 is filled in the end portion of the base 11, and the light emitted from each LED 12, particularly the LED 12a located at the end portion, is inside the phosphor layer 14 made of a transparent resin. The LED 12a located at the end or the LED in the vicinity of the end is made to have a higher light output than the other LEDs to emit light more brightly and more reliably generate dark parts. You may make it cancel.

光透過性樹脂を蛍光体層14で構成したが、蛍光体層ではなくLEDの充電部を覆うための透明な樹脂からなる電気絶縁層で構成してもよい。   Although the light-transmitting resin is composed of the phosphor layer 14, it may be composed of an electrically insulating layer made of a transparent resin for covering the charging portion of the LED instead of the phosphor layer.

基体11のケース部材11aを横断面がコ字状の長い凹溝11bを形成したが、図6に示すように、断面がコリメータレンズ22に向かって凸形状になるように形成してもよい。   The case member 11a of the base body 11 is formed with a long concave groove 11b having a U-shaped cross section, but may be formed so that the cross section is convex toward the collimator lens 22 as shown in FIG.

光源体20の導光体21は、コリメータレンズ22と一体に形成してもよい。導光体の形状は、入射面の面積に対し出射面の面積が小となるようにした、例えば、四角錐の頂点を平坦な面とした形状や楔形をなしていてもよい。   The light guide body 21 of the light source body 20 may be formed integrally with the collimator lens 22. The shape of the light guide may be a wedge shape or a shape in which the area of the exit surface is smaller than the area of the entrance surface, for example, the apex of the quadrangular pyramid is a flat surface.

照明器具30は、角形の照明器具を構成して光源体20を対向する外縁部36、37に2台配設したが、各4辺に1台ずつ計4台の光源体を配置してもよい。さらに、1辺に多数の光源体20を連結させて、流し元灯、足元灯、階段埋込灯などライン状の照明器具を構成してもよい。さらに丸形の照明器具を構成し、照明装置をリング状に連結して光源体を構成し、器具本体の外縁部の周囲全体にわたって配設するようにしてもよい。照明器具をペンダント形のシーリングライトを構成したが、天井直付け形のシーリングライトを構成しても、さらに店舗、オフィス等施設、業務用などの各種の照明器具を構成してもよい。   The lighting fixture 30 is a square lighting fixture and two light source bodies 20 are arranged on the outer edge portions 36 and 37 facing each other. However, a total of four light source bodies may be arranged, one on each of the four sides. Good. Further, a plurality of light source bodies 20 may be connected to one side to constitute a line-shaped lighting fixture such as a sink lamp, a foot lamp, and a staircase embedded lamp. Furthermore, a round illuminating device may be configured, and the light source may be configured by connecting the illuminating devices in a ring shape, and may be disposed over the entire periphery of the outer edge of the device main body. Although the lighting fixture is configured as a pendant type ceiling light, it may be configured as a ceiling-mounted ceiling light, or may be configured as various types of lighting fixtures for stores, offices, and business facilities.

本実施例は、半導体発光素子に対向して基体端部に反射体を配設し、半導体発光素子から放射される光を反射体により基体端部に向けて反射させ端部を発光させる発光部を構成したものである。   In the present embodiment, a reflector is provided at the end of the base so as to face the semiconductor light emitting element, and the light emitted from the semiconductor light emitting element is reflected toward the end of the base by the reflector to emit light at the end. Is configured.

以下、図7〜図8に従い、その構成を説明する。なお、図7〜図8には実施例1と同一部分には同一符号を付し詳細な説明は省略する。   The configuration will be described below with reference to FIGS. 7 to 8, the same parts as those of the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

図7に示すように、基体11は、実施例1と同様に横断面がコ字状の長い凹溝11cを形成した薄いライン状をなしたケース部材で構成し、基体の両端部11d、11d、すなわち、凹溝11cの両端部に反射体50を配設する。   As shown in FIG. 7, the base 11 is formed of a thin line-shaped case member having a long concave groove 11c having a U-shaped cross section as in the first embodiment, and both end portions 11d and 11d of the base are formed. That is, the reflector 50 is disposed at both ends of the concave groove 11c.

