KR101917768B1 - Heterojunction body - Google Patents

Abstract

Provided is a heterojunction molded body, which comprises: a first object made of a first material and including a junction part; and a second molded body made of a second material and molded and joined to the first object and joined to the junction part, wherein the junction part includes a laser machining groove, and the laser machining groove is included in an area of the laser machining groove. An object of the present invention is to provide the heterojunction molded body, which can reduce the weight of bonded different materials while maintaining fixing ability with a structure through laser processing between different kinds of materials.

Description

[0001] HETEROJUNCTION BODY [0002]

The present invention relates to a heterogeneously bonded formed body.

In general, the technique of integrating a metallic alloy material and a resin material, which are different materials, with an adhesive is required from a wide range of industrial and technical fields such as automobiles, home electronic products, and industrial devices. Therefore, many adhesives, adhesive tapes, And plastic joining mold technology for joining have been developed. These adhesives have been used for joining together a metal composite material and a resin material while exhibiting an adhesive function at room temperature or by heating, and there are applications such as automobiles, TVs, mobile phones, and notebooks. Meanwhile, conventionally, methods for joining a metal alloy material and a resin material, which are different materials, without using an adhesive, have been studied. As one of them, nano methods are actively studied. That is, the bonding technique of the different materials by the nano method is a technique of forming a nano-sized groove on the surface of the metal alloy material and inserting the resin material. However, while the above-mentioned insert technology has advantages of higher tensile strength than adhesive, it has a strict management standard for material selection, complicated treatment, high unit cost, and high waste chemicals, . That is, the conventional nano-based insert technology requires a resin material to be inserted into a nano-sized hole. In this case, in order to increase the penetration performance of the resin material, it is necessary to use only a specific resin material.

Korean Patent Publication No. 2012-0132848 (December 10, 2012)

An object of the present invention is to provide a heterogeneous bonded formed body in which different kinds of materials can be held in a fixed structure by laser processing, but the weight of the bonded different materials can be reduced.

An object of the present invention is to provide a hetero-junction formed body in which the projecting direction of the laser processing projection is directed to the inside of the processing groove to prevent the drawing and the fixing force between the different materials is increased.

An embodiment of the present invention aims to provide a hetero-junction formed body in which the side of the laser machining groove is formed to have a larger surface roughness than the bottom of the laser machining groove, so that the fixing force between the different materials is increased.

A first object provided with a first material and including a junction; And a second formed body made of a second material and molded and joined to the first object and joined to the joined portion, wherein the bonded portion includes a laser processing groove, and the laser processing recess is included in the area of the laser processing groove, A heterogeneously bonded formed body is provided.

The height of the upper surface of the ridge positioned between neighboring laser machining grooves can be determined by overlapping of the laser.

Further, the laser machining groove may include a non-through hole or a groove shape.

A first object provided with a first material and including a junction; And a second formed body made of a second material and joined to the bonded portion, wherein the bonded portion includes a bonding surface facing the second formed body, and a laser processing projection projected from a part of the bonding surface, May be 0.1% to 10% of the length of the bottom portion of the adjacent bonding surface.

The laser processing projection may be formed on the bonding surface in an area of 30% or more and 100% or less.

Further, the interval between the laser processing protrusions may be 0.1um or more and 10um or less.

Further, the width of the laser processing projection can be determined by the superposition rate at which the laser is superimposed on the laser processing projection by the laser.

Further, the overlap ratio can be determined by at least one of the frequency and the speed of the laser.

A first object provided with a first material and including a junction; And a second formed body made of a second material and bonded to the bonded portion, wherein the bonded portion includes a bonding face facing the second formed body and a laser recess opened from the bonding face, Side and a processing groove bottom, and the projecting direction of the laser processing projection projected from the processing groove side is a non-parallel direction.

The non-parallel direction may be a downward direction or a reverse direction.

Further, the surface roughness of the side of the laser processing groove may be larger than the surface roughness of the bottom of the laser processing groove.

A first object provided with a first material and including a junction; And a second formed body made of a second material and joined to the bonded portion, wherein the bonded portion includes a multi-directional inclined pattern, the multi-directional inclined pattern includes a first inclined pattern having a first inclination angle, And an angle formed by the first inclined pattern and the second inclined pattern is 10 degrees or more and 170 degrees or less.

The third oblique pattern includes a first oblique pattern and a second oblique pattern, and the third oblique pattern includes a first oblique pattern and a second oblique pattern, each of which has a first oblique angle and a third oblique angle different from the second oblique angle, The following can be obtained.

