TW202235193A - Method for producing junction and junction - Google Patents
Method for producing junction and junction Download PDFInfo
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- TW202235193A TW202235193A TW111101918A TW111101918A TW202235193A TW 202235193 A TW202235193 A TW 202235193A TW 111101918 A TW111101918 A TW 111101918A TW 111101918 A TW111101918 A TW 111101918A TW 202235193 A TW202235193 A TW 202235193A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
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Abstract
Description
本揭示是有關於一種接合體的製造方法及接合體。The disclosure relates to a method for manufacturing a joint body and the joint body.
先前,作為將包含不同的材料的多個構件彼此接合的方法,已知有對構件彼此的邊界面照射雷射光並利用接觸傳熱使材料熔融並進行接合的方法。例如,藉由對含有樹脂的構件及含有樹脂以外的材料的構件的邊界面照射雷射光而對含有樹脂以外的材料的構件進行加熱。然後,藉由自含有樹脂以外的材料的構件傳遞來的熱使含有樹脂的構件熔融後使該樹脂固化而進行接合。Conventionally, as a method of joining a plurality of members made of different materials, there is known a method of irradiating a boundary surface between members with laser light and melting the materials by contact heat transfer to join them. For example, the member containing the material other than the resin is heated by irradiating the interface between the member containing the resin and the member containing the material other than the resin with laser light. Then, the member containing the resin is melted by heat transmitted from the member containing a material other than the resin, and the resin is solidified to perform bonding.
例如,專利文獻1中提出了一種構件的接合方法,所述構件的接合方法將透過雷射光的第一構件與使邊界面成為具有直徑1 μm以下的微小孔的凹凸狀態的金屬性的第二構件相互重合,並照射雷射光。For example,
另外,專利文獻2中提出了一種構件的接合方法,所述構件的接合方法將包括具有特定形狀的穿孔部的第一構件與第二構件鄰接配置,向所述穿孔部照射雷射光,將第二構件填充至所述穿孔部中並使其固化。
[現有技術文獻]
[專利文獻]
In addition,
[專利文獻1]日本專利特開2010-274279號公報 [專利文獻2]日本專利特開2016-43561號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2010-274279 [Patent Document 2] Japanese Patent Laid-Open No. 2016-43561
[發明所欲解決之課題][Problem to be Solved by the Invention]
專利文獻1~專利文獻2的發明中,利用接觸傳熱而將構件彼此接合。然而,於所述情況下,對含有樹脂以外的材料的構件(相當於本揭示的第二構件)所要求的平面度高。若假設含有樹脂以外的材料的構件的平面度低(例如200 μm以上),則來自接合部分中的凹部的傳熱變得不充分。因此,於接合後在構件之間產生間隙,接合體的接合密封性下降。藉由長時間進行雷射掃描,可提高熔融側的構件的平面度,但於所述情況下生產性下降。In the inventions of
因此,本案發明者發現利用先前的方法難以實現能夠兼具接合密封性與生產性的接合方法。Therefore, the inventors of the present application found that it was difficult to realize a bonding method capable of achieving both bonding sealing performance and productivity by the conventional method.
本揭示於一方面是鑒於此種實際情況而成者,其目的在於提供一種能夠兼具生產性與所獲得的接合體的接合密封性的接合體的製造方法。 [解決課題之手段] On the one hand, the present disclosure is made in view of such actual situation, and an object thereof is to provide a method for manufacturing a bonded body capable of achieving both productivity and joint-tightness of the obtained bonded body. [Means to solve the problem]
本揭示為了解決所述課題而採用以下結構。This disclosure adopts the following structures in order to solve the above-mentioned problems.
即,本揭示的一方面的接合體的接合方法包括以下的步驟(A)~步驟(C):(A)於含有具有雷射透過性的樹脂的第一構件的表面形成凹凸部的步驟;(B)於含有樹脂以外的材料的第二構件的表面形成凹凸部的步驟;以及(C)使所述第一構件的凹凸部與所述第二構件的凹凸部相對地重合,自所述第一構件側照射雷射光,使所述第一構件與所述第二構件接合的步驟。That is, the bonding method of a bonded body according to an aspect of the present disclosure includes the following steps (A) to (C): (A) a step of forming concavo-convex portions on the surface of the first member containing a resin having laser transparency; (B) a step of forming a concave-convex portion on the surface of the second member containing a material other than resin; and (C) overlapping the concave-convex portion of the first member with the concave-convex portion of the second member, The first member is irradiated with laser light to join the first member and the second member.
另外,本揭示的一方面的接合體包括:第一構件,含有具有雷射透過性的樹脂且於表面具有凹凸部;以及第二構件,含有樹脂以外的材料且於表面具有凹凸部,以使所述第一構件的凹凸部與第二構件的凹凸部相對地重合的形式,將所述第一構件與所述第二構件接合。 [發明的效果] In addition, a bonded body according to an aspect of the present disclosure includes: a first member containing a resin having laser transparency and having unevenness on the surface; and a second member including a material other than resin and having unevenness on the surface so that The concavo-convex portion of the first member and the concavo-convex portion of the second member are relatively overlapped to join the first member and the second member. [Effect of the invention]
根據本揭示,可提供一種能夠兼具生產性與所獲得的接合體的接合密封性的接合體的製造方法。According to the present disclosure, it is possible to provide a method of manufacturing a bonded body capable of achieving both productivity and joint sealing properties of the obtained bonded body.
以下,基於圖式對本揭示的一方面的實施形態(以下亦表述為「本實施形態」)進行說明。Hereinafter, an embodiment of one aspect of the present disclosure (hereinafter also referred to as “the present embodiment”) will be described based on the drawings.
§1應用例 首先,使用圖1對本揭示的一態樣的接合體的製造方法的概要進行說明。圖1是表示本揭示的一態樣的接合體的製造方法的剖面圖。 §1 Application example First, an outline of a method for manufacturing a bonded body according to an aspect of the present disclosure will be described using FIG. 1 . FIG. 1 is a cross-sectional view illustrating a method of manufacturing a bonded body according to an aspect of the present disclosure.
如圖1所示般,本實施形態中的接合體的製造方法是藉由使含有具有雷射透過性的樹脂的第一構件1的凹凸部21與含有樹脂以外的材料的第二構件2的凹凸部22相對地重合並向接合部4照射雷射光3而接合的接合體的製造方法。本實施形態的接合體的製造方法包括以下的步驟(A)~步驟(C):(A)於含有具有雷射透過性的樹脂的第一構件1的表面形成凹凸部21的步驟;(B)於含有樹脂以外的材料的第二構件2的表面形成凹凸部22的步驟;以及(C)使所述第一構件的凹凸部21與所述第二構件的凹凸部22相對地重合,自所述第一構件1側照射雷射光3,使所述第一構件1與所述第二構件2接合的步驟。As shown in FIG. 1 , the method of manufacturing the bonded body in this embodiment is to make the concave-
於步驟(A)中形成的第一構件的凹凸部21於短時間內吸收雷射光3而軟化或熔融,因此可縮短接合時的雷射掃描時間。另外,第一構件的凹凸部21於接合部4中以嵌入至步驟(B)中形成的第二構件的凹凸部22的形式固化而形成接合體,因此可提供接合密封性優異的接合體。The concavo-
§2結構例 [接合體的製造方法] <步驟(A)> 本揭示的一實施形態的接合體的製造方法(以下亦稱為本製造方法)中的步驟(A)是於含有具有雷射透過性的樹脂的第一構件的表面形成凹凸部的步驟。藉由於第一構件的表面形成有凹凸部,於後述的步驟(C)的接合時,雷射光透過第一構件的凹凸部以外的部分,雷射光被第一構件的凹凸部吸收。即,第一構件中的凹凸部亦可稱為能夠吸收雷射光的凹凸部。因此,僅第一構件的凹凸部及其附近的第一構件軟化、熔融。因此,即便雷射掃描時間短,接合體亦具有高接合密封性。 §2 Structural example [Manufacturing method of joint body] <Step (A)> Step (A) in the method of manufacturing a bonded body according to an embodiment of the present disclosure (hereinafter also referred to as the present manufacturing method) is a step of forming unevenness on the surface of the first member containing a resin having laser transparency. Since the concave-convex portion is formed on the surface of the first member, the laser light is transmitted through the portion other than the concave-convex portion of the first member during bonding in step (C) described later, and the laser light is absorbed by the concave-convex portion of the first member. That is, the concavo-convex portion in the first member may also be referred to as a concavo-convex portion capable of absorbing laser light. Therefore, only the concavo-convex portion of the first member and the first member in the vicinity thereof are softened and melted. Therefore, even if the laser scanning time is short, the bonded body has high bond-tightness.