反射体50は、アルミニウムで断面が三角形をなす三角柱の小片として構成し、傾斜した面からなる反射面50aを端部側に位置するLED12aに対向させて配置し、背面50bをケース部材の端面と面一にし、頂点50cをケース部材11aの上面と面一でかつ端部11dに接するようにし、さらに底面50dを凹溝11c内底面に接してシリコーン樹脂等の耐熱性の接着剤で固着する。さらに、蛍光体層14を両端部側に行きわたるように充填して発光部13、13を構成する。   The reflector 50 is formed as a small piece of a triangular prism made of aluminum and having a triangular cross section. The reflector 50 is formed with an inclined reflecting surface 50a facing the LED 12a located on the end side, and the back surface 50b is connected to the end surface of the case member. The apex 50c is flush with the upper surface of the case member 11a and in contact with the end 11d, and the bottom surface 50d is in contact with the inner bottom surface of the concave groove 11c and fixed with a heat-resistant adhesive such as silicone resin. Further, the light emitting portions 13 and 13 are configured by filling the phosphor layer 14 so as to reach both end portions.

上記に構成した照明装置10を点灯すると、各LEDが発光し、両端部に位置するLED12aの光が蛍光体層14を介して反射体50の反射面50aに向かって放射され、反射面で反射して基体11の光出射部(図7(b)において上方)に向かって放射される。これにより基体の両端部11d、11dの発光部13、13が発光して暗くならず暗部が形成さない。   When the lighting device 10 configured as described above is turned on, each LED emits light, and the light of the LED 12a located at both ends is emitted toward the reflecting surface 50a of the reflector 50 via the phosphor layer 14, and reflected by the reflecting surface. Then, the light is emitted toward the light emitting portion of the substrate 11 (upward in FIG. 7B). As a result, the light emitting portions 13 and 13 of the both end portions 11d and 11d of the base body emit light and do not darken and no dark portion is formed.

また、図7(d)に示すように照明装置10を複数本連結した場合にも、反射体50は背面50bをケース部材11aの端面と面一にし、頂点50cをケース部材11aの上面と面一に形成してあるので、隣接する各反射体50、50の背面50bおよび頂点50cが合致し隙間が形成されることなく細い線で連結されるので目立たなくなり、連結のための継ぎ目(目地)による暗部も形成され難くなる。   Also, as shown in FIG. 7D, even when a plurality of lighting devices 10 are connected, the reflector 50 has the back surface 50b flush with the end surface of the case member 11a, and the vertex 50c faces the top surface of the case member 11a. Since they are formed in one, the back surfaces 50b and the apexes 50c of the adjacent reflectors 50 and 50 are connected and connected by a thin line without forming a gap, so that they are not noticeable, and a joint (joint) for connection It is difficult to form a dark part due to.

本実施例において、蛍光体層14は、図8(a)(b)に示すように、電気絶縁の必要の無い反射体50には充填せずに空間に形成し、材料費を削減するようにしてもよい。   In this embodiment, as shown in FIGS. 8A and 8B, the phosphor layer 14 is formed in a space without filling the reflector 50 that does not require electrical insulation so as to reduce the material cost. It may be.

また、図9(a)に示すように、反射体50の頂点50cをケース部材11aの上面と面一にせず、頂点50cを寸法xだけ低く形成し、蛍光体層14を反射体50の頂点50cの上方にまで、換言すれば、端部まで行きわたるように充填してもよい。これにより複数の照明装置を連結した場合に、反射体50の頂点50cの連結部分が蛍光体層14で覆われて連結部の継ぎ目がさらに目立たなくなり、継ぎ目による暗部を一層なくすことができる。   Further, as shown in FIG. 9A, the vertex 50c of the reflector 50 is not flush with the upper surface of the case member 11a, the vertex 50c is formed lower by the dimension x, and the phosphor layer 14 is formed as the vertex of the reflector 50. It may be filled up to 50c, in other words, to reach the end. As a result, when a plurality of lighting devices are connected, the connecting portion of the vertex 50c of the reflector 50 is covered with the phosphor layer 14 so that the joint of the connecting portion becomes less conspicuous, and the dark portion due to the joint can be further eliminated.

