JP2016201236A - Light-emitting apparatus, lighting fixture, information display apparatus, and method of manufacturing light-emitting apparatus - Google Patents
Light-emitting apparatus, lighting fixture, information display apparatus, and method of manufacturing light-emitting apparatus Download PDFInfo
- Publication number
- JP2016201236A JP2016201236A JP2015080033A JP2015080033A JP2016201236A JP 2016201236 A JP2016201236 A JP 2016201236A JP 2015080033 A JP2015080033 A JP 2015080033A JP 2015080033 A JP2015080033 A JP 2015080033A JP 2016201236 A JP2016201236 A JP 2016201236A
- Authority
- JP
- Japan
- Prior art keywords
- light
- emitting device
- layer
- bubbles
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 238000000605 extraction Methods 0.000 claims abstract description 48
- 238000000034 method Methods 0.000 claims description 26
- 238000010438 heat treatment Methods 0.000 claims description 21
- 238000005401 electroluminescence Methods 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 2
- 230000001788 irregular Effects 0.000 abstract description 11
- 239000010410 layer Substances 0.000 description 128
- 238000012360 testing method Methods 0.000 description 24
- 239000010408 film Substances 0.000 description 20
- 239000000203 mixture Substances 0.000 description 14
- -1 polyethylene terephthalate Polymers 0.000 description 12
- 230000006837 decompression Effects 0.000 description 11
- 239000000463 material Substances 0.000 description 11
- 230000003287 optical effect Effects 0.000 description 8
- 239000002390 adhesive tape Substances 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 5
- 229910052753 mercury Inorganic materials 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 4
- 239000002985 plastic film Substances 0.000 description 4
- 229920006255 plastic film Polymers 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004695 Polyether sulfone Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 235000019646 color tone Nutrition 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920001230 polyarylate Polymers 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 230000000638 stimulation Effects 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- VSQYNPJPULBZKU-UHFFFAOYSA-N mercury xenon Chemical compound [Xe].[Hg] VSQYNPJPULBZKU-UHFFFAOYSA-N 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000011946 reduction process Methods 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000003039 volatile agent Substances 0.000 description 1
Abstract
Description
本発明は、例えば有機エレクトロルミネッセンス発光デバイスを備えた照明器具や情報表示装置等に使用可能な発光装置に関するものである。 The present invention relates to a light-emitting device that can be used in, for example, a lighting fixture or an information display device including an organic electroluminescence light-emitting device.
有機エレクトロルミネッセンス（有機ＥＬ）技術は、例えば照明器具や情報表示装置の低消費電力化、軽量化、フレキシブル化を実現するための有力な技術として注目されている。 Organic electroluminescence (organic EL) technology has attracted attention as a promising technology for realizing, for example, low power consumption, light weight, and flexibility of lighting fixtures and information display devices.
前記有機ＥＬ技術を用いた装置（有機ＥＬ装置）としては、例えば光の取り出し効率の向上、外光の反射防止、指紋の付着防止、意匠性の付与を目的として、有機ＥＬ発光デバイスの一部に、機能性フィルムが貼付された装置が知られている。前記機能性フィルムの貼付には、通常、粘着剤や粘着テープ等を用いる場合が多い。 As an apparatus using the organic EL technology (organic EL apparatus), for example, a part of an organic EL light emitting device for the purpose of improving light extraction efficiency, preventing reflection of external light, preventing adhesion of fingerprints, and imparting design properties. In addition, an apparatus having a functional film attached thereto is known. In general, an adhesive, an adhesive tape, or the like is often used to attach the functional film.
前記機能性フィルムの貼付に使用可能な粘着テープとしては、例えば特定の光学粘着テープ用樹脂と架橋剤とを含む光学粘着テープ等を使用できることが知られている（例えば特許文献１参照。）。 As an adhesive tape that can be used for attaching the functional film, it is known that, for example, an optical adhesive tape containing a specific resin for optical adhesive tape and a crosslinking agent can be used (see, for example, Patent Document 1).
しかし、前記光学粘着テープを、有機ＥＬ発光デバイスの一部と前記機能性フィルムとの貼り合わせに用いた場合、前記貼り合わせ後の減圧工程において、前記粘着テープと機能性フィルムとの界面や、粘着テープの内部に存在した微細な気泡が成長（気泡が大きくなることを指す）し、成長した気泡が有機ＥＬ素子から発光された光の乱反射を引き起こし、光の取り出し効率の低下を引き起こす場合があった。 However, when the optical adhesive tape is used for bonding a part of the organic EL light-emitting device and the functional film, in the decompression step after the bonding, the interface between the adhesive tape and the functional film, Fine bubbles that exist inside the adhesive tape grow (refers to the bubble becoming larger), and the grown bubbles may cause irregular reflection of light emitted from the organic EL element, resulting in a decrease in light extraction efficiency. there were.
本発明が解決しようとする課題は、例えば有機ＥＬデバイス等から発せられた光の乱反射を防止し、効率的に外部に光を導くことのできる発光装置を提供するものである。 The problem to be solved by the present invention is to provide a light emitting device capable of preventing irregular reflection of light emitted from, for example, an organic EL device and efficiently guiding light to the outside.
また、本発明が解決しようとする第二の課題は、有機ＥＬ発光装置を製造する際に行われる減圧工程を経た場合であっても、硬化層に含まれる気泡が大きくなることを防止でき、その結果、光の乱反射を防止し、効率的に外部に光を導くことのできる発光装置を製造する方法を提供するものである。 In addition, the second problem to be solved by the present invention is to prevent the bubbles contained in the cured layer from increasing even when the pressure reducing step is performed when manufacturing the organic EL light emitting device. As a result, the present invention provides a method for manufacturing a light emitting device that can prevent diffused reflection of light and efficiently guide light to the outside.
本発明は、発光デバイスの表面を構成する透明部材（Ａ）と、光取り出し部材（Ｂ）との間に硬化層（Ｃ）を有する発光装置であって、前記硬化層（Ｃ）が、気泡を有しない層、または、平均気泡径１０μｍ以下の気泡を有する層であることを特徴とする発光装置に関するものである。 The present invention is a light emitting device having a cured layer (C) between a transparent member (A) constituting the surface of a light emitting device and a light extraction member (B), wherein the cured layer (C) is a bubble. The present invention relates to a light-emitting device characterized by being a layer that does not have or a layer that has bubbles with an average bubble diameter of 10 μm or less.
本発明の発光装置は、発光デバイスの表面を構成する透明部材（Ａ）もしくは光取り出し部材（Ｂ）と硬化層（Ｃ）との界面、または、前記硬化層（Ｃ）の内部における気泡の成長を抑制できることから、例えば有機ＥＬ発光デバイス等から発せられた光が硬化層（Ｃ）で乱反射し難く、光を効果的に発光装置の外部へ導くことができる。 The light emitting device of the present invention has a growth of bubbles in the interface between the transparent member (A) or the light extraction member (B) constituting the surface of the light emitting device and the cured layer (C), or inside the cured layer (C). Therefore, for example, light emitted from an organic EL light emitting device or the like is hardly diffusely reflected by the cured layer (C), and light can be effectively guided to the outside of the light emitting device.
本発明は、発光デバイスの表面を構成する透明部材（Ａ）と光取り出し部材（Ｂ）との間に硬化層（Ｃ）を有する発光装置である。前記硬化層（Ｃ）は、前記透明部材（Ａ）または光取り出し部材（Ｂ）の表面に直接またはその他の層を介して設けられていてもよい。 This invention is a light-emitting device which has a hardening layer (C) between the transparent member (A) and light extraction member (B) which comprise the surface of a light-emitting device. The cured layer (C) may be provided on the surface of the transparent member (A) or the light extraction member (B) directly or via another layer.