形成第一構件的凹凸部的方法可利用任意的形成方法進行。作為此種任意的形成方法,例如可列舉雷射加工、利用砂紙進行的加工、利用超精密模具進行的成形、微細切削加工等。The method of forming the concavo-convex portion of the first member can be performed by any forming method. Such arbitrary forming methods include, for example, laser processing, processing with sandpaper, molding with an ultra-precision mold, micro-cutting, and the like.
第一構件的凹凸部的形成所使用的雷射例如可列舉:CO 2雷射、光纖雷射、釔鋁石榴石(Yttrium Aluminum Garnet,YAG)雷射、YVO 4雷射、半導體雷射、準分子雷射等。就第一構件的凹凸部的雷射吸收特性的觀點而言,較佳為使用CO 2雷射。另外,雷射的照射條件可根據第一構件的凹凸部的所需的形狀適宜變更。即,雷射例如可為連續波,亦可為脈衝波。 Examples of lasers used to form the concavo-convex portion of the first member include: CO 2 laser, fiber laser, yttrium aluminum garnet (Yttrium Aluminum Garnet, YAG) laser, YVO 4 laser, semiconductor laser, quasi- Molecular lasers, etc. From the viewpoint of the laser absorption properties of the concavo-convex portion of the first member, it is preferable to use a CO 2 laser. In addition, the irradiation conditions of the laser can be changed as appropriate according to the desired shape of the concavo-convex portion of the first member. That is, the laser may be, for example, a continuous wave or a pulsed wave.
(第一構件) 第一構件含有具有雷射透過性的樹脂。作為此種樹脂,例如可列舉熱塑性樹脂及熱硬化性樹脂。 (first component) The first member contains a resin having laser transparency. Examples of such resins include thermoplastic resins and thermosetting resins.
作為所述熱塑性樹脂,例如可列舉:聚氯乙烯(Polyvinyl Chloride,PVC)、聚苯乙烯(Polystyrene,PS)、丙烯腈-苯乙烯(Acrylonitrile Styrene,AS)、丙烯腈-丁二烯-苯乙烯(Acrylonitrile Butadiene Styrene,ABS)、聚甲基丙烯酸甲酯(Polymethyl Methacrylate,PMMA)、聚乙烯(Polyethylene,PE)、聚丙烯(Polypropylene,PP)、聚碳酸酯(Polycarbonate,PC)、改質聚苯醚(Modification-Polyphenylene Ether,M-PPE)、聚醯胺6(PA(Polyamide)6)、聚醯胺66(PA66)、聚縮醛(Polyacetal,POM)、聚對苯二甲酸乙二酯(Polyethylene Terephthalate,PET)、聚對苯二甲酸丁二酯(Polybutylene Terephthalate,PBT)、聚碸(Polysulphone,PSF)、聚芳酯(Polyarylate,PAR)、聚醚醯亞胺(Polyetherimide,PEI)、聚苯硫醚(Polyphenylene Sulfide,PPS)、聚醚碸(Polyether Sulphone,PES)、聚醚醚酮(Polyether Ether Ketone,PEEK)、聚醯胺醯亞胺(Polyamideimide,PAI)、液晶聚合物(Liquid Crystal Polymer,LCP)、聚偏二氯乙烯(Polyvinylidene Chloride,PVDC)、聚四氟乙烯(Polytetrafluoroethylene,PTFE)、聚氯三氟乙烯(Polychlorotrifluoroethylene,PCTFE)及聚偏二氟乙烯(Polyvinylidene Fluoride,PVDF)。另外,亦可為熱塑性彈性體(Thermoplastic Elastomer,TPE),作為TPE的一例,可列舉:熱塑性聚烯烴(Thermoplastic Polyolefin,TPO)(烯烴系)、熱塑性苯乙烯(Thermoplastic Styrene,TPS)(苯乙烯系)、熱塑性聚酯彈性體(Thermoplastic Polyester Elastomer,TPEE)(酯系)、熱塑性聚胺基甲酸酯(Thermoplastic Polyurethane,TPU)(胺基甲酸酯系)、熱塑性聚醯胺(Thermoplastic Polyamide,TPA)(尼龍系)及熱塑性聚氯乙烯(Thermoplastic Polyvinyl Chloride,TPVC)(氯乙烯系)。另外,作為所述熱硬化性樹脂的一例,可列舉:環氧樹脂(Epoxy,EP)、聚胺基甲酸酯(Polyurethane,PUR)、脲甲醛(Urea Formaldehyde,UF)、三聚氰胺甲醛(Melamine Formaldehyde,MF)、苯酚甲醛(Phenol Formaldehyde,PF)、不飽和聚酯(Unsaturated Polyester,UP)及矽酮(Silicone,SI)。另外,亦可為纖維強化塑膠(Fiber Reinforced Plastic,FRP)。作為FRP,例如可列舉碳纖維強化熱塑性樹脂(Carbon Fibre Reinforced Thermoplastic,CFRTP)等。其中,就加工性及強度優異的觀點而言,較佳為PMMA。Examples of the thermoplastic resin include: polyvinyl chloride (Polyvinyl Chloride, PVC), polystyrene (Polystyrene, PS), acrylonitrile-styrene (Acrylonitrile Styrene, AS), acrylonitrile-butadiene-styrene (Acrylonitrile Butadiene Styrene, ABS), polymethyl methacrylate (Polymethyl Methacrylate, PMMA), polyethylene (Polyethylene, PE), polypropylene (Polypropylene, PP), polycarbonate (Polycarbonate, PC), modified polystyrene Ether (Modification-Polyphenylene Ether, M-PPE), polyamide 6 (PA (Polyamide) 6), polyamide 66 (PA66), polyacetal (Polyacetal, POM), polyethylene terephthalate ( Polyethylene Terephthalate, PET), Polybutylene Terephthalate (PBT), Polysulphone (PSF), Polyarylate (PAR), Polyetherimide (PEI), Poly Polyphenylene Sulfide (PPS), Polyether Sulphone (PES), Polyether Ether Ketone (PEEK), Polyamideimide (PAI), Liquid Crystal Polymer (Liquid Crystal Polymer, LCP), polyvinylidene chloride (Polyvinylidene Chloride, PVDC), polytetrafluoroethylene (Polytetrafluoroethylene, PTFE), polychlorotrifluoroethylene (Polychlorotrifluoroethylene, PCTFE) and polyvinylidene fluoride (Polyvinylidene Fluoride, PVDF). In addition, it may be a thermoplastic elastomer (Thermoplastic Elastomer, TPE). As an example of TPE, thermoplastic polyolefin (Thermoplastic Polyolefin, TPO) (olefin system), thermoplastic styrene (Thermoplastic Styrene, TPS) (styrene system) ), Thermoplastic Polyester Elastomer (TPEE) (ester system), thermoplastic polyurethane (Thermoplastic Polyurethane, TPU) (urethane system), thermoplastic polyamide (Thermoplastic Polyamide, TPA ) (nylon) and thermoplastic polyvinyl chloride (Thermoplastic Polyvinyl Chloride, TPVC) (vinyl chloride). In addition, examples of the thermosetting resin include: epoxy resin (Epoxy, EP), polyurethane (Polyurethane, PUR), urea formaldehyde (Urea Formaldehyde, UF), melamine formaldehyde (Melamine Formaldehyde) , MF), phenol formaldehyde (Phenol Formaldehyde, PF), unsaturated polyester (Unsaturated Polyester, UP) and silicone (Silicone, SI). In addition, fiber reinforced plastic (Fiber Reinforced Plastic, FRP) may also be used. As FRP, carbon fiber reinforced thermoplastic resin (Carbon Fiber Reinforced Thermoplastic, CFRTP) etc. are mentioned, for example. Among them, PMMA is preferable from the viewpoint of being excellent in workability and strength.
