JP6414477B2 - Manufacturing method of bonded structure - Google Patents

Description

The present invention relates to the production how the joined structure.

  Conventionally, the joining method which joins a metal member and a resin member is known (for example, refer to patent documents 1).

  The bonding method of Patent Document 1 includes a step of forming an uneven surface on the surface of the metal member, a step of forming a light absorption film on the uneven surface, and a state in which the resin member is in contact with the surface of the metal member. And irradiating the surface of the metal member with laser light from the side to join the resin member and the metal member. In the step of joining the resin member and the metal member, when the surface of the metal member is irradiated with laser light, the metal member becomes high temperature and the resin member is melted by the heat. Then, the melted resin member enters the uneven surface, and then the resin member is solidified, whereby the resin member and the metal member are mechanically joined by the anchor effect.

  In this bonding method, since the light absorption film is formed on the uneven surface, when the laser beam for bonding is irradiated, the laser beam can be efficiently converted into heat. It is possible to improve. The light absorption film is formed by anodizing treatment or plating treatment.

JP 2014-46599 A

  However, in the bonding method described in Patent Document 1, it is possible to improve the bonding quality by forming a light absorption film, but it is necessary to perform anodizing treatment or plating treatment. However, there is a problem that productivity becomes worse.

The present invention has been made to solve the above problems, an object of the present invention, while improving bond quality, manufacturing how the possible joint structure to suppress the deterioration of productivity Is to provide.

A method for manufacturing a bonded structure according to the present invention is a method for manufacturing a bonded structure in which a metal member and a resin member that is transparent to a laser for bonding are bonded, and the first concave shape is formed on the surface of the metal member. Forming the first concave portion, forming the second concave portion shallower than the first concave portion on the surface of the metal member, and disposing the resin member on the surface of the metal member. Irradiating a laser for bonding from the resin member side toward the surface of the metal member, filling the resin member into the first concave portion and solidifying it, thereby bonding the metal member and the resin member; Prepare. The first concave portion includes a circular perforated portion when seen in a plan view, and a projecting portion projecting inward is formed on the inner peripheral surface of the perforated portion, and the depth of the second concave portion is determined by the surface of the metal member. It is formed so that it may become shorter than the distance from the lower end of a protrusion part.

  In the manufacturing method of the bonded structure, the first concave portion is provided for mechanically bonding the metal member and the resin member, and the second concave portion is for improving the absorption rate of the laser for bonding. It may be provided.

  In the manufacturing method of the joined structure, the first concave portion and the second concave portion may be formed by a processing laser.

According to the manufacturing how the joined structure of the present invention, while improving the welding quality, it is possible to suppress the deterioration of productivity.

It is a schematic diagram of the cross section of the joining structure body by one Embodiment of this invention. It is the schematic diagram which looked at the recessed part formed in the metal member of the joining structure of FIG. 1 planarly. It is a figure for demonstrating the manufacturing method of a joining structure, Comprising: It is the figure which showed the process of forming a perforated part in a metal member. It is a figure for demonstrating the manufacturing method of a joining structure, Comprising: It is the figure which showed the process of forming a recessed part in a metal member. It is a figure for demonstrating the manufacturing method of a joining structure, Comprising: It is the figure which showed the process of joining a metal member and a resin member. It is the schematic diagram which looked at the metal member by the 1st modification of this embodiment planarly. It is the schematic diagram which looked at the metal member by the 2nd modification of this embodiment planarly. It is the schematic diagram which looked at the metal member by the 3rd modification of this embodiment planarly. FIG. 3 is a perspective view showing a joint structure according to Example 1.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

  First, with reference to FIG. 1, the joining structure 100 by one Embodiment of this invention is demonstrated.

  As shown in FIG. 1, the bonded structure 100 includes a metal member 1 and a resin member 2, and the metal member 1 and the resin member 2 are bonded to each other.

  As an example of the material of the metal member 1, iron-based metal, stainless-based metal, copper-based metal, aluminum-based metal, magnesium-based metal, and alloys thereof can be cited. Moreover, a metal molding may be sufficient and zinc die-casting, aluminum die-casting, powder metallurgy, etc. may be sufficient.

  A perforated portion 11 and a concave portion 12 are formed on the surface 1 a of the metal member 1. The perforated part 11 and the recessed part 12 of the metal member 1 are filled with the resin member 2 and solidified. Thereby, the metal member 1 and the resin member 2 are mechanically joined by the anchor effect.

