WO2016129391A1

WO2016129391A1 - Production method for bonded structure, and bonded structure

Info

Publication number: WO2016129391A1
Application number: PCT/JP2016/052371
Authority: WO
Inventors: 和義西川
Original assignee: オムロン株式会社
Priority date: 2015-02-10
Filing date: 2016-01-27
Publication date: 2016-08-18
Also published as: JP2016147404A

Abstract

A production method for a bonded structure wherein a first member and a second member, which comprises a resin, are bonded, and a bonded structure wherein a first member and a second member are bonded. The production method for a bonded structure includes: a boring step wherein first- and second-stage bores, which communicate vertically, a top-surface side of a first member being the upper side, are formed in a first member top-surface part, which constitutes a surface to be bonded with a second member, by means of laser irradiation such that the open area of the first-stage bore, which is the higher of the first- and second-stage bores, is larger; and a bonding step wherein the first member and the second member are bonded by filling the first- and second-stage bores with the second member. In the bonded structure, a plurality of bores that communicate vertically in a first member top-surface part are formed by means of laser irradiation such that the open area of the highest of the bores is largest, and the plurality of bores are filled with a second member.

Description

Manufacturing method of bonded structure and bonded structure

The present invention relates to a method for manufacturing a bonded structure and a bonded structure.

Conventionally, a joint structure in which members made of different materials are joined is known. In such a bonded structure, since different members that are difficult to be bonded are bonded to each other, it is an issue to increase the bonding strength.

For example, in Patent Document 1, a recess having an average diameter of 0.01 to 50 μm or a groove having an average width of 0.01 to 50 μm is formed on a joint surface of a metal molded body with a resin molded body. In the first step, the average diameter of the openings is 1.0 to 1000 μm and the maximum depth is 10 to 1000 μm or the average width is 1.0 to 1000 μm and the maximum with respect to the joint surface where the recess or groove is formed There is disclosed a method for producing a composite molded body having a second step of forming a groove having a depth of 10 to 1000 μm and a third step of obtaining a composite molded body by insert molding. According to the thing of this patent document 1, it is supposed that joint strength can be raised.

Japanese Laid-Open Patent Publication No. 2014-051040

By the way, in the joint structure, the concave portion is formed in the joint portion of one member with the other member because the other member (for example, a resin member) melted when the two members are joined is filled in the concave portion. Often this is to obtain a so-called anchor effect.

Although the reason why the bonding strength is improved is not described in Patent Document 1, from FIG. 4 to FIG. 8 of Patent Document 1, 1.0 to 1000 μm with the same shape pattern is formed on the entire bonding surface of the metal member. It is considered that the bonding strength is increased by forming a recess having a maximum depth of 10 to 1000 μm and filling the recess with a resin.

However, when the opening of the recess is narrow, it is difficult to fill the recess with a molten resin member (hereinafter also referred to as a molten resin), and the anchor effect may be reduced. Here, it is conceivable to increase the size of the recess so that the molten resin is easily filled in the recess, but in this case, the anchor effect is reduced because the number of recesses per unit area on the joint surface decreases. May decrease. For this reason, in order to fill the molten resin into the concave portion having a narrow opening without reducing the anchor effect, a high resin temperature for lowering the viscosity, and a high filling pressure for pushing the resin into the narrow concave portion, Will be required.

However, since some resins decompose at high temperatures, it may be difficult to achieve a high resin temperature. When manufacturing relatively small joint structures, it is common to use equipment with low filling pressure, so it is difficult to achieve high filling pressure in relation to existing equipment. There is. For this reason, the resin is not filled in the recesses or the like when it is difficult to realize a high resin temperature or a high filling pressure by simply forming the recesses or the like on the entire joint surface as in the above-mentioned Patent Document 1. In addition, there is a risk that the yield of the bonded structure may be reduced, or that a recess filled with resin and a recess not filled with the resin may cause a variation in bonding strength, resulting in a decrease in bonding quality.

The present invention has been made in view of such points, and the object of the present invention is to produce a bonded structure and a bonded structure, even when it is difficult to achieve a high resin temperature and a high filling pressure. The object is to provide a technique for suppressing a decrease in yield and a decrease in bonding quality.

In order to achieve the above object, in the method for manufacturing a joint structure and the joint structure according to the present invention, the perforated portion provided at the joint portion of one member with the other member is formed in a shape that can easily guide the molten resin. I am doing so.

Specifically, the present invention is a method for manufacturing a joined structure in which a first member and a second member made of resin are joined, and the first member constituting a joint surface with the second member A plurality of perforated portions communicating vertically with the surface side of the first member as the upper side are irradiated with a laser so that the opening area of the uppermost perforated portion of the plurality of perforated portions is maximized A perforating step formed by performing the step, and a joining step for joining the first member and the second member by filling the plurality of perforated portions with the second member. It is.

According to this configuration, the plurality of perforations are formed so that the opening area of the uppermost perforated portion (also referred to as the first perforation) is the largest among the plurality of perforated portions communicating vertically. The first perforated part having a large opening area functions as a funnel with respect to the perforated part below (hereinafter, also referred to as the second perforated part), and the melted second member ( Hereinafter, the second perforated part is easily filled with a molten resin).

More specifically, if only the second perforated portion having a small opening area is formed, and the viscosity of the molten resin is high and the filling pressure is low, the molten resin is placed in the second perforated portion having a narrow inlet. There is a risk that it will not flow. On the other hand, if the first perforated portion having a large opening area is formed, the molten resin can easily flow into the first perforated portion having a wide inlet, even when the viscosity of the molten resin is high and the filling pressure is low. The molten resin collected in the first perforated part is more likely to flow into the second perforated part. Thereby, even when it is difficult to realize a high resin temperature and a high filling pressure, the molten resin is surely filled in the second perforated part, so that a decrease in yield and a decrease in bonding quality can be suppressed.

In addition, the opening of the second perforated part that bears the anchor effect is enlarged by the first perforated part, but the inner space of the second perforated part itself does not increase, The number of second perforations per unit area does not decrease. Therefore, it is possible to suppress a decrease in the anchor effect while suppressing a decrease in yield and a decrease in bonding quality.

In the present invention, “a plurality of perforated portions communicating in the vertical direction” is not limited to the case where one second perforated portion is formed below one first perforated portion. When a plurality of second perforations are formed below the perforations, or below the second perforations formed below the first perforations, third and subsequent perforations are further formed. This includes cases where

Further, the first perforation part does not need to be single, and the second and subsequent perforation parts may be formed below the perforation part formed by partially overlapping the plurality of first perforation parts. Similarly, the second and subsequent perforations are not required to be independent, and a plurality of second and subsequent perforations may partially form a perforation.