圖3中示意性地表示後述的實施例中使用的第一構件1。圖3所示的第一構件1僅為一例,第一構件1的形狀、大小及凹凸部21的形成位置並無特別限定,可適宜變更。如圖3所示的例子般,於第一構件1的表面形成有第一構件的凹凸部21。FIG. 3 schematically shows a
第一構件的凹凸部的雷射吸收率較佳為10%以上,更佳為20%以上,進而佳為30%以上。雷射吸收率的上限並無特別限定,例如亦可為100%以下。若雷射吸收率為所述範圍,則於後述的步驟(C)中,第一構件的凹凸部及其周邊更容易軟化或熔融,因此所獲得的接合體的接合密封性提高。The laser absorption rate of the concavo-convex portion of the first member is preferably at least 10%, more preferably at least 20%, and still more preferably at least 30%. The upper limit of the laser absorptivity is not particularly limited, and may be, for example, 100% or less. If the laser absorptivity is in the above range, the concavo-convex portion of the first member and its periphery are more likely to be softened or melted in the step (C) described later, and thus the bonded sealability of the bonded body obtained is improved.
所述雷射吸收率例如可使用雷射功率計測定雷射透過率,並藉由下述式算出。另外,亦可使用積分球等直接測定吸收率。The laser absorptivity can be calculated by the following equation by measuring the laser transmittance using a laser power meter, for example. Alternatively, the absorbance may be directly measured using an integrating sphere or the like.
100(%)-透過率(%)=雷射吸收率(%) 另一方面,第一構件的凹凸部以外的部分的雷射吸收率較佳為小於10%,更佳為9%以下,進而佳為8%以下。若第一構件的凹凸部以外的部分的雷射吸收率為所述範圍內,則雷射光容易集中於第一構件的凹凸部,所獲得的接合體的生產性提高。 100 (%)-transmittance (%)=laser absorption rate (%) On the other hand, the laser absorptivity of the first member other than the concavo-convex portion is preferably less than 10%, more preferably 9% or less, further preferably 8% or less. When the laser absorptivity of the portion other than the concave-convex portion of the first member is within the above-mentioned range, the laser light is easily concentrated on the concave-convex portion of the first member, and the productivity of the bonded body obtained is improved.
第一構件的凹凸部的加工形狀並無特別限定。例如,可於凹凸部形成有多個槽,亦可形成有多個穿孔,還可形成有不規則的形狀。The processed shape of the concave-convex portion of the first member is not particularly limited. For example, a plurality of grooves may be formed in the concavo-convex portion, a plurality of perforations may also be formed, and an irregular shape may also be formed.
圖6~圖8例示實施形態的第一構件的凹凸部的形狀。圖6所示的形狀是形成有規則的槽的形狀。圖7所示的形狀是形成有多個規則的穿孔的形狀。本說明書中,為了方便,將圖7所示的形狀亦稱為「點群形狀」。圖8所示的形狀是具有不規則的凹凸的形狀。本說明書中,為了方便,將圖8所示的形狀亦稱為「無規則形狀」。第一構件的凹凸部亦可部分地形成有多種形狀。即,例如圖6所示的形狀與圖7所示的形狀可併存。6 to 8 illustrate the shape of the concavo-convex portion of the first member according to the embodiment. The shape shown in FIG. 6 is a shape in which regular grooves are formed. The shape shown in FIG. 7 is a shape formed with a plurality of regular perforations. In this specification, for convenience, the shape shown in FIG. 7 is also referred to as "point cloud shape". The shape shown in FIG. 8 has irregular irregularities. In this specification, for convenience, the shape shown in FIG. 8 is also referred to as "random shape". The concavo-convex portion of the first member may also be partially formed in various shapes. That is, for example, the shape shown in FIG. 6 and the shape shown in FIG. 7 can coexist.
第一構件的凹凸部的深度相對於第二構件的凹凸部的平面度公差的比例較佳為50%以上,更佳為80%以上,進而佳為100%以上,最佳為120%以上。第一構件的凹凸部的深度相對於第二構件的凹凸部的平面度公差的比例的上限並無特別限定,例如亦可為200%以下。若第一構件的凹凸部的深度為所述範圍,則可將藉由雷射軟化或熔融的第一構件充分地填充至所述第二構件的凹凸部,因此接合體的接合密封性提高。The ratio of the depth of the concavo-convex part of the first member to the flatness tolerance of the concavo-convex part of the second member is preferably 50% or more, more preferably 80% or more, further preferably 100% or more, most preferably 120% or more. The upper limit of the ratio of the depth of the concavo-convex portion of the first member to the flatness tolerance of the concavo-convex portion of the second member is not particularly limited, and may be, for example, 200% or less. If the depth of the concave-convex part of the first member is within the above range, the first member softened or melted by the laser can be sufficiently filled into the concave-convex part of the second member, and thus the bonded sealability of the bonded body is improved.
以下,參照圖2對所述第一構件的凹凸部的深度進行說明。圖2是將第一構件的凹凸部與第二構件的凹凸部相對地重合的部分、即接合部的一例放大的示意圖。圖2所示的例子中,所謂第一構件的凹凸部的深度11,是指自接合部中的第一構件1的表面至第一構件的凹凸部的底部為止的垂直距離。即,於第一構件的凹凸部的形狀為點群形狀的情況下,是指自穿孔的開口部至底部為止的垂直距離。另外,於第一構件的凹凸部為槽形狀的情況下,是指自第一構件的表面至槽底部為止的垂直距離。進而,於第一構件的凹凸部為無規則形狀的情況下,是指隨機選擇的多個測定點的凹凸部的深度的6倍標準偏差。就提高測定的精度的觀點而言,測定深度的測定點數例如亦可為100點以上。於在第一構件的凹凸部併存有多個形狀的情況下,亦可為各形狀的平均值。第一構件的凹凸部的深度例如可藉由非接觸光學式三維形狀測定裝置來測定。Hereinafter, the depth of the concavo-convex portion of the first member will be described with reference to FIG. 2 . FIG. 2 is an enlarged schematic view of an example of a joint portion where the concave-convex portion of the first member and the concave-convex portion of the second member are relatively overlapped. In the example shown in FIG. 2 , the
另外,本說明書中,第二構件的平面度公差12是指藉由非接觸光學式三維形狀測定裝置測定的第二構件的凹凸部的深度與第二構件本來具有的平面度的合計值。再者,第二構件的凹凸部的深度可與第一構件的凹凸部的深度同樣地定義。In addition, in this specification, the
所述第一構件的凹凸部的深度可藉由變更雷射的掃描次數等進行調整。例如,若增加雷射的掃描次數,則所述凹凸部的深度變深,若減少雷射的掃描次數,則所述凹凸部的深度變淺。The depth of the concavo-convex part of the first member can be adjusted by changing the scanning times of the laser and the like. For example, if the number of laser scans is increased, the depth of the concave-convex portion becomes deeper, and if the number of laser scans is decreased, the depth of the concave-convex portion becomes shallower.
於所述第一構件中可添加填充劑。作為填充劑,例如可列舉:無機系填充劑(玻璃纖維、無機鹽類等)、金屬系填充劑、有機系填充劑及碳纖維等。A filler may be added to the first member. Examples of fillers include inorganic fillers (glass fibers, inorganic salts, etc.), metal fillers, organic fillers, carbon fibers, and the like.
所述第一構件除了含有所述具有雷射透過性的樹脂以外,亦可於不妨礙所述效果的範圍內視需要含有添加劑。作為添加劑的一例,可列舉:施膠劑、分散劑、抗氧化劑、紫外線吸收劑、抗靜電劑、阻燃劑、潤滑劑、晶核材料、塑化劑、染料、顏料及碳奈米管。In addition to the above-mentioned resin having laser transparency, the first member may optionally contain additives within a range that does not hinder the above-mentioned effects. Examples of additives include sizing agents, dispersants, antioxidants, ultraviolet absorbers, antistatic agents, flame retardants, lubricants, crystal nucleus materials, plasticizers, dyes, pigments, and carbon nanotubes.