  The perforated part 11 is provided for mechanically joining the metal member 1 and the resin member 2 by the anchor effect. On the other hand, the concave portion 12 is formed so as to be shallower than the perforated portion 11, and is provided in order to improve the absorption rate of a laser L3 for bonding (see FIG. 5) described later. The perforated part 11 is an example of the “first concave part” in the present invention, and the concave part 12 is an example of the “second concave part” in the present invention.

  The perforated part 11 is a substantially circular non-through hole when seen in a plan view, and a plurality of perforated parts 11 are formed on the surface 1 a of the metal member 1. On the inner peripheral surface of the perforated part 11, a protruding part 11 a that protrudes inward is formed. The protrusion 11a is formed over the entire length in the circumferential direction, and is formed in an annular shape.

  Specifically, the perforated part 11 has a reduced diameter part 11b in which the opening diameter decreases from the surface 1a side to the bottom part in the depth direction, and an opening diameter increases from the surface 1a side to the bottom part in the depth direction. The enlarged diameter portion 11c and the reduced diameter portion 11d having a smaller opening diameter from the surface 1a side to the bottom portion in the depth direction are formed to be continuous. The reduced diameter portion 11b is formed to linearly reduce the diameter, the enlarged diameter portion 11c is formed to expand in a curved shape, and the reduced diameter portion 11d is formed to reduce in a curved shape. ing. That is, the protruding portion 11a is configured by the reduced diameter portion 11b and the enlarged diameter portion 11c.

  The opening diameter of the open end of the perforated part 11 is preferably 30 μm or more and 100 μm or less. This is because if the opening diameter is less than 30 μm, the filling property of the resin member 2 is deteriorated and the anchor effect may be lowered. On the other hand, if the opening diameter exceeds 100 μm, the number of perforated portions 11 per unit area may decrease and the anchor effect may be reduced.

  Moreover, it is preferable that the space | interval (distance of the center of the predetermined perforation part 11 and the center of the perforation part 11 adjacent to the predetermined perforation part 11) of the perforation part 11 is 200 micrometers or less. This is because when the interval between the perforated portions 11 exceeds 200 μm, the number of the perforated portions 11 per unit area decreases, and the anchor effect may be reduced.

The perforated part 11 is formed by, for example, a processing laser L1 (see FIG. 3). That is, the perforated part 11 is formed by physical processing with the laser L1. The type of laser L1 is preferably a laser capable of pulse oscillation, and can be selected from a fiber laser, a YAG laser, a YVO ₄ laser, a semiconductor laser, a carbon dioxide gas laser, and an excimer laser. The second harmonic of YAG laser, YVO ₄ laser, and semiconductor laser are preferable.

  Such a perforated part 11 is formed by a laser L1 in which one pulse is composed of a plurality of sub-pulses. This laser L1 is suitable for forming the perforated portion 11 because energy can be easily concentrated in the depth direction. As an example of a processing apparatus capable of irradiating such a laser L1, fiber laser marker MX-Z2000 or MX-Z2050 manufactured by OMRON can be mentioned.

  As processing conditions by the fiber laser marker, it is preferable that one period of the sub-pulse is 15 ns or less. This is because when one period of the sub-pulse exceeds 15 ns, energy is easily diffused due to heat conduction, and it becomes difficult to form the perforated part 11. Note that one cycle of the subpulse is a total time of the irradiation time for one subpulse and the interval from the end of the irradiation of the subpulse to the start of the irradiation of the next subpulse.

  Further, the number of subpulses of one pulse is preferably 2 or more and 50 or less. This is because when the number of subpulses exceeds 50, the output per unit of subpulses becomes small, and it becomes difficult to form the perforated part 11.

  The recess 12 is formed to reduce the flat area of the surface 1a of the metal member 1 and increase the roughened area. That is, the recess 12 is provided in order to reduce the reflection of the bonding laser L3 from the surface 1a and to improve the absorption rate at the surface 1a of the laser L3.

  The recesses 12 are non-through holes that are substantially circular in a plan view, and a plurality of the recesses 12 are formed on the surface 1 a of the metal member 1. The recess 12 is formed in a mortar shape so that the opening diameter gradually decreases from the surface 1a side toward the bottom in the depth direction.

