JP2017010956A - Light emitting module and manufacturing method of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light emitting module which inhibits damage of a module in a manufacturing stage and attains effective luminous intensity, and to provide a manufacturing method of the light emitting module.SOLUTION: A light emitting module according to an embodiment includes: a substrate on which light emitting elements are mounted; a base material provided with a recessed part in which the substrate is disposed; a resin filling the recessed part of the base material; and a cover which covers the light emitting elements and is exposed from the resin. A method of manufacturing the light emitting module according to an embodiment includes the steps of: placing the substrate on which the light emitting elements are mounted on a bottom part of the recessed part formed at the base material; filling the recessed part, in which the substrate is placed, with the resin and exposing the cover covering the light emitting elements from the resin; and curing the resin.SELECTED DRAWING: Figure 4

Description

  Embodiments relate to a light emitting module and a method for manufacturing the light emitting module.

  In recent years, long indirect lighting has been frequently used in ceiling corners (conceptual diagram shown in FIG. 6), wall corners, and stairs of halls and theaters. When the light source for indirect illumination is an LED bulb or an MR bulb, power supply must be performed by turning the power rails, which makes the construction complicated and large.

  In order to solve this problem, it is considered to use a light source called a light-emitting module in which a flexible wiring board in which light-emitting elements such as light-emitting diodes (LEDs) are arranged on the wiring board in the longitudinal direction is sealed with a resin, so-called tape light. It is done. For example, Patent Documents 1 and 2 disclose light emitting modules in which a flexible wiring board (FPC) on which a plurality of light emitting elements are mounted is sealed with a resin having flexibility and translucency.

Japanese Patent No. 3916651 Japanese Patent Laid-Open No. 9-50253

  The light emitting modules disclosed in Patent Documents 1 and 2 are generated by integrating a substrate on which a light emitting element is mounted and a thermoplastic resin disposed so as to sandwich the substrate by heating and pressing. However, in this method, there is a possibility that the light emitting element or the like is damaged by heating and pressurizing the substrate.

  Patent Document 1 discloses a method for generating a light emitting module by inserting a substrate on which a light emitting element is mounted into a tube-shaped resin. However, with this method, the light emitting element is surrounded by a relatively thick tube-shaped resin, so that the color rendering property of the light emitting element is sacrificed and the amount of emitted light is reduced, and an illuminance effective as indirect illumination is obtained. There is a problem that can not be.

  This invention is made | formed in view of such a situation, and it aims at providing the manufacturing method of the light emitting module which suppresses the damage of the module in a manufacture stage, and obtains effective illumination intensity, and a light emitting module. To do.

  In order to achieve the above object, a light emitting module according to an embodiment includes a substrate on which a light emitting element is mounted, a base material in which a concave portion in which the substrate is disposed is formed, a resin that fills the concave portion of the base material, and light emission A cover that covers the element and is exposed from the resin.

  In addition, the method for manufacturing a light emitting module according to the embodiment includes a step of placing a substrate on which a light emitting element is mounted on the bottom of a recess formed in a base material, and filling a resin in the recess on which the substrate is placed. A step of exposing a cover covering the light emitting element from the resin, and a step of curing the resin.

  ADVANTAGE OF THE INVENTION According to this invention, the damage of the module in a manufacture stage can be suppressed, and the manufacturing method of a light emitting module which can obtain effective illumination intensity, and a light emitting module can be provided.

It is the figure which showed the light emitting module which concerns on one Embodiment of this invention. It is the figure which showed the light emitting module before being filled with a protection member. It is the figure which showed the characteristic of the light transmittance of a light emitting element cover. (A) is the figure which showed the state before mounting a board | substrate and a light emitting element on a base material. (B) is the figure which showed the state in which the board | substrate and the light emitting element were mounted in the base material. (C) is the figure which showed the state in which the light emitting element cover was put on the light emitting element. (D) is the figure which showed the state with which the protection member was filled in the recessed part of the base material. It is the figure which showed the light emitting module which concerns on the modification of this invention. It is the figure which showed the example in which the indirect illumination was installed in the ceiling corner.

  Hereinafter, with reference to the drawings, a light emitting module according to an embodiment of the present invention and a method for manufacturing the light emitting module will be described.

  As shown in FIG. 1, the light emitting module 1 includes a light emitter 10, a base material 20, and a protection member 30. In the light emitting module 1, a base member 20 provided with a light emitter 10 is filled with a protective member 30 made of resin.

  As shown in FIG. 2, the light emitter 10 is placed on the bottom 24 of the base member 20 formed in a U-shaped cross section. The light emitter 10 includes a substrate 11, a light emitting element 12, a light emitting element cover 13, and a resistor 14.

  The substrate 11 is a flexible wiring substrate (FPC) made of polyethylene terephthalate (PET), polyimide (PI), polyethylene naphthalate (PEN), or the like. The substrate 11 is formed in a rectangular flat plate shape and has flexibility. Further, the substrate 11 is fixed to the bottom of the base material 20. In addition, an electrode fitting to which a wiring cord is connected is provided at one end of the substrate 11. The light emitter 10 is energized when an external power source is supplied to the electrode fitting via the wiring cord.