前記硬化層（Ｃ）は、前記減圧または加熱処理された後であっても、気泡を有しない、または、気泡を有する場合であってもその平均気泡径が１０μｍ以下の気泡を有するものである。このような硬化層（Ｃ）を有する発光装置であれば、例えば有機ＥＬ発光デバイス等から発せられた光の乱反射を抑制し、効果的に発光装置の外部に光を導くことができる。 The hardened layer (C) has bubbles having an average bubble diameter of 10 μm or less even when it has been subjected to the reduced pressure or heat treatment, and has no bubbles or has bubbles. . With the light emitting device having such a cured layer (C), for example, irregular reflection of light emitted from an organic EL light emitting device or the like can be suppressed, and light can be effectively guided to the outside of the light emitting device.
ここで、前記気泡が存在しないとは、本発明の発光装置の前記光取り出し部材（Ｂ）側から、その表面の任意の範囲（面積０．１２ｍｍ２）を、光学式顕微鏡（５００倍率）で観察した際に、前記硬化層（Ｃ）の内部または被着体との界面に、気泡の存在を確認できなかったことを指す。 Here, the absence of the bubbles means that an arbitrary range (area 0.12 mm 2 ) of the surface of the light emitting device of the present invention from the light extraction member (B) side is measured with an optical microscope (500 magnifications). When observed, it indicates that the presence of bubbles could not be confirmed inside the cured layer (C) or at the interface with the adherend.
また、気泡の平均気泡径は、本発明の発光装置の前記光取り出し部材（Ｂ）側から、その表面の任意の範囲（面積０．１２ｍｍ２）を、光学式顕微鏡（５００倍率）で観察した際に、前記硬化層（Ｃ）の内部または被着体との界面に存在することを確認できた気泡のうち、直径の大きい順に気泡を５つ選択し、その直径を平均化した値を指す。 In addition, the average bubble diameter of the bubbles was observed with an optical microscope (500 magnifications) in an arbitrary range (area 0.12 mm 2 ) on the surface from the light extraction member (B) side of the light emitting device of the present invention. In this case, among the bubbles that have been confirmed to be present in the inside of the cured layer (C) or at the interface with the adherend, five bubbles are selected in descending order of diameter, and the averaged diameter is indicated. .
前記硬化層（Ｃ）に存在しうる気泡は、５μｍ以下の平均気泡径であることが好ましく、３μｍ以下の平均気泡径であることが、有機ＥＬデバイス等から発せられた光の乱反射を抑制し、外部に光を効果的に導くことのできる発光装置を得るうえでより好ましい。 The bubbles that may exist in the cured layer (C) preferably have an average bubble diameter of 5 μm or less, and an average bubble diameter of 3 μm or less suppresses irregular reflection of light emitted from an organic EL device or the like. It is more preferable for obtaining a light emitting device capable of effectively guiding light to the outside.
前記硬化層（Ｃ）としては、本発明の発光装置の前記光取り出し部材（Ｂ）側から、その表面の任意の範囲（面積０．１２ｍｍ２）の範囲を、光学式顕微鏡（５００倍率）で観察した際、その単位面積（０．１２ｍｍ２）あたりに、前記気泡の面積が占める割合が１０％以下であるものを使用することが好ましく、５％以下であるものを使用することがより好ましい。 As the hardened layer (C), from the light extraction member (B) side of the light emitting device of the present invention, an arbitrary range of the surface (area 0.12 mm 2 ) can be obtained with an optical microscope (500 magnifications). When observed, it is preferable to use those in which the ratio of the area of the bubbles per unit area (0.12 mm 2 ) is 10% or less, and more preferably 5% or less. .
（発光デバイスの表面を構成する透明部材（Ａ））
本発明の発光装置を構成する発光デバイスとしては、例えば有機エレクトロルミネッセンス発光デバイス（有機ＥＬ発光デバイス）、または、バックライトユニットを備えた液晶表示デバイス等が挙げられ、有機ＥＬ発光デバイスを使用することが好ましい。
(Transparent member (A) constituting the surface of the light emitting device)
Examples of the light-emitting device constituting the light-emitting device of the present invention include an organic electroluminescence light-emitting device (organic EL light-emitting device) or a liquid crystal display device including a backlight unit, and the organic EL light-emitting device is used. Is preferred.
前記有機ＥＬ発光デバイスとしては、例えば陽極層と陰極層との間に有機発光媒体層を狭持した構造を有するものが挙げられる。前記有機発光媒体層は、両電極間に電圧を印加し電流を流すことにより、それ自体が発光するものである。 Examples of the organic EL light emitting device include those having a structure in which an organic light emitting medium layer is sandwiched between an anode layer and a cathode layer. The organic light emitting medium layer emits light by applying a voltage between both electrodes and passing a current.
前記有機ＥＬ発光デバイスのより具体的な構成としては、例えば基材／陽極層／有機発光媒体層／陰極層／基材層が順に積層された構成のものが挙げられ、基材／陽極層／有機発光媒体層／陰極層／保護層／接着層／基材等が順に積層された構成のものであることが好ましい。 As a more specific structure of the organic EL light emitting device, for example, a structure in which a base material / anode layer / organic light emitting medium layer / cathode layer / base material layer are laminated in order is given. The organic light emitting medium layer / cathode layer / protective layer / adhesive layer / base material and the like are preferably laminated in this order.
前記発光デバイスの表面のうち、前記硬化層（Ｃ）を介して光取り出し部材（Ｂ）が設けられる表面を構成しうる透明部材（Ａ）としては、例えば上記基材のいずれか一方または両方に相当するものが挙げられる。前記基材としては、例えばガラス基材や、ポリカーボネート、ポリエチレンテレフタレート、ポリエチレンナフタレート、ポリメチルメタクリレート、シクロオレフィンポリマー、ポリカーボネート、ポリエーテルサルフォン、ポリプロピレン、ポリエチレン、ポリアリレート、ポリアミド等のプラスチック基材等を使用することができ、その表面の一部に陽極層または陰極層等の電極層が設けられたものを使用することもできる。 As the transparent member (A) that can constitute the surface on which the light extraction member (B) is provided via the cured layer (C) among the surfaces of the light emitting device, for example, either or both of the above-mentioned base materials The equivalent is mentioned. Examples of the base material include glass base materials and plastic base materials such as polycarbonate, polyethylene terephthalate, polyethylene naphthalate, polymethyl methacrylate, cycloolefin polymer, polycarbonate, polyethersulfone, polypropylene, polyethylene, polyarylate, polyamide, and the like. It is also possible to use a material in which an electrode layer such as an anode layer or a cathode layer is provided on a part of its surface.
前記透明部材（Ａ）の厚さは、フレキシブル性、光透過性、意匠性等を考慮し適宜選定できるが、好ましくは１０μｍ〜２００μｍ、より好ましくは２０μｍ〜１０５μｍである。 Although the thickness of the said transparent member (A) can be suitably selected in consideration of flexibility, light transmittance, designability, etc., it is preferably 10 μm to 200 μm, more preferably 20 μm to 105 μm.
また、前記発光デバイスとしては、湿分の影響による劣化などを防止することを目的として、上記保護層を有するものを使用することができる。 In addition, as the light emitting device, a device having the protective layer can be used for the purpose of preventing deterioration due to the influence of moisture.
前記保護層としては、例えば湿分封止部材を使用することができ、前記湿分封止部材としては、例えばガスバリア性に優れた珪素窒化物、珪素酸化物、セラミックス等を用いることができる。また、前記湿分封止部材を設ける際には、高密度プラズマ製膜法等で薄膜を製膜する技術を用いることができる。 As the protective layer, for example, a moisture sealing member can be used, and as the moisture sealing member, for example, silicon nitride, silicon oxide, ceramics, etc. excellent in gas barrier properties can be used. Moreover, when providing the said moisture sealing member, the technique which forms a thin film with a high-density plasma film-forming method etc. can be used.