One embodiment of the present invention can provide a heterogeneous bonded formed body that can maintain the clamping force by laser beam machining of different kinds of materials but can lighten the weight of the bonded heterogeneous material.

One embodiment of the present invention can provide a heterogeneous bonded formed body in which the projecting direction of the laser processing projection is directed to the inside of the processing groove to prevent the drawing and the fixing force between the different materials is increased.

An embodiment of the present invention can provide a hetero-junction formed body in which the side of the laser machining groove is formed to have a larger surface roughness than the bottom of the laser machining groove, so that the fixing force between the different materials is increased.

Brief Description of the Drawings Fig. 1 is a view showing a pattern formed on a bonding surface and a bonding surface between different dissimilar materials according to an embodiment of the present invention; Fig.
FIG. 2 is a cross-sectional side view of a first object to which a bonded surface is formed in the heterogeneous bonded formed body according to an embodiment of the present invention; FIG.
FIG. 3 is an enlarged view of a cross-section of a side surface of a first object on which a bonded surface is formed, of the heterogeneous bonded formed body according to an embodiment of the present invention
4 is a view showing a process protrusion in which a second formed body combined with a first object according to an embodiment of the present invention is fixed in a direction opposite to the drawing
5 is a cross-sectional side view of a first object to be bonded to which a bonded surface is formed in the heterogeneous bonded formed body according to an embodiment of the present invention

Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. However, this is merely an example and the present invention is not limited thereto.

In the following description, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear. The following terms are defined in consideration of the functions of the present invention, and may be changed according to the intention or custom of the user, the operator, and the like. Therefore, the definition should be based on the contents throughout this specification.

The technical idea of the present invention is determined by the claims, and the following embodiments are merely a means for effectively explaining the technical idea of the present invention to a person having ordinary skill in the art to which the present invention belongs.

FIG. 1 is a perspective view of a first object 100 and a second object 200 formed on different surfaces of the first object 100 and the second object 200 according to an embodiment of the present invention. Fig.

Referring to FIG. 1, the heterogeneous bonded formed body includes a first object 100 and a second formed body 200, and may be bonded to each other. The heterogeneous bonded formed body may be provided with a predetermined bonding structure on at least one of the dissimilar materials. For example, when the first object 100 is a metal material and a bonding surface is provided, the bonding structure may be formed on the bonding surface 1 of the first object 100 through laser processing or the like.

Details of the above-described coupling structure will be described later with reference to FIG. 2 to FIG. As shown in FIG. 1, a pattern of a coupling structure may be formed on the coupling surface. A hexagonal pattern may be provided as shown in this example. The pattern may be located at a position where the mating surfaces 1, 2 are opposed to each other when they are coupled to each other. As one example, when the second molded body 200 is a resin, the resin as the second molded body 200 flows into the coupled structure processed on the pattern of the first object 100 and is cured, The first object 100, which is a metal material, and the second molding material 200, which is a resin, may be coupled to each other. As an example, the second molding material 200, which is a resin material, is formed at an obtuse angle except for a region where the pattern is formed, so that only the area corresponding to the pattern of the first object 100 can be contacted and bonded.

Hereinafter, the case where the first object 100 is a metal material and the second object 200 is a resin material will be mainly described. In the case where the first object 100 and the second object 200 are combined, And is not limited to metallic materials and resin materials.

Further, as another example, a rhombus or the like, which is a pattern of an unillustrated pattern, may be formed. This is a factor that can determine the area of the pattern formed on the first object 100 and the second formed body 200, and may affect the clamping force between the dissimilar materials. Of course, as the area of the pattern is wider, the fixing force can be further increased on the premise that the bonding structure is formed at the same density per unit area. Furthermore, in this embodiment, the second molded body 200 formed of a resin material may not be in direct contact with the first object 100 except for an area where a pattern is formed in the entire area on the mating surface 2, The amount of molding of the resin material can be reduced. Therefore, the smaller the area of the pattern is, the lighter the total weight of the hetero-junction molding can be.

However, since it is inevitable to avoid an increase in the process of securing the adhesive area in order to apply the adhesive in order to achieve the adhesion of the two linear surfaces through the adhesive and to increase the adhesive strength, The adhesion area can be minimized. This can be done by a clamping force through the pattern.