  Further, the depth of the concave portion 12 is formed to be shorter than the distance from the surface 1a to the lower end of the protruding portion 11a (the boundary portion between the enlarged diameter portion 11c and the reduced diameter portion 11d). Preferably, the depth of the concave portion 12 is formed to be shorter than the distance from the surface 1a to the apex of the protruding portion 11a (the boundary portion between the reduced diameter portion 11b and the enlarged diameter portion 11c). For example, the depth of the recess 12 is 40 μm or less.

  The concave portion 12 is provided in a region that does not overlap the perforated portion 11 in a planar positional relationship. A part of the plurality of recesses 12 may overlap with the perforated part 11. For example, the recesses 12 are arranged in a dot shape (matrix shape) as shown in FIG. In FIG. 2, only the concave portion 12 is shown for ease of viewing, and the illustration of the perforated portion 11 is omitted.

The recess 12 is formed by, for example, a processing laser L2 (see FIG. 4). That is, the recess 12 is formed by physical processing with the laser L2. Examples of the laser L2 include fiber laser, YAG laser, YVO ₄ laser, semiconductor laser, carbon dioxide laser, and excimer laser. The recess 12 is formed by a laser L2 in which one pulse is a single pulse. In addition, the perforated part 11 and the recessed part 12 are formed using the same processing apparatus, and the recessed part 12 is formed after the perforated part 11 is formed with respect to the surface 1a.

  The resin member 2 is, for example, a thermoplastic resin that is transparent to the bonding laser L3, and examples thereof include PVC (polyvinyl chloride), PS (polystyrene), AS (acrylonitrile / styrene), ABS. (Acrylonitrile butadiene styrene), PMMA (polymethyl methacrylate), PE (polyethylene), PP (polypropylene), PC (polycarbonate), m-PPE (modified polyphenylene ether), PA6 (polyamide 6), PA66 (polyamide 66) , POM (polyacetal), PET (polyethylene terephthalate), PBT (polybutylene terephthalate), PSF (polysulfone), PAR (polyarylate), PEI (polyetherimide), PPS (polyphenylene sulfide), PES Polyethersulfone), PEEK (polyetheretherketone), PAI (polyamideimide), LCP (liquid crystal polymer), PVDC (polyvinylidene chloride), PTFE (polytetrafluoroethylene), PCTFE (polychlorotrifluoroethylene), And PVDF (polyvinylidene fluoride). TPE (thermoplastic elastomer) may also be used, and examples of TPE include TPO (olefin-based), TPS (styrene-based), TPEE (ester-based), TPU (urethane-based), TPA (nylon-based), And TPVC (vinyl chloride type) is mentioned.

  Note that a filler may be added to the resin member 2. Examples of the filler include inorganic fillers (glass fibers, inorganic salts, etc.), metal fillers, organic fillers, and carbon fibers.

-Manufacturing method of bonded structure-
Next, with reference to FIGS. 1-5, the manufacturing method of the junction structure 100 by this embodiment is demonstrated.

  First, as shown in FIG. 3, the surface 1 a of the metal member 1 is irradiated with a processing laser L <b> 1 to form the perforated portion 11 and the protruding portion 11 a on the inner peripheral surface thereof. That is, the perforated part 11 is formed by physical processing. The laser L1 is, for example, a fiber laser, and one pulse is composed of a plurality of subpulses. The perforated part 11 is formed to mechanically join the metal member 1 and the resin member 2 by the anchor effect.

  Thereafter, as shown in FIG. 4, the surface 1 a of the metal member 1 is irradiated with a processing laser L <b> 2, thereby forming a recess 12 that is shallower than the perforated portion 11. That is, the recess 12 is formed by physical processing. The laser L2 is, for example, a fiber laser, and one pulse is composed of a single pulse. The recess 12 is formed in order to improve the absorptance of a laser L3 for bonding described later. As shown in FIG. 2, the recesses 12 are arranged in a dot shape. Further, the lasers L1 and L2 can be irradiated by the same processing apparatus, and the perforated portion 11 and the recess 12 are formed using the same processing apparatus.

  Next, as shown in FIG. 5, the resin member 2 is laminated on the surface 1a of the metal member 1, and the metal L1 is irradiated with a laser L3 for bonding from the resin member 2 side toward the surface 1a of the metal member 1. The member 1 becomes high temperature, and the resin member 2 is melted by the heat. Then, the melted resin member 2 is filled in the perforated portion 11 and the recess 12, and then the resin member 2 is solidified. Thereby, the metal member 1 and the resin member 2 are mechanically joined by the anchor effect. This laser L3 is, for example, a semiconductor laser.