（光取り出し部材（Ｂ））
本発明の発光装置に使用する光取出し部材（Ｂ）としては、例えばポリエチレンテレフタレート、ポリエチレンナフタレート、ポリメチルメタクリレート、シクロオレフィンポリマー、ポリカーボネート、ポリエーテルサルフォン、ポリプロピレン、ポリエチレン、ポリアリレート、ポリアミド等のプラスチックフィルム、ガラス、石英等からなるフィルムまたはシート状のものを使用することができる。
(Light extraction member (B))
Examples of the light extraction member (B) used in the light emitting device of the present invention include polyethylene terephthalate, polyethylene naphthalate, polymethyl methacrylate, cycloolefin polymer, polycarbonate, polyethersulfone, polypropylene, polyethylene, polyarylate, and polyamide. A film or sheet made of a plastic film, glass, quartz or the like can be used.
前記プラスチックフィルムとしては、重量平均分子量が１０００以下の低分子化合物をできるだけ含有しないものを使用することが好ましく、前記プラスチックフィルムの質量に対する前記低分子化合物の含有量が０．５質量％以下であるものを使用することがより好ましい。 As the plastic film, it is preferable to use a film containing as little as possible a low molecular compound having a weight average molecular weight of 1000 or less, and the content of the low molecular compound relative to the mass of the plastic film is 0.5% by mass or less. It is more preferable to use one.
前記プラスチックフィルムとして、ポリエチレンテレフタレートフィルムを使用する場合であれば、ポリエチレンテレフタレートフィルムに質量に対して、エチレングリコールとテレフタル酸とからなる環状三量体の含有量が０．４質量％以下であるものを使用することが好ましく、０．３質量％以下であるものを使用することが、本発明の発光装置を製造する際の減圧または加熱工程において、前記低分子化合物のブリードに起因した部材（Ｂ）の白濁を抑制でき、その結果、光の取り出し効率の高い発光装置を製造することができるため好ましい。 If a polyethylene terephthalate film is used as the plastic film, the polyethylene terephthalate film has a cyclic trimer content composed of ethylene glycol and terephthalic acid of 0.4% by mass or less based on the mass. It is preferable to use a material having a content of 0.3% by mass or less in the reduced pressure or heating step when producing the light emitting device of the present invention (B ) Is suppressed, and as a result, a light emitting device with high light extraction efficiency can be manufactured.
前記光取出し部材（Ｂ）としては、光の取り出し効率の向上、外光の反射防止、指紋の付着防止、意匠性の付与等を目的として、その片面または両面の一部または全部に、コーティング、印刷、蒸着、スパッタリング、凹凸加工等の処理が施されたものを使用してもよい。 As the light extraction member (B), for the purpose of improving light extraction efficiency, preventing reflection of external light, preventing adhesion of fingerprints, imparting design properties, etc., coating on a part or all of one surface or both surfaces thereof, You may use what gave processes, such as printing, vapor deposition, sputtering, uneven | corrugated processing.
前記光取り出し部材（Ｂ）の厚さは、フレキシブル性、光透過性、意匠性等を考慮し適宜選定できるが、好ましくは１０μｍ〜２００μｍ、より好ましくは２０μｍ〜１０５μｍ、さらに好ましくは３０μｍ〜５５μｍである。 The thickness of the light extraction member (B) can be appropriately selected in consideration of flexibility, light transmittance, designability, etc., preferably 10 μm to 200 μm, more preferably 20 μm to 105 μm, and still more preferably 30 μm to 55 μm. is there.
（硬化層（Ｃ））
本発明の発光装置を構成する硬化層（Ｃ）は、前記発光デバイスの表面を構成しうる透明部材（Ａ）と前記光取出し部材（Ｂ）との間に直接または他の層を介して設けられる層である。
(Curing layer (C))
The cured layer (C) constituting the light emitting device of the present invention is provided directly or via another layer between the transparent member (A) that can constitute the surface of the light emitting device and the light extraction member (B). Layer.
前記硬化層（Ｃ）は、本発明の発光装置を構成するものであるから、例えば本発明の発光装置が有機ＥＬ発光装置である場合であれば、有機ＥＬ発光装置の製造場面で通常行われる減圧工程を経た後の層を指す。一方、前記減圧工程を必要としない発光装置の場合であれば、前記硬化層（Ｃ）は、後述する硬化層（Ｃ’’）と同一のものを指す。 Since the said hardened layer (C) comprises the light-emitting device of this invention, for example, when the light-emitting device of this invention is an organic EL light-emitting device, it is normally performed in the manufacture scene of an organic EL light-emitting device. It refers to the layer after undergoing the decompression step. On the other hand, in the case of a light emitting device that does not require the decompression step, the cured layer (C) is the same as the cured layer (C ″) described later.
前記硬化層（Ｃ）は、前記透明部材（Ａ）と前記光取り出し部材（Ｂ）とを接合する役割を有するものであることが好ましい。 It is preferable that the said hardened layer (C) has a role which joins the said transparent member (A) and the said light extraction member (B).
前記硬化層（Ｃ）は、前記したとおり、気泡を有しない、または、気泡を有する場合であってもその平均気泡径が１０μｍ以下の気泡を有するものである。このような硬化層（Ｃ）を有する発光装置であれば、有機ＥＬデバイス等から発せられた光の乱反射を抑制し、発光装置の外部へ光を効果的に導くことができる。 As described above, the hardened layer (C) does not have bubbles or has bubbles with an average bubble diameter of 10 μm or less even when bubbles are included. If it is a light-emitting device which has such a hardening layer (C), the irregular reflection of the light emitted from the organic EL device etc. can be suppressed, and light can be guide | induced effectively outside the light-emitting device.
前記硬化層（Ｃ）は、例えば熱や光や湿気等の刺激によって硬化しうる組成物（ｃ）を用い未硬化層（Ｃ’）を形成した後、それを硬化させることによって硬化層（Ｃ’’）を形成し、次いで、減圧または加熱工程を経ることによって形成することができる。 The cured layer (C) is formed by, for example, forming an uncured layer (C ′) using a composition (c) that can be cured by stimulation such as heat, light, or moisture, and then curing the uncured layer (C ′). '') And then through a reduced pressure or heating step.
前記組成物（ｃ）としては、硬化前において粘着性を有するものを使用することが、前記透明部材（Ａ）と光取出し部材（Ｂ）との貼り合わせ作業性を向上させるうえで好ましい。 As the composition (c), it is preferable to use one having adhesiveness before curing in order to improve the workability of bonding the transparent member (A) and the light extraction member (B).
前記硬化層（Ｃ）の形成に使用可能な組成物（ｃ）としては、例えばアクリル系樹脂、ウレタン系樹脂、シリコン系樹脂等のうち、熱や光や湿気等の刺激によって硬化しうるものを含有する組成物を使用することが好ましい。 Examples of the composition (c) that can be used for forming the cured layer (C) include acrylic resins, urethane resins, silicon resins, and the like that can be cured by stimulation such as heat, light, and moisture. It is preferred to use a composition containing.
なかでも、前記組成物（ｃ）としては、例えば前記未硬化層（Ｃ’）のシート化、前記透明部材（Ａ）または光取り出し部材（Ｂ）への前記未硬化層（Ｃ’）の貼付、前記透明部材（Ａ）及び光取り出し部材（Ｂ）の貼り合わせ、及び、前記硬化層（Ｃ’’）または（Ｃ）の形成を、いわゆるロール トゥ ロール方式で行うことができ、かつ、紫外線照射や加熱等によって速やかに硬化し硬化層を形成できる紫外線硬化性（メタ）アクリレートを含有するアクリル系樹脂組成物、紫外線硬化性ウレタン（メタ）アクリレートを含有するウレタン樹脂組成物等を用いることが好ましい。 Among these, as the composition (c), for example, the uncured layer (C ′) is formed into a sheet, and the uncured layer (C ′) is attached to the transparent member (A) or the light extraction member (B). The bonding of the transparent member (A) and the light extraction member (B) and the formation of the cured layer (C ″) or (C) can be performed by a so-called roll-to-roll method, and ultraviolet rays It is possible to use an acrylic resin composition containing an ultraviolet curable (meth) acrylate that can be quickly cured by irradiation or heating to form a cured layer, a urethane resin composition containing an ultraviolet curable urethane (meth) acrylate, or the like. preferable.