For reference, when the first object 100 is a metal, the first object 100 may be a metal series or a metal alloy series. For example, it may be an aluminum series or an aluminum alloy which is industrially used for lightening the product. The aluminum alloy may be an Al-Mg-based alloy, an Al-Mn-based alloy, an Al-Mg-Mn-based alloy, Based alloy, an Al-Mg-Si alloy, and a heat-resistant aluminum alloy. When the second molded body 200 is made of a resin material, the second molded body 200 may be formed of a material such as PC, PPS, PPA, PBT, PA6 (polybutylene terephthalate), polybutylene terephthalate Polyamide 6, PA66 (polyamide 66), PP (polypropylene), ABS (plastic resin, acrylonitile + POLY-butadiene + styrene) Etc. may be used. However, it is needless to say that various thermoplastic resins containing or not containing glass and / or minerals can be used for the second formed body 200. On the other hand, the composite structure according to the embodiment of the present invention may be aimed at adjusting the difference in coefficient of linear expansion between the aluminum alloy component and the resin composition component, and improving the mechanical strength of the resin composition component.

First, FIG. 5 will be described by way of example, and a conceptual diagram for facilitating visual discrimination through FIGS. 2 to 4 will be described later. 5 is a view showing a coupling structure of a first object 100 according to another embodiment of the present invention.

Referring to Fig. 5, a laser is irradiated in the laser irradiation direction L, and a machining groove 101 may be formed in the engaging surface 1 of the object 1. Ridges may be formed on both sides of the machining groove 101 while the machining groove 101 is formed. That is, the machining groove 101 formed between the both ridges R can be formed with a predetermined depth D. The protruding and recessed portions 121 may be formed more finely in the machining groove 101, which will be described later with reference to the drawings, which are shown more intuitively in the following drawings.

On the other hand, by irradiating the laser in the laser irradiation direction L, the machining groove 101 can be formed in the first object 100. Therefore, the machining groove 101 may be formed in a depressed shape by a predetermined depth, which may be formed in the shape of a groove, a non-through hole, and a drain. Here, the predetermined depth may be determined according to the laser irradiation conditions and the material of the first object 100. For example, the laser irradiation conditions may include the output of the laser, the frequency of the laser, and the irradiation time of the laser. Specifically, when the laser beam is irradiated on the first object 100 to form the machining groove 101 by the predetermined depth, the machining groove 101 of the desired depth may not be formed by one irradiation . That is, as the laser output is higher, the predetermined depth can be formed within a shorter time. Of course, in the case of processing with a high power laser through a small number of times of irradiation, thermal deformation may occur according to the first object 100, and the possibility that the first object 100 may be damaged by the laser may increase have. Of course, the surface of the processing groove 101 processed by the high-output laser can be formed to have a larger roughness than the surface of the processing groove 101 processed many times by the laser of low output.

Here, the processing groove 101 may be formed deeply (predetermined depth) in order to increase the defective force of the first object 100 and the second object 200 while reducing thermal deformation of the first object 100 . Herein, the term " deep " means that the depth is deeper than the depth that can be formed by one laser irradiation. For this purpose, the laser may be superposed on the first object 100 and irradiated. As a method of irradiating the first object 100 with a laser beam, a method of irradiating two or more laser beams to a portion of the first object 100 with a time interval may be used. On the other hand, the rate at which the laser is superimposed can be referred to as the superposition ratio.

The spot size, the frequency, the scan interval, and the scan speed of the laser to be irradiated may be factors that determine the overlap rate of the laser, and the predetermined depth may be determined by the overlap rate. For example, the longer the period of the frequency and the shorter the irradiation time, the lower the overlap rate. Conversely, the shorter the period of the frequency and the longer the irradiation time, the more the overlap rate can be increased. Here, the high overlap ratio means that the specific gravity of the amount of energy emitted from the laser is increased per unit area, so that the laser frequency and irradiation time can be selectively determined to reach the predetermined depth.

Therefore, the depth of the processing groove 101 formed by the laser irradiation can be selectively determined in consideration of the conditions of the material of the first object 100, the laser frequency, the laser scanning speed, and the laser output And this can be determined in accordance with the above-described conditions also in the groove 121 and the processing projection 120, which will be described below.

FIG. 2 is a cross-sectional side view of a first object 100 on which a bonded surface (130 of FIG. 5) of a heterogeneous bonded formed body according to an embodiment of the present invention is formed. Although the machined grooves 101 are shown at right angles in this example, the actual surface may not be treated as a plane as shown in Fig.