In the manufacturing method of the bonded structure, in the punching step, a perforation part below the uppermost perforation part among the plurality of perforation parts may be formed so that an opening area becomes smaller as going downward. preferable.

According to this configuration, for example, the second perforated part functions like a funnel with respect to the third perforated part, so that the perforated part having a funnel function is connected to the lower perforated part. The molten resin is easily filled in all the perforated portions communicating in the vertical direction.

Thus, as one of the aspects in which “the opening area of the uppermost perforated portion is maximized”, in the manufacturing method of the joined structure, in the perforating step, the opening diameter of the uppermost perforated portion is the largest. Preferably, the plurality of perforations are formed.

Even in this configuration, the first perforated portion having a large opening diameter functions like a funnel with respect to the second perforated portion, and thus it is difficult to achieve a high resin temperature and a high filling pressure. However, since the molten resin is surely filled in the second perforated part, it is possible to suppress a decrease in yield and a decrease in bonding quality.

Further, in the case of forming a plurality of perforated portions so that the opening diameter of the uppermost perforated portion is maximized, in the manufacturing method of the joined structure, in the perforating step, the uppermost step of the plurality of perforated portions is provided. It is preferable to form the perforated part below the perforated part so that the opening diameter becomes smaller as it goes downward.

According to this configuration, since the perforated part having the funnel function is connected to the lower perforated part, the molten resin can be easily filled in all the perforated parts communicating vertically.

In the manufacturing method of the bonded structure, in the drilling step, one pulse projects to the inside of the hole wall of the lower drilling part than the uppermost drilling part by irradiating a laser composed of a plurality of subpulses. It is preferable to form a protruding portion.

According to this configuration, since the irradiated laser is composed of a plurality of sub-pulses, the melted first member is difficult to scatter and is deposited inside the second and subsequent perforations. A projecting portion projecting inward can be formed on the hole wall of the perforated portion. As a result, even when a force that peels the second member from the first member is applied, the protruding portion is pulled out and resists against a portion of the second member filled in the perforated portion on the back side of the protruding portion. Therefore, the bonding strength in the peeling direction can be improved.

In the method for manufacturing a bonded structure, the first member is preferably made of a metal, a thermoplastic resin, or a thermosetting resin.

In the method for manufacturing a bonded structure, the second member is preferably made of a thermoplastic resin or a thermosetting resin.

In the method for manufacturing a bonded structure, in the bonding step, it is preferable that the plurality of perforated portions are filled with the second member by laser irradiation, injection molding, or hot pressing.

The present invention is also directed to a joined structure in which the first member and the second member are joined.

Specifically, the present invention is a bonded structure in which a first member and a second member made of resin are bonded, and the surface portion of the first member that forms a bonding surface with the second member Further, by irradiating the laser so that the plurality of perforated portions communicating in the vertical direction with the surface side of the first member as the upper side has the maximum opening area of the uppermost perforated portion among the plurality of perforated portions. It is formed, The said 2nd member is filled with the said several perforation part, It is characterized by the above-mentioned.

According to this configuration, since the first perforated part having a large opening area functions like a funnel with respect to the second perforated part, it is difficult to achieve a high resin temperature and a high filling pressure. However, since the molten resin is surely filled in the second perforated part, it is possible to suppress a decrease in yield and a decrease in bonding quality.

As described above, according to the method for manufacturing a bonded structure and the bonded structure according to the present invention, even when it is difficult to realize a high resin temperature and a high filling pressure, a decrease in yield and a decrease in bonding quality can be achieved. Can be suppressed.

It is an expanded sectional view showing typically the joined part in the joined structure concerning Embodiment 1 of the present invention. It is a schematic diagram explaining a mode that a molten resin is filled in the case where the perforated part connected up and down is formed. It is an end view explaining the manufacturing method of a joined structure typically. It is a figure which shows typically the 1st member in the modification 1 of Embodiment 1, FIG. 4 (a) is sectional drawing, FIG.4 (b) is a top view. It is a figure which shows typically the 1st member in the modification 2 of Embodiment 1, Fig.5 (a) is sectional drawing, FIG.5 (b) is a top view. It is a figure which shows typically the 1st member in the modification 3 of Embodiment 1, FIG. 6 (a) is sectional drawing, FIG.6 (b) is a top view. It is a figure which shows typically the 1st member in the modification 4 of Embodiment 1, FIG. 7 (a) is sectional drawing, FIG.7 (b) is a top view, FIG.7 (c) is 1st. It is sectional drawing explaining the formation method of a step punching part. It is a figure which shows typically the 1st member in the modification 5 of Embodiment 1, Fig.8 (a) is sectional drawing, FIG.8 (b) is a top view. FIG. 9A is a perspective view schematically showing a first member in the joined structure of the example, and FIG. 9B is a perspective view schematically showing the joined structure of the example. It is an expanded sectional view showing typically a joined part in a joined structure concerning Embodiment 2 of the present invention. It is a schematic diagram explaining stepwise how a molten resin is filled when a perforated portion that does not communicate vertically is formed.

Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.

(Embodiment 1)
-Overall structure of the joint structure-
FIG. 1 is an enlarged cross-sectional view schematically showing a joint portion in the joint structure 1 according to the present embodiment. As shown in FIG. 1, the bonded structure 1 is obtained by bonding a first member 2 made of metal and a second member 3 made of resin. In the surface portion of the first member 2 constituting the bonding interface between the first member 2 and the second member 3 in the bonded structure 1, the first step perforated portion 4 that opens on the surface of the first member 2, A second-stage perforated part 5 that opens in the first-stage perforated part 4 is formed. Thus, in the joined structure 1, the second member 3 filled in the first-stage perforated part 4 and the second-stage perforated part 5 in the melted state is in the first-stage perforated part 4 and The 1st member 2 and the 2nd member 3 are joined by solidifying within the 2nd step perforation part 5. FIG. In FIG. 1, only one set of the first-stage perforation part 4 and the second-stage perforation part 5 is shown to make the drawing easier to see, but in practice, the first-stage perforation part 4 and the second-stage perforation part 5 A plurality of sets 5 are formed.

-First member and second member-
As an example of the metal material which comprises the 1st member 2, an iron-type metal, a stainless steel metal, a copper-type metal, an aluminum-type metal, a magnesium-type metal, and those alloys are mentioned. Further, the first member 2 may be a metal molded body, or may be zinc die casting, aluminum die casting, powder metallurgy, or the like.

