JP6688496B2 - Flexible light emitting module and method for manufacturing flexible light emitting module - Google Patents

Description

  Embodiments relate to a light emitting module and a method for manufacturing the light emitting module.

  In recent years, long indirect lighting has been widely used in ceiling corners of halls and theaters (a conceptual diagram is shown in FIG. 6), wall corners, and stairs. When the light source of the indirect illumination is an LED light bulb or an MR light bulb, power must be supplied by crawling the power supply rail, resulting in complicated and large-scale construction.

  In order to solve this problem, it is possible to use a light source called a light emitting module, which is a so-called tape light, in which a flexible wiring board in which light emitting elements such as light emitting diodes (LEDs) are longitudinally arranged on a wiring board is sealed with resin. To be For example, Patent Documents 1 and 2 disclose a light emitting module in which a flexible wiring board (FPC) on which a plurality of light emitting elements are mounted is sealed with a resin having flexibility and translucency.

Japanese Patent No. 3916651 JP, 9-50253, A

  The light emitting module disclosed in Patent Documents 1 and 2 is produced by heating and pressurizing a substrate on which a light emitting element is mounted and a thermoplastic resin arranged so as to sandwich the substrate to be integrated. However, in this method, the light emitting element and the like may be damaged by heating and pressing the substrate.

  In addition, Patent Document 1 discloses a method of generating a light emitting module by inserting a substrate on which a light emitting element is mounted into a tubular resin. However, with this method, the light-emitting element is surrounded by a relatively thick tube-shaped resin, so the color rendering of the light-emitting element is sacrificed and the amount of light emission is reduced, resulting in effective illuminance as indirect illumination. There is a problem that you can not.

  The present invention has been made in view of the above circumstances, and an object thereof is to provide a light emitting module that suppresses damage to the module in the manufacturing stage and obtains effective illuminance, and a method for manufacturing the light emitting module. To do.

To achieve the above object, the flexible light emitting module of the embodiment has a flexible flexible wiring board in which a plurality of light emitting elements are mounted on one surface in the longitudinal direction, and the flexible wiring board is fixedly arranged at the bottom. And a flexible base material made of a resin in which a concave portion is formed, and a flexibility filled in at least the surface of the concave portion to which the flexible wiring board is fixed, on which the light emitting element is mounted. And a plurality of light-transmitting covers each having a hollow portion and a part of the outer wall of which is covered with the filling resin and the other part of which is exposed from the filling resin . Each of the covers having is disposed at a position on the surface of the flexible wiring board on which the light emitting element is mounted and which includes any one of the plurality of light emitting elements in the hollow portion .

In addition, a method of manufacturing a flexible light emitting module according to an embodiment includes a flexible flexible wiring board in which a plurality of light emitting elements are mounted on one surface in a longitudinal direction, and a flexible base material made of resin. A step of fixedly mounting the light-emitting element on the flexible wiring board on which the light-emitting element is mounted, the step of fixedly mounting the light-emitting element on the bottom of the recess formed in filling placing at a position enclosing the hollow portion, the filled resin having flexibility at the time of curing the side of the surface where the light emitting elements are mounted at least the flexible wiring board of the recess in which the flexible wiring board is placed Then, a step of covering a part of the outer wall of the plurality of light-transmitting covers for covering the light emitting element and exposing the other part of the cover resin from the filling resin, and a step of curing the filling resin. And, including the.

  According to the present invention, it is possible to provide a light emitting module that suppresses damage to the module in the manufacturing stage and obtains effective illuminance, and a method for manufacturing the light emitting module.

It is the figure which showed the light emitting module which concerns on one Embodiment of this invention. It is the figure which showed the light emitting module before being filled with a protection member. It is the figure which showed the characteristic of the light transmittance of a light emitting element cover. FIG. 7A is a diagram showing a state before the substrate and the light emitting element are mounted on the base material. FIG. 6B is a diagram showing a state in which the substrate and the light emitting element are mounted on the base material. FIG. 6C is a diagram showing a state in which the light emitting element cover is covered on the light emitting element. FIG. 6D is a diagram showing a state in which the concave portion of the base material is filled with the protective member. It is the figure which showed the light emitting module which concerns on the modification of this invention. It is the figure which showed the example in which the indirect lighting was installed in the ceiling corner.