2, a pattern formed on the engaging surface (1 in Fig. 1) is formed in a machining groove 101 at an engraved angle by irradiation of a laser, and between adjacent machining grooves 101, May be formed. The depth (D) and the width (W) of the processing groove (101) may vary depending on the laser irradiation method. Here, the laser irradiation method may mean that irradiation is performed under conditions including at least one of laser scanning speed and frequency. For example, when a laser of a high frequency (pulse number) is irradiated, the illuminance may be degraded in the region where the irradiation point repeats dissolution and hardening for a short time. On the other hand, it may be a continuous investigation, not a pulse dimension. Furthermore, depending on the shape of the laser beam to be irradiated, the machining groove 101 may be influenced by the shape or the like.

The machined grooves 101 may be formed in a non-through hole shape or in a groove shape. This can be variously modified depending on conditions such as the area of the pattern as described above with reference to FIG. Further, when the frequency (number of pulses) is repeated in the irradiation region and the overlapped region occurs in the course of irradiation, the height of the upper surface of the ridge positioned between the processing grooves 101 can be lowered. That is, the depth of the machining groove 101 can be reduced.

In the illustrated example, the second molded body 200, which is a resin material, may be introduced by the depth D of the machining groove 101. The area of the pattern described above is not limited to the machining groove 101 And the area of the bottom surface of the second substrate W2. Therefore, the width W of the machining groove 101 can be one of the factors for determining the inflow amount of the resin material.

Furthermore, the shape of the pattern may be changed by a method for increasing the fixing force between the first object 100 and the second formed body 200. That is, the width W of the machining groove 101, the width RW of the ridge, and the depth of the machining groove (i.e., D). The width W of the machined groove 101, the width RW of the ridge and the width of the machined groove 101 are determined in consideration of the material characteristics of the first object 100 such as the laser wavelength absorption rate, thermal conductivity, thermal expansion coefficient, The depth (D) and the like.

As described above, the first object 100 may be made of various metal or metal alloy aluminum materials. However, when the first object 100 is applied to an aluminum material, for example, the shape of the processing groove 101 will be described below.

The width W of the machining groove 101 may be in the range of 5 mu m to 300 mu m. When the width W of the processing groove 101 is less than 5 占 퐉, it is difficult for the resin to penetrate into the groove 121 (see FIG. 3), so that the first object 100 and the second molding 200, It is difficult to expect the bonding strength between the two. If the diameter exceeds 500 mu m, the size and spacing of the processing protrusions 110 and 120 formed in the width W of the machining groove 101 becomes large, so that the effect of the binding force expected from the coupling structure can be relatively small, Machined dust and burrs are generated around the upper edge of the machined groove 101 or around the ridges to lower the bonding force.

The width RW of the ridge can be designed differently depending on the width W of the machining groove 101 and the depth D of the machining groove 101, . When the width RW of the ridge is formed to be less than 5 mu m, the laser irradiation area is formed in the machining grooves 101 located on both sides. Therefore, when the first object 100 is an aluminum material, The ridge may collapse or damage may occur. However, such damage can be improved through short laser pulse widths and low laser energy. When the width RW of the ridge exceeds 500 mu m, the fixation force may decrease as the contact area is relatively decreased.

The depth D of the machining groove 101 can be designed differently depending on the width W of the machining groove 101, but it can be formed in a range of 1 탆 to 300 탆. When the depth D of the processing groove 101 is less than 1 탆, the size of the processing protrusions 110 and 120, which are engaging means formed on the side of the processing groove 101, And the second molding body 200. [0064] If the depth D of the machined groove 101 is more than 300 mu m, the possibility of thermal deformation due to overheating during laser machining is increased to cause deformation of the first object 100, The roughness of the surface of the opening of the machined groove 101 is lowered and irregularly formed, so that the bonding force with the resin material of the second formed body 200 may be lowered. In addition, the laser processing time can be greatly increased.

3 is an enlarged view of a side surface side section of a first object 100 on which a bonding surface 130 of the heterogeneous bonded formed body according to another embodiment of the present invention is formed.

Referring to FIG. 3, the processing protrusions 110 and 120 may be formed with respect to the area where the processing holes 101 are formed. The processing protrusions 110 and 120 formed through the laser irradiation can be formed with the processing protrusions 110 and 120 and the recessed portions 121 by at least 30% and up to 100% on the opened area of the processing hole 101. The bonding force between the first object 100 and the second formed body 200 due to the processing protrusions 110 and 120 becomes insignificant and it may be difficult to expect the coupling effect by the processing protrusions 110 and 120 have. Specifically, the processing protrusions 110 and 120 may be divided into a bottom processing protrusion 110 and a side processing protrusion 120. Further, the process protrusions 110 and 120 may be formed to have a larger specific gravity of the process protrusions 120 located on the side than the process protrusions 110 located on the bottom portion.