前記組成物（ｃ）を用いて形成された未硬化層（Ｃ’）のアスカーＣ硬度は、２３℃において７０以下であることが好ましく、２０〜６０であることが、前記透明部材（Ａ）や光取り出し部材（Ｂ）に前記未硬化層（Ｃ’）を貼付しやすいためより好ましい。 The Asker C hardness of the uncured layer (C ′) formed using the composition (c) is preferably 70 or less at 23 ° C., and preferably 20 to 60, in the transparent member (A). It is more preferable because the uncured layer (C ′) can be easily attached to the light extraction member (B).
一方、前記未硬化層（Ｃ’）を硬化させることによって形成された硬化層（Ｃ’’）、及び、それを後述する方法で減圧処理等して得られた硬化層（Ｃ）のアスカーＣ硬度は、７０℃において７０以上であることが好ましく、８０以上であることがより好ましく、９０〜１００であることが、前記透明部材（Ａ）及び光取り出し部材（Ｂ）の貼り合わせ後の加熱工程で、前記硬化層（Ｃ）に含まれる気泡が大きくなることを防止するうえで一層好ましい。 On the other hand, the hardened layer (C ″) formed by curing the uncured layer (C ′), and the Asker C of the hardened layer (C) obtained by subjecting it to a reduced pressure treatment by a method described later The hardness is preferably 70 or more at 70 ° C., more preferably 80 or more, and 90 to 100 is the heating after bonding of the transparent member (A) and the light extraction member (B). In the step, it is more preferable to prevent the bubbles contained in the cured layer (C) from increasing.
また、前記未硬化層（Ｃ’）の貯蔵弾性率（Ｇ’）は、２３℃において１．０×１０５Ｐａ以下であることが好ましい。 The storage elastic modulus (G ′) of the uncured layer (C ′) is preferably 1.0 × 10 5 Pa or less at 23 ° C.
一方、前記未硬化層（Ｃ’）を硬化させることによって形成された硬化層（Ｃ’’）、及び、それを後述する方法で減圧処理等して得られた硬化層（Ｃ）の貯蔵弾性率（Ｇ’）は、７０℃において１．０×１０５Ｐａ以上であることが好ましく、１．０×１０６〜１．０×１０８Ｐａであることがより好ましい。 On the other hand, the storage elasticity of the cured layer (C ″) formed by curing the uncured layer (C ′) and the cured layer (C) obtained by subjecting the cured layer (C ″) to reduced pressure treatment by a method described later. The rate (G ′) is preferably 1.0 × 10 5 Pa or more at 70 ° C., and more preferably 1.0 × 10 6 to 1.0 × 10 8 Pa.
前記アスカーＣ硬度および貯蔵弾性率（Ｇ’）を有する硬化層（Ｃ）は、本発明の発光装置を製造する際の減圧（加熱）工程において、発光デバイスの表面を構成しうる透明部材（Ａ）もしくは光取出し部材（Ｂ）と硬化層（Ｃ）との界面、または、前記硬化層（Ｃ）の内部における気泡の成長を抑制でき、その結果、有機ＥＬ発光デバイス等から発せられた光の乱反射を抑制し、発光装置の外部へ光を効果的に導くことができるため好ましい。 The cured layer (C) having the Asker C hardness and the storage elastic modulus (G ′) is a transparent member (A) that can constitute the surface of the light emitting device in the reduced pressure (heating) step when manufacturing the light emitting device of the present invention. ) Or the interface between the light extraction member (B) and the cured layer (C), or the growth of bubbles in the cured layer (C) can be suppressed. As a result, the light emitted from the organic EL light emitting device or the like can be suppressed. It is preferable because irregular reflection can be suppressed and light can be effectively guided to the outside of the light emitting device.
前記未硬化層（Ｃ’）、前記硬化層（Ｃ’’）及び硬化層（Ｃ）の厚さは、前記組成物（ｃ）の塗工及び乾燥工程での発泡や溶剤の残留を軽減する観点から、接着性を阻害しない範囲で薄くすることが好ましく、１０μｍ〜５５μｍの範囲であることがより好ましく、１５μｍ〜３０μｍであることがさらに好ましい。 The thicknesses of the uncured layer (C ′), the cured layer (C ″) and the cured layer (C) reduce foaming and residual solvent in the coating and drying process of the composition (c). From a viewpoint, it is preferable to make it thin in the range which does not inhibit adhesiveness, It is more preferable that it is the range of 10 micrometers-55 micrometers, It is further more preferable that it is 15 micrometers-30 micrometers.
前記未硬化層（Ｃ’）、前記硬化層（Ｃ’’）及び硬化層（Ｃ）としては、前記組成物（ｃ）中に存在しうる溶媒や低分子化合物等の揮発性化合物をできるだけ含有しない層であることが好ましい。前記揮発性化合物は、前記した各層の全量に対して２質量％以下であることが好ましく、１質量％以下であることがより好ましく、０．５質量％以下であることが、硬化層（Ｃ）中に約１０μｍ以上の平均気泡径を有する気泡が形成されることを防止するうえで特に好ましい。 The uncured layer (C ′), the cured layer (C ″) and the cured layer (C) contain as much as possible volatile compounds such as solvents and low molecular compounds that may be present in the composition (c). It is preferable that the layer does not. The volatile compound is preferably 2% by mass or less, more preferably 1% by mass or less, and more preferably 0.5% by mass or less based on the total amount of each layer described above. ) Is particularly preferable for preventing formation of bubbles having an average cell diameter of about 10 μm or more.
また、前記未硬化層（Ｃ’）を硬化させることによって形成された硬化層（Ｃ’’）、及び、それを後述する方法で減圧処理等して得られた硬化層（Ｃ）のヘイズは、３％以下であることが好ましく、１％以下であることがより好ましい。 Moreover, the haze of the cured layer (C ″) formed by curing the uncured layer (C ′) and the cured layer (C) obtained by subjecting it to a reduced pressure treatment by a method described later is It is preferably 3% or less, and more preferably 1% or less.
（本発明の発光装置の製造方法）
本発明の発光装置は、有機ＥＬ発光装置を製造する場合を例に挙げれば、前記透明部材（Ａ）と光取出し部材（Ｂ）とを未硬化層（Ｃ’）を介して貼り合わせる工程、前記未硬化層（Ｃ’）を硬化させ硬化層（Ｃ’’）を形成する工程、及び、減圧または加熱する工程を経ることによって硬化層（Ｃ）を形成する方法によって製造することができる。
(Method for manufacturing light-emitting device of the present invention)
The light emitting device of the present invention is a process of bonding the transparent member (A) and the light extraction member (B) through an uncured layer (C ′), for example, in the case of producing an organic EL light emitting device. The uncured layer (C ′) can be manufactured by a method of forming the cured layer (C) by passing through a step of curing the uncured layer (C ′) to form a cured layer (C ″) and a step of reducing or heating.
その際、前記透明部材（Ａ）は、既に有機ＥＬ発光デバイス等の一部を構成していてもよく、また、前記硬化層（Ｃ’’）を介して光取出し部材（Ｂ）と貼り合わされた後に、前記発光デバイスを構成する一部に貼付される等してもよい。 At that time, the transparent member (A) may already constitute a part of an organic EL light emitting device or the like, and is bonded to the light extraction member (B) via the cured layer (C ″). After that, it may be attached to a part of the light emitting device.
本発明の有機ＥＬ発光装置は、具体的には、以下の方法によって製造することができる。 Specifically, the organic EL light-emitting device of the present invention can be produced by the following method.
はじめに、離型フィルム（１）の離型処理面に、硬化層（Ｃ）を形成しうる前記組成物（ｃ）を塗工し、必要に応じて乾燥等の処理を行った後、離型フィルム（２）の離型処理面と貼付することによって未硬化層（Ｃ’）を形成する。 First, the composition (c) capable of forming the cured layer (C) is applied to the release treatment surface of the release film (1), and after the treatment such as drying is performed, the release is performed. An uncured layer (C ′) is formed by pasting the release treatment surface of the film (2).
