JP2016168598A - Processing method, manufacturing method of junction structure, and junction structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a processing method capable of shortening a processing time.SOLUTION: A processing method, which is a processing method for forming a perforation part 12 on the surface 11 of a metal member 1, includes steps for: preheating the metal member 1 by a high-frequency induction heating device; and irradiating the preheated surface 11 of the metal member 1 with a laser beam L1 by a laser processing device, to thereby form the perforation part 12.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a processing method, a manufacturing method of a bonded structure, and a bonded structure.

  Conventionally, the processing method which forms uneven | corrugated shape in the surface of a metal material is known (for example, refer patent document 1).

  In the processing method of Patent Document 1, an uneven shape is formed on the surface of the metal material by repeatedly performing laser scanning. And when dissimilar materials are joined to the metal material obtained by this processing method, the dissimilar material enters into the concave part, so that the anchor effect is exerted, so that the metal material and dissimilar material are firmly stabilized. It is possible to join in such a state.

Japanese Patent No. 4020957

  However, the processing method described in Patent Document 1 has a problem that the processing time tends to be long because it is necessary to repeatedly perform laser scanning processing.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a processing method, a manufacturing method of a bonded structure, and a bonded structure capable of reducing the processing time. That is.

  The processing method according to the present invention is a processing method for forming a concave portion on the surface of a metal member, a step of preheating the metal member with a heating device, and irradiating a laser on the surface of the preheated metal member with a laser processing device. And a step of forming a concave portion.

  In the above processing method, the heating device may preheat the metal member by resistance heating, induction heating, laser heating, or infrared heating.

  In the above processing method, the metal member may be preheated so that the surface of the metal member is in a preset temperature range. The preset temperature range is, for example, a lower limit value obtained by multiplying the melting temperature of the metal member by 0.2, and an upper limit value obtained by multiplying the melting temperature of the metal member by 0.8.

  In the above processing method, the laser irradiated on the surface of the metal member by the laser processing apparatus may be configured such that one pulse includes a plurality of subpulses.

  The method for manufacturing a bonded structure according to the present invention is a method for manufacturing a bonded structure in which a metal member and a resin member are bonded, and includes a step of preheating the metal member with a heating device and laser processing on the surface of the preheated metal member. The method includes a step of forming a concave portion by irradiating a laser with an apparatus, and a step of filling the concave portion of the metal member with a resin member and solidifying the resin member.

  The joint structure according to the present invention is manufactured by the above-described method for manufacturing a joint structure.

  According to the processing method, the manufacturing method of the bonded structure, and the bonded structure of the present invention, the processing time can be shortened.

It is the schematic diagram which showed the cross section of the joining structure body by one Embodiment of this invention. It is a figure for demonstrating the manufacturing method of a joining structure, Comprising: It is the figure which showed the process of forming a perforated part in a metal member. It is a figure for demonstrating the positional relationship of a joining area | region and a coil. It is a figure for demonstrating the preheating method by the 1st modification of this embodiment. It is a figure for demonstrating the preheating method by the 2nd modification of this embodiment. It is a figure for demonstrating the preheating method by the 3rd modification of this embodiment. It is a figure for demonstrating the preheating method by the 4th modification of this embodiment.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

  First, with reference to FIG. 1, the joining structure 100 by one Embodiment of this invention is demonstrated.

  As shown in FIG. 1, the bonded structure 100 includes a metal member 1 and a resin member 2, and the metal member 1 and the resin member 2 are bonded to each other. In FIG. 1, hatching is omitted for ease of viewing.

  As an example of the material of the metal member 1, iron-based metal, stainless-based metal, copper-based metal, aluminum-based metal, magnesium-based metal, and alloys thereof can be cited. Moreover, a metal molding may be sufficient and zinc die-casting, aluminum die-casting, powder metallurgy, etc. may be sufficient.

  On the surface 11 of the metal member 1, a perforated portion 12 is formed in a joining region (processing region) R, and the perforated portion 12 is filled with the resin member 2 and solidified. Thereby, the metal member 1 and the resin member 2 are mechanically joined by the anchor effect. The perforated part 12 is an example of the “concave part” in the present invention.