On the other hand, the resin constituting the second member 3 is preferably a thermoplastic resin or a thermosetting resin. Examples of thermoplastic resins include PVC (polyvinyl chloride), PS (polystyrene), AS (acrylonitrile styrene), ABS (acrylonitrile butadiene styrene), PMMA (polymethyl methacrylate), PE (polyethylene), PP ( Polypropylene), PC (polycarbonate), m-PPE (modified polyphenylene ether), PA6 (polyamide 6), PA66 (polyamide 66), POM (polyacetal), PET (polyethylene terephthalate), PBT (polybutylene terephthalate), PSF (polysulfone) ), PAR (polyarylate), PEI (polyetherimide), PPS (polyphenylene sulfide), PES (polyethersulfone), PEEK (polyetheretherketone), PAI ( Riamidoimido), LCP (liquid crystal polymer), PVDC (polyvinylidene chloride), PTFE (polytetrafluoroethylene), PCTFE (polychlorotrifluoroethylene) and PVDF (poly (vinylidene fluoride)) and the like. The second member 3 may be TPE (thermoplastic elastomer), and examples of TPE include TPO (olefin-based), TPS (styrene-based), TPEE (ester-based), TPU (urethane-based), Examples include TPA (nylon-based) and TPVC (vinyl chloride-based).

Examples of thermosetting resins include EP (epoxy), PUR (polyurethane), UF (urea formaldehyde), MF (melamine formaldehyde), PF (phenol formaldehyde), UP (unsaturated polyester) and SI (silicone). It is done. The second member 3 may be FRP (fiber reinforced plastic).

Note that a filler may be added to the thermoplastic resin and the thermosetting resin. Examples of the filler include inorganic fillers (glass fibers, inorganic salts, etc.), metal fillers, organic fillers, and carbon fibers.

-Perforated part-
In the present embodiment, as shown in FIG. 1, the first member 2 has a first-stage perforated portion 4 that communicates in the vertical direction (Z direction) with the surface side of the first member 2 as the upper side, as shown in FIG. The second-stage perforated portion 5 is formed. First, the reason why the

perforated portions

4 and 5 communicating in the vertical direction are formed will be described.

In the bonded structure 1, the second-stage perforated portion 5 is formed on the surface portion of the first member 2 when the first member 2 and the second member 3 are bonded to each other. This is to obtain a so-called anchor effect that is caused by filling the second-stage perforated portion 5 with 3) (also referred to as molten resin).

Of course, when the opening of the second-stage perforated part 5 is narrow, the molten resin 3 becomes difficult to fill the second-stage perforated part 5, and the anchor effect may be reduced. Here, it is conceivable to increase the hole diameter of the second-stage perforated part 5 so that the molten resin 3 is easily filled in the second-stage perforated part 5, but in this case, the unit area per unit area on the joint surface is considered. Since the number of second stage perforations 5 decreases, the anchor effect may decrease instead. For this reason, in order to fill the molten resin 3 into the second-stage perforated part 5 having a narrow opening without reducing the anchor effect, a high resin temperature for reducing the viscosity and the narrow second-stage perforated part. 5 is required to have a high filling pressure for pushing the molten resin 3 into the substrate 5.

However, since some resins decompose at high temperatures, it may be difficult to achieve a high resin temperature. In addition, when manufacturing a relatively small size bonded structure 1, it is common to use equipment with a low filling pressure, so it is difficult to realize a high filling pressure in relation to existing equipment. There is a case.

FIG. 11 is a schematic diagram illustrating step by step how a melted second member (hereinafter also referred to as a molten resin) 103 is filled when the

perforated portions

105a, 105b, and 105c that do not communicate with each other are formed. It is. For example, when the first member 102 and the second member 103 are joined by insert molding, the molten resin 103 flows in the direction of the white arrow in FIG. When it is difficult to achieve a high resin temperature and a high filling pressure, the viscosity of the molten resin 103 is high and the force for pushing the molten resin 103 into the perforated portion 105a is insufficient, and therefore, as shown in FIG. Thus, there is a possibility that the molten resin 103 is not filled in the perforated part 105a. In other words, since the flow direction of the molten resin 103 is not the depth direction but the direction of the white arrow in FIG. 11B, the molten resin 103 may pass over the narrow perforated part 105a. There is. Further, as shown in FIG. 11C, the molten resin 103 may be filled into the perforated portion 105b, but there is no certainty as to whether or not it is filled. For this reason, in the bonded structure 101, as shown in FIG. 11D, the perforated part 105a not filled with the second member 103, the perforated part 105b filled with the second member 103, and the second member 103 are filled. However, there is a risk that the perforated part 105c is insufficient. As described above, when the perforated part 105b filled with the second member 103 and the unfilled

perforated parts

105a and 105c are produced, there is a possibility that the joining quality may be varied and the joining quality may be deteriorated. In this case, the product is not realized and the yield may be reduced.

On the other hand, FIG. 2 is a schematic diagram illustrating step by step how the molten resin 3 is filled in the case where the

perforated portions

4 and 5 communicating in the vertical direction are formed. In FIG. 2, the throttle portion 7 in the second-stage perforating portion 5 is omitted for simplification of description. On the other hand, when the

perforated portions

4 and 5 communicating with the top and bottom are formed, even in the case where it is difficult to realize a high resin temperature and a high filling pressure, in the direction indicated by the white arrow in FIG. As shown in FIG. 2B, the molten resin 3 that has flowed is accumulated in the first-stage perforated portion 4 having a large opening area. In this way, the molten resin 3 accumulated in the first-stage perforated portion 4 does not flow in the direction of the white arrow in FIG. 2B (there is no place to go), and therefore is shown by the black arrow in FIG. Thus, it flows into the second stage perforation part 5. That is, when the

perforated portions

4 and 5 communicating with each other are formed, the first-stage perforated portion 4 having a large opening area functions like a funnel with respect to the second-stage perforated portion 5 having a small opening area. As a result, the molten resin 3 is easily filled into the second-stage perforated portion 5. Thereby, in the joined structure 1, as shown in FIG.2 (d), the 2nd member 3 will be filled into the 2nd step drilling part 5. FIG.

In order to obtain the funnel function of the first-stage perforation part 4 with respect to the second-stage perforation part 5, the first-stage perforation part 4 and the second-stage perforation part 5 are not simply communicated vertically, It is necessary that the opening area of the first stage punching part 4 is larger than the opening area of the second stage punching part 5. Therefore, in the present embodiment, the top surface of the first member 2 is vertically moved so that the opening area of the uppermost perforated portion (first-stage perforated portion 4) among the plurality of

perforated portions

4 and 5 is maximized. The

perforated portions

4 and 5 that communicate with each other are formed.