次に、前記未硬化層（Ｃ’）を、前記透明部材（Ａ）または光取り出し部材（Ｂ）の一方の部材に貼付した後、他方の部材（透明部材（Ａ）または光取り出し部材（Ｂ））を貼付する。 Next, after pasting the uncured layer (C ′) on one member of the transparent member (A) or the light extraction member (B), the other member (transparent member (A) or light extraction member (B) )) Is affixed.
次に、前記未硬化層（Ｃ’）に直接、または、前記透明部材（Ａ）もしくは光取り出し部材（Ｂ）を介して前記未硬化層（Ｃ’）に紫外線を照射、または、前記未硬化層（Ｃ’）を加熱等することによって硬化層（Ｃ’’）を形成する。 Next, the uncured layer (C ′) is irradiated with ultraviolet rays directly or via the transparent member (A) or the light extraction member (B), or the uncured layer (C ′). The hardened layer (C ″) is formed by heating the layer (C ′).
また、前記離型フィルム（１）または（２）のいずれか一方の代わりに、前記光取り出し部材（Ｂ）として使用可能な前記プラスチック基材を使用してもよい。具体的には、前記光取り出し部材（Ｂ）の表面に、前記組成物（ｃ）を塗工し乾燥等することによって未硬化層（Ｃ’）を形成し、その表面に、前記透明部材（Ａ）を貼付し、紫外線照射や加熱等することによって本発明の発光装置を製造することが、前記透明部材（Ａ）もしくは光取出し部材（Ｂ）と硬化層（Ｃ）との界面、または、前記硬化層（Ｃ）の内部における気泡の残存が防止された発光装置を得るうえで好ましい。 Moreover, you may use the said plastic base material which can be used as said light extraction member (B) instead of any one of the said release film (1) or (2). Specifically, an uncured layer (C ′) is formed on the surface of the light extraction member (B) by coating the composition (c) and drying, and the transparent member (C) is formed on the surface. A) is attached, and the light emitting device of the present invention is manufactured by ultraviolet irradiation or heating, etc., the interface between the transparent member (A) or the light extraction member (B) and the cured layer (C), or It is preferable for obtaining a light-emitting device in which bubbles are prevented from remaining in the cured layer (C).
前記硬化層（Ｃ’’）及び（Ｃ）を形成する際に行うことができる紫外線の照射は、例えば低圧水銀ランプ、高圧水銀ランプ、超高圧水銀ランプ、メタルハライドランプ、無電極ランプ（フュージョンランプ）、ケミカルランプ、ブラックライトランプ、水銀−キセノンランプ、ショートアーク灯、ヘリウム・カドミニウムレーザー、アルゴンレーザー、太陽光、ＬＥＤ等を用いて行うことができる。 Ultraviolet irradiation that can be performed when the hardened layers (C ″) and (C) are formed is, for example, a low-pressure mercury lamp, a high-pressure mercury lamp, an ultrahigh-pressure mercury lamp, a metal halide lamp, or an electrodeless lamp (fusion lamp). Chemical lamps, black light lamps, mercury-xenon lamps, short arc lamps, helium / cadmium lasers, argon lasers, sunlight, LEDs, and the like.
また、紫外線を照射する際の積算光量は１００〜５０００ｍＪ／ｃｍ２の範囲であることが好ましい。 Moreover, it is preferable that the integrated light quantity at the time of irradiating an ultraviolet-ray is the range of 100-5000mJ / cm < 2 >.
また、前記硬化層（Ｃ’’）及び（Ｃ）を形成する際に行うことができる加熱は、５０〜１２０℃で１０秒〜１時間程度行うことが好ましい。 The heating that can be performed when forming the cured layers (C ″) and (C) is preferably performed at 50 to 120 ° C. for about 10 seconds to 1 hour.
前記方法で形成された硬化層（Ｃ’’）は、減圧または加熱する工程において処理されてもよい。前記工程は、とりわけ有機ＥＬ発光デバイスを備えた発光装置を製造する際に行われる場合がある。従来の粘着テープ等では、それに含まれる微細な気泡が、前記減圧工程等において大きくなり、その結果、光の乱反射等を引き起こすことが懸念されていた。 The hardened layer (C ″) formed by the above method may be processed in a step of reducing pressure or heating. The process may be performed particularly when a light emitting device including an organic EL light emitting device is manufactured. In conventional pressure-sensitive adhesive tapes and the like, fine bubbles contained in the pressure-sensitive adhesive tape become large in the pressure reducing step and the like, and as a result, there has been a concern about causing irregular reflection of light and the like.
しかし、本発明の発光装置では、前記減圧工程等を経る前に硬化層（Ｃ’’）が形成されているため、その後に減圧処理等された後の硬化層（Ｃ）には、例えば平均気泡径が１０μｍを超えるような気泡が形成せれず、その結果、光の乱反射等を最小限に抑制することができる。 However, in the light emitting device of the present invention, since the cured layer (C ″) is formed before the decompression step or the like, the cured layer (C) after the decompression process or the like thereafter has, for example, an average Bubbles having a bubble diameter exceeding 10 μm are not formed, and as a result, irregular reflection of light and the like can be minimized.
前記減圧工程は、例えば１００Ｐａ以下、さらには２０Ｐａ以下といった過酷な減圧条件で行われる場合がある。本発明の発光装置を構成する硬化層（Ｃ）は、前記過酷な減圧条件下におかれた場合であっても、例えば平均気泡径が１０μｍを超えるような気泡を形成せず、その結果、光の乱反射等を最小限に抑制することができる。 The decompression step may be performed under severe decompression conditions, for example, 100 Pa or less, and further 20 Pa or less. Even when the hardened layer (C) constituting the light emitting device of the present invention is placed under the severe pressure-reducing condition, for example, it does not form bubbles with an average bubble diameter exceeding 10 μm, and as a result, Irregular reflection of light and the like can be minimized.
また、前記減圧工程は、加熱とともに行われる場合がある。その際の加熱条件としては５０℃以上、さらには７０℃〜１５０℃といった過酷な条件で行われる場合がある。本発明の装置を構成する硬化層（Ｃ）は、前記過酷な減圧及び加熱条件下におかれた場合であっても、例えば平均気泡径が１０μｍを超えるような気泡を形成せず、その結果、光の乱反射等を最小限に抑制することができる。 Moreover, the said pressure reduction process may be performed with a heating. In this case, the heating may be performed under severe conditions such as 50 ° C. or higher, or 70 ° C. to 150 ° C. Even when the hardened layer (C) constituting the apparatus of the present invention is subjected to the above severe pressure reduction and heating conditions, for example, it does not form bubbles with an average bubble diameter exceeding 10 μm, and as a result Further, irregular reflection of light and the like can be suppressed to a minimum.
未硬化層（Ｃ’）を用いて前記透明部材（Ａ）と光取り出し部材（Ｂ）とを貼り合わせる工程では、それらの界面に気泡を巻き込む場合がある。この気泡は、通常、経時的に分散されるため、それらの貼付物を、前記貼り合わせ後に一定期間養生する方法や、オートクレーブ処理する方法によって除去されやすい。そのため、上記貼り合わせ工程後に上記養生等の処理を行うことによって、上記減圧工程による気泡の成長（気泡が大きくなること）をある程度抑制できる場合がある。 In the step of bonding the transparent member (A) and the light extraction member (B) using the uncured layer (C ′), bubbles may be involved in the interface between them. Since these bubbles are usually dispersed with time, they are easily removed by a method of curing the pasted material for a certain period after the pasting or a method of autoclaving. Therefore, by performing the treatment such as the curing after the bonding step, the bubble growth (bubble increase) by the decompression step may be suppressed to some extent.
しかし、前記発光装置のさらなる高効率化が求められるなかで、上記養生やオートクレーブ処理で十分に除去されなかったごく微細な気泡が、前記減圧工程で大きくなり、その結果、前記光の乱反射等を引き起こすことが懸念される場合がある。 However, while further improvement in the efficiency of the light emitting device is required, very fine bubbles that are not sufficiently removed by the curing and autoclave treatment become large in the decompression step, and as a result, diffuse reflection of the light, etc. There may be concerns about causing it.