  Hereinafter, a light emitting module according to an embodiment of the present invention and a method for manufacturing a light emitting module will be described with reference to the drawings.

  As shown in FIG. 1, the light emitting module 1 includes a light emitting body 10, a base material 20, and a protective member 30. The light emitting module 1 includes a base member 20 provided with a light emitting body 10 and a protective member 30 made of resin filled therein.

  As shown in FIG. 2, the light emitting body 10 is placed on the bottom portion 24 of the base material 20 formed in a U-shaped cross section. The light emitting body 10 includes a substrate 11, a light emitting element 12, a light emitting element cover 13, and a resistor 14.

  The substrate 11 is a flexible wiring substrate (FPC) made of polyethylene terephthalate (PET), polyimide (PI), polyethylene naphthalate (PEN), or the like. The substrate 11 is formed in a rectangular flat plate shape and has flexibility. The substrate 11 is fixed to the bottom of the base material 20. Further, an electrode fitting to which a wiring cord is connected is provided at one end of the substrate 11. The light-emitting body 10 is energized by supplying external power to the electrode fitting via the wiring cord.

  The light emitting element 12 is composed of an SMD (Surface Mount Device) type light emitting diode (LED). The light emitting elements 12 are arranged in the center of the substrate 11 in the lateral direction, and are arranged in a line in the longitudinal direction. The light emitting element 12 is mounted on the substrate 11 by soldering.

  The light emitting element cover 13 is made of a thermoplastic resin such as polycarbonate (PC) or acrylic (PMMA). The light emitting element cover 13 is formed in a hollow hemisphere. The light emitting element cover 13 covers the light emitting element 12 and is fixed to the substrate 11. That is, the light emitting element cover 13 prevents the light emitting element 12 from coming into contact with the protection member 30.

  Further, the light emitting element cover 13 is made of a material that does not easily transmit light in the ultraviolet range (low light transmittance) and allows uniform transmission of light in the visible range. Specifically, as shown in FIG. 3, a light emitting element cover 13 having a light transmittance of 10% or less in an ultraviolet range (10 to 380 nm) and a uniform light transmittance of 90% or more in a visible light range (380 to 800 nm) is adopted. To be done.

  As a result, the light emitting element cover 13 does not discolor with time, and can stably and uniformly transmit the light emitted by the light emitting element 12 (light in the visible light range) (the emission color does not change). ).

  The base material 20 is made of polyvinyl chloride (PVC), polyurethane (PU), silicon, or the like and has flexibility. The base material 20 is formed in a strip shape and has a U-shaped cross section in the lateral direction. Since the substrate 11 is placed on the bottom portion 24 of the base material 20, the length in the lateral direction is longer than that in the lateral direction of the substrate 11.

  The height of the side wall 21 of the base material 20 is lower than that of the light emitting element cover 13 arranged on the substrate 11. Therefore, as shown in FIG. 1, a part of the light emitting element cover 13 is exposed from the protective member 30.

  Further, in the base material 20, a protrusion 22 extending in the lateral direction is formed integrally with the side wall 21 along the side wall 21. The protrusion 22 has flexibility and resilience. Further, the base member 20 is provided with a housing groove 23 by the protrusion 22, the side wall 21, and the bottom 24. Both ends of the substrate 11 are accommodated in the accommodation groove 23. The accommodation groove 23 has a height (width of a surface of the protrusion 22 and the bottom 24 facing the substrate 11) of the substrate 11 in order to prevent the substrate 11 from being displaced after being positioned or fixed at the bottom 24. It is set below the thickness.