Here, various aspects can be considered as the aspect that “the opening area of the uppermost perforated portion among the plurality of perforated portions is maximized”, but in the present embodiment, a plurality of the surface portions of the first member 2 are arranged on the surface portion. The

perforated portions

4 and 5 having circular openings are formed so that the opening diameter R1 of the uppermost perforated portion (first-stage perforated portion 4) among the

perforated portions

4 and 5 is maximized. .

Then, the formation of the first-stage perforated part 4 causes the opening of the second-stage perforated part 5 to expand, but the inner diameter itself of the second-stage perforated part 5 does not increase, so that the joining surface The number of second-stage perforated portions 5 per unit area in the above does not decrease. Therefore, it is possible to suppress a decrease in the anchor effect while suppressing a decrease in yield and a decrease in bonding quality.

These

perforated portions

4 and 5 are formed by, for example, irradiating a processing laser beam (hereinafter simply referred to as a laser). As the type of laser, a laser capable of pulse oscillation is preferable, and a fiber laser, a YAG laser, a YVO ₄ laser, a semiconductor laser, a carbon dioxide gas laser, and an excimer laser can be selected. A fiber laser, a YAG laser, A second harmonic of a YAG laser, a YVO ₄ laser, or a semiconductor laser is preferable.

[First perforated part]
The first-stage perforated portion 4 is a non-through hole having a substantially circular cross section that opens on the surface of the first member 2, has a substantially dish shape, and a plurality of first-stage perforated portions 4 are formed on the surface portion of the first member 2. The opening diameter R1 of the first-stage perforated part 4 is preferably 50 μm or more and 400 μm or less. This is because when the opening diameter R1 is less than 50 μm, a high resin temperature and a high filling pressure also tend to be required for filling the first stage perforated part 4 with the molten resin, and the funnel which the first stage perforated part 4 plays a role. This is because the function may not be sufficiently expressed. Further, if the opening diameter R1 of the first step perforation part 4 exceeds 400 μm, in other words, if the first step perforation part 4 becomes too wide, the inner surface of the first step perforation part 4 and the surface of the first member 2 This is because the effect of inducing the flowing direction of the molten resin 3 in the depth direction due to the funnel function carried by the first-stage perforated portion 4 is sometimes reduced. In addition, since the 1st step drilling part 4 bears a funnel function and the anchor effect is not desired, there is no restriction | limiting in particular in the processing depth.

As a method for forming the first-stage perforated portion 4, for example, (1) a method using a laser having a large focal diameter (rather than the focal diameter of the laser used for processing the second-stage perforated portion 5), and (2) And a method of defocusing laser irradiation and enlarging the focal diameter. In the method (2), for example, when the focal diameter of 50 μm is changed to a focal diameter of 100 μm by defocusing, the processing depth becomes shallower than the focal diameter of 50 μm because of insufficient energy. The first-stage perforated part 4 that takes on the funnel function has a wide and shallow shape, so there is no problem.

[Second stage perforation]
The second-stage perforated portion 5 is a non-through hole having a substantially circular cross section that opens at the bottom surface of the first-stage perforated portion 4. The opening diameter R2 of the second-stage perforated part 5 is preferably 30 μm or more and 100 μm or less. This is because, even if the funnel function of the first-stage perforated part 4 appears, when the opening diameter R2 is less than 30 μm, the filling property of the molten resin 3 into the second-stage perforated part 5 is deteriorated and the bonding strength is reduced. This is because it may decrease. On the other hand, if the opening diameter R2 exceeds 100 μm, the number of second-stage perforated portions 5 per unit area may decrease and a desired bonding strength may not be obtained.

Further, the interval between the second-stage perforations 5 (the distance between the center of a certain second-stage perforation 5 and the center of the second-stage perforation 5 adjacent to the second-stage perforation 5) is 200 μm. The following is preferable. This is because if the interval between the second-stage perforated portions 5 exceeds 200 μm, the number of second-stage perforated portions 5 per unit area may decrease and a desired bonding strength may not be obtained.

As shown in FIG. 1, the second-stage perforated portion 5 is formed with a narrowed portion 7 in which the hole wall 6 is narrowed inward. In other words, the hole wall 6 of the second-stage perforated part 5 has a first wall part 6a that inclines inward in the depth direction (Z direction) from the surface side to the back side, and the back wall of the first wall part 6a. The second wall portion 6b that increases in diameter as it goes from the end on the side to the back side, and the third wall portion 6c that decreases in diameter as it goes from the end on the back side of the second wall portion 6b to the back side are connected. A portion where the first wall portion 6 a and the second wall portion 6 b are connected to each other constitutes the throttle portion 7. The narrowed portion 7 corresponds to the “projecting portion projecting inward” in the present invention, and the “projecting portion” extends over the entire circumference of the hole wall 6 of the second-stage perforated portion 5 having a substantially circular cross section. It is an example when formed. In addition, the dashed-two dotted line in FIG. 1 is a virtual line which shows the division of the 1st wall part 6a, the 2nd wall part 6b, and the 3rd wall part 6c.

In this way, by forming the throttle portion 7 in the second-stage perforated portion 5, even when a force that peels the second member 3 from the first member 2 is applied, the second-stage perforated portion 5 is filled. In addition, since the restricting portion 7 comes out of the second member 3 and is located behind the restricting portion 7, the joining strength in the peeling direction can be improved. Thereby, in addition to the improvement of the joining strength in the shearing direction by filling the second-stage perforated portion 5 with the second member 3, the joining strength can be improved also in the peeling direction. Furthermore, even if peeling stress due to the difference in linear expansion coefficient between the first member 2 and the second member 3 occurs in the thermal cycle environment, the bonding strength can be maintained. Durability can be improved.

In addition, although there is no restriction | limiting in particular in the processing depth of the 2nd step drilling part 5, if the processing depth of the 2nd step drilling part 5 is 30 micrometers or less, formation of the narrowing part 7 will become difficult substantially. Therefore, it is preferable that the processing depth of the second-stage perforated part 5 exceeds 30 μm.