図9(b)に示すように、ケース部材11aにおける凹溝11cの両側壁部分もLED12に向かって傾斜させた反射面11gとなし、両端部の反射体50と共に「すり鉢形状」の反射体を構成するようにし、LEDの光を効率よく反射させるようにしてもよい。   As shown in FIG. 9B, both side wall portions of the concave groove 11c in the case member 11a are also formed as reflecting surfaces 11g inclined toward the LED 12, and a “mortar-shaped” reflector is formed together with the reflectors 50 at both ends. You may make it comprise and reflect the light of LED efficiently.

反射体50は、基体を構成するケース部材11aと一体に形成してもよい。また、PBT等の白色の合成樹脂で構成してもよい。   The reflector 50 may be formed integrally with the case member 11a constituting the base. Moreover, you may comprise with white synthetic resins, such as PBT.

その他、本実施例における他の構成、作動、作用効果、変形例等は、実施例1と同様である。   Other configurations, operations, operational effects, modifications, and the like in this embodiment are the same as those in the first embodiment.

本実施例は、LED自体で発光部13を構成したもので、基体端部11d、11dに位置するLED12aを基体の長手方向にチップの発光面を対向させて配置し、チップの発光面から直接基体端部に向けて光を導入し発光させる発光部13を構成したものである。   In this embodiment, the LED itself constitutes the light emitting portion 13, and the LED 12a located at the base end portions 11d and 11d is arranged with the light emitting surface of the chip facing in the longitudinal direction of the base, and directly from the light emitting surface of the chip. The light emitting section 13 is configured to introduce light toward the end of the base and emit light.

以下、図10に従い、その構成を説明する。なお、図10には実施例1、実施例2と同一部分には同一符号を付し詳細な説明は省略する。   The configuration will be described below with reference to FIG. In FIG. 10, the same parts as those in the first and second embodiments are denoted by the same reference numerals, and detailed description thereof is omitted.

図10に示すように、基体11は、実施例1および実施例2と同様に横断面がコ字状の長い凹溝11cを形成した薄いライン状をなしたケース部材11aで構成する。   As shown in FIG. 10, the base 11 is constituted by a case member 11 a having a thin line shape in which a long groove 11 c having a U-shaped cross section is formed as in the first and second embodiments.

LED12の内、基体の両端部11d、11d側に位置する端部LED12aを、基体の長手方向にチップの発光面12bを対向させて、換言すれば、チップを縦に配置してチップの発光面12bを基体の端部11d側に向けて回路基板11b上に実装し、蛍光体層14を実施例1と同様に両端部まで行きわたるように充填させて構成する。   Of the LEDs 12, the end LED 12 a located on the both ends 11 d and 11 d side of the base is opposed to the light emitting surface 12 b of the chip in the longitudinal direction of the base, in other words, the chip is vertically arranged and the light emitting surface of the chip 12b is mounted on the circuit board 11b toward the end 11d side of the substrate, and the phosphor layer 14 is filled so as to reach both ends as in the first embodiment.

上記に構成した照明装置10を点灯すると、縦方向に配置された両端部に位置する端部LED12aの発光面12bから直接放射される光が蛍光体層14内に導入され両端部の発光部13、13が発光して暗くならず暗部が形成さない。この際、端部LED12aはチップの発光面12bが端部11dに向けられているので、より明るく発光する。これにより、照明装置を複数本連結した場合にも、隣接する各照明装置両端部の発光部13、13が発光して連結のための継ぎ目(目地)による暗部も形成されない。   When the lighting device 10 configured as described above is turned on, light directly emitted from the light emitting surfaces 12b of the end LEDs 12a located at both ends arranged in the vertical direction is introduced into the phosphor layer 14 and the light emitting portions 13 at both ends. , 13 emits light and does not darken and no dark part is formed. At this time, the end LED 12a emits light more brightly because the light emitting surface 12b of the chip is directed to the end 11d. Accordingly, even when a plurality of lighting devices are connected, the light emitting portions 13 and 13 at both ends of each adjacent lighting device emit light, and a dark portion due to a joint (joint) for connection is not formed.