  The light emitting element 12 is composed of an SMD (Surface Mount Device) type light emitting diode (LED). The light emitting elements 12 are arranged in the center of the substrate 11 in the short direction, and a plurality of light emitting elements 12 are arranged in a line in the longitudinal direction. The light emitting element 12 is mounted on the substrate 11 by soldering.

  The light emitting element cover 13 is made of a thermoplastic resin such as polycarbonate (PC) or acrylic (PMMA). The light emitting element cover 13 is formed in a hollow hemisphere. The light emitting element cover 13 covers the light emitting element 12 and is fixed to the substrate 11. That is, the light emitting element cover 13 prevents the light emitting element 12 from contacting the protection member 30.

  The light-emitting element cover 13 employs a light-emitting element cover that is difficult to transmit light in the ultraviolet region (low light transmittance) and can uniformly transmit light in the visible light region. Specifically, as shown in FIG. 3, the light emitting element cover 13 having a light transmittance of 10% or less in the ultraviolet region (10 to 380 nm) and uniformly 90% or more in the visible light region (380 to 800 nm) is employed. Is done.

  Thereby, the light emitting element cover 13 can transmit light (light in the visible light range) emitted from the light emitting element 12 uniformly over a long period of time without causing discoloration or the like over time (the light emission color does not change). ).

  The base material 20 is made of polyvinyl chloride (PVC), polyurethane (PU), silicon or the like and has flexibility. The base material 20 is formed in a band shape, and a cross section in the short direction is formed in a U shape. Since the substrate 11 is placed on the bottom 24 of the base material 20, the length in the short direction is longer than the short direction of the substrate 11.

  Further, the height of the side wall 21 of the base material 20 is lower than that of the light emitting element cover 13 disposed on the substrate 11. Therefore, as shown in FIG. 1, a part of the light emitting element cover 13 is exposed from the protective member 30.

  Further, the base member 20 is formed integrally with the side wall 21 with a protruding portion 22 extending in the lateral direction along the side wall 21. The protrusion 22 has flexibility and resilience. In addition, the base material 20 is provided with an accommodation groove 23 by the protruding portion 22, the side wall 21, and the bottom portion 24. Both side ends of the substrate 11 are accommodated in the accommodation groove 23. The receiving groove 23 has a height (the width of the surface of the protrusion 22 and the bottom 24 facing the substrate 11) of the substrate 11 in order to prevent the substrate 11 from being displaced after being positioned or fixed at the bottom 24. It is set below the thickness.

  The protection member 30 is, for example, a room temperature curable resin. The protection member 30 is filled with the substrate 11 placed in the recess of the base material 20, and is cured by being left at room temperature for a certain period of time. Thereby, the substrate 11 is hermetically sealed by the protective member 30. Although the protective member 30 has translucency, the light transmittance in the visible light region is lower than that of the light emitting element cover 13. Therefore, most of the light emitted from the light emitting element 12 is emitted from the region exposed from the protective member 30 of the light emitting element cover 13.

  Hereinafter, a method for manufacturing the light emitting module 1 configured as described above will be described with reference to FIG.

  As shown in FIG. 4A, before the substrate 11 is placed on the base material 20, members constituting the light emitter 10 are mounted on the substrate 11 in advance. Specifically, the light emitting element 12 and the resistor 14 are mounted on the substrate 11 by soldering, and a wiring cord for supplying external power is connected to the electrode fitting. In addition, a double-sided tape having high thermal conductivity is attached to the back surface of the substrate 11 (the surface facing the bottom portion 24).

  On the other hand, the base material 20 is manufactured by injection molding, for example. The base material 20 is provided with a protruding portion 22 having flexibility and resilience integrally with the side wall 21, and an accommodation groove 23 is formed. A double-sided tape is attached to the back surface of the base material 20.

  As shown in FIG. 4B, the substrate 11 is placed on the bottom portion 24 of the base material 20, and both side ends thereof are accommodated in the accommodation grooves 23. Since the board | substrate 11 and the protrusion part 22 have flexibility, the both ends of the board | substrate 11 can be easily accommodated in the accommodation groove | channel 23 by deform | transforming at least one. The substrate 11 is bonded and fixed to the base material 20 with a double-sided tape applied to the back surface. The double-sided tape may be affixed to the bottom 24 of the base material 20 instead of the back surface of the substrate 11, and other adhesives may be substituted. The deviation of the substrate 11 fixed at the bottom 24 is suppressed by the protrusion 22.

  Subsequently, as shown in FIG. 4C, the light emitting element cover 13 is put on the light emitting element 12 arranged on the substrate 11. An adhesive is applied to the bottom of the light emitting element cover 13 (the part that comes into contact with the substrate 11), and is adhered and fixed to the substrate 11. The light emitting element cover 13 may be fixed to the substrate 11 before the substrate 11 is placed on the base material 20.