  The perforated part 12 is a substantially circular non-through hole when seen in a plan view, and a plurality of perforated parts 12 are formed in the joining region R of the metal member 1. A projecting portion 13 projecting inward is formed on the inner peripheral surface of the perforated portion 12. The protrusion 13 is formed over the entire length in the circumferential direction, and is formed in an annular shape. The junction region R (see FIG. 3) is formed in a rectangular shape when viewed in a plan view, for example.

  Specifically, the perforated part 12 has a diameter-enlarged part in which the opening diameter increases from the surface 11 side to the bottom part in the depth direction and a contraction in which the opening diameter decreases from the surface 11 side to the bottom part in the depth direction. It is formed so as to be continuous with the diameter portion. The enlarged diameter portion is disposed on the surface 11 side and is formed so as to expand in a curved shape. The reduced diameter portion is disposed on the bottom side and is formed to reduce the diameter in a curved shape. That is, the protruding portion 13 is configured by the enlarged diameter portion.

  The opening diameter of the open end of the perforated part 12 is preferably 30 μm or more and 100 μm or less. This is because if the opening diameter is less than 30 μm, the filling property of the resin member 2 is deteriorated and the anchor effect may be lowered. On the other hand, if the opening diameter exceeds 100 μm, the number of perforated portions 12 per unit area is reduced, and the anchor effect may be lowered.

  Moreover, it is preferable that the space | interval (distance of the center of the predetermined perforation part 12 and the center of the perforation part 12 adjacent to the predetermined perforation part 12) of the perforation part 12 is 200 micrometers or less. This is because if the interval between the perforated portions 12 exceeds 200 μm, the number of perforated portions 12 per unit area may decrease and the anchor effect may be reduced.

The perforated portion 12 is formed by, for example, a processing laser L1 (see FIG. 2). The type of laser L1 is preferably a laser capable of pulse oscillation, and can be selected from a fiber laser, a YAG laser, a YVO ₄ laser, a semiconductor laser, a carbon dioxide gas laser, and an excimer laser. The second harmonic of YAG laser, YVO ₄ laser, and semiconductor laser are preferable.

  Such a perforated portion 12 is formed by a laser L1 in which one pulse is composed of a plurality of sub-pulses. This laser L1 is suitable for forming the perforated portion 12 because energy can be easily concentrated in the depth direction. As an example of the laser processing apparatus capable of irradiating such a laser L1, fiber laser marker MX-Z2000 or MX-Z2050 manufactured by OMRON can be mentioned.

  As processing conditions by the fiber laser marker, it is preferable that one period of the sub-pulse is 15 ns or less. This is because when one period of the sub-pulse exceeds 15 ns, energy is easily diffused due to heat conduction and it is difficult to form the perforated portion 12. Note that one cycle of the subpulse is a total time of the irradiation time for one subpulse and the interval from the end of the irradiation of the subpulse to the start of the irradiation of the next subpulse.

  Further, the number of subpulses of one pulse is preferably 2 or more and 50 or less. This is because when the number of subpulses exceeds 50, the output per unit of subpulses becomes small and it becomes difficult to form the perforated portion 12.

  The resin member 2 is a thermoplastic resin or a thermosetting resin, and is provided on the surface 11 of the metal member 1 and is filled in the perforated portion 12.

  Examples of the thermoplastic resin include PVC (polyvinyl chloride), PS (polystyrene), AS (acrylonitrile styrene), ABS (acrylonitrile butadiene styrene), PMMA (polymethyl methacrylate), PE (polyethylene), PP (Polypropylene), PC (polycarbonate), m-PPE (modified polyphenylene ether), PA6 (polyamide 6), PA66 (polyamide 66), POM (polyacetal), PET (polyethylene terephthalate), PBT (polybutylene terephthalate), PSF ( Polysulfone), PAR (polyarylate), PEI (polyetherimide), PPS (polyphenylene sulfide), PES (polyethersulfone), PEEK (polyetheretherketone), PA (Polyamide-imide), LCP (liquid crystal polymer), PVDC (polyvinylidene chloride), PTFE (polytetrafluoroethylene), PCTFE (polychlorotrifluoroethylene), and include PVDF (poly (vinylidene fluoride)) it is. TPE (thermoplastic elastomer) may also be used, and examples of TPE include TPO (olefin-based), TPS (styrene-based), TPEE (ester-based), TPU (urethane-based), TPA (nylon-based), And TPVC (vinyl chloride type) is mentioned.