<步驟(B)> 本製造方法中的步驟(B)是於含有樹脂以外的材料的第二構件的表面形成凹凸部的步驟。藉由該步驟,於後述的步驟(C)中,軟化或熔融的第一構件能夠與第二構件牢固地結合,因此所獲得的接合體的強度提高。 <Step (B)> The step (B) in this manufacturing method is a step of forming the concavo-convex part on the surface of the second member containing a material other than resin. Through this step, the softened or melted first member can be firmly bonded to the second member in the step (C) described later, and thus the strength of the obtained bonded body is improved.
形成第二構件的凹凸部的方法並無特別限定,例如可列舉雷射加工、利用砂紙進行的加工、放電加工、利用超精密模具進行的成形、微細切削加工、電化學處理等。The method of forming the concave-convex portion of the second member is not particularly limited, and examples thereof include laser processing, processing with sandpaper, electrical discharge machining, molding with an ultra-precision mold, micromachining, and electrochemical treatment.
作為第二構件的凹凸部的形成所使用的雷射,例如可列舉光纖雷射、YAG雷射、YVO 4雷射、半導體雷射、CO 2雷射、準分子雷射等。就可有效率地加工第二構件的觀點而言,較佳為使用光纖雷射。另外,於使用光纖雷射的情況下,能夠照射一個脈衝由多個次脈衝(subpulses)構成的雷射。 Examples of lasers used to form the concave-convex portion of the second member include fiber lasers, YAG lasers, YVO4 lasers, semiconductor lasers, CO2 lasers, and excimer lasers. From the viewpoint of efficiently processing the second member, it is preferable to use a fiber laser. In addition, in the case of using a fiber laser, it is possible to irradiate a laser in which one pulse consists of a plurality of subpulses.
若向第二構件照射雷射,則第二構件局部熔融,而形成穿孔。此時,若雷射由多個次脈衝構成,則熔融的第二構件難以飛散,容易堆積於穿孔的附近。堆積於穿孔的內部的第二構件成為穿孔內周面的突起。因此,容易將所述穿孔製成為於後述的內周面具有突起的形狀。另外,就穿孔相對於表面垂直地形成的觀點而言,雷射的照射方向亦可相對於第二構件的表面垂直。When the second member is irradiated with laser light, the second member is partially melted to form perforations. At this time, if the laser is composed of a plurality of sub-pulses, the melted second member is less likely to scatter, and is more likely to be deposited near the perforation. The second member deposited inside the through hole becomes a protrusion on the inner peripheral surface of the through hole. Therefore, it is easy to form the perforation into a shape having protrusions on the inner peripheral surface described later. In addition, the irradiation direction of the laser may be perpendicular to the surface of the second member from the viewpoint of forming the perforation perpendicular to the surface.
(第二構件) 第二構件含有樹脂以外的材料。第二構件中所含的材料若能夠用於本揭示的接合體,則並無特別限定。作為此種材料,例如可列舉金屬、石頭、玻璃及陶瓷等。 (second component) The second member contains a material other than resin. The material contained in the second member is not particularly limited as long as it can be used in the bonded body of the present disclosure. As such a material, metal, stone, glass, ceramics, etc. are mentioned, for example.
於所述材料中,第二構件較佳為含有金屬。作為所述金屬的一例,可列舉鐵系金屬、不鏽鋼系金屬、銅系金屬、鋁系金屬、鎂系金屬及該些的合金。另外,成形出第二構件的方法亦無特別限定,可為機械切削、金屬成形、鋅壓鑄、鋁壓鑄、粉末冶金、鑄造等。Among the above materials, the second member preferably contains metal. Examples of the metal include iron-based metals, stainless steel-based metals, copper-based metals, aluminum-based metals, magnesium-based metals, and alloys thereof. In addition, the method of forming the second member is not particularly limited, and may be mechanical cutting, metal forming, zinc die-casting, aluminum die-casting, powder metallurgy, casting, and the like.
若第二構件含有金屬,則耐久性優異,容易加工,且具有導電性,因此容易將所獲得的接合體用於電子設備等中。When the second member contains metal, it has excellent durability, is easy to process, and has electrical conductivity, so it is easy to use the obtained bonded body in electronic devices and the like.
圖4示意性地表示於後述的實施例中使用的第二構件。圖4所示的第二構件2僅為一例,第二構件2的形狀、大小及凹凸部的形成位置並無特別限定,可適宜變更。如圖4所示的例子般,於第二構件2的表面形成有第二構件的凹凸部22。再者,圖4所示的槽23是為了再現第二構件可具有的平面度公差而形成者,並非第二構件的必須的構成要素。FIG. 4 schematically shows a second member used in Examples described later. The
圖9示意性地例示實施形態的第二構件的凹凸部的形狀的一例。圖9所示的形狀例如相當於關於所述第一構件說明的槽形狀、無規則形狀、以及該些形狀的組合等非獨立的凹凸形狀。第二構件的凹凸部的形狀並不限定於圖9所示的形狀,亦可為點群形狀等具有獨立的非貫通的穿孔等的獨立的凹凸形狀。另外,非獨立的凹凸形狀及獨立的凹凸形狀亦可併存。本說明書中,所謂「非獨立」,是指所述第二構件的凹凸部所具有的形狀的邊界線不明確,各形狀(例如槽等)重疊。Fig. 9 schematically illustrates an example of the shape of the concavo-convex portion of the second member according to the embodiment. The shape shown in FIG. 9 corresponds to, for example, dependent concave-convex shapes such as the groove shape, the random shape, and combinations of these shapes described with respect to the first member. The shape of the concavo-convex portion of the second member is not limited to the shape shown in FIG. 9 , and may be an independent concavo-convex shape having independent non-penetrating through holes such as a point cloud shape. In addition, dependent concave-convex shapes and independent concave-convex shapes may coexist. In this specification, "non-independent" means that the boundary lines of the shapes of the concavo-convex portion of the second member are not clear, and each shape (for example, grooves, etc.) overlaps.
圖10示意性地例示實施形態的第二構件的凹凸部的形狀的一例。所述第二構件的凹凸部較佳為具有如圖10所示般的相互獨立的非貫通的穿孔。即,於自與形成有穿孔的表面垂直的方向觀察的情況下,較佳為穿孔的開口部不重疊,穿孔彼此的邊界線明確。所述穿孔與連續的槽不同。藉由所述第二構件的凹凸部具有相互獨立的非貫通的穿孔,所述第二構件與所述第一構件相接的面積進一步變大,因此所獲得的接合體的耐久性提高。Fig. 10 schematically illustrates an example of the shape of the concavo-convex portion of the second member according to the embodiment. The concavo-convex portion of the second member preferably has mutually independent non-penetrating through holes as shown in FIG. 10 . That is, when viewed from a direction perpendicular to the surface on which the perforations are formed, it is preferable that the openings of the perforations do not overlap and the boundaries between the perforations are clear. The perforations are distinguished from continuous grooves. Since the concavo-convex portion of the second member has non-penetrating through holes independent of each other, the contact area between the second member and the first member is further increased, and thus the durability of the obtained bonded body is improved.
所述穿孔的形狀並無特別限定。例如,關於穿孔,與深度方向垂直的剖面的直徑可為一定,亦可具有與深度方向垂直的剖面的直徑自開口部朝向底部擴大的區域及縮小的區域中的至少任一者。The shape of the perforation is not particularly limited. For example, the perforation may have a constant diameter in the cross section perpendicular to the depth direction, or may have at least one of a region where the diameter of the cross section perpendicular to the depth direction expands and decreases from the opening toward the bottom.