The second stage punching part 5 is formed by irradiating the bottom of the first stage punching part 4 with a laser in which one pulse is composed of a plurality of subpulses. Such a system in which one pulse is irradiated with a laser composed of a plurality of sub-pulses is suitable for forming the second-stage perforated portion 5 because the energy of the laser is easily concentrated in the depth direction. Specifically, when the bottom of the first-stage perforated part 4 is irradiated with laser, the first member 2 is locally melted to advance the formation of the second-stage perforated part 5. At this time, since the laser is composed of a plurality of sub-pulses, the melted first member 2 is not easily scattered and easily deposited in the vicinity of the second-stage perforated portion 5. When the formation of the second-stage perforated portion 5 proceeds, the melted first member 2 is deposited inside the second-stage perforated portion 5, thereby forming the throttle portion 7.

As an example of an apparatus for irradiating such a laser in which one pulse is composed of a plurality of subpulses, fiber laser marker MX-Z2000 or MX-Z2050 manufactured by OMRON can be mentioned.

As processing conditions by the fiber laser marker, it is preferable that one period of the sub-pulse is 15 ns or less. This is because when one period of the sub-pulse exceeds 15 ns, energy is easily diffused by heat conduction, and it is difficult to form the second-stage perforated portion 5. Note that one cycle of the subpulse is a total time of the irradiation time for one subpulse and the interval from the end of the irradiation of the subpulse to the start of the irradiation of the next subpulse.

Further, as processing conditions by the fiber laser marker, the number of subpulses of one pulse is preferably 2 or more and 50 or less. This is because if the number of subpulses exceeds 50, the output per unit of subpulses becomes small, and it is difficult to form the second stage punching portion 5.

And the 2nd member 3 is joined to the surface of the 1st member 2 in which the 1st step punching part 4 and the 2nd step punching part 5 were formed by laser irradiation, injection molding, and hot press, for example. Specifically, the second member 3 is joined to the first member 2 by being solidified in a state where it is melted by laser irradiation or the like and filled in the first-stage perforated part 4 and the second-stage perforated part 5. Yes.

Such a bonded structure 1 is applicable, for example, when a resin cover (not shown) is bonded to a metal case (not shown) of a photoelectric sensor. In this case, the metal case corresponds to the first member 2, and the resin cover corresponds to the second member 3.

-Manufacturing method of bonded structure-
Next, with reference to FIG. 3, the manufacturing method of the junction structure 1 which concerns on this embodiment is demonstrated.

First, as shown by the white arrow in FIG. 3A, the surface of the first member 2 is irradiated with a laser having a large focal diameter as shown in FIG. 3B. A substantially dish-shaped first-stage perforated portion 4 is formed (perforating step).

Next, the perforated part is arranged so that the second stage perforated part 5 communicates vertically with the first stage perforated part 4 having an opening area (opening diameter) larger than the opening area (opening diameter) of the second stage perforated part 5. 4 and 5 are formed by laser irradiation. Specifically, as shown by the white arrow in FIG. 3 (b), a laser having a small focal diameter is irradiated to the bottom of the first-stage perforated part 4, and as shown in FIG. 3 (c), the first A second step punching portion 5 is formed inside the step punching portion 4 (perforating step). At this time, the narrowed portion 7 is formed in the hole wall 6 of the second-stage punching portion 5 by irradiating a laser in which one pulse is composed of a plurality of subpulses.

If the first-stage perforated part 4 is formed after the second-stage perforated part 5 is formed first, the spatter that has jumped out of the surface of the first member 2 by the laser irradiation for forming the first-stage perforated part 4 is formed. In some cases, the previously formed second-stage perforated portion 5 may be blocked by the particles. For this reason, it is preferable to form the second-stage perforated part 5 after the first-stage perforated part 4 is formed first.

Thereafter, for example, the surface of the first member 2 is irradiated with a laser in a state where the first member 2 and the second member 3 are overlapped to melt the second member 3 (laser irradiation), or the first member 2 is made of gold. The molten resin 3 is injected into the mold (not shown) or injected (injection molding) to fill the first stage perforated portion 4 with the molten resin 3. When the molten resin 3 is filled in the first-stage perforated part 4, the funnel function of the first-stage perforated part 4 causes the molten resin 3 to be in the second-stage perforated part as shown by the black arrow in FIG. Guided to 5. Then, the filled molten resin 3 is solidified in the first-stage perforated part 4 and the second-stage perforated part 5, whereby the first member 2 and the second member 3 are joined, and the joining as shown in FIG. A structure 1 is formed.

-Modification of Embodiment 1-
Next, a modified example of the bonded structure 1 according to the first embodiment will be described.

<Modification 1>
4A and 4B are diagrams schematically illustrating a first member 2A according to Modification 1 of Embodiment 1, FIG. 4A is a cross-sectional view, and FIG. 4B is a plan view. In the first modification, the shape of the second-stage perforated part 5A is different from that of the first embodiment. As shown in FIGS. 4 (a) and 4 (b), the second-stage perforated part 5A is formed in the first-stage perforated part 4A as in the second-stage perforated part 5 of the first embodiment. Unlike the second-stage perforated portion 5, the throttle portion 7A is formed in the opening. That is, the second-stage perforated portion 5A is formed in a simple shape such that the first wall portion 6a is omitted from the second-stage perforated portion 5 of the first embodiment. With such a configuration, it is possible to more easily form the

perforated portions

4A and 5A communicating in the vertical direction while maintaining the improvement in the bonding strength in the peeling direction by the narrowed portion 7A.

<Modification 2>
FIG. 5 is a diagram schematically illustrating a first member 2B in Modification 2 of Embodiment 1, FIG. 5 (a) is a cross-sectional view, and FIG. 5 (b) is a plan view. This modified example 2 is different from the first embodiment in that the shape of the second-stage perforated part 5B and a plurality of second-stage perforated parts 5B are formed in one first-stage perforated part 4B. As shown in FIGS. 5A and 5B, four second-stage perforated portions 5B are formed in the first-stage perforated portion 4B. In addition, each second-stage perforated portion 5B has an aperture portion 7B formed in the opening, as in the first modification. In the second modification, the molten resin 3 can be guided to the four second-stage perforations 5B by the funnel function of the first-stage perforations 4B. With such a configuration, it is possible to reduce the number of first-stage perforations 4B while maintaining the filling performance of the second member 3 into the second-stage perforations 5B. Time can be shortened.