本実施例において、図10に示すように、端部LED12aと隣接するLED12との間の間隔寸法yは、他のLED12間の実装間隔寸法zより小となすことにより、端部LED12aの光に加えて隣接するLED12の光も端部11dに取り込むことができ、さらに明るく発光させることができる。また、同図に示すように、実施例2の反射体50を組み込めばより一層明るく発光させることができる。   In this embodiment, as shown in FIG. 10, the distance dimension y between the edge LED 12 a and the adjacent LED 12 is smaller than the mounting distance dimension z between the other LEDs 12, so that the light of the edge LED 12 a is reflected. In addition, the light of the adjacent LED 12 can be taken into the end portion 11d, and light can be emitted more brightly. Further, as shown in the figure, if the reflector 50 of Example 2 is incorporated, light can be emitted even more brightly.

LED12は、基体両端部11d、11dに位置する端部LED12a1個ずつをそれぞれ縦方向に配置したが、隣接する幾つかのLEDも縦方向に配置させるように構成してもよい。   The LED 12 has one end LED 12a positioned at each of the base end portions 11d and 11d in the vertical direction, but may be configured such that several adjacent LEDs are also arranged in the vertical direction.

その他、本実施例における他の構成、作動、作用効果、変形例等は、実施例1および実施例2と同様である。   Other configurations, operations, operational effects, modifications, and the like in the present embodiment are the same as those in the first and second embodiments.

本実施例は、基体の端部まで蛍光体層を充填すると共に、基体の端部を断面が鍵型をなす形状に形成し、端部を発光させると同時に電気絶縁のための距離を確保するように構成したものである。   In this embodiment, the phosphor layer is filled up to the end of the base, and the end of the base is formed in a key-shaped cross section so that the end emits light and at the same time secures a distance for electrical insulation. It is comprised as follows.

以下、図11〜図12に従い、その構成を説明する。なお、図11〜図12には実施例1、実施例2および実施例3と同一部分には同一符号を付し詳細な説明は省略する。   Hereinafter, the configuration will be described with reference to FIGS. 11 to 12, the same parts as those in the first embodiment, the second embodiment, and the third embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

図11(a)に示すように、基体11は、ケース部材11aの底面を構成する基盤部の厚さを肉厚に形成し、長手方向に平行な垂直面で断面した形状がL字形状をなす嵌合部51を形成する。嵌合部は一端、図11(a)で左方がL字をなし、他端、図11(a)で右方が逆L字をなし、両端のL字は、それぞれ嵌合して合致し1本の基体を構成する寸法、形状に形成する。これにより、LEDと電源回路部品などが収納されるケース部材11a底面側との沿面距離を長く形成することができ、電気絶縁距離を確保することができる。   As shown in FIG. 11 (a), the base body 11 is formed with a thick base portion constituting the bottom surface of the case member 11a, and the cross-sectional shape taken along a vertical plane parallel to the longitudinal direction has an L-shape. The fitting part 51 to be formed is formed. The fitting part is one end, the left side in FIG. 11 (a) is L-shaped, the other end, the right side in FIG. It is formed into a size and shape that constitutes a single substrate. As a result, the creepage distance between the LED and the bottom surface side of the case member 11a in which the power supply circuit components and the like are accommodated can be increased, and an electrical insulation distance can be ensured.

同時に、図11(b)に示すように、複数の照明装置を連結した場合にも連結部の継ぎ目(目地)を単なる細い線となして目立たなくすることが可能となり継ぎ目による暗部を生じにくくすることができる。   At the same time, as shown in FIG. 11 (b), even when a plurality of lighting devices are connected, the joint (joint) of the connecting portion can be made into a mere thin line so as to be inconspicuous, and a dark portion due to the joint is hardly generated. be able to.