  Examples of the thermosetting resin include EP (epoxy), PUR (polyurethane), UF (urea formaldehyde), MF (melamine formaldehyde), PF (phenol formaldehyde), UP (unsaturated polyester), and SI (silicone). ). Further, it may be FRP (fiber reinforced plastic).

  Note that a filler may be added to the resin member 2. Examples of the filler include inorganic fillers (glass fibers, inorganic salts, etc.), metal fillers, organic fillers, and carbon fibers.

-Manufacturing method of bonded structure-
Next, with reference to FIGS. 1-3, the manufacturing method of the junction structure 100 by this embodiment is demonstrated. The method for manufacturing the bonded structure 100 includes a method for processing the metal member 1.

  First, as shown in FIG. 2, the metal member 1 is preheated by a high frequency induction heating device. Specifically, an eddy current is generated in the metal member 1 by flowing a high-frequency alternating current through the coil 52 of the high-frequency induction heating device, and the metal member 1 is heated by Joule heat due to the eddy current. That is, the metal member 1 is preheated by induction heating.

  This high-frequency induction heating device is controlled so that the surface 11 of the metal member 1 falls within a preset temperature range. In the preset temperature range, for example, the lower limit value is a value obtained by multiplying the melting temperature of the metal member 1 by 0.2, and the upper limit value is a value obtained by multiplying the melting temperature of the metal member 1 by 0.8. This is because if the temperature of the surface 11 of the metal member 1 falls below the lower limit value, the energy of the surface 11 of the metal member 1 is easily diffused when irradiated with a laser L1 for processing described later. If the value exceeds the value, the formation range of the molten layer is likely to be widened when the processing laser L1 is irradiated, and it becomes difficult to form the perforated portion 12.

  The preset temperature range is more preferably a lower limit value obtained by multiplying the melting temperature of the metal member 1 by 0.4, and an upper limit value obtained by multiplying the melting temperature of the metal member 1 by 0.6. Value. That is, the preset temperature range is a temperature lower than the melting temperature of the metal member 1.

  The coil 52 is disposed on the surface 11 side with respect to the metal member 1. Further, as shown in FIG. 3, the joining region R is disposed inside the coil 52. The high-frequency induction heating device is an example of the “heating device” in the present invention.

  Then, with the metal member 1 preheated to a preset temperature range by the high-frequency induction heating device, the laser L1 is applied from the head 51 of the laser processing device to the bonding region R (see FIG. 1) on the surface 11 of the metal member 1. Irradiate. The laser L1 is scanned a plurality of times. Thereby, while forming the perforated part 12 in the joining area | region R of the metal member 1, the protrusion part 13 is formed in the internal peripheral surface. The laser L1 is, for example, a fiber laser, and one pulse is composed of a plurality of subpulses.

  Thereafter, the resin member 2 is filled into the perforated portion 12 of the metal member 1 and the resin member 2 is solidified. Thereby, the metal member 1 and the resin member 2 are mechanically joined by the anchor effect, and the joining structure 100 (refer FIG. 1) is formed. The resin member 2 is bonded by, for example, injection molding, hot plate welding, laser welding, cast hardening, ultrasonic welding, or vibration welding.

-Effect-
In the present embodiment, as described above, the perforated portion 12 is formed by irradiating the surface 11 of the metal member 1 with the laser L1 with the laser processing apparatus in a state where the surface 11 of the metal member 1 is preheated with the high frequency induction heating device. To do. With such a configuration, when the laser L1 for processing is irradiated, the energy is hardly diffused by the metal member 1, so that energy loss during laser processing can be reduced. That is, laser energy can contribute to the formation of the perforated portion 12 from the initial stage of laser processing. Accordingly, the perforated portion 12 can be formed even if the number of scans of the laser L1 is reduced as compared with the case where the metal member 1 is not preheated. As a result, the processing time can be shortened. In addition, since the metal member 1 is preheated, temperature variations during laser processing (particularly at the initial stage of processing) in the joining region R can be suppressed, so that a processing shape (for example, perforation) caused by energy loss variation can be suppressed. Variation in the depth of the portion 12 can be suppressed.