<Modification 3>
6A and 6B are diagrams schematically showing a first member 2C in Modification 3 of Embodiment 1, FIG. 6A is a cross-sectional view, and FIG. 6B is a plan view. This modification 3 is different from the first embodiment in that the shape of the second-stage perforated part 5C and the

perforated parts

4C, 5C, 8 are formed in three stages. As shown in FIGS. 6A and 6B, the third-stage perforated portion 8 is formed in the second-stage perforated portion 5C. Similarly to the first modification, the second-stage perforated part 5C and the third-stage perforated part 8 have

throttle parts

7C and 9 formed in the openings. In the third modification, the molten resin 3 can be guided to the second-stage perforated part 5C by the funnel function of the first-stage perforated part 4C, and the molten resin 3 is supplied by the funnel function of the second-stage perforated part 5C. The three-stage perforated part 8 can be guided. With such a configuration, even when a force that separates the second member 3 from the first member 2C is applied, the throttle portion 7C comes out of the second member 3 filled in the second-stage perforated portion 5C. In addition to resistance, the narrowed portion 9 comes out of the second member 3 filled in the third-stage perforated portion 8 and becomes resistance, so that the bonding strength in the peeling direction can be further improved.

In the case of the third modification, not only the relationship “the opening diameter of the uppermost perforated portion is maximized” as referred to in the present invention but also “the uppermost perforated portion” as referred to in the present invention. The lower perforated part is formed so that the opening diameter becomes smaller as going downward. Therefore, as a matter of course, in the present invention, not only the relationship that “the opening area of the uppermost perforated portion is maximized” but also the term “the upper perforated portion lower than the uppermost perforated portion” is referred to in the present invention. The relationship that the opening area becomes smaller as it goes downward is also satisfied.

<Modification 4>
7A and 7B are diagrams schematically showing a first member 2D in Modification 4 of Embodiment 1, FIG. 7A is a cross-sectional view, FIG. 7B is a plan view, and FIG. c) is a cross-sectional view illustrating a method of forming the first-stage perforated portion 4D. This modification 4 is different from the first embodiment in that the shape of the second-stage perforated part 5D and the plurality of first-stage perforated parts 4D are partially overlapped. In this first member 2D, as shown in FIGS. 7 (a) and 7 (b), three first-stage perforated portions 4D are formed so that the end portions overlap each other, and are connected in a straight line. Perforated portions 4D having an opening length R3 are formed. Further, the second-stage perforated part 5D is formed in the middle first-stage perforated part 4D, and the narrowed part 7D is formed in the opening as in the first modification.

The opening length R3 of the perforated portions 4D,... Is not limited in the lower limit, but the upper limit is preferably 400 μm or less. This is because when the opening length R3 exceeds 400 μm, the effect of inviting the molten resin 3 in the depth direction by the funnel function performed by the first-stage perforated portion 4D decreases. .. Are formed by overlapping lasers during laser irradiation, as indicated by arrows in FIG. 7C. With such a configuration, it is possible to form the perforated portions 4D having a large opening area without irradiating a laser having a large focal diameter.

<Modification 5>
FIGS. 8A and 8B are views schematically showing the first member 2E in Modification 5 of Embodiment 1, FIG. 8A is a cross-sectional view, and FIG. 8B is a plan view. The fifth modification is different from the first embodiment in that a plurality of second-stage perforations 5E are formed in the shape of the second-stage perforations 5E and the perforations 4E formed of three first-stage perforations 4E. Are different. The three first-stage perforations 4E are formed so that the end portions overlap each other as in the fourth modification, and form perforations 4E,. As shown in FIG. 8 (a) and FIG. 8 (b), two second-stage perforations 5E are formed in the perforations 4E,. In addition, each second-stage perforated portion 5E has an aperture portion 7E formed in the opening, as in the first modification. In the fifth modification, the molten resin 3 can be guided to the two second-stage perforations 5E by the funnel function of the perforations 4E,. With such a configuration, the perforating portions 4E,... Having a large opening area are formed without irradiating a laser having a large focal diameter while maintaining the filling property of the second member 3 to the second stage perforating portion 5E. can do.

-Experimental example-
Next, the manufacturing method of the bonded structure according to the present invention and Experimental Example 1 performed for confirming the effect of the bonded structure will be described.

[Experimental Example 1]
In Experimental Example 1, it was confirmed how much the bonding strength of the bonded structure is improved even when the resin temperature and the packing pressure are relatively low by forming the perforated portions communicating vertically.

Specifically, as shown in FIG. 9A, two plate-like first members 22 each having a length of 100 mm, a width of 29 mm, and a thickness of 3 mm, each made of stainless steel (SUS304), were prepared. The first member 22 is irradiated with a laser under the following laser irradiation condition 1 by using a fiber laser marker MX-Z2000 made by OMRON and irradiating a predetermined region R of 12.5 mm × 20.0 mm under the following laser irradiation condition 1. A stepped perforated portion was formed, and a second step perforated portion was formed by irradiating a laser under the following laser irradiation condition 2. Further, by irradiating the other first member 22 with a laser under the following laser irradiation condition 2 using the fiber laser marker MX-Z2000, it communicates vertically with a predetermined region R of 12.5 mm × 20.0 mm. Only an unperforated portion (hereinafter referred to as a second-stage perforated portion for convenience) was formed.

<Laser irradiation condition 1>
Laser: Fiber laser (wavelength 1062nm)
Frequency: 10kHz
Output: 2.4W
Scanning speed: 650mm / sec
Number of scans: 20 times Irradiation interval: 40 μm
Number of subpulses: 7
<Laser irradiation condition 2>
Laser: Fiber laser (wavelength 1062nm)
Frequency: 10kHz
Output: 3.8W
Scanning speed: 650mm / sec
Number of scans: 20 times Irradiation interval: 65 μm
Number of subpulses: 20
In this experimental example, in order to reduce the depth of the first-stage perforated part, the laser output when forming the first-stage perforated part was set to a low 2.4 W. The frequency for forming the second stage perforated part was a pulse frequency composed of 20 subpulses. That is, under this irradiation condition 2, laser (pulse) was irradiated 10,000 times at an interval of 65 μm while moving 650 mm per second, and the pulse was composed of 20 subpulses. In this way, a second stage perforated part having a throttle part on the surface of the first member 22 was formed by irradiating a laser composed of 20 sub-pulses per pulse. On the other hand, the frequency at the time of forming the first-stage perforated part was set to a pulse frequency composed of seven sub-pulses in order to reduce the depth of the first-stage perforated part.

Furthermore, the irradiation interval when forming the first-stage perforations was 40 μm so that the ends of the adjacent first-stage perforations overlap each other. As a result, the first member 22 has a perforated portion in which the first-stage perforated portions having an opening diameter of 40 to 50 μm are linearly connected as in the fourth modification of the first embodiment.