また、図11(b)に示すように、L字の鍵型に互いに嵌合して重なる部分にそれぞれ給電部52を形成し、半田付けすることにより、隣接する基体同士を電気的に接続するように構成してもよい。これにより基体の表面側に配線を出す必要がなくなり、基体全体をコンパクトに構成することができる。   Further, as shown in FIG. 11 (b), adjacent power bases 52 are electrically connected to each other by forming power supply portions 52 at portions overlapping and overlapping each other in an L-shaped key shape. You may comprise as follows. This eliminates the need for wiring on the surface side of the substrate, and the entire substrate can be made compact.

L字の鍵型の形状は、図12(a)に示すように、互いに重なる部分を傾斜して形成した楔状部53に形成してもよい。さらに同図(b)に示すように、凹凸部54を形成するようにしてもよい。これらの構成により、沿面距離をより長く取ることが可能となる。   As shown in FIG. 12A, the L-shaped key shape may be formed in a wedge-shaped portion 53 formed by inclining overlapping portions. Further, as shown in FIG. 5B, the concavo-convex portion 54 may be formed. With these configurations, the creepage distance can be increased.

蛍光体層14を実施例1と同様に基体11の端部11dまで充填して発光させるように構成したが、実施例2の反射体50を配置する構成にして発光させるようにしてもよい。さらに、実施例3にように端部LED12aを縦方向に配置して発光させるようにしてもよい。   The phosphor layer 14 is filled up to the end portion 11d of the substrate 11 in the same manner as in the first embodiment to emit light. However, the reflector 50 in the second embodiment may be arranged to emit light. Further, as in the third embodiment, the end LEDs 12a may be arranged in the vertical direction to emit light.

その他、本実施例における他の構成、作動、作用効果、変形例等は、実施例1および実施例2と同様である。   Other configurations, operations, operational effects, modifications, and the like in the present embodiment are the same as those in the first and second embodiments.

以上、本発明の好適な実施形態を説明したが、本発明は上述の各実施例に限定されることなく、例えば、上述の各実施例記載の各構成を全て採用して照明装置を構成しても、また各構成を適宜選択して組み合わせ目的とする照明装置を構成するなど、本発明の要旨を逸脱しない範囲内において、種々の設計変更を行うことができる。   The preferred embodiments of the present invention have been described above, but the present invention is not limited to the above-described embodiments. For example, the lighting device is configured by adopting all the configurations described in the above-described embodiments. However, various design changes can be made without departing from the gist of the present invention, for example, by appropriately selecting each configuration to configure a lighting device to be combined.