  In this way, the bonded structure 100 shown in FIG. 1 is manufactured.

-Effect-
In the present embodiment, as described above, the step of forming the perforated portion 11 on the surface 1 a of the metal member 1 and the concave portion shallower than the perforated portion 11 on the surface 1 a of the metal member 1 after the perforated portion 11 is formed. 12 and a step of bonding the metal member 1 and the resin member 2 by irradiating the bonding laser L3. By configuring in this way, the absorption ratio of the laser L3 can be improved by forming the recess 12 in the surface 1a of the metal member 1, so that the laser L3 can be efficiently converted into heat, and the metal member The occurrence of variations in the heating state of 1 can be suppressed. Thereby, since the molten state of the resin member 2 melted by heat can be equalized, it is possible to suppress the occurrence of variation in the bonding state between the metal member 1 and the resin member 2. Therefore, it is possible to improve the bonding quality. Moreover, since the recessed part 12 for improving the absorption rate of the laser L3 can be formed by physical processing, the manufacturing process can be shortened compared with the case where an anodizing process or a plating process is performed. As a result, it is possible to suppress the deterioration of productivity while improving the bonding quality.

  Moreover, in this embodiment, the anchor effect can be improved by forming the protruding portion 11 a inside the perforated portion 11.

  Moreover, in this embodiment, since the position of the recessed part 12 formed in the surface 1a of the metal member 1 can be controlled by forming the recessed part 12 with the laser L2 for processing, the recessed part 12 and the perforated part 11 can be controlled. Can be easily formed at positions where they do not overlap.

  Further, in this embodiment, even if the recess 12 is formed at a position overlapping the perforated portion 11 by making the depth of the recess 12 shorter than the distance from the surface 1a to the apex of the protrusion 11a, the protrusion Since 11a is not crushed, it can suppress that joint strength falls.

  In the present embodiment, the punching portion 11 is formed by the processing laser L1, and the recess 12 is formed by the processing laser L2, so that the punching portion 11 and the recess 12 are continuously formed using the same processing apparatus. Therefore, the manufacturing process can be further shortened.

-Deformation of recess
Next, with reference to FIGS. 6-8, the modification of the recessed part 12 formed in the surface 1a of the metal member 1 is demonstrated.

  FIG. 6 is a schematic view of the recess 12a according to the first modified example of the present embodiment when viewed in plan. The recess 12a shown in FIG. 6 is formed in a groove shape and extends linearly. A plurality of linear recesses 12a are provided, and are arranged substantially in parallel with a predetermined interval.

  FIG. 7 is a schematic view of the recess 12b according to the second modification of the present embodiment as seen in a plan view. The recess 12b shown in FIG. 7 is formed in a groove shape and in an arc shape. A plurality of arc-shaped recesses 12b are provided, and are arranged so as to be continuous in one direction (left-right direction in FIG. 7). In addition, the recesses 12b that are continuous in one direction are arranged at an interval in the other direction (vertical direction in FIG. 7).

  FIG. 8 is a schematic view of the recess 12c according to the third modification of the present embodiment when viewed in plan. The recess 12c shown in FIG. 8 is formed in a groove shape and in a lattice shape.

-Experimental example-
Next, with reference to FIG. 9, an experimental example performed to confirm the effect of the above-described embodiment will be described.

  In this experimental example, the samples according to Examples 1 to 4 and the sample according to the comparative example were produced, and the bonding evaluation was performed for each. The results are shown in Table 1. In addition, the samples of Examples 1-4 and the comparative example were produced 20 pieces each. Example 1 corresponds to the present embodiment, and circular concave portions are formed in a dot shape (matrix shape). Example 2 corresponds to the first modified example, and a groove-like recess is formed linearly. Example 3 corresponds to the second modified example, and a groove-like recess is formed in an arc shape. Example 4 corresponds to the third modified example, and groove-shaped concave portions are formed in a lattice shape. On the other hand, in the comparative example, no recess is formed for improving the absorption rate of the bonding laser.

  First, a method for manufacturing the bonded structure 500 according to the first embodiment will be described.

  In the bonded structure 500 of Example 1, SUS304 was used as the material of the metal member 501. As shown in FIG. 9, the metal member 501 is formed in a plate shape, has a length of 100 mm, a width of 29 mm, and a thickness of 3 mm.