圖11示意性地例示實施形態的第二構件的凹凸部的形狀的一例。例如如圖11的例子所示般,所述穿孔較佳為於內周面具有突起的形狀。具體而言,較佳為在與穿孔的深度方向垂直的剖面的直徑縮小的區域之後,具備有擴大的區域的形狀。若所述穿孔是於內周面具有突起的形狀,則所述第一構件更牢固地與第二構件接合,因此所獲得的接合體的接合界面對剪切應力及垂直應力此兩者顯示出高耐久性。FIG. 11 schematically illustrates an example of the shape of the concavo-convex portion of the second member according to the embodiment. For example, as shown in the example of FIG. 11 , the perforation preferably has a protruding shape on the inner peripheral surface. Specifically, it is preferable to have a shape having an enlarged region after a region with a reduced diameter in a cross section perpendicular to the depth direction of the perforated hole. If the through hole has a protruding shape on the inner peripheral surface, the first member is more firmly bonded to the second member, so the bonded interface of the obtained bonded body exhibits good resistance to both shear stress and vertical stress. high durability.
於將所述穿孔製成為於內周面具有突起的形狀的情況下,較佳為照射所述一個脈衝由多個次脈衝構成的雷射。若向第二構件照射雷射,則第二構件局部熔融而形成穿孔。此時,若雷射由多個次脈衝構成,則熔融的第二構件難以飛散,容易堆積於穿孔的附近。堆積於穿孔的內部的第二構件成為穿孔內周面的突起。因此,容易將所述穿孔製成為於內周面具有突起的形狀。另外,就穿孔相對於表面垂直地形成的觀點而言,雷射的照射方向亦可相對於第二構件的表面垂直。When forming the perforation into a shape having protrusions on the inner peripheral surface, it is preferable to irradiate the laser in which the one pulse consists of a plurality of sub-pulses. When the second member is irradiated with laser light, the second member is partially melted to form perforations. At this time, if the laser is composed of a plurality of sub-pulses, the melted second member is less likely to scatter, and is more likely to be deposited near the perforation. The second member deposited inside the through hole becomes a protrusion on the inner peripheral surface of the through hole. Therefore, it is easy to make the perforation into a shape having a protrusion on the inner peripheral surface. In addition, the irradiation direction of the laser may be perpendicular to the surface of the second member from the viewpoint of forming the perforation perpendicular to the surface.
第二構件的凹凸部的平面度公差並無特別限定,例如可為200 μm以下,亦可為200 μm以上。若第二構件的平面度公差為200 μm以上,則於使用先前的接合方法的情況下,所獲得的接合體的接合密封性或生產性下降。另一方面,若為本製造方法,則即便第二構件的平面度公差為200 μm以上,第一構件及第二構件亦具有凹凸部,因此亦能夠製造接合密封性、生產性此兩者優異的接合體。另外,如上所述,第二構件的凹凸部的平面度公差亦可相對於第一構件的凹凸部的深度適宜調整。The flatness tolerance of the concavo-convex portion of the second member is not particularly limited, and may be, for example, 200 μm or less, or may be 200 μm or more. If the flatness tolerance of the second member is greater than or equal to 200 μm, when the conventional bonding method is used, the bonded sealability and productivity of the bonded body obtained will decrease. On the other hand, according to this manufacturing method, even if the flatness tolerance of the second member is 200 μm or more, the first member and the second member have concavo-convex parts, so it is possible to manufacture joint sealability and excellent productivity. of junctions. In addition, as mentioned above, the flatness tolerance of the concave-convex portion of the second member can also be appropriately adjusted relative to the depth of the concave-convex portion of the first member.
<步驟(C)>
本製造方法中的步驟(C)是使所述第一構件的凹凸部與所述第二構件的凹凸部相對地重合,自所述第一構件側照射雷射光,使所述第一構件與所述第二構件接合的步驟。藉由該步驟,所述第一構件的凹凸部軟化或熔融,以嵌入第二構件的凹凸部22的形式固化,而形成接合體。
<Step (C)>
The step (C) in this manufacturing method is to make the concavo-convex part of the first member overlap with the concavo-convex part of the second member, irradiate laser light from the side of the first member, and make the first member and the concavo-convex part The step of engaging the second member. Through this step, the concavo-convex portion of the first member is softened or melted, and is solidified in a form embedded in the concavo-
所述第一構件側的凹凸部以外的部分能夠透過雷射,因此藉由自第一構件側照射雷射光,可有效率地使所述第一構件的凹凸部軟化或熔融。The portion other than the concave-convex portion on the side of the first member can transmit laser light, so the concave-convex portion of the first member can be efficiently softened or melted by irradiating laser light from the first member side.
作為所述第一構件及第二構件的接合時的雷射光照射方法,例如亦可藉由將接合用的雷射點照射到接合部並對接合部反覆進行雷射掃描來進行。As a laser light irradiation method at the time of joining of the said 1st member and a 2nd member, for example, the laser spot for joining can also be performed by irradiating the joint part and performing laser scanning repeatedly on the joint part.
作為接合所使用的雷射,例如可列舉LD雷射、光纖雷射、YAG雷射、YVO 4雷射、半導體雷射、CO 2雷射、準分子雷射等。就容易透過第一構件的凹凸部以外的部分且可將對接合部以外的第一構件的熱影響抑制為最小限度的觀點而言,較佳為LD雷射。 Examples of lasers used for bonding include LD lasers, fiber lasers, YAG lasers, YVO 4 lasers, semiconductor lasers, CO 2 lasers, and excimer lasers. The LD laser is preferable from the viewpoint of easily transmitting parts other than the concavo-convex part of the first member and minimizing the influence of heat on the first member other than the bonding part.
[接合體] 本揭示的一實施形態的接合體(以下亦稱為本接合體)包括:第一構件,含有具有雷射透過性的樹脂且於表面具有凹凸部;以及第二構件,含有樹脂以外的材料且於表面具有凹凸部,以使所述第一構件的凹凸部與第二構件的凹凸部相對地重合的形式,將所述第一構件與所述第二構件接合。本接合體的第一構件、第二構件為如上所述。本接合體中,第一構件的凹凸部以嵌入第二構件的凹凸部的形式固化,因此與先前的接合體相比,生產性及接合密封性優異。 [Joint body] A bonded body (hereinafter also referred to as this bonded body) according to an embodiment of the present disclosure includes: a first member containing a resin having laser transparency and having unevenness on the surface; and a second member containing a material other than resin and Concave-convex portions are formed on the surface, and the concavo-convex portions of the first member and the concavo-convex portions of the second member are relatively overlapped to join the first member and the second member. The first member and the second member of this joined body are as described above. In this bonded body, the concavo-convex portion of the first member is solidified so as to be embedded in the concavo-convex portion of the second member, and thus is superior in productivity and joint sealing performance compared to the conventional bonded body.
本揭示並不限定於所述各實施形態,能夠於申請專利範圍所示的範圍內進行各種變更,關於將不同的實施形態中分別揭示的技術手段適宜組合而獲得的實施形態,亦包含在本揭示的技術範圍內。 〔總結〕 The present disclosure is not limited to the above-mentioned embodiments, and various changes can be made within the scope indicated in the patent claims. Embodiments obtained by appropriately combining technical means disclosed in different embodiments are also included in this disclosure. within the scope of the technology disclosed. 〔Summarize〕
本揭示的一方面的接合體的接合方法包括以下的步驟(A)~步驟(C):(A)於含有具有雷射透過性的樹脂的第一構件的表面形成凹凸部的步驟;(B)於含有樹脂以外的材料的第二構件的表面形成凹凸部的步驟;以及(C)使所述第一構件的凹凸部與所述第二構件的凹凸部相對地重合,自所述第一構件側照射雷射光,使所述第一構件與所述第二構件接合的步驟。A bonding method of a bonded body according to an aspect of the present disclosure includes the following steps (A) to (C): (A) a step of forming a concavo-convex portion on the surface of a first member containing a resin having laser transparency; (B ) a step of forming a concave-convex portion on the surface of the second member containing a material other than resin; and (C) overlapping the concave-convex portion of the first member with the concave-convex portion of the second member, A step of irradiating the member side with laser light to join the first member and the second member.