本発明の第一の実施形態に係る照明装置を示し、(a)は正面図、(b)は(a)におけるA−A線に沿う断面図、(c)は(a)におけるB−B断面図。The illuminating device which concerns on 1st embodiment of this invention is shown, (a) is a front view, (b) is sectional drawing which follows the AA line in (a), (c) is BB in (a). Sectional drawing. 同じく照明装置を用いた光源体を示し、(a)は一部を切り欠き断面して示す斜視図、(b)は基体部分を拡大して示す断面図。The light source body which similarly used the illuminating device is shown, (a) is a perspective view which cuts off a part and shows it, and (b) is sectional drawing which expands and shows a base | substrate part. 同じく光源体を示し、(a)は光学特性を説明するための側断面図、(b)は照明装置を連結した状態を示す正面図。The light source body is also shown, (a) is a side sectional view for explaining optical characteristics, and (b) is a front view showing a state in which an illumination device is connected. 同じく光源体を用いた照明器具を示し、(a)は縦断面図、(b)は器具本体の外縁部を拡大して示す断面図。The lighting fixture which similarly used the light source body is shown, (a) is a longitudinal cross-sectional view, (b) is sectional drawing which expands and shows the outer edge part of a fixture main body. 同じく照明器具のグローブを外した状態を示す平面図。The top view which shows the state which removed the glove of the lighting fixture similarly. 同じく第一の実施形態に係る光源体の変形例を示す一部を切り欠き断面して示す斜視図。The perspective view which cuts and shows a part which shows the modification of the light source body which concerns on 1st embodiment similarly. 本発明の第二の実施形態に係る照明装置を示し、(a)は正面図、(b)は(a)におけるC−C線に沿う断面図、(c)は(b)のA部を拡大して示す断面図、(d)は連結部を示す断面図。The illuminating device which concerns on 2nd embodiment of this invention is shown, (a) is a front view, (b) is sectional drawing which follows the CC line in (a), (c) is A part of (b). Sectional drawing which expands and shows, (d) is sectional drawing which shows a connection part. 同じく第二の実施形態に係る照明装置の変形例を示し、(a)は第一の変形例を示す正面図、(b)は(a)におけるD−D線に沿う断面図Similarly, the modification of the illuminating device which concerns on 2nd embodiment is shown, (a) is a front view which shows a 1st modification, (b) is sectional drawing which follows the DD line in (a). 同じく第二の実施形態に係る照明装置の変形例を示し、(a)は第二の変形例の連結部を示す断面図、(b)は第三の変形例を示す正面図。Similarly, the modification of the illuminating device which concerns on 2nd embodiment is shown, (a) is sectional drawing which shows the connection part of a 2nd modification, (b) is a front view which shows a 3rd modification. 本発明の第三の実施形態に係る照明装置を示す断面図。Sectional drawing which shows the illuminating device which concerns on 3rd embodiment of this invention. 本発明の第四の実施形態に係る照明装置を示し、(a)は断面図、(b)は連結部を示す断面図。The illuminating device which concerns on 4th embodiment of this invention is shown, (a) is sectional drawing, (b) is sectional drawing which shows a connection part. 同じく第四の実施形態に係る照明装置の変形例を示し、(a)は第一の変形例の連結部を示す断面図、(b)は第二の変形例の連結部を示す断面図。Similarly, the modification of the illuminating device which concerns on 4th embodiment is shown, (a) is sectional drawing which shows the connection part of a 1st modification, (b) is sectional drawing which shows the connection part of a 2nd modification.

符号の説明Explanation of symbols

10 照明装置
11 基体
12 半導体発光素子
13 発光部
20 光源体
30 照明器具
DESCRIPTION OF SYMBOLS 10 Illuminating device 11 Base | substrate 12 Semiconductor light emitting element 13 Light emission part 20 Light source body 30 Lighting fixture

Claims (5)

基体と;
基体に略直線状に配設された半導体発光素子と;
半導体発光素子と基体端部との間を発光させるための発光部と;
を具備することを特徴とする照明装置。
A substrate;
A semiconductor light emitting device disposed substantially linearly on the substrate;
A light emitting portion for emitting light between the semiconductor light emitting element and the end of the substrate;
An illumination device comprising:
基体と;
基体に略直線状に配設された半導体発光素子と;
半導体発光素子を覆い基体端部まで配設された光透過性樹脂と;
を具備することを特徴とする照明装置。
A substrate;
A semiconductor light emitting device disposed substantially linearly on the substrate;
A light-transmitting resin that covers the semiconductor light-emitting element and is disposed up to the end of the substrate;
An illumination device comprising:
基体と;
基体に略直線状に配設された半導体発光素子と;
半導体発光素子に対向して基体端部に配設された反射体と;
を具備することを特徴とする照明装置。
A substrate;
A semiconductor light emitting device disposed substantially linearly on the substrate;
A reflector disposed at the end of the substrate facing the semiconductor light emitting element;
An illumination device comprising:
基体と;
基体に略直線状に配設された半導体発光素子と;
基体端部に基体の長手方向に発光面を対向させて配置した端部半導体発光素子と;
を具備することを特徴とする照明装置。
A substrate;
A semiconductor light emitting device disposed substantially linearly on the substrate;
An end semiconductor light-emitting element disposed with the light emitting surface facing the end of the base in the longitudinal direction of the base;
An illumination device comprising:
器具本体と;
器具本体に配設された請求項1ないし4いずれか一記載の照明装置と
を具備することを特徴とする照明器具。
An instrument body;
A lighting fixture comprising: the lighting device according to any one of claims 1 to 4 disposed in a fixture main body.
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