  Then, a predetermined region R on the surface of the metal member 501 was irradiated with a processing laser to form a perforated portion. This perforated part is for mechanically joining the metal member 501 and the resin member 502 by the anchor effect. The predetermined region R is an area where the bonded structure 500 is bonded, and is 20 mm × 20 mm. This laser irradiation was performed using an Omron fiber laser marker MX-Z2000. The laser irradiation conditions are as follows.

<Laser irradiation conditions for forming perforations>
Laser: Fiber laser (wavelength 1062nm)
Frequency: 10kHz
Output: 3.8W
Scanning speed: 650mm / sec
Number of scans: 20 times Irradiation interval: 65 μm
Number of subpulses: 20
The frequency is a frequency of a pulse constituted by a plurality (20 in this example) of sub-pulses. That is, under this irradiation condition, laser (pulse) is irradiated 10,000 times at intervals of 65 μm while moving 650 mm per second, and the pulse is composed of 20 sub-pulses. Note that the number of scans is the number of times the laser is repeatedly irradiated to the same location.

  In this way, by irradiating a laser in which one pulse is composed of a plurality of sub-pulses, a perforated portion is formed in the predetermined region R on the surface of the metal member 501, and a protruding portion is formed on the inner peripheral surface of the perforated portion. Is formed.

  Next, a predetermined region R on the surface of the metal member 501 was irradiated with a processing laser to form a dot-shaped recess. The concave portion is formed so as to be shallower than the perforated portion, and is for improving the absorptance of a laser for bonding described later. This laser irradiation was performed using an Omron fiber laser marker MX-Z2000. That is, the perforated part and the recessed part were formed using the same processing apparatus. The laser irradiation conditions are as follows.

<Laser irradiation conditions for forming recesses>
Laser: Fiber laser (wavelength 1062nm)
Frequency: 10kHz
Output: 2.1W
Scanning speed: 700mm / sec
Number of scans: 5 times Irradiation interval: 70 μm
This laser is a single pulse and is not composed of a plurality of sub-pulses.

  Thereafter, the resin member 502 is laminated on the predetermined region R of the metal member 501. As this resin member 502, PMMA (polymethyl methacrylate) was used. The resin member 502 is formed in a plate shape, has a length of 100 mm, a width of 25 mm, and a thickness of 3 mm.

  Then, the metal member 501 and the resin member 502 were joined by irradiating a laser for joining toward the predetermined region R of the metal member 501 from the resin member 502 side. Specifically, the metal member 501 is heated by laser irradiation, and the resin member 502 is melted by the heat. Then, after the melted resin member 502 is filled in the perforated portion and the recess, the resin member 502 is solidified. Moreover, the irradiation conditions of the laser for joining are as follows.

<Laser irradiation conditions for bonding>
Laser: Semiconductor laser (wavelength 808 nm)
Oscillation mode: Continuous oscillation Output: 30W
Focal diameter: 4mm
Scanning speed: 1mm / sec
Contact pressure: 0.6 MPa
In this way, the bonded structure 500 of Example 1 was produced.

  Next, the manufacturing method of the junction structure of Examples 2-4 is demonstrated. In the joint structure of Example 2, the groove-shaped recess was formed in a straight line. In the joint structure of Example 3, the groove-shaped recess was formed in an arc shape. In the joint structure of Example 4, the groove-shaped concave portions were formed in a lattice shape. The other points of Examples 2 to 4 are the same as those of Example 1. The irradiation conditions of the laser for forming recesses in Examples 2 to 4 are as follows.

<Laser irradiation conditions for forming recesses>
Laser: Fiber laser (wavelength 1062nm)
Frequency: 10kHz
Output: 2.1W
Scanning speed: 400mm / sec
Number of scans: 5 times Irradiation interval: 40 μm
In Examples 2 to 4, a groove-like recess was formed by connecting a plurality of dot-like recesses into a linear shape.

  Next, a method for manufacturing a bonded structure according to a comparative example will be described. In the bonded structure of the comparative example, no recess was formed to improve the absorption rate of the bonding laser. The remaining points of the comparative example are the same as those of the first embodiment.

  And the joining evaluation about the sample of Examples 1-4 and a comparative example was performed.

  Specifically, using an electromechanical universal testing machine 5900 manufactured by Instron, the test was performed in the shearing direction at a tensile speed of 5 mm / min, and the test was terminated when the resin member was broken or the bonding interface was broken. Note that the shear direction is a direction deviating along the bonding interface (the left-right direction in FIG. 9). Further, when the resin member is broken, it can be said that the bonding strength of the bonded portion is sufficient because the bonding interface is not broken by then.