Specifically, since the process protrusions 110 and 120 can be formed by laser machining on the open area, the protruded length of the process protrusions 110 and 120 is shorter than the projected length of the laser beams irradiated between the adjacent process protrusions 110 and 120 As shown in FIG. That is, since the recess 121 is formed by the laser, the process protrusions 110 and 120 protrude, and the protrusion length of the process protrusions 110 and 120 can be determined.

Here, the concave portion 121 may be formed on the same line as the adjacent concave portion 121, and the same line may be the joint surface 130. That is, the processing protrusions 110 and 120 may be formed by a length protruding from the bonding surface 130.

On the other hand, the processing protrusions 110 and 120 are functionally the same as the above-described processing protrusions 110 and 120, but there may be a difference in arrangement. Unlike the above-described processing protrusions 110 and 120 protruding from the surface (bonding surface 130), the processing protrusions 110 and 120 protruding from the bonding surface 130 and formed intaglio from the surface to the inside of the member may be formed. The difference between the two examples can be varied depending on the position of the portion of the machining groove 101 located at the edge of each of the side and bottom portions of the machining groove 101

Further, the roughness of the processing protrusion 120 formed on the side portion may be formed to be larger than the roughness of the processing protrusion 110 formed on the bottom portion, thereby preventing the second formed body 200 from being pulled out in the pulling-out direction.

4 is a view showing the process protrusions 110 and 120 in which the second formed body 200 coupled with the first object 100 according to another embodiment of the present invention is fixed in a direction opposite to the pulling direction T .

Referring to FIG. 4, the different materials 100 and 200 illustrated in FIG. 1 are coupled to each other. The first object 100 includes a plurality of processing protrusions 110 and 120 And the second molded body 200 may be in a state in which the liquid resin is injected into the bonded structure side of the first object 100 and cured. The first object 100 and the second body 200 combined as shown in the figure can be separated from each other when a force is applied in the drawing direction T. [ Accordingly, the processing protrusions 110 and 120 can be inclined to be fixed in a direction opposite to the drawing direction T. [ The inclination may be formed in a direction opposite to the drawing direction T or in a direction facing downward. That is, it can be formed in a non-parallel direction. This may particularly be the side processing protrusion 120 among the processing protrusions 110 and 120. Since the side processing protrusions 120 are in a liquid state for a time during which they are dissolved during laser processing, downward deflection can be formed due to the influence of self-weight or viscosity in the self-weight direction for a predetermined time until curing. That is, the squeeze can be deformed downward (self-weight direction) by the viscosity and the self weight in the liquid state at the time of melting and further formed by the shock wave applied to the first object 100 during the melting process . Therefore, the processing protrusions 110 and 120 protruding from the bonding surface 130 by a predetermined length can be inclined at a certain angle during the time that the dissolution state is maintained.

The angle can prevent the second molded body 200, which is a liquid resin material, from being moved upward in the drawing direction T after being injected and cured. That is, the first object 100 can be increased in mutual fixing force with the second formed body 200 by the angle toward the downward direction of the side processing protrusion 120.

As described above, the fixing force is increased because the holding force can be maintained through the narrower area, and the total weight of the heterogeneous bonded formed article can be reduced.

Further, the depth d of the concave portion 121 may be in the range of 0.1 탆 to 10 탆. When the depth d of the concave portion 121 is formed to be less than 0.1 占 퐉, the amount of liquid-state resin penetration between the processing protrusions 110 and 120, that is, the concave portion 121, It may be difficult to expect a bonding force between the first object 100 and the second formed body 200 by the protrusions 110 and 120. If the depth d of the concave portion 121 exceeds 10 mu m, it is difficult to form the concave portion 121 on the inner wall of the machining groove 101 when the size of the machining protrusions 110 and 120 is small, The depth d of the concave portion 121 is in the range of 0.1 탆 to 10 탆 since the vicinity of the coupling surfaces 1 and 2 is likely to be broken or the coupling surfaces 1 and 2 are separated when a force in the drawing direction of the concave portion 121 is applied. . ≪ / RTI >

The projection distance rw may be in the range of 0.1 탆 to 10 탆. It is difficult for the resin material to hardly penetrate into the concave portion 121 side and hard to be cured between the protrusion intervals rw in the case where the protrusion interval rw is less than 0.1 占 퐉 so that the first object 100 and the second molded object 200) is not expected to be combined. When the projection distance rw exceeds 10 탆, the number of the processing protrusions 120 decreases, and the fixing force may be lowered. Therefore, the projection interval rw can be formed in a range of 0.1 mu m to 10 mu m.