  The protection member 30 is, for example, a room temperature curable resin. The protection member 30 is filled with the substrate 11 placed in the concave portion of the base material 20 and is polymerized and cured by leaving it at room temperature for a certain period of time. As a result, the substrate 11 is hermetically sealed by the protection member 30. Although the protective member 30 has a light-transmitting property, the light transmittance in the visible light range is lower than that of the light emitting element cover 13. Therefore, most of the light emitted from the light emitting element 12 is emitted from the region exposed from the protective member 30 of the light emitting element cover 13.

  A method of manufacturing the light emitting module 1 configured as above will be described below with reference to FIG.

  As shown in FIG. 4 (a), before mounting the substrate 11 on the base material 20, the members forming the light emitting body 10 are mounted on the substrate 11 in advance. Specifically, the light emitting element 12 and the resistor 14 are mounted on the substrate 11 by soldering, and a wiring cord for supplying an external power source is connected to the electrode fitting. A double-sided tape having high thermal conductivity is attached to the back surface of the substrate 11 (the surface facing the bottom portion 24).

  On the other hand, the base material 20 is manufactured by injection molding, for example. The base member 20 is integrally provided with a projecting portion 22 having flexibility and resilience, and a housing groove 23 is formed therein. A double-sided tape is attached to the back surface of the base material 20.

  As shown in FIG. 4B, the substrate 11 is placed on the bottom portion 24 of the base material 20, and both side ends thereof are accommodated in the accommodation groove 23. Since the substrate 11 and the protruding portion 22 have flexibility, both ends of the substrate 11 can be easily accommodated in the accommodation groove 23 by deforming at least one of them. Further, the substrate 11 is adhered and fixed to the base material 20 by the double-sided tape applied to the back surface. The double-sided tape may be attached to the bottom portion 24 of the base material 20 instead of the back surface of the substrate 11, and another adhesive may be used instead. The displacement of the substrate 11 fixed at the bottom 24 is suppressed by the protrusion 22.

  Subsequently, as shown in FIG. 4C, the light emitting element cover 13 is put on the light emitting element 12 arranged on the substrate 11. An adhesive is applied to the bottom of the light emitting element cover 13 (a portion that comes into contact with the substrate 11), and the adhesive is fixed to the substrate 11. The light emitting element cover 13 may be fixed to the substrate 11 before mounting the substrate 11 on the base material 20.

  After that, end caps that cover both sides in the lateral direction are attached to the base material 20, and the concave portions of the base material 20 are filled with the protective member 30. For example, as shown in FIG. 3D, the protective member 30 is filled to the same height as the side wall 21 of the base material 20. The protective member 30 filled in the base material 20 is polymerized and cured by being left at room temperature for a certain period of time. The light emitting module 1 is manufactured by the above steps. The light emitting module 1 is fixed to the installation place by a double-sided tape attached to the back surface of the base material 20.

  The light emitting module 1 according to the present embodiment is manufactured by filling the U-shaped base material 20 having the light emitting body 10 mounted on the bottom portion 24 with the protective member 30 made of the room temperature curable resin. It As a result, damage to the light-emitting body 10 at the manufacturing stage can be suppressed, and the light-emitting module 1 can be manufactured quickly.

  Further, in the light emitting module 1, the light emitting element 12 is covered with the light emitting element cover 13 which hardly transmits light in the ultraviolet range and allows light in the visible range to pass uniformly, so that the light emitting element 12 emits light stably over a long period of time. Light in the visible light range can be transmitted uniformly (the emission color does not change). Thereby, the light emitting module 1 can obtain good color rendering properties and effective illuminance.

  In addition, the light emitting module 1 can improve the degree of freedom of setting by the protection member 30 and the light emitting element cover 13, and can make versatile light emitting modes (designs). Specifically, by adjusting the height of the protection member 30 in the base material 20, the area of the light emitting element cover 13 exposed from the protection member 30, that is, the amount of light transmitted through the light emitting element cover 13 (light emission amount). Can be changed. Further, in the light emitting module 1, as shown in FIG. 5, by covering the shape of the light emitting element cover 13 with a lens like a bowl-shaped lens cover 13a, the light distribution angle of the light passing through the light emitting element cover 13 is changed. -It is also possible to control and change the irradiation area and also change the illuminance in that area. Reference numeral 13b is a lens guide for fixing the position of the lens cover 13a on the substrate 11. That is, according to the light emitting element cover 13, the light distribution angle of the light emitting element 12 can be determined, and by appropriately using the light emitting element covers 13 having different light distribution angles of the light emitting elements 12, the irradiation area of the light emitting module 1 can be obtained. Also, the illuminance in the irradiation area can be changed.