於所述結構中,所述第一構件的表面藉由形成有凹凸部而提高雷射吸收率。若向該雷射吸收率經提高的第一構件的凹凸部照射雷射光,則會於短時間內軟化或熔融。因此,可縮短接合時的雷射掃描時間。另外,軟化或熔融的所述第一構件的凹凸部以嵌入第二構件的凹凸部的形式固化,藉此形成接合體。因此,能夠製造具有優異的接合密封性的接合體。In the above structure, the surface of the first member is formed with concavo-convex portions to increase the laser absorption rate. When the concave-convex portion of the first member whose laser absorptivity has been improved is irradiated with laser light, it softens or melts in a short time. Therefore, the laser scanning time at the time of joining can be shortened. In addition, the softened or melted concavo-convex portion of the first member is solidified in a form embedded in the concavo-convex portion of the second member, thereby forming a bonded body. Therefore, a joined body having excellent joint sealing properties can be manufactured.
於所述一方面的接合體的製造方法中,所述第二構件可含有金屬。根據該結構,第二構件的耐久性優異,容易將所獲得的接合體用於電子設備等中。In the method for manufacturing a joined body according to the aspect, the second member may contain metal. According to this configuration, the durability of the second member is excellent, and it is easy to use the obtained bonded body in electronic devices and the like.
於所述一方面的接合體的製造方法中,所述第一構件的凹凸部的雷射吸收率可為10%以上。根據該結構,所述第一構件的凹凸部及其周邊更容易軟化或熔融,因此所獲得的接合體的接合密封性提高。In the method of manufacturing a bonded body according to the above aspect, the laser absorption rate of the concavo-convex portion of the first member may be 10% or more. According to this configuration, the concavo-convex portion of the first member and its periphery are more easily softened or melted, so that the joint sealability of the obtained joined body is improved.
於所述一方面的接合體的製造方法中,所述第二構件的凹凸部可具有獨立的非貫通的穿孔。根據該結構,藉由所述第二構件的凹凸部具有獨立的、即不重疊的穿孔,所述第二構件與所述第一構件相接的面積進一步變大,因此所獲得的接合體的接合密封性提高。In the manufacturing method of the joined body according to the aspect, the concavo-convex portion of the second member may have independent non-through holes. According to this configuration, since the concavo-convex portion of the second member has independent, that is, non-overlapping perforations, the contact area between the second member and the first member is further increased, and thus the joint body obtained is Joint sealing is improved.
於所述一方面的接合體的製造方法中,所述穿孔可為於內周面具有突起的形狀。根據該結構,藉由所述穿孔的內周面的突起,所述第一構件與所述第二構件牢固地接合,因此所獲得的接合體的接合部分的剪切應力及垂直應力此兩者提高。In the method for manufacturing a bonded body according to the aspect, the through hole may have a protrusion on an inner peripheral surface. According to this structure, the first member and the second member are firmly bonded by the protrusion of the inner peripheral surface of the through hole, so both the shear stress and the vertical stress of the bonded portion of the obtained bonded body improve.
於所述一方面的接合體的製造方法中,所述第一構件的凹凸部的深度相對於所述第二構件的凹凸部的平面度公差的比例可為50%以上。根據該結構,可將藉由雷射而軟化或熔融的第一構件充分地填充到所述第二構件的凹凸部,因此所獲得的接合體的接合密封性提高。In the method for manufacturing a bonded body according to the aspect, the ratio of the depth of the concavo-convex portion of the first member to the flatness tolerance of the concavo-convex portion of the second member may be 50% or more. According to this configuration, the first member softened or melted by the laser can be sufficiently filled in the concavo-convex portion of the second member, so that the bonding sealing performance of the obtained bonded body is improved.
本說明書中,所謂「第二構件的凹凸部的平面度公差」,是指藉由非接觸光學式三維形狀測定裝置測定的第二構件的凹凸部的平面度公差。另外,本說明書中,所謂「第一構件的凹凸部的深度」,是指自第一構件的表面至第一構件的凹凸部的底部為止的垂直距離。本說明書中,所謂「相對於平面度公差的比例為50%以上」,是指例如於所述第二構件的凹凸部的平面度公差為200 μm的情況下,第一構件的凹凸部的深度為100 μm以上。In this specification, "the flatness tolerance of the concave-convex portion of the second member" refers to the flatness tolerance of the concave-convex portion of the second member measured by a non-contact optical three-dimensional shape measuring device. In addition, in this specification, "the depth of the uneven part of a 1st member" means the vertical distance from the surface of a 1st member to the bottom of the uneven part of a 1st member. In this specification, "the ratio to the flatness tolerance is 50% or more" means, for example, the depth of the concave-convex portion of the first member when the flatness tolerance of the concave-convex portion of the second member is 200 μm. 100 μm or more.
另外,本揭示的一方面的接合體包括:第一構件,含有具有雷射透過性的樹脂且於表面具有凹凸部;以及第二構件,含有樹脂以外的材料且於表面具有凹凸部,以使所述第一構件的凹凸部與第二構件的凹凸部相對地重合的形式,將所述第一構件與所述第二構件接合。根據所述結構,所述接合體較先前的接合體而言生產性及接合密封性優異。 [實施例] In addition, a bonded body according to an aspect of the present disclosure includes: a first member containing a resin having laser transparency and having unevenness on the surface; and a second member including a material other than resin and having unevenness on the surface so that The concavo-convex portion of the first member and the concavo-convex portion of the second member are relatively overlapped to join the first member and the second member. According to the above configuration, the bonded body is superior in productivity and joint sealing performance compared to conventional bonded bodies. [Example]
以下,基於實施例更詳細地說明本揭示,但本揭示並不限定於以下的實施例。Hereinafter, although this indication is demonstrated in more detail based on an Example, this indication is not limited to the following Example.
〔雷射吸收率的測定〕 使用雷射功率計(奧菲爾光電子學(Ophir Optronics)公司製造),自形成有第一構件的凹凸部的面的相反側,測定第一構件的凹凸部的雷射透過率,藉由下述式算出雷射吸收率。 〔Measurement of laser absorption rate〕 Using a laser power meter (manufactured by Ophir Optronics), the laser transmittance of the concave-convex portion of the first member was measured from the opposite side of the surface on which the concave-convex portion of the first member was formed. Formula to calculate the laser absorption rate.
100(%)-透過率(%)=雷射吸收率(%) 〔平面度公差〕 第一構件的凹凸部的深度與第二構件的凹凸部的平面度公差使用非接觸光學式三維測定裝置LEXT OLS4500(奧林匹斯(Olympus製造))進行測定。 100 (%)-transmittance (%)=laser absorption rate (%) 〔Flatness Tolerance〕 The depth of the concave-convex portion of the first member and the flatness tolerance of the concave-convex portion of the second member were measured using a non-contact optical three-dimensional measuring device LEXT OLS4500 (manufactured by Olympus).
〔接合密封性的評價〕 藉由IPX7試驗及冷熱衝擊試驗,評價接合體的接合密封性。 [Evaluation of Joint Sealability] The joint sealing performance of the joined body is evaluated by the IPX7 test and the thermal shock test.
IPX7試驗使用可檢查相當於IPX7的防水性的密封品空氣洩漏測試裝置MSZ-0700系列(series)(福田股份有限公司製造)來實施。The IPX7 test was carried out using the MSZ-0700 series (series) (manufactured by Fukuda Co., Ltd.), which can check the waterproofness of sealed products equivalent to IPX7.
冷熱衝擊試驗使用冷熱衝擊試驗機(愛斯佩克(Espec)公司製造)來實施。關於冷熱衝擊試驗,將低溫側設為-40℃、30分鐘,將高溫側設為70℃、30分鐘。另外,1個循環設定為使低溫側與高溫側各循環一次。The thermal shock test was implemented using a thermal shock tester (manufactured by Espec). Regarding the thermal shock test, the low temperature side was set at -40°C for 30 minutes, and the high temperature side was set at 70°C for 30 minutes. In addition, one cycle is set so that the low-temperature side and the high-temperature side are circulated once each.