Further, the projection width w may be formed in a range of 0.1 탆 to 10 탆. When the projection width w is less than 0.1 占 퐉, the processing protrusion 120 may become fragile at the time of fixing the second molding 200, and the possibility of breakage due to the drawing force may be increased. When the projection distance rw is more than 10 mu m, the number of the processing protrusions 120 that can be provided in the machining groove 101 decreases, and it may be difficult to secure the bonding force. Therefore, the projection width w can be formed in a range of 0.1 탆 to 10 탆.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, . Therefore, the scope of the present invention should not be limited to the above-described embodiments, but should be determined by equivalents to the appended claims, as well as the appended claims.

1: first coupling surface
2: second coupling surface
100: first object
101: Machining groove
110: processing projection on the bottom
120: side machining projection
121: lumbar
130:
200: second shaped body
L: laser irradiation direction
W: Machining groove width
R: Ridge
D: Depth
RW: Ridge width
T: Drawing direction
d: Depth
rw: spacing
w: projection width

Claims (13)

A first object provided with a first material and including a junction; And
And a second molded body formed from a second material and molded and joined to the first object and joined to the bonded portion,
The joining portion
A laser processing groove formed in the area of the laser processing groove,
A joining surface facing the second formed body, and a laser groove opened from the joining surface,
Wherein the laser groove includes a machining groove side portion and a machining groove bottom portion,
And the projecting direction of the laser processing projection projected from the processing groove side portion is a non-parallel direction.
The method according to claim 1,
Wherein a height of the upper surface of the ridge positioned between adjacent laser machining grooves is determined by overlapping of the laser.
The method according to claim 1,
Wherein the laser machining groove comprises a non-through hole or a groove shape.
A first object provided with a first material and including a junction; And
And a second formed body provided with a second material and joined to the bonded portion,
The joining portion
A joining surface facing the second formed body, and a laser groove opened from the joining surface,
Wherein the laser groove includes a machining groove side portion and a machining groove bottom portion,
A joining face facing the second formed body, and a laser processing protrusion protruding from a part of the joining face,
The projecting direction of the laser processing projection projected from the processing groove side portion is a non-parallel direction,
Wherein the projecting length of the laser processing projection is 0.1% to 10% of the distance between adjacent bonding surfaces.
The method of claim 4,
Wherein the laser processing projection is formed on the bonding surface in an area of 30% or more and 100% or less.
The method of claim 4,
Wherein the interval between the laser processing projections is 0.1um or more and 10um or less.
The method of claim 4,
Wherein a width of the laser processing projection is determined by an overlapping ratio at which a laser is superposed on the laser processing projection by a laser.
The method of claim 7,
Wherein the overlap rate is determined by at least one of spot size, frequency, scan interval and scan speed of the laser.
A first object provided with a first material and including a junction; And
And a second formed body provided with a second material and joined to the bonded portion,
The joining portion includes a joining surface facing the second formed body and a laser groove opened from the joining surface,
Wherein the laser groove includes a machining groove side portion and a machining groove bottom portion,
And the projecting direction of the laser processing projection projected from the processing groove side portion is a non-parallel direction.
The method of claim 9,
Wherein the non-parallel direction is a downward direction or a reverse direction of drawing.
The method of claim 9,
Wherein a surface roughness of the laser processing groove side portion is larger than a surface roughness of the laser processing groove bottom portion.
A first object provided with a first material and including a junction; And
And a second formed body provided with a second material and joined to the bonded portion,
The joining portion
A joining surface facing the second formed body, and a laser groove and a multi-directional inclined pattern opened from the joining surface,
Wherein the laser groove includes a machining groove side portion and a machining groove bottom portion,
The projecting direction of the laser processing projection projected from the processing groove side portion is a non-parallel direction,
The multi-
A first inclined pattern having a first inclination angle and a second inclination pattern having a second inclination angle, wherein an angle formed by the first inclination pattern and the second inclination pattern is 10 degrees or more and 170 degrees or less.
The method of claim 12,
The multi-
And a third inclination pattern having a third inclination angle different from the first inclination angle and the second inclination angle,
Wherein the third inclined pattern forms an angle of not less than 10 degrees and not more than 170 degrees with the first inclined pattern and the second inclined pattern, respectively.

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