  Further, by preheating the metal member 1, the perforated portion 12 can be formed using a low-power laser processing apparatus. In addition, the processing method of this embodiment is especially effective when the material of the metal member 1 is a thing with high heat conductivity, such as copper and aluminum.

  Moreover, in this embodiment, while heating the metal member 1 with a high frequency induction heating apparatus, while heating the surface 11 of the metal member 1 directly, the area | region to be heated can be set easily. Note that a region including the bonding region R may be set as a heating region, or a part of the bonding region R may be set as a heating region and the entire bonding region R may be heated by heat conduction.

  Moreover, in this embodiment, the anchor effect can be improved by forming the protruding portion 13 in the perforated portion 12.

-Modification of preheating method-
Next, a modified example of the preheating method for preheating the metal member 1 will be described with reference to FIGS.

  FIG. 4 is a diagram for explaining a preheating method according to a first modification of the present embodiment. As shown in FIG. 4, a plate heater 53 may be disposed so as to contact a surface opposite to the surface 11 of the metal member 1, and the metal member 1 may be preheated by the plate heater 53. That is, the metal member 1 may be preheated by resistance heating (indirect resistance heating). The plate heater 53 is an example of the “heating device” in the present invention.

FIG. 5 is a diagram for explaining a preheating method according to a second modification of the present embodiment. As shown in FIG. 5, the metal member 1 may be preheated by irradiating the surface 11 of the metal member 1 with a laser L2 for heating from the head 54 of the laser heating device. The laser L2 is, for example, a fiber laser, a YAG laser, a YVO ₄ laser, a semiconductor laser, a carbon dioxide gas laser, or an excimer laser, and may be continuous oscillation or pulse oscillation. The output of the laser L2 can be appropriately set according to the material of the metal member 1 and its laser absorption. Further, the focal diameter of the heating laser L2 is made larger than the focal diameter of the processing laser L1, and the lasers L1 and L2 are run in parallel in a state where the focal point of the laser L1 is included in the focal point of the laser L2. Alternatively, the laser L2 may be scanned regardless of the laser L1. That is, the metal member 1 may be preheated by laser heating. The laser heating device is an example of the “heating device” in the present invention.

  FIG. 6 is a diagram for explaining a preheating method according to a third modification of the present embodiment. As shown in FIG. 6, the metal member 1 may be held by a jig 55 incorporating a heater rod 55a, and the metal member 1 may be preheated by the jig 55 (heater rod 55a). That is, the metal member 1 may be preheated by resistance heating. The jig 55 is an example of the “heating device” in the present invention.

  FIG. 7 is a diagram for explaining a preheating method according to a fourth modification of the present embodiment. As shown in FIG. 7, an infrared heater 56 may be disposed so as to be separated from the surface opposite to the surface 11 of the metal member 1, and the metal member 1 may be preheated by the infrared heater 56. That is, the metal member 1 may be preheated by infrared heating. The infrared heater 56 is an example of the “heating device” in the present invention.

-Experimental example-
Next, Experimental Examples 1 and 2 performed to confirm the effect of the above-described embodiment will be described.

[Experiment 1]
This Experimental Example 1 was performed in order to confirm the effect of shortening the processing time by preheating. Specifically, a large number (for example, several thousand) of perforations are formed in a metal member by the processing methods according to Examples 1 to 5 and Comparative Example 1, and ten perforations selected from the many perforations are used. The number of scans required for the depth to be 40 μm or more was measured. The results are shown in Table 1.

  First, the processing method by Example 1 is demonstrated.

  In Example 1, aluminum (A5052) was used as the material of the metal member. This metal member is formed in a plate shape, has a length of 45 mm, a width of 15 mm, and a thickness of 3 mm. In addition, the melting temperature of this metal member is about 600-660 degreeC.