表中,將剛接合後在IPX7試驗中不合格的情況表述為「×」,將剛接合後在IPX7試驗中合格的情況表述為「○」,將於實施5個循環的冷熱衝擊試驗後在IPX7試驗中合格的情況表述為「◎」,將於實施100個循環的冷熱衝擊試驗後在IPX7試驗中合格的情況表述為「◎◎」。In the table, "×" is used to indicate the failure of the IPX7 test immediately after joining, and "○" is indicated to the case of passing the IPX7 test immediately after joining. The case of passing the IPX7 test is expressed as "◎", and the case of passing the IPX7 test after implementing 100 cycles of thermal shock test is expressed as "◎◎".
〔實施例1〕 將作為樹脂材料的圓形PMMA(直徑22 mm、厚度1 mm)設為第一構件。藉由使用CO 2雷射加工機斯百迪(Speedy)100(卓泰克雷射(Trotec Laser)製造)對所述第一構件照射CO 2雷射而進行凹凸加工。 [Example 1] A circular PMMA (22 mm in diameter, 1 mm in thickness) as a resin material was used as the first member. Concave-convex processing was performed by irradiating the first member with a CO 2 laser using a CO 2 laser processing machine Speedy 100 (manufactured by Trotec Laser).
如圖3所示,於自第一構件1的外周起寬度3 mm的區域形成第一構件的凹凸部21。凹凸加工時的CO
2雷射照射條件如表1所示。另外,第一構件的凹凸部21的加工形狀設為圖7所示的點群形狀。
As shown in FIG. 3 , the concavo-
將不鏽鋼(SUS304)設為第二構件。藉由光纖雷射標識器(Fiber Laser Marker)MX-Z2000H(歐姆龍(omron)股份有限公司製造)對所述第二構件進行凹凸加工。第二構件的凹凸部的平面度公差設為200 μm。Stainless steel (SUS304) was used as the second member. Concave-convex processing was performed on the second member by a fiber laser marker (Fiber Laser Marker) MX-Z2000H (manufactured by Omron Co., Ltd.). The flatness tolerance of the concavo-convex portion of the second member was set to 200 μm.
如圖4所示,第二構件2包括外徑20 mm、內徑18 mm的環狀的接合面。圖12是俯瞰第二構件2的存在有環狀接合面的一側的示意圖、以及於第二構件2的環狀接合面形成有槽23的部分的放大圖。如圖12所示,於該環狀接合面形成有寬度3 mm、深度0.15 mm的槽23。於亦包括該槽23的部分在內的環狀的接合面形成第二構件的凹凸部22。再者,該槽23是為了再現第二構件可具有的200 μm左右的平面度公差而形成。即,槽23的深度相當於第二構件可具有的平面度公差。凹凸加工時的雷射標識器的照射條件如表2所示。再者,第二構件的凹凸部22的形狀為圖9所示的非獨立的形狀。As shown in FIG. 4 , the
如圖1所示般,使第一構件的凹凸部21與第二構件的凹凸部22以接觸的形式重合,並設置於接合用的夾具。接著,自第一構件的凹凸部21的相反側使用LD雷射(耶拿(Jenoptik)公司製造),藉由內置於接合用的夾具的汽缸進行加壓,同時照射紅外線雷射,對接合部反覆進行掃描並進行接合。接合時的紅外線雷射的照射條件設為表4所示。利用雷射使第一構件的凹凸部21熔融,嵌入到第二構件的凹凸部22並使其固化,藉此獲得接合體。圖5示意性地表示所獲得的接合體的形狀。As shown in FIG. 1 , the concavo-
〔實施例2〕 除了將用於形成第一構件的凹凸部的雷射照射條件如表1所示變更,且將第一構件的凹凸部的形狀設為圖6所示的槽形狀以外,與實施例1同樣地獲得接合體。 [Example 2] Except that the laser irradiation conditions for forming the concave-convex portion of the first member were changed as shown in Table 1, and the shape of the concave-convex portion of the first member was set to the groove shape shown in FIG. 6 , it was the same as in Example 1. Get joints.
〔實施例3〕 除了將用於形成第一構件的凹凸部的雷射照射條件如表1所示變更,且將第一構件的凹凸部的形狀設為圖8所示的無規則形狀以外,與實施例1同樣地獲得接合體。 [Example 3] Except that the laser irradiation conditions for forming the concavo-convex portion of the first member were changed as shown in Table 1, and the shape of the concavo-convex portion of the first member was set to a random shape as shown in FIG. 8 , it was the same as in Example 1. to obtain junctions.
〔實施例4〕 除了將用於形成第二構件的凹凸部的雷射照射條件如表1所示變更,且將凹凸部的形狀設為圖10所示的獨立的穿孔部以外,與實施例1同樣地獲得接合體。 [Example 4] Bonding was obtained in the same manner as in Example 1, except that the laser irradiation conditions for forming the concave-convex portion of the second member were changed as shown in Table 1, and the shape of the concave-convex portion was set to an independent perforated portion as shown in FIG. 10 . body.
〔實施例5〕 除了將用於形成第二構件的凹凸部的雷射照射條件如表1所示變更,且將凹凸部的形狀設為圖11所示的於內周面具有突起的獨立的穿孔部以外,與實施例4同樣地獲得接合體。 [Example 5] Except that the laser irradiation conditions for forming the concave-convex portion of the second member are changed as shown in Table 1, and the shape of the concave-convex portion is set as an independent perforation portion having a protrusion on the inner peripheral surface shown in FIG. 11 , and A joint body was obtained in the same manner as in Example 4.
〔實施例6〕 除了將用於形成第一構件的凹凸部的雷射照射條件如表1所示變更以外,與實施例5同樣地獲得接合體。再者,實施例6的第一構件的凹凸部與實施例5相比,每單位面積的穿孔的個數少。 [Example 6] A bonded body was obtained in the same manner as in Example 5 except that the laser irradiation conditions for forming the concavo-convex portion of the first member were changed as shown in Table 1. Furthermore, the concavo-convex portion of the first member of Example 6 has a smaller number of perforated holes per unit area than that of Example 5.
〔實施例7〕 除了將用於形成第一構件的凹凸部的雷射照射條件如表1所示變更以外,與實施例5同樣地獲得接合體。再者,實施例7的第一構件的凹凸部與實施例5及實施例6相比,每單位面積的穿孔的個數少。 [Example 7] A bonded body was obtained in the same manner as in Example 5 except that the laser irradiation conditions for forming the concavo-convex portion of the first member were changed as shown in Table 1. Furthermore, the number of perforated holes per unit area is smaller in the concavo-convex portion of the first member in Example 7 than in Examples 5 and 6.
〔實施例8〕 除了將用於形成第一構件的凹凸部的雷射照射條件如表1所示變更以外,與實施例5同樣地獲得接合體。 [Example 8] A bonded body was obtained in the same manner as in Example 5 except that the laser irradiation conditions for forming the concavo-convex portion of the first member were changed as shown in Table 1.
〔實施例9〕 除了將用於形成第一構件的凹凸部的雷射照射條件如表1所示變更以外,與實施例5同樣地獲得接合體。 [Example 9] A bonded body was obtained in the same manner as in Example 5 except that the laser irradiation conditions for forming the concavo-convex portion of the first member were changed as shown in Table 1.
〔比較例1〕 除了未對第一構件進行凹凸加工以外,與實施例1同樣地獲得接合體。 [Comparative Example 1] A bonded body was obtained in the same manner as in Example 1, except that the first member was not subjected to uneven processing.
〔比較例2〕 除了未對第一構件進行凹凸加工以外,與實施例4同樣地獲得接合體。 [Comparative Example 2] A bonded body was obtained in the same manner as in Example 4, except that the first member was not subjected to uneven processing.
〔比較例3〕 除了未對第一構件進行凹凸加工以外,與實施例5同樣地獲得接合體。 [Comparative Example 3] A bonded body was obtained in the same manner as in Example 5, except that the first member was not subjected to uneven processing.