  As shown in Table 1 above, in the comparative example, there were 5 samples with interface breakdown and 15 samples with material breakdown. On the other hand, in Examples 1 to 4, there were 0 samples with interface destruction and 20 samples with material destruction. That is, in the comparative examples, the bonding strength varies, but in Examples 1 to 4, the bonding strength can be suppressed from varying. Therefore, in Examples 1 to 4, it was possible to improve the bonding quality as compared with the comparative example.

  In Examples 1 to 4, by forming a recess for improving the absorption rate of the laser for bonding, the absorption rate of the laser is improved, and the laser is efficiently converted into heat. By suppressing the variation in the heating state, it was possible to equalize the molten state of the resin member that is melted by heat. Therefore, it is possible to suppress the occurrence of variation in the bonding state between the metal member and the resin member. It is thought that it was because it was made.

-Other embodiments-
In addition, embodiment disclosed this time is an illustration in all the points, Comprising: It does not become a basis of limited interpretation. Therefore, the technical scope of the present invention is not interpreted only by the above-described embodiments, but is defined based on the description of the scope of claims. Further, the technical scope of the present invention includes all modifications within the meaning and scope equivalent to the scope of the claims.

  For example, in this embodiment, although the example in which the perforated part 11 is formed in the surface 1a of the metal member 1 was shown, it is not restricted to this, Even if the groove-shaped 1st recessed part is formed in the surface of a metal member Good. Moreover, although the example in which the protrusion part 11a was formed in the perforated part 11 was shown, not only this but the perforated part may be formed in the cylindrical shape or the mortar shape. Moreover, although the example which forms the perforation part 11 with the laser L1 was shown, it is not restricted to this, The physical process of a plasma process, a corona discharge, a blast process, a press process, a sandpaper process, etc. is performed on the surface of a metal member. One concave portion may be formed.

  In the present embodiment, the example in which the concave portion 12 is formed by the laser L2 is shown. However, the present invention is not limited to this, and the metal member is formed by physical processing such as plasma processing, corona discharge, blast processing, press processing, and sandpaper processing. You may make it form a 2nd recessed part in the surface of this.

  Further, in the present embodiment, the example in which the perforated part 11 and the recessed part 12 are formed by the same processing apparatus has been described, but the present invention is not limited thereto, and the perforated part and the recessed part may be formed by different processing apparatuses.

  In the present embodiment, an example in which the resin member 2 is a thermoplastic resin has been described. However, the present invention is not limited thereto, and the resin member may be a thermosetting resin. Examples of thermosetting resins include EP (epoxy), PUR (polyurethane), UF (urea formaldehyde), MF (melamine formaldehyde), PF (phenol formaldehyde), UP (unsaturated polyester), and SI (silicone) Is mentioned. Further, it may be FRP (fiber reinforced plastic).

The present invention is applicable to production how the joint structure and the metal member and the resin member are bonded.

DESCRIPTION OF SYMBOLS 1 Metal member 1a Surface 2 Resin member 11 Perforated part (1st recessed part)
11a Protruding part 12, 12a, 12b, 12c Concave part (second concave part)
100 joint structure

Claims (3)

A method for manufacturing a bonded structure in which a metal member and a resin member having transparency to a bonding laser are bonded,
Forming a first concave portion on the surface of the metal member;
Forming a second concave portion shallower than the first concave portion on the surface of the metal member after forming the first concave portion; and
By placing the resin member on the surface of the metal member and irradiating a laser for bonding from the resin member side toward the surface of the metal member, the resin member is filled in the first concave portion and solidified. A step of joining the metal member and the resin member ,
The first concave portion includes a circular perforated portion when seen in a plan view,
On the inner peripheral surface of the perforated part, a protruding part protruding inward is formed,
The depth of the said 2nd recessed part is formed so that it may become shorter than the distance from the surface of the said metal member to the lower end of the said protrusion part, The manufacturing method of the junction structure characterized by the above-mentioned. In the manufacturing method of the joined structure according to claim 1,
The first concave portion is provided for mechanically joining the metal member and the resin member,
The method for manufacturing a joint structure, wherein the second concave portion is provided in order to improve the absorption rate of a laser for joining. In the manufacturing method of the junction structure according to claim 1 or 2 ,
The method for manufacturing a joint structure, wherein the first concave portion and the second concave portion are formed by a processing laser.

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