また、上記発光装置の生産効率の向上が求められるなかで、前記養生やオートクレーブ処理を十分に行うことができないのが実情である。 In addition, while the improvement in production efficiency of the light emitting device is required, the curing and autoclave treatment cannot be performed sufficiently.
このような状況下、本発明の発光装置の製造方法であれば、前記未硬化層（Ｃ’）を用いて前記透明部材（Ａ）及び光取り出し部材（Ｂ）を貼付した後、紫外線等を照射することによって速やかに硬化層（Ｃ’’）が形成されるため、前記養生やオートクレーブ処理を経ることなく、前記貼り合わせ後、直ちに前記減圧工程を施した場合であっても、前記気泡の成長を防止することが可能である。 Under such circumstances, if the method for producing a light emitting device of the present invention is used, after the transparent member (A) and the light extraction member (B) are pasted using the uncured layer (C ′), ultraviolet rays and the like are applied. Since the cured layer (C ″) is quickly formed by irradiation, even if the decompression step is performed immediately after the pasting without passing through the curing or autoclave treatment, It is possible to prevent growth.
したがって、本発明の発光装置の製造方法は、前記透明部材（Ａ）と光取り出し部材（Ｂ）と未硬化層（Ｃ’）との貼り合わせ工程、紫外線等の照射工程、及び、減圧工程を、いわゆるロール トゥ ロールで連続的に行う際に適用することができる。 Therefore, the manufacturing method of the light-emitting device of the present invention includes the step of bonding the transparent member (A), the light extraction member (B), and the uncured layer (C ′), the irradiation step of ultraviolet rays, and the pressure reduction step. It can be applied when performing so-called roll-to-roll continuously.
前記未硬化層（Ｃ’）を用いて前記透明部材（Ａ）と光取り出し部材（Ｂ）とを貼付後、上記減圧（加熱）工程を施すまでの時間は、およそ６時間以内であることが好ましく、１時間以内であることがより好ましく、上記ロール トゥ ロールで行う場合には、数分以内であることが、上記減圧工程における気泡の成長を防止でき、かつ、本発明の発光装置の生産効率をより一層高めるうえで好ましい。 After pasting the transparent member (A) and the light extraction member (B) using the uncured layer (C ′), the time until the pressure reduction (heating) step is performed is approximately 6 hours or less. Preferably, it is within 1 hour, and when performing the roll-to-roll process, it is possible to prevent the growth of bubbles in the decompression step and to produce the light emitting device of the present invention within a few minutes. It is preferable for further increasing the efficiency.
また、前記透明部材（Ａ）または光取り出し部材（Ｂ）と、未硬化層（Ｃ’）とを貼り合わせる際の上記気泡の巻き込みを軽減する方法としては、それらを積層する際に、その上面からロールを用いて加圧する方法が挙げられる。 Further, as a method of reducing the entrainment of the bubbles when the transparent member (A) or the light extraction member (B) and the uncured layer (C ′) are bonded together, And a method of pressurizing using a roll.
前記ロールとしては、クロムメッキ処理した鉄等の金属、シリコンやウレタン等のゴムからなるものを使用することができ、金属ロールとゴムロールとを組み合わせて用いることもできる。 As the roll, a chrome-plated metal such as iron, or a rubber made of silicon or urethane can be used, and a metal roll and a rubber roll can be used in combination.
前記ロールを用いた加圧は、１０〜３００Ｎ／ｃｍ程度の圧力で行うことが好ましい。また、前記透明部材（Ａ）、光取り出し部材（Ｂ）及び未硬化層（Ｃ’）や本発明の発光装置に悪影響を及ぼさない範囲で５０〜１００℃程度加温してもよい。 The pressurization using the roll is preferably performed at a pressure of about 10 to 300 N / cm. Moreover, you may heat about 50-100 degreeC in the range which does not have a bad influence on the said transparent member (A), light extraction member (B), uncured layer (C '), and the light-emitting device of this invention.
前記発光装置のうち、有機エレクトロルミネッセンス発光装置（有機ＥＬ発光装置）もまた、上記と同様の方法で製造することができる。具体的には、有機ＥＬ発光装置は、有機ＥＬ発光デバイスの表面を構成する透明部材（Ａ）と光取り出し部材（Ｂ）とを未硬化層（Ｃ’）を介して貼り合わせる工程、前記未硬化層（Ｃ’）を硬化させ硬化層（Ｃ’’）を形成する工程、及び、減圧または加熱する工程を経て硬化層（Ｃ）を形成することによって製造することができる。 Among the light emitting devices, an organic electroluminescence light emitting device (organic EL light emitting device) can also be produced by the same method as described above. Specifically, the organic EL light emitting device includes a step of bonding the transparent member (A) and the light extraction member (B) constituting the surface of the organic EL light emitting device through an uncured layer (C ′), It can manufacture by forming a hardened layer (C) through the process of hardening a hardened layer (C '), forming a hardened layer (C' '), and the process of pressure-reducing or heating.
上記方法で得られた本発明の発光装置は、例えば照明器具、ディスプレイ等の情報表示装置等に好適に使用することができる。 The light emitting device of the present invention obtained by the above method can be suitably used for an information display device such as a lighting fixture or a display.
本発明の発光装置は、例えば光取り出し部材（Ｂ）として光の色調を制御可能な部材を使用することによって、生活環境に応じて発光色、白色、電灯色等の様々な色調の光を発することのできる照明器具として、好適に使用することができる。 The light-emitting device of the present invention emits light of various color tones such as luminescent color, white color, and lamp color according to the living environment by using, for example, a member capable of controlling the color tone of light as the light extraction member (B). It can be used suitably as a lighting fixture that can be used.
［実施例１］
厚さ７５μｍの離型フィルムの表面に、紫外線硬化性であるウレタンアクリレート組成物（ｃ−１）を塗工し、乾燥させることによって、厚さ２５μｍの未硬化層（２３℃におけるアスカーＣ硬度が６５）を形成した。
[Example 1]
By applying a UV curable urethane acrylate composition (c-1) to the surface of a release film having a thickness of 75 μm and drying, an uncured layer having a thickness of 25 μm (Asker C hardness at 23 ° C.) 65) was formed.
次に、前記未硬化層の表面に、前記光取出し部材（Ｂ）に相当するものとして厚さ１００μｍのシクロオレフィンポリマーからなるフィルムを、ラミネーターを用いて加圧貼付した。 Next, a film made of a cycloolefin polymer having a thickness of 100 μm, which corresponds to the light extraction member (B), was applied to the surface of the uncured layer using a laminator.
前記加圧貼付後、３０分以内に、前記離型フィルムを剥離し、その表面に、前記透明部材（Ａ）に相当するものとして上記とは別の厚さ１００μｍのシクロオレフィンポリマーからなるフィルムを、ラミネーターを用いて加圧貼付したものを試験サンプル（１Ａ）とした。 Within 30 minutes after the pressure application, the release film is peeled off, and a film made of a cycloolefin polymer having a thickness of 100 μm, which is different from the above, corresponding to the transparent member (A) is formed on the surface thereof. The test sample (1A) was affixed using a laminator.
前記試験サンプル（１Ａ）を作製後、３０分以内に、高圧水銀灯（照射強度１．４Ｗ／ｍ２、積算光量３０００ｍＪ／ｃｍ２）を用い、前記試験サンプル（１Ａ）に紫外線を照射し前記未硬化層を硬化させることによって試験サンプル（１Ｂ）を得た。 Within 30 minutes after preparing the test sample (1A), a high-pressure mercury lamp (irradiation intensity: 1.4 W / m 2 , integrated light quantity: 3000 mJ / cm 2 ) was used to irradiate the test sample (1A) with ultraviolet rays and A test sample (1B) was obtained by curing the cured layer.