  Thereafter, end caps that cover both sides in the short direction are attached to the base material 20, and the recesses of the base material 20 are filled with the protective member 30. For example, as shown in FIG. 3 (d), the protection member 30 is filled up to the same height as the side wall 21 of the base material 20. The protective member 30 filled in the base material 20 is polymerized and cured by being left at room temperature for a certain period of time. The light emitting module 1 is manufactured through the above steps. The light emitting module 1 is fixed to an installation place by a double-sided tape attached to the back surface of the base material 20.

  The light emitting module 1 according to this embodiment is manufactured by filling the U-shaped base material 20 on which the light emitter 10 is placed on the bottom 24 with the protective member 30 made of a room temperature curable resin. The Thereby, damage to the light emitter 10 in the manufacturing stage can be suppressed, and the light emitting module 1 can be manufactured quickly.

  Further, the light emitting module 1 has a light emitting element 12 that stably emits light over a long period of time by covering the light emitting element 12 with a light emitting element cover 13 that hardly transmits light in the ultraviolet region and allows light in the visible light region to pass uniformly. Light in the visible light range can be transmitted uniformly (the emission color does not change). Thereby, the light emitting module 1 can obtain favorable color rendering properties and effective illuminance.

  Moreover, the light emitting module 1 can improve the freedom degree of setting with the protection member 30 and the light emitting element cover 13, and can attain diversification of the light emission form (design). Specifically, by adjusting the height of the protective member 30 in the base material 20, the area of the light emitting element cover 13 exposed from the protective member 30, that is, the amount of light transmitted through the light emitting element cover 13 (light emission amount). Can be changed. Further, as shown in FIG. 5, the light emitting module 1 changes the light distribution angle of light transmitted through the light emitting element cover 13 by covering the shape of the light emitting element cover 13 with a lens like a bowl-shaped lens cover 13a. -It is possible to control and change the irradiation area, and also change the illuminance in that area. A lens guide 13b fixes the position of the lens cover 13a on the substrate 11. That is, according to the light emitting element cover 13, the light distribution angle of the light emitting element 12 can be determined, and by appropriately using the light emitting element cover 13 having a different light distribution angle of the light emitting element 12, the irradiation region of the light emitting module 1 is obtained. Or the illuminance in the irradiation area can be changed.

  Further, at least one of the substrate 11 and the protruding portion 22 only needs to have flexibility and resilience. Specifically, when the substrate 11 is a flexible substrate, the protrusion 22 may not have flexibility and resilience, and when the protrusion 22 has flexibility and resilience, the substrate 11 May not be a flexible substrate.

  In the above embodiment, the example in which the protruding portion 22 is provided integrally with the side wall 21 has been described, but the protruding portion 22 may be provided separately from the side wall 21. Moreover, the base material 20 does not need to have flexibility.

  Moreover, although the light emitting module 1 demonstrated the example provided with the protrusion part 22 in the said embodiment, the protrusion part 22 which prevents the shift | offset | difference of the board | substrate 11 after being positioned or fixed by the bottom part 24 does not need to be provided.

  Further, the arrangement form of the light emitting element 12 and the resistor 14 arranged on the substrate 11 is not particularly limited. For example, one or more resistors 14 may be disposed between a plurality of light emitting elements 12 that are continuously disposed, or the light emitting elements 12 and the resistors 14 may be disposed in a plurality of matrix shapes.

  In the above embodiment, the room temperature curable resin is described as an example of the protective member 30, but a photocurable resin (an ultraviolet curable resin, a visible light curable resin, or the like) may be used for the protective member 30.

  The present invention is not limited by the description of the above-described embodiment and the drawings, and appropriate modifications and the like can be made to the above-described embodiment and the drawings.

DESCRIPTION OF SYMBOLS 1 ... Light emitting module 10 ... Luminescent body 11 ... Board | substrate 12 ... Light emitting element 13 ... Light emitting element cover 14 ... Resistance 20 ... Base material 21 ... Side wall 22 ... Projection part 23 ... Housing groove 24 ... Bottom part 30 ... Protection member

Claims (5)

A substrate on which a light emitting element is mounted;
A base material formed with a recess in which the substrate is disposed;
A resin filled in the recess of the base material;
A cover that covers the light emitting element and is exposed from the resin;
A light emitting module comprising: The base material includes a protruding portion protruding from the inner wall of the recess,
The light emitting module according to claim 1, wherein the substrate is sandwiched between a bottom surface of the recess and the protrusion.   The light emitting module according to claim 2, wherein the protruding portion has flexibility and restorability.   The light emitting module according to claim 1, wherein the substrate is a flexible substrate. Placing the substrate on which the light emitting element is mounted on the bottom of the recess formed in the base material;
Filling the recess in which the substrate is placed with resin, and exposing a cover covering the light emitting element from the resin;
Curing the resin;
Manufacturing method of light emitting module containing.

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