  And the metal member was heated using the high frequency induction heating apparatus. In addition, this heating was performed with respect to the area | region containing the process area | region of a metal member. The heating conditions are set so that the frequency is 400 kHz and the surface of the metal member is at a predetermined temperature. The predetermined temperature is, for example, a value (300 to 330 ° C.) obtained by multiplying the melting temperature of the metal member by 0.5. That is, before irradiating the processing laser, the metal member is preheated so as to be maintained at a predetermined temperature.

  Then, a machining laser was irradiated to the machining area on the surface of the metal member to form a large number of perforations. The processed region is a linear region having a length of 12 mm and a width of 2 mm. This laser irradiation was performed using an Omron fiber laser marker MX-Z2000. The laser irradiation conditions are as follows.

<Laser irradiation conditions for processing>
Laser: Fiber laser (wavelength 1062nm)
Frequency: 10kHz
Output: 2.5W
Scanning speed: 650mm / sec
Irradiation interval: 65 μm
Focal diameter: 0.05mm
Number of subpulses: 20
The frequency is a frequency of a pulse constituted by a plurality (20 in this example) of sub-pulses. That is, under this irradiation condition, laser (pulse) is irradiated 10,000 times at intervals of 65 μm while moving 650 mm per second, and the pulse is composed of 20 sub-pulses.

  Then, the laser was scanned a plurality of times until the depth of 10 perforations at a depth of 40 μm or more among thousands of perforations formed in the processing region. In addition, these ten perforations are perforations arranged near the center of the machining area. The number of scans is the number of times the laser is repeatedly irradiated to the same location.

  Next, processing methods according to Examples 2 to 5 and Comparative Example 1 will be described.

  In the processing method of Example 2, the metal member was preheated using a plate heater as in the first modification described above. In the processing method of Example 3, the metal member was preheated using the laser heating device as in the second modification described above. In the laser heating apparatus, a semiconductor laser having a wavelength of 808 nm is used, the output is set to 30 W, the focal diameter is set to 0.6 mm, and the heating laser runs in parallel in the scanning direction of the processing laser. Scanned to do.

  In the processing method of Example 4, the metal member was preheated using a jig with a built-in heater rod as in the third modification described above. In the processing method of Example 5, the metal member was preheated using an infrared heater as in the fourth modification described above. In the processing method of Comparative Example 1, the metal member was not preheated. The other points of Examples 2 to 5 and Comparative Example 1 are the same as those of Example 1.

  As shown in Table 1, in Examples 1 to 5, the number of scanning times of the processing laser required for the depth of the 10 punched portions to be 40 μm or more is smaller than that in Comparative Example 1. That is, in Examples 1-5, the processing time could be shortened as compared with Comparative Example 1. This is because in Examples 1 to 5, by preheating the metal member, when the laser for processing is irradiated, the energy is not easily diffused, so that the energy loss of the laser for processing can be reduced. It is believed that there is.

[Experiment 2]
This Experimental Example 2 was performed in order to confirm the effect of suppressing variation in the processing shape due to preheating. Specifically, a large number (for example, several thousand) of perforations are formed in a metal member by the processing methods according to Examples 6 to 10 and Comparative Example 2, and ten perforations selected from the many perforations are used. The depth was measured. The results are shown in Table 2.

  In Experimental Example 2, unlike in Experimental Example 1, the number of times of machining laser scanning was set to 20. That is, the scans of Examples 6 to 10 and Comparative Example 2 were set to be the same. Further, out of thousands of perforations formed in the machining area, 10 perforations are arranged linearly from the outer edge of the machining area toward the center, and the depth of the 10 perforations is set. It was measured. Other processing conditions are the same as in Experimental Example 1.

  In addition, Example 6 is preheated with a high frequency induction heating device, Example 7 is preheated with a plate heater, Example 8 is preheated with a laser heating device, Example 9 is preheated with a jig incorporating a heater rod, Example 10 was preheated with an infrared heater, and Comparative Example 2 was not preheated.

  As shown in Table 2, in Examples 6 to 10, variations in the depth of the perforated part are suppressed as compared with Comparative Example 2. That is, in Examples 6 to 10, as compared with Comparative Example 2, variations in the machining shape of the drilled portion in the machining area are suppressed. In Examples 6 to 10, by preheating the metal member, it is possible to suppress temperature variations during laser processing (particularly at the initial stage of processing) in the processing region. This is considered to be because the variation in energy loss could be suppressed.