次に、前記試験サンプル（１Ｂ）を、７０℃及び１０Ｐａの減圧加熱環境下に１時間放置することによって硬化層（アスカー硬度Ｃ９０）を有する試験サンプル（１Ｃ）を得た。 Next, the test sample (1B) having a hardened layer (Asker hardness C90) was obtained by leaving the test sample (1B) for 1 hour in a reduced pressure heating environment of 70 ° C. and 10 Pa.
前記試験サンプル（１Ｃ）を構成する透明部材（Ａ）に相当する面と、有機ＥＬ発光デバイスとを積層することによって、本発明の発光装置を得た。 The surface corresponding to the transparent member (A) constituting the test sample (1C) and the organic EL light emitting device were laminated to obtain the light emitting device of the present invention.
［未硬化層及び硬化層に存在する気泡の平均気泡径の算出方法］
前記試験サンプル（１Ａ）または前記試験サンプル（１Ｃ）を作製後１０分以内のものを用い、前記光取り出し部材（Ｂ）側の表面のうち、任意の範囲（面積０．１２ｍｍ２）の範囲を前記光学式顕微鏡（５００倍率）で観察した。前記観察によって、前記未硬化層もしくは硬化層の内部、または、それらと透明部材（Ａ）や光取出し部材（Ｂ）との界面に存在することが確認できた気泡のうち、直径の大きい順に気泡を５つ選択し、その直径の平均値を算出した。
[Calculation method of average bubble diameter of bubbles present in uncured layer and cured layer]
Using the test sample (1A) or the test sample (1C) within 10 minutes after production, the surface of the light extraction member (B) side has an arbitrary range (area 0.12 mm 2 ). It observed with the said optical microscope (500-times magnification). Among the bubbles that have been confirmed to be present in the uncured layer or the cured layer, or at the interface between them and the transparent member (A) or the light extraction member (B), Were selected, and the average value of the diameters was calculated.
［未硬化層及び硬化層に存在する気泡の存在割合の算出方法］
前記試験サンプル（１Ａ）または前記試験サンプル（１Ｃ）を作製後１０分以内のものを用い、前記光取り出し部材（Ｂ）側の表面のうち、任意の範囲（面積０．１２ｍｍ２）の範囲を光学式顕微鏡（５００倍率）を用い、前記未硬化層もしくは硬化層の内部、または、それらと透明部材（Ａ）や光取出し部材（Ｂ）との界面に存在する気泡の有無を観察した。前記観察した範囲（単位面積：０．１２ｍｍ２）に存在する気泡の面積を算出し、前記単位面積あたりに占める気泡の面積の割合を算出した。
[Calculation method of the ratio of bubbles present in the uncured layer and the cured layer]
Using the test sample (1A) or the test sample (1C) within 10 minutes after production, the surface of the light extraction member (B) side has an arbitrary range (area 0.12 mm 2 ). Using an optical microscope (500 magnifications), the presence or absence of bubbles present inside the uncured layer or the cured layer, or at the interface between them and the transparent member (A) or the light extraction member (B) was observed. The area of bubbles existing in the observed range (unit area: 0.12 mm 2 ) was calculated, and the ratio of the area of bubbles occupied per unit area was calculated.
［減圧加熱処理前の硬化層のヘイズと、減圧下熱処理後の硬化層のヘイズの測定方法］
厚さ７５μｍの離型フィルムの表面に、紫外線硬化性であるウレタンアクリレート組成物（ｃ−１）を塗工し、乾燥させることによって、厚さ２５μｍの未硬化層（２３℃におけるアスカーＣ硬度が６５）を形成した。
[Method of measuring haze of cured layer before heat treatment under reduced pressure and haze of cured layer after heat treatment under reduced pressure]
By applying a UV curable urethane acrylate composition (c-1) to the surface of a release film having a thickness of 75 μm and drying, an uncured layer having a thickness of 25 μm (Asker C hardness at 23 ° C.) 65) was formed.
次に、前記未硬化層の表面に、厚さ１００μｍの透明ポリエチレンテレフタレートフィルムを、ラミネーターを用いて加圧貼付した。 Next, a transparent polyethylene terephthalate film having a thickness of 100 μm was pressure-applied to the surface of the uncured layer using a laminator.
前記加圧貼付後、３０分以内に、前記離型フィルムを剥離し、その表面に、上記とは別の厚さ１００μｍの透明ポリエチレンテレフタレートフィルムを、ラミネーターを用いて加圧貼付したものを試験片１とした。 Within 30 minutes after applying the pressure, the release film was peeled off, and a transparent polyethylene terephthalate film having a thickness of 100 μm different from the above was applied to the surface using a laminator. It was set to 1.
前記試験片１を作製後、１０分以内のもののヘイズを、（株）村上色彩技術研究所製「ＨＲ−１００型」を用いて測定した。 After the test piece 1 was prepared, the haze of the sample within 10 minutes was measured using “HR-100 type” manufactured by Murakami Color Research Laboratory.
前記試験片１を作製後、３０分以内に、高圧水銀灯（照射強度１．４Ｗ／ｍ２、積算光量３０００ｍＪ／ｃｍ２）を用い、前記試験片１に紫外線を照射し前記未硬化層を硬化させることによって試験片２を得た。 Within 30 minutes after the preparation of the test piece 1, the high-pressure mercury lamp (irradiation intensity: 1.4 W / m 2 , integrated light quantity: 3000 mJ / cm 2 ) is used to irradiate the test piece 1 with ultraviolet rays to cure the uncured layer. Test piece 2 was obtained.
次に、前記試験片２を、７０℃及び１０Ｐａの減圧加熱環境下に１時間放置することによって硬化層（アスカー硬度Ｃ９０）を有する試験片３を得た。 Next, the test piece 2 having a hardened layer (Asker hardness C90) was obtained by allowing the test piece 2 to stand in a reduced pressure heating environment of 70 ° C. and 10 Pa for 1 hour.
前記試験片３を作製後、１０分以内のもののヘイズを、（株）村上色彩技術研究所製「ＨＲ−１００型」を用いて測定した。 After producing the test piece 3, the haze of the specimen within 10 minutes was measured using “HR-100 type” manufactured by Murakami Color Research Laboratory.
［比較例１］
ラミネーターを使用せず、２枚のシクロオレフィンポリマーと未硬化層とを、手の指で加圧し貼付したこと以外は、実施例１と同様の方法で試験サンプル及び発光装置を作製した。
[Comparative Example 1]
A test sample and a light-emitting device were produced in the same manner as in Example 1 except that the laminator was not used and two cycloolefin polymers and an uncured layer were pressed and applied with fingers.
［比較例２］
紫外線硬化性であるウレタンアクリレート組成物（ｃ−１）の代わりに、紫外線硬化性ではないアクリル粘着剤（２３℃におけるアスカーＣ硬度が６０）を使用したこと、紫外線照射を行わなかったこと以外は、実施例１と同様の方法で試験サンプル及び発光装置を作製した。
[Comparative Example 2]
Instead of the ultraviolet curable urethane acrylate composition (c-1), an acrylic adhesive that is not ultraviolet curable (Asker C hardness at 23 ° C. is 60) was used, and no ultraviolet irradiation was performed. A test sample and a light emitting device were produced in the same manner as in Example 1.
［光の透過性の評価方法］
実施例及び比較例で得た発光装置を構成する有機ＥＬ発光デバイスを発光させ、その光を前記試験サンプル（１Ｃ）を構成する透明部材（Ａ）側の面に照射した。有機ＥＬ発光デバイスから発せられた光と、前記試験サンプル（１Ｃ）を透過した光との均一性を、目視で観察した。
[Evaluation method of light transmittance]
The organic EL light-emitting devices constituting the light-emitting devices obtained in the examples and comparative examples were caused to emit light, and the light was irradiated onto the surface on the transparent member (A) side constituting the test sample (1C). The uniformity of the light emitted from the organic EL light emitting device and the light transmitted through the test sample (1C) was visually observed.
〇：試験サンプル（１Ｃ）を透過する前の光及び透過した後の光の量が均一であった。 O: The amount of light before and after passing through the test sample (1C) was uniform.