〔參考例1〕 除了不對第一構件進行凹凸加工,且將接合時的紅外線雷射的照射條件如表4所示變更以外,與實施例1同樣地獲得接合體。 [Reference example 1] A bonded body was obtained in the same manner as in Example 1, except that the first member was not subjected to concavo-convex processing, and the irradiation conditions of the infrared laser during bonding were changed as shown in Table 4.
〔參考例2〕 除了不對第一構件進行凹凸加工,且將接合時的紅外線雷射的照射條件如表4所示變更以外,與實施例5同樣地獲得接合體。 [Reference example 2] A bonded body was obtained in the same manner as in Example 5, except that the first member was not subjected to concavo-convex processing, and the irradiation conditions of the infrared laser at the time of bonding were changed as shown in Table 4.
將實施例1~實施例9中的用於形成第一構件的凹凸部的雷射照射條件示於表1中。Table 1 shows the laser irradiation conditions for forming the concavo-convex portion of the first member in Examples 1 to 9.
[表1]
將實施例1~實施例9中的用於形成第二構件的凹凸部的雷射照射條件示於表2中。Table 2 shows the laser irradiation conditions for forming the concavo-convex portion of the second member in Examples 1 to 9.
[表2]
將比較例1~比較例3及參考例1~參考例2中的用於形成第二構件的凹凸部的雷射照射條件示於表3中。Table 3 shows the laser irradiation conditions for forming the concavo-convex portion of the second member in Comparative Example 1 to Comparative Example 3 and Reference Example 1 to Reference Example 2.
[表3]
將實施例1~實施例9、比較例1~比較例3及參考例1~參考例2中的用於接合第一構件與第二構件的雷射照射條件示於表4中。Table 4 shows the laser irradiation conditions for bonding the first member and the second member in Examples 1 to 9, Comparative Examples 1 to 3, and Reference Examples 1 to 2.
[表4]
〔結果〕 將實施例1~實施例3、比較例1、參考例1中的第一構件的凹凸部的加工條件及接合密封性的評價結果示於表5中。再者,於在第一構件未形成凹凸部的情況下,第一構件的凹凸部的深度設為「-」。 〔result〕 Table 5 shows the processing conditions of the concavo-convex portion of the first member in Examples 1 to 3, Comparative Example 1, and Reference Example 1 and the evaluation results of joint sealing properties. In addition, when the uneven part was not formed in the 1st member, the depth of the uneven|corrugated part of the 1st member was made into "-".
[表5]
根據表5可知,第一構件進行了凹凸加工的實施例1~實施例3與未對第一構件進行凹凸加工的比較例1相比,顯示出更優異的接合密封性。另外,與參考例1相比,實施例1~實施例3的接合雷射的掃描次數少,但顯示出相同程度的接合密封性。因此,顯示出實施例1~實施例3的接合體比參考例1的接合體的生產性優異。As can be seen from Table 5, Examples 1 to 3, in which the first member was roughened, exhibited more excellent joint sealability than Comparative Example 1, in which the first member was not roughened. In addition, although the number of times of scanning of the bonding laser in Examples 1 to 3 was less than that of Reference Example 1, they showed the same level of bonding sealing properties. Therefore, it was shown that the bonded body of Examples 1 to 3 is superior in productivity to the bonded body of Reference Example 1.
將實施例4~實施例5、比較例2、參考例2的凹凸部的條件及接合密封性的評價結果示於表6中。Table 6 shows the conditions of the concavo-convex portions of Examples 4 to 5, Comparative Example 2, and Reference Example 2 and the evaluation results of joint sealing properties.
[表6]
根據表6可知,第一構件進行了凹凸加工的實施例4~實施例5與未對第一構件進行凹凸加工的比較例2及比較例3相比,顯示出更優異的接合密封性。另外,與參考例2相比,即便於接合雷射的掃描次數少的情況下,亦顯示出相同程度的接合密封性。因此,顯示出實施例4~實施例5的接合體比參考例2的接合體的生產性優異。As can be seen from Table 6, Examples 4 to 5, in which the first member was roughened, exhibited more excellent joint sealability than Comparative Examples 2 and 3, in which the first member was not roughened. In addition, compared with Reference Example 2, even when the number of times of scanning of the bonding laser is small, the bonding sealing performance of the same level is exhibited. Therefore, it was shown that the bonded body of Examples 4 to 5 is superior in productivity to the bonded body of Reference Example 2.
進而,將第二構件的加工形狀變更為穿孔部的實施例4~實施例5顯示出比實施例1~實施例3更優異的接合密封性。Furthermore, Examples 4 to 5 in which the processed shape of the second member was changed to a perforated portion exhibited superior joint sealing properties compared to Examples 1 to 3.
將實施例5~實施例9的凹凸部的條件及接合密封性的評價結果示於表7。Table 7 shows the conditions of the concavo-convex portion and the evaluation results of joint sealing properties in Examples 5 to 9.
[表7]
根據表7可知,第一構件進行了凹凸加工的實施例5~實施例9均顯示出優異的接合密封性。另外,可知第一構件的凹凸部的雷射吸收率越高,越顯示出優異的接合密封性。 [產業上的可利用性] As can be seen from Table 7, all of Examples 5 to 9 in which the first member was roughened showed excellent joint sealing properties. In addition, it can be seen that the higher the laser absorptivity of the concavo-convex portion of the first member, the more excellent the bonding and sealing performance is exhibited. [industrial availability]
本揭示的一態樣例如可用於所有需要基於金屬與樹脂的接合或者基於金屬與樹脂的接合密封的設備。An aspect of the present disclosure can be used, for example, in all devices that require a metal-to-resin based bond or a metal-to-resin based bonded seal.
1:第一構件 2:第二構件 3:雷射光 4:接合部 11:第一構件的凹凸部的深度 12:第二構件的平面度公差 21:第一構件的凹凸部/凹凸部 22:第二構件的凹凸部/凹凸部 23:槽 1: first component 2: Second component 3: laser light 4: Joint 11: Depth of the concavo-convex portion of the first member 12: Flatness tolerance of the second member 21: Concave-convex part/concave-convex part of the first member 22: Concave-convex part/concave-convex part of the second member 23: Slot
圖1示意性地表示實施形態的接合體的接合方法的一例。 圖2示意性地表示將實施形態的接合體的接合部的一例放大者。 圖3示意性地表示實施例的第一構件。 圖4示意性地表示實施例的第二構件。 圖5示意性地表示實施例的接合體。 圖6是表示實施形態的第一構件的凹凸部的一例的雷射顯微鏡圖像。 圖7是表示實施形態的第一構件的凹凸部的一例的雷射顯微鏡圖像。 圖8是表示實施形態的第一構件的凹凸部的一例的雷射顯微鏡圖像。 圖9示意性地表示實施形態的第二構件的凹凸部的一例。 圖10示意性地表示實施形態的第二構件的凹凸部的一例。 圖11示意性地表示實施形態的第二構件的凹凸部的一例。 圖12示意性地表示實施例的第二構件。 FIG. 1 schematically shows an example of a method for joining a joined body according to the embodiment. FIG. 2 schematically shows an enlarged example of a joint portion of the joint body according to the embodiment. Fig. 3 schematically shows the first member of the embodiment. Fig. 4 schematically shows the second member of the embodiment. Fig. 5 schematically shows a joined body of an example. Fig. 6 is a laser microscope image showing an example of a concavo-convex portion of the first member according to the embodiment. Fig. 7 is a laser microscope image showing an example of a concavo-convex portion of the first member according to the embodiment. Fig. 8 is a laser microscope image showing an example of a concavo-convex portion of the first member according to the embodiment. Fig. 9 schematically shows an example of the concavo-convex portion of the second member according to the embodiment. FIG. 10 schematically shows an example of the concavo-convex portion of the second member according to the embodiment. Fig. 11 schematically shows an example of the concavo-convex portion of the second member according to the embodiment. Fig. 12 schematically shows the second member of the embodiment.
1:第一構件 1: first component
2:第二構件 2: Second component
3:雷射光 3: laser light
4:接合部 4: Joint
21:第一構件的凹凸部 21: Concave-convex part of the first member
22:第二構件的凹凸部 22: Concave-convex part of the second member
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