Next, as shown in FIG. 9B, the joined structure 21 in which the second member 23 is joined to the predetermined region R is formed by insert molding on the first member 22 in which the first and second step perforated portions are formed. This was manufactured as Example 1. In addition, a bonded structure 21 in which the second member 23 was bonded to the predetermined region R was manufactured by insert molding with respect to the first member 22 in which only the second-stage perforated portion was formed. In Example 1 and Comparative Example 1, the second member 23 uses polybutylene terephthalate (PBT) (Juranex (registered trademark) 3316 manufactured by Wintech Polymer) as a material, and is 100 mm long × 25 mm wide × 3 mm thick. Molded into a plate. Moreover, J35EL3 made from Japan Steel Works was used for the molding machine. The molding conditions are as follows.

<Molding conditions>
Pre-drying: 120 ° C x 5 hours Mold temperature: 80 ° C
Cylinder temperature: 270 ° C
Holding pressure: 20 MPa
In this experimental example, assuming that it is difficult to achieve a high resin temperature and a high filling pressure, that is, assuming a relatively low resin temperature and a relatively low filling pressure, the mold temperature is set to 80. While the temperature was set to a relatively low temperature, the holding pressure was set to a relatively low pressure of 20 MPa.

For Example 1 and Comparative Example 1 produced as described above, the bonding strength was measured using an electromechanical universal testing machine 5900 manufactured by Instron. Specifically, the test is performed at a tensile speed of 5 mm / min in the shear direction (direction parallel to the joint surface), and the second member 23 is broken or the joint interface is broken (peeling between the first member 22 and the second member 23). ) Ended the test. The maximum strength obtained was adopted as the bonding strength. Table 1 shows the bonding strengths obtained for Example 1 and Comparative Example 1.

From Table 1, it was confirmed that in Example 1 in which the first and second-stage perforations were formed, the bonding strength was improved nearly three times as compared with Comparative Example 1 in which only the second-stage perforations were formed. Here, it is considered that the first-stage perforated portion having a shallow working depth hardly contributes to the anchor effect. However, although the same second-stage perforated portion is formed, Example 1 is a comparative example. The reason why the bonding strength is improved by nearly three times as compared to 1 is considered to be that the filling rate of the second member 23 into the second-stage perforated part is increased by the funnel function of the first-stage perforated part. As a result, it was confirmed that the perforated portion communicating with the top and bottom contributes to the improvement of the bonding strength.

(Embodiment 2)
The present embodiment is different from the first embodiment in that the first member 12 is also made of resin. Hereinafter, a description will be given focusing on differences from the first embodiment.

FIG. 10 is an enlarged cross-sectional view schematically showing a joint portion in the joint structure 11 according to the present embodiment. As shown in FIG. 10, the bonded structure 11 is formed by bonding a first member 12 and a second member 3 made of different resin materials. In the surface portion of the first member 12 that constitutes the bonding interface between the first member 12 and the second member 3 in the bonded structure 11, a first step perforated portion 14 that opens on the surface of the first member 12, A second-stage perforated part 15 that opens in the first-stage perforated part 14 is formed. Thus, in the joined structure 11, the second member 3 filled in the first-stage perforated part 14 and the second-stage perforated part 15 in the melted state is contained in the first-stage perforated part 14 and the first-stage perforated part 14. The first member 12 and the second member 3 are joined by solidifying in the two-stage perforated portion 15. In FIG. 10, only one set of the first-stage perforation part 14 and the second-stage perforation part 15 is shown in order to make the drawing easier to see, but actually, the first-stage perforation part 14 and the second-stage perforation part 14 A plurality of sets 15 are formed.

The resin constituting the first member 12 is preferably a thermoplastic resin or a thermosetting resin. The types of the thermoplastic resin and the thermosetting resin that constitute the first member 12 are the same as the thermoplastic resin and the thermosetting resin that constitute the second member 3 shown in the first embodiment. Further, similar to the second member 3, a filler may be added to the thermoplastic resin and the thermosetting resin.

Even when resin is used as the material of the first member 12 as in the present embodiment, the first-stage perforated part 14 and the second-stage perforated part 15 are formed by irradiating laser as in the first embodiment. The At this time, similarly, the narrowed portion 17 can be formed in the hole wall 16 of the second-stage punched portion 15 by irradiating a laser in which one pulse is composed of a plurality of subpulses. Furthermore, not only in the shape as shown in FIG. 10, but also in the case where resin is used as the material of the first member 12, the first-stage perforated portion 14 and the second-stage perforated portion are formed in the shapes as shown in FIGS. The part 15 can be formed.

-Experimental example-
Next, a manufacturing method of the bonded structure according to the present invention and Experimental Example 2 performed to confirm the effect of the bonded structure will be described.

[Experiment 2]
In Experimental Example 2, how much the bonding strength of the bonding structure 31 is improved even in the case of a relatively low resin temperature and a relatively low filling pressure in the bonding structure 31 that employs resin as the first member 32. It was confirmed. Specifically, as shown in FIG. 9, a plate-shaped first made of polyphenylene sulfide (PPS) (Fortron (registered trademark) 1140 manufactured by Polyplastics) having a length of 100 mm, a width of 29 mm, and a thickness of 3 mm. Two members 32 were prepared. The first member 32 is irradiated with a laser under the following laser irradiation condition 1 by using a fiber laser marker MX-Z2000 made by OMRON and irradiating a predetermined region R of 12.5 mm × 20.0 mm under the following laser irradiation condition 1. A stepped perforated portion was formed, and a second step perforated portion was formed by irradiating a laser under the following laser irradiation condition 2. Further, by irradiating the other first member 32 with a laser under the following laser irradiation condition 2 using the fiber laser marker MX-Z2000, it communicates vertically with a predetermined region R of 12.5 mm × 20.0 mm. Only an unperforated portion (hereinafter referred to as a second-stage perforated portion for convenience) was formed.

<Laser irradiation condition 1>
Laser: Fiber laser (wavelength 1062nm)
Frequency: 10kHz
Output: 1.1W
Scanning speed: 650mm / sec
Number of scans: 1 Irradiation interval: 40 μm
Number of subpulses: 3
<Laser irradiation condition 2>
Laser: Fiber laser (wavelength 1062nm)
Frequency: 10kHz
Output: 1.1W
Scanning speed: 650mm / sec
Number of scans: 3 times Irradiation interval: 65 μm
Number of subpulses: 5
Note that the number of scans is the number of times the laser is repeatedly irradiated to the same location. In this experimental example, in order to reduce the depth of the first-stage perforated part, the scanning for forming the first-stage perforated part is performed. The number of times was set as small as 1 time. Further, when forming the second-stage perforated part, a second-stage perforated part having a constricted part on the surface part of the first member 32 is formed by irradiating a laser in which one pulse is composed of five sub-pulses. did. On the other hand, the frequency at the time of forming the first-stage perforated part is a pulse frequency constituted by three sub-pulses in order to reduce the depth of the first-stage perforated part. Furthermore, the irradiation interval when forming the first-stage perforations was 40 μm so that the ends of the adjacent first-stage perforations overlap each other.