×：試験サンプル（１Ｃ）を透過する前の光及び透過した後の光の量が不均一であった。 X: The amount of light before and after passing through the test sample (1C) was non-uniform.
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015080033A JP6720473B2 (en) | 2015-04-09 | 2015-04-09 | Light emitting device, lighting fixture, information display device, and method for manufacturing light emitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015080033A JP6720473B2 (en) | 2015-04-09 | 2015-04-09 | Light emitting device, lighting fixture, information display device, and method for manufacturing light emitting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2016201236A true JP2016201236A (en) | 2016-12-01 |
| JP6720473B2 JP6720473B2 (en) | 2020-07-08 |
Family
ID=57424380
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015080033A Active JP6720473B2 (en) | 2015-04-09 | 2015-04-09 | Light emitting device, lighting fixture, information display device, and method for manufacturing light emitting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6720473B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10921492B2 (en) | 2018-01-09 | 2021-02-16 | Corning Incorporated | Coated articles with light-altering features and methods for the production thereof |
| US11940593B2 (en) | 2020-07-09 | 2024-03-26 | Corning Incorporated | Display articles with diffractive, antiglare surfaces and methods of making the same |
| US11971519B2 (en) | 2021-07-08 | 2024-04-30 | Corning Incorporated | Display articles with antiglare surfaces and thin, durable antireflection coatings |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001170858A (en) * | 1999-12-15 | 2001-06-26 | Sumitomo Osaka Cement Co Ltd | Mirror polishing method for grinding silicon wafer |
| JP2003098980A (en) * | 2001-09-25 | 2003-04-04 | Sanyo Electric Co Ltd | Electroluminescence display device and method of manufacturing the same |
| JP2007242313A (en) * | 2006-03-07 | 2007-09-20 | Sony Corp | Manufacturing method of display |
| JP2007265625A (en) * | 2006-03-27 | 2007-10-11 | Seiko Epson Corp | Manufacturing method of bonded substrate and manufacturing method of electro-optical device |
| JP2010067350A (en) * | 2008-09-08 | 2010-03-25 | Hitachi Displays Ltd | Organic el display device and its manufacturing method |
| WO2010044291A1 (en) * | 2008-10-17 | 2010-04-22 | シャープ株式会社 | Display device and method for manufacturing the same |
| JP2013232317A (en) * | 2012-04-27 | 2013-11-14 | Konica Minolta Inc | Organic electronic device |
| WO2014029545A1 (en) * | 2012-08-24 | 2014-02-27 | Tesa Se | Pressure-sensitive adhesive material particularly for encasing an electronic arrangement |
| JP2014112525A (en) * | 2012-10-29 | 2014-06-19 | Nitto Denko Corp | Method for manufacturing organic electroluminescent panel using roll-to-roll process |
| WO2014208271A1 (en) * | 2013-06-28 | 2014-12-31 | コニカミノルタ株式会社 | Organic electroluminescence element, method for manufacturing same, and organic electroluminescence device |
-
2015
- 2015-04-09 JP JP2015080033A patent/JP6720473B2/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001170858A (en) * | 1999-12-15 | 2001-06-26 | Sumitomo Osaka Cement Co Ltd | Mirror polishing method for grinding silicon wafer |
| JP2003098980A (en) * | 2001-09-25 | 2003-04-04 | Sanyo Electric Co Ltd | Electroluminescence display device and method of manufacturing the same |
| JP2007242313A (en) * | 2006-03-07 | 2007-09-20 | Sony Corp | Manufacturing method of display |
| JP2007265625A (en) * | 2006-03-27 | 2007-10-11 | Seiko Epson Corp | Manufacturing method of bonded substrate and manufacturing method of electro-optical device |
| JP2010067350A (en) * | 2008-09-08 | 2010-03-25 | Hitachi Displays Ltd | Organic el display device and its manufacturing method |
| WO2010044291A1 (en) * | 2008-10-17 | 2010-04-22 | シャープ株式会社 | Display device and method for manufacturing the same |
| JP2013232317A (en) * | 2012-04-27 | 2013-11-14 | Konica Minolta Inc | Organic electronic device |
| WO2014029545A1 (en) * | 2012-08-24 | 2014-02-27 | Tesa Se | Pressure-sensitive adhesive material particularly for encasing an electronic arrangement |
| JP2015531807A (en) * | 2012-08-24 | 2015-11-05 | テーザ・ソシエタス・ヨーロピア | Pressure sensitive adhesives especially for the encapsulation of electronic devices |
| JP2014112525A (en) * | 2012-10-29 | 2014-06-19 | Nitto Denko Corp | Method for manufacturing organic electroluminescent panel using roll-to-roll process |
| WO2014208271A1 (en) * | 2013-06-28 | 2014-12-31 | コニカミノルタ株式会社 | Organic electroluminescence element, method for manufacturing same, and organic electroluminescence device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10921492B2 (en) | 2018-01-09 | 2021-02-16 | Corning Incorporated | Coated articles with light-altering features and methods for the production thereof |
| US11940593B2 (en) | 2020-07-09 | 2024-03-26 | Corning Incorporated | Display articles with diffractive, antiglare surfaces and methods of making the same |
| US11971519B2 (en) | 2021-07-08 | 2024-04-30 | Corning Incorporated | Display articles with antiglare surfaces and thin, durable antireflection coatings |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6720473B2 (en) | 2020-07-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101858502B1 (en) | Wavelength conversion member, backlight unit including wavelength conversion member, liquid crystal display device, and method of manufacturing wavelength conversion member | |
| JP2013142132A (en) | Laminate, transparent optical member using the same and image display device using the same | |
| JP2008179781A (en) | Wavelength converting structure and manufacture and use of the same | |
| JP2016182744A (en) | Functional film and method for producing functional film | |
| JP6791138B2 (en) | Adhesive sheet and laminate and their manufacturing method | |
| TWI725980B (en) | Optical film and manufacturing method thereof | |
| TW201922492A (en) | Laminate for image display devices | |
| CN107819073B (en) | Substrate and manufacturing method of OLED device | |
| JP6377541B2 (en) | Flexible device manufacturing method and flexible device laminate | |
| TW201800528A (en) | Two-sided adhesive sheet and layered body | |
| JP2021015168A (en) | Hard coat film and flexible display using the same | |
| WO2012127916A1 (en) | Transparent conductive film, substrate having transparent conductive film, and organic electroluminescent element using same | |
| TW201803954A (en) | Adhesive sheet and laminate body | |
| JP6720473B2 (en) | Light emitting device, lighting fixture, information display device, and method for manufacturing light emitting device | |
| KR101955059B1 (en) | Method for Producing Transparent Adhesive Sheet for Optical Applications, Transparent Adhesive Sheet for Optical Applications, and Display Device Using Same | |
| WO2018101083A1 (en) | Laminate body and device including same | |
| JP2012149227A (en) | Active energy ray-curable resin composition for light guide plate pattern | |
| JP2016096276A (en) | Wavelength conversion member and backlight unit having the same, liquid crystal display device, and method for manufacturing wavelength conversion member | |
| JP6262108B2 (en) | Method for producing functional film | |
| JPWO2017204248A1 (en) | Laminated adhesive sheet | |
| JP6551151B2 (en) | Glass laminate, substrate for electronic device, and electronic device | |
| TW201816038A (en) | Pressure-sensitive adhesive sheet | |
| KR20210079867A (en) | Adhesion variable adhesive composition for display and Adhesive sheet for display comprising the same | |
| JP2015212842A (en) | Hard coat film, and method for producing hard coat film | |
| JP2005011649A (en) | Bonding method, manufacturing method of electroluminescent panel capable of utilizing the bonding method, and electroluminescent panel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RD01 | Notification of change of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7421 Effective date: 20180220 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20180316 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20181227 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190108 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20190308 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190507 |
|
| RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20190620 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20191024 |
|
| RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20191118 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20191219 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20200519 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20200601 |
|
| R151 | Written notification of patent or utility model registration |
Ref document number: 6720473 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |