JP2016174007A - Top-emission type organic electroluminescence display device and manufacturing method for the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress the deterioration in display characteristic by sufficiently preventing the scattering of dust and the like of an organic layer removed by the laser beam into a pixel region.SOLUTION: A top-emission organic EL display device includes a substrate, pixel electrodes, an auxiliary electrode, an insulating layer formed between the pixel electrodes so as to cover an edge of the pixel electrodes and having an opening to expose the auxiliary electrode, an organic EL layer formed on the pixel electrode, including a plurality of organic layers, and including at least a light-emitting layer, the organic layer formed on the auxiliary electrode exposed from the opening of the insulating layer, a contact portion serving as an opening of the organic layer formed on the auxiliary electrode exposed from the opening of the insulating layer, and a transparent electrode layer. The width of the insulating layer between the contact portion and the pixel electrode adjacent to the contact portion is 6 μm or more. The transparent electrode layer is electrically connected to the auxiliary electrode in the contact portion.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a top emission type organic electroluminescence display device having an auxiliary electrode.

  The organic electroluminescence element has high visibility due to self-coloring, is an all-solid-state display unlike a liquid crystal display device, has excellent impact resistance, has a fast response speed, is less affected by temperature changes, and Advantages such as a wide viewing angle are attracting attention. Hereinafter, organic electroluminescence may be abbreviated as organic EL.

  The configuration of the organic EL element is based on a laminated structure in which an organic EL layer is sandwiched between an anode and a cathode. There are passive matrix driving and active matrix driving as a driving method of an organic EL display device having such an organic EL element. However, when manufacturing a large display, it is active from the viewpoint that driving with a low voltage is possible. Matrix driving is advantageous. Note that active matrix driving refers to a system in which a circuit such as a TFT is formed on a substrate on which an organic EL element is formed and the circuit is driven by the circuit such as the TFT.

  Such organic EL display devices include a bottom emission type in which light is extracted from the substrate side on which the organic EL element is formed, and a top emission type in which light is extracted from the side opposite to the substrate on which the organic EL element is formed. . Here, in the case of an organic EL display device driven by an active matrix, in the bottom emission type, the aperture ratio is limited by a circuit such as a TFT formed on a substrate which is a light extraction surface, and the light extraction efficiency is reduced. There's a problem. On the other hand, in the top emission type, since light is extracted from the surface opposite to the substrate, light extraction efficiency superior to that of the bottom emission type is obtained. In the case of the top emission type, a transparent electrode layer is used as the electrode layer on the side that becomes the light extraction surface.

  By the way, a general transparent electrode layer has a larger resistance than an electrode layer made of a metal such as Al or Cu. Therefore, in an organic EL display device having a transparent electrode layer, a voltage drop occurs due to the resistance of the transparent electrode layer, and as a result, the occurrence of so-called luminance unevenness in which the luminance uniformity of the organic EL layer is lowered is a problem. . In addition, since the resistance increases as the area of the transparent electrode layer increases, the above-described problem of luminance unevenness becomes prominent when a large display is manufactured.

  For example, as disclosed in Patent Document 1, for example, a method for suppressing a voltage drop by forming an auxiliary electrode having a low resistance value and electrically connecting the auxiliary electrode to a transparent electrode layer is known. It has been. Here, the auxiliary electrode is usually formed in a pattern by performing a wet process etching after forming a metal layer. Therefore, in the top emission type organic EL display device, when the auxiliary electrode is formed after forming the organic EL layer, there is a problem that the organic EL layer is eroded by the etching solution used when forming the auxiliary electrode. . Therefore, as described in Patent Documents 2 to 5, a method of forming an auxiliary electrode before forming an organic EL layer is known.

  However, if the auxiliary electrode is formed before the organic EL layer is formed, the organic EL layer is formed on the entire surface when the organic EL layer is formed on the entire surface or when at least one organic layer constituting the organic EL layer is formed on the entire surface. An organic EL layer and at least one organic layer are formed. Therefore, there has been a problem that the electrical connection between the auxiliary electrode and the transparent electrode layer is hindered by the organic EL layer or the organic layer on the auxiliary electrode.

  Therefore, Patent Documents 2 to 3 propose a method of manufacturing an organic EL display device in which the organic EL layer on the auxiliary electrode is removed by laser light and the auxiliary electrode and the transparent electrode layer are electrically connected. Yes. However, in this case, there is a problem that the organic EL layer removed by the laser light is scattered, the pixel region in the organic EL display device is contaminated, and the display characteristics are deteriorated.

  As a method for solving the above problem, for example, in Patent Document 4, before the organic EL layer is removed by laser light, the first electrode having translucency is applied to the entire surface of the auxiliary electrode covered with the organic EL layer. A method is proposed in which the organic EL layer is removed by laser light through the first electrode and then the second electrode is formed. However, in this case, although the above-described deterioration in display characteristics can be suppressed, the first electrode and the second electrode are formed as the transparent electrode layer, so that there is a problem that the manufacturing process increases.

Patent No. 4434411 Patent No. 4959119 Japanese Patent No. 4545780 Special table 2010-538440 gazette Japanese Patent No. 4340982

  By the way, in Patent Document 5, as a method for preventing dust or the like of an organic layer removed by a laser beam to form a contact portion that connects an auxiliary electrode and a transparent electrode layer, the display device is contaminated. A method for manufacturing such an organic EL display device is disclosed. That is, as shown in FIG. 6A, the pixel electrode 30 and the auxiliary electrode 40 are formed on the substrate 20, and the insulating layer 50 is formed between the pixel electrode 30 and the auxiliary electrode 40. As shown to (b), the organic electroluminescent layer 60 is formed and organic electroluminescent layer side board | substrate 100 'is formed. Next, as shown in FIG. 6C, the lid member 80 is disposed so that the lid member 80 is opposed to the organic EL layer side substrate 100 ′ under reduced pressure so that the lid member 80 contacts the top of the insulating layer 50. Thus, the space V between the organic EL layer side substrate 100 ′ and the lid member 80 is in a reduced pressure state. Thereafter, the outer peripheral space of the organic EL layer side substrate 100 ′ and the lid member 80 is pressurized so that the lid member 80 is brought into close contact with the organic EL layer side substrate 100 ′. Next, the organic EL layer 60 on the auxiliary electrode 40 is removed by the laser light L, and the lid member 80 is peeled off as shown in FIG. Finally, as shown in FIG. 6E, the auxiliary electrode 40 and the transparent electrode layer 70 were electrically connected at the contact portion by forming the transparent electrode layer 70 on the organic EL layer side substrate. This is a method for manufacturing the organic EL display device 100. By manufacturing an organic EL display device using the above-described method, it is possible to prevent the dust and the like of the organic EL layer removed by the laser light from being scattered to the pixel region, and to prevent deterioration in display characteristics. become.

  Therefore, the present inventors have conducted various studies on the organic EL display device manufactured by using the above-described method. As a result, the present inventors have formed an organic EL display device manufactured using the above-described method between a region where a contact portion is formed by irradiation with laser light and an adjacent pixel electrode. Depending on the width of the insulating layer, it is not possible to sufficiently prevent the dust or the like of the organic EL layer that has been removed by the irradiation of the laser light from scattering into the pixel region, and it is not possible to suppress deterioration in display characteristics. I found a problem.

  The present invention has been made in view of the above circumstances, and in order to form a contact portion, a cover material is brought into contact with an insulating layer between a region where the contact portion is formed and a pixel electrode adjacent to the region, The space between the organic EL layer side substrate on which the pixel electrode, the auxiliary electrode, the insulating layer, and the organic EL layer are formed on the substrate and the lid member is decompressed, and then the side of the lid member opposite to the organic EL layer side substrate When the organic EL layer side substrate and the lid material are brought into close contact with each other by adjusting the pressure of the space, and then the laser light is irradiated to remove the organic layer covering the auxiliary electrode exposed from the opening of the insulating layer The main object of the present invention is to sufficiently prevent the dust or the like of the organic layer removed by the laser light from scattering into the pixel region and to suppress the deterioration of display characteristics.

  In order to achieve the above object, the present invention covers a substrate, a plurality of pixel electrodes formed on the substrate, an auxiliary electrode formed between the pixel electrodes, and an edge portion of the pixel electrode. Is formed between the pixel electrodes adjacent to each other and has an insulating layer having an opening so that the auxiliary electrode is exposed, and a plurality of organic layers formed on the pixel electrode. An organic EL layer having a layer, at least one organic layer formed on the auxiliary electrode exposed from the opening of the insulating layer, and the auxiliary electrode exposed from the opening of the insulating layer. A contact portion which is an opening portion of the organic layer, and the organic EL layer and a transparent electrode layer formed on the contact portion, and between the contact portion and the pixel electrode adjacent to the contact portion. The width of the insulating layer is 6 μm or more , And the above transparent electrode layer provides a top emission type organic EL display device characterized by being electrically connected with the auxiliary electrode and the contact portion.

  According to the present invention, when the width of the insulating layer between the contact portion and the pixel electrode adjacent to the contact portion is 6 μm or more, the contact portion formation region and the contact portion formation region are formed in order to form the contact portion. A lid material in contact with the insulating layer between the pixel electrodes adjacent to the organic EL layer side substrate, wherein the pixel electrode, auxiliary electrode, insulating layer and organic EL layer are formed on the substrate; and the lid material The space between the organic EL layer side substrate and the lid material is brought into close contact with each other under reduced pressure, and then the laser light is irradiated to remove the organic layer covering the auxiliary electrode exposed from the opening of the insulating layer. At this time, it is possible to sufficiently prevent the dust or the like of the organic layer removed by the laser light from scattering into the pixel region, and to suppress the deterioration of display characteristics.

  In the present invention, the height of the insulating layer between the contact part and the pixel electrode adjacent to the contact part is x, and the insulation other than between the contact part and the pixel electrode adjacent to the contact part is provided. It is preferable that y−x ≦ 0.05 μm, where y is the highest height of the layers. Since the difference between the height x and the height y is 0.05 μm or less, the insulating layer between the region where the contact portion is formed and the pixel electrode adjacent to the region is formed in order to form the contact portion. The lid material is brought into contact with the substrate, and the space between the organic EL layer side substrate on which the pixel electrode, auxiliary electrode, insulating layer and organic EL layer are formed on the substrate and the lid material is reduced in pressure, and the organic EL layer side When the substrate and the lid member are brought into close contact, the insulating layer between the contact portion and the pixel electrode adjacent to the contact portion and the lid member can be sufficiently brought into close contact with each other. Therefore, it is possible to more effectively prevent dust or the like of the organic layer removed by the laser light when forming the contact portion from being scattered in the pixel region, and suppress deterioration in display characteristics.

  In the present invention, it is preferable that a protruding structure is formed on the insulating layer between at least the contact portion and the pixel electrode adjacent to the contact portion, and the width of the protruding structure is 6 μm or more. . Since the protrusion structure is formed on the insulating layer between the contact portion and the pixel electrode adjacent to the contact portion, the degree of freedom in the height of the insulating layer between the contact portion and the pixel electrode adjacent to the contact portion is increased. It becomes possible to increase the height easily. Therefore, in order to form the contact portion, a cover material is brought into contact with the insulating layer between the region where the contact portion is formed and the pixel electrode adjacent to the region, and the pixel electrode, the auxiliary electrode, and the insulating layer are formed on the substrate. When the space between the organic EL layer side substrate on which the organic EL layer is formed and the lid member is in a reduced pressure state, the insulating layer and the lid member between the contact portion and the pixel electrode adjacent to the contact portion Can be sufficiently adhered. In addition, since the width of the protruding structure is 6 μm or more, the organic layer dust or the like removed by the laser beam when forming the contact portion is more effectively prevented from scattering into the pixel region, and the display characteristics are improved. The decrease can be suppressed.

  The present invention is formed between a substrate, a plurality of pixel electrodes formed on the substrate, an auxiliary electrode formed between the pixel electrodes, and the adjacent pixel electrodes so as to cover an edge portion of the pixel electrode. An insulating layer having an opening so that the auxiliary electrode is exposed; an organic EL layer formed on the pixel electrode and composed of a plurality of organic layers, having at least a light emitting layer; and an opening in the insulating layer At least one layer of the organic layer formed on the auxiliary electrode exposed from the portion, the contact portion being the opening portion of the organic layer formed on the auxiliary electrode exposed from the opening portion of the insulating layer, and the above A transparent electrode layer formed on the organic EL layer and the contact portion, wherein the width of the insulating layer between the contact portion and the pixel electrode adjacent to the contact portion is 6 μm or more, and the transparent electrode layer The above supplement A method of manufacturing a top emission type organic EL display device for manufacturing a top emission type organic EL display device electrically connected to an electrode at the contact portion, the substrate, the pixel electrode, the auxiliary electrode, and the insulation An organic EL layer side substrate preparing step of preparing an organic EL layer side substrate having a layer and the organic EL layer, wherein at least one organic layer is formed on the entire surface of the auxiliary electrode; Then, the organic EL layer side substrate obtained in the organic EL layer side substrate preparation step is opposed to the organic EL layer side substrate, and is arranged so that the lid material contacts the top of the insulating layer via the organic layer. A step of adhering the organic EL layer side substrate and the lid material by adjusting the space of the lid material opposite to the organic EL layer side substrate to a second pressure higher than the first pressure; Through the lid And a contact part forming step of forming the contact part by removing the organic layer covering the auxiliary electrode exposed from the opening of the insulating layer by irradiating a laser beam. A method for manufacturing an EL display device is provided.

  In the present invention, since the width of the insulating layer between the contact portion and the pixel electrode adjacent to the contact portion is 6 μm or more, the dust of the organic layer removed by the laser beam during the contact portion forming step And the like can be more effectively prevented from scattering into the pixel region, and a top emission type organic EL display device capable of suppressing deterioration in display characteristics can be obtained.

  In the present invention, in order to form the contact portion, a cover material is brought into contact with the insulating layer between the region where the contact portion is formed and the pixel electrode adjacent to the region under the first pressure, and the pixel is formed on the substrate. The space between the organic EL layer side substrate on which the electrode, the auxiliary electrode, the insulating layer, and the organic EL layer are formed and the lid is reduced in pressure, and then the space on the opposite side of the lid from the organic EL layer side substrate is the first. The pressure is adjusted to 2 pressure so that the organic EL layer side substrate and the cover are brought into close contact with each other, and then laser is irradiated to remove the organic layer covering the auxiliary electrode exposed from the opening of the insulating layer. It is possible to sufficiently prevent dust or the like of the organic layer removed by light from being scattered in the pixel region, and to suppress the deterioration of display characteristics.

  The “first pressure” and the “second pressure” are not particularly limited as long as the first pressure is lower than the second pressure. Further, the pressure of the space between the organic EL layer side substrate and the lid material when the lid material is disposed on the surface of the organic EL layer side substrate is adjusted to a first pressure, and the organic EL layer of the lid material is further adjusted. When the pressure in the space on the opposite side of the side substrate is adjusted to the second pressure, the pressure between the organic EL layer side substrate and the lid material and the side of the lid material opposite to the organic EL layer side substrate The pressure is not particularly limited as long as the pressure is such that the organic EL layer side substrate and the lid member can be brought into close contact with each other by the differential pressure from the space pressure. Normally, the “first pressure” is lower than the normal pressure, and the “second pressure” is higher than the “first pressure”. Further, since the “first pressure” is described in the section “B. Manufacturing method of organic EL display device” described later, description thereof is omitted here.

It is the schematic which shows an example of the top emission type organic electroluminescence display of this invention. It is process drawing which shows an example of the manufacturing method of the top emission type organic electroluminescent display apparatus in this invention. It is a schematic diagram explaining the contact part in this invention. It is the schematic which shows the other example of the top emission type organic electroluminescence display of this invention. 10 is a graph showing the results of Example 2. It is process drawing which shows an example of the manufacturing method of the conventional top emission type organic electroluminescence display. It is a schematic plan view which shows the other example of the top emission type organic electroluminescence display of this invention.

  Hereinafter, the top emission type organic EL display device of the present invention and the manufacturing method thereof will be described in detail. Hereinafter, the top emission type organic EL display device may be abbreviated as an organic EL display device.

A. Organic EL Display Device The organic EL display device of the present invention covers a substrate, a plurality of pixel electrodes formed on the substrate, an auxiliary electrode formed between the pixel electrodes, and an edge portion of the pixel electrode. Formed between the pixel electrodes adjacent to each other, and has an insulating layer having an opening so that the auxiliary electrode is exposed, and a plurality of organic layers formed on the pixel electrode. An organic EL layer having a light emitting layer; at least one organic layer formed on the auxiliary electrode exposed from the opening of the insulating layer; and formed on the auxiliary electrode exposed from the opening of the insulating layer A contact portion that is an opening of the organic layer, and a transparent electrode layer formed on the organic EL layer and the contact portion, between the contact portion and the pixel electrode adjacent to the contact portion. The width of the insulating layer Is 6 μm or more, and the transparent electrode layer is electrically connected to the auxiliary electrode at the contact portion.

  1A to 1D are schematic views showing an example of the organic EL display device of the present invention. 1B is a cross-sectional view taken along the line AA in FIG. 1A, and FIG. 1C is a cross-sectional view taken along the line BB in FIG. As illustrated in FIGS. 1A to 1C, the organic EL display device 10 of the present invention has the following configuration. That is, a plurality of pixel electrodes 3 are provided on the substrate 2, and auxiliary electrodes 4 are provided between the pixel electrodes 3. An insulating layer 5 is provided between the adjacent pixel electrodes 3 so as to cover the edge portion of the pixel electrode 3. The insulating layer 5 has an opening so that the auxiliary electrode 4 is exposed. Further, the pixel electrode 3 includes an organic EL layer 6 made of a plurality of organic layers and having at least a light emitting layer. The auxiliary electrode 4 exposed from the opening formed in the insulating layer 5 has at least one organic layer, and the at least one organic layer has an opening serving as a contact portion 9. Is formed. Moreover, the transparent electrode layer 7 is provided on the organic EL layer 6 and the contact portion 9, and the transparent electrode layer 7 is electrically connected to the auxiliary electrode 4 at the contact portion 9. Here, in the organic EL display device 10 of the present invention, as illustrated in FIGS. 1A and 1B, the insulation between the contact portion 9 and the pixel electrode 3 adjacent to the contact portion 9. The width w of the layer 5 is 6 μm or more. Note that the description of FIG. 1D will be described later, so the description thereof is omitted here. FIGS. 1A and 1D are obtained by omitting the organic EL layer and the transparent electrode layer from FIGS. 1B and 1C for the sake of simplicity. Further, FIGS. 1A to 1D omit an active matrix driving circuit such as a TFT, a wiring electrode, and a planarizing layer for the sake of simplicity.

  In the present invention, when the width of the insulating layer between the contact portion and the pixel electrode adjacent to the contact portion is 6 μm or more, for example, when an organic EL display device is manufactured by the following method, display characteristics are improved. There exists an effect that a fall can be controlled. Hereinafter, a method for manufacturing an organic EL display device according to the present invention will be described.

  2A to 2F are process diagrams showing an example of a method for manufacturing an organic EL display device according to the present invention. 2 (a) to 2 (f) are schematic cross-sectional views when observed from the same position as FIG. 1 (b), which is a cross-sectional view taken along line AA of FIG. 1 (a). First, as illustrated in FIG. 2A, a pixel electrode and auxiliary electrode forming step for forming the pixel electrode 3 on the substrate 2 and the auxiliary electrode 4 between the pixel electrodes 3 is performed. Next, as illustrated in FIG. 2B, an insulating layer forming step is performed in which an insulating layer 5 is formed so as to cover the edge portion of the pixel electrode 3 and have an opening so that the auxiliary electrode 4 is exposed. . Thereafter, as illustrated in FIG. 2C, an organic EL layer forming step of forming an organic EL layer 6 including a plurality of organic layers and having at least a light emitting layer on the pixel electrode 3 is performed. In the organic EL layer forming step, the organic EL layer 6 is formed, and at least one of the organic layers constituting the organic EL layer 6 is exposed to the auxiliary electrode 4 exposed from the opening of the insulating layer 5. It is formed to cover. In this way, an organic EL layer side substrate preparation step for preparing the organic EL layer side substrate 1 is performed. Next, as illustrated in FIG. 2D, the lid 8 is opposed to the organic EL layer side substrate 1 under the first pressure, and the lid 8 is placed on the top of the insulating layer 5. An arrangement step of arranging so as to be in contact with each other is performed. At this time, the space V between the organic EL layer side substrate 1 and the lid member 8 is in a reduced pressure state. Thereafter, the space P1 on the opposite side of the lid 8 from the organic EL layer side substrate 1 is adjusted to a second pressure higher than the first pressure to bring the organic EL layer side substrate 1 and the lid 8 into close contact. Perform the process. Next, the organic EL layer 6 that covers the auxiliary electrode 4 exposed from the opening of the insulating layer 5 is irradiated with the laser light L through the lid member 8 and illustrated in FIG. Then, a contact part forming step is performed in which the auxiliary electrode 4 is exposed to form the contact part 9. Finally, as illustrated in FIG. 2F, the transparent electrode layer 7 is formed on the organic EL layer side substrate so as to be electrically connected to the auxiliary electrode 4 exposed at the contact portion 9. A transparent electrode layer forming step is performed. Thereby, the organic EL display device 10 according to the present invention is obtained. Here, the “top portion of the insulating layer” refers to the upper bottom surface of the insulating layer 5 when the vertical cross-sectional shape of the insulating layer 5 is a trapezoid as illustrated in FIG. When the vertical cross-sectional shape is a shape other than the trapezoid, it indicates the apex portion of the insulating layer.

  When the organic EL display device of the present invention is manufactured by the manufacturing method as described above, the width of the insulating layer between the contact portion and the pixel electrode adjacent to the contact portion is 6 μm or more. Since it is possible to sufficiently prevent the dust or the like of the organic layer removed by the laser light from being scattered in the adjacent pixel region, it is possible to suppress deterioration in display characteristics. About this reason, the following can be considered. That is, in the organic EL display device of the present invention, the width of the insulating layer between the contact portion and the pixel electrode adjacent to the contact portion is 6 μm or more, by irradiating laser light to remove the organic layer. It means that a partition wall having a width of 6 μm or more is formed between the contact portion to be formed and a neighboring pixel region. Therefore, when the organic EL display device of the present invention is manufactured by the manufacturing method as described above, dust or the like of the organic layer removed by the laser beam in the contact portion forming step is formed by the insulating layer having a width of 6 μm or more. It is presumed that it is possible to sufficiently prevent scattering in the neighboring pixel region and to suppress deterioration in display characteristics.

  Here, in the present invention, the “edge portion of the pixel electrode” refers to a side surface portion of the pixel electrode formed in the substrate internal direction substantially perpendicular to the flat direction of the pixel electrode surface.

  In the present invention, the “at least one organic layer formed on the auxiliary electrode exposed from the opening of the insulating layer” constitutes the organic EL layer 6 as illustrated in FIG. 2C, for example. A mode in which all the layers are formed on the auxiliary electrode 4 exposed from the opening of the insulating layer 5, and in addition to this, the organic EL layer is assumed to be a hole injection layer, a hole transport layer, a light emitting layer, and When the electron injection layer is composed of four layers, three of the four layers are formed in a pattern on the pixel electrode, and the remaining one layer is exposed on the pixel electrode and the opening of the insulating layer. The aspect formed on the auxiliary electrode, or two of the four layers are formed on the pixel electrode, and the remaining two layers are formed on the pixel electrode and the auxiliary electrode exposed from the opening of the insulating layer. And one of the four layers is formed on the pixel electrode. Includes aspects remaining three layers are formed on the auxiliary electrode exposed from the opening on the pixel electrode and the insulating layer or the like.

Furthermore, in the present invention, “the width of the insulating layer between the contact portion and the pixel electrode adjacent to the contact portion” means that the auxiliary electrode 4 is exposed as in a region r shown in FIG. Thus, in the opening formed in the insulating layer 5, the insulating layer 5 between the contact portion 9 formed by removing at least one organic layer and the pixel electrode 3 facing the contact portion 9. 1A and 1B, the distance w ₁ from the end on the auxiliary electrode 4 side of the insulating layer 5 to the end on the opposing pixel electrode 3 side is indicated. Here, FIG. 1 (d) is an enlarged view of the region R in FIG. 1 (a), and reference numerals not described in FIG. 1 (d) may be the same as those in FIG. 1 (a). Since it is possible, description here is abbreviate | omitted.

  Hereinafter, each configuration of the organic EL display device of the present invention will be described.

1. Insulating layer The insulating layer in the present invention is formed between adjacent pixel electrodes so as to cover the edge portion of the pixel electrode, and has an opening so that the auxiliary electrode is exposed. Further, the width of the insulating layer between the contact portion described later and the pixel electrode adjacent to the contact portion is 6 μm or more.

  Since the planar shape of the insulating layer is formed between the pixel electrodes so as to cover the edge portion of the pixel electrode, it is appropriately formed according to the arrangement of the pixel electrodes. For example, it can be formed in a lattice shape. Note that a pixel is defined by the insulating layer.

  The longitudinal sectional shape of the insulating layer in the present invention is not particularly limited as long as it is a shape capable of exhibiting the function as the insulating layer in the present invention. For example, a forward tapered shape, a reverse tapered shape, Although a rectangle etc. are mentioned, it is preferable that it is a forward taper shape especially. This is because a transparent electrode layer, which will be described later, can be uniformly formed on the entire surface, and sufficient conduction can be obtained.

In the insulating layer according to the present invention, a width between a contact portion described later and the pixel electrode adjacent to the contact portion is 6 μm or more. Among them, the thickness is preferably 8 μm or more, and particularly preferably 10 μm or more. A contact portion and a neighboring pixel formed by removing the organic layer by irradiating a laser beam when the width of the insulating layer between the contact portion described later and the pixel electrode adjacent to the contact portion is 6 μm or more. A partition wall having a width of 6 μm or more is formed between the regions. Therefore, when the organic EL display device of the present invention is manufactured by the manufacturing method illustrated in FIGS. 2A to 2F, the dust of the organic layer removed by the laser light L by the insulating layer 5 or the like. Can be sufficiently prevented from being scattered in the vicinity of the pixel region, and deterioration of display characteristics can be suppressed. Further, the upper limit of the width between the contact portion in the insulating layer and the pixel electrode adjacent to the contact portion is particularly limited as long as it does not adversely affect the display characteristics of the organic EL display device of the present invention. However, in general, the size may be about 1/3 of the pixel region, and specifically, it is preferably 40 μm or less. Note that “the width of the insulating layer between the contact portion and the pixel electrode adjacent to the contact portion is 6 μm or more” means that the distance w ₁ shown in FIGS. 1A and 1B corresponds to FIG. ) Indicates that it is 6 μm or more in any part of the region r shown in FIG. Further, the “size of about 1/3 of the pixel region” refers to a size of about 1/3 of the width p of the pixel region shown in FIG.

As the height of the insulating layer, x is the height of the insulating layer between a contact portion and a pixel electrode adjacent to the contact portion, which will be described later, and the insulating layer other than between the contact portion and the pixel electrode adjacent to the contact portion. Of the heights, it is preferable that the following formula (1) is satisfied, where y is the highest height.
y−x ≦ 0.05 μm (1)
In the present invention, the difference between the height y and the height x of the insulating layer is preferably 0.05 μm or less, but the difference between the height y and the height x of the insulating layer is 0.00 μm or less. In particular, the difference between the height y and the height x of the insulating layer is preferably −1.00 μm or less. Thus, it is most preferable that the height x and the height y of the insulating layer satisfy the relationship x> y. When the height x and height y of the insulating layer satisfy the above-described conditions, as shown in FIG. 2D, when the organic EL layer side substrate 1 and the lid member 8 are brought into contact with each other, the contact portion The insulating layer 5 and the lid member 8 between the region to which the laser light L is irradiated and the pixel electrode 3 facing the region can be sufficiently adhered to each other. In this way, the adhesion between the insulating layer at both ends of the region where the contact portion is formed by irradiating the laser beam and the lid material is improved, so that the dust or the like of the organic layer removed by the laser beam irradiation is the pixel region. Can be effectively prevented from being scattered, and a reduction in display characteristics can be suppressed.

  Here, the height x of the insulating layer between the contact portion and the pixel electrode adjacent to the contact portion is formed in the insulating layer 5 so that the auxiliary electrode 4 is exposed as shown in FIG. A pixel electrode covered with an insulating layer 5 in a region r between the contact portion 9 formed by removing at least one organic layer in the opening and the pixel electrode 3 facing the contact portion 9 Among the heights from the surface of 3 to the top of the insulating layer 5, the height of the lowest point is indicated. Of the height of the insulating layer other than between the contact portion and the pixel electrode adjacent to the contact portion, the highest height y is the insulating layer 5 in a region other than the region r shown in FIG. Among the heights from the surface of the pixel electrode 3 covered with the top to the top of the insulating layer 5, the height of the highest portion is indicated. Here, the height x indicates the distance x shown in FIG. 1B, and the height y indicates the distance y shown in FIG. 1C.

  As for the heights x and y of the insulating layer, it is preferable that the above formula (1) is satisfied in a region having a radius of 0.5 mm centering on an arbitrary contact portion. In the region having a radius of 5 mm, particularly in the region having a radius of 50 mm centered on an arbitrary contact portion, the above formula (1) is preferably satisfied. In general, since the substrate such as glass or resin has undulation, the above-described formula (1) may not be satisfied in the whole organic EL display device. However, if the above-described formula (1) is satisfied in the above-described region, The effect of can be sufficiently obtained. That is, in order to obtain the above effect, the above formula (1) does not need to be satisfied in the entire organic EL display device, and the above formula (1) only needs to be satisfied in the above region.

Here, the region in which the radius centered on an arbitrary contact portion is within a predetermined range varies depending on the form of the contact portion. For example, when the contact portion 9 is formed in a dot shape as shown in FIG. 7A, the region is a region having a predetermined radius centered on the center point of the dot-like contact portion 9. Can do. For example, when the contact portion 9 is formed in a stripe shape as shown in FIG. 7B, the region is centered on an arbitrary point located on the center line of the stripe contact portion 9. A region having a predetermined radius may be used. In this case, it is preferable that the above formula (1) is satisfied in all regions within a predetermined radius centering on an arbitrary point located on the center line of the striped contact portion 9.
In FIGS. 7A and 7B, reference numeral 6a denotes at least one organic layer formed not only on the pixel electrode 3 but also on the auxiliary electrode 4. For ease of explanation, an insulating layer 6a is used. The organic EL layer and the transparent electrode layer are omitted, the pixel electrode 3 is indicated by a broken line, and the auxiliary electrode 4 is indicated by an alternate long and short dash line.

  The height of such an insulating layer satisfies the above-described conditions, and is a case where the organic EL display device of the present invention is manufactured by the manufacturing method illustrated in FIGS. 2A to 2F, for example. As illustrated in (d), when the organic EL layer side substrate 1 and the lid member 8 are opposed to each other, as long as the top of the insulating layer and the lid member can be disposed so as to be in contact with each other, it is particularly limited. For example, it is preferably 1.2 μm or more, more preferably 2 μm or more, and particularly preferably 3 μm or more. When the height of the insulating layer is equal to or higher than the above numerical value, as illustrated in FIG. 2D, the organic EL layer side substrate 1 and the lid member 8 are brought into contact with each other under the first pressure, and thereafter When the space P1 of the lid 8 opposite to the organic EL layer side substrate 1 is adjusted to the second pressure and the organic EL layer side substrate 1 and the lid 8 are brought into close contact with each other, the lid 8 is bent and the pixels The problem of contacting the organic EL layer 6 formed on the electrode 3 and adversely affecting the display characteristics of the organic EL display device can be prevented. In addition, since a sufficient space between the organic EL layer side substrate and the lid material can be secured, even if a slight amount of gas enters the space, the organic EL layer side substrate and the lid material It can suppress that the vacuum degree of the space between falls rapidly. Furthermore, the upper limit of the height of the insulating layer is not particularly limited as long as it is a height that does not adversely affect the display characteristics of the organic EL display device of the present invention, but it is, for example, 30 μm or less. Among them, it is preferable that it is 15 micrometers or less, and it is especially preferable that it is 10 micrometers or less. When the height of the insulating layer is not more than the above numerical value, when the sealing substrate is disposed on the surface of the organic EL display device of the present invention, the volume of the space between the organic EL display device and the sealing substrate is large. Can be prevented. Thereby, it is possible to prevent an increase in cost by preventing an increase in the amount of the sealing material used when the space is filled with the sealing material, and to prevent a decrease in transmittance. In addition, problems such as an increase in the thickness of the organic EL display device can be prevented.

  In the insulating layer, the number of openings formed so that the auxiliary electrode is exposed is appropriately adjusted according to the number of contact portions that electrically connect the auxiliary electrode and the transparent electrode, It is not particularly limited.

  Also, the size of the opening formed in the insulating layer is appropriately adjusted according to the size of the contact portion and the number of contact portions described later, and is not particularly limited. A specific size of the opening of the insulating layer is preferably 10 μm or more in the width direction or length direction of the auxiliary electrode, more preferably 20 μm or more, and particularly preferably 30 μm or more. When the size of the opening formed in the insulating layer is in the above range, a sufficient area for forming the contact portion in the opening can be secured. Thereby, a laser beam can be reliably irradiated to the opening part of an insulating layer, and a contact part can be easily formed in the opening part of an insulating layer. Note that the size in the width direction or length direction of the auxiliary electrode in the opening of the insulating layer refers to the distance m or the distance n shown in FIG. 1D, and “10 μm or more in the width direction or length direction of the auxiliary electrode”. The term “is” means that the larger one of the sizes of the openings in the width direction or the length direction of the auxiliary electrode is 10 μm or more.

  As a material of the insulating layer, a material of a general insulating layer in an organic EL display device can be used. For example, a photo-curable resin such as a photosensitive polyimide resin or an acrylic resin, a thermosetting resin, an inorganic material, or the like. Can be mentioned.

  As a method for forming the insulating layer in the present invention, a general method such as a lamination method, a photolithography method, or a printing method can be used.

2. Substrate The substrate in the present invention supports the insulating layer described above, and pixel electrodes, auxiliary electrodes, organic EL layers, and transparent electrode layers described later.

  Since the organic EL display device of the present invention is a top emission type, the substrate may or may not have optical transparency. When the substrate is light transmissive and is a transparent substrate, a double-sided light emitting organic EL display device can be obtained.

  The substrate may or may not have flexibility, and is appropriately selected depending on the use of the organic EL display device. Examples of such a substrate material include glass and resin. A gas barrier layer may be formed on the surface of the substrate.

  The thickness of the substrate is appropriately selected depending on the material of the substrate and the use of the organic EL display device, and is specifically about 0.005 mm to 5 mm.

3. Pixel Electrode A plurality of pixel electrodes in the present invention are formed on a substrate.
The pixel electrode may or may not have optical transparency, but the organic EL display device of the present invention is a top emission type and usually takes out light from the transparent electrode layer side. It is assumed that it does not have transparency. Further, in the case where the pixel electrode is light transmissive and is a transparent electrode, a double-sided light emitting organic EL display device can be obtained.

The pixel electrode may be either an anode or a cathode.
When the pixel electrode is an anode, it is preferable that the resistance is small, and generally a metal material that is a conductive material is used, but an organic compound or an inorganic compound may be used.
For the anode, a conductive material having a large work function is preferably used so that holes can be easily injected. Examples thereof include metals such as Au, Cr, and Mo; inorganic oxides such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide, and indium oxide; and conductive polymers such as metal-doped polythiophene. It is done. These conductive materials may be used alone or in combination of two or more. When two or more types are used, layers made of each material may be stacked.

When the pixel electrode is a cathode, a metal material that is a conductive material is generally used, but an organic compound or an inorganic compound may be used.
For the cathode, it is preferable to use a conductive material having a low work function so that electrons can be easily injected. Examples thereof include magnesium alloys such as MgAg, aluminum alloys such as AlLi, AlCa, and AlMg, and alloys of alkali metals and alkaline earth metals such as Li, Cs, Ba, Sr, and Ca.

  The thickness of the pixel electrode is appropriately adjusted according to the presence or absence of leakage current from the edge portion of the pixel electrode, and can be set to, for example, about 10 nm to 1000 nm, and preferably about 20 nm to 500 nm. Note that the thickness of the pixel electrode may be the same as or different from the thickness of the auxiliary electrode described later. Note that when the pixel electrode is formed together with an auxiliary electrode described later, the pixel electrode and the auxiliary electrode have the same thickness.

  The method for forming the pixel electrode is not particularly limited as long as the pixel electrode can be formed in a pattern on the substrate, and a general electrode forming method can be employed. For example, the vapor deposition method using a mask, the photolithographic method, etc. are mentioned. Examples of the vapor deposition method include a sputtering method and a vacuum vapor deposition method.

4). Auxiliary Electrode The auxiliary electrode in the present invention is formed between the pixel electrodes.
The auxiliary electrode may or may not have optical transparency.

A metal material that is a conductive material is generally used for the auxiliary electrode. Note that the material used for the auxiliary electrode can be the same as the material used for the pixel electrode, and thus the description thereof is omitted here.
The material used for the auxiliary electrode may be the same as or different from the material used for the pixel electrode. Among these, the pixel electrode and the auxiliary electrode are preferably made of the same material. This is because the pixel electrode and the auxiliary electrode can be formed collectively, and the manufacturing process can be simplified.

  The thickness of the auxiliary electrode is appropriately adjusted according to the presence or absence of leakage current from the edge portion of the auxiliary electrode, and is preferably in the range of 10 nm to 1000 nm, for example, in particular in the range of 20 nm to 500 nm. Is preferred. Note that when the auxiliary electrode is formed together with the above-described pixel electrode, the pixel electrode and the auxiliary electrode have the same thickness.

  Further, the interval between the adjacent pixel electrode and the auxiliary electrode when the auxiliary electrode is formed between the pixel electrodes is not particularly limited as long as an insulating layer described later can be formed. Specifically, it is preferably in the range of 1 μm to 50 μm, and more preferably in the range of 2 μm to 30 μm. Note that the interval between adjacent pixel electrodes and auxiliary electrodes refers to the distance d shown in FIG.

  The shape when such an auxiliary electrode is observed in the thickness direction of the auxiliary electrode, that is, a planar shape, is a shape that can exhibit the function of the auxiliary electrode to suppress a voltage drop due to the resistance of the transparent electrode layer. Although not particularly limited, it is preferable that the pixel region of the organic EL display device has a shape that ensures a sufficient pixel area and does not deteriorate display characteristics. For example, a stripe shape or a lattice shape can be used.

  The method for forming the auxiliary electrode is not particularly limited as long as the auxiliary electrode can be formed in a pattern on the substrate, and a general electrode forming method can be employed. A specific method for forming the auxiliary electrode can be the same as the method for forming the pixel electrode, and thus description thereof is omitted here. In the present invention, the auxiliary electrode is preferably formed together with the pixel electrode. This is because the manufacturing process can be simplified.

5. Organic EL Layer The organic EL layer in the present invention is formed on the pixel electrode, is composed of a plurality of organic layers, and has at least a light emitting layer. In addition, at least one organic layer is formed on the auxiliary electrode exposed from the opening of the insulating layer.

Examples of the organic layer constituting such an organic EL layer include a hole injection layer, a hole transport layer, an electron injection layer, and an electron transport layer in addition to the light emitting layer. Therefore, at least an organic layer such as a hole injection layer, a hole transport layer, an electron injection layer, or an electron transport layer is formed on the auxiliary electrode exposed from the opening of the insulating layer.
Hereinafter, each organic layer constituting the organic EL layer will be described.

(1) Light-emitting layer The light-emitting layer may be a single-color light-emitting layer or a multi-color light-emitting layer, and is appropriately selected according to the use of the organic EL display device. A light emitting layer is formed.

  The light emitting material used for the light emitting layer may be any material that emits fluorescence or phosphorescence, and examples thereof include dye materials, metal complex materials, and polymer materials. Note that specific pigment materials, metal complex materials, and polymer materials can be the same as those generally used, and thus description thereof is omitted here.

  The thickness of the light-emitting layer is not particularly limited as long as it can provide a function of emitting light by providing a recombination field of electrons and holes, and may be, for example, about 10 nm to 500 nm. it can.

  Examples of the method for forming the light emitting layer include a wet process in which a light emitting layer forming coating solution in which a light emitting material or the like is dissolved or dispersed in a solvent, a dry process such as a vacuum deposition method, and the like. Among these, a dry process is preferable because of the influence on the light emission efficiency and life of the organic EL display device.

(2) Hole Injecting and Transporting Layer As the organic EL layer in the present invention, a hole injecting and transporting layer may be formed between the light emitting layer and the anode.
The hole injection transport layer may be a hole injection layer having a hole injection function, or a hole transport layer having a hole transport function, and the hole injection layer and the hole transport layer are laminated. And may have both a hole injection function and a hole transport function.

  The material used for the hole injecting and transporting layer is not particularly limited as long as it can stabilize the injection and transportation of holes to the light emitting layer, and a general material can be used. .

  The thickness of the hole injecting and transporting layer is not particularly limited as long as the hole injecting function and the hole transporting function are sufficiently exhibited. Specifically, the thickness is in the range of 0.5 nm to 1000 nm, particularly 10 nm to It is preferable to be in the range of 500 nm.

  The method for forming the hole injecting and transporting layer is not particularly limited as long as it can be formed on at least the pixel electrode, and is appropriately selected according to the kind of material. For example, a wet process in which a coating solution for forming a hole injection transport layer in which a material or the like is dissolved or dispersed in a solvent is applied, a dry process such as a vacuum deposition method, or the like can be given.

(3) Electron Injecting and Transporting Layer As the organic EL layer in the present invention, an electron injecting and transporting layer may be formed between the light emitting layer and the cathode.
The electron injection / transport layer may be an electron injection layer having an electron injection function, may be an electron transport layer having an electron transport function, or may be a laminate of an electron injection layer and an electron transport layer. It may have both an electron injection function and an electron transport function.

The material used for the electron injection layer is not particularly limited as long as it can stabilize the injection of electrons into the light emitting layer, and the material used for the electron transport layer is from the cathode. The material is not particularly limited as long as the injected electrons can be transported to the light emitting layer.
A general material can be used as a specific material used for the electron injection layer and the electron transport layer.

  The thickness of the electron injection / transport layer is not particularly limited as long as the electron injection function and the electron transport function are sufficiently exhibited.

  The method for forming the electron injecting and transporting layer is appropriately selected according to the type of material. For example, a wet process in which a coating solution for forming an electron injecting and transporting layer in which a material or the like is dissolved or dispersed in a solvent is applied, and a dry process such as a vacuum deposition method is used.

6). Contact part The contact part in this invention is an opening part of the said organic layer formed on the said auxiliary electrode exposed from the opening part of the said insulating layer.

  The planar shape of the contact portion in the present invention is not particularly limited as long as the transparent electrode layer and the auxiliary electrode, which will be described later, can be electrically connected sufficiently. A circular shape etc. are mentioned.

  Moreover, the aspect of the contact portion is not particularly limited as long as it can electrically connect a transparent electrode layer and an auxiliary electrode described later sufficiently. FIG. 3A to FIG. 3C are schematic diagrams for explaining aspects of the contact portion in the present invention. A specific mode of the contact portion 9 is a mode in which at least one organic layer 6a formed on the auxiliary electrode 4 is removed in a stripe shape as shown in FIG. Alternatively, as shown in FIG. 3 (b), an embodiment in which an opening is provided in at least one organic layer 6a formed on the auxiliary electrode 4 may be used. As shown in FIG. 3, the organic layer 6a formed on the auxiliary electrode 4 may be provided with a plurality of openings.

  In the method for forming the contact portion in the present invention, for example, as illustrated in FIG. 2D, the organic layer that covers the auxiliary electrode 4 by irradiating the organic EL layer side substrate 1 with the laser light L through the lid 8 is used. The method of forming by removing is mentioned.

The laser light used for forming the contact portion is particularly limited as long as it can remove the organic layer that passes through the cover material and covers the auxiliary electrode when irradiated through the cover material. Instead, a laser beam generally used in a method for removing the organic layer with a laser beam can be employed. The wavelength range of the laser light is not particularly limited as long as it is a wavelength range that can pass through the lid used in the above-described method and efficiently remove the organic layer. It is preferable that The specific ultraviolet region is preferably within a range of 300 nm to 400 nm, more preferably within a range of 320 nm to 380 nm, and particularly preferably within a range of 340 nm to 360 nm. Examples of laser light having such a wavelength range include solid lasers such as YAG and YVO ₄ , excimer lasers such as XeCl and XeF, and semiconductor lasers.

  Further, the laser beam may be a pulse laser or a continuous wave laser, and among these, a pulse laser is preferable. Since the pulse laser has a high peak value, the organic layer covering the auxiliary electrode can be efficiently removed. On the other hand, because of the high output, the organic layer removed by the pulse laser is likely to scatter and there is a possibility that the contamination of the pixel region becomes wide. On the other hand, in the present invention, scattering of the organic layer can be prevented, which is useful when a pulse laser is used.

  In the case of a pulse laser, the pulse width is preferably in the range of 0.01 nanoseconds to 100 nanoseconds. The repetition frequency is preferably in the range of 1 kHz to 1000 kHz. The output is appropriately adjusted as long as the organic layer can be removed.

7). Transparent electrode layer The transparent electrode layer in the present invention is formed on the organic EL layer and the contact portion.

  The said transparent electrode layer should just have transparency and electroconductivity, for example, a metal oxide is mentioned. Specific examples of the metal oxide include indium tin oxide, indium oxide, indium zinc oxide, zinc oxide, and stannic oxide. In addition, metal materials such as magnesium-silver alloy, aluminum, and calcium can also be used when forming a film thin enough to have light transmittance.

  As a method for forming the transparent electrode layer in the present invention, the transparent electrode layer can be formed on the organic EL layer and the contact portion so as to be electrically connected to the auxiliary electrode exposed at the contact portion. There is no particular limitation as long as it is present, and a general electrode forming method can be used. For example, a vacuum deposition method, a sputtering method, an EB deposition method, a PVD method such as an ion plating method, a CVD method, or the like can be given.

8). Projecting Structure In the present invention, it is preferable that a projecting structure is formed on the insulating layer between at least the contact portion and the pixel electrode adjacent to the contact portion. Since the protrusion structure is formed on the insulating layer between the contact portion and the pixel electrode adjacent to the contact portion, the degree of freedom in the height of the insulating layer between the contact portion and the pixel electrode adjacent to the contact portion is increased. It becomes possible to increase the height easily. Therefore, when the space between the organic EL layer side substrate and the lid material is in a reduced pressure state in order to form the contact portion, the protruding structure and the lid material can be sufficiently adhered, It is possible to effectively prevent dust or the like of the organic layer removed by light from being scattered in the pixel region.

  4A to 4D are schematic views illustrating other examples of the organic EL display device of the present invention. 4B is a cross-sectional view taken along the line C-C in FIG. 4A, and FIG. 4C is a cross-sectional view taken along the line D-D in FIG. The organic EL display device 10 of the present invention may have a protruding structure 11 as illustrated in FIGS. 4 (a) to 4 (c). That is, a plurality of pixel electrodes 3 are provided on the substrate 2, and auxiliary electrodes 4 are provided between the pixel electrodes 3. An insulating layer 5 is provided between the adjacent pixel electrodes 3 so as to cover the edge portion of the pixel electrode 3. The insulating layer 5 has an opening so that the auxiliary electrode 4 is exposed. Furthermore, a protruding structure 11 is provided on the insulating layer 5 between the opening formed in the insulating layer 5 and the neighboring pixel electrode 3. Further, the pixel electrode 3 includes an organic EL layer 6 which is composed of a plurality of organic layers and has at least a light emitting layer. The auxiliary electrode 4 exposed from the opening formed in the insulating layer 5 has at least one organic layer, and the at least one organic layer has an opening serving as a contact portion 9. Is formed. Moreover, the transparent electrode layer 7 is provided on the organic EL layer 6 and the contact portion 9, and the transparent electrode layer 7 is electrically connected to the auxiliary electrode 4 at the contact portion 9. Here, in the organic EL display device 10 of the present invention having a protruding structure, as illustrated in FIGS. 4A and 4B, at least the contact portion 9 and the pixel electrode adjacent to the contact portion 9. The width of the protruding structure 11 formed on the insulating layer 5 between 3 is 6 μm or more. Note that the description of FIG. 4D will be described later, so description thereof is omitted here. 4A and 4D are obtained by omitting the organic EL layer and the transparent electrode layer from FIGS. 4B and 4C for the sake of simplicity. Further, in FIGS. 4A to 4D, the active matrix driving circuit such as the TFT, the wiring electrode, and the planarization layer is omitted for the sake of simplicity.

  A planar shape of the protruding structure is appropriately formed according to the shape of the insulating layer, and is formed on the insulating layer at least between the contact portion and the pixel electrode adjacent to the contact portion. There is no particular limitation as long as the above-described predetermined effect can be obtained. For example, as illustrated in FIG. 4A, the protruding structure 11 according to the present invention is formed in an island shape on the insulating layer 5 between the contact portion and the pixel electrode 3 adjacent to the contact portion. Although not shown, it is formed in a stripe shape so as to be formed on the insulating layer between the contact portion and the pixel electrode adjacent to the contact portion. Furthermore, it is formed in a lattice shape along the shape of the insulating layer so as to be formed on the insulating layer between the contact portion and the pixel electrode adjacent to the contact portion. Also good. Among them, the protruding structure in the present invention is preferably formed in an island shape on the insulating layer between the contact portion and the pixel electrode adjacent to the contact portion. This is because the predetermined effect by providing the protruding structure appears more remarkably.

  The longitudinal cross-sectional shape of the protruding structure in the present invention is not particularly limited as long as it is a shape capable of exhibiting the function as the protruding structure in the present invention. For example, a forward tapered shape or a reverse tapered shape is used. A shape, a rectangle, etc. are mentioned, Among these, a forward taper shape is preferable. This is because a transparent electrode layer, which will be described later, can be uniformly formed on the entire surface, and sufficient conduction can be obtained.

The width of the protruding structure formed on the insulating layer between the contact portion and the pixel electrode adjacent to the contact portion is not particularly limited as long as it is 6 μm or more. Is appropriately adjusted according to the above. Especially, it is preferable that it is 8 micrometers or more, and it is especially preferable that it is 10 micrometers or more. When the protrusion structure has a width of 6 μm or more, a partition wall having a width of 6 μm or more is formed between a contact portion formed by irradiating a laser beam and removing the organic layer and a neighboring pixel region. Will be. Therefore, when the organic EL display device of the present invention is manufactured by the manufacturing method illustrated in FIGS. 2A to 2F, dust or the like of the organic layer removed by the laser beam by the protruding structure is generated. It is possible to sufficiently prevent scattering to neighboring pixel regions and to suppress deterioration of display characteristics. In addition, the upper limit of the width of the protruding structure is not particularly limited as long as it can be formed on the insulating layer and does not adversely affect the display characteristics of the organic EL display device of the present invention. However, in general, the size may be about 1/3 of the pixel region, and specifically, it is preferably 40 μm or less. Note that “the width of the protruding structure between the contact portion and the pixel electrode adjacent to the contact portion is 6 μm or more” means that w ₂ in FIGS. 4A and 4B corresponds to FIG. In any part of the region f shown in FIG. Here, FIG. 4D is an enlarged view of the region F in FIG. 4A, and the reference numerals not described in FIG. 4D may be the same as those in FIG. Since it is possible, description here is abbreviate | omitted.

When the protruding structure is formed, the height of the protruding structure is the same as that described in the section “1. Insulating layer”, and the pixel adjacent to the contacting part. The height of the insulating layer between the electrodes and the protruding structure is x1, and the height of the insulating layer other than between the contact portion and the pixel electrode adjacent to the contact portion, or the height of the insulating layer and the protruding structure. Among these, when the highest height is y1, it is preferable that the following formula (2) holds.
y1-x1 ≦ 0.05 μm (2)
In the present invention, the difference between the height y1 and the height x1 is preferably 0.05 μm or less, and the difference between the height y1 and the height x1 is preferably 0.00 μm or less. In particular, the difference between the height y1 and the height x1 is preferably −1.00 μm or less. Thus, it is most preferable that the height x1 and the height y1 satisfy the relationship x1> y1. The reason why the difference between the height y1 and the height x1 preferably satisfies the above condition is as follows. The height y and the height x of the insulating layer described in the section “1. Since it can be the same as the description of the difference, the description is omitted here.

  Here, the height x1 of the insulating layer between the contact portion and the pixel electrode adjacent to the contact portion and the protruding structure is an insulating layer so that the auxiliary electrode 4 is exposed as shown in FIG. 5 in the region f between the contact portion 9 formed by removing at least one organic layer and the pixel electrode 3 facing the contact portion 9 in the opening formed in the insulating layer 5. Of the height from the surface of the covered pixel electrode 3 to the top of the protruding structure 11 formed on the insulating layer 5, the height is the lowest. Also, the highest height y1 among the height of the insulating layer other than between the contact portion and the pixel electrode adjacent to the contact portion, or the height between the insulating layer and the protruding structure is shown in FIG. In a region other than the region f shown, the height of the highest portion of the height to the top of the insulating layer 5 or the height to the top of the protruding structure 11 formed on the insulating layer 5 is indicated. Here, the height x1 indicates the distance x1 shown in FIG. 4B, and the height y1 indicates the distance y1 shown in FIG. 4C. Further, the “top portion of the protruding structure” described above refers to the upper bottom surface of the protruding structure 11 when the vertical cross-sectional shape of the protruding structure 11 is a trapezoid as illustrated in FIG. When the vertical cross-sectional shape of the protruding structure is a shape other than the trapezoid, it indicates the apex portion of the protruding structure.

  As for the above-described heights x1 and y1, as in the case of the heights x and y of the insulating layer described in the section “1. In the above, it is preferable that the above formula (2) is satisfied, and in particular, in the region having a radius of 5 mm centering on an arbitrary contact portion, particularly in the region having a radius of 50 mm centering on an arbitrary contact portion, It is preferable that 2) holds. In general, since the substrate such as glass or resin has undulations, the above formula (2) may not be satisfied in the whole organic EL display device. However, if the above formula (2) is satisfied in the above region, The effect of can be sufficiently obtained. That is, in order to obtain the above-described effect, the above formula (2) does not need to be satisfied in the entire organic EL display device, and the above formula (2) only needs to be satisfied in the above region.

  In addition, the region in which the radius centered on an arbitrary contact portion is in a predetermined range is the same as that described in the above section “1. Insulating layer”.

  The specific height of the protruding structure is not particularly limited as long as the protruding structure is high enough to exhibit the function of the present invention, and depends on the height of the insulating layer. Are adjusted accordingly. For example, it is preferably within a range of 1 μm to 10 μm, more preferably within a range of 1.5 μm to 8 μm, and particularly preferably within a range of 2 μm to 5 μm. Note that the height of the protrusion structure between the contact portion and the pixel electrode adjacent to the contact portion is a protrusion structure from the top of the insulating layer 5 on which the protrusion structure 11 is formed, as shown in FIG. The distance t to the top of the object 11 is indicated.

  The material used for the protruding structure is not particularly limited as long as it does not adversely affect the characteristics of the organic EL display device of the present invention. For example, photosensitive polyimide resin, acrylic resin, etc. Insulating materials such as photocurable resins or thermosetting resins and inorganic materials. In addition, a conductive material can also be used.

  As a method for forming the protruding structure in the present invention, general methods such as a lamination method, a photolithography method, and a printing method can be used.

9. Other Configurations The present invention is not particularly limited as long as it has the above-described configuration, and may have other configurations. Examples of other configurations include a sealing substrate that seals the organic EL display device.
Hereinafter, the sealing substrate will be described.

Since the organic EL display device of the present invention is a top emission type, the sealing substrate has light transmittance. The light transmittance of the sealing substrate only needs to be transparent to the wavelength in the visible light region. Specifically, the light transmittance for the entire wavelength range in the visible light region is 80% or more. Of these, 85% or more, particularly 90% or more is preferable.
Here, the light transmittance can be measured by, for example, an ultraviolet-visible light spectrophotometer UV-3600 manufactured by Shimadzu Corporation.

  Further, the sealing substrate may or may not have flexibility, and is appropriately selected depending on the use of the organic EL display device.

  The material of the sealing substrate is not particularly limited as long as a light-transmitting sealing substrate can be obtained. For example, inorganic materials such as quartz and glass, acrylic resin, and COP are used. Examples thereof include resins such as cycloolefin polymer, polycarbonate, polyethylene terephthalate, polybutylene terephthalate, polyphenylene sulfide, polyimide, polyamideimide, polyethersulfone, polyetherimide, and polyetheretherketone. A gas barrier layer may be formed on the surface of the resin sealing substrate.

  The thickness of the sealing substrate is appropriately selected depending on the material of the sealing substrate and the use of the organic EL device. Specifically, the thickness of the sealing substrate is about 0.001 mm to 5 mm.

10. Organic EL Display Device The organic EL display device of the present invention may be any device that can extract light from at least the transparent electrode layer side, and may be a top emission type that extracts light from the transparent electrode layer side. A double-sided light emitting type in which light is extracted from both sides of the electrode may be used.

B. Manufacturing method of organic EL display device The manufacturing method of the organic EL display device of the present invention includes a substrate, a plurality of pixel electrodes formed on the substrate, an auxiliary electrode formed between the pixel electrodes, and an edge of the pixel electrode. An insulating layer is formed between the adjacent pixel electrodes so as to cover a portion, and has an opening so that the auxiliary electrode is exposed. The insulating layer is formed on the pixel electrode, and includes a plurality of organic layers. An organic EL layer having at least a light emitting layer, at least one organic layer formed on the auxiliary electrode exposed from the opening of the insulating layer, and formed on the auxiliary electrode exposed from the opening of the insulating layer A contact portion that is an opening of the organic layer, and a transparent electrode layer formed on the organic EL layer and the contact portion, between the contact portion and the pixel electrode adjacent to the contact portion. Up The insulating layer has a width of 6 μm or more, and the transparent electrode layer is a manufacturing method for manufacturing an organic EL display device that is electrically connected to the auxiliary electrode at the contact portion. An organic EL layer side substrate comprising an electrode, the auxiliary electrode, the insulating layer, and the organic EL layer, and an organic EL layer side substrate having at least one organic layer formed on the entire surface of the auxiliary electrode A cover material is made to face the organic EL layer side substrate obtained in the preparation step and the organic EL layer side substrate preparation step under a first pressure, and the cover material is placed on the top of the insulating layer via the organic layer. And an adhesion step of adjusting the space on the opposite side of the organic EL layer side substrate of the lid material to a second pressure to bring the organic EL layer side substrate and the lid material into close contact with each other. And irradiate laser light through the lid, And removing the organic layer covering the auxiliary electrodes exposed from the opening of the serial insulating layer is a manufacturing method characterized in that it comprises a contact portion forming step of forming the contact portion.

  2A to 2F are process diagrams showing an example of a method for manufacturing an organic EL display device of the present invention. 2A to 2F can be the same as the contents described in the section “A. Organic EL display device”, and the description is omitted here. .

  According to the present invention, since the width of the insulating layer between the contact portion and the pixel electrode adjacent to the contact portion is 6 μm or more, the organic layer removed by the laser beam during the contact portion forming step It is possible to obtain an organic EL display device that can more effectively prevent dust and the like from being scattered in the pixel region and suppress deterioration in display characteristics. In addition, since it can be the same as that of what was described in the term of the said "A. organic EL display apparatus" about the specific reason which has the above effects, description here is abbreviate | omitted.

  Here, in the present invention, “arranged so that the lid material is in contact with the top of the insulating layer via the organic layer” means that the insulating layer 5 has a structure as illustrated in FIG. An aspect in which the lid 8 is arranged in contact with the top via the organic EL layer 6, or although not shown, the lid is in contact with the top of the insulating layer via at least one organic layer. The arrangement | positioning etc. are included.

  Hereinafter, each process which comprises the manufacturing method of the organic electroluminescence display of this invention is demonstrated.

1. Organic EL layer side substrate preparation step The organic EL layer side substrate preparation step in the present invention includes the substrate, the pixel electrode, the auxiliary electrode, the insulating layer, and the organic EL layer, and is disposed on the entire surface of the auxiliary electrode. This is a step of preparing an organic EL layer side substrate on which at least one organic layer is formed.
Hereinafter, each process which comprises an organic EL layer side board | substrate preparatory process is demonstrated.

(1) Pixel electrode and auxiliary electrode forming step The pixel electrode and auxiliary electrode forming step in the present invention is a step of forming a plurality of pixel electrodes on a substrate and forming auxiliary electrodes between the pixel electrodes.

  The substrate, the pixel electrode, and the auxiliary electrode used in this step are the same as those described in the above section “A. Organic EL display device 2. Substrate” to “A. Organic EL display device 4. Auxiliary electrode”. Therefore, the description here is omitted.

(2) Insulating layer forming step The insulating layer forming step in the present invention is a step of forming an insulating layer so as to cover the edge portion of the pixel electrode between the adjacent pixel electrodes. Note that the insulating layer formed in this step has an opening so that the auxiliary electrode is exposed.

  The insulating layer formed in this step can be the same as that described in the above section “A. Organic EL display device 1. Insulating layer”, and thus description thereof is omitted here.

(3) Organic EL Layer Forming Step The organic EL layer forming step in the present invention is a step of forming an organic EL layer having a plurality of organic layers and having at least a light emitting layer on the pixel electrode.

  In this step, the organic EL layer is formed, and at least one organic layer constituting the organic EL layer is formed so as to cover the auxiliary electrode exposed from the opening of the insulating layer. . For example, when a light emitting layer is separately applied to each pixel of an organic EL display device, a hole injection transport layer and an electron injection transport layer are formed on the pixel electrode and the auxiliary electrode, and the light emitting layer is patterned on the pixel electrode. Formed. When organic layers such as a hole injection transport layer and an electron injection transport layer are formed on the pixel electrode and the auxiliary electrode, the organic layer is continuously formed on the pixel electrode and the auxiliary electrode. It is common.

  In the present invention, for example, a hole injection transport layer, a light emitting layer, and an electron transport layer may be formed in this step, and then the electron injection layer may be formed after a contact portion forming step described later. Even when the electron injection layer formed after the contact portion forming step is formed not only on the pixel electrode but also on the contact portion in the auxiliary electrode, if the electron injection layer is extremely thin, This is because the auxiliary electrode and the transparent electrode layer formed by the transparent electrode layer forming step described later can be electrically connected. As described above, when the electron injection layer is formed after the contact portion formation step, the electron injection layer can be prevented from being deteriorated due to the placement step, the adhesion step, and the contact portion formation step, and thus is relatively unstable. A material such as lithium fluoride can be used as the material of the electron injection layer.

  The organic EL layer formed in this step can be the same as that described in the above section “A. Organic EL display device 5. Organic EL layer”, and thus the description thereof is omitted here.

(4) Other steps The organic EL layer side substrate preparation step in the present invention is not particularly limited as long as it has the above-described pixel electrode and auxiliary electrode formation step, insulating layer formation step, and organic EL layer formation step. There may be other steps, though. For example, there is a protruding structure forming step of forming a protruding structure on at least the contact portion and the insulating layer between the pixel electrodes adjacent to the contact portion.

  The protrusion structure formed in the protrusion structure forming step can be the same as that described in the above section “A. Organic EL display device 8. Projection structure”. Is omitted.

2. Arrangement Step In the arrangement step of the present invention, the lid material is opposed to the organic EL layer side substrate obtained in the organic EL layer side substrate preparation step under the first pressure, and the lid material is placed on the top of the insulating layer. It is the process of arrange | positioning so that it may contact via the said organic layer.
Hereinafter, the lid used in this process and a specific arrangement process will be described.

(1) Lid material The lid material used in this step is one that can face the organic EL layer side substrate and reduce the space between the organic EL layer side substrate and the lid material. For example, a material having translucency such as a glass film, COP, PP, PC, and PET may be used. Of these, glass film, COP, and PET are preferable.

  The thickness of the lid material is such that the space between the organic EL layer side substrate and the lid portion can be in a reduced pressure state by facing the organic EL layer side substrate and the lid material under the first pressure. If it is, it will not specifically limit. For example, it is preferably within a range of 1 μm to 1000 μm, more preferably within a range of 10 μm to 200 μm, and particularly preferably within a range of 30 μm to 100 μm.

Such a lid member preferably has a predetermined barrier property against gas. Since the lid material has a predetermined barrier property against the gas, the space between the lid material and the organic EL layer side substrate is reduced in pressure in this step, and then the contact portion forming step described later is performed. During this, the space between the lid member and the organic EL layer side substrate can be maintained in a decompressed state. Therefore, when the organic layer on the auxiliary electrode is removed by laser light in the contact portion forming step, the adhesion between the lid material and the organic EL layer side substrate is sufficiently maintained, and the dust or the like of the removed organic layer is a pixel. This is because it can be prevented from scattering into the area. The barrier property against the gas of the lid member is not particularly limited as long as the lid member has a barrier property that can exert the above-described effects. For example, the oxygen permeability of the lid member is not limited. It is preferably 100 cc / m ² · day or less, more preferably 30 cc / m ² · day or less, and particularly preferably 15 cc / m ² · day or less.

  The lid material may have a barrier layer formed on the surface. Since the lid material has a barrier layer, gas enters the space between the organic EL layer side substrate and the outer periphery of the lid material into the space between the organic EL layer side substrate and the lid material in the contact portion forming step described later. Can be prevented more effectively.

  As a material of the barrier layer used for the lid member, it can exhibit a desired barrier property against a gas such as oxygen or nitrogen, and can transmit a laser beam used in a contact portion forming step described later. If it is a thing, it will not specifically limit, For example, an inorganic material is mentioned. Specific examples of the inorganic material include silicon oxide, silicon nitride, silicon carbide, titanium oxide, niobium oxide, indium oxide, zinc oxide, tin oxide, tantalum oxide, aluminum oxide, magnesium oxide, calcium oxide, and zirconium oxide. . Moreover, you may use a glass film as a barrier layer.

  The thickness of the barrier layer is not particularly limited as long as the lid material can achieve the above-described average transmittance when the barrier layer is formed on the lid material used in this step. However, it is preferably within the range of 10 nm to 800 nm, for example, preferably within the range of 50 nm to 500 nm, and particularly preferably within the range of 70 nm to 300 nm.

  Examples of the method for forming the barrier layer on the surface of the lid member used in this step include a sputtering method, a vacuum deposition method, a plasma CVD method, and the like. Alternatively, the barrier layer may be formed alone, and the barrier layer may be bonded to the surface of the lid using an adhesive layer made of an adhesive material. The pressure-sensitive adhesive material used for the pressure-sensitive adhesive layer is not particularly limited as long as it can be adhered to the surface of the lid material with a desired strength and transmits laser light used in the contact portion forming step described later. Examples thereof include polycarbonate resin, polyolefin resin, acrylic resin, urethane resin, silicone resin, polyester resin, and epoxy resin. Furthermore, the thickness of the pressure-sensitive adhesive layer is not particularly limited as long as the lid material and the barrier layer can be sufficiently bonded to each other. Specifically, the thickness is set within a range of 5 μm to 50 μm. can do.

  When the lid material used in this step has a barrier layer, the barrier layer may be disposed on one surface of the lid material or may be disposed on both surfaces of the lid material. In addition, when the barrier layer is arrange | positioned at one surface of a cover material, when making the said cover material and an organic EL layer side board | substrate oppose, the barrier layer in the said cover material turns into the organic EL layer side board | substrate side. It may be arranged so that it may be arranged on the side opposite to the organic EL layer side substrate.

Moreover, when using a glass film as a cover material, the resin layer may be formed in the single side | surface or both surfaces of a glass film. Breaking of the glass film can be suppressed. A resin base material can be used as the resin layer. Examples of the material used for the resin substrate include polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyethersulfone (PES), polyimide (PI), polyetheretherketone (PEEK), and polycarbonate (PC). , Polyethylene (PE), polypropylene (PP), polyphenylene sulfide (PPS), polyetherimide (PEI), cellulose triacetate (CTA), cyclic polyolefin (COP), polymethyl methacrylate (PMMA), polysulfone (PSF), polyamideimide (PAI), norbornene resin, allyl ester resin and the like.
The thickness of the resin substrate is not particularly limited as long as a flexible lid can be obtained. For example, the thickness is preferably in the range of 3 μm to 200 μm, and preferably in the range of 5 μm to 200 μm. It is more preferable that
The resin base material can be bonded to the glass film through the adhesive layer. In addition, about the adhesion layer, it can be the same as that of the above-mentioned adhesion layer.

(2) Arrangement step This step is a step of reducing the space between the organic EL layer side substrate and the lid member.

  In the present invention, “under a first pressure, a cover material is opposed to the organic EL layer side substrate obtained in the organic EL layer side substrate preparation step, and the cover material is placed on the top of the insulating layer. Examples of the “arrangement step of arranging so as to be in contact with each other” include the following methods. That is, first, in a vacuum chamber set to a predetermined degree of vacuum that is the first pressure, the organic EL layer side substrate on which the sealing agent is formed on the outer peripheral portion and the lid material are arranged to face each other, and the organic EL layer Examples thereof include a method of bringing the side substrate and the lid material into contact, and a method of bringing the organic EL layer side substrate and the lid material into contact with each other using a jig or the like in a vacuum chamber set to the first pressure.

In the case of using a jig, the jig is not particularly limited as long as the organic EL layer side substrate and the lid material can be brought into contact with each other. Alternatively, a jig that holds and fixes only the lid material so that the lid material does not bend may be used.
Moreover, it is preferable that a jig | tool can seal the space on the opposite side to the organic electroluminescent layer side board | substrate of a cover material. Specifically, a frame-shaped jig can be mentioned. For example, frame-shaped jigs are arranged on both sides of the lid material, and the lid material is attached to the laser light transmission window of the vacuum chamber via the frame-shaped jig arranged on the opposite surface of the organic EL layer side substrate of the lid material. Can be used to seal the space on the side opposite to the organic EL layer side substrate of the lid material, and the pressure on the space on the side opposite to the organic EL layer side substrate of the lid material can be sealed in the adhesion process described below. This is because it can be adjusted. In this case, the organic EL layer side substrate can be placed, for example, on a stage that can move up and down, and the stage is moved upward, and the organic EL layer side substrate is placed on a lid fixed by a frame-shaped jig. By contacting, the space between the organic EL layer side substrate and the lid member can be in a reduced pressure state. For example, an O-ring may be used as a frame-shaped jig disposed on the surface of the lid material opposite to the organic EL layer side substrate.

The space between the organic EL layer side substrate and the lid member has a predetermined degree of vacuum that is the first pressure. Specifically, the space between the organic EL layer side substrate and the lid material and the lid material are adjusted by adjusting the space on the opposite side of the organic EL layer side substrate of the lid material to the second pressure in the adhesion step described later. In the contact part forming step described later, a differential pressure can be generated between the organic EL layer side substrate and the space opposite to the organic EL layer side substrate to sufficiently adhere the organic EL layer side substrate and the lid material. Although it will not specifically limit if the dust of the organic layer removed by a laser beam can be prevented from scattering to a pixel area, the value of the degree of vacuum is as large as possible, that is, the organic EL layer side substrate and the lid material It is preferable that the value of the pressure in the space between is as small as possible. Especially, in this process, it is preferable that the space between the organic EL layer side substrate and the lid member is a vacuum space. The specific degree of vacuum is preferably in the range of 1 × 10 ⁻⁵ Pa to 1 × 10 ⁴ Pa, and more preferably in the range of 1 × 10 ⁻⁵ Pa to 1 × 10 ³ Pa. In particular, it is preferably in the range of 1 × 10 ⁻⁵ Pa to 1 × 10 ² Pa.

3. Adhering step In the present invention, the space on the opposite side of the organic EL layer side substrate of the lid material is adjusted to a second pressure higher than the first pressure to bring the organic EL layer side substrate and the lid material into close contact with each other. An adhesion process is performed.
Hereinafter, a specific adhesion process will be described.

  In this step, the space on the opposite side of the lid from the organic EL layer side substrate is adjusted to the second pressure, so that the space between the organic EL layer side substrate and the lid material, the organic EL layer side substrate of the lid material, Is a step of generating a differential pressure between the opposite space and bringing the organic EL layer side substrate and the lid material into close contact with each other.

  When adjusting the space opposite to the organic EL layer side substrate of the lid to the second pressure, at least the space opposite to the organic EL layer side substrate of the lid may be adjusted to the second pressure, For example, only the space opposite to the organic EL layer side substrate of the lid material may be adjusted to the second pressure, and the outer space of the lid material and the organic EL layer side substrate may be adjusted to the second pressure.

  As a method for adjusting the space on the side opposite to the organic EL layer side substrate of the lid to the second pressure, the space between the organic EL layer side substrate and the lid and the side opposite to the organic EL layer side substrate of the lid Although it will not specifically limit if it is a method which produces a differential pressure between this space and can make an organic EL layer side board | substrate and a cover material contact | adhere, For example, the following methods are mentioned. That is, by exposing the organic EL layer side substrate and the lid material brought into contact with each other in the vacuum chamber to a normal pressure space, the outer peripheral space of the organic EL layer side substrate and the lid material is returned to normal pressure, And the like, after the space between the organic EL layer side substrate and the lid member is in a reduced pressure state, a gas is flowed into the vacuum chamber to pressurize. In addition, as said "normal pressure space" in the case of performing an adhesion | attachment process by the method which exposes the contacted organic EL layer side board | substrate and cover material to normal pressure space, from a viewpoint of suppressing deterioration of an organic EL display element, for example, The space preferably has an oxygen concentration and a water concentration of at least 1 ppm or less and is filled with an inert gas such as nitrogen or argon. In addition, when a gas is flowed into the vacuum chamber and pressurized, the gas may flow into the entire vacuum chamber, or the gas may flow into only the space on the side opposite to the organic EL layer side substrate of the lid. Also good. As described above, for example, when a frame-shaped jig is used, the space on the side opposite to the organic EL layer side substrate of the lid can be sealed, and the organic EL can be obtained by flowing gas into this space. A layer side board | substrate and a cover material can be stuck. The gas flowing into the vacuum chamber is preferably an inert gas such as nitrogen or argon for the same reason as described above.

  The “second pressure” is a pressure higher than the first pressure in the disposing step, and the lid material can be brought into close contact with the organic EL layer side substrate by the differential pressure between the first pressure and the second pressure. For example, the second pressure is preferably 100 Pa or more higher than the first pressure, more preferably 1000 Pa or more, and particularly preferably 10,000 Pa or more. When the differential pressure between the second pressure and the first pressure is equal to or higher than the above numerical value, the lid member can be sufficiently adhered to the organic EL layer side substrate.

4). Contact part forming step The contact part forming step in the present invention is performed by irradiating a laser beam through the lid material, removing the organic layer covering the auxiliary electrode exposed from the opening of the insulating layer, and the contact part. Is a step of forming.

  In this step, as described in the section “2. Arrangement step” above, the space between the organic EL layer side substrate and the lid member and at least the space on the opposite side of the lid member from the organic EL layer side substrate are provided. It is performed in a state where there is a predetermined differential pressure between them. In addition, when using the method of making gas flow into a vacuum chamber and pressurizing as the contact | adherence process mentioned above, this process can be performed by the following methods, for example. That is, a contact portion is formed by irradiating a laser beam through a laser beam transmitting window or the like installed in a vacuum chamber composed of a transparent substrate such as glass and removing the organic layer covering the auxiliary electrode. Is the method.

  About the contact part formed in this process, since it can be made to be the same as that of what was described in the above-mentioned item of "A. Organic EL display device 6. Contact part", description here is abbreviate | omitted.

5. Transparent electrode layer forming step The transparent electrode layer forming step in the present invention is performed on the organic EL layer side substrate so that the lid member is peeled off and electrically connected to the auxiliary electrode exposed at the contact portion. This is a step of forming a transparent electrode layer.

  The transparent electrode layer formed in this step can be the same as that described in the above section “A. Organic EL display device 7. Transparent electrode layer”, and thus the description thereof is omitted here.

6). Other Steps In the present invention, there are no particular limitations as long as the steps described above are included, but other steps may be included. Examples of other processes include a sealing substrate forming process for sealing the organic EL display device.

  The sealing substrate can be the same as that described in the above section “A. Organic EL display device 9. Other configurations”, and thus description thereof is omitted here.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has substantially the same configuration as the technical idea described in the claims of the present invention, and any device that exhibits the same function and effect is the present invention. It is included in the technical scope of the invention.

  Hereinafter, the present invention will be specifically described with reference to examples.

[Example 1]
(Pixel electrode and auxiliary electrode formation process)
A chromium film having a thickness of 150 nm was formed by sputtering on a substrate made of alkali-free glass having a thickness of 0.7 mm. Thereafter, a pixel electrode and an auxiliary electrode were simultaneously formed by photolithography.

(Insulating layer formation process)
Next, an insulating layer was formed between the pixel electrodes by a photolithography method so as to cover the edge portion of the pixel electrode and to have an opening through which the auxiliary electrode was exposed. In addition, the longitudinal cross-sectional shape of the insulating layer was a forward taper shape. Further, the width and height of the insulating layer between the contact portion to be formed later and the pixel electrode adjacent to the contact portion were adjusted as shown in Table 1 below. Here, the width of the insulating layer in the the FIG. 1 (a), refers to w ₁ shown in (b), the height of the insulating layer refers to x shown in FIG. 1 (b).

(Organic EL layer formation process)
Next, a 0.1 μm hole injection layer was formed on the pixel electrode, and then a 0.3 μm light emitting layer was formed on the hole injection layer. Thereafter, an electron transport layer having a thickness of 0.3 μm was formed on the light emitting layer to obtain an organic EL layer. The organic EL layer was formed on the pixel electrode and also on the auxiliary electrode exposed from the opening of the insulating layer.

(Sealing material forming process)
A sealant was formed on the outer periphery of the pattern of the organic EL layer side substrate using a dispenser.