  Further, at least one of the substrate 11 and the protrusion 22 may have flexibility and restorability. Specifically, when the substrate 11 is a flexible substrate, the protrusion 22 does not need to have flexibility and resilience, and when the protrusion 22 has flexibility and restoration, the substrate 11 Need not be a flexible substrate.

  In the above embodiment, the example in which the protrusion 22 is provided integrally with the side wall 21 has been described, but the protrusion 22 may be provided separately from the side wall 21. Further, the base material 20 may not have flexibility.

  Further, in the above embodiment, an example in which the light emitting module 1 includes the protruding portion 22 has been described, but the protruding portion 22 that prevents the substrate 11 from being displaced after being positioned or fixed by the bottom portion 24 may not be provided.

  Further, the arrangement form of the light emitting element 12 and the resistor 14 arranged on the substrate 11 is not particularly limited. For example, one or more resistors 14 may be arranged between the plurality of light emitting elements 12 that are continuously arranged, or the light emitting elements 12 and the resistors 14 may be arranged in a plurality of rows and columns.

  Further, in the above-described embodiment, the room temperature curable resin is given as an example of the protective member 30, but a photocurable resin (such as an ultraviolet curable resin or a visible light curable resin) may be used for the protective member 30.

  The present invention is not limited to the description of the above embodiments and the drawings, and modifications and the like can be appropriately added to the above embodiments and drawings.

DESCRIPTION OF SYMBOLS 1 ... Light emitting module 10 ... Light emitting body 11 ... Substrate 12 ... Light emitting element 13 ... Light emitting element cover 14 ... Resistor 20 ... Base material 21 ... Side wall 22 ... Projection part 23 ... Housing groove 24 ... Bottom part 30 ... Protecting member

Claims (5)

A flexible wiring board having flexibility in which a plurality of light emitting elements are mounted on one surface in the longitudinal direction,
A flexible base material made of a resin, in which the flexible wiring board is provided with a concave portion fixedly arranged at the bottom;
A flexible filling resin that is filled into at least the surface of the flexible wiring board on which the light emitting element is mounted, of the concave portion to which the flexible wiring board is fixed,
A cover having a hollow portion, a plurality of light-transmitting covers in which a part of the outer wall is covered with the filling resin and the other part is exposed from the filling resin,
Equipped with
Each of the plurality of light-transmitting covers is arranged at a position on the surface of the flexible wiring board on which the light-emitting element is mounted, the position including the light-emitting element in the hollow portion.
Flexible light emitting module. The base material includes a protrusion that protrudes from the inner wall of the recess,
The flexible light emitting module according to claim 1, wherein the flexible wiring board is sandwiched between the bottom surface of the recess and the protrusion. The filling resin is a room temperature curable resin or a photocurable resin,
The flexible light emitting module according to claim 1. The filling resin has a lower light transmittance than the cover,
The flexible light emitting module according to claim 1. A step of fixedly mounting a flexible wiring board having a plurality of light emitting elements mounted on one surface in the longitudinal direction on the bottom of a recess formed in a flexible base material made of resin; ,
Steps of arranging a plurality of light-transmitting covers each having a hollow portion on a surface of the flexible wiring board on which the light-emitting element is mounted, at a position where any one of the plurality of light-emitting elements is included in the hollow portion. When,
At least a portion of the recess on which the flexible wiring board is mounted is filled with a filling resin having flexibility at the time of curing, on the surface of the flexible wiring board on which the light emitting element is mounted, and the plurality of the light emitting elements are covered. Covering a part of the outer wall of the cover having a light-transmitting property and exposing the other part from the filling resin;
Curing the filled resin,
A method for manufacturing a flexible light emitting module including the following.

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