Next, as shown in FIG. 9B, the joined structure 31 in which the second member 33 is joined to the predetermined region R is formed by insert molding on the first member 32 in which the first and second step perforated portions are formed. This is used as Example 2, and a joined structure 31 is produced in which the second member 33 is joined to the predetermined region R with respect to the first member 32 in which only the second-stage perforated portion is formed. It was. The second member 33 is made of polybutylene terephthalate (PBT) (Juranex (registered trademark) 3316 made by Wintech Polymer) as a material for both Example 2 and Comparative Example 2, and is 100 mm long × 25 mm wide × 3 mm thick. Molded into a plate. Moreover, J35EL3 made from Japan Steel Works was used for the molding machine. The molding conditions are as follows.

<Molding conditions>
Pre-drying: 120 ° C x 5 hours Mold temperature: 80 ° C
Cylinder temperature: 270 ° C
Holding pressure: 20 MPa
For Example 2 and Comparative Example 2 produced as described above, the bonding strength was measured using an electromechanical universal testing machine 5900 manufactured by Instron in the same manner as in Experimental Example 1. Table 2 shows the bonding strengths obtained for Example 2 and Comparative Example 2.

From Table 2, it was confirmed that in Example 2 in which the first and second-stage perforations were formed, the bonding strength was improved nearly three times as compared with Comparative Example 2 in which only the second-stage perforations were formed. Thereby, also in the joining structure 31 which joined resin, it was able to confirm that the perforated part connected up and down contributed to the improvement of joining strength.

(Other embodiments)
The present invention is not limited to the embodiments, and can be implemented in various other forms without departing from the spirit or main features thereof.

In each of the above-described embodiments and modifications thereof, the second-stage

perforated portions

5, 5A, 5B, 5C, 5D, and 5E having the narrowed

portions

7, 7A, 7B, 7C, 7D, and 7E are formed. The shape of the perforated part in the second and subsequent stages may be a straight shape having no throttle part.

In the third modification, the third-stage perforated portion 8 is formed. However, the present invention is not limited to this, and a fourth-stage perforated portion may be formed.

Further, in the third modification, the

perforated portions

5C and 8 below the first stage perforated part 4C are formed so that the opening diameter (opening area) decreases as going downward, but the first stage perforated part If it is formed so that the opening diameter (opening area) of 4C is maximized, the present invention is not limited to this. For example, the opening diameter (opening area) of the second stage punching part 5C and the third stage punching part 8 The opening diameter (opening area) may be the same.

Thus, the above-described embodiment is merely an example in all respects and should not be interpreted in a limited manner. Further, all modifications and changes belonging to the equivalent scope of the claims are within the scope of the present invention. This application claims priority based on Japanese Patent Application No. 2015-024641. By this reference, the entire contents thereof are incorporated into the present application.

According to the present invention, even when it is difficult to achieve a high resin temperature and a high filling pressure, it is possible to suppress a decrease in yield and a decrease in bonding quality, and thus a method for manufacturing a bonded structure in which different types of members are bonded to each other And is very useful when applied to bonded structures.

1, 11, 21, 31

Joint structure

2, 2A, 2B, 2C, 2D, 2E, 12, 22, 32

First member

3, 23, 33

Second member

4, 4A, 4B, 4C, 4D, 4E, 14 1st

stage drilling part

5,5A, 5B, 5C, 5D, 5E, 15 2nd

stage drilling part

6,16

Hole wall

7,7A, 7B, 7C, 7D, 7E, 9,17 Restriction part (protrusion part)
8 3rd stage perforation R1, R2 Opening diameter

Claims

A method for manufacturing a joined structure in which a first member and a second member made of resin are joined,
A plurality of perforated portions communicating vertically with the surface side of the first member as an upper side are formed on the surface portion of the first member constituting the joint surface with the second member, and the uppermost step among the plurality of perforated portions. A perforation process formed by irradiating with a laser so that the opening area of the perforated part is maximized;
A joining step of joining the first member and the second member by filling the plurality of perforated portions with the second member;
The manufacturing method of the joining structure characterized by including.
In the manufacturing method of the joined structure according to claim 1,
In the punching step, a manufacturing method of a joined structure, wherein a punching portion below the uppermost punching portion among the plurality of punching portions is formed so that an opening area decreases as going downward. .
In the manufacturing method of the joined structure according to claim 1,
In the punching step, the plurality of punched portions are formed so that the opening diameter of the uppermost punched portion is maximized.
In the manufacturing method of the joined structure according to claim 3,
In the punching step, a manufacturing method of a joint structure, wherein a drilling portion below the uppermost punching portion among the plurality of punching portions is formed so that the opening diameter decreases as going downward. .
In the method for manufacturing a joined structure according to any one of claims 1 to 4,
In the drilling step, one pulse is irradiated with a laser composed of a plurality of sub-pulses, thereby forming a projecting portion projecting inwardly on the hole wall of the drilling portion below the uppermost drilling portion. A method for manufacturing a joined structure.
In the method for manufacturing a bonded structure according to any one of claims 1 to 5,
The method for manufacturing a joined structure, wherein the first member is made of a metal, a thermoplastic resin, or a thermosetting resin.
In the method for manufacturing a bonded structure according to any one of claims 1 to 6,
The method for manufacturing a joined structure, wherein the second member is made of a thermoplastic resin or a thermosetting resin.
In the method for manufacturing a joined structure according to any one of claims 1 to 7,
In the joining step, the second member is filled in the plurality of perforated portions by laser irradiation, injection molding, or hot pressing.
A joined structure in which a first member and a second member made of resin are joined,
A plurality of perforated portions communicating with the surface portion of the first member constituting the joint surface with the second member in the vertical direction with the surface side of the first member as an upper side is the uppermost step among the plurality of perforated portions. It is formed by irradiating a laser so that the opening area of the perforated part is maximized,
The joining structure, wherein the plurality of perforated portions are filled with the second member.