(Arrangement process and adhesion process)
Next, in the vacuum chamber, the lid material is opposed to the organic EL layer side substrate, the lid material is brought into contact with the surface of the organic EL layer side substrate, and the space between the organic EL layer side substrate and the lid material is decompressed. It was in a state. Thereafter, nitrogen gas was introduced into the vacuum chamber to return the inside of the chamber to normal pressure, and the organic EL layer side substrate and the lid member were brought into close contact with each other. In addition, this process was performed on two conditions, the case where the vacuum chamber which set the vacuum degree to 50 Pa was used, and the case where the vacuum chamber which set the vacuum degree to 500 Pa was used. Further, a PET film having a thickness of 100 μm was used as the lid material.

(Contact part formation process)
Next, one shot of YAG laser light having an energy of 500 mJ / cm ² , a spot diameter of 10 μmφ, a wavelength of 355 nm, and a pulse width of 5 nsec is irradiated through the cover material to cover the auxiliary electrode, a hole injection layer, a light emitting layer, and an electron transport layer Then, the auxiliary electrode was exposed to form a contact portion.

(Electron injection layer and transparent electrode layer forming step)
Thereafter, the lid material is peeled off, and lithium fluoride is deposited by vacuum deposition so as to have a thickness of 0.5 nm so as to be electrically connected to the auxiliary electrode exposed at the contact portion, and the electron injection layer is formed. Formed. Next, the film was formed by vacuum deposition so that the calcium film thickness was 10 nm and the aluminum film thickness was 5 nm to form a transparent electrode layer.

(Sealing process)
The organic EL display device manufactured as described above was bonded and sealed to a sealing substrate coated with an adhesive.

(Evaluation)
No. shown in Table 1 above. The space between the lid material and the organic EL layer side substrate is reduced to a reduced pressure state under conditions of a vacuum degree of 50 Pa and 500 Pa using the insulating layers of 1 to 5, and then the adhesion process and the contact part forming process are performed. The presence or absence of scattering of the organic layer on the surface of the organic EL layer in the pixel region was observed. "A" if scattering of the organic layer to the surface of the organic EL layer in the pixel area can be prevented, and "B" if scattering of the organic layer to the surface of the organic EL layer in the pixel area cannot be prevented. evaluated.
The evaluation results are shown in Table 2.

  As shown in Table 2, in both the case where the degree of vacuum in the vacuum chamber was set to 50 Pa and the degree of vacuum in the vacuum chamber was set to 500 Pa in the placement step, No. 2-No. The space between the organic EL layer side substrate having the insulating layer 5 and the lid material was reduced in pressure, and the organic EL layer side substrate and the lid material were brought into close contact with each other, thereby being removed by the laser light in the contact portion forming step. It was possible to prevent dust on the organic layer from being scattered on the surface of the organic EL layer in the pixel region. Accordingly, when the width of the insulating layer is 6 μm or more, a predetermined distance is generated between the region irradiated with the laser beam and the neighboring pixel region in the contact portion forming step, and the organic layer removed by the laser beam. It was found that the dust and the like can be prevented from scattering on the surface of the organic EL layer in the pixel region.

[Example 2]
Example 1 except that the size of the opening formed in the insulating layer is 0 μm to 35 μm, and the width of the insulating layer between the contact portion and the pixel electrode adjacent to the contact portion is 0 μm to 40 μm. An organic EL display device was manufactured by the same method. In the arranging step, the degree of vacuum in the vacuum chamber was set to 50 Pa.

(Evaluation)
As in Example 1, the presence or absence of scattering of the organic layer on the surface of the organic EL layer in the pixel region was observed. If the scattering of the organic layer to the surface of the organic EL layer in the pixel region can be prevented, “A”, the output of the laser irradiator is set to energy 250 mJ / cm ² , and the other conditions are the same as in “A” above. If the organic layer can be prevented from scattering to the surface of the organic EL layer in the pixel area by irradiating light, “B”, and the organic layer to the surface of the organic EL layer in the pixel area must be prevented from scattering. And “C”. In addition, the laser irradiation machine used in a contact part formation process can remove an organic layer more reliably, so that an output is large. Therefore, in a case where the output of the laser irradiation apparatus is the energy 250 mJ / cm ² when the energy 500 mJ / cm ² is more reliably organic layer is better in the case where the output of the laser irradiation apparatus is energy 500 mJ / cm ² Can be removed.
The evaluation results are shown in FIG.

  As shown in FIG. 5, when the width of the insulating layer between the contact portion and the pixel electrode adjacent to the contact portion is 6 μm or more, the organic layer removed by the laser beam during the contact portion forming step It was possible to prevent dust and the like from being scattered in the pixel area. The effect is remarkable when the width of the insulating layer between the contact portion and the pixel electrode adjacent to the contact portion is 6 μm or more and the size of the opening formed in the insulating layer is 10 μm or more. Met. This is because the width of the insulating layer between the contact portion and the pixel electrode adjacent to the contact portion is 6 μm or more, and the size of the opening is 10 μm or more. This is presumably because a predetermined distance is generated between the irradiated region and the neighboring pixel region.

[Example 3]
The height of the insulating layer between the contact portion and the pixel electrode adjacent to the contact portion is x, and the height of the insulating layer other than between the contact portion and the pixel electrode adjacent to the contact portion is Among them, an organic EL display device was produced in the same manner as in Example 1 except that the design was such that y-x was as shown in Table 3 below, where y was the highest height. In addition, No. In Nos. 10 and 11, a protruding structure is formed on the insulating layer between the contact portion and the pixel electrode adjacent to the contact portion. In this case, the height of the insulating layer and the protruding structure between the contact portion and the pixel electrode adjacent to the contact portion is x1, and the height of the insulating layer other than between the contact portion and the pixel electrode adjacent to the contact portion, Or it designed so that y1-x1 might become following Table 3 when the highest height was set to y1 among the heights of an insulating layer and a protrusion structure. In the placement step, the degree of vacuum in the vacuum chamber was set to 50 Pa.

(Evaluation)
No. shown in Table 3 above. The insulating layer is designed as in 6 to 11, the space between the lid material and the organic EL layer side substrate is reduced in pressure, the organic EL layer side substrate and the lid material are brought into close contact, and then the laser is passed through the lid material. The organic layer formed on the auxiliary electrode was removed by light. At this time, the presence or absence of scattering of the organic layer on the surface of the organic EL layer in the pixel region was observed. “A” when the organic layer removed by the laser beam is prevented from scattering into the pixel area and the display characteristics can be prevented from being deteriorated, “A”, the organic layer removed by the laser beam in the contact portion forming step Was slightly scattered in the pixel area, but was evaluated as “B” when the display characteristics could be prevented from being deteriorated.
The evaluation results are shown in Table 4.

  As shown in Table 4, y.sub.x or y.sub.1-x1 is 0.05 .mu.m or less. 8-No. In the case of No. 11, No. having a y-x of 0.05 μm or more. 6 and no. 7 and the contact process and the contact process, the insulating layer between the pixel electrode adjacent to the contact part and the cover material can be sufficiently adhered, and are removed by the laser beam in the contact part formation process. It was found that the dust in the organic layer can be more effectively prevented from scattering into the pixel region.

[Example 4]
An organic EL display device was produced in the same manner as in Example 1 except that the organic EL layer forming step was performed as shown below.
(Organic EL layer formation process)
Next, a hole injection layer and a hole transport layer were formed on the pixel electrode so as to have a thickness of 0.1 μm, and then a 0.02 μm light emitting layer was formed on the hole transport layer. Thereafter, an electron transport layer having a thickness of 0.03 μm was formed on the light emitting layer to obtain an organic EL layer. The organic EL layer was formed on the pixel electrode and also on the auxiliary electrode exposed from the opening of the insulating layer.
(Evaluation)
The same result as in Example 1 was obtained.

DESCRIPTION OF SYMBOLS 1 ... Organic EL layer side substrate 2 ... Substrate 3 ... Pixel electrode 4 ... Auxiliary electrode 5 ... Insulating layer 6 ... Organic EL layer 7 ... Transparent electrode layer 8 ... Lid 9 ... Contact part 10 ... Top emission type organic EL display device 11 ... Projection structure

Claims (3)

A substrate,
A plurality of pixel electrodes formed on the substrate;
An auxiliary electrode formed between the pixel electrodes;
An insulating layer formed between adjacent pixel electrodes so as to cover an edge portion of the pixel electrode, and having an opening so that the auxiliary electrode is exposed;
An organic electroluminescence layer formed on the pixel electrode and composed of a plurality of organic layers, and having at least a light emitting layer;
At least one organic layer formed on the auxiliary electrode exposed from the opening of the insulating layer;
A contact portion which is an opening portion of the organic layer formed on the auxiliary electrode exposed from the opening portion of the insulating layer;
The organic electroluminescence layer and a transparent electrode layer formed on the contact portion,
A width of the insulating layer between the contact portion and the pixel electrode adjacent to the contact portion is 6 μm or more;
The transparent electrode layer is electrically connected to the auxiliary electrode at the contact portion,
The height of the insulating layer between the contact portion and the pixel electrode adjacent to the contact portion is x, and the height of the insulating layer other than between the contact portion and the pixel electrode adjacent to the contact portion is Among them, a top emission type organic electroluminescence display device, wherein y−x ≦ 0.05 μm, where y is the highest height. A protrusion structure is formed on the insulating layer between at least the contact portion and the pixel electrode adjacent to the contact portion,
The top emission type organic electroluminescence display device according to claim 1, wherein a width of the protruding structure is 6 μm or more. A substrate, a plurality of pixel electrodes formed on the substrate, an auxiliary electrode formed between the pixel electrodes, and formed between the adjacent pixel electrodes so as to cover an edge portion of the pixel electrode, Insulating layer having an opening so as to expose the auxiliary electrode, formed on the pixel electrode, composed of a plurality of organic layers, and exposed at least from the organic electroluminescent layer having a light emitting layer, from the opening of the insulating layer At least one organic layer formed on the auxiliary electrode, a contact portion that is an opening of the organic layer formed on the auxiliary electrode exposed from the opening of the insulating layer, and the organic electroluminescence A transparent electrode layer formed on the contact portion and the contact portion, and the width of the insulating layer between the contact portion and the pixel electrode adjacent to the contact portion is 6 μm or more And x is the height of the insulating layer between the contact portion and the pixel electrode adjacent to the contact portion, and the height of the insulating layer other than between the contact portion and the pixel electrode adjacent to the contact portion. Of these, when the highest height is y, y−x ≦ 0.05 μm, and the transparent electrode layer is electrically connected to the auxiliary electrode at the contact portion. A method of manufacturing a top emission type organic electroluminescence display device for manufacturing a luminescence display device,
An organic electroluminescence layer side substrate having the substrate, the pixel electrode, the auxiliary electrode, the insulating layer, and the organic electroluminescence layer, wherein at least one organic layer is formed on the entire surface of the auxiliary electrode. An organic electroluminescence layer side substrate preparation step to be prepared;
Under a first pressure, a lid material is made to face the organic electroluminescence layer side substrate obtained in the organic electroluminescence layer side substrate preparation step, and the lid material contacts the top of the insulating layer via the organic layer. An arrangement step of arranging
An adhesion step of adjusting the space on the opposite side of the lid material from the organic electroluminescence layer side substrate to a second pressure higher than the first pressure to bring the organic electroluminescence layer side substrate and the lid material into close contact with each other;
A contact part forming step of forming the contact part by irradiating a laser beam through the lid member to remove the organic layer covering the auxiliary electrode exposed from the opening of the insulating layer. A method for manufacturing a top emission type organic electroluminescence display device.

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