-Other embodiments-
In addition, embodiment disclosed this time is an illustration in all the points, Comprising: It does not become a basis of limited interpretation. Therefore, the technical scope of the present invention is not interpreted only by the above-described embodiments, but is defined based on the description of the scope of claims. Further, the technical scope of the present invention includes all modifications within the meaning and scope equivalent to the scope of the claims.

  For example, in this embodiment, in order to join the metal member 1 and the resin member 2, the example in which the present invention is applied to the processing method for processing the perforated portion 12 in the metal member 1 has been described. You may apply this invention to the processing method which marks printing etc. on a member.

  Further, in the present embodiment, an example in which the protruding portion 13 in the perforated portion 12 is provided on the surface 11 side is shown, but the present invention is not limited to this, and the protruding portion is provided at a position where it enters in the depth direction of the perforated portion. May be.

  Moreover, although the example in which the protrusion part 13 is formed in the punching part 12 was shown in this embodiment, it is not restricted to this, The protrusion part does not need to be formed in the punching part. For example, the perforated part may be formed in a cylindrical shape or a mortar shape.

  In the present embodiment, the circular perforated part 12 is shown as an example of the concave part when viewed in plan, but the present invention is not limited thereto, and a groove part may be formed as the concave part.

  In the present embodiment, the example in which the coil 52 of the high-frequency induction heating device is arranged on the surface 11 side of the metal member 1 is shown. However, the present invention is not limited to this, and the coil of the high-frequency induction heating device is on the back side of the metal member. It may be arranged.

  In the present embodiment, an example in which the pre-heated metal member 1 is irradiated with the processing laser L1 has been shown. However, the present invention is not limited thereto, and the pre-heated metal member is irradiated with the processing laser. You may make it irradiate.

  Moreover, although the example which preheats the metal member 1 by the plate heater 53 was shown in the 1st modification of this embodiment, you may make it preheat not only this but a band member or a ribbon heater.

  Further, in the second modification of the present embodiment, the example in which the surface 11 of the metal member 1 is irradiated with the heating laser L2 has been described. However, the present invention is not limited thereto, and the back surface of the metal member is irradiated with the heating laser. You may do it. That is, the heating laser may be irradiated from the side opposite to the processing laser.

  In the second modification of the present embodiment, the surface 11 of the metal member 1 may be roughened in order to improve the absorption of the heating laser L2.

  Further, in the present embodiment, the example in which the bonding region R is rectangular when viewed in plan is shown, but the present invention is not limited thereto, and the bonding region may have other shapes other than the rectangle.

  INDUSTRIAL APPLICABILITY The present invention is applicable to a processing method for forming a concave portion on the surface of a metal member, a manufacturing method for a bonded structure, and a bonded structure.

DESCRIPTION OF SYMBOLS 1 Metal member 2 Resin member 11 Surface 12 Perforated part (concave part)
51 head (laser processing equipment)
52 Coil (heating device)
53 Plate heater (heating device)
54 Head (Heating device)
55 Jig (heating device)
56 Infrared heater (heating device)
100 joint structure

Claims (6)

A processing method for forming a concave portion on the surface of a metal member,
Preheating the metal member with a heating device;
And a step of forming the concave portion by irradiating the surface of the preheated metal member with a laser by a laser processing apparatus. The processing method according to claim 1,
The said heating apparatus preheats the said metal member by resistance heating, induction heating, laser heating, or infrared heating, The processing method characterized by the above-mentioned. The processing method according to claim 1 or 2,
The metal member is preheated so that the surface of the metal member is in a preset temperature range. In the processing method as described in any one of Claims 1-3,
The laser irradiating the surface of the metal member by the laser processing apparatus has one pulse composed of a plurality of sub-pulses. A method for manufacturing a joined structure in which a metal member and a resin member are joined,
Preheating the metal member with a heating device;
Forming a concave portion by irradiating the surface of the preheated metal member with a laser processing apparatus; and
And a step of filling and solidifying the resin member in the concave portion of the metal member.   A bonded structure manufactured by the method for manufacturing a bonded structure according to claim 5.

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